WO2016031454A1 - 表面実装型アンテナおよび電子機器 - Google Patents

表面実装型アンテナおよび電子機器 Download PDF

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Publication number
WO2016031454A1
WO2016031454A1 PCT/JP2015/071058 JP2015071058W WO2016031454A1 WO 2016031454 A1 WO2016031454 A1 WO 2016031454A1 JP 2015071058 W JP2015071058 W JP 2015071058W WO 2016031454 A1 WO2016031454 A1 WO 2016031454A1
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WIPO (PCT)
Prior art keywords
main surface
linear conductor
base material
coil
antenna
Prior art date
Application number
PCT/JP2015/071058
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English (en)
French (fr)
Japanese (ja)
Inventor
加藤登
Original Assignee
株式会社村田製作所
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Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2016545063A priority Critical patent/JP6191779B2/ja
Priority to CN201590000904.2U priority patent/CN206628599U/zh
Publication of WO2016031454A1 publication Critical patent/WO2016031454A1/ja

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the present invention relates to a surface mount antenna, and more particularly to a surface mount antenna used in a communication system such as an HF band.
  • the present invention also relates to an electronic device, and more particularly to an electronic device used in a communication system such as an HF band.
  • Patent Document 1 discloses a magnetic layer in which a plurality of magnetic bodies are stacked, a coil conductor wound with the winding axis direction aligned with a direction orthogonal to the stacking direction of the magnetic layers, and a magnetic layer.
  • a coil antenna including a dielectric layer laminated on the outer layer is disclosed.
  • Patent Document 2 discloses a coil having a core having a magnetic layer, a linear conductor portion, and a plurality of via-hole conductor portions, the winding axis being parallel to the main surface of the core.
  • a coil antenna with a conductor is disclosed.
  • the mounting surface for the printed wiring board or the like and the winding axis are parallel. Therefore, it is mounted (arranged) on the printed wiring board or the like so that the winding axis of the coil antenna is parallel to the main surface of the printed wiring board or the like.
  • other electronic components mounted on the main surface such as a printed wiring board and surrounding structures are unnecessarily coupled to the coil antenna, so that there is little magnetic flux interlinking with the coil antenna on the communication partner side. Become. For this reason, the coupling coefficient with the communication-side antenna is lowered, and as a result, the communication characteristics of the coil antenna are lowered.
  • An object of the present invention is to provide a surface-mounted antenna having excellent communication characteristics and directivity above a direction along a mounting surface, and an electronic device including the surface-mounted antenna.
  • the surface mount antenna of the present invention is A base material having a first main surface to be a mounting surface, and a second main surface facing the first main surface; A helical coil conductor formed on the substrate and having a winding axis in a direction along the first main surface and the second main surface; With The coil conductor has a first main surface side conductor and a second main surface side conductor, The length in the winding axis direction of the formation region of the first main surface side conductor at the same position as viewed from the second main surface, and the length in the winding axis direction of the formation region of the second main surface side conductor. The length in the winding axis direction of the formation region of the second main surface side conductor is shorter than the length in the winding axis direction of the formation region of the first main surface side conductor in comparison with the length. It is characterized by having.
  • the magnetic flux entering and exiting diagonally above the surface-mounted antenna can be linked to the coil opening of the coil conductor, so that it is above the direction along the mounting surface.
  • a surface-mounted antenna having directivity can be realized. Therefore, even when a surface-mounted antenna is mounted on a printed wiring board or the like, the magnetic flux interlinking with the coil opening of the coil conductor is caused by other electronic components mounted on the main surface of the printed wiring board or the like and surrounding structures. It is possible to suppress the obstruction.
  • the effective coil opening that functions as an antenna increases, the range and distance for radiating (collecting) magnetic flux increases, and it becomes easy to couple with the coil antenna on the communication partner side. Therefore, a surface mount antenna having excellent communication characteristics can be realized without using a large coil.
  • the base material is a resin member, and a portion of the coil conductor that extends from the first main surface to the second main surface is the first main surface of the base material. It is preferable that the metal post reaches the second main surface.
  • the metal post since the metal post is used for a part of the pattern constituting the coil conductor, it is not necessary to form a coil on the multilayer substrate, and it is not necessary to route complicated wiring. Therefore, it is possible to easily realize a coil structure having a relatively large height dimension and excellent freedom in designing the coil opening size.
  • the resistance of the coil conductor can be reduced, a highly sensitive surface mount antenna or a small surface mount antenna can be obtained for high sensitivity.
