WO2016060051A1 - Circuit substrate equipped with heat sink, and method for manufacuring circuit substrate equipped with heat sink - Google Patents

Circuit substrate equipped with heat sink, and method for manufacuring circuit substrate equipped with heat sink Download PDF

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Publication number
WO2016060051A1
WO2016060051A1 PCT/JP2015/078554 JP2015078554W WO2016060051A1 WO 2016060051 A1 WO2016060051 A1 WO 2016060051A1 JP 2015078554 W JP2015078554 W JP 2015078554W WO 2016060051 A1 WO2016060051 A1 WO 2016060051A1
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WIPO (PCT)
Prior art keywords
resin sheet
heat sink
conductor layer
resin
composite
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PCT/JP2015/078554
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French (fr)
Japanese (ja)
Inventor
浩樹 井出
曽根　靖博
篤 堀居
武 西畑
Original Assignee
豊田鉄工株式会社
利昌工業株式会社
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Application filed by 豊田鉄工株式会社, 利昌工業株式会社 filed Critical 豊田鉄工株式会社
Publication of WO2016060051A1 publication Critical patent/WO2016060051A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a circuit board with a heat sink in which an increase in contact thermal resistance is suppressed and a method for manufacturing the circuit board with a heat sink.
  • circuit board with a heat sink in which a conductor layer constituting a circuit and one surface of a metal heat sink are integrated via an insulating layer.
  • high heat dissipation circuit boards with heat sinks include inverter boards for electric vehicles (EV) / hybrid vehicles (HEV), aluminum boards for PCs, and other in-vehicle applications such as headlamps, instrument panels, electric power steering, DCDC. It can be widely used for converters, ABS modules and motor drivers.
  • FIG. 8 is a diagram showing a hot pressing step in a conventional method for manufacturing a circuit board with a heat sink in Patent Document 1, for example.
  • an inorganic filler and a thermosetting resin are mainly used as a precursor of the insulating layer 110 in which the insulating layer 110 is formed by being cured under heat and pressure by a hot press process.
  • the two-layer insulating composition 112, which is a major component, is heated and pressed by the hot press 116 with the release layer 114 used in the insulating composition preparation process facing each other, and the thermosetting resin is cured.
  • FIG. 8B an insulating layer 110 in which two insulating compositions are thermocompression bonded is obtained.
  • one of the release layers 114 on both sides is removed.
  • the heat sink is integrated with the surface of the insulating layer 110 from which the release layer 114 has been removed to form a heat sink with an insulating layer.
  • the heat generating element as a circuit board is formed on the insulating layer 110 of the heat sink with the insulating layer.
  • a circuit board with a heat sink is configured by adhering the modules provided with.
  • the heat sink with an insulating layer of Patent Document 1 since the heat sink with an insulating layer of Patent Document 1 has a large thickness and the conventional general-purpose line has a limit on the thickness that can be etched, it is integrated with the insulating layer 110 of the heat sink with an insulating layer, for example.
  • the etching process of the conductor layer cannot be performed.
  • the insulating layer 110 is in a so-called B-stage state, which is a semi-cured state before complete curing that can be pressure-bonded to the heat sink, and is chemically changed by the action of the etching solution.
  • the present invention has been made against the background of the above circumstances.
  • the object of the present invention is to provide a circuit board with a heat sink and a heat sink in which a conductor layer can be etched on a general-purpose line and an increase in thermal resistance is suppressed. It is providing the manufacturing method of an attached circuit board.
  • the gist of the first invention is that a conductor layer constituting a circuit and one surface of a large-capacity heat sink are integrated via an insulating layer, and the insulating layer is thermocoupled to each other.
  • a circuit board with a heat sink including two resin sheets, wherein at least one of the pair of first and second resin sheets at the time of pressure bonding is uneven on the pressure bonding surface of the first resin sheet having a higher hardness than the second resin sheet. Is formed, and the first resin sheet and the second resin sheet are bonded together by an anchor effect.
  • the circuit board with a heat sink of the first invention at least at the time of pressure bonding, an unevenness is formed on the pressure-bonding surface of the first resin sheet having higher hardness than the second resin sheet among the pair of first and second resin sheets.
  • the first resin sheet and the second resin sheet are bonded together by an anchor effect. Therefore, it is possible to etch the conductor layer on the general-purpose line before fixing the heat sink, and the insulating layer of the circuit board with the heat sink is integrated with the first resin sheet and the second resin sheet by the anchor effect. Since it is couple
  • the insulating layer is composed of two layers, the one resin sheet and the other resin sheet. For this reason, while the insulating layer of the circuit board with a heat sink is thickened, the insulating performance is improved, the adhesion between the resin sheets is enhanced, and the increase in thermal resistance is suppressed.
  • the gist of the manufacturing method of the circuit board with a heat sink of the second invention is that the conductor layer constituting the circuit and one surface of the large capacity heat sink are integrated through an insulating layer, and the insulating layers are thermocompression bonded to each other.
  • a method of manufacturing a circuit board with a heat sink including a pair of first and second resin sheets, wherein the first resin sheet is used as a first conductor layer and a first resin sheet constituting a circuit.
  • the first resin of the second composite through a sheet Lies in comprising a third step of vacuum hot pressed at state superposed over preparative and the heat sink. For this reason, an unevenness is formed on the first resin sheet on which the second resin sheet is overlaid, and an insulating layer is formed in which the first resin sheet and the second resin sheet are pressure-bonded by the anchor effect.
  • a two-layer circuit board with a heat sink in which the adhesion between the first resin sheet and the second resin sheet is enhanced and the increase in thermal resistance is suppressed is obtained.
  • the first conductor layer constituting the circuit is etched before the heat sink is pressure-bonded to the second resin sheet, a circuit board with a heat sink that can be applied to a conventional general-purpose line with a limited thickness is manufactured. A method can be provided.
  • the gist of the method for manufacturing a circuit board with a heat sink of the third invention is that a conductor layer constituting a circuit and one surface of a large-capacity heat sink are integrated via an insulating layer, and the insulating layers are thermocompression bonded to each other.
  • a method of manufacturing a circuit board with a heat sink including a pair of first and second resin sheets, wherein the first resin sheet is used as a first conductor layer and a first resin sheet constituting a circuit.
  • a similar process includes a fourth step of obtaining a fourth composite and a fifth step of vacuum hot pressing in a state where the fourth composite and the heat sink are overlapped. For this reason, a circuit board with a heat sink comprising an insulating layer composed of three layers of the first resin sheet, the second resin sheet, and a plurality of the third resin sheets, and a rise in thermal resistance is suppressed. can get.
  • the first conductor layer constituting the circuit is etched before the heat sink is pressure-bonded to the third resin sheet, so that the heat sink with a heat sink applicable to a conventional general-purpose line with a limited thickness is provided.
  • a method for manufacturing a circuit board can be provided.
  • the conductor layer is an electrolytic copper foil having a high thermal conductivity having a thickness of 200 ⁇ m or less, or a rolled copper foil subjected to chemical conversion treatment, and more preferably with the first resin sheet.
  • the conductor layer is not limited to the above, and if the first resin sheet is sufficiently pressure-bonded to the first resin sheet by curing, the thickness of the conductor layer may be greater than 200 ⁇ m, for example.
  • the rolled copper foil does not need to be subjected to chemical conversion treatment.
  • the conductor layer may be an electrolytic aluminum foil or a chemical-treated rolled aluminum foil.
  • the first resin sheet, the second resin sheet, and the third resin sheet are a thermosetting resin, an inorganic filler, and a curing agent and a curing accelerator that are contained as necessary. And a resin composition in which a volatile solvent is mixed is formed into a plate shape.
  • the first resin sheet, the second resin sheet, and the third resin sheet may have the same composition or different compositions.
  • thermosetting resin is not particularly limited, and for example, an epoxy resin and a phenol resin are preferably exemplified. More preferably, there is an epoxy resin that has good heat resistance and moisture resistance, has excellent adhesiveness, and allows the resin sheets to be more strongly pressure-bonded by an anchor effect.
  • the epoxy resin is, for example, a normal temperature solid bisphenol A type epoxy resin having an epoxy equivalent of 450 to 2000 g / eq, and a polyfunctional normal temperature solid having an epoxy equivalent of 160 to 220 g / eq, of 87 ° to 93 °.
  • the viscosity of the resin sheet is moderately reduced during the vacuum hot press treatment, and voids are well removed.
  • the inorganic filler includes particles such as boron nitride, aluminum nitride, silicon nitride, gallium nitride, aluminum oxide, silicon carbide, silicon dioxide, magnesium oxide and diamond. More preferably, the particle
  • a curing agent and a curing accelerator of the epoxy resin are contained. May be.
  • the curing agent includes, for example, amine curing agents such as diaminodiphenyl sulfone, dicyandiamide, diaminodiphenylmethane, triethylenetetramine, phenol novolac resin, aralkyl type phenol resin, dicyclopentadiene modified phenol resin, naphthalene.
  • amine curing agents such as diaminodiphenyl sulfone, dicyandiamide, diaminodiphenylmethane, triethylenetetramine, phenol novolac resin, aralkyl type phenol resin, dicyclopentadiene modified phenol resin, naphthalene.
  • Phenolic curing agents such as type phenolic resin and bisphenolic phenolic resin, and acid anhydrides.
  • examples of the curing accelerator include amine-based curing accelerators such as imidazoles, triphenyl phosphate (TPP), and boron trifluoride monoethylamine.
  • amine-based curing accelerators such as imidazoles, triphenyl phosphate (TPP), and boron trifluoride monoethylamine.
  • the volatile solvent preferably has a boiling point of 120 ° C. or less in that it easily volatilizes after coating.
  • the resin composition of the first resin sheet, the second resin sheet, and the third resin sheet is dispersed within a range that does not impair the effects of the present invention in addition to the above.
  • Agents, tackifiers, antioxidants, antioxidants, processing aids, stabilizers, antifoaming agents, flame retardants, thickeners, pigments and the like may be included.
  • the large-capacity heat sink is formed of a metal having high thermal conductivity such as aluminum or copper and has high heat dissipation performance. More preferably, the large-capacity heat sink has, for example, a plate thickness larger than 3 mm, or a surface opposite to the side bonded to the resin sheet is not flat and has, for example, a radiation fin. Any one of these configurations or both configurations are included.
  • the vacuum hot press treatment is performed by thermocompression bonding between the first resin sheet and the second resin sheet and thermocompression bonding between the second resin sheet and the third resin sheet.
  • the uncured resin sheet on the lower hardness side is firmly bonded by the anchor effect due to the unevenness of the pressure-bonding surface of the higher hardness resin sheet and the voids are removed well, for example, 0 It is pressed at a pressure of 2 MPa at a temperature of 140 to 180 degrees under a reduced pressure of 0.02 MPa or less, more preferably 0.015 to 0.02 MPa.
  • the pressure may be reduced to about 0.001 MPa, for example.
  • an electrolytic copper foil having a rough surface is used for the second conductor layer so that the first resin sheet is roughened to form irregularities after the etching process.
  • FIG. 1 is a front view showing a circuit board 10 with a heat sink, which is an example of the present invention.
  • FIG. 2 is a perspective view showing the circuit board 10 with a heat sink.
  • the circuit board 10 with a heat sink is configured such that a circuit 12 made of copper foil and one surface of a large-capacity heat sink 14 (hereinafter referred to as “heat sink 14”) are integrated with an insulating layer 16 interposed therebetween.
  • the insulating layer 16 is composed of a pair of resin sheets in which a first resin sheet 18 and a second resin sheet 20 are thermocompression bonded to each other.
  • the first resin sheet 18 and the second resin sheet 20 have the same composition, and are solid at room temperature and plate-like by applying a resin composition mainly composed of an epoxy resin that is a thermosetting resin.
  • the uncured resin sheet formed in (1) is cured by thermocompression treatment and formed to a thickness of 60 ⁇ m.
  • the composition of the resin composition constituting the first resin sheet 18 and the second resin sheet 20 is, for example, 50 parts by mass of a bisphenol A type epoxy resin, 50 parts by mass of a novolac type epoxy resin, and 19.8 parts by mass of an amine curing agent. Part, an amine accelerator 1.5 parts by mass, a boron nitride filler 241.4 parts by mass and methyl ethyl ketone 400 parts by mass.
  • the first resin sheet 18 has already been cured to some extent, and has a higher hardness than the second resin sheet 20, and Concavities and convexities are formed on the pressure-bonding surface of the first resin sheet 18 and the second resin sheet 20, and the first resin sheet 18 and the second resin sheet 20 are joined by an anchor effect due to the concavities and convexities. Thereby, the raise of the thermal resistance between the 1st resin sheet 18 and the 2nd resin sheet 20 is suppressed.
