WO2016101417A1 - Laser packaging structure - Google Patents

Laser packaging structure Download PDF

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Publication number
WO2016101417A1
WO2016101417A1 PCT/CN2015/074300 CN2015074300W WO2016101417A1 WO 2016101417 A1 WO2016101417 A1 WO 2016101417A1 CN 2015074300 W CN2015074300 W CN 2015074300W WO 2016101417 A1 WO2016101417 A1 WO 2016101417A1
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WIPO (PCT)
Prior art keywords
lens
laser
light
package structure
cap
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PCT/CN2015/074300
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French (fr)
Chinese (zh)
Inventor
王希亮
杨毓智
绪海波
李连城
华一敏
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昂纳信息技术（深圳）有限公司
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Publication of WO2016101417A1 publication Critical patent/WO2016101417A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements

Definitions

  • the present invention relates to the field of laser technologies, and in particular, to a laser package structure.
  • lasers Due to its advantages of simple fabrication, small size, light weight, long life and high efficiency, lasers are widely used in optical communication, optical pumping, optical storage and laser display.
  • the usual laser packaging method is to package the laser chip on the header, and the laser chip emits The beam is directly coupled into the fiber through the lens, but due to the laser chip
  • the emission beam is large, the divergence angle is 20 ⁇ 25° in the fast axis (Y axis) direction, and the divergence angle in the slow axis (X axis) direction is 6 ⁇ 8.5°.
  • the divergence angles in the two directions are different. It is easy to cause the spot on the fast axis (Y axis) of the fiber to be too large. Moreover, part of the emitted light beam is transmitted to the lens, and the coupling efficiency is low due to high loss.
  • the technical problem to be solved by the present invention is to provide a laser package structure and overcome the above-mentioned drawbacks of the prior art.
  • a laser package structure comprising a tube holder, a tube cap and a laser chip disposed on the tube holder, further comprising a condensing lens disposed on the tube cap, and a light compression lens disposed between the concentrating lens and the laser chip, Both the laser chip and the light compression lens are encapsulated in a closed cavity formed by the joint of the stem and the cap.
  • the optical compression lens is a fiber lens.
  • the fiber lens is a 105 um diameter fiberglass rod lens.
  • the optical fiber lens is disposed in front of the light emitting end of the laser chip, and the light incident end of the fiber lens is adjacent to the light emitting end of the laser chip, and the light emitting end of the fiber lens is adjacent to the light collecting lens.
  • the optical lens is a ball lens
  • the ball lens is mounted in cooperation with the tube cap.
  • the optical condenser lens is an aspherical lens, and the aspherical lens is mounted in cooperation with the pipe cap.
  • the method further comprises: a window disposed on the cap, the window, the cap and the stem cooperate to form a closed cavity.
  • the method further comprises: a heat sink, wherein the laser chip is mounted on a vertical surface of the socket by a heat sink.
  • the optical axis of the laser chip is disposed on a central axis of the concentrating lens.
  • the invention has the beneficial effects that, compared with the prior art, the present invention designs a laser package structure, and provides a light compression lens in front of the laser chip to perform spot compression on the emitted light beam, so that the emitted light beam all enters the lens. Improve the working efficiency of the laser and reduce the working loss of the laser.
  • FIG. 1 is a schematic structural view of a prior art laser package structure
  • FIG. 2 is a schematic structural view of a first embodiment of a laser package structure of the present invention.
  • Fig. 3 is a schematic view showing the structure of the second embodiment of the laser package structure of the present invention.
  • FIG. 2 is a scheme 1 of the laser package structure.
  • FIG. 3 is a schematic structural diagram of the second scheme of the laser package structure.
  • a laser package structure comprising a stem 11, a cap 12 and a laser chip 3 disposed on the stem 11, further comprising a condensing lens 5 disposed on the cap 12, and a photopolymer lens 5 and a laser chip
  • the three optical compression lenses 4, the laser chip 3 and the optical compression lens 4 are each enclosed in a closed cavity formed by the cooperation of the stem 11 and the cap 12.
