WO2016068069A1 - Procédé de traitement thermique d'une plaque de base en verre et procédé de fabrication d'une plaque de base en verre - Google Patents

Procédé de traitement thermique d'une plaque de base en verre et procédé de fabrication d'une plaque de base en verre Download PDF

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Publication number
WO2016068069A1
WO2016068069A1 PCT/JP2015/080090 JP2015080090W WO2016068069A1 WO 2016068069 A1 WO2016068069 A1 WO 2016068069A1 JP 2015080090 W JP2015080090 W JP 2015080090W WO 2016068069 A1 WO2016068069 A1 WO 2016068069A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
setter
heat treatment
glass
base plate
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Application number
PCT/JP2015/080090
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English (en)
Japanese (ja)
Inventor
泰紀 三成
昭霖 ▲呉▼
致維 程
芳延 呂
建元 王
貴弘 川口
Original Assignee
日本電気硝子株式会社
台湾電気硝子股▲ふん▼有限公司
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Publication of WO2016068069A1 publication Critical patent/WO2016068069A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B25/00—Annealing glass products
    • C03B25/02—Annealing glass products in a discontinuous way
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B32/00—Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a heat treatment method for a glass substrate and a method for producing the same.
  • glass substrates are used for flat panel displays (hereinafter referred to as FPD) such as liquid crystal displays, plasma displays, electroluminescence displays, and organic EL displays.
  • FPD flat panel displays
  • liquid crystal displays plasma displays
  • electroluminescence displays electroluminescence displays
  • organic EL displays organic EL displays
  • the glass substrate when forming a thin film electric circuit on the surface, the glass substrate may be exposed to high temperature. At this time, if the thermal contraction of the glass substrate is large, a circuit pattern formed on the surface of the glass substrate is deviated from the design, and there is a problem that desired electrical performance cannot be maintained. At this time, as the thickness of the glass substrate is thinner, the drawing rate at the time of forming the glass substrate is increased, so that the thermal shrinkage rate of the glass substrate is also increased.
  • Patent Document 1 a method of improving the flatness and thermal dimensional stability of the glass substrate by placing the molded glass substrate on a setter and performing a heat treatment is known (see, for example, Patent Document 1).
  • the entire lower surface 101a of the glass substrate 101 is brought into contact with the upper surface 102a of the setter 102 using a setter 102 larger than the glass substrate 101 as shown in FIGS. 8a and 8b.
  • the peripheral edge portion 101c of the glass substrate 101 (the portion with the class hatching in the drawing) 101c is also supported from below by the setter 102, like the central portion of the glass substrate 101.
  • the setter 102 warps toward the glass substrate 101 in the course of the heat treatment, and breakage starts from the peripheral edge portion 101c of the glass substrate 101 (particularly, the end surface 101b having low damage strength). May occur.
  • the thickness of the setter 102 is reduced for the purpose of suppressing the heat capacity of the setter 102, the rigidity of the setter 102 is reduced and warping tends to occur, and the possibility that the glass substrate 101 is damaged increases.
  • the cause of the setter 102 to warp is that a shrinkage difference occurs in the plane of the setter 102 due to the temperature distribution generated in the center portion and the peripheral portion of the setter 102 in the temperature lowering process during the heat treatment.
  • an object of the present invention is to provide a heat treatment method for a glass substrate capable of suppressing breakage of an end face starting from the peripheral edge of the glass substrate.
  • the present invention provides a glass substrate heat treatment method for performing a heat treatment for lowering the thermal shrinkage of a glass substrate in a state where the upper surface of the setter is in contact with the lower surface of the glass substrate.
  • the glass substrate is characterized by a heat treatment method for a glass substrate in which a non-contact portion that is not in contact with the upper surface of the setter is provided on at least a part of the peripheral edge of the lower surface.
  • the “peripheral portion” refers to a predetermined region including the end face.
