WO2016035680A1 - 自動車用ledランプヒートシンク - Google Patents
自動車用ledランプヒートシンク Download PDFInfo
- Publication number
- WO2016035680A1 WO2016035680A1 PCT/JP2015/074315 JP2015074315W WO2016035680A1 WO 2016035680 A1 WO2016035680 A1 WO 2016035680A1 JP 2015074315 W JP2015074315 W JP 2015074315W WO 2016035680 A1 WO2016035680 A1 WO 2016035680A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- led lamp
- resin composition
- lamp heat
- automotive led
- Prior art date
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 92
- 239000010439 graphite Substances 0.000 claims abstract description 71
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 71
- 239000011342 resin composition Substances 0.000 claims abstract description 71
- 229920005989 resin Polymers 0.000 claims abstract description 60
- 239000011347 resin Substances 0.000 claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229920006230 thermoplastic polyester resin Polymers 0.000 claims abstract description 23
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 18
- 230000005484 gravity Effects 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims abstract description 11
- 239000007924 injection Substances 0.000 claims abstract description 11
- -1 polybutylene terephthalate Polymers 0.000 claims description 69
- 239000002245 particle Substances 0.000 claims description 46
- 238000000465 moulding Methods 0.000 claims description 32
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 30
- 229920000570 polyether Polymers 0.000 claims description 30
- 238000004898 kneading Methods 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 18
- 238000001746 injection moulding Methods 0.000 claims description 16
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 16
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 16
- 239000003575 carbonaceous material Substances 0.000 claims description 12
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 26
- 239000002585 base Substances 0.000 description 22
- 125000003118 aryl group Chemical group 0.000 description 17
- 229920000728 polyester Polymers 0.000 description 17
- 239000003063 flame retardant Substances 0.000 description 15
- 239000003242 anti bacterial agent Substances 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 14
- 239000000945 filler Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 13
- 229920005992 thermoplastic resin Polymers 0.000 description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000005452 bending Methods 0.000 description 8
- 239000011231 conductive filler Substances 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 8
- 230000000704 physical effect Effects 0.000 description 8
- 239000003981 vehicle Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 239000008188 pellet Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 150000001463 antimony compounds Chemical class 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 238000005809 transesterification reaction Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 230000007774 longterm Effects 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 3
- 229910021536 Zeolite Inorganic materials 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 150000002291 germanium compounds Chemical class 0.000 description 3
- 229940119177 germanium dioxide Drugs 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000012760 heat stabilizer Substances 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000012744 reinforcing agent Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 3
- 239000010457 zeolite Substances 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- GWEHVDNNLFDJLR-UHFFFAOYSA-N 1,3-diphenylurea Chemical compound C=1C=CC=CC=1NC(=O)NC1=CC=CC=C1 GWEHVDNNLFDJLR-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- MGWAVDBGNNKXQV-UHFFFAOYSA-N diisobutyl phthalate Chemical compound CC(C)COC(=O)C1=CC=CC=C1C(=O)OCC(C)C MGWAVDBGNNKXQV-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000012796 inorganic flame retardant Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 2
- 229910021382 natural graphite Inorganic materials 0.000 description 2
- 229930014626 natural product Natural products 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 125000005702 oxyalkylene group Chemical group 0.000 description 2
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920006345 thermoplastic polyamide Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- SGXRTWRRYSEZLP-UHFFFAOYSA-N (2-hydroxyphenyl) diphenyl phosphate Chemical compound OC1=CC=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 SGXRTWRRYSEZLP-UHFFFAOYSA-N 0.000 description 1
- DAZHWGHCARQALS-UHFFFAOYSA-N (2-methylphenyl) (4-methylphenyl) phenyl phosphate Chemical compound C1=CC(C)=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1 DAZHWGHCARQALS-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- VUWCWMOCWKCZTA-UHFFFAOYSA-N 1,2-thiazol-4-one Chemical class O=C1CSN=C1 VUWCWMOCWKCZTA-UHFFFAOYSA-N 0.000 description 1
- AHBGXHAWSHTPOM-UHFFFAOYSA-N 1,3,2$l^{4},4$l^{4}-dioxadistibetane 2,4-dioxide Chemical compound O=[Sb]O[Sb](=O)=O AHBGXHAWSHTPOM-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 description 1
- CICDSZCELMNDRA-UHFFFAOYSA-N 10-(2-ethylhexoxy)-10-oxodecanoic acid Chemical compound CCCCC(CC)COC(=O)CCCCCCCCC(O)=O CICDSZCELMNDRA-UHFFFAOYSA-N 0.000 description 1
- CHUGKEQJSLOLHL-UHFFFAOYSA-N 2,2-Bis(bromomethyl)propane-1,3-diol Chemical compound OCC(CO)(CBr)CBr CHUGKEQJSLOLHL-UHFFFAOYSA-N 0.000 description 1
- HDIFHQMREAYYJW-FMIVXFBMSA-N 2,3-dihydroxypropyl (e)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C\CCCCCCCC(=O)OCC(O)CO HDIFHQMREAYYJW-FMIVXFBMSA-N 0.000 description 1
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 1
- PHDVPEOLXYBNJY-KTKRTIGZSA-N 2-(2-hydroxyethoxy)ethyl (z)-octadec-9-enoate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCOCCO PHDVPEOLXYBNJY-KTKRTIGZSA-N 0.000 description 1
- NXIFLHKNGSUALF-UHFFFAOYSA-N 2-[(2,3-dibromo-4-methylphenoxy)methyl]oxirane Chemical compound BrC1=C(Br)C(C)=CC=C1OCC1OC1 NXIFLHKNGSUALF-UHFFFAOYSA-N 0.000 description 1
- FDZMLNCJBYFJBH-UHFFFAOYSA-N 2-[(2,3-dibromophenoxy)methyl]oxirane Chemical compound BrC1=CC=CC(OCC2OC2)=C1Br FDZMLNCJBYFJBH-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- FWQNYUYRXNWOOM-UHFFFAOYSA-N 2-nonylpropanedioic acid Chemical compound CCCCCCCCCC(C(O)=O)C(O)=O FWQNYUYRXNWOOM-UHFFFAOYSA-N 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- MFJDFPRQTMQVHI-UHFFFAOYSA-N 3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound O=C1OCOC(=O)C2=CC=C1C=C2 MFJDFPRQTMQVHI-UHFFFAOYSA-N 0.000 description 1
- ALKCLFLTXBBMMP-UHFFFAOYSA-N 3,7-dimethylocta-1,6-dien-3-yl hexanoate Chemical compound CCCCCC(=O)OC(C)(C=C)CCC=C(C)C ALKCLFLTXBBMMP-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- NUCFNMOPTGEHQA-UHFFFAOYSA-N 3-bromo-2h-pyrazolo[4,3-c]pyridine Chemical compound C1=NC=C2C(Br)=NNC2=C1 NUCFNMOPTGEHQA-UHFFFAOYSA-N 0.000 description 1
- SIXWIUJQBBANGK-UHFFFAOYSA-N 4-(4-fluorophenyl)-1h-pyrazol-5-amine Chemical compound N1N=CC(C=2C=CC(F)=CC=2)=C1N SIXWIUJQBBANGK-UHFFFAOYSA-N 0.000 description 1
- DMIMWGHYIPFAIF-UHFFFAOYSA-N 5-nitro-2-piperidin-1-ylaniline Chemical compound NC1=CC([N+]([O-])=O)=CC=C1N1CCCCC1 DMIMWGHYIPFAIF-UHFFFAOYSA-N 0.000 description 1
- NWSGBTCJMJADLE-UHFFFAOYSA-N 6-o-decyl 1-o-octyl hexanedioate Chemical compound CCCCCCCCCCOC(=O)CCCCC(=O)OCCCCCCCC NWSGBTCJMJADLE-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- IHLDFUILQQSDCQ-UHFFFAOYSA-L C(C)(=O)[O-].[Ge+2].C(C)(=O)[O-] Chemical class C(C)(=O)[O-].[Ge+2].C(C)(=O)[O-] IHLDFUILQQSDCQ-UHFFFAOYSA-L 0.000 description 1
- ZPPYYOIUDVPKPK-UHFFFAOYSA-L C(CO)(=O)[O-].[Ge+2].C(CO)(=O)[O-] Chemical class C(CO)(=O)[O-].[Ge+2].C(CO)(=O)[O-] ZPPYYOIUDVPKPK-UHFFFAOYSA-L 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- RDOFJDLLWVCMRU-UHFFFAOYSA-N Diisobutyl adipate Chemical compound CC(C)COC(=O)CCCCC(=O)OCC(C)C RDOFJDLLWVCMRU-UHFFFAOYSA-N 0.000 description 1
- ZVFDTKUVRCTHQE-UHFFFAOYSA-N Diisodecyl phthalate Chemical compound CC(C)CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC(C)C ZVFDTKUVRCTHQE-UHFFFAOYSA-N 0.000 description 1
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical class C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- MURWRBWZIMXKGC-UHFFFAOYSA-N Phthalsaeure-butylester-octylester Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC MURWRBWZIMXKGC-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GTVWRXDRKAHEAD-UHFFFAOYSA-N Tris(2-ethylhexyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OCC(CC)CCCC GTVWRXDRKAHEAD-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 229920006127 amorphous resin Polymers 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 229910000411 antimony tetroxide Inorganic materials 0.000 description 1
- SZXAQBAUDGBVLT-UHFFFAOYSA-H antimony(3+);2,3-dihydroxybutanedioate Chemical compound [Sb+3].[Sb+3].[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O.[O-]C(=O)C(O)C(O)C([O-])=O SZXAQBAUDGBVLT-UHFFFAOYSA-H 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 229910021383 artificial graphite Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 150000004283 biguanides Chemical class 0.000 description 1
- ROPXFXOUUANXRR-BUHFOSPRSA-N bis(2-ethylhexyl) (e)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C\C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-BUHFOSPRSA-N 0.000 description 1
- SAOKZLXYCUGLFA-UHFFFAOYSA-N bis(2-ethylhexyl) adipate Chemical compound CCCCC(CC)COC(=O)CCCCC(=O)OCC(CC)CCCC SAOKZLXYCUGLFA-UHFFFAOYSA-N 0.000 description 1
- ZDWGXBPVPXVXMQ-UHFFFAOYSA-N bis(2-ethylhexyl) nonanedioate Chemical compound CCCCC(CC)COC(=O)CCCCCCCC(=O)OCC(CC)CCCC ZDWGXBPVPXVXMQ-UHFFFAOYSA-N 0.000 description 1
- KEVDDQOYWPSMFD-UHFFFAOYSA-N bis(2-methylpropyl) nonanedioate Chemical compound CC(C)COC(=O)CCCCCCCC(=O)OCC(C)C KEVDDQOYWPSMFD-UHFFFAOYSA-N 0.000 description 1
- ZWYAVGUHWPLBGT-UHFFFAOYSA-N bis(6-methylheptyl) decanedioate Chemical compound CC(C)CCCCCOC(=O)CCCCCCCCC(=O)OCCCCCC(C)C ZWYAVGUHWPLBGT-UHFFFAOYSA-N 0.000 description 1
- CJFLBOQMPJCWLR-UHFFFAOYSA-N bis(6-methylheptyl) hexanedioate Chemical compound CC(C)CCCCCOC(=O)CCCCC(=O)OCCCCCC(C)C CJFLBOQMPJCWLR-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 229940112669 cuprous oxide Drugs 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- INSRQEMEVAMETL-UHFFFAOYSA-N decane-1,1-diol Chemical compound CCCCCCCCCC(O)O INSRQEMEVAMETL-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- JVLRYPRBKSMEBF-UHFFFAOYSA-K diacetyloxystibanyl acetate Chemical compound [Sb+3].CC([O-])=O.CC([O-])=O.CC([O-])=O JVLRYPRBKSMEBF-UHFFFAOYSA-K 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- LPRHLAXCXZTKNI-UHFFFAOYSA-N dibutyl methyl phosphate Chemical compound CCCCOP(=O)(OC)OCCCC LPRHLAXCXZTKNI-UHFFFAOYSA-N 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229940031769 diisobutyl adipate Drugs 0.000 description 1
- DGVMNQYBHPSIJS-UHFFFAOYSA-N dimagnesium;2,2,6,6-tetraoxido-1,3,5,7-tetraoxa-2,4,6-trisilaspiro[3.3]heptane;hydrate Chemical compound O.[Mg+2].[Mg+2].O1[Si]([O-])([O-])O[Si]21O[Si]([O-])([O-])O2 DGVMNQYBHPSIJS-UHFFFAOYSA-N 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical class C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- CTCOPPBXAFHGRB-UHFFFAOYSA-N ethanolate;germanium(4+) Chemical compound [Ge+4].CC[O-].CC[O-].CC[O-].CC[O-] CTCOPPBXAFHGRB-UHFFFAOYSA-N 0.000 description 1
- JQVXMIPNQMYRPE-UHFFFAOYSA-N ethyl dimethyl phosphate Chemical compound CCOP(=O)(OC)OC JQVXMIPNQMYRPE-UHFFFAOYSA-N 0.000 description 1
- ANPYQJSSFZGXFE-UHFFFAOYSA-N ethyl dipropyl phosphate Chemical compound CCCOP(=O)(OCC)OCCC ANPYQJSSFZGXFE-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical class [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- LMDQRKJROSLEEI-UHFFFAOYSA-N germanium(4+) propan-2-olate Chemical compound [Ge+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] LMDQRKJROSLEEI-UHFFFAOYSA-N 0.000 description 1
- GGQZVHANTCDJCX-UHFFFAOYSA-N germanium;tetrahydrate Chemical compound O.O.O.O.[Ge] GGQZVHANTCDJCX-UHFFFAOYSA-N 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000002751 molybdenum Chemical class 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 150000005002 naphthylamines Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000004989 p-phenylenediamines Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000002987 primer (paints) Substances 0.000 description 1
- ILVXOBCQQYKLDS-UHFFFAOYSA-N pyridine N-oxide Chemical compound [O-][N+]1=CC=CC=C1 ILVXOBCQQYKLDS-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- IEXRMSFAVATTJX-UHFFFAOYSA-N tetrachlorogermane Chemical class Cl[Ge](Cl)(Cl)Cl IEXRMSFAVATTJX-UHFFFAOYSA-N 0.000 description 1
- AUHHYELHRWCWEZ-UHFFFAOYSA-N tetrachlorophthalic anhydride Chemical compound ClC1=C(Cl)C(Cl)=C2C(=O)OC(=O)C2=C1Cl AUHHYELHRWCWEZ-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000000858 thiocyanato group Chemical group *SC#N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- IELLVVGAXDLVSW-UHFFFAOYSA-N tricyclohexyl phosphate Chemical compound C1CCCCC1OP(OC1CCCCC1)(=O)OC1CCCCC1 IELLVVGAXDLVSW-UHFFFAOYSA-N 0.000 description 1
- OHRVKCZTBPSUIK-UHFFFAOYSA-N tridodecyl phosphate Chemical compound CCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCC)OCCCCCCCCCCCC OHRVKCZTBPSUIK-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- FDGZUBKNYGBWHI-UHFFFAOYSA-N trioctadecyl phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC FDGZUBKNYGBWHI-UHFFFAOYSA-N 0.000 description 1
- QJAVUVZBMMXBRO-UHFFFAOYSA-N tripentyl phosphate Chemical compound CCCCCOP(=O)(OCCCCC)OCCCCC QJAVUVZBMMXBRO-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- RXPQRKFMDQNODS-UHFFFAOYSA-N tripropyl phosphate Chemical compound CCCOP(=O)(OCCC)OCCC RXPQRKFMDQNODS-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- 150000003754 zirconium Chemical class 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2507/00—Use of elements other than metals as filler
- B29K2507/04—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
- B29K2995/0013—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
Definitions
- the present invention relates to an automotive LED lamp heat sink using a heat conductive resin. More specifically, the present invention relates to an automotive LED lamp heat sink that has a lower specific gravity than metal and can contribute to weight reduction and energy saving.