  • the socket 11 is provided with a pin, and the pin can be connected with an external circuit to realize monitoring of the working state of the tunable laser; the emitted light beam of the laser chip 3 is focused by the spotlight lens 5 disposed on the cap 12 So as to be coupled into the fiber transmission structure 6 for transmission.
  • the light collecting lens 5 is passed. At the time of convergence, the spot that is likely to reach the fast axis (Y-axis) direction of the optical fiber is too large, and part of the emitted light beam is lost due to excessive divergence angle during transmission to the lens, and is disposed between the optical condenser lens 5 and the laser chip 3. The light compresses the lens 4.
  • the light output axis of the laser chip 3 is disposed on the central axis of the condenser lens 5.
  • the optical compression lens 4 is used to compress the light beam emitted from the laser chip 3 to be reduced as much as possible before being transmitted to the condenser lens 5.
  • the light compression lens 4 is preferably a fiber lens that is held at a certain transmission distance of the light beam.
  • the fiber lens is preferably a 105 um diameter fiberglass rod lens.
  • the fiber lens is disposed in front of the light emitting end of the laser chip 3, and the light incident end of the fiber lens is adjacent to the light emitting end of the laser chip 3.
  • the light emitting end of the fiber lens is adjacent to the light collecting lens 5.
  • the fiber lens is mounted in a closed cavity formed by the cooperation of the stem 11 and the cap 12 through a limiting structure. Wherein, the light-increasing end of the fiber lens is kept close enough to the light-emitting end of the laser chip 3, and most of the light beams emitted by the laser chip 3 can be injected into the fiber lens to improve the working efficiency of the laser.
  • the concentrating lens 5 is a ball lens 51, and the ball lens 51 is mounted in cooperation with the cap 12.
  • the ball lens 51 receives the light beam emitted from the light exit of the fiber lens and performs spot focusing.
  • the concentrating lens 5 includes an aspherical lens 52 disposed on the inner side of the cap 12 and fitted with the cap 12; or disposed outside the cap 12 and mounted in cooperation with the cap 12.
  • the aspherical lens 52 receives the light beam emitted from the light exit of the fiber optic lens and focuses the spot.
  • the laser package structure further includes a window disposed on the cap 12, and the window, the cap 12 and the stem 11 cooperate to form a closed cavity, and the window is provided to ensure the sealing of the closed cavity, in particular, the aspherical lens 52.
  • the transmission process of the specific light beam is sequentially arranged as a laser chip 3, a fiber lens, a window, and a condensing lens 5.
  • a heat sink is further included, and the laser chip 3 is mounted on the vertical surface of the stem 11 by a heat sink.
  • the heat sink is the carrier of the laser chip 3.
  • the vertical structure of the stem 11 is also constituted by a heat sink.
  • the heat sink is fixed on the stem 11, and the laser chip 3 is fixed on the vertical surface of the heat sink.
  • the vertical surface of the heat sink is a plane perpendicular to the tube seat 11 and can be designed as L. Type structure.
  • the heat sink has a high thermal conductivity and can also be used to conduct heat generated by the laser chip 3 fixed thereto.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

A laser packaging structure relates to the technical field of lasers. The laser packaging structure comprises a tube base (11), a tube cap (12) and a laser chip (3) arranged on the tube base (11), and further comprises a light condenser lens (5) arranged on the tube cap (12) and a light compression lens (4) arranged between the light condenser lens (5) and the laser chip (3). The laser chip (3) and the light compression lens (4) are both packaged in a closed cavity formed cooperatively by the tube base (11) and the tube cap (12). With the designed laser packaging structure, in which the light compression lens (4) is arranged in front of the laser chip (3) to perform light spot compression on an emitted light beam and enable the emitted light beam to completely enter the light condenser lens (5), the working efficiency of the laser is improved and the working loss of the laser is lowered.