  • the circuit 12 includes a first conductor layer 22 made of a rolled copper foil having a thickness of 200 ⁇ m or less, which is roughened so that at least one surface has unevenness of several ⁇ m to several tens of ⁇ m by chemical conversion treatment or sandblasting treatment. The roughened surface is pressure-bonded in a state of facing the first resin sheet 18 and then etched to a desired size.
  • FIG. 3 is a perspective view showing the heat sink 14 provided in the circuit board 10 with the heat sink.
  • the heat sink 14 is made of aluminum having high thermal conductivity as shown in FIGS. 2 and 3, and the plate thickness is 3 mm or more.
  • the circuit board with heat sink 10 configured in this way has heat from the power element fixed to the circuit 12 by the insulating layer 16 composed of two layers of the first resin sheet 18 and the second resin sheet 20.
  • the circuit board with heat sink 10 configured in this way has heat from the power element fixed to the circuit 12 by the insulating layer 16 composed of two layers of the first resin sheet 18 and the second resin sheet 20.
  • EV electric vehicle
  • HEV hybrid vehicle
  • the vacuum hot press process is performed with the first resin sheet 18 sandwiched between the first conductor layer 22 and the second conductor layer 26 constituting the circuit 12.
  • the first composite 28 is obtained.
  • the second conductor layer 26 is an electrolytic copper foil having a rough surface, and is used for roughening the surface of the first resin sheet 18 to form irregularities by being removed by an etching process described later.
  • the first conductor layer 22 is so arranged that the uncured first resin sheet 18 coated with the resin composition faces one surface on the rough side of the surface of the first conductor layer 22.
  • the first resin sheet 18 is polymerized by being pressed with a pressure of 2 MPa at a temperature of 140 to 180 degrees under a reduced pressure of 0.02 MPa, for example, in a state sandwiched between the first and second conductor layers 26. Is progressed and cured, so that the first composite sheet 18 is integrated by being crimped in a state where the first resin sheet 18 is sandwiched between the first conductor layer 22 and the second conductor layer 26. 28 is configured.
  • the void on the bonding surface of the first resin sheet 18 with the first conductor layer 22 and the second conductor layer 26 is removed under vacuum conditions, and the uncured first resin sheet 18 is
  • the first resin sheet 18 and the first conductor layer 22 constituting the first composite are cured by being pressed into the irregularities on the surfaces of the first conductor layer 22 and the second conductor layer 26 by the pressing pressure. And the second conductor layer 26 are firmly bonded.
  • the second conductor layer 26 is removed from the first composite 28 by the etching process, and the first conductor layer 22 is removed leaving a desired shape to form the circuit 12.
  • a second composite 30 is formed. Since the first composite 28 configured in the first step is heat-treated at a high temperature of 140 to 180 degrees, the first resin sheet 18 is cured to a completely cured state or a state almost completely cured. Therefore, it is easily processed by a known etching method without considering chemical modification by the etching solution. After the second conductor layer 26 is removed, the surface of the first resin sheet 18 on the side from which the second conductor layer 26 has been removed is transferred by transferring irregularities on the surface of the second conductor layer 26. Concavities and convexities are formed on the surface.
  • the uncured second resin sheet 20 is superimposed on the uneven surface of the first resin sheet 18 of the second composite 30, and the second resin A circuit board 10 with a heat sink having an insulating layer 16 composed of two layers of a first resin sheet 18 and a second resin sheet 20 is subjected to a vacuum hot press process with the heat sink 14 superimposed on the sheet 20.
  • the vacuum hot press process in the third step is performed under the same conditions as the vacuum hot press process in the first step.
  • the first resin sheet that has already been cured in the vacuum hot press process in the first step in the pressure bonding between the first resin sheet 18 and the second resin sheet 20 is performed under the same conditions as the vacuum hot press process in the first step.
  • the first resin sheet 18 and the second resin sheet 20 out of the pair of the first resin sheet 18 and the second resin sheet 20 are at least pressed in the vacuum hot press process of the third process. Concavities and convexities are formed on the pressure-bonding surface of the first resin sheet 18 having a higher hardness than the second resin sheet 20, and the first resin sheet 18 and the second resin sheet 20 are joined together by an anchor effect.
  • the first conductor layer 22 can be etched on the general-purpose line before the heat sink 14 is fixed, and the insulating layer 16 of the circuit board 10 with the heat sink is composed of the first resin sheet 18 and the second resin sheet. Since 20 is integrally coupled by the anchor effect, the adhesion between the resin sheets is enhanced, and an increase in thermal resistance is suppressed.
  • the insulating layer 16 is composed of two layers of the first resin sheet 18 and the second resin sheet 20. For this reason, the thickness of the insulating layer 16 of the circuit board 10 with the heat sink is increased to improve the insulating performance, and the adhesion between the first resin sheet 18 and the second resin sheet 20 is enhanced, The increase in resistance is suppressed.
  • the first resin sheet 18 is fixed to the first conductor layer 22 and the first resin sheet 18 that constitute the circuit 12.
  • the first resin sheet 18 of the second composite 30 and the heat sink 14 are overlapped with each other through the uncured second resin sheet 20 having a lower hardness than the first resin sheet 18 cured to some extent in the first step.
  • a third step of vacuum hot pressing in the combined state is included. For this reason, the first resin sheet 18 on which the second resin sheet 20 is overlaid is formed with irregularities, and the insulating layer 16 in which the first resin sheet 18 and the second resin sheet 20 are pressure-bonded by the anchor effect is formed.
  • the two-layered circuit board 10 with the heat sink in which the adhesion between the first resin sheet 18 and the second resin sheet 20 is enhanced and the increase in thermal resistance is suppressed is obtained.
  • the first conductor layer 22 constituting the circuit 12 is etched before the heat sink 14 is pressure-bonded to the second resin sheet 20, the heat sink 14 can be applied to a conventional general-purpose line with a limited thickness. A method for manufacturing the circuit board 10 can be provided.
  • the circuit board 32 with the heat sink of the present embodiment has the first conductor layer 22 constituting the circuit 12 and one surface of the heat sink 14 through the insulating layer 34.
  • the insulating layer 34 is integrated, and the first resin sheet 18 and the second resin sheet 20 bonded by the anchor effect are uncured third resin sheet 36 on the surface of the second resin sheet 20.
  • the third resin sheet 36 has a three-layer structure in which the second resin sheet 20 is bonded to the second resin sheet 20 by an anchor effect, and the thickness thereof is increased.
  • the third resin sheet 36 has the same composition as the first resin sheet 18 and the second resin sheet 20, and is subjected to normal temperature by applying a resin composition mainly composed of an epoxy resin that is a thermosetting resin.
  • An uncured resin sheet formed into a solid and plate shape is cured by a thermocompression treatment and formed to a thickness of about 60 ⁇ m.
  • the heat sink 14 is coupled to the surface of the third resin sheet 36 opposite to the pressure-bonding surface of the second resin sheet 20.
  • the manufacturing method of the circuit board 32 with the heat sink is the same process until the end of the second process in which the second composite 30 is obtained by the etching process in Example 1 described above. Therefore, hereinafter, the third step and the following steps different from those of the first embodiment will be described with reference to FIG.
  • the second resin sheet 20 is superimposed on the first resin sheet 18 of the second composite, and the first resin sheet 18 of the second resin sheet 20 is overlapped.
  • a vacuum hot press process is performed in a state where the third conductor layer 38 is superimposed on the surface opposite to the surface to be superimposed, and the third composite 40 is obtained.
  • the third conductor layer 38 is an electrolytic copper foil having a rough surface, and is used for roughening the surface of the second resin sheet 20 by being removed by an etching process described later.
  • the uncured second resin sheet 20 coated with the resin composition faces the uneven surface of the first resin sheet 18 of the second composite 30.
  • the pressure is 2 MPa at a temperature of 140 to 180 degrees.
  • the second resin sheet 20 is pressed with the pressure, and the polymerization of the epoxy resin of the second resin sheet 20 proceeds and is cured, so that the second resin sheet 20 and the first resin sheet 18 of the second composite 30 and the third resin sheet 20 are cured.
  • a third composite body 40 is formed by being crimped in a state of being sandwiched between the conductor layers 38.
  • the voids on the bonding surface of the second resin sheet 20 to the first resin sheet 18 and the third conductor layer 38 are removed under vacuum conditions, and the uncured second resin sheet 20 is
  • the resin is already cured in the first step and cured while entering the unevenness formed on the surface of the first resin sheet 18 having a higher hardness than the second resin sheet 20 and the unevenness on the surface of the third conductor layer 38. Therefore, the first resin sheet 18, the second resin sheet 20, and the third conductor layer 38 constituting the third composite body 40 are firmly bonded.
  • the third conductor layer 38 is removed from the third composite 40 by the etching process, and the fourth composite 42 is configured.
  • the second resin sheet 20 is cured to a fully cured state or a state close to complete curing by a heat treatment at a high temperature of 140 to 180 degrees in the third step. It can be easily processed by a known etching method without taking into account any modification.
  • the surface of the second resin sheet 20 on the side where the third conductor layer 38 is removed by transferring the irregularities on the surface of the third conductor layer 38. Concavities and convexities are formed on the surface.
  • the uncured third resin sheet 36 is superimposed on the surface of the fourth composite 42 having the irregularities of the second resin sheet 20, and the third resin
  • a vacuum hot press process is performed in a state where the heat sink 14 is superimposed on the sheet 36, and an insulating layer 34 composed of three layers of the first resin sheet 18, the second resin sheet 20, and the third resin sheet 36.
  • a circuit board 32 with a heat sink having the above is configured.
  • the vacuum hot press process in the fifth step is performed under the same conditions as the vacuum hot press process in the first step and the third step.
  • the second resin in which the third resin sheet 36 is cured while the uncured third resin sheet 36 having a lower hardness than that of the second resin sheet 20 enters the unevenness formed on the surface of the second resin sheet 20. Due to the so-called anchor effect between the sheet 20 and the third resin sheet 36, the second resin sheet 20 and the third resin sheet 36 are firmly coupled, and the third resin sheet 36 is vacuum-processed. Voids on the bonding surface with the second resin sheet 20 are removed. Further, the third resin sheet 36 and the heat sink 14 are bonded together by the uncured third resin sheet 36 being cured while being pressed against the surface of the heat sink 14 opposite to the heat dissipating fins 24. .
  • the first resin sheet 18 is uneven on the surface on the side fixed to the first conductor layer 22 and the first resin sheet 18 constituting the circuit 12.
  • the uncured second resin sheet 20 having a lower hardness than the first resin sheet 18 is overlaid on the surface having the irregularities formed in the second step of the first resin sheet 18 of the second composite 30, and the first Of the second resin sheet 20 and the first resin sheet 18.
  • the first resin sheet 18 and the second resin sheet 20 are bonded to each other by the anchor effect by vacuum hot pressing in a state where the third conductor layer 38 is overlapped so as to face the surface opposite to the contact surface.
  • the third step of obtaining the third composite 40, and the third conductor layer 38 is removed by the etching process, so that the fourth composite 42 in which irregularities are formed on the surface of the second resin sheet 20 is obtained.
  • the third resin sheet 36 having a lower hardness than the second resin sheet 20 is bonded to the second resin sheet 20 on which the unevenness of the fourth composite 42 is formed, by the anchor effect, 3 and the 5th process of performing a vacuum hot press process so that the resin sheet 36 and the heat sink 14 may be couple
  • FIG. 6 is a perspective view of the circuit board with heat sink 44 of the present embodiment.
  • the circuit board with heat sink 44 is configured by integrating the first conductor layer 22 constituting the circuit 12 and one surface of the heat sink 46 with the insulating layer 16 interposed therebetween.
  • the heat sink 46 is a large-capacity heat sink formed of aluminum having high thermal conductivity and having a plate thickness larger than 3 mm, and is bonded to the second resin sheet 20 by curing the second resin sheet 20 of the insulating layer 16. ing.
  • circuit board with heat sink 44 of the present embodiment can obtain the same effects as the circuit board 10 with heat sink of the first embodiment.
  • FIG. 7 is a perspective view showing the circuit board 48 with the heat sink, that is, the heat sink 50 of the present embodiment in a state where the circuit 12 is removed.
  • the circuit board 48 with the heat sink is configured by integrating the first conductor layer 22 constituting the circuit 12 and one surface of the heat sink 50 via the insulating layer 16.
