CN210866773U - Coaxial pigtail semiconductor laser assembly - Google Patents
Coaxial pigtail semiconductor laser assembly Download PDFInfo
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- CN210866773U CN210866773U CN201922181582.9U CN201922181582U CN210866773U CN 210866773 U CN210866773 U CN 210866773U CN 201922181582 U CN201922181582 U CN 201922181582U CN 210866773 U CN210866773 U CN 210866773U
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Abstract
The utility model provides a coaxial pigtail semiconductor laser subassembly, including TO base, laser chip subassembly, first lens, TO pipe cap, second lens and optic fibre subassembly, the one end of TO base is provided with the laser chip subassembly, and the one end that the laser chip subassembly kept away from the TO base has a light-emitting part, has set gradually first lens, TO pipe cap, second lens and optic fibre subassembly on the laser route of light-emitting part, first lens and laser chip subassembly fixed connection; the second lens and the optical fiber assembly are fixedly arranged relative TO the TO base; the laser emitted by the light-emitting part sequentially passes through the first lens, the TO pipe cap and the second lens and is coupled into the optical fiber assembly. The first lens, the TO tube cap, the second lens and the optical fiber assembly on the light-emitting path can realize secondary coupling on laser, further compress light spots, improve the efficiency of optical fiber coupling, and add an isolator TO inhibit a resonant cavity formed by back reflection TO further improve the product performance.
Description
Technical Field
The utility model relates to a laser equipment technical field especially relates to a coaxial tail optical fiber semiconductor laser subassembly.
Background
The high-power semiconductor laser has high reliability and high stability, is widely applied to the fields of optical storage, optical communication, national defense, industry, medical treatment and the like, and has the advantages of 635-1653 nm of output laser wavelength and large power adjustable range. In most application environments, the reliability of high power lasers is a determining factor, and is directly related to the quality of the laser.
The light-emitting side of the light-emitting tube cap of the common TO packaging structure of the semiconductor laser is provided with a focusing lens, and laser emitted by the light-emitting tube cap can be focused and then emitted outwards. The output end of the semiconductor laser usually needs to be coupled with an optical fiber, and a coaxial optical fiber is arranged on the light emitting side of the semiconductor laser, so that light emitted by the laser is coupled into the optical fiber. Although the laser is provided with the focusing lens, the quality of a light spot when the lens is coupled with the optical fiber is poor due to the fact that the lens cannot be accurately adjusted, the coupling efficiency is not ideal, and high fiber output power cannot be obtained; although the output power of the chip in the semiconductor laser can be increased by adopting a method of increasing the output power, the power consumption of the semiconductor laser can be increased, and adverse effects can be brought to the internal heat dissipation and the service life of the packaging structure of the semiconductor laser.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a can improve semiconductor laser output coupling efficiency and go out coaxial tail optical fiber semiconductor laser subassembly of fine power.
The technical scheme of the utility model is realized like this: the utility model provides a coaxial pigtail semiconductor laser subassembly, including TO base (1), laser chip subassembly (2), first lens (3), TO pipe cap (4), second lens (5) and optical fiber subassembly (6), the one end of TO base (1) is provided with laser chip subassembly (2), the one end that laser chip subassembly (2) kept away from TO base (1) has light-emitting portion (20), first lens (3), TO pipe cap (4), second lens (5) and optical fiber subassembly (6) have set gradually on the laser path of light-emitting portion (20), first lens (3) and laser chip subassembly (2) fixed connection; the second lens (5) and the optical fiber assembly (6) are fixedly arranged relative TO the TO base (1); the laser emitted by the light emitting part (20) sequentially passes through the first lens (3), the TO pipe cap (4) and the second lens (5) and is coupled into the optical fiber assembly (6).
On the basis of the technical scheme, preferably, the TO pipe cap (4) and the TO base (1) surround TO form a closed first cavity (10); the laser chip assembly (2) and the first lens (3) are located in the first cavity (10), and the first lens (3) is fixedly connected with the laser chip assembly (2).
Further preferably, the optical fiber laser device further comprises an isolator (7), the isolator (7) is located on a laser path between the first lens (3) and the TO tube cap (4), and the isolator (7) is fixedly connected with one end, far away from the TO base (1), of the first lens (3).