  • the glass substrate and the setter are not in contact with each other at a position corresponding to the peripheral edge of the glass substrate. Therefore, it is possible to reduce the influence of the setter warping acting on the peripheral edge of the glass substrate. Therefore, the breakage starting from the peripheral edge of the glass substrate can be reduced.
  • the upper surface of the setter is preferably smaller than the lower surface of the glass substrate.
  • the ratio of the area of the non-contact portion to the area of the entire lower surface of the glass substrate is preferably less than 0.5.
  • the ratio of the non-contact portion to the entire lower surface of the glass substrate is regulated. If it does, the temperature nonuniformity in a glass substrate can be prevented.
  • the non-contact portion is provided over the entire periphery of the peripheral portion of the glass substrate.
  • the thickness of the glass substrate may be 0.2 mm or less.
  • Thinning the glass substrate makes it possible to reduce the thickness and size of mounted products, such as reducing the thickness and weight of FPDs.
  • the thickness of the setter is preferably 0.5 mm or more and 3.0 mm or less.
  • the heat capacity of the setter can be reduced by setting the thickness of the setter to 3.0 mm or less. Thereby, the energy loss at the time of the heat processing of a glass substrate can be reduced, and productivity can be aimed at. Moreover, the strength of the setter can be maintained by setting the thickness of the setter to 0.5 mm or more.
  • the glass substrate has a rectangular shape of 300 mm square or more.
  • the maximum temperature during the heat treatment is lower than the annealing point of the glass substrate.
  • the heat treatment method can be used for a glass substrate used for a flexible device or a wearable device.
  • the said glass substrate can be manufactured with the manufacturing process of shape
  • the present invention even if the setter warps to the glass substrate side, by providing a non-contact portion with the setter on the peripheral edge portion of the glass substrate, it is possible to reduce the influence of the setter warping, Breakage starting from the peripheral edge can be suppressed.
  • the manufacturing method of the glass substrate 1 includes a forming step of forming the glass substrate 1 from molten glass using an overflow downdraw method, and a heat treatment that reduces the heat shrinkage rate of the glass substrate 1 by heat-treating the formed glass substrate 1. It is roughly divided into processes. Since a well-known method can be employed for the forming process, the following description will focus on the heat treatment process. You may provide the washing
  • the heat treatment step is a step of executing the heat treatment method according to the embodiment of the present invention.
  • the glass substrate 1 is placed on a setter 2 for firing.
  • the upper surface 2a of the setter 2 is smaller than the lower surface 1a of the glass substrate 1, and a non-contact portion 1d that is not in contact with the upper surface 2a of the setter 2 is formed over the entire periphery of the peripheral portion 1c of the glass substrate 1. Is formed.
  • the dimension of the glass substrate 1 is preferably 300 mm square or more, more preferably 400 mm square or more, further preferably 500 mm square or more, and most preferably 600 mm square or more.
  • the thickness of the glass substrate 1 is set to 300 ⁇ m or less. More preferably, it is 200 micrometers or less, Most preferably, it is 100 micrometers or less. In consideration of the strength of the glass substrate 1, the thickness is preferably 5 ⁇ m or more.
  • the glass substrate 1 silicate glass and silica glass can be used, and borosilicate glass and soda glass are more preferable.
  • alkali-free glass is used.
  • the alkali-free glass means a glass that does not substantially contain an alkali component (alkali metal oxide). Specifically, it means a glass having an alkali component content of 3000 ppm or less. The content of the alkali component is preferably 1000 ppm or less, more preferably 500 ppm or less, and most preferably 300 ppm or less.
  • the strain point of the glass substrate 1 is preferably 600 ° C. or higher, more preferably 650 ° C. or higher, further preferably 680 ° C. or higher, and most preferably 700 ° C. or higher.
  • the strain point indicates a value measured based on the method of ASTM C336.
  • the plate thickness of the setter 2 is set in the range of 0.5 to 3.0 mm.
  • the thickness is preferably 0.5 to 2.5 mm, more preferably 0.5 to 2.0 mm, still more preferably 0.7 to 2.0 mm, and most preferably 1.0 to 2.0 mm.
