WO2016114174A1 - Procédé de fabrication d'une structure liée et structure liée - Google Patents

Procédé de fabrication d'une structure liée et structure liée Download PDF

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Publication number
WO2016114174A1
WO2016114174A1 PCT/JP2016/050132 JP2016050132W WO2016114174A1 WO 2016114174 A1 WO2016114174 A1 WO 2016114174A1 JP 2016050132 W JP2016050132 W JP 2016050132W WO 2016114174 A1 WO2016114174 A1 WO 2016114174A1
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WO
WIPO (PCT)
Prior art keywords
metal member
laser
bonding
bonded structure
resin member
Prior art date
Application number
PCT/JP2016/050132
Other languages
English (en)
Japanese (ja)
Inventor
和義 西川
Original Assignee
オムロン株式会社
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Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Publication of WO2016114174A1 publication Critical patent/WO2016114174A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354—Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/024—Thermal pre-treatments
    • B29C66/0246—Cutting or perforating, e.g. burning away by using a laser or using hot air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/303—Particular design of joint configurations the joint involving an anchoring effect
    • B29C66/3032—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined
    • B29C66/30325—Particular design of joint configurations the joint involving an anchoring effect making use of protrusions or cavities belonging to at least one of the parts to be joined making use of cavities belonging to at least one of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/15—Magnesium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/721—Fibre-reinforced materials
    • B29C66/7212—Fibre-reinforced materials characterised by the composition of the fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts

Definitions

  • the present invention relates to a method for manufacturing a bonded structure and a bonded structure.
  • Patent Document 1 a method for manufacturing a bonded structure in which a metal member and a resin member are bonded and a bonded structure are known (see, for example, Patent Document 1).
  • Patent Document 1 discloses a technique in which an oxide layer is formed by performing a surface modification treatment on the bonding interface side (metal member side) of a resin member, and then the resin member and the metal member are bonded by laser irradiation. ing.
  • a perforated portion is provided on the surface of the metal member, particularly on the bonding interface side (resin member side), and the resin member is buried and bonded to the perforated portion.
  • the surface of the resin member is melted to a depth of about several tens of ⁇ m from the surface layer due to heat transfer from the metal member side heated by laser irradiation, and the surface modification effect provided on the resin member side is sufficient.
  • the present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a bonded structure and a bonded structure capable of improving the bondability between a metal member and a resin member. Is to provide a body.
  • a method for manufacturing a bonded structure according to the present invention is a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a step of forming a perforated portion having an opening on a surface of the metal member; After forming the portion, the method includes a step of modifying the surface of the metal member, and a step of bonding the surface-modified metal member and the resin member.
  • the step of modifying the surface of the metal member may be performed by any of plasma treatment, corona treatment, UV ozone treatment, or laser treatment on the surface of the metal member. It may be a step of forming.
  • the step of bonding the surface-modified metal member and the resin member may be any of laser irradiation, injection molding, and hot pressing. .
  • the step of forming the perforated part may be a step of forming the perforated part by irradiating a laser in which one pulse is composed of a plurality of subpulses.
  • the bonded structure according to the present invention is manufactured by any one of the above-described bonded structure manufacturing methods.
  • the method for manufacturing a bonded structure and the bonded structure of the present invention it is possible to improve the bondability (bonding strength) due to the strong anchor bonding effect between the metal member and the resin member.
  • FIG. 1 It is a schematic diagram of the cross section of the joining structure body by one Embodiment of this invention. It is the schematic diagram which showed the state by which the perforated part was formed in the metal member of a joining structure. It is the schematic diagram which showed the state by which surface modification was performed to the metal member of the joining structure. It is the perspective view which showed the metal member of the joining structure body of an Example. It is the perspective view which showed the joining structure of the Example.
  • the bonded structure 100 according to the present embodiment is obtained by bonding a metal member 10 and a resin member 20 made of different materials.
