WO2016093520A3 - 배선용 인터포저 및 이를 구비하는 전자 모듈 - Google Patents

배선용 인터포저 및 이를 구비하는 전자 모듈 Download PDF

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Publication number
WO2016093520A3
WO2016093520A3 PCT/KR2015/012838 KR2015012838W WO2016093520A3 WO 2016093520 A3 WO2016093520 A3 WO 2016093520A3 KR 2015012838 W KR2015012838 W KR 2015012838W WO 2016093520 A3 WO2016093520 A3 WO 2016093520A3
Authority
WO
WIPO (PCT)
Prior art keywords
interposer
wiring
same
electronic module
layer
Prior art date
Application number
PCT/KR2015/012838
Other languages
English (en)
French (fr)
Other versions
WO2016093520A2 (ko
Inventor
송철
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Publication of WO2016093520A2 publication Critical patent/WO2016093520A2/ko
Publication of WO2016093520A3 publication Critical patent/WO2016093520A3/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

본 발명은 인터포저 내에 배선층을 형성함으로써 성능을 개선할 수 있으며, 회로 설계 및 패턴 구현이 용이한 배선용 인터포저 및 이를 구비하는 전자 모듈에 관한 것이다. 본 발명에 따른 배선용 인터포저는, 전자 장치들 사이에 위치하여, 상기 전자 장치들을 전기적으로 연결하며, 상기 인터포저는, 제 1 전기 장치와 전기적으로 연결되는 제 1 도전층; 제 2 전기 장치와 전기적으로 연결되는 제 2 도전층; 및 상기 제 1 및 제 2 도전층 사이에 위치하여, 상기 제 1 및 제 2 전기 장치를 전기적으로 연결하며, 복층 구조로 이루어지는 배선층을 포함한다.
PCT/KR2015/012838 2014-12-11 2015-11-27 배선용 인터포저 및 이를 구비하는 전자 모듈 WO2016093520A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140178227A KR102279152B1 (ko) 2014-12-11 2014-12-11 배선용 인터포저 및 이를 구비하는 전자 모듈
KR10-2014-0178227 2014-12-11

Publications (2)

Publication Number Publication Date
WO2016093520A2 WO2016093520A2 (ko) 2016-06-16
WO2016093520A3 true WO2016093520A3 (ko) 2016-07-28

Family

ID=56108323

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/012838 WO2016093520A2 (ko) 2014-12-11 2015-11-27 배선용 인터포저 및 이를 구비하는 전자 모듈

Country Status (2)

Country Link
KR (1) KR102279152B1 (ko)
WO (1) WO2016093520A2 (ko)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060163740A1 (en) * 2004-02-24 2006-07-27 Ibiden Co., Ltd. Semiconductor mounting board
KR20100055305A (ko) * 2008-11-17 2010-05-26 후지쯔 가부시끼가이샤 배선 기판 및 그 제조 방법
KR101060862B1 (ko) * 2009-09-14 2011-08-31 삼성전기주식회사 인터포저 및 그의 제조방법
US20120267751A1 (en) * 2011-04-21 2012-10-25 Tessera Research Llc Interposer having molded low cte dielectric
KR20140041496A (ko) * 2011-04-22 2014-04-04 테세라, 인코포레이티드 적층된 페이스-다운 접속된 다이들을 구비한 멀티-칩 모듈

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789571B1 (ko) 2006-08-31 2007-12-28 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조방법
KR101904926B1 (ko) 2012-05-04 2018-10-08 에스케이하이닉스 주식회사 반도체 패키지

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060163740A1 (en) * 2004-02-24 2006-07-27 Ibiden Co., Ltd. Semiconductor mounting board
KR20100055305A (ko) * 2008-11-17 2010-05-26 후지쯔 가부시끼가이샤 배선 기판 및 그 제조 방법
KR101060862B1 (ko) * 2009-09-14 2011-08-31 삼성전기주식회사 인터포저 및 그의 제조방법
US20120267751A1 (en) * 2011-04-21 2012-10-25 Tessera Research Llc Interposer having molded low cte dielectric
KR20140041496A (ko) * 2011-04-22 2014-04-04 테세라, 인코포레이티드 적층된 페이스-다운 접속된 다이들을 구비한 멀티-칩 모듈

Also Published As

Publication number Publication date
KR102279152B1 (ko) 2021-07-19
KR20160071029A (ko) 2016-06-21
WO2016093520A2 (ko) 2016-06-16

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