WO2016111124A1 - Insulating heat dissipation sheet, heat spreader and electronic device - Google Patents
Insulating heat dissipation sheet, heat spreader and electronic device Download PDFInfo
- Publication number
- WO2016111124A1 WO2016111124A1 PCT/JP2015/085098 JP2015085098W WO2016111124A1 WO 2016111124 A1 WO2016111124 A1 WO 2016111124A1 JP 2015085098 W JP2015085098 W JP 2015085098W WO 2016111124 A1 WO2016111124 A1 WO 2016111124A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- layer
- insulating
- heat radiation
- sheet
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/60—Composite insulating bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to an insulating heat radiation sheet, a heat spreader, and an electronic device.
- heat sinks and heat spreaders that dissipate heat generated by electronic components and electrical components are attached.
- a material obtained by bonding an adhesive tape to a metal foil having thermal conductivity such as an aluminum foil or a copper foil is often used.
- Patent Document 1 discloses a heat-dissipating heat-dissipating sheet in which a pressure-sensitive adhesive layer and a heat-radiating sheet provided with a heat-radiating layer on a layer made of aluminum or an aluminum alloy are laminated.
- Patent Document 1 since the heat radiation layer disclosed in Patent Document 1 is made of alumina or aluminum alloy coated with alumina, the alumina layer may be damaged due to impact or deformation. Since the defect of the alumina layer hinders securing sufficient insulation, it is difficult to use it in a place that requires insulation.
- the present invention has been made in view of the above circumstances, and provides an insulating heat radiating sheet that can be easily joined to a heating element such as an electronic component, and can efficiently diffuse and dissipate heat generated by the electronic component,
- a heating element such as an electronic component
- the inventors have an insulating layer, a heat radiation layer containing a heat radiation filler and a binder, a metal layer, and an adhesive layer in order, and the insulating layer and the adhesive layer have a predetermined thickness.
- high thermal diffusibility and insulation can be realized.
- Providing a layer on the heat radiation layer may hinder heat radiation, and is not performed from ordinary technical common knowledge of those skilled in the art.
- the present inventors have found that high thermal diffusibility and insulation can be realized by setting the lamination condition to a predetermined condition.
- the insulation heat dissipation sheet which concerns on 1 aspect of this invention has an insulating layer, the heat radiation layer containing a heat radiation filler and a binder, a metal layer, and the adhesion layer in order, The said insulation layer and the said adhesion The average thickness of each layer is 5 to 50 ⁇ m.
- the insulation heat dissipation sheet according to the above (1) has a dielectric breakdown voltage of 1 kV or more.
- the average thickness of the heat radiation layer may be 0.1 to 5 ⁇ m.
- the average thickness of the metal layer may be 20 to 100 ⁇ m.
- the heat radiation filler may be a carbonaceous material.
- the carbonaceous material is one or more selected from carbon black, graphite, and vapor grown carbon fiber. It may be a material.
- At least one of the binders may be an epoxy resin or a polymer polysaccharide crosslinked with an acid crosslinking agent.
- the insulating heat-radiating sheet according to any one of (1) to (7) may contain 20 to 50% by mass of the thermal radiation filler and 50 to 80% by mass of a binder.
- the insulating heat-radiating sheet according to any one of (1) to (8) may further include a release sheet on the surface of the adhesive layer opposite to the metal layer.
- a heat spreader includes the insulating heat radiating sheet according to any one of (1) to (9).
- An electronic device incorporates the heat spreader described in (10) above.
- the insulating heat radiating sheet of the present invention can be easily joined to a heating element such as an electronic component, and can efficiently diffuse and dissipate heat generated by the electronic component.
- FIG. 1 is a diagram schematically illustrating a cross section of an insulating heat dissipation sheet according to one embodiment of the present invention.
- 1 has an insulating layer 1, a heat radiation layer 2 containing a heat radiation filler and a binder, a metal layer 3, and an adhesive layer 4.
- the average thickness of the insulating layer 1 and the adhesive layer 4 is 5 to 50 ⁇ m.
- a release sheet 5 may be further laminated on the exposed surface of the adhesive layer 4 as necessary. Other layers may be provided between the layers.
- the “average thickness” refers to a value obtained by observing the cross section of the insulating heat-radiating sheet 10 and measuring the thickness at 10 randomly selected locations and calculating the arithmetic average value thereof.
- the insulating layer 1 is a layer that becomes the outermost layer when the insulating heat radiating sheet 10 is bonded to a heating element such as an electronic component.
- the insulating layer 1 has electrical insulation.
- the insulating property means that the insulating property can be maintained without being broken down even when a voltage of 1 to 5 kV is applied to both surfaces of the insulating layer 1, for example. Since the insulating layer 1 has an insulating property, it can be used even in an electronic component or the like that requires insulating properties.
- the material constituting the insulating layer 1 is not particularly limited as long as it has insulating properties, and a resin material or a ceramic material can be used.
- a resin material or a ceramic material can be used.
- polyesters such as polyethylene terephthalate (PET), polyolefins such as polypropylene and polyethylene, and the like can be used. From the viewpoints of insulation and heat resistance, PET is particularly preferable.
- the average thickness of the insulating layer 1 is 5 to 50 ⁇ m.
- the average thickness of the insulating layer 1 is preferably 5 to 15 ⁇ m. When the average thickness of the insulating layer 1 is 5 to 50 ⁇ m, sufficient insulation and high heat dissipation can be maintained.
- the method for laminating the insulating layer 1 on the heat radiation layer 2 is not particularly limited.
- the insulating heat-radiating sheet 10 can maintain high insulation from the outside by having the insulating layer 1 as described above. As a result, the insulating heat radiating sheet 10 can be used even in an electronic component or the like where insulation is required. Further, since the insulating layer 1 protects the heat radiation layer 2 and the like formed thereunder, the wear resistance of the insulating heat radiating sheet 10 can also be improved. That is, even if an impact or deformation is applied to the insulating heat radiating sheet 10, the heat radiating property and the insulating property can be maintained.
- the heat radiation layer 2 contains a heat radiation filler and a binder.
- the thermal radiation filler used for the thermal radiation layer 2 is not particularly limited as long as it has an emissivity of 0.8 or more, regardless of metal or non-metal. From the viewpoint of high thermal emissivity and low cost, a carbonaceous material is preferable. Examples of the carbonaceous material include carbon black such as acetylene black and ketjen black, graphite, vapor grown carbon fiber, and the like, and one or more of them may be selected and used.
- the particle size of the thermal radiation filler is preferably 0.1 to 2.0 ⁇ m, more preferably 0.2 to 1 ⁇ m, with a cumulative mass 50% particle size (D50). When the cumulative mass 50% particle diameter (D50) is 0.1 to 2.0 ⁇ m, a heat radiation layer with high smoothness can be obtained.
- the binder used for the heat radiation layer 2 is not particularly limited as long as it is a material capable of binding a heat radiation filler. From the viewpoint of the binding property of the heat radiation filler, the coating property of the composition of the heat radiation filler and the binder, and the film performance as the heat radiation layer 2, the binder is preferably a heat or photocurable resin.
- the photocurable resin that can be used include epoxy resins, oxetane resins, vinyl ether resins, polysiloxane resins, vinyl ester resins, and (meth) acrylic resins.