Still further preferably, the laser chip assembly (2) comprises a semiconductor refrigerator (201), a heat sink (202), a thermistor (203) and a laser chip (204); the semiconductor refrigerator (201) is fixedly arranged on the TO base (1), a heat sink (202) is arranged at one end, far away from the TO base (1), of the semiconductor refrigerator (201), the heat sink (202) is fixedly connected with the semiconductor refrigerator (201), a thermistor (203) and a laser chip (204) are arranged at one end, far away from the TO base (1), of the heat sink (202), and the thermistor (203) and the laser chip (204) are fixedly connected with the heat sink (202); one end of the laser chip (204) far away from the TO base (1) is provided with a light emitting part (20).
Still further preferably, a lens sleeve (205) is further included, the lens sleeve (205) being disposed around the radial direction surfaces of the first lens (3) and the spacer (7).
Further preferably, the optical fiber cable further comprises a hollow cylinder (8), the cylinder (8) surrounds the TO base (1), the TO pipe cap (4) and the second lens (5), one end of the cylinder (8) is fixedly connected with the TO base (1), and the second lens (5) is embedded at the other end of the cylinder (8); the optical fiber assembly (6) is arranged at one end, far away from the TO base (1), of the barrel (8).
Still further preferably, the optical fiber module further comprises a connecting pipe (9), and the optical fiber assembly (6) is embedded in the connecting pipe (9) and is fixedly connected with the connecting pipe (9); the connecting pipe (9) is fixedly connected with one end of the cylinder body (8) far away from the TO base (1).
Further preferably, the outer surface of the connecting pipe (9) is further provided with a rubber tail sleeve (11), the rubber tail sleeve (11) is arranged around the surface of the connecting pipe (9), and the rubber tail sleeve (11) is fixedly connected with the connecting pipe (9).
Still further preferentially, optic fibre subassembly (6) include optic fibre (61), lock pin (62) and protective sheath (63), optic fibre (61) outer loop is provided with lock pin (62), the inside cavity of protective sheath (63), lock pin (62) are inlayed and are established in protective sheath (63) and are close TO the one end of TO base (1), be provided with the lock pin hole that runs through on lock pin (62), the downthehole optic fibre (61) of having worn of lock pin, optic fibre (61) and lock pin (62) fixed connection, optic fibre (61) are just TO the light-emitting direction setting of second lens (5).
Preferably, on the basis of the above technical solution, the light emitting portion (20), the first lens (3), the second lens (5) and the optical fiber assembly (6) are all coaxially arranged.
The utility model provides a pair of coaxial tail optical fiber semiconductor laser subassembly for prior art, has following beneficial effect:
(1) the utility model discloses a set gradually first lens, TO pipe cap, second lens and optic fibre subassembly on the light-emitting path of laser chip subassembly, realize the secondary coupling TO the laser, further compress the facula, improve the efficiency of optic fibre coupling;
(2) meanwhile, an isolator is further arranged between the first lens and the TO tube cap, and the performance of the product is further improved by a resonant cavity formed by back reflection inhibition;
(3) the TO tube cap is used for packaging the laser chip assembly, the first lens and the isolator in one step;
(4) the cylinder body is equivalent TO further packaging the TO base, the laser chip assembly, the first lens, the isolator, the TO tube cap and the second lens;
(5) the optical fiber assembly can effectively support and protect the optical fiber part.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a perspective view of a coaxial pigtail semiconductor laser module according to the present invention;
fig. 2 is an exploded perspective view of a coaxial pigtail semiconductor laser module according to the present invention;
fig. 3 is a front view, partly in cross-section, of a structure of a coaxial pigtail semiconductor laser assembly according to the present invention;
fig. 4 is a perspective view of the coaxial pigtail semiconductor laser module according TO the present invention showing a combined state of the TO base, the laser chip module, the first lens and the TO cap;
FIG. 5 is a front view in half section of FIG. 4;
fig. 6 is a front view, in half section, of a barrel of a coaxial pigtail semiconductor laser assembly of the present invention;
fig. 7 is a front view, partly in cross-section, of a second lens of a coaxial pigtail semiconductor laser assembly according to the present invention;
fig. 8 is a front view of the connecting pipe of the coaxial pigtail semiconductor laser module according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
As shown in fig. 1 with reference TO fig. 2 and fig. 3, the utility model provides a coaxial pigtail semiconductor laser assembly, including TO base 1, laser chip assembly 2, first lens 3, TO pipe cap 4, second lens 5, optical fiber assembly 6, isolator 7, barrel 8 and connecting pipe 9, its one end of TO base 1 is provided with laser chip assembly 2, the one end of laser chip assembly 2 far away from TO base 1 has light-emitting portion 20, first lens 3, TO pipe cap 4, second lens 5 and optical fiber assembly 6 have set gradually on the laser path of light-emitting portion 20, first lens 3 and laser chip assembly 2 fixed connection; the second lens 5 and the optical fiber assembly 6 are both fixedly arranged relative TO the TO base 1; the laser light emitted from the light emitting part 20 passes through the first lens 3, the TO cap 4 and the second lens 5 in this order, and is coupled into the optical fiber assembly 6.