  • the heat sink 50 is a large-capacity heat sink that is formed of aluminum having high thermal conductivity, has a plate thickness larger than 3 mm, and has heat radiating fins 52 protruding from one surface of the aluminum plate at equal intervals in the vertical and horizontal directions.
  • the second resin sheet 20 is bonded to the second resin sheet 20 by curing.
  • circuit board 48 with the heat sink of the present embodiment can obtain the same effects as the circuit board 10 with the heat sink of the first embodiment.
  • the insulating layer 16 of the circuit board with heat sink 10 of Example 1 and the insulating layer 34 of the circuit board 32 with heat sink of Example 2 are composed of two or three resin sheets.
  • the present invention is not limited to this.
  • the hardness of the third composite body 40 obtained by the third step of the above-described second embodiment is lower than that of the second resin sheet 20 at least during pressure bonding.
  • a circuit board with a heatsink provided with an insulating layer composed of four or more resin sheets may be obtained by repeating steps similar to the second step and the third step using a resin sheet.
  • the second resin sheet combined with the heat sink of Example 1 described above may contain glass fibers. If it does in this way, the adhesiveness of a 2nd resin sheet and a heat sink will improve with the glass fiber contained in a 2nd resin sheet.

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  • Physics & Mathematics (AREA)
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Abstract

Provided is a circuit substrate equipped with a heat sink, wherein an increase in thermal resistance can be suppressed, and a method for manufacturing a circuit substrate equipped with a heat sink. According to this circuit substrate (10) equipped with a heat sink, an insulation layer (16) includes a pair of resin sheets, that is, a first resin sheet (18) and a second resin sheet (20), which are bonded to each other by thermo-compression, and during the compression bonding in at least a third step, which is a vacuum heat pressing step, asperities are formed on the compression bonding surface of the first resin sheet (18), which has a higher hardness than the second resin sheet (20), and the first resin sheet (18) and the second resin sheet (20) are bonded by means of an anchor effect. Therefore, in the insulation layer (16) of the circuit substrate (10) equipped with a heat sink, the first resin sheet (18) and the second resin sheet (20) are integrally bonded to each other by means of the anchor effect, so the adhesion between the resin sheets is increased, an increase in thermal resistance is suppressed, and the heat dissipation performance is increased.

Description

ヒートシンク付回路基板およびヒートシンク付回路基板の製造方法Circuit board with heat sink and method for manufacturing circuit board with heat sink
　本発明は、接触熱抵抗の上昇が抑制されたヒートシンク付回路基板およびヒートシンク付回路基板の製造方法に関する。 The present invention relates to a circuit board with a heat sink in which an increase in contact thermal resistance is suppressed and a method for manufacturing the circuit board with a heat sink.
　回路を構成する導体層と金属製のヒートシンクの一面とが絶縁層を介して一体化されたヒートシンク付回路基板が知られている。このような高放熱性のヒートシンク付回路基板は、電気自動車（ＥＶ）／ハイブリッド車両（ＨＥＶ）用インバータの基板、ＰＣ用アルミ基板、その他車載用途たとえば、ヘッドランプ、メーターパネル、電動パワステアリング、ＤＣＤＣコンバータ、ＡＢＳモジュールおよびモータードライバなどに広く利用可能である。 There is known a circuit board with a heat sink in which a conductor layer constituting a circuit and one surface of a metal heat sink are integrated via an insulating layer. Such high heat dissipation circuit boards with heat sinks include inverter boards for electric vehicles (EV) / hybrid vehicles (HEV), aluminum boards for PCs, and other in-vehicle applications such as headlamps, instrument panels, electric power steering, DCDC. It can be widely used for converters, ABS modules and motor drivers.
　上記のような金属製ヒートシンクが備えられたヒートシンク付回路基板の絶縁層は、導体層の固着されたパワー素子からの熱をヒートシンクに伝える高熱伝導性を有するとともに、回路基板からヒートシンクを通じて外部へ電流が漏れることを防止するための絶縁性能を向上させるために、その厚みが必要に応じて厚くされる必要がある。絶縁層の厚さを確保するために、たとえば特許文献１に示すように、従来から様々な方法が提案されている。図８は、たとえば特許文献１における従来のヒートシンク付回路基板の製造方法のうちの熱プレス工程を示す図である。先ず、図８の（Ａ）では、熱プレス工程により加熱加圧条件下で硬化されることにより絶縁層１１０が形成される絶縁層１１０の前駆体としての、無機フィラーと熱硬化性樹脂を主な成分とする２層の絶縁組成物１１２が、絶縁組成物の調製工程において用いられた剥離層１１４を外側として相対向した状態で、熱プレス機１１６により加熱加圧され熱硬化性樹脂が硬化されることにより、図８（Ｂ）で示されるように２層の絶縁組成物が熱圧着された絶縁層１１０が得られる。そして、図８（Ｃ）で示されるように、両面の剥離層１１４のうちの一方が除去される。その後の工程で、絶縁層１１０の剥離層１１４が除去された面に対してヒートシンクが一体化されて、絶縁層付ヒートシンクが構成され、絶縁層付ヒートシンクの絶縁層１１０に回路基板としての発熱素子が設けられたモジュールが接着されて、ヒートシンク付回路基板が構成される。 The insulating layer of the circuit board with a heat sink provided with the metal heat sink as described above has high thermal conductivity that conducts heat from the power element to which the conductor layer is fixed to the heat sink, and current from the circuit board to the outside through the heat sink. In order to improve the insulation performance for preventing leakage, the thickness needs to be increased as necessary. In order to ensure the thickness of the insulating layer, various methods have been conventionally proposed as shown in Patent Document 1, for example. FIG. 8 is a diagram showing a hot pressing step in a conventional method for manufacturing a circuit board with a heat sink in Patent Document 1, for example. First, in FIG. 8A, an inorganic filler and a thermosetting resin are mainly used as a precursor of the insulating layer 110 in which the insulating layer 110 is formed by being cured under heat and pressure by a hot press process. The two-layer insulating composition 112, which is a major component, is heated and pressed by the hot press 116 with the release layer 114 used in the insulating composition preparation process facing each other, and the thermosetting resin is cured. As a result, as shown in FIG. 8B, an insulating layer 110 in which two insulating compositions are thermocompression bonded is obtained. Then, as shown in FIG. 8C, one of the release layers 114 on both sides is removed. In a subsequent process, the heat sink is integrated with the surface of the insulating layer 110 from which the release layer 114 has been removed to form a heat sink with an insulating layer. The heat generating element as a circuit board is formed on the insulating layer 110 of the heat sink with the insulating layer. A circuit board with a heat sink is configured by adhering the modules provided with.
特開２００９－１３０２５１号公報JP 2009-130251 A
　ところで、上記特許文献１の絶縁層付ヒートシンクは厚さが大きく、従来の汎用ラインにはエッチング処理可能な厚さの制限があるため、たとえば、絶縁層付ヒートシンクの絶縁層１１０に一体化された導体層のエッチング工程を行うことができない。また、従来の汎用ラインにおいてエッチング工程を行うとすれば、ヒートシンクと一体化前の図２（Ｃ）の熱プレス工程を経た、従来の汎用ラインに適用可能な厚みの絶縁層１１０に対してエッチング処理を行う必要があるが、この絶縁層１１０はヒートシンクと圧着可能な完全硬化前の半硬化状態である所謂Ｂステージ状態にあるものであり、エッチング液の作用で化学的に変化して、その後の加熱加圧工程で半硬化状態から完全硬化状態とされることによるヒートシンクとの一体化が妨げられる可能性がある。ここで、従来の汎用ラインにおいてエッチング処理を経た絶縁層を備える大容量ヒートシンクの製造にあたり、絶縁層とヒートシンクとの間に微小空間を埋めるグリースを介在させた状態でボルト締結することが考えられる。しかしながら、グリースとボルトを用いた製造方法では、製造コストが上昇するのに加えて、絶縁層とヒートシンクとは一体化されていないことから、絶縁層とヒートシンクとの間の熱抵抗が上昇し、放熱性が低下する可能性があった。 By the way, since the heat sink with an insulating layer of Patent Document 1 has a large thickness and the conventional general-purpose line has a limit on the thickness that can be etched, it is integrated with the insulating layer 110 of the heat sink with an insulating layer, for example. The etching process of the conductor layer cannot be performed. Further, if the etching process is performed in the conventional general-purpose line, the insulating layer 110 having a thickness applicable to the conventional general-purpose line after the heat pressing process shown in FIG. The insulating layer 110 is in a so-called B-stage state, which is a semi-cured state before complete curing that can be pressure-bonded to the heat sink, and is chemically changed by the action of the etching solution. There is a possibility that the integration with the heat sink due to the semi-cured state being changed to the fully cured state in the heating and pressing step is prevented. Here, when manufacturing a large-capacity heat sink having an insulating layer that has undergone an etching process in a conventional general-purpose line, it is conceivable that bolts are fastened with a grease that fills a minute space between the insulating layer and the heat sink. However, in the manufacturing method using grease and bolts, in addition to the increase in manufacturing cost, since the insulating layer and the heat sink are not integrated, the thermal resistance between the insulating layer and the heat sink increases, There was a possibility that the heat dissipation was reduced.
　本発明は、以上の事情を背景として為されたものであり、その目的とするところは、汎用ラインで導体層のエッチングが可能であり、熱抵抗の上昇が抑制されたヒートシンク付回路基板およびヒートシンク付回路基板の製造方法を提供することにある。 The present invention has been made against the background of the above circumstances. The object of the present invention is to provide a circuit board with a heat sink and a heat sink in which a conductor layer can be etched on a general-purpose line and an increase in thermal resistance is suppressed. It is providing the manufacturing method of an attached circuit board.
　すなわち、第１発明の要旨とするところは、回路を構成する導体層と大容量ヒートシンクの一面とが絶縁層を介して一体化され、該絶縁層は互いに熱圧着された一対の第１および第２の樹脂シートを含むヒートシンク付回路基板であって、少なくとも圧着時には前記一対の第１および第２の樹脂シートのうち、第２の樹脂シートより硬度が高い第１の樹脂シートの圧着面に凹凸が形成されており、前記第１の樹脂シートと前記第２の樹脂シートとがアンカー効果により結合されていることにある。 That is, the gist of the first invention is that a conductor layer constituting a circuit and one surface of a large-capacity heat sink are integrated via an insulating layer, and the insulating layer is thermocoupled to each other. A circuit board with a heat sink including two resin sheets, wherein at least one of the pair of first and second resin sheets at the time of pressure bonding is uneven on the pressure bonding surface of the first resin sheet having a higher hardness than the second resin sheet. Is formed, and the first resin sheet and the second resin sheet are bonded together by an anchor effect.
　第１発明のヒートシンク付回路基板によれば、少なくとも圧着時には前記一対の第１および第２の樹脂シートのうち、第２の樹脂シートより硬度が高い第１の樹脂シートの圧着面に凹凸が形成されており、前記第１の樹脂シートと前記第２の樹脂シートとがアンカー効果により結合されている。このため、ヒートシンクを固着する前に汎用ラインで導体層のエッチングが可能であり、しかもヒートシンク付回路基板の絶縁層は、第１の樹脂シートと第２の樹脂シートとがアンカー効果により一体的に結合されていることから、樹脂シート同士の密着性が高められ、熱抵抗の上昇が抑制される。 According to the circuit board with a heat sink of the first invention, at least at the time of pressure bonding, an unevenness is formed on the pressure-bonding surface of the first resin sheet having higher hardness than the second resin sheet among the pair of first and second resin sheets. The first resin sheet and the second resin sheet are bonded together by an anchor effect. Therefore, it is possible to etch the conductor layer on the general-purpose line before fixing the heat sink, and the insulating layer of the circuit board with the heat sink is integrated with the first resin sheet and the second resin sheet by the anchor effect. Since it is couple | bonded, the adhesiveness of resin sheets is improved and the raise of a thermal resistance is suppressed.
　また、好適には、前記絶縁層が、前記一方の樹脂シートと前記他方の樹脂シートの２層からなる。このため、ヒートシンク付回路基板の絶縁層が厚くされて絶縁性能が向上されるとともに、樹脂シート同士の密着性が高められ、熱抵抗の上昇が抑制される。 Also preferably, the insulating layer is composed of two layers, the one resin sheet and the other resin sheet. For this reason, while the insulating layer of the circuit board with a heat sink is thickened, the insulating performance is improved, the adhesion between the resin sheets is enhanced, and the increase in thermal resistance is suppressed.