  • a modified layer (oxide film) 10a subjected to a surface modification process is formed on the surface 13 of the metal member 10. This surface modification is performed in order to improve the affinity between the metal member 10 and the molten resin member 20 when the metal member 10 and the resin member 20 are joined.
  • a perforated portion 11 having an opening is formed on the surface 13 of the metal member 10.
  • FIG. 1 is a diagram schematically showing an enlarged joining interface between the metal member 10 and the resin member 20, and actually a plurality of perforated portions 11 are provided, but only one is shown in FIG. It was.
  • Examples of the metal member 10 include iron metal, stainless steel metal, copper metal, aluminum metal, magnesium metal, and alloys thereof. Moreover, a metal molded body may be sufficient and zinc die casting, aluminum die casting, powder metallurgy, etc. may be sufficient.
  • Resin member 20 is a thermoplastic resin or a thermosetting resin.
  • thermoplastic resins include PVC (polyvinyl chloride), PS (polystyrene), AS (acrylonitrile styrene), ABS (acrylonitrile butadiene styrene), PMMA (polymethyl methacrylate), PE (polyethylene), PP ( Polypropylene), PC (polycarbonate), m-PPE (modified polyphenylene ether), PA6 (polyamide 6), PA66 (polyamide 66), POM (polyacetal), PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PSF (polysulfone) ), PAR (polyarylate), PEI (polyetherimide), PPS (polyphenylene sulfide), PES (polyethersulfone), PEEK (polyetheretherketone), PAI ( Riamidoimido), LCP (liquid crystal polymer), PV
  • TPE thermoplastic elastomer
  • examples of TPE include TPO (olefin-based), TPS (styrene-based), TPEE (ester-based), TPU (urethane-based), TPA (nylon-based), And TPVC (vinyl chloride type) is mentioned.
  • thermosetting resins examples include EP (epoxy), PUR (polyurethane), UF (urea formaldehyde), MF (melamine formaldehyde), PF (phenol formaldehyde), UP (unsaturated polyester), and SI (silicone). Is mentioned. Further, it may be FRP (fiber reinforced plastic).
  • a filler may be added to the above-described thermoplastic resin and thermosetting resin.
  • the filler include inorganic fillers (glass fibers, inorganic salts, etc.), metal fillers, organic fillers, and carbon fibers.
  • the perforated portion 11 formed on the surface 13 of the metal member 10 is previously formed by laser processing, blast processing, sandpaper processing, anodizing processing, electric discharge processing, etching processing, press processing, or the like.
  • the perforated part 11 is a substantially circular non-through hole when viewed in plan, and a plurality of perforated parts 11 are formed on the surface 13 of the metal member 10.
  • the opening diameter R1 of the surface 13 of the perforated part 11 is preferably 30 ⁇ m or more and 100 ⁇ m or less. This is because when the opening diameter R1 is less than 30 ⁇ m, the filling property of the resin member 20 is deteriorated and the anchor effect may be lowered. On the other hand, when the opening diameter R1 exceeds 100 ⁇ m, the number of the perforated portions 11 per unit area is reduced, and the anchor effect may be lowered.
  • the interval between the perforated parts 11 is preferably 200 ⁇ m or less. This is because when the interval between the perforated portions 11 exceeds 200 ⁇ m, the number of the perforated portions 11 per unit area decreases, and the anchor effect may be reduced.
  • the perforated part 11 has an enlarged diameter part 111 whose opening diameter increases from the surface 13 side toward the bottom part 113 in the depth direction (Z direction), and an opening diameter from the surface 13 side toward the bottom part 113 in the depth direction. It is formed so as to be connected to the reduced diameter portion 112 where the diameter becomes smaller.
  • the enlarged diameter portion 111 is formed so as to increase in diameter in a curved shape, and the reduced diameter portion 112 is formed so as to reduce in diameter in a curved shape.
  • the enlarged diameter portion 111 is disposed on the surface 13 side, and the reduced diameter portion 112 is disposed on the bottom 113 side.