When the laser works, the light emitting part 20 of the laser chip assembly 2 emits laser, and the laser sequentially passes through the first lens 3 and the second lens 5 to carry out two-stage focusing, so that the diffused laser is converged, the converged light spot is smaller, the coupling efficiency is better than that of a single lens, and the laser power input into the optical fiber assembly 5 after coupling is also higher. The distance between the second lens 5 and the optical fiber assembly 6 and the TO base 1 is kept relatively unchanged, namely the second lens 5 and the optical fiber assembly 6 can be directly fixed with the TO pipe cap 4, and can also be further fixed with the TO pipe cap 4 or the TO base 1 through other assemblies.
As can be seen from fig. 3 in conjunction with fig. 5, the illustration provides a combined structure of the TO cap 4 and the TO base 1 of the present invention. The TO pipe cap 4 and the TO base 1 are enclosed TO form a closed first cavity 10; the laser chip assembly 2 and the first lens 3 are located in the first cavity 10, and the first lens 3 is fixedly connected with the laser chip assembly 2. The first cavity 10 provides a fully enclosed space inside, which can reduce the influence of external force or environmental factors on the laser chip assembly 2 and the first lens 3. The TO pipe cap 4 and the TO base 1 can be fixed in a welding mode.
As a further improvement of the utility model, the utility model discloses a can also set up isolator 7 in the first cavity 10, isolator 7 is located the laser path between first lens 3 and the TO pipe cap 4, and isolator 7 and first lens 3 keep away from the one end fixed connection of TO base 1. The isolator 7 can inhibit the back reflection on the laser path from forming a resonant cavity to influence the product performance.
As shown in fig. 3, 4 and 5, a structure of a laser chip assembly 2 according to the present invention is provided. The laser chip assembly 2 comprises a semiconductor refrigerator 201, a heat sink 202, a thermistor 203 and a laser chip 204; the semiconductor refrigerator 201 is fixedly arranged on the TO base 1, one end of the semiconductor refrigerator 201, which is far away from the TO base 1, is provided with a heat sink 202, the heat sink 202 is fixedly connected with the semiconductor refrigerator 201, one end of the heat sink 202, which is far away from the TO base 1, is provided with a thermistor 203 and a laser chip 204, and both the thermistor 203 and the laser chip 204 are fixedly connected with the heat sink 202; the laser chip 204 has a light emitting portion 20 at an end thereof remote from the TO base 1. The laser chip 204 has a large heat amount during operation, and since the laser chip assembly 2 is packaged inside the first cavity 10, in order to conduct the heat amount, the heat sink 202 is required to transfer heat to the semiconductor cooler 201, and the temperature of the laser chip 204 is monitored by the thermistor 203.
As shown in fig. 5, to further fix the relative positions of the spacer 7 and the first lens 3, the laser chip assembly 2 further includes a lens sleeve 205, and the lens sleeve 205 is disposed around the radial direction surfaces of the first lens 3 and the spacer 7. The first lens 3 and the laser chip assembly 2 can be fixedly connected by gluing, but can also be fixedly connected with the laser chip assembly 2 by other methods such as gasket fixation, threaded connection or welding.