　また、第２発明のヒートシンク付回路基板の製造方法の要旨とするところは、回路を構成する導体層と大容量ヒートシンクの一面とが絶縁層を介して一体化され、該絶縁層は互いに熱圧着された一対の第１および第２の樹脂シートを含むヒートシンク付回路基板の製造方法であって、前記第１の樹脂シートを、回路を構成する第１の導体層および前記第１の樹脂シートに固定される側の面に凹凸形状を有する第２の導体層との間に挟んだ状態で真空熱プレスして、第１複合体を得る第１工程と、エッチングにより該第１複合体の前記第１の導体層に前記回路を構成し、且つ前記第２の導体層を除去して、第２複合体を得る第２工程と、前記第１の樹脂シートより硬度の低い前記第２の樹脂シートを介して、前記第２複合体の前記第１の樹脂シートとヒートシンクを重ね合わせた状態で真空熱プレスする第３工程とを含むことにある。このため、第２の樹脂シートが重ね合わせられる第１の樹脂シートに凹凸が形成されてアンカー効果により第１の樹脂シートと第２の樹脂シートとが圧着された絶縁層が形成されることから、第１の樹脂シートと第２の樹脂シートとの密着性が高められ、熱抵抗の上昇が抑制された、二層のヒートシンク付回路基板が得られる。また、ヒートシンクが第２の樹脂シートに圧着される前に、回路を構成する第１の導体層がエッチングされるため、厚みに制限のある従来の汎用ラインに適用可能なヒートシンク付回路基板の製造方法を提供することができる。 Further, the gist of the manufacturing method of the circuit board with a heat sink of the second invention is that the conductor layer constituting the circuit and one surface of the large capacity heat sink are integrated through an insulating layer, and the insulating layers are thermocompression bonded to each other. A method of manufacturing a circuit board with a heat sink including a pair of first and second resin sheets, wherein the first resin sheet is used as a first conductor layer and a first resin sheet constituting a circuit. A first step of obtaining a first composite by vacuum hot pressing in a state sandwiched between a second conductor layer having a concavo-convex shape on the surface to be fixed; and the first composite by etching. A second step of forming the circuit on the first conductor layer and removing the second conductor layer to obtain a second composite; and the second resin having a hardness lower than that of the first resin sheet. The first resin of the second composite through a sheet Lies in comprising a third step of vacuum hot pressed at state superposed over preparative and the heat sink. For this reason, an unevenness is formed on the first resin sheet on which the second resin sheet is overlaid, and an insulating layer is formed in which the first resin sheet and the second resin sheet are pressure-bonded by the anchor effect. Thus, a two-layer circuit board with a heat sink in which the adhesion between the first resin sheet and the second resin sheet is enhanced and the increase in thermal resistance is suppressed is obtained. In addition, since the first conductor layer constituting the circuit is etched before the heat sink is pressure-bonded to the second resin sheet, a circuit board with a heat sink that can be applied to a conventional general-purpose line with a limited thickness is manufactured. A method can be provided.
　また、第３発明のヒートシンク付回路基板の製造方法の要旨とするところは、回路を構成する導体層と大容量ヒートシンクの一面とが絶縁層を介して一体化され、該絶縁層は互いに熱圧着された一対の第１および第２の樹脂シートを含むヒートシンク付回路基板の製造方法であって、前記第１の樹脂シートを、回路を構成する第１の導体層および前記第１の樹脂シートに固定される側の面に凹凸形状を有する第２の導体層との間に挟んだ状態で真空熱プレスして、第１複合体を得る第１工程と、エッチングにより該第１複合体の第１の導体層に回路を構成し、且つ前記第２の導体層を除去して、第２複合体を得る第２工程と、前記第１の樹脂シートより硬度の低い前記第２の樹脂シートを、前記第２複合体の前記第１の樹脂シートに重ね合わせた状態で真空熱プレスして、第３複合体を得る第３工程と、前記第２の樹脂シートより硬度は低い第３の樹脂シートを用いて、前記第２工程および前記第３工程と同様の工程により、第４複合体を得る第４工程と、該第４複合体とヒートシンクを重ね合わせた状態で真空熱プレスする第５工程とを含むことにある。このため、前記第１の樹脂シート、前記第２の樹脂シートおよび複数の前記第３の樹脂シートの三層から構成される絶縁層を備え、熱抵抗の上昇が抑制されたヒートシンク付回路基板が得られる。また、第５工程において、ヒートシンクが第３の樹脂シートに圧着される前に回路を構成する第１の導体層がエッチングされるため、厚みに制限のある従来の汎用ラインに適用可能なヒートシンク付回路基板の製造方法を提供することができる。 The gist of the method for manufacturing a circuit board with a heat sink of the third invention is that a conductor layer constituting a circuit and one surface of a large-capacity heat sink are integrated via an insulating layer, and the insulating layers are thermocompression bonded to each other. A method of manufacturing a circuit board with a heat sink including a pair of first and second resin sheets, wherein the first resin sheet is used as a first conductor layer and a first resin sheet constituting a circuit. A first step of obtaining a first composite by vacuum hot pressing in a state sandwiched between a second conductor layer having a concavo-convex shape on the surface to be fixed, and a first step of the first composite by etching A second step of forming a circuit in one conductor layer and removing the second conductor layer to obtain a second composite; and the second resin sheet having a lower hardness than the first resin sheet. , Superimposed on the first resin sheet of the second composite The third step of obtaining a third composite by vacuum hot pressing in the state of being put on, and using the third resin sheet having a hardness lower than that of the second resin sheet, the second step and the third step A similar process includes a fourth step of obtaining a fourth composite and a fifth step of vacuum hot pressing in a state where the fourth composite and the heat sink are overlapped. For this reason, a circuit board with a heat sink comprising an insulating layer composed of three layers of the first resin sheet, the second resin sheet, and a plurality of the third resin sheets, and a rise in thermal resistance is suppressed. can get. Further, in the fifth step, the first conductor layer constituting the circuit is etched before the heat sink is pressure-bonded to the third resin sheet, so that the heat sink with a heat sink applicable to a conventional general-purpose line with a limited thickness is provided. A method for manufacturing a circuit board can be provided.
　また、好適には、前記導体層は、厚さが２００μｍ以下の熱伝導性の高い電解銅箔、あるいは化成処理された圧延銅箔であり、より好適には、前記第１の樹脂シートとの密着性を高めるために少なくとも前記第１の樹脂シートに重ね合わされる面に数μｍから数十μｍの凹凸が形成されているものが挙げられる。また、前記導体層は上記に限らず、前記第１の樹脂シートの硬化により前記第１の樹脂シートと十分に圧着されるならば、たとえばその厚さが２００μｍより大きくされてもよいし、あるいは圧延銅箔においては化成処理が施されていなくともよい。また、前記導体層は、電解アルミ箔、化成処理された圧延アルミ箔であってもよい。 Preferably, the conductor layer is an electrolytic copper foil having a high thermal conductivity having a thickness of 200 μm or less, or a rolled copper foil subjected to chemical conversion treatment, and more preferably with the first resin sheet. In order to improve the adhesion, at least a surface that is superimposed on the first resin sheet has unevenness of several μm to several tens μm. In addition, the conductor layer is not limited to the above, and if the first resin sheet is sufficiently pressure-bonded to the first resin sheet by curing, the thickness of the conductor layer may be greater than 200 μm, for example. The rolled copper foil does not need to be subjected to chemical conversion treatment. The conductor layer may be an electrolytic aluminum foil or a chemical-treated rolled aluminum foil.
　また、好適には、前記第１の樹脂シート、前記第２の樹脂シートおよび前記第３の樹脂シートは、熱硬化性樹脂、無機フィラー、必要に応じて含有される、硬化剤、硬化促進剤および揮発性溶媒が混合された樹脂組成物が板状に形成されたものである。なお、前記第１の樹脂シート、前記第２の樹脂シートおよび前記第３の樹脂シートは同一の組成であってもよいし、異なる組成であってもよい。 Preferably, the first resin sheet, the second resin sheet, and the third resin sheet are a thermosetting resin, an inorganic filler, and a curing agent and a curing accelerator that are contained as necessary. And a resin composition in which a volatile solvent is mixed is formed into a plate shape. The first resin sheet, the second resin sheet, and the third resin sheet may have the same composition or different compositions.
　また、好適には、前記熱硬化性樹脂は、特に限定されるものではなく、たとえば、エポキシ樹脂およびフェノール樹脂が好適に挙げられる。より好適には、耐熱性および耐湿性が良好であるとともに、優れた接着性を有し、アンカー効果により樹脂シート同士がより強固に圧着される、エポキシ樹脂が挙げられる。 Further, preferably, the thermosetting resin is not particularly limited, and for example, an epoxy resin and a phenol resin are preferably exemplified. More preferably, there is an epoxy resin that has good heat resistance and moisture resistance, has excellent adhesiveness, and allows the resin sheets to be more strongly pressure-bonded by an anchor effect.
　また、好適には、前記エポキシ樹脂は、たとえば、エポキシ当量４５０～２０００ｇ／ｅｑの常温固体のビスフェノールＡ型エポキシ樹脂と、エポキシ当量１６０～２２０ｇ／ｅｑの多官能の常温固体で８７度から９３度の間に軟化点を有するノボラック型エポキシ樹脂とが、（ビスフェノールＡ型エポキシ樹脂／ノボラック型エポキシ樹脂）＝４０／６０から６０／４０となる質量比率で混合されたものが使用されることが好ましい。このようなエポキシ樹脂が含まれた樹脂シートは、真空熱プレス処理の際に適度に樹脂シートの粘度が低下し、ボイドが良好に取り除かれる。 Preferably, the epoxy resin is, for example, a normal temperature solid bisphenol A type epoxy resin having an epoxy equivalent of 450 to 2000 g / eq, and a polyfunctional normal temperature solid having an epoxy equivalent of 160 to 220 g / eq, of 87 ° to 93 °. It is preferable that a novolac type epoxy resin having a softening point between them is mixed at a mass ratio of (bisphenol A type epoxy resin / novolak type epoxy resin) = 40/60 to 60/40. . In the resin sheet containing such an epoxy resin, the viscosity of the resin sheet is moderately reduced during the vacuum hot press treatment, and voids are well removed.
　また、好適には、前記無機フィラーとしては、たとえば、窒化ホウ素、窒化アルミニウム、窒化ケイ素、窒化ガリウム、酸化アルミニウム、炭化ケイ素、二酸化ケイ素、酸化マグネシウムおよびダイヤモンドなどの粒子が挙げられる。より好適には、樹脂シートの熱伝導性が高まるという点で、窒化ホウ素の粒子が挙げられる。 Also preferably, the inorganic filler includes particles such as boron nitride, aluminum nitride, silicon nitride, gallium nitride, aluminum oxide, silicon carbide, silicon dioxide, magnesium oxide and diamond. More preferably, the particle | grains of boron nitride are mentioned at the point that the heat conductivity of a resin sheet increases.
　また、好適には、前記第１の樹脂シート、前記第２の樹脂シートおよび前記第３の樹脂シートに前記エポキシ樹脂が含有される場合には、前記エポキシ樹脂の硬化剤、硬化促進剤が含有されてもよい。 Preferably, when the epoxy resin is contained in the first resin sheet, the second resin sheet, and the third resin sheet, a curing agent and a curing accelerator of the epoxy resin are contained. May be.
　また、好適には、前記硬化剤としては、たとえば、ジアミノジフェニルスルホン、ジシアンジアミド、ジアミノジフェニルメタン、トリエチレンテトラミンなどのアミン系硬化剤、フェノールノボラック樹脂、アラルキル型フェノール樹脂、ジシクロペンタジエン変性フェノール樹脂、ナフタレン型フェノール樹脂、ビスフェノール系フェノール樹脂などのフェノール系硬化剤、酸無水物などが挙げられる。 Preferably, the curing agent includes, for example, amine curing agents such as diaminodiphenyl sulfone, dicyandiamide, diaminodiphenylmethane, triethylenetetramine, phenol novolac resin, aralkyl type phenol resin, dicyclopentadiene modified phenol resin, naphthalene. Phenolic curing agents such as type phenolic resin and bisphenolic phenolic resin, and acid anhydrides.
　また、好適には、前記硬化促進剤としては、たとえば、イミダゾール類、トリフェニルフォスフェイト（ＴＰＰ）、三フッ化ホウ素モノエチルアミンなどのアミン系硬化促進剤が挙げられる。 Also preferably, examples of the curing accelerator include amine-based curing accelerators such as imidazoles, triphenyl phosphate (TPP), and boron trifluoride monoethylamine.
