JP6059964B2 - Manufacturing method of heat dissipation member with adhesive layer, and manufacturing method of semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor in which an electronic component including a semiconductor element and a heat radiating member for radiating heat generated by the electronic component are bonded by a cured product obtained by curing a thermosetting resin composition containing an inorganic filler. The present invention relates to a method for manufacturing a heat radiating member with an adhesive layer used for forming a device, and a method for manufacturing a semiconductor device for manufacturing the semiconductor device.

Conventionally, when an electronic component having a large calorific value such as a power transistor is used as a component of a semiconductor device, a heat radiating member such as a heat radiating fin is also used as a member constituting the semiconductor device in order to promote heat dissipation from the semiconductor device. It is used.
As the power transistor, a type in which a heat sink is exposed on the back side is widely used, and the heat sink extends outside a portion where a semiconductor chip is resin-molded, and a screw is formed at the extended portion. Those having through holes for stopping are widely used.
When this type of power transistor is used in a semiconductor device, the heat radiating fin and the power transistor are fixed by screwing using the through hole so that the heat radiating plate is in contact with the heat radiating plate. .
At this time, in order to improve heat transfer from the power transistor to the heat radiating fin, a silicone rubber sheet (heat radiating sheet) or silicone grease (heat radiating grease) containing an inorganic filler is interposed.

It is required that the heat transfer property from the electronic component such as the power transistor to the heat radiating member such as the heat radiating fin is further improved.
Therefore, in recent years, as shown in Patent Document 1 below, a heat containing a thermosetting resin such as an epoxy resin and an inorganic filler excellent in thermal conductivity such as boron nitride particles or aluminum nitride particles. A sheet body called an adhesive sheet having excellent thermal conductivity is formed with a curable resin composition, and an electronic component and a heat dissipation member are bonded with the adhesive sheet.
For example, in the case of the heat radiating sheet, since it is usually necessary to cause elastic deformation, there is a limit to highly filling the inorganic filler, and the thermal conductivity is at most 5 W / (m · K). However, in the case of the adhesive sheet, it is not difficult to contain 50% by volume or more of the inorganic filler, and it exceeds 5 W / (m · K), and in some cases reaches 10 W / (m · K). It is easy to produce one having a good thermal conductivity.

In addition, when using heat dissipation grease or heat dissipation sheet, usually a separate fixture is required to maintain the contact state between the electronic component and the heat dissipation member. This is also advantageous in that the heat radiation member can be bonded and fixed.
Furthermore, a non-insulated electronic component in which the heat spreader is also used as a casing and the heat spreader is energized during operation is required to ensure insulation between the heat dissipation member and the heat spreader. However, the adhesive sheet is also excellent in electrical insulation, and since the cured product usually has a volume resistivity of 1 × 10 ¹² Ω · cm or more, it can be said to be particularly suitable for heat dissipation of this type of electronic component. .

On the other hand, since the adhesive sheet is brittle and easily cracked by being highly filled with an inorganic filler, it is usually necessary to handle it carefully when attempting to improve its thermal conductivity.
From this, the heat radiating member with an adhesive layer in which the adhesive layer is formed on the surface of the heat radiating member by the thermosetting resin composition used for forming the adhesive sheet is used for forming the semiconductor device. Yes.
That is, in this type of heat dissipation member with an adhesive layer, since the adhesive layer is held on the surface of the heat dissipation member, troubles such as cracks occur in the adhesive layer in the operation of manufacturing a semiconductor device. Work can be made easier compared to the case where a semiconductor device is manufactured using a single adhesive sheet with low risk.

The manufacturing method of the heat radiating member with an adhesive layer will be described. For example, as shown in FIG. 4, a sheet body 11x made of a thermosetting resin composition containing an inorganic filler is set at the center of the upper surface of the heat radiating fin 10x. Prepare a plurality of these, and arrange them on the lower hot plate 510x of the heat press 500x that can be moved up and down by a hydraulic cylinder at an appropriate interval. In this state, lift the lower hot plate 510x. The heat radiation fin 10x on which the sheet body 11x is set is sandwiched between the upper heat plate 520x and heat is applied by the upper and lower heat plates to soften the sheet body to exhibit surface adhesion and to use the sheet body as a heat radiation fin. These are bonded and integrated by pressure contact.
When adhering to such a heat radiating fin, if the thermosetting resin constituting the sheet body is excessively thermoset and the B-stage is excessively advanced, the adhesive force when adhering electronic components is increased. There is a risk of being lost.