- a method for imparting thermal conductivity to a resin a method of adding a high thermal conductive filler such as graphite is disclosed.
- Patent Document 1 discloses a resin composition having excellent thermal conductivity by adding specific graphite particles having an aspect ratio of 10 to 20, a weight average particle diameter of 10 to 200 ⁇ m, and a fixed carbon amount of 98% by mass or more to a thermoplastic resin. The product is disclosed.
- Patent Document 2 discloses a conductive resin composition containing a thermoplastic resin and graphite powder having an aspect ratio of 70% or more of particles of 3 or less.
- Patent Document 3 includes a combination of a heat conductive resin containing a thermoplastic resin and one or more fillers selected from metals, inorganic substances, carbon fibers, and graphite, and a highly heat conductive metal or carbon material.
- An LED lamp heat sink is disclosed.
- it is necessary to highly fill graphite and other fillers in order to impart thermal conductivity, and there is a problem that the fluidity is extremely lowered, and in some cases, molding becomes difficult.
- LED lamp heat sinks for automobiles it is mentioned as a necessary physical property that the lamp lens does not become fogged when exposed to high temperatures, and low fogging properties are required, but these points are completely described in the above patent documents. It has not been. Moreover, it does not describe ultrasonic weldability when a material such as metal or resin is combined with a heat conductive resin.
- An object of the present invention is to provide an automotive LED lamp heat sink which is excellent in thermal conductivity, molding processability, fogging property, ultrasonic weldability with metals and resins, and can be manufactured at a low cost.
- thermoconductive resin composition containing graphite having a specific shape in a specific thermoplastic polyester has thermal conductivity, molding processability, It has been found that it is excellent in low fogging properties, ultrasonic welding properties with metals and resins, and is suitable for LED lamp heat sinks for automobiles, and the present invention has been completed.
- the present invention includes the following 1) to 16).
- a heat sink for cooling an LED module partly or entirely formed by injection molding of a heat conductive resin composition wherein the heat conductive resin composition has (A) a number average molecular weight of 12, A thermoplastic polyester resin of 000 to 70,000 (hereinafter sometimes simply referred to as “thermoplastic polyester resin (A)”) 50 to 90% by weight, and (B) a fixed carbon amount of 98% by mass or more, And containing at least 10 to 50% by weight of flake graphite having an aspect ratio of 21 or more (hereinafter sometimes simply referred to as “flaky graphite (B)”), a specific gravity of 1.4 to 1.7, and
- An automotive LED lamp heat sink characterized by being a resin composition having a thermal conductivity in a plane direction of 1 W / (m ⁇ K) or more.
- the automotive LED lamp heat sink according to 1) wherein the scale-like graphite (B) contained in the automotive LED lamp heat sink has a volume average particle diameter of 1 to 500 ⁇ m.
- the heat conductive resin composition is produced by melt kneading, and the volume average particle size of the flake graphite before melt kneading is 1 to 700 ⁇ m, the amount of fixed carbon is 98% by mass or more, and the aspect ratio is 21 or more.
- the thermoplastic polyester resin (A) is one or more selected from the group consisting of polybutylene terephthalate, polyethylene terephthalate, and polyester-polyether copolymer.
- the automotive LED lamp heat sink according to any one of 3). 5) The automotive LED lamp as described in any one of 1) to 4) above, wherein the thermal conductivity in the thickness direction of the thermally conductive resin composition is 0.5 W / (m ⁇ K) or more. heatsink. 6) The automotive LED lamp heat sink according to any one of 1) to 5), wherein a part of the automotive LED lamp heat sink is one of a good heat conductor metal and a carbon material. 7) An LED lamp heat sink for automobiles formed of the good heat conductor metal and the heat conductive resin composition receives heat from the heat sink made of the heat conductive resin composition by insert molding, ultrasonic welding, or heat fusion.
- the good heat conductor metal is a metal selected from the group consisting of aluminum, copper, magnesium and alloys thereof, and is a substance having a thermal conductivity of 40 W / (m ⁇ K) or more, 6) or 7)
- the automotive LED lamp heat sink uses a thermal interface material of 0.5 W / (m ⁇ K) or more, and is composed of a good thermal conductor metal / thermal interface material / thermal conductive resin composition.
- the thickness ratio (base portion thickness / gate thickness) of the base portion of the heat sink is 2 or more with respect to the gate thickness in the injection mold of the LED lamp heat sink for automobile.
- the automotive LED lamp heat sink according to any one of 1) to 11).
- the automotive LED lamp heat sinks 1) to 16) can be paraphrased as follows, for example.
- An automotive LED lamp heat sink comprising a member comprising an injection-molded product of a heat conductive resin composition, wherein the heat conductive resin composition has (A) a number average molecular weight of 12,000 to 70,000. And 50 to 90% by weight of a thermoplastic polyester resin, and (B) 10 to 50% by weight of flake graphite having a fixed carbon amount of 98% by mass or more and an aspect ratio of 21 or more, and a specific gravity of 1.4 to An automotive LED lamp heat sink having a thermal conductivity of 1 W / (m ⁇ K) or more in a plane direction of 1.7.
- the LED lamp heat sink for automobiles according to 1), wherein the scale-like graphite (B) has a volume average particle diameter of 1 to 500 ⁇ m.
- the thermally conductive resin composition is a melt-kneaded product, and the flake graphite before melt-kneading has a volume average particle diameter of 1 to 700 ⁇ m, a fixed carbon amount of 98% by mass or more, and an aspect ratio of 21 or more.
- the thermoplastic polyester resin (A) is at least one selected from the group consisting of polybutylene terephthalate, polyethylene terephthalate, and polyester-polyether copolymers, and any one of 1) to 3) LED lamp heat sink for automobiles.
- a heat conductive layer made of a thermal interface material having a thermal conductivity of 0.5 W / (m ⁇ K) or more is further included, and the heat conductive layer is a member made of an injection-molded body of a heat conductive resin composition;
- the LED lamp heat sink for automobiles of the present invention contains a specific thermoplastic polyester resin (A) and specific graphite particles (B), thereby providing thermal conductivity, moldability (fluidity), metal and resin. And can be manufactured at a low cost.
- the perspective view of the typical form of the LED lamp heat sink for motor vehicles of this invention Sectional drawing of the typical form of the LED lamp heat sink for motor vehicles of this invention
- the perspective view of the other typical form of the LED lamp heat sink for motor vehicles of this invention Sectional drawing of the other typical form of the LED lamp heat sink for motor vehicles of this invention
- the perspective view of the other typical form of the LED lamp heat sink for motor vehicles of this invention Sectional drawing of the other typical form of the LED lamp heat sink for motor vehicles of this invention
- the top view of the other typical form of the LED lamp heat sink for motor vehicles of this invention Sectional drawing of another typical form of the LED lamp heat sink for motor vehicles of this invention
- the LED lamp heat sink for automobiles of the present invention is a heat sink that is partly or entirely formed by injection molding with a heat conductive resin composition to be described later, and is used for cooling an LED (light emitting diode) module. Anything with fins is applicable.
- the LED lamp heat sink for automobiles of the present invention (hereinafter sometimes simply referred to as “heat sink”) is partially or entirely composed of a thermoplastic polyester resin (A) and scaly graphite (B) described later. It consists of an injection-molded product of a heat conductive resin composition (hereinafter sometimes simply referred to as “resin composition”). More specifically, the thermally conductive resin composition is melt-kneaded, and the obtained melt-kneaded product is injection-molded as it is, or the melt-kneaded product is pelletized and then injection-molded using the obtained pellets. By doing so, an injection molded product having a desired shape is obtained, and the injection molded product is used as a part or all of the automotive LED lamp heat sink of the present invention.
- the automotive LED lamp heat sink of the present invention can be used for various automotive LED lamps.
- the LED lamps for automobiles are roughly classified into interior lamps and exterior lamps.
- interior lamps include room lamps, map lamps, and exterior lamps such as rear lamps, front lamps, and head lamps.
- Side turn signal lamps day lamps, fashion lamps and the like.
- a high-intensity LED module is used, and from the viewpoint that heat dissipation is required, a rear lamp, a front lamp, and a head lamp are preferable, and a tail lamp, a stop lamp, a fog lamp, a positioning lamp, a turn are more preferable.
- the power consumption per LED of an automobile LED lamp varies depending on the application, and a plurality of LED modules may be used.
- an LED module of 0.1 to 15 W is used for a rear lamp or a front lamp, preferably 0.1 to 10 W, more preferably 0.1 to 8 W, still more preferably 0.1 to 5 W, particularly preferably. 0.1 to 3 W is used.
- an LED module of 1 W or more is used for the headlamp, preferably 5 to 40 W, more preferably 10 to 30 W, still more preferably 10 to 25 W, and particularly preferably 10 to 20 W. .