  • a portion having a relatively large height can be formed by a metal post, for example, compared with a case where a plurality of base material layers having interlayer conductors are stacked to form a connection portion in the height direction. And the electrical reliability of the coil conductor is increased.
  • the base material is a laminate of a plurality of base material layers, and a portion of the coil conductor that extends from the first main surface to the second main surface is the base material. It may be an interlayer conductor formed in the layer.
  • the base material has a magnetic member (for example, a magnetic ferrite material) constituting a magnetic core.
  • a magnetic member for example, a magnetic ferrite material
  • the coil conductor may be configured such that portions of the base material reaching the first main surface and the second main surface are formed inside the magnetic member.
  • the portion of the coil conductor that reaches the first main surface and the second main surface of the base material is embedded in the magnetic member, so that radiation of the magnetic field from the side surface of the base material is suppressed by the shielding effect. Therefore, unnecessary coupling with other electronic components mounted on the main surface such as a printed wiring board and surrounding structures is suppressed.
  • the electronic device of the present invention The surface mount antenna according to any one of (1) to (5) above; A power feeding circuit connected to a coil conductor of the surface mount antenna; Is provided.
  • This configuration makes it possible to realize an electronic device equipped with a surface mount antenna used in a communication system of HF band or UHF band.
  • a substrate having a ground conductor is provided, and the surface mount antenna is disposed in the vicinity of an edge portion of the ground conductor.
  • the surface mount antenna is disposed in the vicinity of an edge portion of the ground conductor.
  • a surface-mounted antenna that has excellent communication characteristics and has directivity above the direction along the mounting surface.
  • an electronic device including the surface mount antenna can be realized.
  • FIG. 1 is an external perspective view of a surface mount antenna 101 according to the first embodiment.
  • 2A is a plan view of the surface-mounted antenna 101
  • FIG. 2B is a bottom view of the surface-mounted antenna 101
  • FIG. 2C is a cross-sectional view taken along line AA in FIG.
  • FIG. 3A is a plan view of the surface-mounted antenna 101 showing the formation area PA2 of the second linear conductor patterns 51A to 51E, viewed from the second main surface VS2 (through the ⁇ Z direction).
  • FIG. FIG. 3B is a plan view of the surface-mounted antenna 101 showing the formation area PA1 of the first linear conductor patterns 21A to 21D, as viewed from the second main surface VS2 (through the ⁇ Z direction).
  • FIG. 3C is a diagram for comparing the formation area PA1 of the first linear conductor patterns 21A to 21D and the formation area PA2 of the second linear conductor patterns 51A to 51E.
  • FIG. 4A is a plan view showing the operating principle of the surface-mounted antenna 101 according to the first embodiment
  • FIG. 4B is a cross-sectional view showing the operating principle of the surface-mounted antenna 101.
  • FIG. 5 is a cross-sectional view showing a path of magnetic flux interlinking with the coil opening of the coil conductor when the surface-mounted antenna 101 is mounted on the circuit board 80.
  • 6A is a plan view of the surface-mounted antenna 102A according to the second embodiment
  • FIG. 6B is a bottom view of the surface-mounted antenna 102A
  • FIG. 7 is a cross-sectional view taken along the line BB in FIG.
  • FIG. 7A is a plan view of a surface mount antenna 102B according to the second embodiment
  • FIG. 7B is a bottom view of the surface mount antenna 102B
  • FIG. It is CC sectional drawing in (A) and FIG. 7 (B).
  • FIG. 8A is a plan view of the surface mount antenna 103 according to the third embodiment
  • FIG. 8B is a bottom view of the surface mount antenna 103
  • FIG. 9 is a DD cross-sectional view in (A) and FIG. 8 (B).
  • FIG. 9A is a plan view of the surface-mounted antenna 104 according to the fourth embodiment
  • FIG. 9B is a bottom view of the surface-mounted antenna 104
  • FIG. 9A is a plan view of the surface-mounted antenna 104 according to the fourth embodiment
  • FIG. 10A is a cross-sectional view taken along line EE in FIG. 9B.
  • FIG. FIG. 10 is an external perspective view of a surface mount antenna 105 according to the fifth embodiment.
  • FIG. 11A is a plan view of the surface-mounted antenna 105
  • FIG. 11B is a bottom view of the surface-mounted antenna 105 with the second base material layer 12 removed
  • FIG. It is a bottom view of the surface mount antenna 105.
