WO2016067492A1 - 外部機器の放熱構造、電子機器、及び外部機器 - Google Patents
外部機器の放熱構造、電子機器、及び外部機器 Download PDFInfo
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- WO2016067492A1 WO2016067492A1 PCT/JP2015/003642 JP2015003642W WO2016067492A1 WO 2016067492 A1 WO2016067492 A1 WO 2016067492A1 JP 2015003642 W JP2015003642 W JP 2015003642W WO 2016067492 A1 WO2016067492 A1 WO 2016067492A1
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- Prior art keywords
- external device
- heat
- heat dissipation
- hdd
- unit
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1426—Reducing the influence of the temperature by cooling plates, e.g. fins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
Definitions
- the present invention relates to a heat dissipation structure for external devices, an electronic device, and an external device.
- Some external devices housed in electronic devices require a heat dissipation structure equipped with an HDD (Hard Disk Drive) or the like.
- HDD Hard Disk Drive
- Patent Document 1 discloses a heat dissipation mechanism for an external device in which a ring-shaped heat dissipation sheet is provided in a holding portion that holds the external device.
- Patent Document 1 a heat dissipation sheet, which is a component used for heat dissipation of an external device, is provided on the device main body side, and when performing maintenance (replacement etc.) of a component used for heat dissipation of the external device, the device main body is Maintenance is poor because it must be disassembled.
- An object of the present invention is to provide a heat dissipation structure for an external device that can be easily maintained.
- a heat dissipation structure for an external device is a heat dissipation structure for the external device in an electronic device provided with a housing portion that detachably accommodates the external device, and is detachably attached to the external device.
- a heat dissipating part having heat conductivity for transmitting heat generated to the housing part is provided.
- the electronic device is an electronic device including a housing portion that detachably accommodates an external device, and the external device has a thermal conductivity that transmits heat generated by the external device to the housing portion. Is removably attached.
- An external device is an external device that is detachably accommodated in a housing portion of an electronic device, and a heat radiating portion having heat conductivity that transfers heat generated by the external device to the housing portion is detachably attached. ing.
- a heat dissipation structure for an external device that can be easily maintained can be obtained.
- FIG. 3 is a cross-sectional view taken along line A-A ′ of FIG. 2.
- FIG. 1 is a side view of a POS (Point Of Sales) terminal device 10 (electronic device) having an external device heat dissipation structure of the present invention.
- POS terminal device electronic device
- FIG. 1 is a side view of a POS terminal device 10 (electronic device) having an external device heat dissipation structure of the present invention.
- a POS terminal device will be described as an example of an electronic device having a heat dissipation structure for an external device, but the electronic device according to the present invention is not limited thereto.
- the POS terminal device 10 includes a main body unit 20 and a power supply unit 30.
- the main body unit 20 includes a display with a touch panel, for example, and includes a housing unit that houses (mounts) an external device such as an HDD, a motherboard, and the like.
- the main body unit 20 includes a top cover 40 and a rear cover 50. By removing the top cover 40 and the rear cover 50, the HDD can be attached to and detached from the housing unit.
- the power supply unit 30 includes a DC power supply that supplies power to the main body unit 20.
- FIG. 2 is a perspective view showing a state in which the top cover 40 and the rear cover 50 are removed from the main body 20.
- the main body unit 20 includes two housing units 100, a mother board 200, and the like.
- the housing unit 100 can house an external device equipped with, for example, an HDD or an SSD (Solid State Drive).
- the accommodating part 100 is provided in the metal frame 101 of the main body part 20 using metal.
- the housing part 100 has a structure in which a housing part upper surface 101 ′, which is a part of the metal frame 101, comes into contact with outside air. Therefore, the accommodating part 100 can radiate the heat generated inside from the accommodating part upper surface 101 ′ to the outside air.
- the two storage units 100 stores the HDD unit 300 that is an external device, but the other storage unit 100 can also store the HDD unit 300.
- the number of the accommodating parts 100 with which the main-body part 20 is provided is not limited, The accommodating part 100 may be one and may also be provided with the several accommodating part 100 further.