As shown in fig. 3, 6 and 7, in order TO further improve the packaging effect of the two lenses and the isolator 7, the utility model also provides a hollow cylinder 8, the cylinder 8 is arranged around the TO base 1, the TO cap 4 and the second lens 5, one end of the cylinder 8 is fixedly connected with the TO base 1, and the second lens 5 is embedded at the other end of the cylinder 8; the fiber optic assembly 6 is disposed at an end of the barrel 8 remote from the TO mount 1. The barrel 8 further encapsulates the TO base 1, the laser chip assembly 2, the first lens 3, the isolator 7, the TO cap 4, and the second lens 5, and has an effect of stabilizing the double focusing of the first lens 3, the isolator 7, and the second lens 5 therein.
As shown in fig. 1 and fig. 3 and 8, the optical fiber module 6 of the present invention is fixed to the tube 8 by the connecting tube 9. The optical fiber assembly 6 is embedded in the connecting pipe 9 and is fixedly connected with the connecting pipe 9; the connecting pipe 9 is fixedly connected with one end of the cylinder 8 far away from the TO base 1. The connecting pipe 9 and the cylinder 8 can be fixed by welding.
As shown in fig. 3, the utility model discloses an optical fiber assembly 6 includes optic fibre 61, lock pin 62 and protective sheath 63, and optic fibre 61 encircles outward and is provided with lock pin 62, the inside cavity of protective sheath 63, and lock pin 62 inlays the one end of establishing at protective sheath 63 near TO base 1, is provided with the lock pin hole that runs through on the lock pin 62, and the downthehole optic fibre 61 that has worn of lock pin has been put, optic fibre 61 and lock pin 62 fixed connection, and optic fibre 61 is just setting up the light-emitting direction of second lens 5. The optical fiber 61 is relatively fragile, and a ferrule 62 made of ceramic and a protective sleeve 63 made of metal may be provided outside the optical fiber to protect the optical fiber.
In addition, the outer surface of the connecting pipe 9 is also provided with a rubber tail sleeve 11, the rubber tail sleeve 11 is arranged around the surface of the connecting pipe 9, and the rubber tail sleeve 11 is fixedly connected with the connecting pipe 9.
In order to improve the light-emitting coupling effect of the present invention, it is preferable that the light-emitting portion 20, the first lens 3, the second lens 5, and the optical fiber assembly 6 are coaxially disposed. The utility model discloses the power that does not need the increase laser instrument promotes coupling output power, can not produce adverse effect to laser instrument life-span and heat resistance. The specifications of the first lens 3 and the second lens 5 are substantially the same. The light-emitting side of the TO pipe cap 4 is also obliquely provided with a glass stop sheet TO prevent foreign matters from entering the TO pipe cap 4.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A coaxial pigtail semiconductor laser subassembly characterized in that: the optical fiber laser device comprises a TO base (1), a laser chip assembly (2), a first lens (3), a TO pipe cap (4), a second lens (5) and an optical fiber assembly (6), wherein the laser chip assembly (2) is arranged at one end of the TO base (1), a light emitting part (20) is arranged at one end, away from the TO base (1), of the laser chip assembly (2), the first lens (3), the TO pipe cap (4), the second lens (5) and the optical fiber assembly (6) are sequentially arranged on a laser path of the light emitting part (20), and the first lens (3) is fixedly connected with the laser chip assembly (2); the second lens (5) and the optical fiber assembly (6) are fixedly arranged relative TO the TO base (1); the laser emitted by the light emitting part (20) sequentially passes through the first lens (3), the TO pipe cap (4) and the second lens (5) and is coupled into the optical fiber assembly (6).
2. A coaxial pigtail semiconductor laser assembly as recited in claim 1, wherein: the TO pipe cap (4) and the TO base (1) are encircled TO form a closed first cavity (10); the laser chip assembly (2) and the first lens (3) are located in the first cavity (10), and the first lens (3) is fixedly connected with the laser chip assembly (2).
3. A coaxial pigtail semiconductor laser assembly as recited in claim 2, wherein: still include isolator (7), isolator (7) are located the laser path between first lens (3) and TO pipe cap (4), and isolator (7) and first lens (3) keep away from the one end fixed connection of TO base (1).
