WO2016053058A1 - Procédé de prévention de l'adhérence à l'aide d'un liquide ionique et appareil de dépôt sous vide doté d'un équipement de prévention de l'adhérence de liquide - Google Patents

Procédé de prévention de l'adhérence à l'aide d'un liquide ionique et appareil de dépôt sous vide doté d'un équipement de prévention de l'adhérence de liquide Download PDF

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Publication number
WO2016053058A1
WO2016053058A1 PCT/KR2015/010462 KR2015010462W WO2016053058A1 WO 2016053058 A1 WO2016053058 A1 WO 2016053058A1 KR 2015010462 W KR2015010462 W KR 2015010462W WO 2016053058 A1 WO2016053058 A1 WO 2016053058A1
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WO
WIPO (PCT)
Prior art keywords
deposition
chamber
ionic liquid
liquid
shield layer
Prior art date
Application number
PCT/KR2015/010462
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English (en)
Korean (ko)
Inventor
김태원
Original Assignee
한국생산기술연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국생산기술연구원 filed Critical 한국생산기술연구원
Publication of WO2016053058A1 publication Critical patent/WO2016053058A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32486—Means for reducing recombination coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts

Abstract

La présente invention concerne un procédé de prévention de l'adhérence qui comprend les étapes suivantes : une étape (S110) consistant à fournir un liquide ionique à l'intérieur d'une chambre d'un appareil de dépôt sous vide ; une étape (S120) consistant à amener le liquide ionique à s'écouler sur une surface d'un sujet auquel on empêche d'adhérer dans la chambre, de manière à former une couche de protection liquide ; une étape (S130) de collecte d'un matériau de dépôt de diffusion dans la couche de protection liquide ; une étape (S140) de récupération, dans la chambre, d'un mélange liquide contenant le matériau de dépôt collecté et restant dans le liquide ionique de la couche de protection liquide ; et une étape (S150) consistant à évacuer le mélange liquide collecté dans la chambre vers l'extérieur de celle-ci. La présente invention permet au liquide ionique de s'écouler le long d'une paroi interne de la chambre ou d'une surface d'une plaque de prévention de l'adhérence, de manière à former la couche de protection liquide, ce qui permet d'obtenir les avantages d'empêcher le matériau de dépôt de se déposer sur la paroi interne de la chambre, la plaque de prévention de l'adhérence ou analogue au cours d'un processus de dépôt. En outre, le matériau de dépôt adsorbé ou bien collecté dans le liquide ionique s'écoule avec le liquide ionique de façon à être récupéré, de sorte que l'intérieur de la chambre ne puisse pas être contaminé et, par conséquent, un procédé peut être effectué en continu sans arrêter le processus de dépôt, ce qui permet d'obtenir l'avantage de l'augmentation de la vitesse de fonctionnement de l'appareil de dépôt.
PCT/KR2015/010462 2014-10-04 2015-10-02 Procédé de prévention de l'adhérence à l'aide d'un liquide ionique et appareil de dépôt sous vide doté d'un équipement de prévention de l'adhérence de liquide WO2016053058A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0133627 2014-10-04
KR20140133627 2014-10-04

Publications (1)

Publication Number Publication Date
WO2016053058A1 true WO2016053058A1 (fr) 2016-04-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/010462 WO2016053058A1 (fr) 2014-10-04 2015-10-02 Procédé de prévention de l'adhérence à l'aide d'un liquide ionique et appareil de dépôt sous vide doté d'un équipement de prévention de l'adhérence de liquide

Country Status (2)

Country Link
KR (1) KR20160041006A (fr)
WO (1) WO2016053058A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109295422A (zh) * 2018-11-08 2019-02-01 京东方科技集团股份有限公司 蒸镀装置及蒸镀方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220403509A1 (en) * 2021-06-17 2022-12-22 Tokyo Electron Limited Vacuum processing apparatus and oxidizing gas removal method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192223A (ja) * 1998-12-25 2000-07-11 Matsushita Electric Ind Co Ltd マグネトロンスパッタリング方法とマグネトロンスパッタリング装置
US20010045187A1 (en) * 1999-12-20 2001-11-29 Micron Technology, Inc. Chemical vapor deposition methods and apparatus
KR20050123425A (ko) * 2004-06-25 2005-12-29 엘지전자 주식회사 진공 증착 장치
JP2006237277A (ja) * 2005-02-25 2006-09-07 Matsushita Electric Ind Co Ltd 基板処理装置
KR20080086541A (ko) * 2006-01-17 2008-09-25 피피지 인더스트리즈 오하이오 인코포레이티드 이온성 액체 중에서 물리적 증착에 의해 입자를 제조하는 방법
JP2009068071A (ja) * 2007-09-13 2009-04-02 Seiko Epson Corp 防着板、真空処理装置、及び防着板の再生方法
KR20140079308A (ko) * 2012-12-18 2014-06-26 한국생산기술연구원 이온성 액체를 이용한 유기소재 정제방법 및 정제장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192223A (ja) * 1998-12-25 2000-07-11 Matsushita Electric Ind Co Ltd マグネトロンスパッタリング方法とマグネトロンスパッタリング装置
US20010045187A1 (en) * 1999-12-20 2001-11-29 Micron Technology, Inc. Chemical vapor deposition methods and apparatus
KR20050123425A (ko) * 2004-06-25 2005-12-29 엘지전자 주식회사 진공 증착 장치
JP2006237277A (ja) * 2005-02-25 2006-09-07 Matsushita Electric Ind Co Ltd 基板処理装置
KR20080086541A (ko) * 2006-01-17 2008-09-25 피피지 인더스트리즈 오하이오 인코포레이티드 이온성 액체 중에서 물리적 증착에 의해 입자를 제조하는 방법
JP2009068071A (ja) * 2007-09-13 2009-04-02 Seiko Epson Corp 防着板、真空処理装置、及び防着板の再生方法
KR20140079308A (ko) * 2012-12-18 2014-06-26 한국생산기술연구원 이온성 액체를 이용한 유기소재 정제방법 및 정제장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109295422A (zh) * 2018-11-08 2019-02-01 京东方科技集团股份有限公司 蒸镀装置及蒸镀方法

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