- thermosetting resins examples include epoxy resins, oxetane resins, polysiloxane resins, unsaturated polyester resins, vinyl ester resins, phenol resins, novolac resins, amino resins, and crosslinkable functional groups.
- (Meth) acrylic resin having high molecular weight, polymeric polysaccharides, and the like can be used.
- the curable resin used as the binder is more preferably a thermosetting epoxy resin or a high molecular polysaccharide in terms of durability and adhesion, and it is preferable to crosslink these with an acid crosslinking agent and cure.
- the epoxy resin include diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl ether of biphenol, and the like, and one or more selected from these can be used.
- Examples of the polymeric polysaccharide include one or more selected from chitosan, chitin and derivatives thereof.
- Acid crosslinking agents include phthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trimellitic anhydride, tetrahydrophthalic anhydride, pyromellitic anhydride, dodecyl succinic anhydride, methyl nadic anhydride, benzophenone tetra anhydride
- acid anhydrides such as carboxylic acid and anhydrous butanetetracarboxylic acid, and one or more selected from these can be used.
- the content of the heat radiation filler in the heat radiation layer 2 is preferably 20 to 50% by mass, more preferably 30 to 40% by mass.
- the binder content in the heat radiation layer 2 is preferably 50 to 80% by mass, more preferably 60 to 70% by mass. When the binder content in the heat radiation layer 2 is within this range, there is a merit of supporting the heat radiation filler on the substrate.
- the formation method of the heat radiation layer 2 is not particularly limited.
- the heat radiation layer 2 can be formed by applying and curing a composition of a heat radiation filler and a binder on the insulating layer 1 or the metal layer 3.
- the composition of the heat radiation filler and binder may be diluted with a solvent, if necessary, and then applied, dried and further cured to form the heat radiation layer 2.
- a coating method of the composition of the heat radiation filler and the binder gravure coating capable of forming a thin film having a uniform thickness is preferable as the coating method.
- the average thickness of the heat radiation layer is preferably from 0.1 to 5 ⁇ m, more preferably from 0.5 to 3 ⁇ m. If the average thickness of the heat radiation layer is 0.1 to 5 ⁇ m, a sufficient amount of heat radiation filler in the heat radiation layer can be secured, and sufficient heat dissipation can be obtained.
- the metal layer 3 is provided between the heat radiation layer 2 and a heating element such as an electronic component. Since the metal layer 3 has high thermal conductivity, the heat generated by the heating element can be efficiently transmitted to the heat radiation layer 2.
- metal layer 3 gold, silver, copper, iron, nickel, aluminum, an alloy containing those metals, or the like can be used.
- a metal having a high thermal conductivity is preferable. From the viewpoint of low cost and ease of processing, it is preferable to use copper, aluminum, and an alloy containing these metals as the metal layer 3.
- the average thickness of the metal layer 3 is preferably 20 to 100 ⁇ m, and more preferably 30 to 80 ⁇ m.
- the average thickness of the metal layer 3 is 20 ⁇ m or more, the insulating heat radiating sheet 10 excellent in heat radiation is obtained, and the distortion and deformation of the metal layer 3 in the process of manufacturing the insulating heat radiating sheet 10 are small.
- the average thickness of the metal layer 3 is 100 ⁇ m or less, the shape followability of the insulating heat radiating sheet 10 with respect to the heat generator when the insulating heat radiating sheet 10 is bonded to the heat generator can be sufficiently secured. Therefore, even when the surface of the heating element is a curved surface, a sufficient contact area between the heating element and the insulating heat radiating sheet 10 can be ensured, so that the heat of the heating element can be efficiently radiated.
- the adhesive layer 4 is a layer for bonding the insulating heat-radiating sheet 10 to a heating element such as an electronic device.
- the pressure-sensitive adhesive used for the pressure-sensitive adhesive layer 4 is not particularly limited. It is sufficient that the insulating properties and the adhesive strength are sufficient, and silicone-based adhesives, acrylic-based adhesives, urethane-based adhesives, rubber-based adhesives, and the like can be used. Especially, it is preferable to use an acrylic adhesive from the point of adhesive force.
- the pressure-sensitive adhesive either a solvent-containing one or a solvent-free one can be used.
- a curing agent corresponding to the pressure-sensitive adhesive may be included.
- an isocyanate compound, an epoxy compound, an aziridine compound, a melamine compound, or the like can be used.
- Examples of the method for forming the pressure-sensitive adhesive layer 4 include a method in which a pressure-sensitive adhesive diluted with a solvent is applied to one surface of the metal layer 3 or the release sheet 5 and dried and thermally cured.
- the average thickness of the pressure-sensitive adhesive layer 4 used in the present invention is 5 to 50 ⁇ m, preferably 8 to 20 ⁇ m.
- the insulating heat-radiating sheet 10 has a sufficiently high bonding strength between the pressure-sensitive adhesive layer 4 and the heating element and the metal layer 3 and can satisfy the insulating properties.
- the heat of the heating element can be efficiently conducted to the metal layer 3 through the adhesive layer 4.
- the method for applying the adhesive is not particularly limited. Examples thereof include a method using a gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, spray coater, comma coater, direct coater and the like.
- the adhesive strength of the adhesive layer 4 is preferably 5 N / 25 mm or more, more preferably 8 N / 25 mm or more, more preferably 10 N / 25 mm or more, with respect to SUS304 measured using a measurement method described later. More preferably it is.
- the adhesive strength of the adhesive layer 4 is 5 N / 25 mm or more, the insulating heat-radiating sheet 10 has sufficiently high bonding strength between the adhesive layer 4 and the heating element and the metal layer 3.
- the adhesive strength of the adhesive layer 4 is determined by the following method.
- a PET film having a thickness of 50 ⁇ m (“Lumirror (registered trademark) S-10” manufactured by Toray Industries, Inc.) is used as a base material, and an adhesive layer 4 is formed on the base material to obtain a test laminated sheet.
- the test laminated sheet is cut into a size of 25 mm in length and 100 mm in width to obtain strip-shaped sheet pieces.
- a strip-shaped sheet is laminated on the test plate made of SUS304 with the adhesive layer facing the test plate. Thereafter, the test plate and the strip-shaped sheet are joined by reciprocating a 2 kg rubber roller (width: about 50 mm) once on the strip-shaped sheet.
- the bonded test plate and strip-shaped sheet are left in an environment of 23 ° C. and humidity 50% RH for 24 hours. Thereafter, according to JIS Z0237, a tensile test in the direction of 180 ° is performed at a peeling speed of 300 mm / min, and the adhesive strength (N / 25 mm) of the strip-shaped sheet to the test plate is measured.
- the adhesive layer 4 may contain an insulating heat conductive filler in the adhesive. Any thermally conductive filler may be used as long as it is insulating and has thermal conductivity. For example, 1 type, or 2 or more types of particles selected from a metal oxide, a metal nitride, a metal hydrate, etc. are mentioned.
- the metal oxide include aluminum oxide, magnesium oxide, zinc oxide, and titanium dioxide.
- the metal nitride include aluminum nitride, boron nitride, and silicon nitride.
- the metal hydrate include magnesium hydroxide and aluminum hydroxide.
- the heat conductive filler is preferably a powder from the viewpoint of being uniformly dispersed in the adhesive layer 4.
- the particle diameter of the thermally conductive filler is preferably 1 to 50 ⁇ m, more preferably 3 to 30 ⁇ m, with a 50% cumulative mass particle diameter (D50).
