WO2016059893A1 - Oscillateur laser à semi-conducteurs - Google Patents

Oscillateur laser à semi-conducteurs Download PDF

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Publication number
WO2016059893A1
WO2016059893A1 PCT/JP2015/074336 JP2015074336W WO2016059893A1 WO 2016059893 A1 WO2016059893 A1 WO 2016059893A1 JP 2015074336 W JP2015074336 W JP 2015074336W WO 2016059893 A1 WO2016059893 A1 WO 2016059893A1
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WO
WIPO (PCT)
Prior art keywords
laser
emitted
sets
optical fibers
surface emitting
Prior art date
Application number
PCT/JP2015/074336
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English (en)
Japanese (ja)
Inventor
かおり 臼田
Original Assignee
株式会社アマダホールディングス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015147330A external-priority patent/JP2016082219A/ja
Application filed by 株式会社アマダホールディングス filed Critical 株式会社アマダホールディングス
Publication of WO2016059893A1 publication Critical patent/WO2016059893A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30

Abstract

L'oscillateur laser à semi-conducteurs de l'invention est équipé : d'une pluralité de groupes de diodes laser regroupant une pluralité de diodes laser ; et d'une pluralité de groupes de fibres optiques (11f11 à 11fn1, 11f12 à 11fn2) qui transmet des lasers émis par les diodes laser. Les fibres optiques (11f11 à 11fn1, 11f12 à 11fn2) sont rangées dans une première direction dans chacun des groupes, et la pluralité de groupes est à son tour rangée dans une seconde direction croisant la première direction et la direction de progression des lasers. L'oscillateur laser à semi-conducteurs est également équipé : de collimateurs (1112, 1115) mettant en parallèle chacun des lasers émis en sortie par les fibres optiques (11f11 à 11fn1, 11f12 à 11fn2) ; de miroirs d'oscillateur d'extérieur mettant en oscillation le laser émis en sortie par les diodes laser ; et d'un réseau (1103) disposé entre les miroirs d'oscillateur d'extérieur, et couplant les lasers émis en sortie par les collimateurs (1112, 1115) en faisceau de spectre. Les collimateurs (1112, 1115) mettent chacun des lasers émis en sortie par les fibres optiques (11f11 à 11fn1, 11f12 à 11fn2) de la pluralité de groupes, en incidence selon des angles différents les uns des autres vis-à-vis du réseau (1103).
PCT/JP2015/074336 2014-10-15 2015-08-28 Oscillateur laser à semi-conducteurs WO2016059893A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014210493 2014-10-15
JP2014-210493 2014-10-15
JP2015147330A JP2016082219A (ja) 2014-10-15 2015-07-27 半導体レーザ発振器
JP2015-147330 2015-07-27

Publications (1)

Publication Number Publication Date
WO2016059893A1 true WO2016059893A1 (fr) 2016-04-21

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ID=55746441

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/074336 WO2016059893A1 (fr) 2014-10-15 2015-08-28 Oscillateur laser à semi-conducteurs

Country Status (1)

Country Link
WO (1) WO2016059893A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7098090B1 (ja) * 2022-01-28 2022-07-08 三菱電機株式会社 レーザ装置およびレーザ加工機
WO2023176541A1 (fr) * 2022-03-14 2023-09-21 株式会社島津製作所 Dispositif de traitement laser

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5862278A (en) * 1996-01-29 1999-01-19 Deutsche Forschungsanstalt Fuer Luftund Raumfahrt E.V. Laser system
JP2001277464A (ja) * 2000-03-29 2001-10-09 Think Laboratory Co Ltd 製版用レーザ露光装置
WO2002009904A1 (fr) * 2000-07-31 2002-02-07 Toyota Jidosha Kabushiki Kaisha Procede d'usinage par faisceau laser
JP2003344803A (ja) * 2002-03-19 2003-12-03 Toyoda Mach Works Ltd レンズアレイ、光整列器及びレーザ集光装置
JP2006091285A (ja) * 2004-09-22 2006-04-06 Sumitomo Electric Ind Ltd 発光装置
WO2006116477A2 (fr) * 2005-04-25 2006-11-02 Massachusetts Institute Of Technology Melangeur de faisceaux a longueurs d'ondes multiples
JP2007515792A (ja) * 2003-12-19 2007-06-14 ノベラ・オプティクス・インコーポレーテッド 受動的光ネットワーク用のレーザ光源と検出器の一体化
JP2011205061A (ja) * 2010-03-04 2011-10-13 Komatsu Ltd レーザ装置、レーザシステムおよび極端紫外光生成装置
WO2012033105A1 (fr) * 2010-09-06 2012-03-15 国立大学法人大阪大学 Dispositif de laser
JP2013521666A (ja) * 2010-03-05 2013-06-10 テラダイオード，インコーポレーテッド 波長ビーム結合システムおよび方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5862278A (en) * 1996-01-29 1999-01-19 Deutsche Forschungsanstalt Fuer Luftund Raumfahrt E.V. Laser system
JP2001277464A (ja) * 2000-03-29 2001-10-09 Think Laboratory Co Ltd 製版用レーザ露光装置
WO2002009904A1 (fr) * 2000-07-31 2002-02-07 Toyota Jidosha Kabushiki Kaisha Procede d'usinage par faisceau laser
JP2003344803A (ja) * 2002-03-19 2003-12-03 Toyoda Mach Works Ltd レンズアレイ、光整列器及びレーザ集光装置
JP2007515792A (ja) * 2003-12-19 2007-06-14 ノベラ・オプティクス・インコーポレーテッド 受動的光ネットワーク用のレーザ光源と検出器の一体化
JP2006091285A (ja) * 2004-09-22 2006-04-06 Sumitomo Electric Ind Ltd 発光装置
WO2006116477A2 (fr) * 2005-04-25 2006-11-02 Massachusetts Institute Of Technology Melangeur de faisceaux a longueurs d'ondes multiples
JP2011205061A (ja) * 2010-03-04 2011-10-13 Komatsu Ltd レーザ装置、レーザシステムおよび極端紫外光生成装置
JP2013521666A (ja) * 2010-03-05 2013-06-10 テラダイオード，インコーポレーテッド 波長ビーム結合システムおよび方法
WO2012033105A1 (fr) * 2010-09-06 2012-03-15 国立大学法人大阪大学 Dispositif de laser

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7098090B1 (ja) * 2022-01-28 2022-07-08 三菱電機株式会社 レーザ装置およびレーザ加工機
WO2023144995A1 (fr) * 2022-01-28 2023-08-03 三菱電機株式会社 Appareil laser et machine de traitement laser
WO2023176541A1 (fr) * 2022-03-14 2023-09-21 株式会社島津製作所 Dispositif de traitement laser

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