Description

一种激光器封装结构  Laser package structure 技术领域Technical field
本发明涉及激光器技术领域，具体涉及一种激光器封装结构。  The present invention relates to the field of laser technologies, and in particular, to a laser package structure.
背景技术Background technique
激光器由于制作简单、体积小、重量轻、寿命长和效率高等优点，在光通信、光泵浦、光存储和激光显示等领域得到广泛应用。 Due to its advantages of simple fabrication, small size, light weight, long life and high efficiency, lasers are widely used in optical communication, optical pumping, optical storage and laser display.
如图1所示，通常 激光器封装 方法是将 激光器芯片封装在管座上 ， 激光器芯片发射的 光束直接通过透镜耦合到光纤中，但是由于 激光器芯片 的发射光束较大，在快轴（Y轴）方向的发散角为20~25°，慢轴（X轴）方向的发散角为6~8.5°，两个方向发散角不同，通过透镜汇聚时，易造成到达光纤上快轴（Y轴）方向的光斑过大。而且部分发射光束在传输到透镜过程中，由于损耗高，使耦合效率低。  As shown in Figure 1, the usual laser packaging method is to package the laser chip on the header, and the laser chip emits The beam is directly coupled into the fiber through the lens, but due to the laser chip The emission beam is large, the divergence angle is 20~25° in the fast axis (Y axis) direction, and the divergence angle in the slow axis (X axis) direction is 6~8.5°. The divergence angles in the two directions are different. It is easy to cause the spot on the fast axis (Y axis) of the fiber to be too large. Moreover, part of the emitted light beam is transmitted to the lens, and the coupling efficiency is low due to high loss.
技术问题technical problem
本发明要解决的技术问题在于，针对现有技术的上述缺陷，提供一种 激光器封装结构，克服 发射光束汇聚时光斑过大、传输损耗高的问题 。  The technical problem to be solved by the present invention is to provide a laser package structure and overcome the above-mentioned drawbacks of the prior art. The problem of excessive spot size and high transmission loss when the emitted beam is concentrated.
技术解决方案Technical solution
本发明解决其技术问题所采用的技术方案是：提供 一种激光器封装结构，包括管座、管帽及设置在管座上的激光器芯片，还包括设置在管帽上的光聚透镜、及设置在光聚透镜和激光器芯片间的光压缩透镜，所述激光器芯片和光压缩透镜均封装于所述管座和管帽配合形成的封闭腔体中。  The technical solution adopted by the present invention to solve the technical problem thereof is: providing A laser package structure comprising a tube holder, a tube cap and a laser chip disposed on the tube holder, further comprising a condensing lens disposed on the tube cap, and a light compression lens disposed between the concentrating lens and the laser chip, Both the laser chip and the light compression lens are encapsulated in a closed cavity formed by the joint of the stem and the cap.
其中，较佳方案是：所述光压缩透镜为光纤透镜。  Preferably, the optical compression lens is a fiber lens.
其中，较佳方案是：所述光纤透镜为105um直径的光纤玻璃棒透镜。  Preferably, the fiber lens is a 105 um diameter fiberglass rod lens.
其中，较佳方案是：所述光纤透镜设置在激光器芯片的发光端前，所述光纤透镜的进光端靠近激光器芯片的发光端，所述光纤透镜的出光端靠近光聚透镜。 Preferably, the optical fiber lens is disposed in front of the light emitting end of the laser chip, and the light incident end of the fiber lens is adjacent to the light emitting end of the laser chip, and the light emitting end of the fiber lens is adjacent to the light collecting lens.
其中，较佳方案是：所述光聚透镜为球透镜，所述球透镜与管帽配合安装。  Preferably, the optical lens is a ball lens, and the ball lens is mounted in cooperation with the tube cap.
其中，较佳方案是：所述光聚透镜为非球透镜，所述非球透镜与管帽配合安装。  Preferably, the optical condenser lens is an aspherical lens, and the aspherical lens is mounted in cooperation with the pipe cap.