For this reason, when manufacturing a heat radiating member with an adhesive layer, a step of quickly cooling the sheet body to about room temperature after being bonded by hot pressing as described above may be performed. ing.
However, in order to sufficiently soften the sheet body highly filled with the inorganic filler to adhere well to the heat radiating member, the sheet body must be heated to a high temperature, so that the thermosetting resin constituting the sheet body It is difficult to suppress the curing reaction.
That is, it has become difficult to obtain a heat radiating member with an adhesive layer that has excellent heat dissipation while having excellent heat dissipation, and a semiconductor device that is excellent in heat dissipation of heat generated by electronic components It's getting harder to get.

JP 2010-132840 A

  The present invention has been made in view of such problems, and provides a heat-dissipating member with an adhesive layer that has excellent heat-dissipating property and excellent adhesiveness with an electronic component. It is an object of the present invention to provide a semiconductor device that is excellent in heat dissipation of generated heat.

  The present invention according to the method for manufacturing a heat radiating member with an adhesive layer for solving the above-described problem is that an electronic component including a semiconductor element and a heat radiating member for radiating heat generated by the electronic component contain an inorganic filler. An adhesive layer for bonding the electronic component to the surface of the heat dissipation member is used for forming a semiconductor device bonded by a cured product obtained by curing a thermosetting resin composition, and the thermosetting resin composition A method for producing a heat radiating member with an adhesive layer, which is formed by cooling a sheet body made of the thermosetting resin composition from one side with a cooling member. While the heat-radiating member heated in advance is brought into contact with the other surface opposite to the side cooled by the cooling member, the heat of the heat-dissipating member exerts adhesiveness on the surface of the sheet body and the cooling Between the structural member and the heat dissipation member Serial and the sheet member adhered to the heat dissipation member by pressurizing across the sheet member is characterized in that to form the adhesive layer.

  In addition, the present invention relating to a method for manufacturing a semiconductor device is characterized by using the heat dissipation member with an adhesive layer as described above.

In the method for producing a heat radiating member with an adhesive layer of the present invention, since the preheated heat radiating member is brought into contact with the surface of a sheet body made of a thermosetting resin composition containing an inorganic filler, the thermosetting is performed. The surface of the sheet body can be quickly heated by heating the heat radiating member above the temperature at which the adhesive property of the adhesive resin is exhibited, and the sheet body and the heat radiating member are in a good bonding state. It can be glued with.
That is, even when using a sheet body highly filled with inorganic filler, the surface of the sheet body can be quickly brought to a temperature at which good adhesion can be performed by heating the heat dissipation member to a predetermined temperature in advance. Can be heated.
And since the cooling by the cooling member is implemented in the other surface side of a sheet | seat body, it can suppress that B-staging progresses too much in the side used for adhesion | attachment with an electronic component.
Therefore, according to the present invention, it is possible to provide a heat-dissipating member with an adhesive layer that has excellent heat dissipation properties and excellent adhesion to electronic components, and is excellent in heat dissipation properties of heat generated by electronic components. A semiconductor device can be provided.

The schematic perspective view which shows the usage method of the thermal radiation member with an adhesive bond layer of one Embodiment. The schematic perspective view which showed an example of the process (preheating process) which heats a thermal radiation member beforehand. The schematic front view which showed a mode that the preheated heat radiating member and a sheet | seat body were adhere | attached, and the heat radiating member with an adhesive bond layer was formed. The schematic perspective view which shows the method of producing the conventional heat radiating member with an adhesive bond layer.

Below, preferable embodiment which concerns on the heat conductive sheet of this invention is described, referring a figure.
First, the utilization method of the heat radiating member with an adhesive layer of the present embodiment will be described with reference to FIG. 1 which is a schematic perspective view showing a heat radiating member with an adhesive layer and an electronic component.
As shown in the drawing, here, as an electronic component used for forming a semiconductor device, an electronic component 2 having a main body portion 20 having a flat rectangular parallelepiped shape is exemplified to cool the electronic component 2. The heat radiating member 1 with an adhesive layer used will be described.
In addition, the electronic component 2 has three plate-like main terminals 21a and ten needle-like control terminals 21b protruding from two opposite side surfaces of the four side surface portions of the main body portion 20. The terminals 21a and 21b are projected outward at a substantially central portion in the thickness direction of the main body portion 20.
Further, the electronic component 2 of the present embodiment is provided with a heat radiating plate 22 for radiating the heat of the semiconductor element in the main body to the outside, and the heat radiating plate 22 at the center of the bottom surface portion 2 b of the electronic component 2. The upper surface of the heat radiating plate 22 is mounted with the semiconductor element (not shown) and is resin-molded.
That is, the electronic component 2 of this embodiment is a non-insulating type in which the heat radiating plate 22 is energized during operation.