- thermoplastic polyester resin (A) of the present invention examples include amorphous polyester resins such as amorphous semi-aromatic polyesters and amorphous wholly aromatic polyesters, crystalline semi-aromatic polyesters and crystalline wholly aromatic polyesters, etc. These crystalline polyester resins may be used, and one or more of these thermoplastic polyesters may be used in combination.
- thermoplastic polyester resins (A) a part or all of the resin is a thermoplastic resin having crystallinity or liquid crystallinity, and the thermal conductivity of the obtained resin composition tends to increase. Or it is preferable from the point that it is easy to make it contain scaly graphite (B) in resin.
- thermoplastic resins having crystallinity or liquid crystallinity are such that even if the entire resin is crystalline, only a specific block in the molecule of the block or graft copolymer resin is crystalline or liquid crystalline. Only the part may be crystalline or liquid crystalline.
- the thermoplastic resin a polymer alloy of an amorphous resin and a crystalline or liquid crystalline resin can be used. There is no particular limitation on the crystallinity of the resin.
- thermoplastic resins that are partly or entirely crystalline or liquid crystalline can be crystallized, but can be used alone or molded under specific molding conditions. Some resins exhibit amorphous properties. When such a resin is used, there is a case where a part or the whole of the resin can be crystallized by devising a molding method such as stretching or post-crystallization.
- the crystalline polyester include polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polyethylene-2,6-naphthalate, polybutylene naphthalate, poly1,4-cyclohexylenedimethylene terephthalate and polyethylene-1,2-bis ( Phenoxy) ethane-4,4'-dicarboxylate, etc., polyethylene isophthalate / terephthalate, polybutylene terephthalate / isophthalate, polybutylene terephthalate / decane dicarboxylate and polycyclohexanedimethylene terephthalate / isophthalate, polyester / poly Examples thereof include crystalline copolyesters such as ether.
- polyester-polyether copolymer The polyester / polyether (hereinafter referred to as polyester-polyether copolymer) is represented by 50 to 80% by weight of an aromatic polyester unit and the following general formula (1) from the viewpoint of moldability and heat resistance, and will be described later. It is preferably a polymer comprising 20 to 50% by weight of a modified polyether unit, more preferably a polymer comprising 60 to 80% by weight of an aromatic polyester unit and 20 to 40% by weight of the modified polyether unit. .
- —A— represents —O—, —S—, —SO—, —SO 2 —, —CO—, an alkylene group having 1 to 20 carbon atoms, or an alkylidene having 6 to 20 carbon atoms.
- R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , and R 8 is a hydrogen atom, a halogen atom, or a monovalent hydrocarbon having 1 to 5 carbon atoms
- R 9 and R 10 is a divalent hydrocarbon group having 1 to 5 carbon atoms, which may be the same or different, and m and n are repeating oxyalkylene units. Indicates the number of units, 2 ⁇ m + n ⁇ 50.
- a polyester-polyether copolymer is produced by using a catalyst to which an antimony compound, and optionally a germanium compound, is added, and (1) a three-way direct esterification method of an aromatic dicarboxylic acid, a diol, and a modified polyether, 2) Three-way transesterification method of dialkyl aromatic dicarboxylate, diol, modified polyether, and / or ester of modified polyether, (3) Dialkyl aromatic dicarboxylate, during transesterification of diol, or transesterification Examples include, but are not limited to, a method of polycondensation by adding a modified polyether later, and a method of (4) transesterification under a melt and reduced pressure after mixing with a modified polyether using a polymeric aromatic polyester. Although not intended, the production method (4) is preferred from the viewpoint of control of the raw material composition.
- antimony compound used as the catalyst according to the present invention examples include antimony trioxide, antimony pentoxide, antimony acetate, antimony glycoxide and the like, and these are used alone or in combination of two or more. Of these antimony compounds, antimony trioxide is particularly preferred.
- the amount of the antimony compound catalyst to be added at the time of polymerization is preferably 50 to 2000 ppm by weight, more preferably 100 to 1000 ppm by weight, based on the total amount of the monomer compound or the raw material resin, from the viewpoint of reaction rate and economical viewpoint. It is to be.
- germanium compound used as the catalyst examples include germanium oxide such as germanium dioxide, germanium alkoxide such as germanium tetraethoxide, germanium tetraisopropoxide, germanium hydroxide and alkali metal salts of germanium, germanium glycolate, germanium chloride, Germanium acetate etc. are mentioned, These are used individually or in combination of 2 or more types. Of these germanium compounds, germanium dioxide is particularly preferred.
- the amount of germanium dioxide catalyst to be added at the time of polymerization is preferably 50 to 2000 ppm by weight, more preferably 100 to 1000 ppm by weight, from the viewpoint of reaction rate and economical viewpoint.
- the aromatic dicarboxylic acid used in the production method (1) is particularly preferably terephthalic acid, and other examples include isophthalic acid, diphenyldicarboxylic acid, and diphenoxyethanedicarboxylic acid.
- terephthalic acid isophthalic acid, diphenyldicarboxylic acid, and diphenoxyethanedicarboxylic acid.
- a small proportion (15% or less) of other aromatic oxycarboxylic acids such as oxybenzoic acid, or aliphatics such as adipic acid, sebacic acid, cyclohexane 1,4-dicarboxylic acid, Or you may use together alicyclic dicarboxylic acid.
- the diol used in the production methods (1) to (3) is a low molecular weight glycol component that forms an ester unit, and is a low molecular weight glycol having 2 to 10 carbon atoms, such as ethylene glycol, trimethylene glycol, tetramethylene. Glycol, hexanediol, decanediol, cyclohexanedimethanol and the like. In particular, ethylene glycol, trimethylene glycol, and tetramethylene glycol are preferable from the viewpoint of availability.
- alkyl group of the dialkyl aromatic dicarboxylate used in the production methods (2) and (3) a methyl group is preferable from the viewpoint of transesterification.
- Weight ratio In the mixed solvent, the logarithmic viscosity (IV) at a concentration of 0.5 g / dl at 25 ° C. is preferably 0.3 to 2.0, more preferably 0.5 to 1.5.
- the aromatic polyester unit in the polyester-polyether copolymer is a polymer or copolymer obtained from an aromatic dicarboxylic acid or an ester-forming derivative thereof and a diol or an ester-forming derivative thereof.
- the condensate is preferably one or more selected from the group consisting of polyethylene terephthalate units, polybutylene terephthalate units, and polypropylene terephthalate units.
- the aromatic polyester unit include polyethylene terephthalate, polyethylene terephthalate copolymer, polybutylene terephthalate, polybutylene terephthalate copolymer, polypropylene terephthalate, or polypropylene terephthalate copolymer, more preferably polyethylene. It is at least one selected from the group consisting of terephthalate units, polybutylene terephthalate, and polypropylene terephthalate units.
- the modified polyether unit in the polyester-polyether copolymer is a unit represented by the general formula (1), and (m + n) per m and n repeating units of the oxyalkylene unit in the general formula (1).
- the number average of is preferably 2 to 50, more preferably 10 to 50, and still more preferably 18 to 50.
- the modified polyether unit is preferably a unit represented by the following general formula (2).
- the formula weight is 314, and (m + n) is 50.
- the formula weight is 2426.
- the preferred molecular weight is 316 to 2430, more preferably 670 to 2430, It is preferably 1020 to 2430, and more preferably 1330 to 2000.
- polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polyethylene-2,6-naphthalate, polybutylene naphthalate, and poly 1,4-cyclohexylene diene are used from the viewpoints of moldability and mechanical properties. It is preferable to use methylene terephthalate, polyester-polyether copolymer, etc., and polybutylene terephthalate, polyethylene terephthalate, polyester-polyether copolymer are more preferable from the viewpoint of being inexpensive and easily available. From the viewpoint of superiority, polyethylene terephthalate and polyester-polyether copolymers are more preferred.
- the number average molecular weight of the present invention is a high-temperature GPC using a solution prepared by dissolving polystyrene in a mixed solvent of p-chlorophenol and toluene in a volume ratio of 3: 8 so as to have a concentration of 2.5% by weight.
- Viscotek: 350, HT-GPC System The column temperature is 80 ° C., and the detector is a differential refractometer (RI).
- the number average molecular weight of the polybutylene terephthalate, polyethylene terephthalate, and polyester-polyether copolymer is preferably 12,000 to 70,000, more preferably 15,000 to 60,000, and 18,000. It is more preferably from ⁇ 55,000, particularly preferably from 20,000 to 40,000. If it is less than 12,000, the mechanical strength may be low, and if it is greater than 70,000, molding may be difficult.
- the LED lamp heat sink for automobiles of the present invention is produced by injection molding after a thermoplastic polyester resin (A), scaly graphite (B) and other components are produced by melt-kneading.
- the number average molecular weight referred to in the present invention may be either before and after melt kneading or molding, but is preferably after molding.
- the content of the thermoplastic polyester resin (A) used in the present invention is 50 to 90% by weight, preferably 50 to 80% by weight, Preferably, it is 50 to 75% by weight.
- the thermoplastic polyester resin (A) is less than 50% by weight, when it is combined with a metal or other resin, the ultrasonic weldability or the heat-sealability may be deteriorated. Thermal conductivity may not be exhibited.
- the scale-like graphite (B) used in the present invention is graphite particles having specific physical properties.
- the amount of fixed carbon is 98% by mass or more, preferably 98.5% by mass or more, and more preferably 99% by mass or more. When the amount of fixed carbon is less than 98% by mass, the thermal conductivity decreases.
- the amount of fixed carbon can be measured according to JIS M8511. It is assumed that the amount of fixed carbon does not change before and after melt kneading and molding.
- the aspect ratio is 21 or more in the molded body.
- the upper limit of the aspect ratio is preferably as high as possible, and is not particularly limited. However, if an upper limit is set, the preferable range is 1,000,000 or less, the more preferable range is 5,000 or less, and more preferably. 3,000 or less.
- the aspect ratio of the scaly graphite (B) is obtained as a ratio of the maximum diameter in the plane direction to the minimum thickness (maximum diameter in the plane direction / minimum thickness). For example, 100 scales arbitrarily selected by an electron microscope or the like It can be calculated by measuring the maximum diameter and the minimum thickness of the surface graphite particles in the plane direction, and calculating the arithmetic average value of the obtained measured values.
- the scale-like graphite (B) used in the present invention may be either natural graphite or artificial graphite, and may be used in combination, but natural graphite is preferred from the viewpoint that it can be obtained at low cost. Further, either ⁇ -graphite or ⁇ -graphite may be used, or these may be combined.
- graphite having other particle diameters, shapes, and characteristics may be used in combination as long as the physical properties of the present invention are not significantly impaired.
- Specific shapes of graphite include fibrous, lump, earth, and sphere.
- the content of the scaly graphite (B) is 10 to 50% by weight, preferably 20 to 50% by weight, more preferably 25 to 50%. % By weight.
- the heat conductive resin composition used for the automotive LED lamp heat sink of the present invention contains 50 to 90 wt% (preferably 50 to 80 wt%, more preferably 50 to 75 wt%) of the thermoplastic polyester resin (A).
- flaky graphite (B) is contained in an amount of 10 to 50% by weight (preferably 20 to 50% by weight, more preferably 25 to 50% by weight).
- the specific gravity of the heat conductive resin composition of the present invention is 1.4 to 1.7, more preferably 1.5 to 1.7. When specific gravity is less than 1.4, heat conductivity may not fully be expressed and heat dissipation may become insufficient.
- the “surface direction thermal conductivity” refers to the thermal conductivity in the direction in which the molten resin flows when a molded body is produced.
- the thermal conductivity in the direction perpendicular to the resin flow direction is referred to as “thickness direction thermal conductivity”.
- the thermal conductivity in the surface direction of the thermally conductive resin composition of the present invention is 1 W / (m ⁇ K) or more, preferably 3 W / (m ⁇ K) or more, more preferably 5 W / (m ⁇ K). K) or more, more preferably 8 W / (m ⁇ K) or more.
- the upper limit is not particularly limited, and the higher the better.
- the thermal conductivity in the thickness direction of the thermally conductive resin composition of the present invention is not particularly limited, and the higher the better. If a lower limit is set, it is preferably 0.5 W / (m ⁇ K) or more, more preferably 0.8 W / (m ⁇ K) or more, and further preferably 1 W / (m ⁇ K). Or more, particularly preferably 1.2 W / (m ⁇ K) or more.