  • the opening diameter (inner diameter) R2 of the boundary part between the enlarged diameter part 111 and the reduced diameter part 112 is the largest, and the opening diameter R1 is smaller than the opening diameter R2.
  • the protrusion part 12 is arrange
  • This protrusion 12 is formed over the entire length in the circumferential direction, for example, and is formed in an annular shape.
  • the protruding portion 12 protruding inwardly on the inner peripheral surface of the perforated portion 11, the protruding portion 12 and the resin member 20 filled in the perforated portion 11 are engaged in the peeling direction (Z direction). By doing so, it is possible to improve the bonding strength in the peeling direction. Thereby, it is possible to improve the bonding strength in the peeling direction in addition to the shearing direction. Furthermore, even in a heat cycle environment, even if a peeling stress due to a difference in linear expansion coefficient between the metal member 10 and the resin member 20 occurs, the bonding strength can be maintained. That is, it is possible to improve durability under a heat cycle environment.
  • This perforated part 11 is formed by, for example, laser irradiation.
  • a fiber laser, a YAG laser, a YVO 4 laser, a semiconductor laser, a carbon dioxide gas laser, and an excimer laser can be selected from the viewpoint of enabling pulse oscillation, and considering the laser wavelength, a fiber laser, a YAG laser, a YAG
  • the second harmonic of the laser, YVO 4 laser, and semiconductor laser are preferred.
  • the laser output is set in consideration of the laser irradiation diameter, the type of material of the metal member 10, the shape (for example, thickness) of the metal member 10, and the like.
  • the output upper limit of the laser is preferably 40W. This is because when the laser output exceeds 40 W, the energy is large and it is difficult to form the perforated part 11 having the protruding part 12.
  • fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON As an example of an apparatus for forming the perforated part 11, there can be mentioned fiber laser marker MX-Z2000 or MX-Z2050 manufactured by OMRON. With this fiber laser marker, it is possible to irradiate a laser where one pulse is composed of a plurality of subpulses. For this reason, since the energy of a laser is easy to concentrate on the depth direction, it is suitable for forming the perforated part 11. Specifically, when the metal member 10 is irradiated with a laser, the metal member 10 is locally melted, so that the formation of the perforated portion 11 proceeds. At this time, since the laser is composed of a plurality of sub-pulses, the molten metal member 10 is not easily scattered and easily deposited in the vicinity of the perforated portion 11.
  • the molten metal member 10 is deposited inside the perforated part 11, thereby forming the protruding part 12.
  • the laser irradiation direction is, for example, a direction perpendicular to the surface 13, and the axis of the perforated part 11 is perpendicular to the surface 13.
  • one period of the subpulse is 15 ns or less. This is because if one period of the sub-pulse exceeds 15 ns, energy is easily diffused by heat conduction, and it becomes difficult to form the perforated part 11 having the protruding part 12.
  • one cycle of the subpulse is a total time of the irradiation time for one subpulse and the interval from the end of the irradiation of the subpulse to the start of the irradiation of the next subpulse.
  • the number of subpulses of one pulse is preferably 2 or more and 50 or less. This is because if the number of subpulses exceeds 50, the output per unit of subpulses becomes small, and it becomes difficult to form the perforated part 11 having the protruding parts 12.
  • the surface 13 of the metal member 10 exhibits a state in which a modified layer is formed in no small amount.
  • the purpose of laser irradiation is to form the perforated portion 11, and it has not yet been possible to form a uniform and uniform modified layer on the surface 13 of the metal member 10.
  • the formation of the modified layer by laser irradiation in the gap between the perforated part 11 and the perforated part 11 is more uneven, or the modified layer Is not formed.
  • any one of plasma treatment, corona treatment, UV ozone treatment, or laser treatment is performed.
  • the perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 is processed using an atmospheric pressure plasma processing apparatus.
  • the other portions than the perforated portion 11 are masked with a resin so that the perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 is exposed.
  • the entire surface including the perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 is processed using a table-top conveyor type UV reformer.