- the particle diameter of the thermally conductive filler is preferably set as appropriate according to the thickness of the adhesive layer 4. When the cumulative mass 50% particle diameter (D50) is 1 to 50 ⁇ m, a sufficient contact area between the heat conductive filler contained in the adhesive layer 4 and the heating element and the metal layer 3 is obtained, and the heat of the heating element is reduced. The metal layer 3 can be efficiently conducted through the adhesive layer 4.
- the “cumulative mass 50% particle size (D50)” is obtained, for example, by laser diffraction particle size distribution measurement using a laser diffraction particle size distribution measuring device of trade name “SALD-200V ER” manufactured by Shimadzu Corporation.
- the release sheet 5 is not particularly limited.
- a plastic film whose surface is treated with a release treating agent can be used.
- silicone-based, long-chain alkyl-based, fluorine-based agents and the like can be used.
- the plastic film include a polyethylene terephthalate (PET) film.
- the heat radiation layer 2 is formed on one surface of the metal layer 3, and then the insulating layer 1 is laminated on the heat radiation layer 2. Furthermore, the insulating heat-radiating sheet 10 can be obtained by bonding the adhesive layer 4 to the other surface of the metal layer 3. The obtained insulating heat radiation sheet 10 is until the insulating heat radiation sheet 10 is joined to the heating element by laminating the release sheet 5 on the opposite side of the surface of the adhesive layer 4 bonded to the metal layer 3. The adhesive layer 4 can be protected by the release sheet 5.
- the insulating heat-radiating sheet 10 may be formed by laminating the insulating layer 1, the heat radiation layer 2, the metal layer 3, and the adhesive layer 4 in this order. If necessary, an adhesive layer, a laminate layer, or the like is provided between the layers. Other layers may be included.
- the insulating heat radiating sheet 10 preferably has a thermal emissivity of 0.8 to 1, more preferably 0.9 to 1. If the thermal emissivity is 0.8 to 1, sufficient thermal emissivity can be obtained.
- the insulation heat dissipation sheet 10 has a dielectric breakdown voltage of 1 kV or more. More preferably, it is 2 kV or more. When the dielectric breakdown voltage is 1 kV or more, there is no problem in use for low-power applications, and it can be used.
- the insulating heat radiating sheet 10 can be easily joined to the heating element, and can efficiently radiate the heat of the heating element. Therefore, the insulating heat radiating sheet 10 can be suitably used as a heat spreader for dissipating heat generated by the heating element.
- the heating element include electronic components such as a semiconductor chip, a transistor, a capacitor, and a capacitor, and electrical components such as a battery (battery).
- Other examples of heating elements include electronic circuit boards, solar panels, verification equipment, display backlights, projectors, LED lights, signals, mobile phones, smartphones, personal computers, tablet PCs, servers, small game machines, solar Examples include battery panel memory modules, amplifiers, various batteries, camera modules, and the like.
- Example A-1 As an insulating layer 1, a 12 ⁇ m PET film was coated with an adhesive (EX-2022 manufactured by Showa Denko KK) to a thickness of 1 ⁇ m, dried, and then a carbon-coated aluminum metal sheet having a heat radiation layer 2 and a metal layer 3 (Showa Denko) Manufactured: Carbon coated aluminum foil SDX (trademark)) was laminated on the carbon coating layer to form a laminated sheet in which the insulating layer 1, the heat radiation layer 2, and the metal layer 3 were laminated in this order.
- an adhesive EX-2022 manufactured by Showa Denko KK
- a carbon-coated aluminum metal sheet having a heat radiation layer 2 and a metal layer 3 (Showa Denko)
- Carbon coated aluminum foil SDX (trademark)
- the heat radiation layer 2 is obtained by crosslinking carbon black as a heat radiation filler and chitosan derivative as a binder with pyromellitic acid.
- the average thickness of the heat radiation layer 2 is 1 ⁇ m
- the metal layer 3 is an aluminum foil having an average thickness of 50 ⁇ m.
- an insulating heat-dissipating sheet A-1 was obtained by adhering a 10 ⁇ m-thick adhesive sheet from which one surface release-treated PET film was removed to the metal layer surface of the laminated sheet.
- Example A-2 Insulating heat radiating sheet of Example A-2 in the same manner as the insulating heat radiating sheet of Example A-1, except that the insulating layer 1 of Example A-1 was changed to a 50 ⁇ m PET film and the average thickness of the adhesive layer 4 was changed to 50 ⁇ m.
- Example A-3 An insulating heat radiating sheet of Example A-3 was obtained in the same manner as the insulating heat radiating sheet of Example A-1, except that the insulating layer of Example A-1 was changed to a 12 ⁇ m polyethylene film.
- D-2000 is a polypropylene glycol having a terminal hydroxyl group with isophorone diisocyanate and a hydroxyl value of 56 mgKOH / g in a 5 L four-necked flask equipped with a thermometer, a stirrer, a dropping funnel and a cooling tube
- the weight average molecular weight of the polyurethane having an acryloyl group at the terminal is gel permeation chromatography under the following conditions: trade name “Shodex GPC-101” (manufactured by Showa Denko KK, “Shodex” is a registered trademark)
- the molecular weight in terms of polystyrene measured using Column: LF-804 (made by Showa Denko KK) Column temperature: 40 ° C
- a heat conductive filler-containing pressure-sensitive adhesive sheet was formed by the following method.
- the heat conductive adhesive composition was applied to the 75 ⁇ m-thick PET film (200 mm ⁇ 200 mm) subjected to the surface release treatment using an applicator so that the film thickness (average thickness after curing) was 50 ⁇ m. .
- the same surface release treatment PET film was arrange
- Comparative Example B-1 An insulating heat-dissipating sheet of Comparative Example B-1 was obtained in the same manner as the insulating heat-dissipating sheet of Example A-1 except that the configuration was changed to that of Example A-1 except for the insulating layer 1.
- Comparative Example B-2 An insulating heat-dissipating sheet of Comparative Example B-2 was obtained in the same manner as the insulating heat-dissipating sheet of Example A-1, except that the average thickness of the adhesive layer 4 of Example A-1 was changed to 3 ⁇ m.
- Example B-3 An insulating heat-dissipating sheet of Example B-3 was obtained in the same manner as the insulating heat-dissipating sheet of Example A-1, except that the heat-radiating layer 2 of Example A-1 was removed.
- a sample obtained by peeling off a peeled PET film of a square insulating heat radiating sheet having a length of 100 mm and a width of 100 mm was used as a measurement sample.
- a withstand voltage tester (TOS5101) manufactured by Kikusui Electronics Co., Ltd. was used.
- the upper electrode had a diameter of 25 mm and a height of 25 mm, and the lower electrode had a diameter of 70 mm and a height of 15 mm.
- Boosting was performed according to the conditions of the 60-second step-up test of JIS C2110-1, and the voltage at which the sample was broken was defined as the dielectric breakdown voltage. The obtained results were evaluated as follows. ⁇ : 1 kV or more ⁇ less than 1 kV
- a 60 mm long and 60 mm wide square insulating heat release sheet from which the peeled PET film has been peeled off is applied to both sides of a 60 mm long and 60 mm wide square ceramic heater (WALN-1 manufactured by Sakaguchi Electric Heating Co., Ltd.). Were stacked to face each other. Then, the heater temperature (after 60 minutes) when the ceramic heater was heated at 5 W was measured to evaluate the heat dissipation. Evaluation was performed in an environment of room temperature 25 ° C. and humidity 50% RH. The heater temperature was 150 ° C. when the ceramic heater without the insulating heat-radiating sheet was heated at 5 W.