- the LED lamp heat sink for automobiles of the present invention is formed by injection molding, and the volume average particle diameter of graphite contained in the heat sink is not particularly limited, but is preferably 1 to 500 ⁇ m, more preferably 10 to 300 ⁇ m, still more preferably. Is 20 to 200 ⁇ m, particularly preferably 40 to 100 ⁇ m.
- the volume average particle diameter is less than 1 ⁇ m, the thermal conductivity of the resin composition may be lowered.
- the larger the particle size the better the thermal conductivity and the moldability, but when it exceeds 500 ⁇ m, the strength of the resin composition may decrease.
- the volume average particle diameter can be measured by a laser diffraction method, a light scattering method, or the like.
- the particle size distribution is not particularly limited, but if limited, the ratio D 80 / D 20 of the particle diameters D 20 and D 80 when the cumulative volume obtained by measuring the particle size distribution is 20 and 80%, respectively.
- the ratio is preferably 1 to 20, more preferably 1 to 10, and still more preferably 1 to 5.
- the larger the volume average particle diameter of the flake graphite before melt kneading the better, preferably 1 to 700 ⁇ m, more preferably 10 to 650 ⁇ m, and still more preferably. It is 40 to 500 ⁇ m, and particularly preferably 201 to 40 ⁇ m.
- the aspect ratio is preferably 21 or more.
- the upper limit of the aspect ratio is preferably as high as possible, and is not particularly limited. However, if an upper limit is set, the preferable range is 3,000 or less, the more preferable range is 1,000 or less, and more preferably. 500 or less.
- graphite tends to be crushed during melt-kneading and molding. Therefore, the larger the volume-average particle size of graphite before melt-kneading, the larger the volume-average particle size of graphite after melt-kneading and molding. Largely held, heat conductivity and moldability are improved.
- the LED lamp heat sink for automobiles of the present invention does not need to use the heat conductive resin composition of the present invention on the entire surface or the entire interior, and in order to improve heat dissipation, it is partially good heat conduction such as metal or carbon material.
- the body may be combined. These installation locations are not particularly limited, but after the heat of the LED module is diffused with a good heat conductor, it is possible to dissipate heat with a heat sink composed of a heat conductive resin, so that the heat sink can receive heat efficiently. It is preferable to install on the surface portion.
- the LED lamp heat sink for automobiles of the present invention has a first form consisting only of a member (hereinafter, may be referred to as “thermal conductive resin member”) which is an injection-molded body of a thermally conductive resin composition, heat.
- a third form including a heat conductive layer made of an interface material is included.
- each of the first to third embodiments can include an insulating member made of an insulating material.
- at least 1 sort (s) chosen from the group which consists of metal members and carbon members can be used, for example.
- the material of the metal member is not particularly limited, but aluminum and alloys including this (aluminum alloy), copper and alloys including this (brass, bronze, aluminum brass, etc.), nickel, chromium, titanium, iron, cobalt, tin, Zinc, palladium, silver, stainless steel, magnesium and alloys (magnesium alloys) containing this, manganese, and the like can be given.
- aluminum, copper, magnesium and alloys thereof are preferable from the viewpoint that they have a thermal conductivity of 40 W / (m ⁇ K) or more and can be easily obtained.
- the metal which comprises a metal member can be used individually by 1 type or in combination of 2 or more types.
- Examples of the carbon material constituting the carbon member include a graphite sheet and a carbon fiber composite material, but a graphite sheet is preferable in that it has high thermal conductivity.
- the thermal conductivity in the plane direction of the graphite sheet is not particularly limited, but the higher the better.
- the thickness of the good heat conductive member made of the good heat conductor metal and the carbon material is not particularly limited, but is preferably 5 mm or less, more preferably 3 mm or less, and even more preferably 1 mm or less.
- carbon materials in the case of a graphite sheet, it is preferably 500 ⁇ m or less, more preferably 200 ⁇ m or less, and further preferably 100 ⁇ m or less. A thinner thickness is preferable because it can be reduced in weight.
- the shape of the good heat conductive member made of the good heat conductor is not particularly limited, and examples thereof include a flat plate shape, a curved plate shape, a rod shape, a cylindrical shape, and a massive shape, and even a structure made of a combination thereof. Good. Moreover, you may have a through-hole, a bending part, etc.
- the LED lamp heat sink for automobiles of the present invention has a second form or a third form in which a heat conductive resin member (hereinafter sometimes referred to as “resin molding part”) and a good heat conductive member are integrated.
- a heat conductive resin member hereinafter sometimes referred to as “resin molding part”
- the shape of the surface (heat-receiving surface portion) to be joined to the good heat conductive member of the resin molded portion of the present invention is not particularly limited, and examples thereof include a flat plate, a curved surface, an uneven surface, and a pointed portion.
- the heat conductive resin member is integrally bonded to the good heat conductive member.
- the surface of the metal member on which the resin molded portion is formed is subjected to a surface treatment from the viewpoint of adhesive strength and adhesion between the metal member and the resin molded portion. It may be a thing.
- the surface treatment method is not particularly limited, and examples thereof include fine roughening by a special chemical solution or physical polishing, formation of a film by anodization or an organic compound, primer coating with an adhesive, or the like. Examples of the metal surface treatment include metal surface treatment techniques described in Japanese Patent No. 4527196 and Japanese Patent No. 5302315.
- Integration of the resin molded part and the good heat conductive member is performed by, for example, bonding and fixing.
- the bonding and fixing method include a method of bonding by insert molding, adhesive, vibration welding, ultrasonic welding, thermal fusion, and the like.
- the joining method by insert molding, ultrasonic welding, thermal fusion, vibration welding is preferable, and the molding cycle can be stably produced.
- Ultrasonic welding, heat welding, and vibration welding for bonding a member made of a good heat conductor after forming a heat sink are more preferable.
- the vibration welding is preferably about 100 to 300 Hz, and in the case of ultrasonic welding, 10 to 50 kHz is preferable.
- the total number of vibrations is preferably 300 to 10,000 in the case of vibration welding, and preferably 10,000 to 150,000 in the case of ultrasonic vibration.
- a heat conductive layer made of a thermal interface material is interposed between the resin molded portion and the good heat conductive member.
- the thermal interface material referred to in the present invention is a material used for filling or closely adhering a gap between two materials, and indicates a material having thermal conductivity.
- the thermal interface material is used to create the gap between the good heat conductor metal member and the resin molding part that constitutes the main part of the heat sink. Heat dissipation can be improved by filling.
- the thermal interface material is not particularly limited, and the thermal conductivity is not limited, but a thermal interface material having a thermal conductivity of 0.5 W / (m ⁇ K) or more is preferable from the viewpoint of heat dissipation.
- the LED lamp heat sink for an automobile of the present invention is a composite of an insulating member made of at least one material selected from the group consisting of ceramics, an insulating resin, and a resin composition in order to provide insulation.
- a resin and a resin composition having insulating properties are preferable in that the insulating properties can be imparted at low cost.
- the method of combining is not particularly limited, but it is a method by integral molding such as insert molding or two-color molding, or by separately preparing only an insulating member, and then combining by adhesive, vibration welding, ultrasonic welding, heat welding, etc. And the like.
- the shape of the automotive LED lamp heat sink of the present invention is not particularly limited, and typical forms are shown in FIGS. 1 is a perspective view, and FIG. 2 is a cross-sectional view.
- the LED lamp heat sink for automobiles shown in FIG. 1 and FIG. 2 has a substantially rectangular plate-like base portion 3 and a fin portion 4 composed of a plurality of fins, and each of the plurality of fins is one surface of the base portion 3. , While being spaced apart from each other, and so as to be further away from the base portion 3, the thickness thereof is reduced.
- the LED module 1 is installed in the center of the other surface of the base part 3 in the heat sink via the circuit board 2, and these are connected to a power source (not shown) to constitute an automotive LED lamp.
- the planar shape of the base portion 3 is not limited to a square, and may be any shape such as a rectangle, a circle, an ellipse, a triangle, a pentagon or more polygon.
- the LED lamp for automobiles shown in FIGS. 1 and 2 is in the form of LED module 1 / base part 3 of heat sink / fin part 4 of heat sink, and the heat conductivity in the thickness direction of base part 3 of the heat sink is shown.
- the heat sink in the shape shown below.
- the melt of the heat conductive resin composition is caused to flow into the mold cavity for heat sink injection molding from the gate narrow with respect to the thickness of the heat sink, that is, the thickness ratio of the heat sink to the gate thickness in the mold (heat sink thickness /
- the gate thickness ratio is preferably designed under a condition of 2 or more, more preferably 3 or more, and further preferably 5 or more.
- the gate thickness here includes the gate diameter.
- the thickness of the heat sink here refers to the thickness other than the fin portion, and is not particularly limited, but is preferably the thickness of the base portion 3.
- scaly graphite (B) and other thermally conductive fillers can be oriented in the thickness direction of the molded body (resin molded portion), and the heat sink thickness direction Thermal conductivity is increased more efficiently.
- the type of gate is not particularly limited, and examples include direct gates, side gates, pinpoint gates, film gates, disk gates, ring gates, fan gates, tab gates, submarine gates, and hot runner gates. In view of easy orientation in the body thickness direction, pinpoint gates, film gates, and the like are preferable.
- the installation location of the gate is not particularly limited, it is preferable to install the gate at a location other than the area where the fin portion 4 is to be molded in the mold from the viewpoint of heat dissipation and moldability.
- the number of gate openings is not particularly limited, but two or more are preferable from the viewpoints of heat dissipation and moldability.
- the number of gates is two or more, the thermal conductivity in the thickness direction of the weld portion generated when the resin is filled can be increased, and the heat of the LED module can be efficiently transmitted to the fins.
- the size of the LED lamp heat sink for automobiles is not particularly limited, but the power consumption of the LED differs depending on the type of lamp application to be used, and the size of the heat sink required for heat dissipation varies.
- the longest side of the rear lamp heat sink has a length of 100 mm or less, preferably 70 mm or less, more preferably 50 mm or less, and further preferably 40 mm or less.
- the length of the longest side in the front lamp heat sink is 200 mm or less, preferably 120 mm or less, more preferably 80 mm or less, and even more preferably 50 mm or less.
- the length of the longest side in the heat sink for headlamps is 300 mm or less, preferably 200 mm or less, more preferably 100 mm or less, and further preferably 80 mm or less.
- thermoplastic resin composition thermal conductive resin composition
- the thermoplastic resin composition (thermal conductive resin composition) of the present invention having excellent moldability is suitable, and a rear lamp application having a small heat sink size is suitable.
- the thickness of the base portion 3 of the heat sink is not particularly limited, but is 10 mm or less, preferably 5 mm or less, more preferably 3 mm or less, and further preferably 2 mm or less. If it exceeds 10 mm, the heat of the LED module may not be efficiently transferred to the fins of the heat sink.
- the height of the fin part 4 of a heat sink is not specifically limited, From a viewpoint that heat dissipation can be improved, it is so preferable that height is high. In that case, the heat conductivity in the surface direction of the fin portion 4 is preferably higher than the heat conductivity in the surface direction of the base portion. As a shape for implementing this, the fin portion 4 of the heat sink with respect to the thickness of the base portion 3 of the heat sink.
- the thickness ratio (fin thickness / substrate thickness) is preferably 1 or less. When the thickness of the fin is not uniform, the thickness ratio is calculated as the thickness of the root portion of the fin.
- the thermally conductive resin member shown in FIGS. 3 and 4 has a gate mark 5.
- the gate mark 5 is formed by disposing a gate in a planned formation region on the end face side of the base portion in the mold.
- the heat conductive resin member shown in FIGS. 5 to 7 is the same as the heat conductive resin member shown in FIGS. 1 and 2 on the surface opposite to the surface on which the fin portion of the base is provided.
- a recess 6 having a spatial shape corresponding to the shape of the heat conductive member or the like, and a rib 7 that is provided upright from both ends in one direction of the recess 6 and is a protrusion for fixing the circuit board, the heat conductive member, or the like. It is characterized by having.
- the LED module shown in FIG. 8 is the LED module shown in FIGS. 1 and 2 in which a good heat conductor metal member 8 is interposed between the circuit board 2 and the base portion 3.
- the automotive LED lamp heat sink of the present invention is excellent in heat resistance, and the load deflection temperature (HDT) under a load of 1.82 MPa is 120 ° C. or higher, preferably 130 ° C. or higher, more preferably 150. It is above °C. As the brightness of the LED increases, the temperature of the LED itself tends to increase, and HDT requires 120 ° C. or higher.