  • 12 is a cross-sectional view taken along line FF in FIGS. 11A, 11B, and 11C.
  • FIG. 13 is an external perspective view of a wireless IC device 201 according to the fifth embodiment.
  • 14A is a plan view of the wireless IC device 201, FIG.
  • FIG. 14B is a bottom view of the wireless IC device 201
  • FIG. 14C is a plan view of the substrate 4 (the first main surface PS1). View).
  • FIG. 15 is a circuit diagram of the wireless IC device 201.
  • FIG. 16 is a perspective view of an electronic device 301 according to the sixth embodiment.
  • FIG. 17 is a cross-sectional view of the electronic device 301.
  • FIG. 18 is a partially enlarged view of FIG.
  • FIG. 19 is a perspective view of the booster antenna 120.
  • FIG. 20 is a circuit diagram of the booster antenna 120.
  • FIG. 1 is an external perspective view of a surface mount antenna 101 according to the first embodiment.
  • 2A is a plan view of the surface-mounted antenna 101
  • FIG. 2B is a bottom view of the surface-mounted antenna 101
  • FIG. 2C is a cross-sectional view taken along line AA in FIG. FIG. Note that in FIG. 2C, the thickness of each portion is exaggerated. The same applies to the sectional views in the following embodiments.
  • the surface-mounted antenna 101 includes a base material 1 having a first main surface VS1 and a second main surface VS2 facing the first main surface VS1, and a coil conductor (described in detail later) formed on the base material 1.
  • the first main surface VS1 corresponds to a “mounting surface”
  • the second main surface VS2 corresponds to a “top surface”.
  • the base material 1 is a rectangular parallelepiped insulator whose longitudinal direction coincides with the lateral direction (X direction in FIG. 2A). As shown in FIG. 1, the base material 1 is a laminate of a first base material layer 11, a second base material layer 12, and a third base material layer 13, and both main surfaces (first surfaces) of the first base material layer 11. 1 main surface LS ⁇ b> 1 and second main surface LS ⁇ b> 2) are sandwiched between the second base material layer 12 and the third base material layer 13.
  • the first substrate layer 11 is a rectangular parallelepiped magnetic plate, and the second substrate layer 12 and the third substrate layer 13 are rectangular parallelepiped nonmagnetic plates.
  • the first base material layer 11 is, for example, magnetic ferrite, and the second base material layer 12 and the third base material layer 13 are, for example, nonmagnetic ferrite.
  • the second base material layer 12 is laminated on the first main surface LS1 of the first base material layer 11, and the third base material layer 13 is laminated on the second main surface LS2 of the first base material layer 11. That is, as shown in FIG. 2C, the second base material layer 12 is disposed on the first main surface VS1 side of the base material 1, and the third base material layer 13 is on the second main surface VS2 side of the base material 1. Placed in.
  • the second base material layer 12 has surface mounting connection terminals 2A and 2B and NC terminals 3A and 3B.
  • the base material 1 has surface mounting connection terminals 2A and 2B and NC terminals 3A and 3B on the first main surface VS1.
  • the connection terminals 2A, 2B and NC terminals 3A, 3B for surface mounting are conductor patterns having a rectangular planar shape, for example, a metal film mainly composed of Cu, Ni, or Au.
  • the surface mount antenna 101 includes first linear conductor patterns 21A, 21B, 21C, and 21D, second linear conductor patterns 51A, 51B, 51C, 51D, and 51E, and first metal posts 31A, 31B, 31C, and 31D. , 31E and second metal posts 41A, 41B, 41C, 41D, 41E.
  • the first linear conductor patterns 21A, 21B, 21C, and 21D are formed on the first main surface LS1 of the first base material layer 11. That is, the first linear conductor patterns 21A to 21D are formed inside the substrate 1 as shown in FIG.
  • the first linear conductor patterns 21A to 21D are, for example, conductors formed by forming a conductor film such as a Cu film on the first main surface LS1 of the first base material layer 11 by plating or the like, and patterning this by photolithography. It is a pattern.
  • the first linear conductor patterns 21A to 21D may be formed by screen printing a conductive paste.
  • the first linear conductor patterns 21A to 21D correspond to the “first main surface side conductor” of the coil conductor according to the present invention.
  • the second linear conductor patterns 51A, 51B, 51C, 51D, 51E are formed on the second main surface LS2 of the first base material layer 11. That is, the second linear conductor patterns 51A to 51E are formed inside the substrate 1 as shown in FIG.