　また、好適には、前記揮発性溶媒としては、塗工後に容易に揮発するという点で、沸点が１２０度以下のものが好ましい。 Also preferably, the volatile solvent preferably has a boiling point of 120 ° C. or less in that it easily volatilizes after coating.
　また、好適には、前記第１の樹脂シート、前記第２の樹脂シートおよび前記第３の樹脂シートの前記樹脂組成物には、上記のほかに、本発明の効果を損なわない範囲において、分散剤、粘着性付与剤、老化防止剤、酸化防止剤、加工助剤、安定剤、消泡剤、難燃剤、増粘剤、顔料などが含有されてもよい。 Preferably, the resin composition of the first resin sheet, the second resin sheet, and the third resin sheet is dispersed within a range that does not impair the effects of the present invention in addition to the above. Agents, tackifiers, antioxidants, antioxidants, processing aids, stabilizers, antifoaming agents, flame retardants, thickeners, pigments and the like may be included.
　また、好適には、前記大容量ヒートシンクは、アルミニウム、銅などの高熱伝導性を有する金属から形成され、高放熱性能を有するものである。より好適には、前記大容量ヒートシンクは、たとえば板厚が３ｍｍよりも大きいこと、または前記樹脂シートに結合される側とは反対側の面が、平らではなくたとえば放熱フィンなどを備えていることのいずれかの構成、あるいは両方の構成を含むものである。 Preferably, the large-capacity heat sink is formed of a metal having high thermal conductivity such as aluminum or copper and has high heat dissipation performance. More preferably, the large-capacity heat sink has, for example, a plate thickness larger than 3 mm, or a surface opposite to the side bonded to the resin sheet is not flat and has, for example, a radiation fin. Any one of these configurations or both configurations are included.
　また、好適には、前記真空熱プレス処理は、前記第１の樹脂シートと前記第２の樹脂シートとの熱圧着および前記第２の樹脂シートと前記第３の樹脂シートとの熱圧着において、圧着時において硬度の低い側の未硬化の樹脂シートが硬度の高い側の樹脂シートの圧着面の凹凸によるアンカー効果により強固に結合されるとともに、ボイドが良好に除去されるように、たとえば、０．０２ＭＰａ以下、より好ましくは０．０１５～０．０２ＭＰａの減圧下、１４０度から１８０度の温度で、２ＭＰａの圧力でプレスされる。量産の必要がある場合には、たとえば０．００１ＭＰａ程度に減圧されてもよい。 Preferably, the vacuum hot press treatment is performed by thermocompression bonding between the first resin sheet and the second resin sheet and thermocompression bonding between the second resin sheet and the third resin sheet. In order that the uncured resin sheet on the lower hardness side is firmly bonded by the anchor effect due to the unevenness of the pressure-bonding surface of the higher hardness resin sheet and the voids are removed well, for example, 0 It is pressed at a pressure of 2 MPa at a temperature of 140 to 180 degrees under a reduced pressure of 0.02 MPa or less, more preferably 0.015 to 0.02 MPa. When mass production is necessary, the pressure may be reduced to about 0.001 MPa, for example.
　また、好適には、前記第２の導体層は、前記エッチング処理後に、前記第１の樹脂シートが粗面化されて凹凸が形成されるように、たとえば、表面の粗い電解銅箔が用いられる。 Preferably, for example, an electrolytic copper foil having a rough surface is used for the second conductor layer so that the first resin sheet is roughened to form irregularities after the etching process. .
本発明の一例のヒートシンク付回路基板を示す正面図である。It is a front view which shows the circuit board with a heat sink of an example of this invention. 図１のヒートシンク付回路基板の斜視図である。It is a perspective view of the circuit board with a heat sink of FIG. 図１のヒートシンク付回路基板に備えられたヒートシンクを示す斜視図である。It is a perspective view which shows the heat sink with which the circuit board with a heat sink of FIG. 1 was equipped. 図１のヒートシンク付回路基板の製造工程を説明する図である。It is a figure explaining the manufacturing process of the circuit board with a heat sink of FIG. 図１の２層の樹脂シートが圧着された絶縁層を備えるヒートシンク付回路基板および他の実施例における３層の樹脂シートが圧着された絶縁層を備えるヒートシンク付回路基板の製造工程を説明する図である。The figure explaining the manufacturing process of the circuit board with a heat sink provided with the insulating layer with which the 2 layer resin sheet of FIG. 1 was crimped | bonded, and the circuit board with a heat sink provided with the insulating layer to which the 3 layer resin sheet was crimped | bonded in another Example. It is. 他の実施例におけるヒートシンク付回路基板を示す斜視図である。It is a perspective view which shows the circuit board with a heat sink in another Example. 他の実施例におけるヒートシンク付回路基板に備えられるヒートシンクを示す斜視図である。It is a perspective view which shows the heat sink with which the circuit board with a heat sink in another Example is equipped. 従来のヒートシンク付回路基板の熱プレス工程を説明する図である。It is a figure explaining the hot press process of the conventional circuit board with a heat sink.
　以下、本発明のヒートシンク付回路基板の一実施例について図面を参照して詳細に説明する。 Hereinafter, an embodiment of a circuit board with a heat sink according to the present invention will be described in detail with reference to the drawings.
　図１は、本発明の一例であるヒートシンク付回路基板１０を示す正面図である。図２は、ヒートシンク付回路基板１０を示す斜視図である。ヒートシンク付回路基板１０は、銅箔から構成される回路１２と大容量ヒートシンク１４（以下、「ヒートシンク１４」という。）の一面とが絶縁層１６を介して一体化されて構成されている。絶縁層１６は、第１の樹脂シート１８と第２の樹脂シート２０とが互いに熱圧着された一対の樹脂シートから構成されている。第１の樹脂シート１８および第２の樹脂シート２０は同一の組成を有しており、熱硬化性樹脂であるエポキシ樹脂を主成分とする樹脂組成物の塗工処理により常温固体状且つ板状に形成された未硬化の樹脂シートが、熱圧着処理により硬化され、厚さ６０μｍに形成されたものである。第１の樹脂シート１８および第２の樹脂シート２０を構成する上記樹脂組成物の組成は、たとえばビスフェノールＡ型エポキシ樹脂５０質量部、ノボラック型エポキシ樹脂５０質量部、アミン系硬化剤１９．８質量部、アミン系促進剤１．５質量部、窒化ホウ素フィラー２４１．４質量部およびメチルエチルケトン４００質量部から構成されている。第１の樹脂シート１８と第２の樹脂シート２０との熱圧着時において、第１の樹脂シート１８はすでにある程度硬化されており、第２の樹脂シート２０よりも硬度が高くなっており、且つ第１の樹脂シート１８の第２の樹脂シート２０との圧着面には凹凸が形成され、その凹凸によるアンカー効果により第１の樹脂シート１８と第２の樹脂シート２０とが結合されている。これにより、第１の樹脂シート１８と第２の樹脂シート２０との間の熱抵抗の上昇が抑制されている。回路１２は、化成処理やサンドブラスト処理により少なくとも一面が数μｍから数十μｍの凹凸を有するように粗面化された、厚さ２００μｍ以下の圧延銅箔から成る第１の導体層２２が、その粗面化された面が第１の樹脂シート１８に対向する状態で圧着された後に、所望のサイズにエッチングされたものである。図３は、ヒートシンク付回路基板１０に備えられるヒートシンク１４を示す斜視図であり、ヒートシンク１４は、図２および図３に示すように高熱伝導性を有するアルミニウムから形成され、その板厚が３ｍｍよりも大きく、且つ一面に放熱フィン２４を備えた大容量ヒートシンクであり、第２の樹脂シート２０の硬化により第２の樹脂シート２０と一体化されている。このように構成されたヒートシンク付回路基板１０は、第１の樹脂シート１８と第２の樹脂シート２０との二層から構成される絶縁層１６により、回路１２に固着されたパワー素子からの熱をヒートシンク１４に伝える高熱伝導性を有するとともに、回路基板からヒートシンク１４を通じて外部へ電流が漏れることを好適に防止することができ、たとえば、電気自動車（ＥＶ）／ハイブリッド車両（ＨＥＶ）用インバータの基板、ＰＣ用アルミ基板などに好適に用いることができる。 FIG. 1 is a front view showing a circuit board 10 with a heat sink, which is an example of the present invention. FIG. 2 is a perspective view showing the circuit board 10 with a heat sink. The circuit board 10 with a heat sink is configured such that a circuit 12 made of copper foil and one surface of a large-capacity heat sink 14 (hereinafter referred to as “heat sink 14”) are integrated with an insulating layer 16 interposed therebetween. The insulating layer 16 is composed of a pair of resin sheets in which a first resin sheet 18 and a second resin sheet 20 are thermocompression bonded to each other. The first resin sheet 18 and the second resin sheet 20 have the same composition, and are solid at room temperature and plate-like by applying a resin composition mainly composed of an epoxy resin that is a thermosetting resin. The uncured resin sheet formed in (1) is cured by thermocompression treatment and formed to a thickness of 60 μm. The composition of the resin composition constituting the first resin sheet 18 and the second resin sheet 20 is, for example, 50 parts by mass of a bisphenol A type epoxy resin, 50 parts by mass of a novolac type epoxy resin, and 19.8 parts by mass of an amine curing agent. Part, an amine accelerator 1.5 parts by mass, a boron nitride filler 241.4 parts by mass and methyl ethyl ketone 400 parts by mass. At the time of thermocompression bonding between the first resin sheet 18 and the second resin sheet 20, the first resin sheet 18 has already been cured to some extent, and has a higher hardness than the second resin sheet 20, and Concavities and convexities are formed on the pressure-bonding surface of the first resin sheet 18 and the second resin sheet 20, and the first resin sheet 18 and the second resin sheet 20 are joined by an anchor effect due to the concavities and convexities. Thereby, the raise of the thermal resistance between the 1st resin sheet 18 and the 2nd resin sheet 20 is suppressed. The circuit 12 includes a first conductor layer 22 made of a rolled copper foil having a thickness of 200 μm or less, which is roughened so that at least one surface has unevenness of several μm to several tens of μm by chemical conversion treatment or sandblasting treatment. The roughened surface is pressure-bonded in a state of facing the first resin sheet 18 and then etched to a desired size. FIG. 3 is a perspective view showing the heat sink 14 provided in the circuit board 10 with the heat sink. The heat sink 14 is made of aluminum having high thermal conductivity as shown in FIGS. 2 and 3, and the plate thickness is 3 mm or more. And a large-capacity heat sink provided with heat radiation fins 24 on one side, and is integrated with the second resin sheet 20 by curing the second resin sheet 20. The circuit board with heat sink 10 configured in this way has heat from the power element fixed to the circuit 12 by the insulating layer 16 composed of two layers of the first resin sheet 18 and the second resin sheet 20. Can be suitably prevented from leaking from the circuit board to the outside through the heat sink 14, for example, an inverter board for an electric vehicle (EV) / hybrid vehicle (HEV). It can be suitably used for an aluminum substrate for PC.