- WALN-1 manufactured by Sakaguchi Electric Heating Co., Ltd.
- Examples A-1, A-2, and A-3 showed good results in electrical insulation, heat dissipation, and adhesive strength. Since A-4 contained a filler in the adhesive layer, the adhesive strength was reduced, but even if the adhesive layer was as thick as 50 ⁇ m, no reduction in heat dissipation was observed. On the other hand, Comparative Example B-1 having no insulating layer does not provide good insulation performance, and Comparative Example B-2 where the thickness of the adhesive layer is insufficient is sufficient to reduce adhesive strength and provide good electrical insulation. I could't. Comparative Example B-3 having no heat radiation layer resulted in poor heat dissipation.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Conductive Materials (AREA)
- Organic Insulating Materials (AREA)
- Insulating Bodies (AREA)
Abstract
Description
熱放射層の上に層を設けることは、熱放射を阻害するおそれがあり、当業者の通常の技術常識からは行われないことである。しかしながら、本発明者らはその積層条件を所定の条件とすることで、高い熱拡散性及び絶縁性を実現できることを見出した。
また所定の粘着層をさらに備えることで、発熱体への接合性と、熱放射層への熱伝導性を共に備えることができることを見出した。
すなわち、本発明は以下に示す構成を備えるものである。 As a result of intensive studies, the inventors have an insulating layer, a heat radiation layer containing a heat radiation filler and a binder, a metal layer, and an adhesive layer in order, and the insulating layer and the adhesive layer have a predetermined thickness. Thus, it has been found that high thermal diffusibility and insulation can be realized.
Providing a layer on the heat radiation layer may hinder heat radiation, and is not performed from ordinary technical common knowledge of those skilled in the art. However, the present inventors have found that high thermal diffusibility and insulation can be realized by setting the lamination condition to a predetermined condition.
Further, it has been found that by further providing a predetermined adhesive layer, it is possible to provide both the bonding property to the heating element and the thermal conductivity to the heat radiation layer.
That is, the present invention has the following configuration.
「平均厚み」とは、絶縁放熱シート10の断面を観察し、無作為に選んだ10カ所の厚みを測定し、その算術平均値として得られた値を指す。 FIG. 1 is a diagram schematically illustrating a cross section of an insulating heat dissipation sheet according to one embodiment of the present invention. 1 has an
The “average thickness” refers to a value obtained by observing the cross section of the insulating heat-radiating
絶縁層1は、電子部品等の発熱体に絶縁放熱シート10を接合した際に、最外層となる層である。 <Insulating layer>
The
絶縁層1が絶縁性を有することで、電子部品等の中の絶縁性を必要とする場所でも使用も可能となる。 The
Since the insulating
また絶縁層1は、その下に形成される熱放射層2等を保護するため、絶縁放熱シート10の耐摩耗性も向上することができる。すなわち、絶縁放熱シート10に衝撃や変形が加わっても、放熱性及び絶縁性を維持することができる。 The insulating heat-radiating
Further, since the insulating
熱放射層2は、熱放射フィラーおよびバインダーを含有する。 <Thermal radiation layer>
The
熱放射層2における熱放射フィラーの含有量は、好ましくは20~50質量%、より好ましくは30~40質量%である。熱放射層2における熱放射フィラーの含有量がこの範囲内であることにより、熱放射フィラー単体の熱放射率に熱放射層2の放熱性を近づけることができ、熱放射層2の放熱性を向上させるメリットがある。熱放射層2におけるバインダーの含有量は、好ましくは50~80質量%、より好ましくは60~70質量%である。熱放射層2におけるバインダーの含有量がこの範囲内であることにより、熱放射フィラーを基材上に担持するメリットがある。 The curable resin used as the binder is more preferably a thermosetting epoxy resin or a high molecular polysaccharide in terms of durability and adhesion, and it is preferable to crosslink these with an acid crosslinking agent and cure. Examples of the epoxy resin include diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl ether of biphenol, and the like, and one or more selected from these can be used. Examples of the polymeric polysaccharide include one or more selected from chitosan, chitin and derivatives thereof. Acid crosslinking agents include phthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trimellitic anhydride, tetrahydrophthalic anhydride, pyromellitic anhydride, dodecyl succinic anhydride, methyl nadic anhydride, benzophenone tetra anhydride Examples thereof include acid anhydrides such as carboxylic acid and anhydrous butanetetracarboxylic acid, and one or more selected from these can be used.
The content of the heat radiation filler in the
熱放射フィラーおよびバインダーの組成物は、必要に応じて溶剤で希釈してから塗布、乾燥、さらに硬化させて熱放射層2を形成してもよい。
熱放射フィラーおよびバインダーの組成物の塗工方法としては、均一の厚みの薄膜を形成すること出来るグラビア塗工が塗工方法として好ましい。
熱放射層の平均厚みとしては、0.1~5μmであることが好ましく、0.5~3μmであることがより好ましい。熱放射層の平均厚みが0.1~5μmであれば、熱放射層内の熱放射フィラー量を十分確保でき、十分な放熱性を得られる。 The formation method of the
The composition of the heat radiation filler and binder may be diluted with a solvent, if necessary, and then applied, dried and further cured to form the
As a coating method of the composition of the heat radiation filler and the binder, gravure coating capable of forming a thin film having a uniform thickness is preferable as the coating method.
The average thickness of the heat radiation layer is preferably from 0.1 to 5 μm, more preferably from 0.5 to 3 μm. If the average thickness of the heat radiation layer is 0.1 to 5 μm, a sufficient amount of heat radiation filler in the heat radiation layer can be secured, and sufficient heat dissipation can be obtained.
金属層3は、熱放射層2と電子部品等の発熱体の間に備えられる。金属層3は、高い熱伝導性を有することで、熱放射層2に発熱体で発生した熱を効率よく伝えることができる。 <Metal layer>
The metal layer 3 is provided between the
粘着層4は、絶縁放熱シート10を電子機器等の発熱体と接合するための層である。
粘着層4に用いられる粘着剤としては、特に限定されない。絶縁性と粘着力が十分であれば良く、シリコーン系粘着剤、アクリル系粘着剤、ウレタン系粘着剤、ゴム系粘着剤等を用いることが出来る。中でも、粘着力の点でアクリル系粘着剤を用いることが好ましい。
粘着剤は、溶剤を含んだもの、無溶剤のもの、何れも用いることができる。粘着剤の凝集力を高める目的で、粘着剤に応じた硬化剤を含んでも良い。硬化剤としては、例えば、イソシアネート系化合物、エポキシ系化合物、アジリジン系化合物、メラミン系化合物等を用いることができる。
粘着層4の形成方法としては、例えば、金属層3または剥離シート5の一方の面に、溶剤で希釈された粘着剤を塗布し、乾燥して熱硬化させる方法等が挙げられる。 <Adhesive layer>
The adhesive layer 4 is a layer for bonding the insulating heat-radiating
The pressure-sensitive adhesive used for the pressure-sensitive adhesive layer 4 is not particularly limited. It is sufficient that the insulating properties and the adhesive strength are sufficient, and silicone-based adhesives, acrylic-based adhesives, urethane-based adhesives, rubber-based adhesives, and the like can be used. Especially, it is preferable to use an acrylic adhesive from the point of adhesive force.
