WO2016076764A1 - Устройство и способ извлечения о ловянно -свинцовых припоев из лома - Google Patents
Устройство и способ извлечения о ловянно -свинцовых припоев из лома Download PDFInfo
- Publication number
- WO2016076764A1 WO2016076764A1 PCT/RU2015/000765 RU2015000765W WO2016076764A1 WO 2016076764 A1 WO2016076764 A1 WO 2016076764A1 RU 2015000765 W RU2015000765 W RU 2015000765W WO 2016076764 A1 WO2016076764 A1 WO 2016076764A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tin
- scrap
- printed circuit
- container
- circuit boards
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B25/00—Obtaining tin
- C22B25/06—Obtaining tin from scrap, especially tin scrap
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
- C22B7/004—Dry processes separating two or more metals by melting out (liquation), i.e. heating above the temperature of the lower melting metal component(s); by fractional crystallisation (controlled freezing)
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/005—Separation by a physical processing technique only, e.g. by mechanical breaking
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B9/00—General processes of refining or remelting of metals; Apparatus for electroslag or arc remelting of metals
- C22B9/02—Refining by liquating, filtering, centrifuging, distilling, or supersonic wave action including acoustic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Definitions
- the technical solution relates to the field of processing metal waste, and in particular to means for extracting tin-lead solders from scrap electronic printed circuit boards.
- the method includes placement of products, application of force to them, heating, separation of parts and solder from products, and their separation, the products being placed around the heating center, the action of centrifugal forces is used, the heating is carried out at 170-300 ° C, and the department parts and solder are carried out at a separation factor of 150-800g, and the action of centrifugal forces is carried out after heating the products;
- the device comprises a thermally insulated body, a heater with a support, a perforated partition, a mounting device with holes having a side wall, a bottom, product clamps and a support element, parts and solder receivers, characterized in
- the objective of this technical solution is to increase the extraction efficiency of tin-lead solders from electronic scrap.
- the problem is solved by a method of extracting tin-lead solders from scrap electronic printed circuit boards characterized in that the scrap electronic printed circuit boards are placed in a liquid and / or gas permeable container, which is placed in a liquid or gaseous heat carrier medium heated to or above the melting temperature tin-lead solder, then, after the tin-lead solder is melted, the container is freed from the coolant, after which the molten tin is removed from it by rotation of the container -lead solder and coolant residues, as well as a device for removing tin-lead solders from scrap electronic printed circuit boards characterized in that it contains a hollow tank made in the form of a body of revolution, while the tank is mounted for rotation and made permeable to liquid and / or gas in a direction radial from the axis of rotation; the capacity is made in the form of a drum; the permeability of the tank is achieved by perforation of its side walls; capacity made with the
- Fig. 1 is a device for extracting tin-lead solders from scrap electronic printed circuit boards with a hollow tank, made with the possibility of vertical movement and located inside the tank for the coolant
- Fig.2 is a device for extracting tin lead solders from scrap electronic printed circuit boards with hollow capacity made with the possibility of vertical movement and an external container for the coolant
- Fig.Z a device for extracting tin-lead solders from scrap electronic printed circuit boards with a hollow container located inside the container for the coolant without the possibility of vertical movement.
- Figure 1 shows a hollow tank 1, permeable walls 2, perforation 3, shaft 4, axis 5 of rotation of the hollow tank, tank 6 for the coolant, coolant 7, engine 8.
- a device for extracting tin-lead solders from scrap electronic printed circuit boards is as follows.
- a device for extracting tin-lead solders from scrap electronic printed circuit boards contains a hollow tank 1 made in the form of a body of revolution.
- the hollow tank 1 is mounted on the shaft 4 with the possibility of rotation around its axis 5.
- the tank 1 is driven into rotation by the engine 8.
- the walls 2 of the hollow tank 1 are made permeable to liquid and / or gas in a direction radial from the axis of rotation 5.
- the hollow container 1 is made in the form of a drum.
- the permeability of the tank 1 is achieved due to the perforation 3 made in its side walls 2.
