CN104466623A - Laser packaging structure - Google Patents
Laser packaging structure Download PDFInfo
- Publication number
- CN104466623A CN104466623A CN201410826618.3A CN201410826618A CN104466623A CN 104466623 A CN104466623 A CN 104466623A CN 201410826618 A CN201410826618 A CN 201410826618A CN 104466623 A CN104466623 A CN 104466623A
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- CN
- China
- Prior art keywords
- lens
- laser
- light
- chip
- package structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of lasers, in particular to a laser packaging structure which comprises a tube base, a tube cap and a laser chip arranged on the tube base. The laser packaging structure further comprises a light condenser lens and a light compressed lens, wherein the light condenser lens is arranged on the tube cap, and the light compressed lens is arranged between the light condenser lens and the laser chip. The laser chip and the light compressed lens are both packaged in a closed cavity defined by the tube base and the tube cap in a matched mode. According to the laser packaging structure, the light compressed lens is arranged in front of the laser chip to conduct light spot compression on emitted light beams, the emitted light beams completely enter the light condenser lens, work efficiency of the laser is improved, and the work loss of the laser is lowered.
Description
Technical field
The present invention relates to field of laser device technology, be specifically related to a kind of individual laser package structure.
Background technology
Laser due to make simple, volume is little, lightweight, the life-span long and efficiency advantages of higher, be used widely in fields such as optical communication, optical pumping, optical storage and laser displaies.
As shown in Figure 1, usual individual laser package method is encapsulated on base by chip of laser, the direct scioptics of light beam that chip of laser is launched are coupled in optical fiber, but because the transmitted beam of chip of laser is larger, it is 20 ~ 25 ° in the angle of divergence in fast axle (Y-axis) direction, the angle of divergence in slow axis (X-axis) direction is 6 ~ 8.5 °, the both direction angle of divergence is different, when scioptics converge, easily cause the hot spot arriving fast axle (Y-axis) direction on optical fiber excessive.And fractional transmission light beam is being transferred in lens process, because loss is high, make coupling efficiency low.
Summary of the invention
The technical problem to be solved in the present invention is, for the above-mentioned defect of prior art, provides a kind of individual laser package structure, overcomes the problem that when transmitted beam converges, hot spot is excessive, loss is high.
The technical solution adopted for the present invention to solve the technical problems is: provide a kind of individual laser package structure, the chip of laser comprising base, pipe cap and be arranged on base, also comprise the light be arranged on pipe cap to gather lens and be arranged on light and gather optical pressure contracting lens between lens and chip of laser, described chip of laser and optical pressure contracting lens are all packaged in described base and pipe cap coordinates in the closed cavity formed.
Wherein, preferred version is: described optical pressure contracting lens are optical fiber lens.
Wherein, preferred version is: described optical fiber lens is the fiber glass rod lens of 105um diameter.
Wherein, preferred version is: before described optical fiber lens is arranged on the luminous end of chip of laser, and the light inlet of described optical fiber lens is near the luminous end of chip of laser, and the bright dipping end of described optical fiber lens gathers lens near light.
Wherein, preferred version is: it is globe lens that described light gathers lens, and described globe lens coordinates with pipe cap to be installed.
Wherein, preferred version is: it is non-globe lens that described light gathers lens, and described non-globe lens coordinates with pipe cap to be installed.
Wherein, preferred version is: also comprise the window be arranged on pipe cap, and described window, pipe cap and base coordinate formation closed cavity.
Wherein, preferred version is: also comprise heat sink, and described chip of laser is arranged on the vertical plane of base by heat sink.
Wherein, preferred version is: the bright dipping optical axis of described chip of laser is arranged on light and gathers on the central shaft of lens.
Beneficial effect of the present invention is, compared with prior art, the present invention is by a kind of individual laser package structure of design, optical pressure contracting lens are set before chip of laser, hot spot compression is carried out to transmitted beam, allow transmitted beam all enter into light and gather lens, improve the operating efficiency of laser, reduce the working loss of laser.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing:
Fig. 1 is the structural representation of prior art individual laser package structure;
Fig. 2 is the structural representation of the scheme one of individual laser package structure of the present invention;
Fig. 3 is the structural representation of the scheme two of individual laser package structure of the present invention.
Embodiment
Now by reference to the accompanying drawings, preferred embodiment of the present invention is elaborated.
As shown in Figures 2 and 3, provide a kind of preferred embodiment of individual laser package structure, wherein Fig. 2 is the structural representation of the scheme one of individual laser package structure, and Fig. 3 is the structural representation of the scheme two of individual laser package structure.