In this embodiment, the electronic component 2 and the heat radiating member 10 for radiating the heat generated by the electronic component 2 are bonded with a thermosetting resin composition containing an inorganic filler. As shown in FIG. 1, the heat dissipation member 1 with an adhesive layer is formed with an adhesive layer 11 for bonding the electronic component 2 to the surface of the heat dissipation member 10, and the adhesive layer 11 is thermosetting. It is formed by a sheet body 11a made of a resin composition.
The heat dissipation member 1 with an adhesive layer of the present embodiment is formed by adhering a sheet body 11 a that is slightly larger than the contour shape of the electronic component 2 to the heat dissipation member 10.

The heat radiating member 10 is not particularly limited in shape, size, material, and the like as long as it can be used for heat dissipation of the electronic component 2, and may be aluminum, copper, tin, nickel, iron, titanium, or the like. A general metal, an alloy thereof, or a material formed of ceramics can be used. However, in this embodiment, it is easy to obtain a relatively inexpensive one and many similar varieties are commercially available. Therefore, from the viewpoint of easy design change and the like, a heat radiating fin (aluminum extruded heat radiating fin) obtained by extruding aluminum into a fin shape and cutting it at a predetermined length is employed.
The heat radiating member 10 may be formed in a flat block shape, or may have a heat pipe function in which the inside is hollow and hydraulic fluid is sealed in the hollow area.

  The aluminum extrusion heat dissipating fin has a rectangular plate-shaped substrate portion 10a and a plurality of fin portions 10b erected from the back surface S1 of the substrate portion 10a, and the side on which the fin portion 10b is provided; The surface S2 of the opposite substrate portion 10a is formed as a substantially flat surface to which the sheet body 11a is bonded.

The sheet body 11a for forming the adhesive layer 11 by being bonded to the heat radiating member 10 has a thickness of generally 10 μm to 10 μm in order to impart a good balance of characteristics such as thermal resistance, insulation reliability, and adhesiveness. It is 500 μm, preferably 50 μm to 300 μm, and more preferably 100 μm to 200 μm.
In addition, in providing excellent thermal conductivity and adhesiveness to these adhesive layers 11, the thermosetting resin composition constituting the sheet body 11a includes an epoxy resin, a phenol resin, and It is preferable to contain an inorganic filler and to contain the inorganic filler in an amount of 40 to 70% by volume.

  Examples of the epoxy resin include triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and modified bisphenol F type epoxy. Various epoxy resins such as resin, dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, and phenoxy resin can be used alone or in combination of two or more.

Moreover, as said phenol resin, dicyclopentadiene type phenol resin, novolak type phenol resin, cresol novolak resin, phenol aralkyl resin, triphenylmethane type phenol resin, etc. are employable, for example.
Especially, a triphenylmethane type phenol resin is advantageous in heat resistance, and a phenol aralkyl resin can be preferably used in order to exhibit favorable adhesiveness between a heat radiating member and an electronic component.

In addition, although the said phenol resin functions as a hardening | curing agent of an epoxy resin, if needed, other hardening | curing agents and hardening accelerators may be added, and the thermosetting property of a thermosetting resin composition may be adjusted. Also good.
Examples of the curing agent include amine curing agents such as diaminodiphenyl sulfone, dicyandiamide, diaminodiphenylmethane, and triethylenetetramine, and acid anhydride curing agents.
Examples of the curing accelerator include amine-based curing accelerators such as imidazoles, triphenyl phosphate (TPP), and boron trifluoride monoethylamine.