- HDT load deflection temperature
- the automotive LED lamp heat sink of the present invention has excellent long-term heat resistance. Since the LED lamp heat sink for automobiles may be used for a long time at a high temperature, the higher the long-term heat resistance, the better.
- the long-term heat resistance as used herein refers to the bending strength retention rate when left in the atmosphere at 150 ° C. for 2000 hours (bending strength after leaving for 2000 hours / initial bending strength). Preferably it is 60% or more, More preferably, it is 70% or more, More preferably, it is 75% or more.
- the automotive LED lamp heat sink of the present invention is excellent in emissivity.
- the emissivity referred to in the present invention is obtained by measuring the emissivity of the molded body using an emissivity measuring instrument, and is 0.65 or more, preferably 0.7 or more, more preferably 0.75 or more. It is.
- the automotive LED lamp heat sink of the present invention is also excellent in electromagnetic wave shielding properties, and the electromagnetic wave shielding effect at a frequency of 100 MHz is 5 dB or more, preferably 10 dB or more, more preferably 15 to 60 dB.
- optional components other than the thermoplastic polyester resin (A) and the scaly graphite (B) in the thermally conductive resin composition used in the present invention will be described.
- the optional component include a thermally conductive filler other than the flaky graphite (B), a filler excluding the flaky graphite (B) and the other thermally conductive filler, and a synthesis other than the thermoplastic polyester resin (A).
- Resin, reinforcing agent, heat stabilizer, antioxidant, UV absorber, anti-aging agent, thickener, release agent, plasticizer, coupling agent, flame retardant, flame retardant, colorant, colorant, etc. 1 type (s) or 2 or more types selected from resin additives such as auxiliary agents.
- the shape of the filler is not particularly limited, and for example, a scale shape, a fiber shape, a flake shape, a plate shape, a spherical shape, a particle shape, a fine particle shape, a nanoparticle, an aggregated particle shape, a tube shape, a nanotube shape, a wire shape, and a rod shape. And various shapes such as an irregular shape, a rugby ball shape, a hexahedron shape, a composite particle shape in which large particles and fine particles are combined, and a liquid.
- a metal filler such as aluminum or nickel, a low melting point alloy having a liquidus temperature of 300 ° C. or more and a solidus temperature of 150 ° C. or more and 250 ° C. or less, aluminum oxide, magnesium oxide, silicon oxide, beryllium oxide, oxidation Metal oxides such as copper and cuprous oxide, metal nitrides such as aluminum nitride and silicon nitride, metal carbides such as silicon carbide, metal carbonates such as magnesium carbonate, insulating carbon materials such as diamond, aluminum hydroxide, water Examples thereof include metal hydroxides such as magnesium oxide, alumina, boron nitride, glass fiber, carbon fiber, potassium titanate whisker, silicon nitride fiber, carbon nanotube, talc, and wollastonite.
- the inorganic filler may be a natural product or a synthesized one. In the case of a natural product, there are no particular limitations on the production area and the like, which can be selected as appropriate.
- fillers in addition to the above-mentioned heat conductive filler, known fillers can be widely used depending on the purpose.
- fillers other than the thermally conductive filler include diatomaceous earth powder, basic magnesium silicate, calcined clay, fine powder silica, quartz powder, crystalline silica, kaolin, antimony trioxide, fine powder mica, molybdenum disulfide, rock Examples thereof include inorganic fibers such as wool, ceramic fibers, and asbestos, and glass fillers such as glass fibers, glass powder, glass cloth, and fused silica.
- organic fillers such as paper, pulp, wood, polyamide fiber, aramid fiber, boron fiber and other synthetic fibers, polyolefin powder and the like can be used in combination.
- the filler used in the present invention is surface-treated with various surface treatment agents such as a silane treatment agent, stearic acid, and an acrylic monomer in order to increase the adhesiveness at the interface between the resin and the filler or to facilitate workability.
- a surface treating agent For example, conventionally well-known things, such as a silane coupling agent and a titanate coupling agent, can be used.
- an epoxy group-containing silane coupling agent such as epoxy silane
- an amino group-containing silane coupling agent such as aminosilane, polyoxyethylene silane, and the like are preferable because they hardly reduce the physical properties of the resin.
- the surface treatment method for the filler is not particularly limited, and a normal treatment method can be used.
- the thermally conductive resin composition of the present invention includes epoxy resin, polyolefin resin, bismaleimide resin, polyimide resin, polyether resin, phenol resin, silicone resin, polycarbonate resin, polyamide resin, polyester resin, fluorine resin, acrylic resin, It may be alloyed with any known resin such as melamine resin, urea resin, urethane resin.
- any other components depending on the purpose for example, reinforcing agent, heat stabilizer, antioxidant, ultraviolet absorber, aging
- An inhibitor thickener, a release agent, a plasticizer, a coupling agent, a flame retardant, a flame retardant, a colorant, a colorant, and other auxiliaries can be added as long as the effects of the present invention are not lost.
- the amount of these additives used is preferably in the range of 0 to 20 parts by weight with respect to 100 parts by weight of the thermoplastic resin.
- the heat stabilizer include phosphites, hindered phenols, thioethers, and the like. These can be used alone or in combination of two or more.
- antioxidants examples include phosphites, hindered amines, hydroquinones, hindered phenols, sulfur-containing compounds and the like. These can be used alone or in combination of two or more.
- ultraviolet absorber examples include benzophenones, benzotriazoles, salicylic acid esters, metal complex salts and the like. These can be used alone or in combination of two or more.
- flame retardant examples include organic flame retardants, inorganic flame retardants, and reactive flame retardants. These can be used alone or in combination of two or more.
- Organic flame retardants include brominated epoxy compounds, brominated alkyltriazine compounds, brominated bisphenol epoxy resins, brominated bisphenol phenoxy resins, brominated bisphenol polycarbonate resins, brominated polystyrene resins, brominated crosslinked polystyrene resins Halogenated flame retardants such as brominated bisphenol cyanurate resin, brominated polyphenylene ether, brominated bismaleimide, decabromodiphenyl oxide, tetrabromobisphenol A and oligomers thereof; trimethyl phosphate, triethyl phosphate, tripropyl phosphate, tributyl phosphate, Tripentyl phosphate, toxyl phosphate, tricyclohexyl phosphate, triphenyl phosphate, tricresyl phosphate Phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, dicresyl
- inorganic flame retardant examples include aluminum hydroxide, antimony oxide, magnesium hydroxide, zinc borate, zirconium series, molybdenum series, zinc stannate, guanidine salt, silicone series, and phosphazene series. These can be used alone or in combination of two or more.
- Reactive flame retardants include tetrabromobisphenol A, dibromophenol glycidyl ether, brominated aromatic triazine, tribromophenol, tetrabromophthalate, tetrachlorophthalic anhydride, dibromoneopentyl glycol, poly (pentabromobenzyl polyacrylate) , Chlorendic acid (hett acid), chlorendic anhydride (hett acid anhydride), brominated phenol glycidyl ether, dibromocresyl glycidyl ether, the following general formula (3) (wherein n is an integer of 2 to 20) And organic phosphorus flame retardants represented. These can be used alone or in combination of two or more.
- a flame retardant aid when a flame retardant is contained in the composition of the present invention, it is preferable to use a flame retardant aid.
- a flame retardant aid antimony trioxide, antimony tetroxide, antimony pentoxide, sodium antimonate, antimony tartrate and other antimony compounds, zinc borate, barium metaborate, hydrated alumina, zirconium oxide, Examples thereof include ammonium polyphosphate, tin oxide, and iron oxide. These can be used alone or in combination of two or more.
- a silicone oil can be mix
- anti-aging agent examples include naphthylamine compounds, diphenylamine compounds, p-phenylenediamine compounds, quinoline compounds, hydroquinone derivative compounds, monophenol compounds, bisphenol compounds, trisphenol compounds, polyphenol compounds.
- plasticizer examples include phthalates such as dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diisobutyl phthalate, dioctyl phthalate, butyl octyl phthalate, di- (2-ethylhexyl) phthalate, diisooctyl phthalate, and diisodecyl phthalate; dimethyl adipate , Diisobutyl adipate, di- (2-ethylhexyl) adipate, diisooctyl adipate, diisodecyl adipate, octyl decyl adipate, di- (2-ethylhexyl) azelate, diisooctyl azelate, diisobutyl azelate, dibutyl sebacate, di- Fatty acid esters such as (2-ethylhexyl) se,
- antibacterial agent examples include zeolite antibacterial agents such as silver zeolite and silver-zinc zeolite, silica gel antibacterial agents such as complexed silver-silica gel, glass antibacterial agents, calcium phosphate antibacterial agents, and zirconium phosphate antibacterial agents.
- Silicate antibacterial agents such as silver-magnesium aluminate, titanium oxide antibacterial agents, ceramic antibacterial agents, whisker antibacterial agents, and other inorganic antibacterial agents; formaldehyde release agents, halogenated aromatic compounds, road Organic antibacterial agents such as propargyl derivatives, thiocyanato compounds, isothiazolinone derivatives, trihalomethylthio compounds, quaternary ammonium salts, biguanide compounds, aldehydes, phenols, pyridine oxide, carbanilide, diphenyl ether, carboxylic acid, organometallic compounds; Organic hybrid antibacterial agent; heaven Antibacterial agents and the like. These can be used alone or in combination of two or more.
- colorant examples include organic dyes, inorganic pigments, and organic pigments. These can be used alone or in combination of two or more.
- thermoplastic resin composition thermal conductive resin composition
- the method for producing the thermoplastic resin composition (thermal conductive resin composition) of the present invention is not particularly limited.
- a melt-kneaded product can be produced by melt-kneading with a melt-kneader such as a single-screw or twin-screw extruder.
- the kneading temperature is selected according to the type of the thermoplastic polyester resin (A).
- a compounding component is a liquid, it can also manufacture by adding to a melt-kneader on the way using a liquid supply pump etc.
- PET polyethylene terephthalate
- IV antimony catalyst
- the bisol 18EN has a number average (m + n) of 18 in the structure of the general formula (2).
- Thermoplastic polyamide resin nylon 6, A1020BRL (trade name) manufactured by Unitika
- Molding conditions The molding processing temperature of the molded body used for evaluation varied depending on the thermoplastic resin used, and injection molding was performed at the molding processing temperature shown in Table 1. Moreover, it shape
- volume average particle diameter of graphite Using a Microtrac particle size distribution measuring apparatus (MICROTRAC MT3300EXII manufactured by Nikkiso Co., Ltd.), graphite particles were put into an aqueous solvent and subjected to ultrasonic vibration for 60 seconds, followed by measurement. Regarding the volume average particle diameter of the graphite particles after the molding process, the pellets of the obtained heat conductive resin composition were obtained using an injection molding machine [Toyo Machine Metal Co., Ltd., Si-30IV], as shown in FIG. A heat sink (gate diameter: ⁇ 1 mm) shown in FIG. 4 was prepared and baked at 620 ° C. for 1 hour, and then only the graphite particles contained in the heat sink were taken out and measured.
- MICROTRAC MT3300EXII manufactured by Nikkiso Co., Ltd.
- Graphite aspect ratio Using a scanning electron microscope (SEM) (JEOL JSM-6060LA), the longest diameter and the minimum thickness in the surface direction of 100 graphite particles are measured, and each average value of the obtained measurement values is used for calculation. did. About the aspect ratio of the graphite particle after a shaping
- Number average molecular weight A part of the heat sink shown in FIGS. 3 and 4 produced by injection molding was dissolved in a mixed solvent of p-chlorophenol (manufactured by Tokyo Chemical Industry Co., Ltd.) and toluene in a volume ratio of 3: 8 so as to have a concentration of 0.25% by weight. Then, only the thermoplastic resin was extracted and the sample was prepared. The standard material was polystyrene, and a similar sample solution was prepared. The measurement was performed using a high temperature GPC (350 HT-GPC System manufactured by Viscotek) under conditions of a column temperature of 80 ° C. and a flow rate of 1.00 mL / min. A differential refractometer (RI) was used as a detector.
- RI differential refractometer
- Extrusion kneading temperature The heat conductive resin composition was prepared by extrusion melt kneading. The extrusion kneading temperature at that time was different depending on the thermoplastic polyester resin (A), and extrusion kneading was performed at the extrusion barrel temperature shown in Table 1.