A kind of individual laser package structure, the chip of laser 3 comprising base 11, pipe cap 12 and be arranged on base 11, also comprise the light be arranged on pipe cap 12 to gather lens 5 and be arranged on light and gather optical pressure contracting lens 4 between lens 5 and chip of laser 3, chip of laser 3 and optical pressure contracting lens 4 are all packaged in base 11 and pipe cap 12 coordinates in the closed cavity formed.
Wherein, base 11 is provided with pin, pin can be connected with external circuit, realizes the monitoring of the operating state to this tunable laser; The transmitted beam of chip of laser 3 is gathered lens 5 hot spot by the light that pipe cap 12 is arranged and is focused on, and transmits to be coupled in Optical Fiber Transmission structure 6.
In order to avoid due to the transmitted beam of chip of laser 3 larger, by light gather lens 5 converge time, easily cause the hot spot arriving fast axle (Y-axis) direction on optical fiber excessive, and fractional transmission light beam loses because the angle of divergence is excessive being transferred in lens process, gathers between lens 5 and chip of laser 3 arrange optical pressure contracting lens 4 at light.
Further, the bright dipping optical axis of chip of laser 3 is arranged on light and gathers on the central shaft of lens 5.
In the present embodiment, optical pressure contracting lens 4 carry out hot spot compression for the light beam launched by chip of laser 3, and reduce to be transferred to before light gathers lens 5 as far as possible, light beam is in the angle of divergence in fast axle (Y-axis), slow axis (X-axis) direction.
Optical pressure contracting lens 4 are preferably optical fiber lens, in certain transmission range of light beam, keep the angle of divergence that light beam is lower on fast axle (Y-axis), slow axis (X-axis) direction.Further, optical fiber lens is preferably the fiber glass rod lens of 105um diameter.
Before optical fiber lens is arranged on the luminous end of chip of laser 3, the light inlet of optical fiber lens is near the luminous end of chip of laser 3, and the bright dipping end of described optical fiber lens gathers lens 5 near light.Optical fiber lens is arranged on base 11 by position limiting structure and pipe cap 12 coordinates in the closed cavity formed.Wherein, keep the light inlet of optical fiber lens enough near the luminous end of chip of laser 3, the light beam that most of chip of laser 3 is launched all can be injected in optical fiber lens, improve the operating efficiency of laser.
In the present embodiment, two kinds of light are provided to gather the scheme of lens 5, specific as follows.
Scheme one: light gathers lens 5 for globe lens 51, and globe lens 51 coordinates with pipe cap 12 to be installed.Globe lens 51 receives the light beam that optical fiber lens light-emitting window sends, and carries out hot spot focusing.
Scheme two: light gathers lens 5 and comprises non-globe lens 52, non-globe lens 52 is arranged on inside pipe cap 12, coordinates install with pipe cap 12; Or be arranged on outside pipe cap 12, coordinate with pipe cap 12 and install.Non-globe lens 52 receives the light beam that optical fiber lens light-emitting window sends, and carries out hot spot focusing.
Wherein, individual laser package structure also comprises the window be arranged on pipe cap 12, and window, pipe cap 12 and base 11 coordinate formation closed cavity, arranges the sealing that window ensures closed cavity, particularly coordinates with non-globe lens 52.The transmitting procedure of concrete light beam be arranged in order into, chip of laser 3, optical fiber lens, window and light gather lens 5.
In the present embodiment, also comprise heat sink, chip of laser 3 is by the heat sink vertical plane being arranged on base 11.Heat sink is the carrier of chip of laser 3.Further, the vertical stratification of base 11 is also be made up of heat sink.
Concrete, base 11 is fixed with heat sink, chip of laser 3 is fixed on heat sink vertical plane, and heat sink vertical plane is the heat sink plane perpendicular with base 11, can be designed l-shaped structure.Wherein, heat sink thermal conductivity is very high, can also be used for the heat conducting chip of laser 3 generation fixed thereon.
As described above, be only preferred embodiment, and not for limiting the scope of the invention, all equivalences done according to the present patent application the scope of the claims change or modify, and are all the present invention and contain.
Claims (9)
1. an individual laser package structure, the chip of laser comprising base, pipe cap and be arranged on base, it is characterized in that: also comprise the light be arranged on pipe cap and gather lens and be arranged on light and gather optical pressure contracting lens between lens and chip of laser, described chip of laser and optical pressure contracting lens are all packaged in described base and pipe cap coordinates in the closed cavity formed.
2. individual laser package structure according to claim 1, is characterized in that: described optical pressure contracting lens are optical fiber lens.