其中，较佳方案是：还包括设置在管帽上的窗口，所述窗口、管帽和管座配合形成封闭腔体。  Preferably, the method further comprises: a window disposed on the cap, the window, the cap and the stem cooperate to form a closed cavity.
其中，较佳方案是：还包括热沉，所述激光器芯片通过热沉安装在管座的垂直面上。  Preferably, the method further comprises: a heat sink, wherein the laser chip is mounted on a vertical surface of the socket by a heat sink.
其中，较佳方案是：所述激光器芯片的出光光轴设置在光聚透镜的中心轴上。  Preferably, the optical axis of the laser chip is disposed on a central axis of the concentrating lens.
有益效果Beneficial effect
本发明的有益效果在于，与现有技术相比，本发明通过设计一种激光器封装结构，在激光器芯片前设置光压缩透镜，对 发射光束进行光斑压缩，让发射光束全部进入到 光聚透镜 中，提高 激光器的工作效率，降低激光器的工作损耗。 The invention has the beneficial effects that, compared with the prior art, the present invention designs a laser package structure, and provides a light compression lens in front of the laser chip to perform spot compression on the emitted light beam, so that the emitted light beam all enters the lens. Improve the working efficiency of the laser and reduce the working loss of the laser.
附图说明DRAWINGS
下面将结合附图及实施例对本发明作进一步说明，附图中：  The present invention will be further described below in conjunction with the accompanying drawings and embodiments, in which:
图1是现有技术 激光器封装结构的 结构示意图；  1 is a schematic structural view of a prior art laser package structure;
图2是本发明 激光器封装结构的方案一的 结构示意图；  2 is a schematic structural view of a first embodiment of a laser package structure of the present invention;
图3是本发明 激光器封装结构的方案二的 结构示意图。  Fig. 3 is a schematic view showing the structure of the second embodiment of the laser package structure of the present invention.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
现结合附图，对本发明的较佳实施例作详细说明 。  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings.
如图2和图3所示，提供一种激光器封装结构的优选实施例，其中 图2是 激光器封装结构的方案一的 结构示意图，图3是 激光器封装结构的方案二的 结构示意图。  As shown in FIG. 2 and FIG. 3, a preferred embodiment of a laser package structure is provided, wherein FIG. 2 is a scheme 1 of the laser package structure. Schematic diagram of the structure, FIG. 3 is a schematic structural diagram of the second scheme of the laser package structure.
一种激光器封装结构，包括管座11、管帽12及设置在管座11上的激光器芯片3，还包括设置在管帽12上的光聚透镜5、及设置在光聚透镜5和激光器芯片3间的光压缩透镜4，激光器芯片3和光压缩透镜4均封装于管座11和管帽12配合形成的封闭腔体中。 A laser package structure comprising a stem 11, a cap 12 and a laser chip 3 disposed on the stem 11, further comprising a condensing lens 5 disposed on the cap 12, and a photopolymer lens 5 and a laser chip The three optical compression lenses 4, the laser chip 3 and the optical compression lens 4 are each enclosed in a closed cavity formed by the cooperation of the stem 11 and the cap 12.
其中，管座11上设置有管脚，管脚可以与外部电路连接，实现对该可调激光器的工作状态的监控；激光器芯片3的发射光束通过管帽12上设置的光聚透镜5光斑聚焦，以便耦合至光纤传输结构6中进行传输。 Wherein, the socket 11 is provided with a pin, and the pin can be connected with an external circuit to realize monitoring of the working state of the tunable laser; the emitted light beam of the laser chip 3 is focused by the spotlight lens 5 disposed on the cap 12 So as to be coupled into the fiber transmission structure 6 for transmission.