Further, as the inorganic filler, nitrides such as boron nitride particles, aluminum nitride particles, silicon nitride particles and gallium nitride particles, alumina (aluminum oxide) particles, silica (silicon oxide) particles, zirconium oxide (zirconia) particles, oxidized Titanium (titania) particles, barium titanate particles, hafnium oxide particles, zinc oxide particles, metal oxide particles such as iron oxide particles, silicon carbide particles, diamond particles, and the like can be used.
Among these, boron nitride particles having excellent thermal conductivity can be preferably used.
In particular, it is preferable to employ boron nitride particles in the form of aggregated particles having a size of about 20 μm to 100 μm by aggregating and integrating a plurality of hexagonal plate-like primary particles.
However, boron nitride particles have few surface functional groups effective for exerting interaction with epoxy resin or phenol resin, and in order to exert excellent cohesive failure strength in the adhesive layer Are preferably used in combination with alumina particles and silica particles.
In addition, since the alumina particle and the silica particle are contained in the thermosetting resin composition so as to use the surface functional group, it is preferable that the particle size is fine.

That is, the thermosetting resin composition contains a total of 40 volume% to 70 volume% of metal oxide particles and boron nitride particles made of at least one of alumina particles and silica particles, and the metal oxide particles. And the boron nitride particles are preferably contained in a volume ratio of 10:90 to 50:50 (metal oxide particles: boron nitride particles), and the metal oxide particles have a median diameter of 0.5 μm. It is preferable that it is -30 micrometers.
The metal oxide particles preferably have a median diameter of 0.5 to 10 μm.
The median diameter can be obtained by measurement with a laser diffraction / scattering particle size distribution meter.
By containing boron nitride particles and metal oxide particles as described above, the thermal conductivity of the adhesive layer after thermosetting can be set to 4.5 W / mK or more, for example, 3 oz (105 μm). ) Can be set to 5.7 N / cm or more.

It is preferable to contain boron nitride particles in the state of agglomerated particles in the adhesive layer 11. The agglomerated particles effectively act to form a good heat transfer path in the thickness direction of the adhesive layer 11. Because.
The primary particles of boron nitride are usually in the shape of a hexagonal plate as described above, and the aggregated particles have a shape close to a sphere in which a plurality of primary particles are assembled. If the cross section is observed with a microscope, it can be easily determined whether or not boron nitride particles are contained as aggregated particles.
As described above, this agglomerated particle is an effective component for forming a good heat transfer path, and 50% of the boron nitride particles to be contained in the adhesive layer 11 can be used to exhibit excellent thermal conductivity. It is preferable to contain at least mass% in the form of aggregated particles.

  It is preferable that the boron nitride particles and the metal oxide particles have a volume ratio within the above range because the volume ratio of the metal oxide particles in the total of the boron nitride particles and the metal oxide particles is If it exceeds 50%, it becomes difficult to impart sufficient thermal conductivity to the adhesive layer, and if the volume ratio of the metal oxide particles is less than 10%, it is difficult to impart excellent cohesive failure strength to the adhesive layer. It is to become.

  In addition, it is preferable that the median diameter of the metal oxide particles is within the above range. Outside the above range, the metal oxide particles inhibit a good heat transfer path formed by the boron nitride aggregated particles, and thus the adhesive. This is because the thermal conductivity of the layer may be reduced.

The thermosetting resin composition may contain a polymer other than an epoxy resin or a phenol resin, or an inorganic filler other than boron nitride particles or metal oxide particles.
Further, the thermosetting resin composition includes a resin such as a dispersant, a tackifier, an antioxidant, an antioxidant, a processing aid, a stabilizer, an antifoaming agent, a flame retardant, a thickener, and a pigment. Formulated chemicals generally used in products can be appropriately contained.

As a method for producing a heat radiating member with an adhesive layer by using a sheet body made of such a thermosetting resin composition and forming an adhesive layer on the heat radiating member with the sheet body, for example, the following a) to g: ) In order.