- the hollow tank 1 is optionally made with the possibility of vertical movement.
- the device contains a container 6 for the coolant. Capacity 6 for the coolant is optionally made open at the top.
- a method of extracting tin-lead solders from scrap electronic printed circuit boards is as follows.
- the scrap of electronic printed circuit boards is placed in a container 1 that is permeable to liquid and / or gas.
- the container 1, together with the scrap of printed circuit boards is placed in a liquid or gaseous heat carrier 7 heated to a temperature above or above the melting point of tin-lead solder.
- the placement of the tank 1 with the scrap of printed circuit boards in the coolant 7 can be carried out, for example, by vertical immersion of this tank 1 in the coolant 7 or by pouring the coolant 7 of the tank 1 with the boards, previously placed in a volume sealed for the coolant.
- Heating medium 7 may carried out either preliminarily, or after placing in it a container 1 with scrap boards. Tin-lead solder is melted in the preheated coolant 7.
- the container 1 with the scrap boards is freed from the coolant 7.
- the container 1 with the boards is removed from the coolant 7, for example, by removing the container from the coolant 7 vertically or by its pumping. Then, by rotating the tank 1 due to the emerging centrifugal force, the molten tin-lead solder and the remaining coolant 7 are removed from it.
- a device for extracting tin-lead solders from scrap electronic printed circuit boards works as follows.
- the scrap of electronic printed circuit boards is placed in a hollow tank 1.
- the container 1 together with the scrap of printed circuit boards is placed in the medium of a liquid or gaseous coolant 7, heated to a temperature above or above the melting point of tin-lead solder, thereby ensuring contact between the scrap of boards and the coolant 7.
- a hollow tank 1 is lowered into a tank 6 open with a coolant 7 previously heated to a temperature above the melting of tin-lead solder.
- the scrap of boards with the coolant 7 can be contacted by pumping the coolant 7 into the volume of the tank 1 with the boards, in this case, the hollow tank 1 is preliminarily placed in the tank 6, which is sealed for the coolant 7, to which the supply and removal lines of the coolant 7 are connected.
- the tank 6 which is sealed for the coolant 7, to which the supply and removal lines of the coolant 7 are connected.
- the container 1 with the boards is removed from the coolant, for example, by removing the container 1 from the coolant 7 vertically or by its pumping. Then, by rotating the tank 1 due to the emerging centrifugal force, the molten tin-lead solder and the remains of the coolant 7 are removed from it. The melt of the tin-lead solder is separated from the coolant 7, for example, by decantation. Through the use of liquid or gaseous coolant 7, thermal energy is evenly distributed in the scrap volume of electronic printed circuit boards. In the production cycle, organized according to the principle of operation of this device, the scrap of printed circuit boards can fill the entire useful volume of the hollow tank 1. As processed raw materials, you can use scrap electronic printed circuit boards, both in whole and in shredded form.