- Thermal conductivity Using the pellets of the obtained heat conductive resin composition, a molded body of ⁇ 26 mm ⁇ 1 mm thickness was produced with an injection molding machine [Toyo Machine Metal Co., Ltd., Si-15IV], and conformed to ASTM E1461 standard Then, the thermal conductivity in the plane direction and the thickness direction in the room temperature atmosphere was measured with a laser flash method thermal conductivity measuring device (LFA447 manufactured by NETZSCH).
- Thermal conductivity of heat sink Three types of heat sinks (1) and (2) having the same shape and the same dimensions as shown in FIGS. 3 and 4 except that the cross-sectional shape of the gate trace 5 is different were manufactured by injection molding. The heat conductivity in the thickness direction of the base portion 3 of the obtained heat sink was measured.
- Cross-sectional shape of the gate mark 5 of the heat sink (1) substantially circular of ⁇ 1 mm
- Cross-sectional shape of the gate mark 5 of the heat sink (2) substantially square of 2 mm ⁇ 2 mm
- Formability The pellets of the obtained heat conductive resin composition were matched to the type of thermoplastic resin contained in the heat conductive resin composition using an injection molding machine [Toyo Machine Metal Co., Ltd., Si-30IV]. Then, the flow length in a spiral shaped product (10 mm width ⁇ 1 mm thickness, pitch 5 mm) was measured at an injection pressure of 150 MPa and an injection speed of 150 mm / s with the molding temperature and mold temperature shown in Table 1 as follows. The formability was judged. ⁇ : Flow length is 120 mm or more, ⁇ : Flow length is 80 to 120 mm, X: Flow length is less than 80 mm
- a test piece having a thickness of 80 mm ⁇ 40 mm ⁇ 4 mm was prepared with an HDT (high load) injection molding machine (Si-30IV, manufactured by Toyo Machine Metal Co., Ltd.), and measured according to ISO75 standard.
- HDT high load injection molding machine
- Emissivity Using an emissivity measuring instrument (TSS-5X manufactured by Japan Sensor Co., Ltd.), the emissivity of a molded product having a thickness of 80 mm ⁇ 40 mm ⁇ 4 mm was measured.
- Fogging property A ⁇ 26 mm x 1 mm thick sample produced by injection molding was allowed to stand for 1 week in an atmosphere of 23 ° C and 50% humidity, and then placed in a glass tube (outer diameter 80 mm x height 180 mm, opening outer diameter 60 mm). Three samples were put, a glass plate was placed on the glass tube opening, and sealed with a wrap to fill the gap between the glass tube and the glass plate. The glass tube was immersed in an oil bath at 120 ° C. for 24 hours, and the gas generated at this time was adhered to the glass plate.
- the haze value (cloudiness) of this glass plate was measured with a turbidimeter (NDH-300A manufactured by Nippon Denshoku Industries Co., Ltd.), and the fogging property was determined as follows.
- ⁇ : Haze value is less than 5%
- ⁇ : Haze value is 5 to 10%
- ⁇ : Haze value is 10% or more. The smaller the haze value, the less fogging and the better the fogging property, and the higher the haze value, the more the glass becomes cloudy and the fogging property is inferior.
- Ultrasonic weldability A heat sink (40 ⁇ 40 ⁇ 40 mm) having the shape shown in FIGS. 5 to 7 was produced, and an aluminum plate (20 ⁇ 20, thickness 1 mm) was placed on the upper surface of the heat sink. Using an ultrasonic welder (Emerson 2000Xdt), 20 kHz ultrasonic vibration was applied for 3 seconds at an amplitude setting value of 80%, and the rib portion 7 was welded. The ultrasonic weldability was determined as follows. ⁇ : No burr is generated at the welded portion, x: Burr is generated at the welded portion, and scrap is generated when the burr portion is rubbed with a nail.
- thermoplastic polyester resins (A-1) to (A-4) were dried at 140 ° C. for 4 hours using a hot air dryer, and mixed so that the weight ratios shown in Table 2 were obtained.
- a phenol-based stabilizer AO-60 manufactured by ADEKA Corporation
- a phosphorus-based antioxidant Adeka Stab PEP-36 manufactured by ADEKA Corporation
- Example 1 Example 1 was repeated except that the formulation was changed to the formulation shown in Table 3.
- Table 3 shows the volume average particle diameter and aspect ratio of the graphite particles contained in the heat sink, and various physical property values.
- thermoplastic polyester resin was changed to a thermoplastic polyamide resin, dried at 120 ° C. for 6 hours using a hot air dryer, and prepared by mixing so as to have the weight ratio shown in Table 3.
- Example 1 was repeated except that the extrusion barrel temperature and the injection molding conditions were changed.
- Table 3 shows the volume average particle diameter and aspect ratio of the graphite particles contained in the heat sink, and various physical property values.
- Example 3 and Comparative Example 1 when the same amount of graphite is contained, the thermal conductivity and molding processability are increased because the fixed carbon amount of the graphite used in the example is 98% or more. I understand that. Further, comparing the example and the comparative example 2, it can be said that the heat conductive resin composition of the example is excellent in fogging property and ultrasonic welding property. From Example 3 and Example 7, the larger the volume average particle diameter of the graphite before melt kneading, the larger the volume average particle diameter of the graphite particles contained in the molded body, and the thermal conductivity and moldability are improved. I can say that.
- Example 3 From the results of Example 3 and Example 8, it can be said that when the heat sink thickness / gate thickness ratio is 2 or more, the thermal conductivity in the thickness direction of the base portion of the heat sink is improved. As a result, the heat of the LED module can be efficiently transmitted to the fin portion, so that the temperature of the LED module can be more effectively reduced.
- the LED lamp heat sink for automobiles of the present invention has excellent thermal conductivity, molding processability, and low specific gravity, so it can be used as a substitute for metals with high thermal conductivity, and has high weight reduction and high degree of freedom in shape. It can be manufactured easily and inexpensively. In addition, it has excellent low fogging properties and ultrasonic weldability, the lamp lens is less fogged, can be easily combined with other base materials, and the physical properties can be improved according to the application.
- the heat conductive resin composition of the present invention is excellent in electromagnetic shielding properties and is also suitable for applications requiring electromagnetic shielding properties. From the above, it is suitable for LED lamp heat sink applications for automobiles.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Abstract
Description
1)一部または全部が熱伝導性樹脂組成物の射出成形により形成されたLEDモジュールを冷却するためのヒートシンクであって、前記熱伝導性樹脂組成物が、(A)数平均分子量が12,000~70,000である熱可塑性ポリエステル樹脂(以下、単に「熱可塑性ポリエステル樹脂(A)」と称することがある。)50~90重量%、および(B)固定炭素量が98質量%以上、且つアスペクト比が21以上である鱗片状黒鉛(以下、単に「鱗片状黒鉛(B)」と称することがある。)10~50重量%を少なくとも含有し、比重1.4~1.7、且つ1W/(m・K)以上の面方向の熱伝導率を有する樹脂組成物であることを特徴とする自動車用LEDランプヒートシンク。
2)前記自動車用LEDランプヒートシンク中に含まれる鱗片状黒鉛(B)の体積平均粒子径が1~500μmであることを特徴とする、1)に記載の自動車用LEDランプヒートシンク。
3)前記熱伝導性樹脂組成物が溶融混練によって製造され、溶融混練前の鱗片状黒鉛の体積平均粒子径が1~700μm、固定炭素量が98質量%以上、アスペクト比が21以上であることを特徴とする、1)、又は2)に記載の自動車用LEDランプヒートシンク。
4)前記熱可塑性ポリエステル樹脂(A)が、ポリブチレンテレフタレート、ポリエチレンテレフタレート、及びポリエステル-ポリエーテル共重合体からなる群より選択される1種以上のものであることを特徴とする、1)~3)の何れかに記載の自動車用LEDランプヒートシンク。
5)前記熱伝導性樹脂組成物の厚み方向の熱伝導率が0.5W/(m・K)以上であることを特徴とする、1)~4)の何れかに記載の自動車用LEDランプヒートシンク。
6)前記自動車用LEDランプヒートシンクの一部が良熱伝導体金属又は炭素材料の何れか一方である、1)~5)の何れかに記載の自動車用LEDランプヒートシンク。