a) Coating liquid preparation step The epoxy resin and the phenol resin are dissolved in an organic solvent in which the epoxy resin and the phenol resin can be dissolved, and the boron nitride particles and the metal oxide are dissolved in the resin solution. A coating liquid preparation process in which particles and the like are dispersed to prepare a coating liquid;
b) Coating step A coating step in which a mat-processed resin film or electrolytic copper foil is used as a transfer sheet, and the mat surface of the transfer sheet is coated with the coating liquid.
c) Drying step A drying step in which the transfer sheet coated with the coating liquid is introduced into a drying furnace, the organic solvent is removed, and a dry film of the coating liquid is formed on the transfer sheet.
d) Laminating step Two transfer sheets with the dry coating formed thereon are prepared, stacked so that the dry coating is on the inside, and hot-pressed so that these dry coatings are stacked and integrated, and then dried. A laminating step of forming a laminated sheet in which a sheet body formed by laminating a film is sandwiched between two transfer sheets;
e) External shape processing step External shape processing step of cutting the laminated sheet into a shape that is slightly larger than the contour shape of the electronic component 2 and then removing the transfer sheet to produce a sheet body 11a for forming an adhesive layer.
f) Preheating step A preheating step of heating the heat radiating member 10 so that the surface temperature of the substrate portion 10a of the heat radiating member 10 becomes a temperature at which the sheet body 11a can exhibit surface adhesiveness,
g) Cooling press step A heat radiating member heated to a predetermined temperature in the preheating step is brought into contact with the surface of the sheet body to exhibit adhesiveness on the surface and a plate-shaped cooling member (cooling plate) from the back side. The sheet body is cooled by contacting the sheet body, and the sheet body is pressed between the cooling plate and the heat radiating member to form the adhesive layer by adhering the sheet body to the heat radiating member. The cooling press process.

In addition, the said coating liquid preparation process can be implemented using stirring apparatuses, such as a ball mill, a planetary mixer, a homogenizer, and a 3 roll mill.
However, it is preferable to select an apparatus in which such a phenomenon is unlikely to occur because there is a possibility that aggregated particles of boron nitride may be crushed if shearing is excessively applied to the coating solution.
Further, it is preferable to adjust the operating conditions of the apparatus so that the aggregated particles are not crushed.

  The coating process can be performed using a coating apparatus such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a knife coater, a comma coater, or a direct coater, and the drying process is performed using a general heating and drying furnace. Can be implemented.

The coating liquid preferably contains a total of 40% to 70% by volume of metal oxide particles and boron nitride particles with respect to the solid content, but usually contains only this amount of inorganic filler. If contained, fine voids may be formed in the dry film, and the apparent film thickness may be increased.
The laminating step is effective in preventing the formation of a defect penetrating in the thickness direction by stacking two dry films, but defects such as voids due to the voids described above are adhesives. This is also effective in suppressing the formation of the layer.
Further, it can be said that the laminating process is also effective for bringing boron nitride particles close to each other to form a heat transfer path mainly composed of aggregated particles.

In the point that the effects as described above can be exhibited more remarkably, it is preferable to perform the lamination process at a higher temperature and a higher pressure, but in the lamination process, excessive heat is applied to the thermosetting resin composition. There is a risk that the curing reaction of the epoxy resin and the like will proceed excessively and the adhesive force to the heat dissipation member will be greatly reduced.
In addition, since the same kind of effect can be expected in the subsequent hot pressing process, the hot pressing in the laminating process may be of a temporary bonding level.

  The outer shape processing step can be carried out by punching with a Thomson blade mold.

In the preheating step, in addition to a method of heating the entire heat radiating member by storing the heat radiating member in a heating furnace set at a predetermined temperature for a predetermined time, for example, as shown in FIG. The heat radiating member 10 is placed on the substrate 210 so that the surface S2 of the substrate portion 10a faces downward, or only the surface portion of the substrate portion is selectively selected by performing electromagnetic induction heating from the substrate portion side. It is possible to employ a method in which the surface of the substrate portion is heated to a predetermined temperature and a portion that does not participate in adhesion to the sheet body 11a such as the fin portion 10b is made lower than the surface of the substrate portion.
In the preheating process, it is preferable to heat only the necessary part to the necessary temperature as described above in consideration of the cooling performance in the subsequent cooling press process, but the heat radiation member may be distorted by local heating. In addition, when it has it, you may heat the whole heat radiating member to required temperature.

  Although the temperature of the heat radiating member at this time depends on the heat capacity of the heat radiating member, etc., the softening of the sheet body usually obtained by conducting a test based on JIS K7234 (ring ball method) on the sheet body. The temperature can be higher by 5 ° C to 20 ° C than the point.