  • Glass can be used as the material for the setter 2.
  • Silicate glass, silica glass, borosilicate glass, and alkali-free glass are preferably used.
  • alkali-free glass similar to the glass substrate 1 is used.
  • a heat-resistant material such as ceramics or metal can be used.
  • An inorganic thin film may be formed on the upper surface 2a of the setter 2.
  • the glass substrate 1 is stacked on the setter 2 having the upper surface 2a formed with an inorganic thin film.
  • the effect according to the embodiment of the present invention can be similarly obtained by adopting a configuration in which the upper surface 2a is slightly smaller than the lower surface 1a of the glass substrate 1 regardless of the presence or absence of the inorganic thin film. .
  • the glass substrate 1 does not adhere to the setter 2 even when the glass substrate 1 becomes high temperature by heating during the heat treatment, and the glass substrate 1 can be easily peeled from the setter 2 after the heat treatment. .
  • a method for forming an inorganic thin film on the upper surface of the setter 2 for example, a sputtering method, a vacuum deposition method, a CVD method, a sol-gel method, or the like can be used.
  • the surface roughness Ra of the inorganic thin film formed on the setter 2 is preferably 100 nm or less.
  • the surface roughness Ra is larger than 100 nm, an air layer is easily interposed between the setter 2 and the inorganic thin film. This is because the glass substrate 1 easily slides on the setter 2 and the posture of the glass substrate 1 with respect to the setter 2 becomes unstable.
  • the surface roughness Ra of the inorganic thin film is more preferably 80 nm or less, further preferably 50 nm or less, more preferably 30 nm or less, and most preferably 10 nm or less.
  • the surface roughness Ra can be measured by an arbitrary method such as a stylus type surface roughness meter or AFM.
  • the surface roughness Ra of the inorganic thin film formed on the setter 2 is set to 1.0 nm or more, and preferably 2.0 nm or more. This is because the glass substrate 1 can be easily peeled from the setter 2 even when heat treatment is performed at a high temperature of 500 ° C. or higher. In addition, it is not necessary to make the adhesive force resulting from both surface states act between the glass substrate 1 and an inorganic thin film.
  • Inorganic thin film ITO, Ti, Si, Au , Ag, Al, Cr, Cu, Mg, Ti, SiO, SiO 2, Al 2 O 3, MgO, Y 2 O 3, L 2 O 3, Pr 6 O 11 , Sc 2 O 3 , WO 3 , HfO 2 , In 2 O 3 , ZrO 2 , Nd 2 O 3 , Ta 2 O 5 , CeO, Nb 2 O 5 , TiO, TiO 2 , Ti 3 O 5 , NiO, ZnO It is preferable to form by 1 type, or 2 or more types selected from.
  • the inorganic thin film is preferably formed of an oxide such as ITO. In the case of an oxide thin film, since it is thermally stable, the same setter 2 can be repeatedly used for the heat treatment process.
  • the thickness of the inorganic thin film is preferably 500 nm or less, more preferably 400 nm or less, and most preferably 300 nm or less.
  • the thickness of the inorganic thin film is set to 5 nm or more. There exists a possibility that the glass substrate 1 may become difficult to peel that the thickness of an inorganic thin film is less than 5 nm.
  • the size of the glass substrate 1 is set to be 10 mm or more larger than the setter 2 in the vertical and horizontal directions. By increasing the length and width by 20 mm or more, damage to the end face 1b can be reliably suppressed, which is more preferable.
  • the ratio of the area of the non-contact part 1d with respect to the whole lower surface 1a is 0.5 or less. More preferably, it is 0.3 or less, More preferably, it is 0.2 or less, Most preferably, it is 0.1 or less. However, of course, it is larger than 0 (the glass substrate 1 has the non-contact part 1d). By regulating the ratio of the non-contact portion 1d to the entire lower surface 1a of the glass substrate 1, temperature unevenness inside the glass substrate 1 can be prevented.