为了避免 由于 激光器芯片3 的发射光束较大，通过 光聚透镜5 汇聚时，易造成到达光纤上快轴（Y轴）方向的光斑过大，以及部分发射光束在传输到透镜过程中由于发散角过大而损耗掉，在 光聚透镜5和激光器芯片3间设置光压缩透镜4。  In order to avoid the large amount of the emitted light of the laser chip 3, the light collecting lens 5 is passed. At the time of convergence, the spot that is likely to reach the fast axis (Y-axis) direction of the optical fiber is too large, and part of the emitted light beam is lost due to excessive divergence angle during transmission to the lens, and is disposed between the optical condenser lens 5 and the laser chip 3. The light compresses the lens 4.
进一步地，激光器芯片3的出光光轴设置在光聚透镜5的中心轴上。  Further, the light output axis of the laser chip 3 is disposed on the central axis of the condenser lens 5.
本实施例中，光压缩透镜4用于将激光器芯片3发射出的 光束进行光斑压缩，尽可能减小传输到 光聚透镜5前， 光束在快轴（Y轴）、慢轴（X轴）方向的发散角。  In this embodiment, the optical compression lens 4 is used to compress the light beam emitted from the laser chip 3 to be reduced as much as possible before being transmitted to the condenser lens 5. The divergence angle of the beam in the fast axis (Y axis) and slow axis (X axis) direction.
光压缩透镜4优选为光纤透镜，在光束的一定传输距离中，保持 光束在快轴（Y轴）、慢轴（X轴）方向上较低的发散角 。进一步地，光纤透镜优选为105um直径的光纤玻璃棒透镜。  The light compression lens 4 is preferably a fiber lens that is held at a certain transmission distance of the light beam. The lower divergence angle of the beam in the fast axis (Y axis) and slow axis (X axis) direction. Further, the fiber lens is preferably a 105 um diameter fiberglass rod lens.
光纤透镜设置在激光器芯片3的发光端前，光纤透镜的进光端靠近激光器芯片3的发光端，所述光纤透镜的出光端靠近光聚透镜5。光纤透镜通过限位结构安装在管座11和管帽12配合形成的封闭腔体中。其中，保持光纤透镜的进光端足够靠近激光器芯片3的发光端，可将大部分激光器芯片3发射的光束都射入光纤透镜中，提高激光器的工作效率。 The fiber lens is disposed in front of the light emitting end of the laser chip 3, and the light incident end of the fiber lens is adjacent to the light emitting end of the laser chip 3. The light emitting end of the fiber lens is adjacent to the light collecting lens 5. The fiber lens is mounted in a closed cavity formed by the cooperation of the stem 11 and the cap 12 through a limiting structure. Wherein, the light-increasing end of the fiber lens is kept close enough to the light-emitting end of the laser chip 3, and most of the light beams emitted by the laser chip 3 can be injected into the fiber lens to improve the working efficiency of the laser.
本实施例中，提供两种光聚透镜5的方案，具体如下。  In this embodiment, two types of the condenser lens 5 are provided, as follows.
方案一：光聚透镜5为球透镜51，球透镜51与管帽12配合安装。球透镜51接收光纤透镜出光口发出的光束，并进行光斑聚焦。 Solution 1: The concentrating lens 5 is a ball lens 51, and the ball lens 51 is mounted in cooperation with the cap 12. The ball lens 51 receives the light beam emitted from the light exit of the fiber lens and performs spot focusing.
方案二：光聚透镜5包括非球透镜52，非球透镜52设置在管帽12内侧，与管帽12配合安装；或设置在管帽12外侧，与管帽12配合安装。非球透镜52接收光纤透镜出光口发出的光束，并进行光斑聚焦。 Solution 2: The concentrating lens 5 includes an aspherical lens 52 disposed on the inner side of the cap 12 and fitted with the cap 12; or disposed outside the cap 12 and mounted in cooperation with the cap 12. The aspherical lens 52 receives the light beam emitted from the light exit of the fiber optic lens and focuses the spot.