  In the cooling press step, for example, as shown in FIG. 3, a cooling plate 310 that is cooled so that the coolant CL is internally circulated and has a surface temperature of room temperature or lower is disposed horizontally, and the sheet is placed thereon. The body 11a is placed thereon, and the heat dissipating member 10 preheated in the preheating step is placed thereon with the surface S2 of the substrate portion 10a facing downward, and the heat dissipating member 10 and the cooling plate 310 are The sheet body 11a may be sandwiched between them and pressurized with a predetermined pressure F.

In addition, the surface temperature of the said cooling plate at this time can be normally less than 20 degreeC.
Moreover, what is necessary is just to implement this cooling press process so that the pressure of 0.5 Mpa-10 Mpa may act on a sheet | seat body for the time for 0.5 minute (30 second)-30 minutes normally.

In the present embodiment, the cooling plate 310 is brought into contact with the sheet body 11a in consideration of the cooling efficiency of the sheet body 11a. However, a resin film or metal is interposed between the sheet body 11a and the cooling plate 310. You may make it insert foil.
For example, the cooling press may be performed in a state where an aluminum foil coated with a fluorine resin is inserted between the sheet body 11a and the cooling plate 310.
Moreover, in the above, although the case where a plate-shaped cooling member is used for cooling the sheet body 11a is illustrated, the cooling member having various shapes such as a block shape other than the plate shape is used in the cooling press step. It can be used instead of the cooling plate.

  In the conventional manufacturing method of the heat radiating member with an adhesive layer, since heating is performed from both the heat radiating member and the sheet body by hot pressing, the interface between the sheet body to be bonded and the heat radiating member reaches a predetermined temperature. In addition, the curing reaction proceeds on the contact surface between the hot plate and the sheet body of the hot press, and there is a possibility that the B-stage is excessively advanced. In the manufacturing method, there is a low possibility of causing such a problem.

This point will be described in more detail. In a preferred embodiment of the present embodiment, a sheet body highly filled with 40% to 70% by volume of inorganic filler is used, so the surface of the sheet body is heated to a high temperature. Otherwise, it may be difficult to perform good adhesion to the heat dissipation member.
On the other hand, in a preferable aspect in the present embodiment, the sheet body is formed by a thermosetting resin composition in which an epoxy resin and a phenol resin are employed as resin components to be contained. If it is heated too much, many epoxy resins and phenol resin resins react to consume epoxy groups and phenolic hydroxyl groups, which may make it difficult to exert adhesive force when bonding to electronic components.

However, in the present embodiment, the sheet body is bonded to the heat radiating member while the surface opposite to the surface bonded to the heat radiating member is cooled by the cooling plate, so that the bonding surface with the heat radiating member is heated to a high temperature. Thus, it is possible to prevent the B-stage from excessively progressing on the surface used for adhesion to the electronic component while maintaining a good adhesion state.
That is, even if the preheating temperature of the heat dissipating member is set to a high temperature, the surface of the adhesive layer formed by the sheet body is excellent in adhesion to electronic parts by setting the cooling plate to a cooling temperature commensurate with it. can do.
In addition, since the heat dissipation member is usually made of metal or ceramics, it is usually less likely to cause a problem just by heating to about 200 ° C. to 300 ° C. The heat dissipation member is heated to such a temperature. It is also possible to shorten the time required for adhesion to the sheet body.

  The semiconductor device obtained by using the heat radiating member with the adhesive layer obtained in this manner has a good adhesion between the electronic component and the adhesive layer, and the adhesive layer and the heat radiating member. Thermal resistance is sufficiently low and heat dissipation is excellent.

In addition, when individual differences of the heat radiating member with the adhesive layer occur in the adhesiveness with the electronic component, depending on the degree of progress of the curing of the adhesive layer when manufacturing these semiconductor devices by bonding them to the electronic component The necessity of varying the bonding conditions will arise.
Therefore, from the viewpoint of work efficiency, it is preferable to make the bonding condition to the electronic component constant. After the hot pressing process, before bonding to the electronic component, the degree of curing of the adhesive layer is determined and the degree is adjusted. It is preferable to further provide a curing degree adjusting step.

The progress of the curing of the adhesive layer (the degree of B-stage) can be confirmed by near infrared spectroscopy (NIR). From the high accuracy of the analysis, an acousto-optic variable wavelength filter (Acousto-Optic Tunable) is used. (Filter) It is preferable to confirm by near infrared spectroscopic analysis (AOTF-NIR) of a spectroscopic system.
More specifically, by AOTF-NIR, the degree of progress of curing is determined by the intensity ratio of the absorption peak derived from aromatics appearing near 4611 cm ⁻¹ and the absorption peak derived from epoxy groups appearing near 4525 cm ^−1. preferable.