- the mother board 200 that functions as a control unit of the POS terminal device 10, for example, electronic components such as a CPU (Central Processing Unit) (not shown) are mounted.
- a CPU Central Processing Unit
- FIG. 3 is a perspective view showing the HDD unit 300 according to the present invention.
- the HDD unit 300 is housed in the housing unit 100 and is electrically connected to the mother board 200 via the cable 201.
- FIG. 4A is a perspective view showing the configuration of the HDD unit 300 housed in the housing unit 100.
- FIG. 4B is a perspective view of the HDD unit 300 viewed from a different angle from FIG. 4A.
- the HDD unit 300 includes an HDD main body 301, an HDD holder 302, and a heat radiation sheet 303 having a teardrop shape as viewed from the side (cross-sectional shape in the longitudinal direction).
- the HDD main body 301 has a built-in HDD.
- the HDD holder 302 holds the HDD main body 301.
- the HDD holder 302 has two longitudinal vibration damping dampers 304 that reduce the vibration in the longitudinal direction of the HDD main body 301 and one thickness vibration damping damper 305 that reduces the vibration in the thickness direction.
- the longitudinal direction vibration damping damper 304 and the thickness direction vibration damping damper 305 protect the HDD main body 301 from an impact or the like.
- the heat dissipation sheet 303 transmits heat generated by the HDD main body 301 to the housing unit 100.
- the heat radiating sheet 303 has, for example, thermal conductivity (thermal diffusibility) at least enough to transmit heat generated by the HDD main body 301 to the housing unit 100. Further, the heat dissipation sheet 303 is not damaged at least when bent and formed into a teardrop shape when viewed from the side, and after housing the HDD unit 300 in the housing unit 100, the contact with the ceiling of the housing unit 100 and the HDD Flexibility is sufficient to maintain the contact with the upper surface of the main body 301 for a predetermined period (in this embodiment, 5 years).
- the heat dissipation sheet 303 is attached to the HDD holder 302 with a fixing tape 306 or the like.
- the fixing tape 306 has heat resistance that is at least not deteriorated or damaged by heat transmitted from the HDD main body 301 to the heat radiation sheet 303.
- both ends thereof are stuck with a tape or the like so as to form a teardrop shape when viewed from the side.
- the place where the fixing tape 306 is applied is, for example, the back surface of the surface provided with the longitudinal vibration damping damper 304.
- FIG. 5 is a diagram showing only the HDD unit 300 in a state of being accommodated in the accommodating unit 100 (see FIG. 6A).
- the heat radiation sheet 303 having a teardrop shape is deformed along the longitudinal direction on the upper surface of the HDD main body 301.
- the heat radiation sheet 303 and the ceiling of the housing portion 100 come into contact with each other, and the heat radiation sheet 303 and the upper surface of the HDD main body portion 301 come into contact with each other.
- the heat radiation sheet 303 is flexible and has a teardrop shape, an accident such as the heat radiation sheet 303 being caught in the housing part 100 when the HDD unit 300 is housed in or taken out from the housing part 100 occurs. Can be prevented.
- an elastic body having thermal conductivity and stretchability and having a shape viewed from the side (longitudinal sectional shape) in a teardrop shape or a similar shape is used. May be.
- the shape similar to the teardrop shape is, for example, an inclined surface that gradually inclines from one end on the side to be inserted into the housing portion 100 toward the other end, and the other end is rounded. Shape. That is, when the HDD unit 300 is housed in the housing unit 100 or taken out, the heat radiation sheet 303 can be prevented from being caught on the housing unit 100.
- Such an elastic body can produce the same effect as the case where the heat dissipation sheet 303 is used.
- FIG. 6A is a cross-sectional view taken along the line A-A ′ of FIG. 2
- FIG. 6B is a perspective view illustrating a state in which the HDD unit 300 is accommodated in the accommodating portion 100.
- the heat radiating sheet 303 and the ceiling of the accommodating portion 100 abut, and the heat radiating sheet 303 and the upper surface of the HDD main body 301 abut.