　次に、ヒートシンク付回路基板１０の製造工程の一例を図４および図５を用いて詳細に説明する。第１工程としての真空熱プレス工程では、第１の樹脂シート１８を、回路１２を構成する第１の導体層２２と第２の導体層２６との間に挟んだ状態で真空熱プレス処理が行われ、第１複合体２８が得られる。第２の導体層２６は、その表面が粗い電解銅箔であり、後述するエッチング工程により除去され第１の樹脂シート１８の表面を粗面化して凹凸を形成するために用いられる。真空熱プレス工程では、樹脂組成物が塗工処理された未硬化の第１の樹脂シート１８が、第１の導体層２２の表面の粗い側の一面に対向するように第１の導体層２２と第２の導体層２６とにより挟まれた状態で、たとえば、０．０２ＭＰａの減圧下、温度１４０度から１８０度において２ＭＰａの圧力でプレスされて、第１の樹脂シート１８のエポキシ樹脂の重合が進行し、硬化されることにより、第１の樹脂シート１８が第１の導体層２２と第２の導体層２６とに挟まれた状態で圧着されることにより一体化された第１複合体２８が構成される。このとき、第１の樹脂シート１８の第１の導体層２２および第２の導体層２６との貼り合わせ面のボイドが真空条件下で除去されるとともに、未硬化の第１の樹脂シート１８は、プレス圧により第１の導体層２２と第２の導体層２６の面上の凹凸に入り込みながら硬化されるので、第１複合体を構成する第１の樹脂シート１８と第１の導体層２２と第２の導体層２６とは強固に結合されている。 Next, an example of the manufacturing process of the circuit board 10 with the heat sink will be described in detail with reference to FIGS. In the vacuum hot press process as the first process, the vacuum heat press process is performed with the first resin sheet 18 sandwiched between the first conductor layer 22 and the second conductor layer 26 constituting the circuit 12. The first composite 28 is obtained. The second conductor layer 26 is an electrolytic copper foil having a rough surface, and is used for roughening the surface of the first resin sheet 18 to form irregularities by being removed by an etching process described later. In the vacuum hot pressing process, the first conductor layer 22 is so arranged that the uncured first resin sheet 18 coated with the resin composition faces one surface on the rough side of the surface of the first conductor layer 22. The first resin sheet 18 is polymerized by being pressed with a pressure of 2 MPa at a temperature of 140 to 180 degrees under a reduced pressure of 0.02 MPa, for example, in a state sandwiched between the first and second conductor layers 26. Is progressed and cured, so that the first composite sheet 18 is integrated by being crimped in a state where the first resin sheet 18 is sandwiched between the first conductor layer 22 and the second conductor layer 26. 28 is configured. At this time, the void on the bonding surface of the first resin sheet 18 with the first conductor layer 22 and the second conductor layer 26 is removed under vacuum conditions, and the uncured first resin sheet 18 is The first resin sheet 18 and the first conductor layer 22 constituting the first composite are cured by being pressed into the irregularities on the surfaces of the first conductor layer 22 and the second conductor layer 26 by the pressing pressure. And the second conductor layer 26 are firmly bonded.
　第２工程としてのエッチング工程では、エッチング処理により第１複合体２８から第２の導体層２６が除去されるとともに、第１の導体層２２が所望の形状を残して除去されて回路１２が形成された第２複合体３０が構成される。第１工程で構成された第１複合体２８は、１４０度から１８０度の高温で熱処理されているため、第１の樹脂シート１８は完全に硬化された状態あるいは、完全硬化に近い状態まで硬化されているため、エッチング処理液による化学的な変性を考慮することなく、公知のエッチング処理方法により容易に処理される。第２の導体層２６が除去された後には、第２の導体層２６の表面の凹凸が転写されることにより、第２の導体層２６が除去された側の第１の樹脂シート１８の表面に凹凸が形成されている。 In the etching process as the second process, the second conductor layer 26 is removed from the first composite 28 by the etching process, and the first conductor layer 22 is removed leaving a desired shape to form the circuit 12. A second composite 30 is formed. Since the first composite 28 configured in the first step is heat-treated at a high temperature of 140 to 180 degrees, the first resin sheet 18 is cured to a completely cured state or a state almost completely cured. Therefore, it is easily processed by a known etching method without considering chemical modification by the etching solution. After the second conductor layer 26 is removed, the surface of the first resin sheet 18 on the side from which the second conductor layer 26 has been removed is transferred by transferring irregularities on the surface of the second conductor layer 26. Concavities and convexities are formed on the surface.
　第３工程としての真空熱プレス工程では、第２複合体３０の第１の樹脂シート１８の凹凸を有する表面に対して未硬化の第２の樹脂シート２０が重ね合わされるとともに、第２の樹脂シート２０に対してヒートシンク１４が重ね合わされた状態で真空熱プレス処理が行われ、第１の樹脂シート１８と第２の樹脂シート２０の二層から成る絶縁層１６を備えたヒートシンク付回路基板１０が構成される。第３工程での真空熱プレス処理は、第１工程での真空熱プレス処理と同条件で行われる。この第３工程での真空熱プレス処理では、第１の樹脂シート１８と第２の樹脂シート２０との圧着において、第１工程での真空熱プレス処理においてすでに硬化されている第１の樹脂シート１８の表面に形成された凹凸に、第１の樹脂シート１８よりも硬度の低い未硬化の第２の樹脂シート２０が入り込んだ状態で第２の樹脂シート２０が硬化される、第１の樹脂シート１８と第２の樹脂シート２０との間の所謂アンカー効果により、第１の樹脂シート１８と第２の樹脂シート２０とが強固に結合されるとともに、真空処理により第２の樹脂シート２０の第１の樹脂シート１８との貼り合わせ面におけるボイドが除去される。また、未硬化の第２の樹脂シート２０がヒートシンク１４の放熱フィン２４とは反対側の面に対して圧着されつつ硬化されることにより、第２の樹脂シート２０とヒートシンク１４とが結合される。 In the vacuum hot press process as the third process, the uncured second resin sheet 20 is superimposed on the uneven surface of the first resin sheet 18 of the second composite 30, and the second resin A circuit board 10 with a heat sink having an insulating layer 16 composed of two layers of a first resin sheet 18 and a second resin sheet 20 is subjected to a vacuum hot press process with the heat sink 14 superimposed on the sheet 20. Is configured. The vacuum hot press process in the third step is performed under the same conditions as the vacuum hot press process in the first step. In the vacuum hot press process in the third step, the first resin sheet that has already been cured in the vacuum hot press process in the first step in the pressure bonding between the first resin sheet 18 and the second resin sheet 20. The first resin in which the second resin sheet 20 is cured while the uncured second resin sheet 20 having a lower hardness than that of the first resin sheet 18 enters the irregularities formed on the surface of the first resin 18. Due to the so-called anchor effect between the sheet 18 and the second resin sheet 20, the first resin sheet 18 and the second resin sheet 20 are firmly bonded, and the second resin sheet 20 is vacuum-processed. Voids on the bonding surface with the first resin sheet 18 are removed. Further, the uncured second resin sheet 20 is cured while being pressed against the surface of the heat sink 14 opposite to the heat dissipating fins 24, whereby the second resin sheet 20 and the heat sink 14 are coupled. .
　上述のように、本実施例のヒートシンク付回路基板１０によれば、少なくとも第３工程の真空熱プレス工程での圧着時には一対の第１の樹脂シート１８および第２の樹脂シート２０のうち、第２の樹脂シート２０より硬度が高い第１の樹脂シート１８の圧着面に凹凸が形成されており、第１の樹脂シート１８と第２の樹脂シート２０とがアンカー効果により結合されている。このため、ヒートシンク１４を固着する前に汎用ラインで第１の導体層２２のエッチングが可能であり、しかもヒートシンク付回路基板１０の絶縁層１６は、第１の樹脂シート１８と第２の樹脂シート２０とがアンカー効果により一体的に結合されていることから、樹脂シート同士の密着性が高められ、熱抵抗の上昇が抑制される。 As described above, according to the circuit board 10 with the heat sink of the present embodiment, the first resin sheet 18 and the second resin sheet 20 out of the pair of the first resin sheet 18 and the second resin sheet 20 are at least pressed in the vacuum hot press process of the third process. Concavities and convexities are formed on the pressure-bonding surface of the first resin sheet 18 having a higher hardness than the second resin sheet 20, and the first resin sheet 18 and the second resin sheet 20 are joined together by an anchor effect. For this reason, the first conductor layer 22 can be etched on the general-purpose line before the heat sink 14 is fixed, and the insulating layer 16 of the circuit board 10 with the heat sink is composed of the first resin sheet 18 and the second resin sheet. Since 20 is integrally coupled by the anchor effect, the adhesion between the resin sheets is enhanced, and an increase in thermal resistance is suppressed.
　また、本実施例のヒートシンク付回路基板１０によれば、絶縁層１６が、第１の樹脂シート１８と第２の樹脂シート２０との二層から構成される。このため、ヒートシンク付回路基板１０の絶縁層１６の厚みが厚くされて絶縁性能が向上されるとともに、第１の樹脂シート１８と第２の樹脂シート２０との間の密着性が高められ、熱抵抗の上昇が抑制される。 Further, according to the circuit board 10 with the heat sink of the present embodiment, the insulating layer 16 is composed of two layers of the first resin sheet 18 and the second resin sheet 20. For this reason, the thickness of the insulating layer 16 of the circuit board 10 with the heat sink is increased to improve the insulating performance, and the adhesion between the first resin sheet 18 and the second resin sheet 20 is enhanced, The increase in resistance is suppressed.
　また、本実施例のヒートシンク付回路基板１０の製造方法によれば、第１の樹脂シート１８を、回路１２を構成する第１の導体層２２および第１の樹脂シート１８に固定される側の面に凹凸形状を有する第２の導体層２６との間に挟んだ状態で真空熱プレスして、第１複合体２８を得る第１工程と、エッチングにより第１複合体２８の第１の導体層２２に回路１２を構成し、且つ第２の導体層２６を除去して、第１の樹脂シート１８の表面が粗面化され凹凸が形成された第２複合体３０を得る第２工程と、第１工程である程度硬化された第１の樹脂シート１８より硬度の低い未硬化の第２の樹脂シート２０を介して、第２複合体３０の第１の樹脂シート１８とヒートシンク１４とを重ね合わせた状態で真空熱プレスする第３工程を含む。このため、第２の樹脂シート２０が重ね合わせられる第１の樹脂シート１８に凹凸が形成されてアンカー効果により第１の樹脂シート１８と第２の樹脂シート２０とが圧着された絶縁層１６が形成されることから、第１の樹脂シート１８と第２の樹脂シート２０との密着性が高められ、熱抵抗の上昇が抑制された、二層のヒートシンク付回路基板１０が得られる。また、ヒートシンク１４が第２の樹脂シート２０に圧着される前に、回路１２を構成する第１の導体層２２がエッチングされるため、厚みに制限のある従来の汎用ラインに適用可能なヒートシンク付回路基板１０の製造方法を提供することができる。 Moreover, according to the manufacturing method of the circuit board 10 with a heat sink of the present embodiment, the first resin sheet 18 is fixed to the first conductor layer 22 and the first resin sheet 18 that constitute the circuit 12. A first step of obtaining a first composite 28 by vacuum hot pressing in a state sandwiched between a second conductor layer 26 having an uneven shape on the surface, and a first conductor of the first composite 28 by etching. A second step of forming the circuit 12 on the layer 22 and removing the second conductor layer 26 to obtain the second composite 30 in which the surface of the first resin sheet 18 is roughened to form irregularities The first resin sheet 18 of the second composite 30 and the heat sink 14 are overlapped with each other through the uncured second resin sheet 20 having a lower hardness than the first resin sheet 18 cured to some extent in the first step. A third step of vacuum hot pressing in the combined state is included. For this reason, the first resin sheet 18 on which the second resin sheet 20 is overlaid is formed with irregularities, and the insulating layer 16 in which the first resin sheet 18 and the second resin sheet 20 are pressure-bonded by the anchor effect is formed. Since it is formed, the two-layered circuit board 10 with the heat sink in which the adhesion between the first resin sheet 18 and the second resin sheet 20 is enhanced and the increase in thermal resistance is suppressed is obtained. In addition, since the first conductor layer 22 constituting the circuit 12 is etched before the heat sink 14 is pressure-bonded to the second resin sheet 20, the heat sink 14 can be applied to a conventional general-purpose line with a limited thickness. A method for manufacturing the circuit board 10 can be provided.
　次に本発明の他の実施例を説明する。なお、以下の実施例において前記実施例と実質的に共通する部分には同一の符号を付して詳しい説明を省略する。 Next, another embodiment of the present invention will be described. In the following embodiments, parts that are substantially the same as those in the above embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.
　図５の三層品の工程図に示されるように、本実施例のヒートシンク付回路基板３２は、回路１２を構成する第１の導体層２２とヒートシンク１４の一面とが絶縁層３４を介して一体化されており、絶縁層３４は、アンカー効果により結合された第１の樹脂シート１８と第２の樹脂シート２０の、第２の樹脂シート２０の表面に未硬化の第３の樹脂シート３６が重ね合わされた状態で真空熱プレス処理されることにより、第３の樹脂シート３６が第２の樹脂シート２０とアンカー効果により結合された３層構造であり、その厚みが厚くされている。第３の樹脂シート３６は、第１の樹脂シート１８と第２の樹脂シート２０と同一の組成であり、熱硬化性樹脂であるエポキシ樹脂を主成分とする樹脂組成物の塗工処理により常温固体状且つ板状に形成された未硬化の樹脂シートが、熱圧着処理により硬化され、厚さ６０μｍ程度に形成されたものである。第３の樹脂シート３６の第２の樹脂シート２０の圧着面とは反対側の面にヒートシンク１４が結合されている。 As shown in the process diagram of the three-layer product in FIG. 5, the circuit board 32 with the heat sink of the present embodiment has the first conductor layer 22 constituting the circuit 12 and one surface of the heat sink 14 through the insulating layer 34. The insulating layer 34 is integrated, and the first resin sheet 18 and the second resin sheet 20 bonded by the anchor effect are uncured third resin sheet 36 on the surface of the second resin sheet 20. The third resin sheet 36 has a three-layer structure in which the second resin sheet 20 is bonded to the second resin sheet 20 by an anchor effect, and the thickness thereof is increased. The third resin sheet 36 has the same composition as the first resin sheet 18 and the second resin sheet 20, and is subjected to normal temperature by applying a resin composition mainly composed of an epoxy resin that is a thermosetting resin. An uncured resin sheet formed into a solid and plate shape is cured by a thermocompression treatment and formed to a thickness of about 60 μm. The heat sink 14 is coupled to the surface of the third resin sheet 36 opposite to the pressure-bonding surface of the second resin sheet 20.