  • the heat treatment apparatus 3 used in the heat treatment step includes a glass chamber 4, a glass shelf 5 disposed inside the glass chamber 4, and a lifting platform 6 on which the glass shelf 5 is placed. And a furnace wall 7 surrounding the periphery of the glass chamber 4 and a heater 8 for heating the glass chamber 4 from the outside.
  • this heat processing apparatus 3 is arrange
  • the glass chamber 4 has a covered cylindrical shape formed by integrally molding quartz glass, and has a heat treatment space S therein. That is, the glass chamber 4 defines the heat treatment space S by a continuous continuous surface.
  • the glass shelf 5 is made of quartz glass and has a plurality of accommodating portions 9 provided in a multistage shape in the vertical direction. Each storage portion 9 is provided with a detachable shelf plate 10 on which the setter 2 and the glass substrate 1 are stored in an overlapping manner.
  • the shelf board 10 is also formed of quartz glass.
  • the mounting part 11 of the lifting platform 6 is made of quartz glass, and closes the lower opening of the glass chamber 4 at the raised position.
  • the setter 2 and the glass substrate 1 are loaded and unloaded on the glass shelf 5 on the mounting portion 11 by lowering the lifting platform 6 to a lower position outside the drawing.
  • the furnace wall 7 is made of a refractory, and a plurality of heaters 8 are attached to the inner wall surface and the upper inner wall surface of the furnace wall 7.
  • the heater 8 is not particularly limited, but in this embodiment, a metal heating element (for example, a nichrome heating element) is used.
  • the shelf board 10 of the glass shelf 5 is comprised by the grid
  • a plurality of pin-shaped protrusions are provided on the upper surface of the shelf board 10.
  • the setter 2 and the glass substrate 1 are supported from below the setter 2 by the plurality of protrusions.
  • the glass shelf 5 is disposed in the heat treatment space S provided in the glass chamber 4, and the glass substrate 1 is accommodated in the setter 2 in each of the shelf plates 10 provided in the accommodating portion 9 of the glass shelf 5. To do. Then, after that, the heat treatment space S is heated from the outside of the glass chamber 4 by the heater 8, and the glass substrates 1 accommodated in the respective accommodating portions 9 are heat treated.
  • the glass substrate 1 is heat treated by the heat of the heater 8 as described above. First, the temperature of the glass substrate 1 is raised to a predetermined temperature and held at that temperature for a certain period of time. Thereafter, the temperature is lowered over time.
  • the structure relaxation of the glass substrate 1 can be promoted and the thermal shrinkage rate of the glass substrate 1 can be reduced.
  • the glass substrate 1 is greatly deformed by heat shrinkage even when the glass substrate 1 is subjected to manufacturing-related processing involving heating. There is no.
  • the thickness of the setter 2 is set to a predetermined value or less to reduce the heat capacity of the setter 2. Thereby, the amount of heat flowing to the setter 2 can be suppressed, and the glass substrate 1 can be efficiently heated.
  • the temperature rising rate of the glass substrate 1 is preferably 3 ° C./min or more, more preferably 5 ° C./min or more, and further preferably 7 ° C./min or more. In order to prevent the glass substrate 1 from being damaged, the temperature rising rate of the glass substrate 1 is preferably 30 ° C./min or less, and more preferably 20 ° C./min or less.
  • the maximum temperature is preferably lower than the annealing point, and the temperature holding time after reaching the maximum temperature is preferably set between 5 and 120 minutes. Thereby, reduction of the thermal contraction rate of the glass substrate 1 can be performed appropriately.
  • the temperature lowering rate after reaching the maximum temperature is preferably 1 ° C./min or more, more preferably 2 ° C./min or more, and further preferably 5 ° C./min or more. Thereby, the time for temperature fall can be shortened and the productivity of the glass substrate 1 can be improved. Further, in order to sufficiently reduce the thermal shrinkage rate of the glass substrate 1, the temperature lowering rate is preferably 20 ° C./min or less, and more preferably 15 ° C./min or less.