- the heat dissipation sheet 303 has thermal conductivity
- the HDD main body 301 and the housing portion 100 are thermally connected via the heat dissipation sheet 303.
- the heat generated by the HDD main body 301 is transmitted to the housing unit 100 via the heat dissipation sheet 303.
- the housing unit 100 can cool the HDD unit 300 by radiating the heat transmitted from the heat radiating sheet 303 from the housing unit upper surface 101 ′ to the outside air.
- FIG. 7A is a cross-sectional view illustrating a state in which the HDD unit 300 is pulled out from the housing unit 100
- FIG. 7B is a perspective view illustrating a state in which the HDD unit 300 is pulled out from the housing unit 100.
- the HDD unit 300 is pulled out from the housing portion 100, and the heat dissipation sheet 303 is also pulled out at the same time. Therefore, when work such as replacement or maintenance of the heat dissipation sheet 303 becomes necessary, the work can be easily performed without disassembling the housing portion 100.
- the storage unit 100 can also store an SSD unit equipped with an SSD. Since the SSD generates a small amount of heat, unlike the HDD, it is not necessary to attach the heat dissipation sheet 303.
- the heat dissipation mechanism as in Patent Document 1 since the heat dissipation structure is incorporated in the housing portion, an unnecessary heat dissipation structure is provided even when an SSD unit with a small heat generation amount is housed, which is wasteful in cost. Occurs.
- the present invention is advantageous over the heat dissipation structure as disclosed in Patent Document 1 from the viewpoint of cost because the heat dissipation sheet 303 is not attached when an SSD unit equipped with an SSD is used.
- the heat dissipation structure of the external device in the electronic device having a housing part that detachably accommodates the external device,
- a heat dissipation structure for an external device comprising a heat dissipation portion that is detachably attached to the external device and has heat conductivity that transfers heat generated by the external device to the housing portion.
- Appendix 2 The heat dissipation structure for an external device according to appendix 1, wherein the heat dissipating unit is attached to the external device so as to be in contact with the housing unit when the external device is stored in the storage unit.
- Appendix 3 3. The heat dissipation structure for an external device according to appendix 1 or 2, wherein the heat dissipating part is a flexible sheet having end portions bonded together so that the cross section has a teardrop shape.
- Appendix 4 3. The heat dissipation structure for an external device according to appendix 1 or 2, wherein the heat dissipating part has a teardrop shape or a shape similar to a teardrop shape and is an elastic body having elasticity.
- Appendix 5 The heat dissipation structure for an external device according to any one of appendices 1 to 4, wherein the housing portion is provided on a metal frame of the electronic device.
- Appendix 6 The external device according to any one of appendices 1 to 5, wherein the external device is an HDD unit including an HDD main body and an HDD holder that holds the HDD main body, and the heat dissipation portion is attached to the HDD holder. Heat dissipation structure.
- An electronic device having a housing part that detachably houses an external device,
- the external device is an electronic device in which a heat dissipating part having heat conductivity for transferring heat generated by the external device to the housing part is detachably attached.
- Appendix 8 The electronic device according to appendix 7, wherein the heat radiating unit is attached to the external device so as to come into contact with the housing unit when the external device is housed in the housing unit.
- Appendix 9 The electronic device according to appendix 7 or 8, wherein the heat radiating portion is a flexible sheet in which end portions are bonded so that a cross section has a teardrop shape.
- Appendix 10 The electronic device according to appendix 7 or 8, wherein the heat radiating section has a teardrop shape or a shape similar to a teardrop shape, and is an elastic body having elasticity.
- Appendix 11 The electronic device according to any one of appendices 7 to 10, wherein the housing portion is provided on a metal frame of the electronic device.
- Appendix 12 The electronic device according to any one of appendices 7 to 11, wherein the external device is an HDD unit including an HDD main body portion and an HDD holder that holds the HDD main body portion, and the heat dissipation portion is attached to the HDD holder. .
- Appendix 13 It is an external device that is detachably housed in the housing portion of the electronic device, An external device in which a heat dissipating part having heat conductivity for transferring heat generated by the external device to the housing part is detachably attached.