　ヒートシンク付回路基板３２の製造方法は、前述の実施例１におけるエッチング処理により第２複合体３０が得られる第２工程終了時点までは、同様の工程である。したがって、以下、前述の実施例１と異なる第３工程以下を図５を用いて説明する。 The manufacturing method of the circuit board 32 with the heat sink is the same process until the end of the second process in which the second composite 30 is obtained by the etching process in Example 1 described above. Therefore, hereinafter, the third step and the following steps different from those of the first embodiment will be described with reference to FIG.
　第３工程としての真空熱プレス工程では、第２の樹脂シート２０が、第２複合体の第１の樹脂シート１８に重ね合わされるとともに、第２の樹脂シート２０の第１の樹脂シート１８に重ね合わされる面とは反対側の面に第３の導体層３８が重ね合わされた状態で真空熱プレス処理が行われ、第３複合体４０が得られる。第３の導体層３８は、その表面が粗い電解銅箔であり、後述するエッチング工程により除去され第２の樹脂シート２０の表面を粗面化するために用いられる。第３工程としての真空熱プレス工程では、樹脂組成物が塗工処理された未硬化の第２の樹脂シート２０が、第２複合体３０の第１の樹脂シート１８の凹凸を有する表面に対向するように第１の樹脂シート１８と第３の導体層３８とにより挟まれた状態で、たとえば第１工程と同様の条件、すなわち０．０２ＭＰａの減圧下、温度１４０度から１８０度において２ＭＰａの圧力でプレスされて、第２の樹脂シート２０のエポキシ樹脂の重合が進行し、硬化されることにより、第２の樹脂シート２０が第２複合体３０の第１の樹脂シート１８と第３の導体層３８とに挟まれた状態で圧着されることにより一体化された第３複合体４０が構成される。このとき、第２の樹脂シート２０の第１の樹脂シート１８および第３の導体層３８との貼り合わせ面のボイドが真空条件下で除去されるとともに、未硬化の第２の樹脂シート２０は、第１工程ですでに硬化され、第２の樹脂シート２０よりも硬度の高い第１の樹脂シート１８の表面に形成された凹凸および第３の導体層３８の表面の凹凸に入り込みながら硬化されるので、第３複合体４０を構成する第１の樹脂シート１８と第２の樹脂シート２０と第３の導体層３８とは強固に結合されている。 In the vacuum hot pressing process as the third process, the second resin sheet 20 is superimposed on the first resin sheet 18 of the second composite, and the first resin sheet 18 of the second resin sheet 20 is overlapped. A vacuum hot press process is performed in a state where the third conductor layer 38 is superimposed on the surface opposite to the surface to be superimposed, and the third composite 40 is obtained. The third conductor layer 38 is an electrolytic copper foil having a rough surface, and is used for roughening the surface of the second resin sheet 20 by being removed by an etching process described later. In the vacuum hot press process as the third process, the uncured second resin sheet 20 coated with the resin composition faces the uneven surface of the first resin sheet 18 of the second composite 30. In the state sandwiched between the first resin sheet 18 and the third conductor layer 38, for example, under the same conditions as in the first step, that is, under a reduced pressure of 0.02 MPa, the pressure is 2 MPa at a temperature of 140 to 180 degrees. The second resin sheet 20 is pressed with the pressure, and the polymerization of the epoxy resin of the second resin sheet 20 proceeds and is cured, so that the second resin sheet 20 and the first resin sheet 18 of the second composite 30 and the third resin sheet 20 are cured. A third composite body 40 is formed by being crimped in a state of being sandwiched between the conductor layers 38. At this time, the voids on the bonding surface of the second resin sheet 20 to the first resin sheet 18 and the third conductor layer 38 are removed under vacuum conditions, and the uncured second resin sheet 20 is The resin is already cured in the first step and cured while entering the unevenness formed on the surface of the first resin sheet 18 having a higher hardness than the second resin sheet 20 and the unevenness on the surface of the third conductor layer 38. Therefore, the first resin sheet 18, the second resin sheet 20, and the third conductor layer 38 constituting the third composite body 40 are firmly bonded.
　第４工程としてのエッチング工程では、エッチング処理により第３複合体４０から第３の導体層３８が除去され、第４複合体４２が構成される。第３工程での１４０度から１８０度の高温での熱処理により、第２の樹脂シート２０は完全に硬化された状態あるいは、完全硬化に近い状態まで硬化されているため、エッチング処理液による化学的な変性を考慮することなく、公知のエッチング処理方法により容易に処理される。第３の導体層３８が除去された後には、第３の導体層３８の表面の凹凸が転写されることにより、第３の導体層３８が除去された側の第２の樹脂シート２０の表面に凹凸が形成されている。 In the etching step as the fourth step, the third conductor layer 38 is removed from the third composite 40 by the etching process, and the fourth composite 42 is configured. The second resin sheet 20 is cured to a fully cured state or a state close to complete curing by a heat treatment at a high temperature of 140 to 180 degrees in the third step. It can be easily processed by a known etching method without taking into account any modification. After the third conductor layer 38 is removed, the surface of the second resin sheet 20 on the side where the third conductor layer 38 is removed by transferring the irregularities on the surface of the third conductor layer 38. Concavities and convexities are formed on the surface.
　第５工程としての真空熱プレス工程では、第４複合体４２の第２の樹脂シート２０の凹凸を有する表面に対して未硬化の第３の樹脂シート３６が重ね合わされるとともに、第３の樹脂シート３６に対してヒートシンク１４が重ね合わされた状態で真空熱プレス処理が行われ、第１の樹脂シート１８と第２の樹脂シート２０と第３の樹脂シート３６との三層から成る絶縁層３４を備えたヒートシンク付回路基板３２が構成される。第５工程での真空熱プレス処理は、第１工程および第３工程での真空熱プレス処理と同条件で行われる。この第５工程での真空熱プレス処理では、第２の樹脂シート２０と第３の樹脂シート３６との圧着において、第３工程での真空熱プレス処理においてすでに硬化されている第２の樹脂シート２０の表面に形成された凹凸に、第２の樹脂シート２０よりも硬度の低い未硬化の第３の樹脂シート３６が入り込んだ状態で第３の樹脂シート３６が硬化される、第２の樹脂シート２０と第３の樹脂シート３６との間の所謂アンカー効果により、第２の樹脂シート２０と第３の樹脂シート３６とが強固に結合されるとともに、真空処理により第３の樹脂シート３６の第２の樹脂シート２０との貼り合わせ面におけるボイドが除去される。また、未硬化の第３の樹脂シート３６がヒートシンク１４の放熱フィン２４とは反対側の面に対して圧着されつつ硬化されることにより、第３の樹脂シート３６とヒートシンク１４とが結合される。 In the vacuum hot press process as the fifth process, the uncured third resin sheet 36 is superimposed on the surface of the fourth composite 42 having the irregularities of the second resin sheet 20, and the third resin A vacuum hot press process is performed in a state where the heat sink 14 is superimposed on the sheet 36, and an insulating layer 34 composed of three layers of the first resin sheet 18, the second resin sheet 20, and the third resin sheet 36. A circuit board 32 with a heat sink having the above is configured. The vacuum hot press process in the fifth step is performed under the same conditions as the vacuum hot press process in the first step and the third step. In the vacuum hot press process in the fifth step, the second resin sheet that has already been cured in the vacuum hot press process in the third step in the pressure bonding between the second resin sheet 20 and the third resin sheet 36. The second resin, in which the third resin sheet 36 is cured while the uncured third resin sheet 36 having a lower hardness than that of the second resin sheet 20 enters the unevenness formed on the surface of the second resin sheet 20. Due to the so-called anchor effect between the sheet 20 and the third resin sheet 36, the second resin sheet 20 and the third resin sheet 36 are firmly coupled, and the third resin sheet 36 is vacuum-processed. Voids on the bonding surface with the second resin sheet 20 are removed. Further, the third resin sheet 36 and the heat sink 14 are bonded together by the uncured third resin sheet 36 being cured while being pressed against the surface of the heat sink 14 opposite to the heat dissipating fins 24. .
　上述のように、本実施例のヒートシンク付回路基板３２によれば、前述の実施例１のヒートシンク付回路基板と同様の効果を得ることができる。 As described above, according to the circuit board 32 with the heat sink of the present embodiment, the same effects as those of the circuit board with the heat sink of the first embodiment can be obtained.
　また、本実施例のヒートシンク付回路基板３２によれば、第１の樹脂シート１８を、回路１２を構成する第１の導体層２２および第１の樹脂シート１８に固定される側の面に凹凸形状を有する第２の導体層２６との間に挟んだ状態で真空熱プレスして、第１複合体２８を得る第１工程と、第１複合体２８を、エッチングして第２の導体層２６を除去するとともに、第１の導体層２２のうち所望形状を残して除去することにより回路１２が形成された、第２複合体３０を得る第２工程と、第１工程で硬化された第１の樹脂シート１８より硬度の低い未硬化の第２の樹脂シート２０を、第２複合体３０の第１の樹脂シート１８の第２工程で形成された凹凸を有する面に重ね合わせるとともに、第２の樹脂シート２０の第１の樹脂シート１８と向かい合う面の反対側の面に対向するように第３の導体層３８が重ね合わされた状態で真空熱プレスされて、第１の樹脂シート１８と第２の樹脂シート２０とがアンカー効果により結合された第３複合体４０を得る第３工程と、エッチング処理により第３の導体層３８が除去されて、第２の樹脂シート２０の表面に凹凸が形成された第４複合体４２が得られる第４工程と、第４複合体４２の凹凸が形成された第２の樹脂シート２０に第２の樹脂シート２０よりも硬度の低い第３の樹脂シート３６がアンカー効果により結合されるとともに、第３の樹脂シート３６とヒートシンク１４が結合されるように真空熱プレス処理を行う第５工程とから構成されている。このため、第１の樹脂シート１８、第２の樹脂シート２０および第３の樹脂シート３６とがアンカー効果により結合された三層から構成される絶縁層３４により絶縁性能がさらに向上されるとともに、絶縁層１６の熱抵抗の上昇が抑制されたヒートシンク付回路基板３２が得られる。 Moreover, according to the circuit board 32 with a heat sink of the present embodiment, the first resin sheet 18 is uneven on the surface on the side fixed to the first conductor layer 22 and the first resin sheet 18 constituting the circuit 12. A first step of obtaining a first composite 28 by vacuum hot pressing in a state of being sandwiched between a second conductor layer 26 having a shape, and a second conductor layer by etching the first composite 28 26, and the second step of obtaining the second composite 30 in which the circuit 12 is formed by removing the first conductor layer 22 while leaving the desired shape, and the first step cured in the first step. The uncured second resin sheet 20 having a lower hardness than the first resin sheet 18 is overlaid on the surface having the irregularities formed in the second step of the first resin sheet 18 of the second composite 30, and the first Of the second resin sheet 20 and the first resin sheet 18. The first resin sheet 18 and the second resin sheet 20 are bonded to each other by the anchor effect by vacuum hot pressing in a state where the third conductor layer 38 is overlapped so as to face the surface opposite to the contact surface. The third step of obtaining the third composite 40, and the third conductor layer 38 is removed by the etching process, so that the fourth composite 42 in which irregularities are formed on the surface of the second resin sheet 20 is obtained. In the fourth step, the third resin sheet 36 having a lower hardness than the second resin sheet 20 is bonded to the second resin sheet 20 on which the unevenness of the fourth composite 42 is formed, by the anchor effect, 3 and the 5th process of performing a vacuum hot press process so that the resin sheet 36 and the heat sink 14 may be couple | bonded. Therefore, the insulation performance is further improved by the insulating layer 34 composed of three layers in which the first resin sheet 18, the second resin sheet 20, and the third resin sheet 36 are combined by the anchor effect, A circuit board 32 with a heat sink in which an increase in the thermal resistance of the insulating layer 16 is suppressed is obtained.