其中，激光器封装结构还包括设置在管帽12上的窗口，窗口、管帽12和管座11配合形成封闭腔体，设置窗口保证封闭腔体的密封性，特别是与非球透镜52配合。具体光束的传输过程依次排列为，激光器芯片3、光纤透镜、窗口及光聚透镜5。 The laser package structure further includes a window disposed on the cap 12, and the window, the cap 12 and the stem 11 cooperate to form a closed cavity, and the window is provided to ensure the sealing of the closed cavity, in particular, the aspherical lens 52. The transmission process of the specific light beam is sequentially arranged as a laser chip 3, a fiber lens, a window, and a condensing lens 5.
本实施例中，还包括热沉，激光器芯片3通过热沉安装在管座11的垂直面上。热沉是激光器芯片3的载体。进一步地，管座11的垂直结构也是由热沉构成。 In this embodiment, a heat sink is further included, and the laser chip 3 is mounted on the vertical surface of the stem 11 by a heat sink. The heat sink is the carrier of the laser chip 3. Further, the vertical structure of the stem 11 is also constituted by a heat sink.
具体的，管座11上固定有热沉，激光器芯片3固定在热沉的垂直面上，热沉的垂直面为热沉与管座11相垂直的平面，可以将其设计成L 型结构。其中，热沉的热导率很高，还可以用于传导固定在其上的激光器芯片3产生的热量。 Specifically, the heat sink is fixed on the stem 11, and the laser chip 3 is fixed on the vertical surface of the heat sink. The vertical surface of the heat sink is a plane perpendicular to the tube seat 11 and can be designed as L. Type structure. Among them, the heat sink has a high thermal conductivity and can also be used to conduct heat generated by the laser chip 3 fixed thereto.
以上所述者，仅为本发明最佳实施例而已，并非用于限制本发明的范围，凡依本发明申请专利范围所作的等效变化或修饰，皆为本发明所涵盖。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and equivalent changes or modifications made by the scope of the present invention are covered by the present invention.
本发明的实施方式Embodiments of the invention
工业实用性Industrial applicability
序列表自由内容Sequence table free content

Claims (9)

  1. 一种激光器封装结构，包括管座、管帽及设置在管座上的激光器芯片，其特征在于：还包括设置在管帽上的光聚透镜、及设置在光聚透镜和激光器芯片间的光压缩透镜，所述激光器芯片和光压缩透镜均封装于所述管座和管帽配合形成的封闭腔体中。 A laser package structure comprising a tube holder, a tube cap and a laser chip disposed on the tube holder, further comprising: a condensing lens disposed on the tube cap, and light disposed between the concentrating lens and the laser chip A compression lens, the laser chip and the light compression lens are both enclosed in a closed cavity formed by the joint of the stem and the cap.
  2. 根据权利要求1所述的激光器封装结构，其特征在于：所述光压缩透镜为光纤透镜。The laser package structure of claim 1 wherein said light compression lens is a fiber optic lens.
  3. 根据权利要求2所述的激光器封装结构，其特征在于：所述光纤透镜为105um直径的光纤玻璃棒透镜。 The laser package structure according to claim 2, wherein the fiber lens is a 105 um diameter fiberglass rod lens.
  4. 根据权利要求2所述的激光器封装结构，其特征在于：所述光纤透镜设置在激光器芯片的发光端前，所述光纤透镜的进光端靠近激光器芯片的发光端，所述光纤透镜的出光端靠近光聚透镜。The laser package structure according to claim 2, wherein the fiber lens is disposed in front of the light emitting end of the laser chip, and the light incident end of the fiber lens is adjacent to the light emitting end of the laser chip, and the light emitting end of the fiber lens is Close to the condenser lens.
  5. 根据权利要求1所述的激光器封装结构，其特征在于：所述光聚透镜为球透镜，所述球透镜与管帽配合安装。 The laser package structure according to claim 1, wherein the light collecting lens is a ball lens, and the ball lens is mounted in cooperation with the tube cap.