That is, even if the curing reaction of the adhesive layer proceeds, the peak height of the absorption peak appearing in the vicinity of 4611 cm ⁻¹ hardly changes, but the peak height of the absorption peak appearing in the vicinity of 4525 cm ⁻¹ is the same as the adhesive layer. since the curing reaction of decreases as it proceeds, for example, the peak height I _ARM absorption peak appearing in the vicinity of 4611cm ^-1, a peak height of the absorption peak appearing in the vicinity of 4525cm ^-1 when the I _EPX The degree of curing can be determined with high accuracy by these ratios (I _EPX / I _ARM ).

  The curing degree adjusting step can be carried out by heating the heat radiating member with an adhesive layer at a predetermined temperature for a predetermined time, and the heating temperature and heating time at that time are the degree of curing by the AOTF-NIR. What is necessary is just to set based on a determination result.

  In this way, the method of adhering the heat dissipation member 1 with the adhesive layer and the electronic component 2 whose adhesion to the electronic component is adjusted can be carried out in the same manner as the conventional method, and the heat dissipation with the adhesive layer is performed. The member 1 is heated to a temperature equal to or higher than the softening temperature of the thermosetting resin constituting the thermosetting resin composition to cause the adhesive layer 11 to exhibit surface tackiness. There is a method in which the thermosetting resin composition is thermally cured by continuing heating while pressure-contacting and the electronic component 2 and the heat dissipation member 1 with an adhesive layer are bonded and integrated.

  In addition, although further detailed explanation is omitted here, the heat dissipation member with adhesive layer and the semiconductor device of the present invention are not limited to the above-mentioned examples, and heretofore known technical matters in these technical fields are described. As long as the effect of the invention is not significantly impaired, it can be adopted as appropriate.

DESCRIPTION OF SYMBOLS 1 Heat radiation member with adhesive layer 2 Electronic component 10 Heat radiation member 10a Substrate part 10b Fin part 11 Adhesive layer 11a Sheet body 22 Heat radiation plate

Claims (4)

For forming a semiconductor device in which an electronic component including a semiconductor element and a heat dissipation member for radiating heat generated by the electronic component are bonded by a cured product obtained by curing a thermosetting resin composition containing an inorganic filler. Manufacture of a heat dissipation member with an adhesive layer used to manufacture a heat dissipation member with an adhesive layer in which an adhesive layer for adhering the electronic component to the surface of the heat dissipation member is formed of the thermosetting resin composition A method,
A heat radiating member preheated on the other surface side opposite to the side cooled by the cooling member while cooling the sheet body made of the thermosetting resin composition from one surface side by the cooling member. The sheet body is brought into contact with the surface of the sheet body by the heat of the heat radiating member, and the sheet body is pressed between the cooling member and the heat radiating member to press the sheet body. The manufacturing method of the heat radiating member with an adhesive layer characterized by making it adhere | attach and forming the said adhesive layer.   The thermosetting resin composition contains an epoxy resin and a phenol resin, contains 40% by volume to 70% by volume of the inorganic filler, and contains boron nitride particles as the inorganic filler. The manufacturing method of the thermal radiation member with an adhesive bond layer of 1 description. The inorganic filler further contains metal oxide particles composed of at least one of alumina particles and silica particles, and the volume ratio of the metal oxide particles to the boron nitride particles is 10:90 to 50:50, The method for producing a heat-radiating member with an adhesive layer according to claim 2 , wherein the median diameter of the metal oxide particles is 0.5 µm to 30 µm. Manufacturing a semiconductor device in which an electronic component including a semiconductor element and a heat dissipation member for radiating heat generated by the electronic component are bonded by a cured product obtained by curing a thermosetting resin composition containing an inorganic filler A method for manufacturing a semiconductor device, comprising:
A heat dissipation member with an adhesive layer obtained by the method for manufacturing a heat dissipation member with an adhesive layer according to any one of claims 1 to 3 and the electronic component are used to heat the heat dissipation member with an adhesive layer. The electronic component is adhered to the surface of the adhesive layer of the heat dissipation member with the adhesive layer and the thermosetting resin composition constituting the adhesive layer is thermally cured. Production method.

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