7)前記良熱伝導体金属と熱伝導性樹脂組成物により形成された自動車用LEDランプヒートシンクが、インサート成形、超音波溶着、または熱融着によって、熱伝導性樹脂組成物からなるヒートシンクの受熱面部に、良熱伝導体金属を接合固定してなる、1)~5)の何れかに記載の自動車用LEDランプヒートシンク。
8)前記良熱伝導体金属は、アルミニウム、銅、マグネシウム及びこれらの合金からなる群より選ばれる金属であり、熱伝導率40W/(m・K)以上の物質である、6)または7)に記載の自動車用LEDランプヒートシンク。
9)炭素材料は、グラファイトシートであって、面方向の熱伝導率が500W/(m・K)以上である、6)に記載の自動車用LEDヒートシンク。
10)前記自動車用LEDランプヒートシンクは、0.5W/(m・K)以上のサーマルインターフェイスマテリアルを用いたものであって、良熱伝導体金属/サーマルインターフェイスマテリアル/熱伝導性樹脂組成物より構成される、1)~9)の何れかに記載の自動車用LEDランプヒートシンク。
11)前記自動車用LEDランプヒートシンクの一部が絶縁性を有する樹脂を含む樹脂組成物で構成されることを特徴とする、1)~10)の何れかに記載の自動車用LEDランプヒートシンク。
12)前記自動車用LEDランプヒートシンクの射出成形用金型内のゲート厚みに対して、該ヒートシンクの基盤部の厚み比(基盤部厚み/ゲート厚み)が2以上であることを特徴とする、1)~11)の何れかに記載の自動車用LEDランプヒートシンク。
13)前記自動車用LEDランプヒートシンクのゲート痕が、2つ以上であることを特徴とする、1)~12)の何れかに記載の自動車用LEDランプヒートシンク。
14)1)~13)の何れかに記載の自動車用LEDリアランプヒートシンク。
15)1)~13)の何れかに記載の自動車用LEDフロントランプヒートシンク。
16)1)~13)の何れかに記載の自動車用LEDヘッドランプヒートシンク。
1)熱伝導性樹脂組成物の射出成形体からなる部材を含む自動車用LEDランプヒートシンクであって、該記熱伝導性樹脂組成物は、(A)数平均分子量が12,000~70,000である熱可塑性ポリエステル樹脂50~90重量%、および(B)固定炭素量が98質量%以上、且つアスペクト比が21以上である鱗片状黒鉛10~50重量%を含有し、比重1.4~1.7、且つ面方向の熱伝導率1W/(m・K)以上であることを特徴とする自動車用LEDランプヒートシンク。
2)鱗片状黒鉛(B)の体積平均粒子径が1~500μmである、1)に記載の自動車用LEDランプヒートシンク。
3)熱伝導性樹脂組成物は溶融混練物であり、溶融混練前の鱗片状黒鉛の体積平均粒子径が1~700μm、固定炭素量が98質量%以上、アスペクト比が21以上である、1)又は2)に記載の自動車用LEDランプヒートシンク。
4)熱可塑性ポリエステル樹脂(A)が、ポリブチレンテレフタレート、ポリエチレンテレフタレート、及びポリエステル-ポリエーテル共重合体からなる群より選択される1種以上である、1)~3)の何れかに記載の自動車用LEDランプヒートシンク。
5)熱伝導性樹脂組成物の厚み方向の熱伝導率が0.5W/(m・K)以上である、1)~4)の何れかに記載の自動車用LEDランプヒートシンク。
6)金属及び炭素材料から選ばれる少なくとも1種の良熱伝導体からなる部材をさらに含む、1)~5)の何れかに記載の自動車用LEDランプヒートシンク。
7)熱伝導性樹脂組成物の射出成形体からなる部材であるヒートシンクの受熱面部と、良熱伝導体からなる部材との、インサート成形、超音波溶着または熱融着による接合体である、1)~5)の何れかに記載の自動車用LEDランプヒートシンク。
8)金属は、アルミニウム、銅、マグネシウム及びこれらの合金からなる群より選ばれる少なくとも1種であって、熱伝導率40W/(m・K)以上である、6)または7)に記載の自動車用LEDランプヒートシンク。
9)炭素材料は、面方向の熱伝導率500W/(m・K)以上のグラファイトシートである、6)に記載の自動車用LEDヒートシンク。
10)熱伝導率0.5W/(m・K)以上のサーマルインターフェイスマテリアルからなる熱伝導層を更に含み、該熱伝導層が、熱伝導性樹脂組成物の射出成形体からなる部材と、良熱伝導体からなる部材との間に介在する、6)~9)の何れかに記載の自動車用LEDランプヒートシンク。
11)絶縁性材料からなる部材をさらに含む、1)~10)の何れかに記載の自動車用LEDランプヒートシンク。
12)自動車用LEDランプヒートシンクの射出成形用金型内に熱伝導性樹脂組成物を注入するゲートの厚みと、該自動車用LEDランプヒートシンクの基盤部の厚みとの比(基盤部厚み/ゲート厚み)が2以上である、1)~11)の何れかに記載の自動車用LEDランプヒートシンク。
13)2つ以上のゲート痕を有する、1)~12)の何れかに記載の自動車用LEDランプヒートシンク。
14)リアランプに用いられる、1)~13)の何れかに記載の自動車用LEDランプヒートシンク。
15)フロントランプに用いられる、1)~13)の何れかに記載の自動車用LEDランプヒートシンク。
16)ヘッドランプに用いられる、1)~13)の何れかに記載の自動車用LEDランプヒートシンク。
ポリエステル-ポリエーテル共重合体における芳香族ポリエステル単位は、芳香族ジカルボン酸またはそのエステル形成性誘導体とジオールまたはそのエステル形成性誘導体とから得られる重合体ないし共重合体であって、通常、交互重縮合体であり、好ましくは、ポリエチレンテレフタレート単位、ポリブチレンテレプタレート単位、及びポリプロピレンテレフタレート単位からなる群から選ばれる1種以上である。
ポリエステル-ポリエーテル共重合体における変性ポリエーテル単位は、前記一般式(1)で表される単位であり、一般式(1)中のオキシアルキレン単位の繰り返し単位数m、nにつき、(m+n)の数平均は、好ましくは2~50であり、より好ましくは10~50であり、さらに好ましくは18~50である。
熱可塑性ポリエステル樹脂(A):
ポリエチレンテレフタレート(A-1):三菱化学社製 ノバペックス PBKII(商品名)、数平均分子量28,000
ポリエチレンテレフタレート(A-2):三菱化学社製 GS-100(商品名)、数平均分子量22,500
ポリエチレンテレフタレート(A-3)クラレ社製 KS710B-8S(商品名)、数平均分子量61,000
ポリエステル-ポリエーテル共重合体(A-4):
ポリエステル-ポリエーテル共重合体(A-4)としては、以下の方法で製造したものを使用した。
熱可塑性ポリアミド樹脂:ナイロン6、ユニチカ社製 A1020BRL(商品名)
鱗片状黒鉛(B-1):中越黒鉛工業所社製 CPB-80(商品名)、体積平均粒子径300μm、固定炭素量99.9%、アスペクト比100
鱗片状黒鉛(B-2):中越黒鉛工業所社製 BF-40AK(商品名)、体積平均粒子径50μm、固定炭素量99.9%、アスペクト比30
鱗片状黒鉛(B-3):中越黒鉛工業所社製 MD-100C(商品名)、体積平均粒子径170μm、固定炭素量93.6%、アスペクト比80
補強剤(C):
ガラス繊維:日本電気硝子株式会社製T187H/PL(商品名)、単体での熱伝導率1.0W/(m・K)、繊維直径13μm、数平均繊維長3.0mm
成形加工条件:
評価するために使用する成形体の成形加工温度は、使用する熱可塑性樹脂によって異なり、表1に示す成形加工温度で射出成形を行った。また、射出速度150mm/s、射出圧力150MPaに固定して成形を行った。
マイクロトラック粒度分布測定装置(日機装社製 MICROTRAC MT3300EXII)を用いて、水溶媒中に黒鉛粒子を投入し、60秒間超音波振動させた後、測定を行った。成形加工後の黒鉛粒子の体積平均粒子径については、得られた熱伝導性樹脂組成物のペレットを、射出成形機[東洋機械金属(株)製、Si-30IV]を用いて、図3、4に示すヒートシンク(ゲート径:φ1mm)を作製し、620℃で1時間焼成させた後、ヒートシンク中に含まれる黒鉛粒子のみを取り出し、測定を行った。
走査型電子顕微鏡(SEM)(日本電子社製 JSM-6060LA)を用いて、黒鉛粒子100個の面方向の最長径及び最小厚みを測定し、得られた測定値の各平均値を用いて算出した。成形加工後の黒鉛粒子のアスペクト比については、図3、4に示すヒートシンクを用いて同様の方法で算出した。
射出成形によって作製した図3、4のヒートシンクの一部を、p-クロロフェノール(東京化成工業製)とトルエンの体積比3:8混合溶媒に0.25重量%濃度となるように溶解させた後、熱可塑性樹脂のみを抽出し、試料を調製した。標準物質はポリスチレンとし、同様の試料溶液を調製した。高温GPC(Viscotek社製 350 HT-GPC System)にてカラム温度:80℃、流速1.00mL/minの条件で測定した。検出器としては、示差屈折計(RI)を使用した。
熱伝導性樹脂組成物は、押出溶融混練によって作製されるが、その際の押出混練温度は熱可塑性ポリエステル樹脂(A)によって異なり、表1に示す押出バレル温度で押出混練を行った。
得られた熱伝導性樹脂組成物のペレットを用いて、射出成形機[東洋機械金属(株)製、Si-15IV]にて、φ26mm×1mm厚の成形体を作製し、ASTM E1461規格に準拠して、レーザーフラッシュ法熱伝導率測定装置(NETZSCH社製 LFA447)により、室温大気中における面方向と厚み方向の熱伝導率を測定した。
射出成形によって、図3 、4に示すヒートシンクであって、ゲート痕5の断面形状が異なる以外は同じ形状及び同じ寸法である2種類のヒートシンク(1)、(2)を作製した。得られたヒートシンクの基盤部3の厚み方向の熱伝導率を測定した。
ヒートシンク(1)のゲート痕5の断面形状:φ1mmのほぼ円形
ヒートシンク(2)のゲート痕5の断面形状:2mm×2mmのほぼ正方形
φ26mm×1mm厚の成形体を用いて、ISO1183規格に準拠して、水中置換法にて比重を測定した。
得られた熱伝導性樹脂組成物のペレットを、射出成形機[東洋機械金属(株)製、Si-30IV]を用いて、熱伝導性樹脂組成物中に含まれる熱可塑性樹脂の種類に合わせて、表1に示す成形温度、金型温度にし、射出圧力150MPa、射出速度150mm/sでスパイラル状の成形体(10mm幅×1mm厚、ピッチ5mm)における流動長を測定し、次のように成形性を判断した。○:流動長が120mm以上、△:流動長が80~120mm、×:流動長が80mm未満
HDT(高荷重)射出成形機[東洋機械金属(株)製、Si-30IV]にて、80mm×40mm×4mm厚みの試験片を作製し、ISO75規格に準拠して測定した。
小型高温チャンバー(ESPEC社製、ST-120)を用いて、試験片を大気中、150℃雰囲気下で2000時間放置した。試験前後の試験片の曲げ強度をISO178に準拠して測定し、曲げ強度保持率(2000時間放置後の曲げ強度/初期の曲げ強度)を算出した。
放射率測定器(ジャパンセンサー社製 TSS-5X)を用いて、80mm×40mm×4mm厚みの成形体の放射率を測定した。
射出成形によって作製したφ26mm×1mm厚のサンプルを、23℃、湿度50%雰囲気下で1週間放置させた後、ガラス管(外径80mm×高さ180mm、開口部の外径60mm)の中に、サンプルを3枚いれ、ガラス管開口上にガラス板を載せ、ガラス管とガラス板間の隙間を埋めるためラップでシールをした。このガラス管を120℃のオイルバスに24時間浸け、この際に発生したガスをガラス板に付着させた。その後、このガラス板を濁度計(日本電色工業社製NDH-300A)にてヘイズ値(曇り)を測定し、次のようにフォギング性の判定をした。○:ヘイズ値が5%未満、△:ヘイズ値が5~10%、×:ヘイズ値が10%以上。ヘイズ値は小さいほど曇りが少なくフォギング性に優れており、ヘイズ値が大きいほどガラスが曇り、フォギング性に劣る。
図5~7に示す形状のヒートシンク(40×40×40mm)を作製し、ヒートシンクの上面部にアルミ板(20×20、厚み1mm)を設置した。超音波溶着機(エマソン社製 2000Xdt)を用いて、20kHzの超音波振動を振幅設定値80%で3秒間かけリブ部7を溶着させ、超音波溶着性を次のようにして判定した。○:溶着部にバリの発生がない、×:溶着部にバリの発生があり、バリ部を爪で擦ると屑が発生する。
熱可塑性ポリエステル樹脂(A-1)~(A-4)を、熱風乾燥機を用いて140℃で4時間乾燥し、表2に示された重量比率となるように混合したものを準備した。これに、フェノール系安定剤(株式会社ADEKA製AO-60)およびリン系酸化防止剤(株式会社ADEKA製アデカスタブPEP-36)を樹脂組成物100重量部に対してそれぞれ0.3重量部加えた。この混合物を、株式会社テクノベル製25mm同方向回転完全噛合型二軸押出機MFU25TW-60HG-NH-1300を用いて、吐出量20kg/h、スクリュー回転数150rpm、押出バレル温度を表1に示す温度に設定して溶融混練することで、樹脂組成物のペレットを得た。
得られた樹脂組成物のペレットを射出成形によって、各成形体を作製し、各種評価した。ヒートシンク中に含まれる黒鉛粒子の体積平均粒子径とアスペクト比、及び各種物性値を表2に示す。
表3に示す配合処方に変更した以外は、実施例1と同様にした。ヒートシンク中に含まれる黒鉛粒子の体積平均粒子径とアスペクト比、及び各種物性値を表3に示す。
熱可塑性ポリエステル樹脂を熱可塑性ポリアミド樹脂に変更し、熱風乾燥機を用いて120℃で6時間乾燥し、表3に示された重量比率となるように混合したものを準備した。押出バレル温度、射出成形条件を変更した点以外は、実施例1と同様にした。ヒートシンク中に含まれる黒鉛粒子の体積平均粒子径とアスペクト比、及び各種物性値を表3に示す。
2 回路基板
3 ヒートシンクの基盤部
4 ヒートシンクのフィン
5 ゲート
6 ヒートシンク上面部
7 リブ
8 良熱伝導体金属製部材
Claims (16)
- 一部または全部が熱伝導性樹脂組成物の射出成形により形成されたLEDモジュールを冷却するためのヒートシンクであって、
前記熱伝導性樹脂組成物が、(A)数平均分子量が12,000~70,000である熱可塑性ポリエステル樹脂50~90重量%、および(B)固定炭素量が98質量%以上、且つアスペクト比が21以上である鱗片状黒鉛10~50重量%を少なくとも含有し、比重1.4~1.7、且つ1W/(m・K)以上の面方向の熱伝導率を有する樹脂組成物であることを特徴とする自動車用LEDランプヒートシンク。 - 前記自動車用LEDランプヒートシンク中に含まれる鱗片状黒鉛(B)の体積平均粒子径が1~500μmであることを特徴とする、請求項1に記載の自動車用LEDランプヒートシンク。
- 前記熱伝導性樹脂組成物が溶融混練によって製造され、溶融混練前の鱗片状黒鉛の体積平均粒子径が1~700μm、固定炭素量が98質量%以上、アスペクト比が21以上であることを特徴とする、請求項1、又は2に記載の自動車用LEDランプヒートシンク。
- 前記熱可塑性ポリエステル樹脂(A)が、ポリブチレンテレフタレート、ポリエチレンテレフタレート、及びポリエステル-ポリエーテル共重合体からなる群より選択される1種以上のものであることを特徴とする、請求項1~3の何れか1項に記載の自動車用LEDランプヒートシンク。
- 前記熱伝導性樹脂組成物の厚み方向の熱伝導率が0.5W/(m・K)以上であることを特徴とする、請求項1~4の何れか1項に記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクの一部が良熱伝導体金属又は炭素材料の何れか一方である、請求項1~5の何れか1項に記載の自動車用LEDランプヒートシンク。
- 良熱伝導体金属と前記熱伝導性樹脂組成物により形成された自動車LEDランプヒートシンクが、インサート成形、超音波溶着、または熱融着によって、前記熱伝導性樹脂組成物からなるヒートシンクの受熱面部に、前記良熱伝導体金属を接合固定してなる、請求項1~5の何れか1項に記載の自動車用LEDランプヒートシンク。
- 前記良熱伝導体金属は、アルミニウム、銅、マグネシウム及びこれらの合金からなる群より選ばれる金属であり、熱伝導率40W/(m・K)以上の物質である、請求項6または7に記載の自動車用LEDランプヒートシンク。
- 前記炭素材料は、グラファイトシートであって、面方向の熱伝導率が500W/(m・K)以上である、請求項6に記載の自動車用LEDヒートシンク。
- 前記自動車用LEDランプヒートシンクは、0.5W/(m・K)以上のサーマルインターフェイスマテリアルを用いたものであって、前記良熱伝導体金属/前記サーマルインターフェイスマテリアル/前記熱伝導性樹脂組成物より構成される、請求項6~9の何れか1項に記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクの一部が絶縁性を有する樹脂を含む樹脂組成物で構成されることを特徴とする、請求項1~10の何れかに記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクの射出成形用金型内のゲート厚みに対して、該ヒートシンクの基盤部の厚み比(基盤部厚み/ゲート厚み)が2以上であることを特徴とする、請求項1~11の何れか1項に記載の自動車用LEDランプヒートシンク。
- 前記自動車用LEDランプヒートシンクのゲート痕が、2つ以上であることを特徴とする、請求項1~12の何れか1項に記載の自動車用LEDランプヒートシンク。
- 請求項1~13の何れか1項に記載の自動車用LEDリアランプヒートシンク。
- 請求項1~13の何れか1項に記載の自動車用LEDフロントランプヒートシンク。
- 請求項1~13の何れか1項に記載の自動車用LEDヘッドランプヒートシンク。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580046972.7A CN106605310B (zh) | 2014-09-01 | 2015-08-27 | 汽车用led灯散热器 |