  • the second linear conductor patterns 51A to 51E are, for example, conductors formed by forming a conductor film such as a Cu film on the second main surface LS2 of the first base material layer 11 by plating or the like, and patterning this by photolithography. It is a pattern.
  • the second linear conductor patterns 51A to 51E may be formed by screen printing a conductive paste. In the present embodiment, these second linear conductor patterns 51A to 51E correspond to the “second main surface side conductor” of the coil conductor according to the present invention.
  • the second linear conductor patterns 51A to 51E are arranged in the longitudinal direction of the substrate 1 (X direction in FIG. 2A), and extend in the short direction of the substrate 1 (Y direction in FIG. 2A). is doing.
  • the second linear conductor pattern 51C arranged in the center of the longitudinal direction (X direction) of the substrate 1 is the short direction (Y direction) of the substrate 1.
  • the center part of the transversal direction (Y direction) of the base material 1 bends toward the center part of the longitudinal direction (X direction) of the base material 1. It is formed as follows.
  • the second linear conductor patterns 51A, 51B, 51D, and 51E are formed such that the central portion in the short direction (Y direction) of the substrate 1 is bent toward the second linear conductor pattern 51C. I can say that.
  • the first metal posts 31A to 31E and the second metal posts 41A to 41E are, for example, cylindrical Cu pins. These are obtained, for example, by cutting a Cu wire having a circular cross section in a predetermined length unit, and the aspect ratio (height / bottom diameter) is preferably 5 or more and less than 30.
  • the first metal posts 31A to 31E are arranged to extend from the first main surface VS1 of the base material 1 toward the second main surface VS2, and the first main surface LS1 and the second main surface LS1 of the first base material layer 11 are disposed. It reaches the main surface LS2. Further, as shown in FIG. 1 and the like, the first metal posts 31A to 31E are arranged so as to extend in the normal line direction with respect to the first main surface VS1 of the base material 1, and are formed on the first side surface VS3 of the base material 1. It is arranged in the vicinity. The first ends of the first metal posts 31A to 31E are connected to the surface mounting connection terminal 2A and the first linear conductor patterns 21A to 21D.
  • the first end of the first metal post 31A is connected to the surface mounting connection terminal 2A.
  • the first end of the first metal post 31B is connected to the first linear conductor pattern 21A.
  • the first end of the first metal post 31C is connected to the first linear conductor pattern 21B.
  • the first end of the first metal post 31D is connected to the first linear conductor pattern 21C.
  • the first end of the first metal post 31E is connected to the first linear conductor pattern 21D.
  • the second metal posts 41A to 41E are arranged so as to extend from the first main surface VS1 of the base material 1 toward the second main surface VS2, and the first main surface LS1 and the second main surface LS1 of the first base material layer 11 are disposed. It reaches the main surface LS2. Further, as shown in FIG. 1 and the like, the second metal posts 41A to 41E are arranged so as to extend in the normal line direction with respect to the first main surface VS1 of the substrate 1, and the second metal posts 41A to 41E are arranged on the second side surface VS4 of the substrate 1. It is arranged in the vicinity. The first ends of the second metal posts 41A to 41E are connected to the surface mounting connection terminals 2B and the first linear conductor patterns 21A to 21D.
  • the first end of the second metal post 41A is connected to the first linear conductor pattern 21A.
  • the first end of the second metal post 41B is connected to the first linear conductor pattern 21B.
  • the first end of the second metal post 41C is connected to the first linear conductor pattern 21C.
  • the first end of the second metal post 41D is connected to the first linear conductor pattern 21D.
  • the first end of the second metal post 41E is connected to the connection terminal 2B for surface mounting.
  • the first ends of the second linear conductor patterns 51A to 51E are connected to the second ends of the first metal posts 31A to 31E, and the second ends of the second linear conductor patterns 51A to 51E are the second metal posts 41A. To the second end of 41E.
  • the first end of the second linear conductor pattern 51A is connected to the second end of the first metal post 31A, and the second end of the second linear conductor pattern 51A is the second of the second metal post 41A. Connected to the end.
  • the first end of the second linear conductor pattern 51B is connected to the second end of the first metal post 31B, and the second end of the second linear conductor pattern 51B is connected to the second end of the second metal post 41B.
  • the first end of the second linear conductor pattern 51C is connected to the second end of the first metal post 31C, and the second end of the second linear conductor pattern 51C is connected to the second end of the second metal post 41C.