As the pressure-sensitive adhesive, either a solvent-containing one or a solvent-free one can be used. For the purpose of increasing the cohesive strength of the pressure-sensitive adhesive, a curing agent corresponding to the pressure-sensitive adhesive may be included. As the curing agent, for example, an isocyanate compound, an epoxy compound, an aziridine compound, a melamine compound, or the like can be used.
Examples of the method for forming the pressure-sensitive adhesive layer 4 include a method in which a pressure-sensitive adhesive diluted with a solvent is applied to one surface of the metal layer 3 or the
粘着層4の粘着力は、以下に示す方法により求める。
厚さ50μmのPETフィルム(東レ株式会社製、「ルミラー(登録商標)S-10」)を基材とし、基材上に粘着層4を形成して、試験用積層シートとする。次に、試験用積層シートを縦25mm、横100mmの大きさに切り取り、短冊状シート片とする。次いで、SUS304からなる試験板上に、粘着層を試験板に向けて短冊状シートを積層する。その後、短冊状シート上を、2kgのゴムローラー(幅:約50mm)を1往復させて試験板と短冊状シートとを接合する。 "Testing method for adhesive strength"
The adhesive strength of the adhesive layer 4 is determined by the following method.
A PET film having a thickness of 50 μm (“Lumirror (registered trademark) S-10” manufactured by Toray Industries, Inc.) is used as a base material, and an adhesive layer 4 is formed on the base material to obtain a test laminated sheet. Next, the test laminated sheet is cut into a size of 25 mm in length and 100 mm in width to obtain strip-shaped sheet pieces. Next, a strip-shaped sheet is laminated on the test plate made of SUS304 with the adhesive layer facing the test plate. Thereafter, the test plate and the strip-shaped sheet are joined by reciprocating a 2 kg rubber roller (width: about 50 mm) once on the strip-shaped sheet.
剥離シート5としては、特に限定されない。例えば、剥離処理剤により表面が処理されたプラスチックフィルムが挙げられる。 "Peeling sheet"
The
絶縁放熱シート10の製造方法について特に制限はない。例えば、金属層3の片面に熱放射層2を形成し、その後、熱放射層2に絶縁層1をラミネートする。さらに金属層3のもう片面に粘着層4を貼り合せることで絶縁放熱シート10を得ることが出来る。得られた絶縁放熱シート10は、粘着層4の金属層3と貼り合せた面の反対側に、剥離シート5が積層されることで、絶縁放熱シート10を発熱体に接合するまでの間、剥離シート5によって粘着層4を保護できる。絶縁放熱シート10は、絶縁層1、熱放射層2、金属層3、および粘着層4がこの順で積層されていれば良く、必要に応じて各層の間に粘着剤層やラミネート層等の他の層を含んでもよい。 "Insulating heat dissipation sheet manufacturing method"
There is no restriction | limiting in particular about the manufacturing method of the insulation
アクリル系粘着剤(昭和電工株式会社製 ビニロール(登録商標) PSA SV-6805 固形分 47% )100質量部、イソシアネート系架橋剤(東ソー株式会社製 コロネート(登録商標) HX 固形分100%)1質量部、及び希釈用溶剤の酢酸エチル100質量部を混合し粘着剤組成物を作製した。次いで、表面が離型処理されたPETフィルム(東洋紡社製E7006、厚み75μm)上にドクターブレードにより溶剤乾燥後所定の厚みとなるように塗工し溶剤を乾燥させ、次いで上記表面離型処理PETフィルムを被せて粘着シートを得た。この粘着シートは、後述する金属層と接着させることで粘着層となる。 (Preparation of adhesive layer)
100 parts by mass of acrylic adhesive (Vinylol (registered trademark) PSA SV-6805 solid content 47%) manufactured by Showa Denko KK, 1 mass of isocyanate crosslinking agent (Coronate (registered trademark) HX solid content 100% manufactured by Tosoh Corporation) Part and 100 parts by mass of ethyl acetate as a diluting solvent were mixed to prepare an adhesive composition. Next, the surface is subjected to a release treatment on a PET film (Toyobo E7006, thickness 75 μm) by a doctor blade so that the solvent is dried and dried to a predetermined thickness, and then the surface release treatment PET The film was covered to obtain an adhesive sheet. This pressure-sensitive adhesive sheet becomes a pressure-sensitive adhesive layer by being adhered to a metal layer described later.
(実施例A-1)
絶縁層1として12μmPETフィルムに接着剤(昭和電工株式会社製 EX-2022)を1μm厚となるように塗工乾燥し、次いで熱放射層2と金属層3を有するカーボンコートアルミ金属シート(昭和電工製:カーボンコートアルミ箔 SDX(商標))のカーボンコート層上に貼り合せ、絶縁層1、熱放射層2、金属層3が順に積層された積層シートを形成した。熱放射層2は、熱放射フィラーとしてカーボンブラック、バインダーとしてキトサン誘導体をピロメリット酸により架橋させたものである。熱放射層2の平均厚みは1μmであり、金属層3は、平均厚み50μmのアルミ箔である。
次に、一方の表面離型処理PETフィルムを除去した10μm厚の粘着シートを、積層シートの金属層面に貼り合せることで絶縁放熱シートA-1を得た。
(実施例A-2)
実施例A-1の絶縁層1を50μmPETフィルムに、粘着層4の平均厚みを50μmに変更した以外は実施例A-1の絶縁放熱シートと同様にして、実施例A-2の絶縁放熱シートを得た。
(実施例A-3)
実施例A-1の絶縁層を12μmポリエチレンフィルムに変更した以外は、実施例A-1の絶縁放熱シートと同様にして、実施例A-3の絶縁放熱シートを得た。
(実施例A-4)
<ポリウレタンの合成>
温度計、撹拌器、滴下ロート、乾燥管付き冷却管を備えた5L四つ口フラスコに、イソホロンジイソシアネート及び水酸基価が56mgKOH/gのヒドロキシル基を末端に有するポリプロピレングリコールである商品名「D-2000」(三井化学ファイン株式会社製、数平均分子量:2000(カタログ値))を、前者が474.6g、後者が3992.4g(モル比で前者:後者=15:14)で仕込んだ。その後、前記イソホロンジイソシアネート及びD-2000に対し、ジオクチルスズジラウレート100質量ppmを加え、70℃まで昇温して4時間反応させ、イソシアナト基を末端に有するポリウレタンを得た。
その後、2-ヒドロキシエチルアクリレート33.0g(上記ポリウレタンの理論末端イソシアナト基量と当量(2モル相当分))を加えた後、70℃で2時間反応させ、重量平均分子量が70,000のアクリロイル基を末端に有するポリウレタンを得た。このとき、IRスペクトルにより、イソシアナト基由来の吸収ピークが消失したことを確認した後、反応を終了した。なお、上記アクリロイル基を末端に有するポリウレタンの重量平均分子量は、以下の条件でゲル・パーミエーション・クロマトグラフィー:商品名「Shodex GPC-101」(昭和電工株式会社製、「Shodex」は登録商標である)を用いて測定したポリスチレン換算の分子量である。
カラム:LF-804(昭和電工株式会社製)
カラムの温度:40℃
試料:0.2質量%テトラヒドロフラン溶液
流量:1ml/min
溶離液:テトラヒドロフラン
<ポリウレタン樹脂組成物の製造>
このようにして得られたポリウレタン100質量部と、重合性単量体である2-エチルヘキシルアクリレート252質量部とイソステアリルアクリレート196質量部とアクリル酸18質量部と2-ヒドロキシエチルアクリレート10質量部とを、フラスコで混合し、ポリウレタン樹脂組成物を得た。
<熱伝導性粘着剤組成物の製造>
このようにして得られたポリウレタン樹脂組成物100質量部に対して、熱伝導性フィラーである、D50が18μmの水酸化アルミニウム(昭和電工社製、商品名 H-31)300質量部と、光重合開始剤である2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド(BASF社製、商品名:LUCIRIN TPO)を0.8質量部とを、室温下でディスパーを用いて混合し、均一な熱伝導性粘着剤組成物を調製した。
<熱伝導性フィラー含有粘着シートの製造>
このようにして調製した熱伝導性粘着剤組成物を用いて、以下に示す方法により、熱伝導性フィラー含有粘着シートを形成した。
熱伝導性粘着剤組成物を、前記表面離型処理された厚み75μmのPETフィルム(200mm×200mm)に、アプリケーターを用いて膜厚(硬化後の平均厚み)が50μm厚となるように塗布した。その後、粘着剤組成物からなる塗膜上に、同じ表面離型処理PETフィルムを配置した。続いて、一方の剥離PETフィルム上から、紫外線照射装置(日本電池株式会社製、UV照射装置4kw×1、出力:160W/cm、メタルハライドランプ)を用いて、照射距離12cm、ランプ移動速度20m/min、照射量約1000mJ/cm2の条件で紫外線を照射して、熱伝導性粘着剤組成物を硬化させた。