3. individual laser package structure according to claim 2, is characterized in that: described optical fiber lens is the fiber glass rod lens of 105um diameter.
4. individual laser package structure according to claim 2, it is characterized in that: before described optical fiber lens is arranged on the luminous end of chip of laser, the light inlet of described optical fiber lens is near the luminous end of chip of laser, and the bright dipping end of described optical fiber lens gathers lens near light.
5. individual laser package structure according to claim 1, is characterized in that: it is globe lens that described light gathers lens, and described globe lens coordinates with pipe cap to be installed.
6. individual laser package structure according to claim 1, is characterized in that: it is non-globe lens that described light gathers lens, and described non-globe lens coordinates with pipe cap to be installed.
7. the individual laser package structure according to claim 5 or 6, is characterized in that: also comprise the window be arranged on pipe cap, and described window, pipe cap and base coordinate formation closed cavity.
8. individual laser package structure according to claim 1, it is characterized in that: also comprise heat sink, described chip of laser is arranged on the vertical plane of base by heat sink.
9. individual laser package structure according to claim 1, is characterized in that: the bright dipping optical axis of described chip of laser is arranged on light and gathers on the central shaft of lens.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410826618.3A CN104466623A (en) | 2014-12-25 | 2014-12-25 | Laser packaging structure |
| PCT/CN2015/074300 WO2016101417A1 (en) | 2014-12-25 | 2015-03-16 | Laser packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410826618.3A CN104466623A (en) | 2014-12-25 | 2014-12-25 | Laser packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104466623A true CN104466623A (en) | 2015-03-25 |
Family
ID=52912234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410826618.3A Pending CN104466623A (en) | 2014-12-25 | 2014-12-25 | Laser packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104466623A (en) |
| WO (1) | WO2016101417A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810724A (en) * | 2015-05-06 | 2015-07-29 | 大连藏龙光电子科技有限公司 | Coaxially-packaged DFB laser transmitter with refrigeration function |
| WO2021212850A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112230351B (en) * | 2020-10-27 | 2022-04-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114552367A (en) * | 2022-02-17 | 2022-05-27 | Nano科技(北京)有限公司 | Light emitting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200956492Y (en) * | 2006-09-29 | 2007-10-03 | 重庆航伟光电科技有限公司 | Coaxial packaged semiconductor laser |
| US20080089643A1 (en) * | 2006-10-11 | 2008-04-17 | Tecdia Co., Ltd. | Semiconductor laser module |
| JP2009258320A (en) * | 2008-04-16 | 2009-11-05 | Sumitomo Electric Ind Ltd | Optical subassembly |
| CN103227414A (en) * | 2013-04-09 | 2013-07-31 | 中国电子科技集团公司第十一研究所 | Semiconductor laser coupling and homogenizing device |
| CN204349199U (en) * | 2014-12-25 | 2015-05-20 | 昂纳信息技术（深圳）有限公司 | A kind of individual laser package structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009198908A (en) * | 2008-02-22 | 2009-09-03 | Nippon Electric Glass Co Ltd | Lens component for optical communication |
| CN203787764U (en) * | 2014-04-12 | 2014-08-20 | 中山新诺科技股份有限公司 | Novel blue-violet laser light source |
-
2014
- 2014-12-25 CN CN201410826618.3A patent/CN104466623A/en active Pending
-
2015
- 2015-03-16 WO PCT/CN2015/074300 patent/WO2016101417A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200956492Y (en) * | 2006-09-29 | 2007-10-03 | 重庆航伟光电科技有限公司 | Coaxial packaged semiconductor laser |
| US20080089643A1 (en) * | 2006-10-11 | 2008-04-17 | Tecdia Co., Ltd. | Semiconductor laser module |
| JP2009258320A (en) * | 2008-04-16 | 2009-11-05 | Sumitomo Electric Ind Ltd | Optical subassembly |
| CN103227414A (en) * | 2013-04-09 | 2013-07-31 | 中国电子科技集团公司第十一研究所 | Semiconductor laser coupling and homogenizing device |
| CN204349199U (en) * | 2014-12-25 | 2015-05-20 | 昂纳信息技术（深圳）有限公司 | A kind of individual laser package structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104810724A (en) * | 2015-05-06 | 2015-07-29 | 大连藏龙光电子科技有限公司 | Coaxially-packaged DFB laser transmitter with refrigeration function |
| WO2021212850A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016101417A1 (en) | 2016-06-30 |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150325 |
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| RJ01 | Rejection of invention patent application after publication |