　図６は、本実施例のヒートシンク付回路基板４４の斜視図である。ヒートシンク付回路基板４４は、回路１２を構成する第１の導体層２２とヒートシンク４６の一面とが絶縁層１６を介して一体化されて構成されている。ヒートシンク４６は、高熱伝導性を有するアルミニウムから形成され、その板厚が３ｍｍよりも大きい大容量ヒートシンクであり、絶縁層１６の第２の樹脂シート２０の硬化により第２の樹脂シート２０と結合されている。 FIG. 6 is a perspective view of the circuit board with heat sink 44 of the present embodiment. The circuit board with heat sink 44 is configured by integrating the first conductor layer 22 constituting the circuit 12 and one surface of the heat sink 46 with the insulating layer 16 interposed therebetween. The heat sink 46 is a large-capacity heat sink formed of aluminum having high thermal conductivity and having a plate thickness larger than 3 mm, and is bonded to the second resin sheet 20 by curing the second resin sheet 20 of the insulating layer 16. ing.
　上述のように、本実施例のヒートシンク付回路基板４４は、前述の実施例１のヒートシンク付回路基板１０と同様の効果を得ることができる。 As described above, the circuit board with heat sink 44 of the present embodiment can obtain the same effects as the circuit board 10 with heat sink of the first embodiment.
　図７は、回路１２が取り除かれた状態の本実施例のヒートシンク付回路基板４８すなわちヒートシンク５０を示す斜視図である。ヒートシンク付回路基板４８は、回路１２を構成する第１の導体層２２とヒートシンク５０の一面とが絶縁層１６を介して一体化されて構成されている。ヒートシンク５０は、高熱伝導性を有するアルミニウムから形成され、その板厚が３ｍｍよりも大きく、放熱フィン５２がアルミ板の一面から縦横等間隔で突設された大容量ヒートシンクであり、絶縁層１６の第２の樹脂シート２０の硬化により第２の樹脂シート２０と結合されている。 FIG. 7 is a perspective view showing the circuit board 48 with the heat sink, that is, the heat sink 50 of the present embodiment in a state where the circuit 12 is removed. The circuit board 48 with the heat sink is configured by integrating the first conductor layer 22 constituting the circuit 12 and one surface of the heat sink 50 via the insulating layer 16. The heat sink 50 is a large-capacity heat sink that is formed of aluminum having high thermal conductivity, has a plate thickness larger than 3 mm, and has heat radiating fins 52 protruding from one surface of the aluminum plate at equal intervals in the vertical and horizontal directions. The second resin sheet 20 is bonded to the second resin sheet 20 by curing.
　上述のように、本実施例のヒートシンク付回路基板４８は、前述の実施例１のヒートシンク付回路基板１０と同様の効果を得ることができる。 As described above, the circuit board 48 with the heat sink of the present embodiment can obtain the same effects as the circuit board 10 with the heat sink of the first embodiment.
　以上、本発明を表及び図面を参照して詳細に説明したが、本発明は更に別の態様でも実施でき、その主旨を逸脱しない範囲で種々変更を加え得るものである。 As mentioned above, although this invention was demonstrated in detail with reference to the table | surface and drawing, this invention can be implemented in another aspect, and can be variously changed in the range which does not deviate from the main point.
　たとえば、前述の実施例１のヒートシンク付回路基板１０の絶縁層１６および実施例２のヒートシンク付回路基板３２の絶縁層３４は、二層あるいは三層の樹脂シートから構成されるものであったが、これに限定されるものではなく、たとえば、前述の実施例２の前記第３工程により得られる第３複合体４０に対して、少なくとも圧着時において、第２の樹脂シート２０よりも硬度の低い樹脂シートを用いて前記第２工程および前記第３工程と同様の工程が繰り返されることにより、４層以上の樹脂シートから構成される絶縁層を備えたヒートシンク付回路基板であってもよい。 For example, the insulating layer 16 of the circuit board with heat sink 10 of Example 1 and the insulating layer 34 of the circuit board 32 with heat sink of Example 2 are composed of two or three resin sheets. However, the present invention is not limited to this. For example, the hardness of the third composite body 40 obtained by the third step of the above-described second embodiment is lower than that of the second resin sheet 20 at least during pressure bonding. A circuit board with a heatsink provided with an insulating layer composed of four or more resin sheets may be obtained by repeating steps similar to the second step and the third step using a resin sheet.
　また、前述の実施例１のヒートシンクと結合された第２の樹脂シートが、ガラス繊維を含んでいてもよい。このようにすれば、第２の樹脂シートに含まれるガラス繊維により、第２の樹脂シートとヒートシンクとの密着性が向上される。 Further, the second resin sheet combined with the heat sink of Example 1 described above may contain glass fibers. If it does in this way, the adhesiveness of a 2nd resin sheet and a heat sink will improve with the glass fiber contained in a 2nd resin sheet.
　なお、上述したのはあくまでも一実施形態であり、その他一々例示はしないが、本発明は、その主旨を逸脱しない範囲で当業者の知識に基づいて種々変更、改良を加えた態様で実施することができる。 It should be noted that the above description is merely an embodiment, and other examples are not illustrated. However, the present invention is implemented in variously modified and improved modes based on the knowledge of those skilled in the art without departing from the gist of the present invention. Can do.
１０、３２、４４、４８：ヒートシンク付回路基板
１２：回路
１４、４６、５０：ヒートシンク
１６、３４：絶縁層
１８：第１の樹脂シート
２０：第２の樹脂シート
２２：第１の導体層（導体層）
２６：第２の導体層
２８：第１複合体
３０：第２複合体
４０：第３複合体
４２：第４複合体 10, 32, 44, 48: circuit board with heat sink 12: circuits 14, 46, 50: heat sink 16, 34: insulating layer 18: first resin sheet 20: second resin sheet 22: first conductor layer ( Conductor layer)
26: second conductor layer 28: first composite 30: second composite 40: third composite 42: fourth composite

Claims (4)

  1. 　回路を構成する導体層と大容量ヒートシンクの一面とが絶縁層を介して一体化され、該絶縁層は互いに熱圧着された一対の第１および第２の樹脂シートを含むヒートシンク付回路基板であって、少なくとも圧着時には前記一対の第１および第２の樹脂シートのうち、第２の樹脂シートより硬度が高い第１の樹脂シートの圧着面に凹凸が形成されており、前記第１の樹脂シートと前記第２の樹脂シートとがアンカー効果により結合されていることを特徴とするヒートシンク付回路基板。 A conductor layer constituting a circuit and one surface of a large-capacity heat sink are integrated via an insulating layer, and the insulating layer is a circuit board with a heat sink including a pair of first and second resin sheets that are thermocompression bonded to each other. In addition, at least when the pressure bonding is performed, the first resin sheet has an unevenness formed on the pressure-bonding surface of the first resin sheet having a hardness higher than that of the second resin sheet among the pair of first and second resin sheets. A circuit board with a heat sink, wherein the second resin sheet is bonded to the second resin sheet by an anchor effect.
  2. 　前記絶縁層が、前記第１の樹脂シートと前記第２の樹脂シートの２層からなることを特徴とする請求項１のヒートシンク付回路基板。 The circuit board with a heat sink according to claim 1, wherein the insulating layer comprises two layers of the first resin sheet and the second resin sheet.
  3. 　回路を構成する導体層と大容量ヒートシンクの一面とが絶縁層を介して一体化され、該絶縁層は互いに熱圧着された一対の第１および第２の樹脂シートを含むヒートシンク付回路基板の製造方法であって、前記第１の樹脂シートを、回路を構成する第１の導体層および前記第１の樹脂シートに固定される側の面に凹凸形状を有する第２の導体層との間に挟んだ状態で真空熱プレスして、第１複合体を得る第１工程と、
    　エッチングにより該第１複合体の前記第１の導体層に前記回路を構成し、且つ前記第２の導体層を除去して、第２複合体を得る第２工程と、
    　前記第１の樹脂シートより硬度の低い前記第２の樹脂シートを介して、前記第２複合体の前記第１の樹脂シートとヒートシンクを重ね合わせた状態で真空熱プレスする第３工程とを含むことを特徴とするヒートシンク付回路基板の製造方法。     Manufacturing a circuit board with a heat sink including a pair of first and second resin sheets in which a conductor layer constituting a circuit and one surface of a large capacity heat sink are integrated via an insulating layer, and the insulating layer is thermocompression bonded to each other It is a method, Comprising: A said 1st resin sheet is arrange | positioned between the 1st conductor layer which comprises a circuit, and the 2nd conductor layer which has an uneven | corrugated shape in the surface fixed to the said 1st resin sheet. A first step of vacuum heat pressing in a sandwiched state to obtain a first composite;
    A second step of forming the circuit in the first conductor layer of the first composite by etching and removing the second conductor layer to obtain a second composite;
    A third step of performing vacuum heat pressing in a state where the first resin sheet and the heat sink of the second composite are overlapped with each other through the second resin sheet having a lower hardness than the first resin sheet. A method of manufacturing a circuit board with a heat sink.
  4. 　回路を構成する導体層と大容量ヒートシンクの一面とが絶縁層を介して一体化され、該絶縁層は互いに熱圧着された一対の第１および第２の樹脂シートを含むヒートシンク付回路基板の製造方法であって、前記第１の樹脂シートを、回路を構成する第１の導体層および前記第１の樹脂シートに固定される側の面に凹凸形状を有する第２の導体層との間に挟んだ状態で真空熱プレスして、第１複合体を得る第１工程と、
    　エッチングにより該第１複合体の第１の導体層に回路を構成し、且つ前記第２の導体層を除去して、第２複合体を得る第２工程と、
    　前記第１の樹脂シートより硬度の低い前記第２の樹脂シートを、前記第２複合体の前記第１の樹脂シートに重ね合わせた状態で真空熱プレスして、第３複合体を得る第３工程と、
    　前記第２の樹脂シートより硬度は低い第３の樹脂シートを用いて、前記第２工程および前記第３工程と同様の工程により、第４複合体を得る第４工程と、
    　該第４複合体とヒートシンクを重ね合わせた状態で真空熱プレスする第５工程とを含むことを特徴とするヒートシンク付回路基板の製造方法。     Manufacturing a circuit board with a heat sink including a pair of first and second resin sheets in which a conductor layer constituting a circuit and one surface of a large capacity heat sink are integrated via an insulating layer, and the insulating layer is thermocompression bonded to each other It is a method, Comprising: A said 1st resin sheet is arrange | positioned between the 1st conductor layer which comprises a circuit, and the 2nd conductor layer which has an uneven | corrugated shape in the surface fixed to the said 1st resin sheet. A first step of vacuum heat pressing in a sandwiched state to obtain a first composite;
    A second step of forming a circuit in the first conductor layer of the first composite by etching and removing the second conductor layer to obtain a second composite;
    The second resin sheet having a hardness lower than that of the first resin sheet is vacuum hot pressed in a state where the second resin sheet is superposed on the first resin sheet of the second composite to obtain a third composite. Process,
    A fourth step of obtaining a fourth composite by a step similar to the second step and the third step, using a third resin sheet having a lower hardness than the second resin sheet;
    A method of manufacturing a circuit board with a heat sink, comprising: a fifth step of vacuum heat pressing the fourth composite and the heat sink in a superposed state.
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JP2003046260A (en) * 2001-07-30 2003-02-14 Fujitsu Ltd Multilayer circuit board and its manufacturing method
WO2011018968A1 (en) * 2009-08-10 2011-02-17 太陽インキ製造株式会社 Printed wiring board and method for producing the same
WO2014021438A1 (en) * 2012-08-03 2014-02-06 日立化成株式会社 Wiring board with heat sink, component-mounted wiring board with heat sink, and manufacturing method of these

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046260A (en) * 2001-07-30 2003-02-14 Fujitsu Ltd Multilayer circuit board and its manufacturing method
WO2011018968A1 (en) * 2009-08-10 2011-02-17 太陽インキ製造株式会社 Printed wiring board and method for producing the same
WO2014021438A1 (en) * 2012-08-03 2014-02-06 日立化成株式会社 Wiring board with heat sink, component-mounted wiring board with heat sink, and manufacturing method of these

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