- Appendix 14 The external device according to appendix 13, wherein the heat radiating unit is attached to the external device so as to come into contact with the storage unit when the external device is stored in the storage unit.
- Appendix 15 15. The external device according to appendix 13 or 14, wherein the heat radiating portion is a flexible sheet having end portions bonded together so that the cross section has a teardrop shape.
- Appendix 16 15. The external device according to appendix 13 or 14, wherein the heat radiating section has a teardrop shape or a shape similar to a teardrop shape, and is an elastic body having elasticity.
- Appendix 17 The external device according to any one of appendices 13 to 16, wherein the housing portion is provided on a metal frame of the electronic device.
- Appendix 18 The external device according to any one of appendices 13 to 17, wherein the electronic device is a POS terminal device.
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- Thermal Sciences (AREA)
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Abstract
Description
本発明に係る実施形態について図面を適宜参照して説明する。
外部機器を着脱可能に収容する収容部を備えた電子機器における前記外部機器の放熱構造であって、
前記外部機器に取り外し可能に取り付けられ、前記外部機器が発する熱を前記収容部に伝える熱伝導性を有する放熱部を備える、外部機器の放熱構造。
前記放熱部は、前記収容部に前記外部機器を収容した際に、前記収容部と接するように前記外部機器に取り付けられている、付記1に記載の外部機器の放熱構造。
前記放熱部は、断面が涙滴形状となるように端部を張り合わせた可撓性を有するシートである、付記1または2に記載の外部機器の放熱構造。
前記放熱部は、断面が涙滴形状、もしくは涙滴形状に類似する形状であり、伸縮性を有する弾性体である、付記1または2に記載の外部機器の放熱構造。
前記収容部は、前記電子機器の金属フレームに設けられている、付記1~4のいずれか1つに記載の外部機器の放熱構造。
前記外部機器は、HDD本体部と、それを保持するHDDホルダから成るHDDユニットであって、前記放熱部は前記HDDホルダに取り付けられる、付記1~5のいずれか1つに記載の外部機器の放熱構造。
外部機器を着脱可能に収容する収容部を備えた電子機器であって、
前記外部機器は、該外部機器が発する熱を前記収容部に伝える熱伝導性を有する放熱部が取り外し可能に取り付けられている、電子機器。
前記放熱部は、前記収容部に前記外部機器を収容した際に、前記収容部と接するように前記外部機器に取り付けられている、付記7に記載の電子機器。
前記放熱部は、断面が涙滴形状となるように端部を貼りあわせた可撓性を有するシートである、付記7または8に記載の電子機器。
前記放熱部は、断面が涙滴形状、もしくは涙滴形状に類似する形状であり、伸縮性を有する弾性体である、付記7または8に記載の電子機器。
前記収容部は、前記電子機器の金属フレームに設けられている、付記7~10のいずれか1つに記載の電子機器。
前記外部機器は、HDD本体部と、それを保持するHDDホルダとから成るHDDユニットであって、前記放熱部は前記HDDホルダに取り付けられる、付記7~11のいずれか1つに記載の電子機器。
電子機器の収容部に着脱可能に収容された外部機器であって、
前記外部機器が発する熱を前記収容部に伝える熱伝導性を有する放熱部が取り外し可能に取り付けられている、外部機器。
前記放熱部は、前記収容部に前記外部機器を収容した際に、前記収容部と接するように前記外部機器に取り付けられている、付記13に記載の外部機器。
前記放熱部は、断面が涙滴形状となるように端部を張り合わせた可撓性を有するシートである、付記13または14に記載の外部機器。
前記放熱部は、断面が涙滴形状、もしくは涙滴形状に類似する形状であり、伸縮性を有する弾性体である、付記13または14に記載の外部機器。
前記収容部は、前記電子機器の金属フレームに設けられている、付記13~16のいずれか1つに記載の外部機器。
前記電子機器は、POS端末装置である、付記13~17のいずれか1つに記載の外部機器。
20・・・本体部