  • the setter 2 may be uneven in temperature due to a difference in temperature drop rate inside the setter 2 and may be warped toward the glass substrate 1 as shown in FIG.
  • the peripheral edge portion 1c of the glass substrate 1 can be made the non-contact portion 1d, and the breakage of the end surface 1b can be reduced.
  • the heat treatment process according to the embodiment of the present invention may use an online heat treatment furnace such as a roller conveyor, a belt conveyor, a walking beam method, or a heat treatment such as a batch method, a continuous conveyance method, or a single wafer method.
  • a furnace may be used.
  • the glass substrate 1 used in the experiment has a rectangular shape of 610 mm ⁇ 740 mm and has a thickness of 200 ⁇ m, and is made of an alkali-free glass manufactured by Nippon Electric Glass Co., Ltd. (product name: OA-11, coefficient of thermal expansion at 30 to 380 ° C .: 37 ⁇ 10- 7 / ° C., the strain point 685 ° C., a annealing point 740 ° C.).
  • the glass substrate 1 having the above size was cut from a 200 ⁇ m thick glass plate by a diamond wheel chip scribe method. In addition, the end surface processing after cutting is not performed.
  • non-alkali glass OA-11 manufactured by Nippon Electric Glass Co., Ltd. is used for the setter 2.
  • the inorganic thin film which consists of ITO with a thickness of 180 nm is formed in the both surfaces of the setter 2 by the sputtering method.
  • the four types of setters 2 are 1.5 mm thick, 590 mm long x 720 mm wide, 1.5 mm thick, 620 mm long x 750 mm wide, 1.5 mm thick, 750 mm long x 940 mm wide, 0.5 mm thick, and 750 mm long. The one with a width of 940 mm is used.
  • the glass substrate 1 and each type of setter 2 are prepared, and the thermal contraction rate of each glass substrate 1 is reduced by performing the above-described annealing treatment.
  • the annealing treatment of the experiment the glass substrate 1 placed on each setter 2 was heated to 600 ° C. at 10 ° C./min, held at 60 ° C. for 90 minutes, and then cooled to room temperature at 3 ° C./min. Let The glass substrate 1 subjected to the annealing treatment is visually checked for the presence or absence of breakage of each end face 1b, and the breakage rate is evaluated.
  • the thermal contraction rate of the glass substrate 1 after the heat treatment is measured by the following method (hereinafter the same). That is, as shown in FIG. 4A, first, a 160 mm ⁇ 30 mm strip sample G is prepared as a sample of the glass substrate 1. A marking M is formed on each end of the strip-shaped sample G in the long side direction at a position 20 to 40 mm away from the edge by using # 1000 water-resistant abrasive paper. Thereafter, as shown in FIG. 4b, the strip-shaped sample G on which the marking M is formed is folded in two along the direction orthogonal to the marking M to produce sample pieces Ga and Gb. Then, only one sample piece Gb is heated from room temperature to 500 ° C.
  • Table 1 shows the size and thickness of the first to fourth setters 2, the dimensional difference from the glass substrate 1 (+ is larger for the setter 2), and the breakage rate of the end surface 1b of the glass substrate 1. Moreover, the thermal contraction rate of the glass substrate 1 after heat processing all became a small value of 5 ppm or less, and it was a result that heat processing was performed favorable about all the glass substrates 1.
  • the first setter 2 with a smaller area than the glass substrate 1 had a breakage rate of 0%, whereas the second to fourth setters 2 with a larger area than the glass substrate 1,
  • the damage rate was 60 to 80%.
  • the change of the failure rate by the thickness of the setter 2 was not seen by the comparison of No. 3 and No. 4.
  • FIG. 1 the case where the upper surface 2a of the setter 2 is included inside the lower surface 1a of the glass substrate 1 and has the non-contact portion 1d over the entire periphery of the peripheral portion 1c of the glass substrate 1 is shown. As shown in FIG. 3, the structure which has the non-contact part 1d in the part may be sufficient.