JP2016546602A JP6857497B2 (ja) | 2014-09-01 | 2015-08-27 | 自動車用ledランプヒートシンク |
EP15837871.1A EP3190636B1 (en) | 2014-09-01 | 2015-08-27 | Automotive led lamp heat sink |
US15/446,457 US10222051B2 (en) | 2014-09-01 | 2017-03-01 | Automotive LED lamp heat sink |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014177322 | 2014-09-01 | ||
JP2014-177322 | 2014-09-01 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/446,457 Continuation US10222051B2 (en) | 2014-09-01 | 2017-03-01 | Automotive LED lamp heat sink |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016035680A1 true WO2016035680A1 (ja) | 2016-03-10 |
Family
ID=55439744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/074315 WO2016035680A1 (ja) | 2014-09-01 | 2015-08-27 | 自動車用ledランプヒートシンク |
Country Status (5)
Country | Link |
---|---|
US (1) | US10222051B2 (ja) |
EP (1) | EP3190636B1 (ja) |
JP (1) | JP6857497B2 (ja) |
CN (1) | CN106605310B (ja) |
WO (1) | WO2016035680A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016194361A1 (ja) * | 2015-06-03 | 2016-12-08 | 株式会社カネカ | 金属樹脂複合体 |
EP3348618A4 (en) * | 2015-09-09 | 2019-04-24 | Kaneka Corporation | THERMOCONDUCTIVE RESIN COMPOSITION |
WO2022158600A1 (ja) * | 2021-01-25 | 2022-07-28 | 積水テクノ成型株式会社 | 樹脂組成物及び樹脂成形体 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102282332B1 (ko) | 2014-07-07 | 2021-07-27 | 허니웰 인터내셔날 인코포레이티드 | 이온 스캐빈저를 갖는 열 계면 재료 |
JP6600314B2 (ja) | 2014-10-23 | 2019-10-30 | 株式会社カネカ | Ledランプヒートシンク |
WO2016086410A1 (en) | 2014-12-05 | 2016-06-09 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
WO2017040703A1 (en) * | 2015-08-31 | 2017-03-09 | Flex-N-Gate Advanced Product Development, Llc | Lamp assembly with thermal transporter |
KR20170033947A (ko) * | 2015-09-17 | 2017-03-28 | 삼성전자주식회사 | 광원 모듈 및 이를 포함하는 조명 장치 |
US10312177B2 (en) * | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
JP6765241B2 (ja) * | 2016-07-13 | 2020-10-07 | 株式会社小糸製作所 | 車輌用照明装置 |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
CN107129744B (zh) * | 2017-04-27 | 2018-05-11 | 广东歌丽斯化学有限公司 | 一种封装材料及其制备方法和应用 |
EP3503226A3 (en) * | 2017-08-27 | 2019-09-18 | Everlight Electronics Co., Ltd. | Semiconductor package structure |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
JP6932198B2 (ja) * | 2017-10-12 | 2021-09-08 | 日本パーカライジング株式会社 | 表面処理剤、並びに、表面処理被膜を有する金属材料及びその製造方法 |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
CN108148361B (zh) * | 2017-12-29 | 2020-06-30 | 江阴济化新材料有限公司 | 一种导热pbt材料及其制备方法和应用 |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US11084925B2 (en) * | 2018-02-20 | 2021-08-10 | Ticona Llc | Thermally conductive polymer composition |
US10281113B1 (en) | 2018-03-05 | 2019-05-07 | Ford Global Technologies, Llc | Vehicle grille |
CN108546398A (zh) * | 2018-04-09 | 2018-09-18 | 上海小糸车灯有限公司 | 车灯用防起雾材料及其制备方法 |
JP6603364B1 (ja) * | 2018-05-16 | 2019-11-06 | 株式会社テックスイージー | 容器入り飲料温度調節装置 |
CN112638264B (zh) * | 2018-06-12 | 2024-05-17 | 深圳市理邦精密仪器股份有限公司 | 超声波换能器、超声波探头以及超声波检测装置 |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
US10986722B1 (en) * | 2019-11-15 | 2021-04-20 | Goodrich Corporation | High performance heat sink for double sided printed circuit boards |
US20230174837A1 (en) * | 2020-03-30 | 2023-06-08 | Toyobo Co., Ltd. | Thermally conductive resin composition and molded article comprising same |
US20220320408A1 (en) * | 2021-04-01 | 2022-10-06 | Baker Hughes Oilfield Operations Llc | Enclosures for thermoelectric generators, and related devices, systems, and methods |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010021452A (ja) * | 2008-07-14 | 2010-01-28 | Panasonic Corp | 光半導体装置用パッケージ |
JP2011016937A (ja) * | 2009-07-09 | 2011-01-27 | Mitsubishi Engineering Plastics Corp | 高熱伝導性熱可塑性樹脂組成物及び成形品 |
JP2011061157A (ja) * | 2009-09-14 | 2011-03-24 | Starlite Co Ltd | Led用ヒートシンク及び自動車用ledランプ |
JP2014093427A (ja) * | 2012-11-05 | 2014-05-19 | Unitika Ltd | ヒートシンク |
JP2014091826A (ja) * | 2012-11-07 | 2014-05-19 | Kaneka Corp | 熱伝導成形体 |
JP2014146575A (ja) * | 2013-01-30 | 2014-08-14 | Panasonic Corp | ランプ、ランプの製造方法、及び照明装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6399209B1 (en) * | 1999-04-16 | 2002-06-04 | The Bergquist Company | Integrated release films for phase-change interfaces |
JP2001060413A (ja) | 1999-06-17 | 2001-03-06 | Showa Denko Kk | 導電樹脂組成物及びそれを用いた成形物 |
US20070216067A1 (en) * | 2000-01-21 | 2007-09-20 | Cyclics Corporation | Macrocyclic polyester oligomers as carriers and/or flow modifier additives for thermoplastics |
US6384128B1 (en) * | 2000-07-19 | 2002-05-07 | Toray Industries, Inc. | Thermoplastic resin composition, molding material, and molded article thereof |
JP5225558B2 (ja) | 2005-05-26 | 2013-07-03 | テクノポリマー株式会社 | 熱伝導性樹脂組成物及び成形品 |
WO2010016485A1 (ja) | 2008-08-06 | 2010-02-11 | 大成プラス株式会社 | 金属合金とポリアミド樹脂組成物の複合体とその製造方法 |
JP4527196B2 (ja) | 2009-12-24 | 2010-08-18 | 東ソー株式会社 | 複合体およびその製造方法 |
CN102762920B (zh) * | 2010-02-11 | 2015-04-08 | 帝斯曼知识产权资产管理有限公司 | Led照明装置 |
US8915617B2 (en) * | 2011-10-14 | 2014-12-23 | Ovation Polymer Technology And Engineered Materials, Inc. | Thermally conductive thermoplastic for light emitting diode fixture assembly |
US9227347B2 (en) * | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
-
2015
- 2015-08-27 JP JP2016546602A patent/JP6857497B2/ja active Active
- 2015-08-27 CN CN201580046972.7A patent/CN106605310B/zh active Active
- 2015-08-27 WO PCT/JP2015/074315 patent/WO2016035680A1/ja active Application Filing
- 2015-08-27 EP EP15837871.1A patent/EP3190636B1/en active Active
-
2017
- 2017-03-01 US US15/446,457 patent/US10222051B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010021452A (ja) * | 2008-07-14 | 2010-01-28 | Panasonic Corp | 光半導体装置用パッケージ |
JP2011016937A (ja) * | 2009-07-09 | 2011-01-27 | Mitsubishi Engineering Plastics Corp | 高熱伝導性熱可塑性樹脂組成物及び成形品 |
JP2011061157A (ja) * | 2009-09-14 | 2011-03-24 | Starlite Co Ltd | Led用ヒートシンク及び自動車用ledランプ |
JP2014093427A (ja) * | 2012-11-05 | 2014-05-19 | Unitika Ltd | ヒートシンク |
JP2014091826A (ja) * | 2012-11-07 | 2014-05-19 | Kaneka Corp | 熱伝導成形体 |
JP2014146575A (ja) * | 2013-01-30 | 2014-08-14 | Panasonic Corp | ランプ、ランプの製造方法、及び照明装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016194361A1 (ja) * | 2015-06-03 | 2016-12-08 | 株式会社カネカ | 金属樹脂複合体 |
EP3348618A4 (en) * | 2015-09-09 | 2019-04-24 | Kaneka Corporation | THERMOCONDUCTIVE RESIN COMPOSITION |
US10544342B2 (en) | 2015-09-09 | 2020-01-28 | Kaneka Corporation | Thermally conductive resin composition |
WO2022158600A1 (ja) * | 2021-01-25 | 2022-07-28 | 積水テクノ成型株式会社 | 樹脂組成物及び樹脂成形体 |
Also Published As
Publication number | Publication date |
---|---|
CN106605310B (zh) | 2019-11-01 |
EP3190636B1 (en) | 2020-07-29 |
US10222051B2 (en) | 2019-03-05 |
CN106605310A (zh) | 2017-04-26 |
JP6857497B2 (ja) | 2021-04-14 |
JPWO2016035680A1 (ja) | 2017-06-29 |
EP3190636A1 (en) | 2017-07-12 |
US20170167716A1 (en) | 2017-06-15 |
EP3190636A4 (en) | 2018-01-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2016035680A1 (ja) | 自動車用ledランプヒートシンク | |
JP6600314B2 (ja) | Ledランプヒートシンク | |
US10544342B2 (en) | Thermally conductive resin composition | |
EP3305519B1 (en) | Metal resin composite | |
WO2016084397A1 (ja) | 金属樹脂複合体 | |
JP6229796B2 (ja) | 熱伝導性樹脂組成物 | |
KR102158764B1 (ko) | 폴리에스테르 수지 및 그것을 사용한 표면 실장형 led 반사판용 폴리에스테르 수지 조성물 | |
WO2012169193A1 (ja) | 反射材用熱可塑性樹脂組成物、反射板および発光ダイオード素子 | |
KR20160028452A (ko) | 사출 성형성이 우수한 고열전도성 열가소성 수지 조성물 | |
JP6531414B2 (ja) | ポリアミド樹脂組成物およびそれを成形してなる成形品 | |
WO2016063541A1 (ja) | 熱伝導性樹脂と金属との複合部材 | |
JP2017071728A (ja) | ポリエステル樹脂組成物、反射板の製造方法および発光ダイオード(led)素子の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15837871 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2016546602 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2015837871 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2015837871 Country of ref document: EP |