30・・・電源部
40・・・トップカバー
50・・・リアカバー
100・・・収容部
101・・・金属フレーム
101’・・・収容部上面
200・・・マザーボード
201・・・ケーブル
300・・・HDDユニット
301・・・HDD本体
302・・・HDDホルダ
303・・・放熱シート
304・・・長手方向防振ダンパ
305・・・厚み方向防振ダンパ
306・・・固定テープ
Claims (10)
- 外部機器を着脱可能に収容する収容部を備えた電子機器における前記外部機器の放熱構造であって、
前記外部機器に取り外し可能に取り付けられ、前記外部機器が発する熱を前記収容部に伝える熱伝導性を有する放熱部を備える、外部機器の放熱構造。 - 前記放熱部は、前記収容部に前記外部機器を収容した際に、前記収容部と接するように前記外部機器に取り付けられている、請求項1に記載の外部機器の放熱構造。
- 前記放熱部は、断面が涙滴形状となるように端部を張り合わせた可撓性を有するシートである、請求項1または2に記載の外部機器の放熱構造。
- 前記放熱部は、断面が涙滴形状、もしくは涙滴形状に類似する形状であり、伸縮性を有する弾性体である、請求項1または2に記載の外部機器の放熱構造。
- 前記収容部は、前記電子機器の金属フレームに設けられている、請求項1~3のいずれか1項に記載の外部機器の放熱構造。
- 前記外部機器は、HDD本体部と、それを保持するHDDホルダから成るHDDユニットであって、前記放熱部は前記HDDホルダに取り付けられる、請求項1~5のいずれか1項に記載の外部機器の放熱構造。
- 外部機器を着脱可能に収容する収容部を備えた電子機器であって、
前記外部機器は、該外部機器が発する熱を前記収容部に伝える熱伝導性を有する放熱部が取り外し可能に取り付けられている、電子機器。 - 前記放熱部は、前記収容部に前記外部機器を収容した際に、前記収容部と接するように前記外部機器に取り付けられている、請求項7に記載の電子機器。
- 電子機器の収容部に着脱可能に収容される外部機器であって、
前記外部機器が発する熱を前記収容部に伝える熱伝導性を有する放熱部が取り外し可能に取り付けられている、外部機器。 - 前記放熱部は、前記収容部に前記外部機器を収容した際に、前記収容部と接するように前記外部機器に取り付けられている、請求項9に記載の外部機器。
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US15/306,135 US9952637B2 (en) | 2014-10-28 | 2015-07-21 | Heat dissipation structure for external apparatus, electronic apparatus, and external apparatus |
CN201580023547.6A CN106255936B (zh) | 2014-10-28 | 2015-07-21 | 用于外部设备的散热结构、电子设备以及外部设备 |
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JP2014-219466 | 2014-10-28 | ||
JP2014219466A JP5854487B1 (ja) | 2014-10-28 | 2014-10-28 | 外部機器の放熱構造、電子機器、及び外部機器 |
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2015
- 2015-07-21 US US15/306,135 patent/US9952637B2/en active Active
- 2015-07-21 WO PCT/JP2015/003642 patent/WO2016067492A1/ja active Application Filing
- 2015-07-21 MY MYPI2016703967A patent/MY171626A/en unknown
- 2015-07-21 CN CN201580023547.6A patent/CN106255936B/zh active Active
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JP2008282074A (ja) * | 2007-05-08 | 2008-11-20 | Matsushita Electric Ind Co Ltd | 放熱機構 |
JP2008310855A (ja) * | 2007-06-12 | 2008-12-25 | Hitachi Ltd | 電子機器 |
Also Published As
Publication number | Publication date |
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CN106255936B (zh) | 2018-03-30 |
US9952637B2 (en) | 2018-04-24 |
US20170052574A1 (en) | 2017-02-23 |
CN106255936A (zh) | 2016-12-21 |
MY171626A (en) | 2019-10-21 |
JP2016085682A (ja) | 2016-05-19 |
JP5854487B1 (ja) | 2016-02-09 |
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