  • Laser treatment is performed using a semiconductor laser 808 nm on a perforated portion 11 (20 ⁇ 20 mm) formed on the surface 13 of the metal member 10 at a focal diameter of 1 mm and a scanning speed of 1 mm / sec.
  • the resin member 20 is bonded to the surface 13 of the metal member 10 in which the perforated portion 11 is formed.
  • the resin member 20 is bonded to the metal member 10 by, for example, laser bonding, injection molding bonding, hot press bonding, cast hardening, ultrasonic welding, or vibration welding. Thereby, the resin member 20 is solidified in the state where the perforated part 11 is filled.
  • Such a bonded structure 100 is applicable, for example, when a resin cover (not shown) is bonded to a metal case (not shown) of a photoelectric sensor.
  • the metal case corresponds to the metal member 10
  • the resin cover corresponds to the resin member 20.
  • laser bonding In laser bonding, the metal member 10 and the resin member 20 are pressed with a jig or the like and brought into surface contact, and then laser irradiation is performed. Laser irradiation is performed from the resin member 20 side (only when having laser transparency) and / or the metal member 10 side.
  • laser irradiation is performed from the resin member 20 side (only when having laser transparency) and / or the metal member 10 side.
  • fiber laser, YAG laser, YVO 4 laser, a semiconductor laser, a carbon dioxide laser, or excimer laser can be selected.
  • the metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the material of the resin member 20 is PMMA resin (Acrylite (registered trademark) manufactured by Mitsubishi Rayon.
  • the resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness. Is 3 mm.
  • Example conditions for laser irradiation are as follows.
  • Laser Semiconductor laser (wavelength 808 nm) Oscillation mode: Continuous oscillation Output: 30W Focal diameter: 4mm Scanning speed: 1mm / sec Contact pressure: 0.6 MPa
  • Injection molding joining In the injection molding joining, the metal member 10 was inserted into an injection mold and joined to the resin member 20 by injection molding. As a material of the metal member 10, SUS304 is used. The metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the molding machine uses J35EL3 manufactured by Nippon Steel Works.
  • the resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • Molding conditions are as follows.
  • Hot press bonding In the hot press bonding, the metal member 10 is installed in the lower mold of a press machine that has been heated and adjusted in advance, and the bonding surface of the resin member 20 is installed facing the bonding surface of the metal member 10. Press to join.
  • a material of the metal member 10 SUS304 is used.
  • the metal member 10 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • the resin member 20 is formed in a plate shape, has a length of 100 mm, a width of 25 mm, and a thickness of 3 mm.
  • Example conditions for hot press bonding are as follows.
  • the perforated part 11 is formed on the surface 13 of the metal member 10, and the protruding part 12 is formed on the inner peripheral surface of the perforated part 11.
  • the perforated part 11 and the protruding part 12 are formed, for example, by irradiating a laser in which one pulse is composed of a plurality of sub-pulses. As a specific example, it is formed using the fiber laser marker MX-Z2000 or MX-Z2050 described above.
  • the metal member 10 is subjected to any one of plasma treatment, corona treatment, UV ozone treatment, or laser treatment on the surface 13 of the metal member 10 on which the perforated portion 11 is formed.
  • a modified layer (oxide film) 10a is formed on the surface 13 of the substrate.
  • the resin member 20 is filled into the perforated portion 11 of the surface-modified metal member 10, and the resin member 20 is solidified. Thereby, the metal member 10 and the resin member 20 are joined, and the joining structure 100 (refer FIG. 1) is formed.
  • the resin member 20 is bonded by, for example, the above-described laser bonding, injection molding bonding, hot press bonding, cast hardening, ultrasonic welding, or vibration welding.
  • Example 1 In Experimental Example 1, a bonded structure 500 (see FIG. 5) according to Examples A1, A2, A3, and A4 corresponding to the present embodiment and a bonded structure according to Comparative Example A were produced, and bonding evaluation was performed for each. Went. The results are shown in Table 1.