以上の工程により、2枚の剥離PETフィルム間に、厚み50μm厚の熱伝導性粘着層が挟まれた熱伝導性粘着シートを得た。
次に、実施例1に記載の粘着シートを、熱伝導性粘着シートに変更した以外は、実施例A-1の絶縁放熱シートと同様にして、実施例A-4の絶縁放熱シートを得た。 <Manufacture of insulation heat dissipation sheet>
Example A-1
As an insulating
Next, an insulating heat-dissipating sheet A-1 was obtained by adhering a 10 μm-thick adhesive sheet from which one surface release-treated PET film was removed to the metal layer surface of the laminated sheet.
Example A-2
Insulating heat radiating sheet of Example A-2 in the same manner as the insulating heat radiating sheet of Example A-1, except that the insulating
Example A-3
An insulating heat radiating sheet of Example A-3 was obtained in the same manner as the insulating heat radiating sheet of Example A-1, except that the insulating layer of Example A-1 was changed to a 12 μm polyethylene film.
Example A-4
<Synthesis of polyurethane>
A trade name “D-2000” which is a polypropylene glycol having a terminal hydroxyl group with isophorone diisocyanate and a hydroxyl value of 56 mgKOH / g in a 5 L four-necked flask equipped with a thermometer, a stirrer, a dropping funnel and a cooling tube with a drying tube. (Mitsui Chemicals Fine Co., Ltd., number average molecular weight: 2000 (catalog value)) was charged at 474.6 g for the former and 3.92.4 g for the latter (molar ratio of the former: the latter = 15: 14). Thereafter, 100 mass ppm of dioctyltin dilaurate was added to the isophorone diisocyanate and D-2000, and the mixture was heated to 70 ° C. and reacted for 4 hours to obtain a polyurethane having an isocyanato group at the terminal.
Thereafter, 33.0 g of 2-hydroxyethyl acrylate (equivalent to the amount of the theoretical terminal isocyanate group of the polyurethane (equivalent to 2 moles)) was added, followed by reaction at 70 ° C. for 2 hours, and acryloyl having a weight average molecular weight of 70,000. A polyurethane having a terminal group was obtained. At this time, after confirming that the absorption peak derived from the isocyanato group disappeared by IR spectrum, the reaction was terminated. In addition, the weight average molecular weight of the polyurethane having an acryloyl group at the terminal is gel permeation chromatography under the following conditions: trade name “Shodex GPC-101” (manufactured by Showa Denko KK, “Shodex” is a registered trademark) The molecular weight in terms of polystyrene measured using
Column: LF-804 (made by Showa Denko KK)
Column temperature: 40 ° C
Sample: 0.2 mass% tetrahydrofuran solution Flow rate: 1 ml / min
Eluent: Tetrahydrofuran <Production of polyurethane resin composition>
100 parts by mass of the polyurethane thus obtained, 252 parts by mass of 2-ethylhexyl acrylate which is a polymerizable monomer, 196 parts by mass of isostearyl acrylate, 18 parts by mass of acrylic acid, 10 parts by mass of 2-hydroxyethyl acrylate, Were mixed in a flask to obtain a polyurethane resin composition.
<Manufacture of heat conductive adhesive composition>
With respect to 100 parts by mass of the polyurethane resin composition thus obtained, 300 parts by mass of aluminum hydroxide (trade name H-31, manufactured by Showa Denko KK) having a D50 of 18 μm, which is a heat conductive filler, 0.84 parts by mass of 2,4,6-trimethylbenzoyldiphenylphosphine oxide (trade name: LUCIRIN TPO), which is a polymerization initiator, was mixed with a disper at room temperature to obtain uniform heat. A conductive adhesive composition was prepared.
<Manufacture of heat conductive filler containing adhesive sheet>
Using the heat conductive pressure-sensitive adhesive composition thus prepared, a heat conductive filler-containing pressure-sensitive adhesive sheet was formed by the following method.
The heat conductive adhesive composition was applied to the 75 μm-thick PET film (200 mm × 200 mm) subjected to the surface release treatment using an applicator so that the film thickness (average thickness after curing) was 50 μm. . Then, the same surface release treatment PET film was arrange | positioned on the coating film which consists of an adhesive composition. Subsequently, from one peeled PET film, using an ultraviolet irradiation device (manufactured by Nippon Battery Co., Ltd., UV irradiation device 4 kw × 1, output: 160 W / cm, metal halide lamp), an irradiation distance of 12 cm, a lamp moving speed of 20 m / The heat conductive pressure-sensitive adhesive composition was cured by irradiating with ultraviolet rays under conditions of min and an irradiation amount of about 1000 mJ / cm 2 .
By the above process, the heat conductive adhesive sheet in which the 50-micrometer-thick heat conductive adhesive layer was pinched | interposed between two peeling PET films was obtained.
Next, an insulating heat radiating sheet of Example A-4 was obtained in the same manner as the insulating heat radiating sheet of Example A-1, except that the pressure sensitive adhesive sheet described in Example 1 was changed to a heat conductive pressure sensitive adhesive sheet. .