  • the sides X1 are all non-contact portions 1d, and the end surface 1b corresponding to the side X1 can suppress damage due to warping of the setter 2. In this manner, the breakage of the end surface 1b corresponding to the specific side of the glass substrate 1 may be suppressed. Further, the sides X2 and X3 have a non-contact portion 1d in a part thereof (the left side portion in the figure), and damage to the end surface 1b corresponding to the portion having the non-contact portion 1d can be suppressed. In this manner, the non-contact portion 1d may be provided on a part of the side of the glass substrate 1. Note that the side X4 does not have the non-contact portion 1d.
  • FIG. 6 by changing the arrangement of the glass substrate 1 with respect to the setter 2, a part of the glass substrate 1 (four corners including four vertices in the figure) can be used as the non-contact portion 1d. is there.
  • the example of FIG. 6 is effective when the strength of the end surface 1b at the four apexes of the end surface 1b is particularly weak.
  • the setter 2 may have a cross-shaped configuration, and the four corners of the glass substrate 1 may be non-contact portions 1d.
  • the configuration of the heat treatment apparatus 3 is not particularly limited as long as the glass substrate 1 placed on the setter 2 can be heated.
  • the glass substrate 1 is manufactured by the overflow downdraw method
  • the glass substrate 1 is manufactured by another method, for example, a slot downdraw method, a rollout method or a float method, an updraw method, a redraw method, or the like. Also good.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Dans le procédé de traitement thermique selon un mode de réalisation de la présente invention, une plaque de base en verre (1) est placée au-dessus d'un plaque de support d'échauffement (2), tel que montré sur la figure 1a et la figure 1b. Spécifiquement, la surface supérieure (2a) de la plaque de support (2) est plus petite que la surface inférieure (1a) de la plaque de base en verre (1), de telle sorte que, sur toute la périphérie d'une partie de bord périphérique (1c) de la plaque de base en verre (1), une partie de non-contact (1d) est formée, qui n'entre pas en contact avec la surface supérieure (2a) de la plaque de support (2). L'utilisation de la partie de non-contact (1d) permet une suppression de dommages sur une surface de bord (1b) même lorsque la plaque de support (2) voilent à l'arrière au niveau du côté de la plaque de base en verre (1).
PCT/JP2015/080090 2014-10-30 2015-10-26 Procédé de traitement thermique d'une plaque de base en verre et procédé de fabrication d'une plaque de base en verre WO2016068069A1 (fr)

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JP2014221520A JP2016088769A (ja) 2014-10-30 2014-10-30 ガラス基板の熱処理方法およびガラス基板の製造方法
JP2014-221520 2014-10-30

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JPH0920527A (ja) * 1995-07-04 1997-01-21 Nippon Electric Glass Co Ltd 薄板ガラスの熱処理用治具
JP2005061747A (ja) * 2003-08-18 2005-03-10 Nippon Electric Glass Co Ltd 熱処理用セッター及びその製造方法
JP2007084379A (ja) * 2005-09-21 2007-04-05 Nippon Electric Glass Co Ltd 板ガラスの熱処理方法及び熱処理装置並びに熱処理用治具
JP2007287969A (ja) * 2006-04-18 2007-11-01 Ihi Corp 基板アニール装置用の基板支持装置

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JPH0920527A (ja) * 1995-07-04 1997-01-21 Nippon Electric Glass Co Ltd 薄板ガラスの熱処理用治具
JP2005061747A (ja) * 2003-08-18 2005-03-10 Nippon Electric Glass Co Ltd 熱処理用セッター及びその製造方法
JP2007084379A (ja) * 2005-09-21 2007-04-05 Nippon Electric Glass Co Ltd 板ガラスの熱処理方法及び熱処理装置並びに熱処理用治具
JP2007287969A (ja) * 2006-04-18 2007-11-01 Ihi Corp 基板アニール装置用の基板支持装置

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