  • the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm.
  • a perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example A1 was performed by plasma treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example A2 was performed by corona treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example A3 was performed by UV ozone treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example A4 was performed by laser processing.
  • a predetermined region R on the surface of the metal member 501 is irradiated with a joining laser.
  • the laser irradiation conditions are as described above.
  • the thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
  • the bonding level that can be realized by forming the perforated portion in the metal member of this experimental example is a breakage of the resin member in the bonding strength evaluation when the thermal cycle test is not performed. That is, the bonding strength becomes the breaking strength of the resin, and it cannot be determined whether or not there is a surface modification effect. Therefore, it is effective to observe thermal cycle fatigue resistance as a method for evaluating the surface modification effect of this experimental example.
  • the pass / fail judgment was made according to the following criteria.
  • the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage)
  • ⁇ a product exceeding the standard was regarded as acceptable ( ⁇ ).
  • the number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
  • Example A1 As shown in Table 1 above, in Comparative Example A (standard), when the number of thermal cycles was 250, partial peeling was observed at the bonding interface. On the other hand, in Example A1, when the number of thermal cycles was 750, partial peeling was observed at the bonding interface. In Examples A2 and A3, partial peeling was observed at the bonding interface when the number of thermal cycles was 500. In Example A4, when the number of thermal cycles was 750, partial peeling was observed at the bonding interface.
  • thermal cycle fatigue is achieved by performing surface modification on the metal member 501 as compared with the joining structure of Comparative Example A (when surface modification is not performed). Resistance was high. As a result, it was found that the surface modification of the metal member 501 as in the bonded structures 500 of Examples A1 to A4 can suppress the peeling due to thermal stress and improve the bondability. did.
  • Example 2 In Experimental Example 2, a bonded structure 500 (see FIG. 5) according to Examples B1, B2, B3, and B4 corresponding to the present embodiment and a bonded structure according to Comparative Example B were produced, and bonding evaluation was performed for each. Went. The results are shown in Table 2.
  • the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. A perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example B1 was performed by plasma treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example B2 was performed by corona treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example B3 was performed by UV ozone treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example B4 was performed by laser processing.
  • the metal member 501 was inserted into an injection mold and joined to the resin member 502 by injection molding.
  • the molding conditions are as described above.
  • the thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
  • the pass / fail judgment was made according to the following criteria.
  • the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage)
  • ⁇ a product exceeding the standard was regarded as acceptable ( ⁇ ).
  • the number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
  • thermal cycle fatigue is achieved by performing surface modification on the metal member 501 compared to the joining structure of Comparative Example B (when surface modification is not performed). Resistance was high. As a result, it was found that, as in the bonding structures 500 of Examples B1 to B4, the surface modification of the metal member 501 can suppress the peeling due to thermal stress and improve the bondability. did.
  • the metal member 501 is formed in a plate shape, has a length of 100 mm, a width of 29 mm, and a thickness of 3 mm. A perforated portion was formed by irradiating a predetermined region R of the metal member 501 with a laser.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example C1 was performed by plasma treatment.
  • the surface modification of the metal member 501 of the joint structure 500 according to Example C2 was performed by corona treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example C3 was performed by UV ozone treatment.
  • the surface modification of the metal member 501 of the bonded structure 500 according to Example C4 was performed by laser processing. These surface modification conditions are as described above.
  • the metal member 501 was placed in a lower mold of a press machine that had been heated and adjusted in advance, and pressed and joined in a state where the joint surface of the resin member 502 was placed facing the joint surface of the metal member 501.
  • the conditions for hot press bonding are as described above.
  • the thermal shock test was performed using a thermal shock apparatus TSD-100 manufactured by Espec. Specifically, low temperature exposure at ⁇ 40 ° C. for 30 minutes and high temperature exposure at 85 ° C. for 30 minutes were repeatedly performed until the bonding interface was peeled off.