- the technical result of the proposed technical solution is to increase the extraction efficiency of tin-lead solders from scrap electronic printed circuit boards due to the method of extracting tin-lead solders from scrap electronic printed circuit boards characterized in that the scrap electronic printed circuit boards are located in a liquid and / or gas-permeable container, which placed in an environment of liquid or gaseous coolant, heated to or above the melting temperature of tin-lead solder, then, after molten I lead-tin solder, the tank is freed from the coolant, and then by rotation of the tank, molten tin-lead solder and the remaining coolant are removed from it, as well as a device for removing tin-lead solders from scrap electronic printed circuit boards characterized in that it contains a hollow tank, made in the form of a body of revolution, wherein the container is rotatably mounted and made permeable to liquid and / or gas in a direction radial from the axis of rotation; the capacity is made in the
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/519,545 US10512981B2 (en) | 2014-11-12 | 2015-11-11 | Device and method for recovering tin-lead solder from scrap |
CA2966510A CA2966510A1 (en) | 2014-11-12 | 2015-11-11 | Device and method for recovering tin-lead solder from scrap |
JP2017524055A JP2017535670A (ja) | 2014-11-12 | 2015-11-11 | 電子プリント回路基板スクラップから錫鉛はんだを回収するための方法およびそれを実行するための装置 |
UAA201703854A UA119180C2 (ru) | 2014-11-12 | 2015-11-11 | Устройство и способ извлечения оловянно-свинцовых припоев из лома |
AU2015347357A AU2015347357B2 (en) | 2014-11-12 | 2015-11-11 | Device and method for recovering tin-lead solder from scrap |
CN201580061289.0A CN107002174A (zh) | 2014-11-12 | 2015-11-11 | 用于从废弃物中回收锡‑铅焊料的装置和方法 |
EP15858623.0A EP3219816A4 (en) | 2014-11-12 | 2015-11-11 | Device and method for recovering tin-lead solder from scrap |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
RU2014145417/02A RU2600156C2 (ru) | 2014-11-12 | 2014-11-12 | Способ извлечения оловянно-свинцовых припоев из лома электронных печатных плат и устройство для его осуществления |
RU2014145417 | 2014-11-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016076764A1 true WO2016076764A1 (ru) | 2016-05-19 |
Family
ID=55954717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/RU2015/000765 WO2016076764A1 (ru) | 2014-11-12 | 2015-11-11 | Устройство и способ извлечения о ловянно -свинцовых припоев из лома |
Country Status (9)
Country | Link |
---|---|
US (1) | US10512981B2 (ru) |
EP (1) | EP3219816A4 (ru) |
JP (1) | JP2017535670A (ru) |
CN (1) | CN107002174A (ru) |
AU (1) | AU2015347357B2 (ru) |
CA (1) | CA2966510A1 (ru) |
RU (1) | RU2600156C2 (ru) |
UA (1) | UA119180C2 (ru) |
WO (1) | WO2016076764A1 (ru) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016022755A2 (en) * | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
CN111961855B (zh) * | 2020-06-02 | 2021-12-31 | 成都仁新科技股份有限公司 | 一种废旧线路板红外线加热脱锡装置 |
CN113500051B (zh) * | 2021-07-16 | 2023-02-21 | 兰州有色冶金设计研究院有限公司 | 一种电路板焊锡去除装置及方法 |
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JPH08225863A (ja) * | 1995-02-23 | 1996-09-03 | Toshiba Corp | 廃棄物からの鉛回収方法および廃棄物からの鉛回収装置 |
JP2003247031A (ja) * | 2002-02-22 | 2003-09-05 | Shirogane:Kk | リサイクル(再生)鉛フリーはんだ(鉛を使わない錫が主成分の半田)材より残存鉛等を除去する精錬方法 |