実施例A-1の絶縁層1を除いた構成に変更した以外は、実施例A-1の絶縁放熱シートと同様にして、比較例B-1の絶縁放熱シートを得た。
(比較例B-2)
実施例A-1の粘着層4の平均厚みを3μmに変更した以外は、実施例A-1の絶縁放熱シートと同様にして、比較例B-2の絶縁放熱シートを得た。
(比較例B-3)
実施例A-1の熱放射層2を除いた構成に変更した以外は、実施例A-1の絶縁放熱シートと同様にして、実施例B-3の絶縁放熱シートを得た。 (Comparative Example B-1)
An insulating heat-dissipating sheet of Comparative Example B-1 was obtained in the same manner as the insulating heat-dissipating sheet of Example A-1 except that the configuration was changed to that of Example A-1 except for the insulating
(Comparative Example B-2)
An insulating heat-dissipating sheet of Comparative Example B-2 was obtained in the same manner as the insulating heat-dissipating sheet of Example A-1, except that the average thickness of the adhesive layer 4 of Example A-1 was changed to 3 μm.
(Comparative Example B-3)
An insulating heat-dissipating sheet of Example B-3 was obtained in the same manner as the insulating heat-dissipating sheet of Example A-1, except that the heat-radiating
各実施例、比較例の絶縁放熱シートをカッターで切断した断面を電子マイクロメータ(株式会社セイコー・イーエム社製ミリトロン1240)により無作為に10点観察し、絶縁層を除く各層の厚みを測定して、その算術平均値を求めた。絶縁層は所定の厚みの市販のフィルムを使用しているため測定していない。
(電気絶縁性の評価)
JIS C2110-1に準拠した方法で、各実施例および各比較例で作製した絶縁放熱シートの絶縁破壊電圧を測定した。
具体的には、縦100mm、横100mmの正方形の絶縁放熱シートの剥離PETフィルムを剥がしたものを測定サンプルとして用いた。
測定には菊水電子工業(株)製の耐電圧試験器(TOS5101)を使用し、上部電極は直径25mm、高さ25mm、下部電極は直径70mm、高さ15mmのものを使用した。
昇圧はJIS C2110-1の60秒段階昇圧試験の条件に従って行い、サンプルが破壊された電圧を絶縁破壊電圧とした。
得られた結果について、以下のように評価した。
○:1kV以上
×:1kV未満 (Measurement of average thickness)
Ten sections of the cross-sections obtained by cutting the insulating heat-dissipating sheets of each Example and Comparative Example with a cutter were randomly observed with an electronic micrometer (Millitron 1240 manufactured by Seiko EM Co., Ltd.), and the thickness of each layer excluding the insulating layer was measured. The arithmetic average value was obtained. The insulating layer is not measured because a commercially available film having a predetermined thickness is used.
(Evaluation of electrical insulation)
The dielectric breakdown voltage of the insulating heat radiation sheet produced in each example and each comparative example was measured by a method based on JIS C2110-1.
Specifically, a sample obtained by peeling off a peeled PET film of a square insulating heat radiating sheet having a length of 100 mm and a width of 100 mm was used as a measurement sample.
For the measurement, a withstand voltage tester (TOS5101) manufactured by Kikusui Electronics Co., Ltd. was used. The upper electrode had a diameter of 25 mm and a height of 25 mm, and the lower electrode had a diameter of 70 mm and a height of 15 mm.
Boosting was performed according to the conditions of the 60-second step-up test of JIS C2110-1, and the voltage at which the sample was broken was defined as the dielectric breakdown voltage.
The obtained results were evaluated as follows.
○: 1 kV or more × less than 1 kV
剥離PETフィルムを剥がした縦60mm、横60mmの正方形の絶縁放熱シートを、縦60mm、横60mmの正方形のセラミックヒーター(坂口電熱社製 WALN-1)の両面に、セラミックヒーターに粘着シートの粘着層を対向させて積層した。そして、セラミックヒーターを5Wで発熱させた時のヒーター温度(60分後)を測定し、放熱性を評価した。評価は、室温25℃、湿度50%RHの環境で行った。
なお、絶縁放熱シートを貼り付けない状態のセラミックヒーターを5Wで発熱させた時のヒーター温度は150℃であった。 (Evaluation of heat dissipation)
A 60 mm long and 60 mm wide square insulating heat release sheet from which the peeled PET film has been peeled off is applied to both sides of a 60 mm long and 60 mm wide square ceramic heater (WALN-1 manufactured by Sakaguchi Electric Heating Co., Ltd.). Were stacked to face each other. Then, the heater temperature (after 60 minutes) when the ceramic heater was heated at 5 W was measured to evaluate the heat dissipation. Evaluation was performed in an environment of room temperature 25 ° C. and humidity 50% RH.
The heater temperature was 150 ° C. when the ceramic heater without the insulating heat-radiating sheet was heated at 5 W.
Claims (11)
- 絶縁層と、熱放射フィラーおよびバインダーを含有する熱放射層と、金属層と、粘着層とを順に有し、
前記絶縁層および前記粘着層の平均厚みが各々5~50μmである絶縁放熱シート。 It has an insulating layer, a heat radiation layer containing a heat radiation filler and a binder, a metal layer, and an adhesive layer in order,
An insulating heat radiating sheet, wherein the insulating layer and the adhesive layer each have an average thickness of 5 to 50 μm. - 絶縁破壊電圧が1kV以上である請求項1に記載の絶縁放熱シート。 The insulation heat dissipation sheet according to claim 1, wherein the dielectric breakdown voltage is 1 kV or more.
- 前記熱放射層の平均厚みが0.1~5μmである請求項1又は2のいずれかに記載の絶縁放熱シート。 3. The insulating heat-radiating sheet according to claim 1, wherein the heat radiation layer has an average thickness of 0.1 to 5 μm.
- 前記金属層の平均厚みが20~100μmである請求項1~3のいずれか一項に記載の絶縁放熱シート。 4. The insulating heat-radiating sheet according to claim 1, wherein the average thickness of the metal layer is 20 to 100 μm.
- 前記熱放射フィラーが炭素質材料である請求項1~4のいずれか一項に記載の絶縁放熱シート。 The insulating heat radiating sheet according to any one of claims 1 to 4, wherein the heat radiation filler is a carbonaceous material.
- 前記炭素質材料が、カーボンブラック、黒鉛および気相法炭素繊維から選ばれる1種または2種以上の材料である請求項5に記載の絶縁放熱シート。 The insulating heat radiation sheet according to claim 5, wherein the carbonaceous material is one or more materials selected from carbon black, graphite, and vapor grown carbon fiber.
- 前記バインダーの少なくとも一種が、エポキシ樹脂または高分子多糖類が酸架橋剤によって架橋されたものである請求項1~6のいずれか一項に記載の絶縁放熱シート。 The insulating heat-radiating sheet according to any one of claims 1 to 6, wherein at least one of the binders is obtained by crosslinking an epoxy resin or a polymer polysaccharide with an acid crosslinking agent.
- 前記熱放射層が、前記熱放射フィラー20~50質量%およびバインダー50~80質量%を含有する請求項1~7のいずれか一項に記載の絶縁放熱シート。 The insulating heat-radiating sheet according to any one of claims 1 to 7, wherein the heat radiation layer contains 20 to 50% by mass of the heat radiation filler and 50 to 80% by mass of a binder.
- 前記粘着層の金属層と反対側の面に、剥離シートをさらに有することを特徴とする請求項1~8のいずれか一項に記載の絶縁放熱シート。 The insulating heat-radiating sheet according to any one of claims 1 to 8, further comprising a release sheet on a surface of the adhesive layer opposite to the metal layer.