  • the pass / fail judgment was made according to the following criteria.
  • the resistance of the specimen in which the surface modification of the metal member is not performed in the thermal cycle environment (partial delamination starts to be observed at the bonding interface with the resin member fracture being the initial stage)
  • ⁇ a product exceeding the standard was regarded as acceptable ( ⁇ ).
  • the number of thermal cycles was confirmed up to 0, 100, 250, 500, 750, 1000, 1500, and 2000 cycles.
  • Example C As shown in Table 3 above, in Comparative Example C (standard), when the thermal cycle number was 250, partial peeling was observed at the bonding interface. On the other hand, in Example C1, when the number of thermal cycles was 1000, partial peeling was observed at the bonding interface. In Examples C2 and C3, partial peeling was observed at the bonding interface when the number of thermal cycles was 750. In Example C4, when the number of thermal cycles was 1000, partial peeling was observed at the bonding interface.
  • thermal cycle fatigue is achieved by performing surface modification on the metal member 501 as compared with the joining structure of Comparative Example C (when surface modification is not performed). Resistance was high. As a result, it was found that, by performing the surface modification of the metal member 501 as in the bonding structures 500 of Examples C1 to C4, it is possible to suppress peeling due to thermal stress and to improve bondability. did.
  • the effects listed below can be obtained. That is, in this embodiment, as described above, the metal member 10 and the resin member are formed by forming the modified layer (oxide film) 10a by modifying the surface of the metal member 10 in which the perforated portion 11 is formed. Since the embedding property (fillability) of the resin member 20 into the perforated part 11 provided on the surface 13 of the metal member 10 is improved in the joining process with the metal member 10, the strong anchor joining effect between the metal member 10 and the resin member 20 is improved. Bondability can be improved.
  • the present invention is not limited to this.
  • the surface modification in the step of performing the surface modification, the surface modification may be performed by a step other than the above steps.
  • the modified layer oxide film
  • the present invention is not limited to this.
  • the surface of the metal member other than the oxide film can be improved.
  • a modified layer may be formed.
  • the step of bonding the surface-modified metal member and the resin member may be a step other than the above.
  • the projecting part may not be formed in the perforated part. That is, the cross-sectional shape of the perforated part may be a concave shape such as a rectangular shape or a triangular shape. Further, the perforated part may be formed in a groove shape so as to be continuous.
  • the present invention is applicable to a method for manufacturing a bonded structure in which a metal member and a resin member are bonded, and a bonded structure.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laser Beam Processing (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une structure liée, dans laquelle un élément métallique et un élément de résine sont liés l'un à l'autre, qui comprend les étapes suivantes : la formation d'une pièce perforée qui présente une ouverture dans la surface de l'élément métallique ; l'exécution d'une modification de la surface de l'élément métallique après la formation de la pièce perforée ; la liaison de l'élément métallique à surface modifiée et de l'élément de résine l'un à l'autre.
PCT/JP2016/050132 2015-01-13 2016-01-05 Procédé de fabrication d'une structure liée et structure liée WO2016114174A1 (fr)

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JP6961159B2 (ja) * 2017-02-09 2021-11-05 睦月電機株式会社 金属部材と合成樹脂成形部材との接合法およびその接合体
FR3063965B1 (fr) * 2017-03-14 2023-07-14 Dorel France Sa Voiture d'enfant pliante a chariots coulissants
JP6351902B1 (ja) * 2017-09-26 2018-07-04 住友理工株式会社 複合部材の製造方法
KR102090531B1 (ko) * 2017-12-22 2020-03-19 주식회사 포스코 진공 플라즈마를 이용한 플라스틱-금속 복합소재의 제조방법
JP2019117061A (ja) * 2017-12-26 2019-07-18 ファナック株式会社 ロータリエンコーダおよびロータリエンコーダの製造方法
DE102019103130A1 (de) * 2019-02-08 2020-08-13 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum Erzeugen einer Funktionsstruktur sowie Bauteil

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