RU145776U1 (ru) * | 2014-04-22 | 2014-09-27 | Денис Александрович Втулкин | УСТРОЙСТВО ДЛЯ ИЗВЛЕЧЕНИЯ ОЛОВЯННО-СВИНЦОВЫХ ПРИПОЕВ ИЗ ЛОМА ЭЛЕКТРОННЫХ ПЕЧАТНЫХ ПЛАТ ПРИ ПОМОЩИ ВОЗДЕЙСТВИЯ ЦЕНТРОБЕЖНЫХ СИЛ НА ЛОМ ЭЛЕКТРОННЫХ ПЕЧАТНЫХ ПЛАТ В СРЕДЕ ЖИДКОГО ТЕПЛОНОСИТЕЛЯ НАГРЕТОГО ВЫШЕ ТЕМПЕРАТУРЫ ПЛАВЛЕНИЯ ОЛОВЯННО-СВИНЦОВОГО ПРИПОЯ В ДИАПАЗОНЕ ОТ 150º C ДО 320º C |
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RU2089632C1 (ru) * | 1994-08-17 | 1997-09-10 | Эфроим Пинхусович Локшин | Способ регенерации изделий с соединенными припоем деталями и устройство для его осуществления |
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JP2713231B2 (ja) * | 1995-05-19 | 1998-02-16 | 日本電気株式会社 | 電子部品を実装したプリント基板からの有価物の回収方法 |
JP2904148B2 (ja) * | 1996-09-26 | 1999-06-14 | 松下電器産業株式会社 | プリント配線基板の処理装置 |
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EP1008395A3 (en) * | 1998-12-11 | 2003-05-02 | Matsushita Electric Industrial Co., Ltd. | Method for separating metallic material from waste printed circuit boards, and dry distilation apparatus used for waste treatment |
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CN203741390U (zh) * | 2014-02-25 | 2014-07-30 | 中国矿业大学 | 一种废弃电路板金属回收分离装置 |
WO2016022755A2 (en) * | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
-
2014
- 2014-11-12 RU RU2014145417/02A patent/RU2600156C2/ru active IP Right Revival
-
2015
- 2015-11-11 UA UAA201703854A patent/UA119180C2/ru unknown
- 2015-11-11 WO PCT/RU2015/000765 patent/WO2016076764A1/ru active Application Filing
- 2015-11-11 EP EP15858623.0A patent/EP3219816A4/en not_active Withdrawn
- 2015-11-11 JP JP2017524055A patent/JP2017535670A/ja active Pending
- 2015-11-11 US US15/519,545 patent/US10512981B2/en active Active
- 2015-11-11 CA CA2966510A patent/CA2966510A1/en active Pending
- 2015-11-11 CN CN201580061289.0A patent/CN107002174A/zh active Pending
- 2015-11-11 AU AU2015347357A patent/AU2015347357B2/en not_active Ceased
Patent Citations (4)
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SU62221A1 (ru) * | 1939-03-23 | 1942-11-30 | И.А. Кравцов | Устройство дл регулировани направл ющего аппарата дл трогани с места гидротурбины |
JPH08225863A (ja) * | 1995-02-23 | 1996-09-03 | Toshiba Corp | 廃棄物からの鉛回収方法および廃棄物からの鉛回収装置 |
JP2003247031A (ja) * | 2002-02-22 | 2003-09-05 | Shirogane:Kk | リサイクル(再生)鉛フリーはんだ(鉛を使わない錫が主成分の半田)材より残存鉛等を除去する精錬方法 |
RU145776U1 (ru) * | 2014-04-22 | 2014-09-27 | Денис Александрович Втулкин | УСТРОЙСТВО ДЛЯ ИЗВЛЕЧЕНИЯ ОЛОВЯННО-СВИНЦОВЫХ ПРИПОЕВ ИЗ ЛОМА ЭЛЕКТРОННЫХ ПЕЧАТНЫХ ПЛАТ ПРИ ПОМОЩИ ВОЗДЕЙСТВИЯ ЦЕНТРОБЕЖНЫХ СИЛ НА ЛОМ ЭЛЕКТРОННЫХ ПЕЧАТНЫХ ПЛАТ В СРЕДЕ ЖИДКОГО ТЕПЛОНОСИТЕЛЯ НАГРЕТОГО ВЫШЕ ТЕМПЕРАТУРЫ ПЛАВЛЕНИЯ ОЛОВЯННО-СВИНЦОВОГО ПРИПОЯ В ДИАПАЗОНЕ ОТ 150º C ДО 320º C |
Non-Patent Citations (1)
Title |
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See also references of EP3219816A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP3219816A4 (en) | 2018-06-27 |
AU2015347357A1 (en) | 2017-06-29 |
US20170239742A1 (en) | 2017-08-24 |
CN107002174A (zh) | 2017-08-01 |
UA119180C2 (ru) | 2019-05-10 |
EP3219816A1 (en) | 2017-09-20 |
CA2966510A1 (en) | 2016-05-19 |
AU2015347357B2 (en) | 2021-04-08 |
JP2017535670A (ja) | 2017-11-30 |
RU2600156C2 (ru) | 2016-10-20 |
RU2014145417A (ru) | 2016-05-27 |
US10512981B2 (en) | 2019-12-24 |
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