4. A coaxial pigtail semiconductor laser assembly as claimed in claim 2 or 3 wherein: the laser chip assembly (2) comprises a semiconductor refrigerator (201), a heat sink (202), a thermistor (203) and a laser chip (204); the semiconductor refrigerator (201) is fixedly arranged on the TO base (1), a heat sink (202) is arranged at one end, far away from the TO base (1), of the semiconductor refrigerator (201), the heat sink (202) is fixedly connected with the semiconductor refrigerator (201), a thermistor (203) and a laser chip (204) are arranged at one end, far away from the TO base (1), of the heat sink (202), and the thermistor (203) and the laser chip (204) are fixedly connected with the heat sink (202); one end of the laser chip (204) far away from the TO base (1) is provided with a light emitting part (20).
5. A coaxial pigtail semiconductor laser assembly as recited in claim 3, wherein: further comprising a lens sleeve (205), the lens sleeve (205) being arranged around the radial direction surfaces of the first lens (3) and the spacer (7).
6. A coaxial pigtail semiconductor laser assembly as recited in claim 2, wherein: the TO lamp is characterized by further comprising a hollow barrel (8), wherein the barrel (8) surrounds the TO base (1), the TO tube cap (4) and the second lens (5), one end of the barrel (8) is fixedly connected with the TO base (1), and the second lens (5) is embedded at the other end of the barrel (8); the optical fiber assembly (6) is arranged at one end, far away from the TO base (1), of the barrel (8).
7. A coaxial pigtail semiconductor laser assembly as in claim 6 wherein: the optical fiber module is characterized by also comprising a connecting pipe (9), wherein the optical fiber module (6) is embedded in the connecting pipe (9) and is fixedly connected with the connecting pipe (9); the connecting pipe (9) is fixedly connected with one end of the cylinder body (8) far away from the TO base (1).
8. A coaxial pigtail semiconductor laser assembly as recited in claim 7, wherein: the outer surface of the connecting pipe (9) is further provided with a rubber tail sleeve (11), the rubber tail sleeve (11) surrounds the surface of the connecting pipe (9), and the rubber tail sleeve (11) is fixedly connected with the connecting pipe (9).
9. A coaxial pigtail semiconductor laser assembly as in claim 6 wherein: optical fiber subassembly (6) are including optic fibre (61), lock pin (62) and protective sheath (63), optic fibre (61) outer loop is around being provided with lock pin (62), the inside cavity of protective sheath (63), lock pin (62) are inlayed and are established in protective sheath (63) and are close TO the one end of TO base (1), are provided with the lock pin hole that runs through on lock pin (62), the downthehole optic fibre (61) of having worn TO have set up of lock pin, optic fibre (61) and lock pin (62) fixed connection, optic fibre (61) are just TO the light-emitting direction setting of second lens (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922181582.9U CN210866773U (en) | 2019-12-07 | 2019-12-07 | Coaxial pigtail semiconductor laser assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922181582.9U CN210866773U (en) | 2019-12-07 | 2019-12-07 | Coaxial pigtail semiconductor laser assembly |
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| Publication Number | Publication Date |
|---|---|
| CN210866773U true CN210866773U (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922181582.9U Active CN210866773U (en) | 2019-12-07 | 2019-12-07 | Coaxial pigtail semiconductor laser assembly |
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| CN (1) | CN210866773U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864791A (en) * | 2021-01-08 | 2021-05-28 | 东莞市中镓半导体科技有限公司 | Semiconductor laser of combined type TO encapsulation |
| CN115469408A (en) * | 2022-09-22 | 2022-12-13 | 武汉腾芯通信技术有限公司 | Optical communication assembly |
-
2019
- 2019-12-07 CN CN201922181582.9U patent/CN210866773U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112864791A (en) * | 2021-01-08 | 2021-05-28 | 东莞市中镓半导体科技有限公司 | Semiconductor laser of combined type TO encapsulation |
| CN115469408A (en) * | 2022-09-22 | 2022-12-13 | 武汉腾芯通信技术有限公司 | Optical communication assembly |
| CN115469408B (en) * | 2022-09-22 | 2024-02-09 | 武汉腾芯通信技术有限公司 | Optical communication assembly |
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