  6. 根据权利要求1所述的激光器封装结构，其特征在于：所述光聚透镜为非球透镜，所述非球透镜与管帽配合安装。 The laser package structure according to claim 1, wherein the condensing lens is an aspherical lens, and the aspherical lens is mounted in cooperation with the cap.
  7. 根据权利要求5或6所述的激光器封装结构，其特征在于：还包括设置在管帽上的窗口，所述窗口、管帽和管座配合形成封闭腔体。The laser package structure according to claim 5 or 6, further comprising a window disposed on the cap, the window, the cap and the stem being cooperatively formed to form a closed cavity.
  8. 根据权利要求1所述的激光器封装结构，其特征在于：还包括热沉，所述激光器芯片通过热沉安装在管座的垂直面上。 The laser package structure according to claim 1, further comprising a heat sink, wherein the laser chip is mounted on a vertical surface of the stem by a heat sink.
  9. 根据权利要求1所述的激光器封装结构，其特征在于：所述激光器芯片的出光光轴设置在光聚透镜的中心轴上。 The laser package structure according to claim 1, wherein the optical axis of the laser chip is disposed on a central axis of the concentrating lens.
PCT/CN2015/074300 2014-12-25 2015-03-16 Laser packaging structure WO2016101417A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112230351A (en) * 2020-10-27 2021-01-15 青岛海信宽带多媒体技术有限公司 Optical module
CN114552367A (en) * 2022-02-17 2022-05-27 Nano科技(北京)有限公司 Light emitting device

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104810724A (en) * 2015-05-06 2015-07-29 大连藏龙光电子科技有限公司 Coaxially-packaged DFB laser transmitter with refrigeration function
WO2021212850A1 (en) * 2020-04-21 2021-10-28 青岛海信宽带多媒体技术有限公司 Optical module

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200956492Y (en) * 2006-09-29 2007-10-03 重庆航伟光电科技有限公司 Coaxial packaged semiconductor laser
CN101162830A (en) * 2006-10-11 2008-04-16 日本捷科泰亚株式会社 Semiconductor laser module
WO2009104337A1 (en) * 2008-02-22 2009-08-27 日本電気硝子株式会社 Lens component for optical communication
JP2009258320A (en) * 2008-04-16 2009-11-05 Sumitomo Electric Ind Ltd Optical subassembly
CN103227414A (en) * 2013-04-09 2013-07-31 中国电子科技集团公司第十一研究所 Semiconductor laser coupling and homogenizing device
CN203787764U (en) * 2014-04-12 2014-08-20 中山新诺科技股份有限公司 Novel blue-violet laser light source
CN204349199U (en) * 2014-12-25 2015-05-20 昂纳信息技术（深圳）有限公司 A kind of individual laser package structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200956492Y (en) * 2006-09-29 2007-10-03 重庆航伟光电科技有限公司 Coaxial packaged semiconductor laser
CN101162830A (en) * 2006-10-11 2008-04-16 日本捷科泰亚株式会社 Semiconductor laser module
WO2009104337A1 (en) * 2008-02-22 2009-08-27 日本電気硝子株式会社 Lens component for optical communication
JP2009258320A (en) * 2008-04-16 2009-11-05 Sumitomo Electric Ind Ltd Optical subassembly
CN103227414A (en) * 2013-04-09 2013-07-31 中国电子科技集团公司第十一研究所 Semiconductor laser coupling and homogenizing device
CN203787764U (en) * 2014-04-12 2014-08-20 中山新诺科技股份有限公司 Novel blue-violet laser light source
CN204349199U (en) * 2014-12-25 2015-05-20 昂纳信息技术（深圳）有限公司 A kind of individual laser package structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112230351A (en) * 2020-10-27 2021-01-15 青岛海信宽带多媒体技术有限公司 Optical module
CN112230351B (en) * 2020-10-27 2022-04-22 青岛海信宽带多媒体技术有限公司 Optical module
CN114552367A (en) * 2022-02-17 2022-05-27 Nano科技(北京)有限公司 Light emitting device

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