- 請求項1~9のいずれか一項に記載の絶縁放熱シートを含むヒートスプレッター。 A heat spreader comprising the insulating heat-dissipating sheet according to any one of claims 1 to 9.
- 請求項10に記載のヒートスプレッターを組みこんだ、電子機器。 An electronic device incorporating the heat spreader according to claim 10.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020177021236A KR20170102305A (en) | 2015-01-09 | 2015-12-15 | Insulation sheet, heat spreader and electronic device |
JP2016568303A JP6604971B2 (en) | 2015-01-09 | 2015-12-15 | Insulating heat dissipation sheet, heat spreader and electronic equipment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-003074 | 2015-01-09 | ||
JP2015003074 | 2015-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016111124A1 true WO2016111124A1 (en) | 2016-07-14 |
Family
ID=56355826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/085098 WO2016111124A1 (en) | 2015-01-09 | 2015-12-15 | Insulating heat dissipation sheet, heat spreader and electronic device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6604971B2 (en) |
KR (1) | KR20170102305A (en) |
TW (1) | TWI590750B (en) |
WO (1) | WO2016111124A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018067671A (en) * | 2016-10-21 | 2018-04-26 | エムデン無線工業株式会社 | Electronic component holding device |
JP7111237B1 (en) | 2021-10-14 | 2022-08-02 | 大日本印刷株式会社 | Energy storage device module using heat dissipation sheet, electric mobility |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5457700A (en) * | 1977-10-18 | 1979-05-09 | Toray Industries | Heat transfer electric insulating sheet |
JPS57182917A (en) * | 1981-05-06 | 1982-11-11 | Showa Denko Kk | High thermal conductive electrically insulated substrate |
JP2005203735A (en) * | 2003-12-16 | 2005-07-28 | Fuji Polymer Industries Co Ltd | Thermally conductive composite sheet |
JP2006245523A (en) * | 2005-02-04 | 2006-09-14 | Dainippon Printing Co Ltd | Heat dissipating sheet |
JP2008120065A (en) * | 2006-10-19 | 2008-05-29 | Hitachi Chem Co Ltd | Heat radiating film |
JP2009136848A (en) * | 2007-12-11 | 2009-06-25 | Furukawa Sky Kk | Heat radiation coated metal plate |
JP2011096989A (en) * | 2009-11-02 | 2011-05-12 | Keiwa Inc | Heat radiation sheet for back of solar cell module, and solar cell module using the same |
JP2015179799A (en) * | 2014-02-28 | 2015-10-08 | 大日本印刷株式会社 | Heat dissipation structure, and solar cell module with heat dissipation structure |
-
2015
- 2015-12-15 KR KR1020177021236A patent/KR20170102305A/en not_active Application Discontinuation
- 2015-12-15 WO PCT/JP2015/085098 patent/WO2016111124A1/en active Application Filing
- 2015-12-15 JP JP2016568303A patent/JP6604971B2/en active Active
- 2015-12-21 TW TW104142948A patent/TWI590750B/en not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5457700A (en) * | 1977-10-18 | 1979-05-09 | Toray Industries | Heat transfer electric insulating sheet |
JPS57182917A (en) * | 1981-05-06 | 1982-11-11 | Showa Denko Kk | High thermal conductive electrically insulated substrate |
JP2005203735A (en) * | 2003-12-16 | 2005-07-28 | Fuji Polymer Industries Co Ltd | Thermally conductive composite sheet |
JP2006245523A (en) * | 2005-02-04 | 2006-09-14 | Dainippon Printing Co Ltd | Heat dissipating sheet |
JP2008120065A (en) * | 2006-10-19 | 2008-05-29 | Hitachi Chem Co Ltd | Heat radiating film |
JP2009136848A (en) * | 2007-12-11 | 2009-06-25 | Furukawa Sky Kk | Heat radiation coated metal plate |
JP2011096989A (en) * | 2009-11-02 | 2011-05-12 | Keiwa Inc | Heat radiation sheet for back of solar cell module, and solar cell module using the same |
JP2015179799A (en) * | 2014-02-28 | 2015-10-08 | 大日本印刷株式会社 | Heat dissipation structure, and solar cell module with heat dissipation structure |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018067671A (en) * | 2016-10-21 | 2018-04-26 | エムデン無線工業株式会社 | Electronic component holding device |
JP7111237B1 (en) | 2021-10-14 | 2022-08-02 | 大日本印刷株式会社 | Energy storage device module using heat dissipation sheet, electric mobility |
JP2023058969A (en) * | 2021-10-14 | 2023-04-26 | 大日本印刷株式会社 | Power storage device module using heat dissipation sheet, and electric mobility |
Also Published As
Publication number | Publication date |
---|---|
TW201640994A (en) | 2016-11-16 |
KR20170102305A (en) | 2017-09-08 |
JPWO2016111124A1 (en) | 2017-10-26 |
JP6604971B2 (en) | 2019-11-13 |
TWI590750B (en) | 2017-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6022546B2 (en) | Curable heat dissipation composition | |
KR101523332B1 (en) | Adhesive sheet, electromagnetic wave shielding sheet and electronic device | |
TWI686582B (en) | Method of producing heat-radiation insulating sheet, heat-radiation insulating sheet and heat spreader | |
WO2015072487A1 (en) | Electromagnetic-wave-absorbing heat dissipation sheet | |
JP2013176979A (en) | Thermal conductive sheet | |
WO2018110255A1 (en) | Transfer sheet | |
JP2017092345A (en) | Heat conduction sheet and method of manufacturing the same, and semiconductor device | |
JP5581605B2 (en) | Method for producing anisotropic conductive adhesive film | |
WO2015183896A1 (en) | Enhanced pressure sensitive adhesive for thermal management applications | |
JP6704860B2 (en) | COF type semiconductor package and liquid crystal display device | |
JP6604971B2 (en) | Insulating heat dissipation sheet, heat spreader and electronic equipment | |
KR20140142676A (en) | Thermosetting die-bonding film, die-bonding film with dicing sheet, and process for producing semiconductor device | |
TW201938365A (en) | Composite sheet for forming protective film and method for manufacturing semiconductor chip with protective film | |
US11799442B2 (en) | Manufacturing method of mounting structure, and laminate sheet therefor | |
JP6975006B2 (en) | Work manufacturing method | |
JP6566554B2 (en) | LAMINATED SHEET AND METHOD FOR PRODUCING LAMINATED SHEET | |
WO2003085733A1 (en) | Thermosetting adhesive sheet with electroconductive and thermoconductive properties | |
JP2017118025A (en) | Electromagnetic shielding heat dissipation sheet and heat spreader | |
KR101568687B1 (en) | Heat-radiating sheet and method for manufacturing the same | |
JP2022130850A (en) | Heat conducting sheet | |
KR101532243B1 (en) | Adhesive thermal conductivity and heat dissipation sheet coated with paint | |
WO2020032175A1 (en) | Terminal protecting tape and method for manufacturing semiconductor device furnished with electromagnetic-wave blocking film | |
WO2020130127A1 (en) | Double-faced adhesive tape for protection of terminal and production method for semiconductor device equipped with electromagnetic wave shielding film | |
TW202225358A (en) | Dicing adhesive film with spacer | |
CN112980366A (en) | Chip bonding sheet and dicing chip bonding film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15876997 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2016568303 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20177021236 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 15876997 Country of ref document: EP Kind code of ref document: A1 |