  • the first end of the second linear conductor pattern 51D is connected to the second end of the first metal post 31D, and the second end of the second linear conductor pattern 51D is connected to the second end of the second metal post 41D.
  • the first end of the second linear conductor pattern 51E is connected to the second end of the first metal post 31E, and the second end of the second linear conductor pattern 51E is connected to the second end of the second metal post 41E. .
  • the first linear conductor patterns 21A to 21D, the first metal posts 31A to 31E, the second linear conductor patterns 51A to 51E, and the second metal posts 41A to 41E constitute a rectangular helical coil conductor of 5 turns.
  • the first linear conductor patterns 21A to 21D, the first metal posts 31A to 31E, the second linear conductor patterns 51A to 51E, and the second metal posts 41A to 41E are “helical” according to the present invention.
  • the coil conductor is formed on the base material 1 and has a winding axis AX1 in a direction along the first main surface VS1 and the second main surface VS2, as shown in FIG. 1 and FIG.
  • the winding axis AX1 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.
  • FIG. 3A is a plan view of the surface-mounted antenna 101 showing the formation area PA2 of the second linear conductor patterns 51A to 51E, viewed from the second main surface VS2 (through the ⁇ Z direction).
  • FIG. 3B is a plan view of the surface-mounted antenna 101 showing the formation area PA1 of the first linear conductor patterns 21A to 21D, as viewed from the second main surface VS2 (through the ⁇ Z direction).
  • FIG. FIG. 3C is a diagram for comparing the formation area PA1 of the first linear conductor patterns 21A to 21D and the formation area PA2 of the second linear conductor patterns 51A to 51E.
  • FIG. 3A illustration of the first base material layer and the third base material layer is omitted.
  • FIG. 3B the third base material layer is not shown.
  • the formation area PA1 of the first linear conductor patterns 21A to 21D of the surface mount antenna 101 has a parallelogram shape as viewed from the second main surface VS2. Further, as shown in FIG. 3A, the formation area PA2 of the second linear conductor patterns 51A to 51E of the surface mount antenna 101 is viewed in the short direction of the substrate 1 (as viewed from the second main surface VS2). The center portion in the Y direction is bent inward.
  • the second linear conductor patterns 51A to 51E at the same position as viewed from the second major surface VS2 (the central portion in the short direction (Y direction) of the substrate 1).
  • the length X2 of the formation area PA2 in the direction of the winding axis AX1 is shorter than the length X1 of the formation area PA1 of the first linear conductor patterns 21A to 21D in the direction of the winding axis AX1.
  • the coil conductor of the surface-mounted antenna 101 has a length X2 in the direction of the winding axis AX1 of the formation area PA2 of the second linear conductor patterns 51A to 51E at the same position as viewed from the second main surface VS2. However, it has a portion SP1 shorter than the length X1 in the direction of the winding axis AX1 of the formation area PA1 of the first linear conductor patterns 21A to 21D (area where X2 ⁇ X1 is satisfied).
  • the coil opening C1 of the coil conductor can be made larger (C1> C0) than the coil opening C0 in the case of not having the above-described configuration, and the substantial coil opening that functions as an antenna is obtained. Can be bigger.
  • the “position” in “the same position as viewed from the second main surface VS2” in the present invention is the direction (Y direction) orthogonal to the winding axis AX1 direction (X direction) as viewed from the second main surface VS2.
  • the position of That is, the “same position” in the present invention refers to the winding viewed from the second main surface VS2 in the formation area PA2 of the second linear conductor patterns 51A to 51E and the formation area PA1 of the first linear conductor patterns 21A to 21D.
  • the second main surface side (second linear conductor patterns 51A to 51E) of the coil conductor is in the direction of the winding axis AX1 at the center in the short direction (Y direction) as shown in FIG.
  • the inter-line distance D1 is narrower than the inter-line distance D2 in the direction of the winding axis AX1 on the first main surface side (first linear conductor patterns 21A to 21D) of the coil conductor (D1 ⁇ D2).
  • the portion of the coil conductor that extends from the first main surface VS1 toward the second main surface VS2 includes the first metal posts 31A to 31E and the second metal posts 41A to 41E. Therefore, a portion of the coil conductor that extends from the first main surface VS1 toward the second main surface VS2 is formed inside the first base material layer that is a magnetic member.
  • the coil conductor of the surface mount antenna 101 is configured to wind inside and outside the first base material layer 11 that is a magnetic material member. Therefore, in this embodiment, the 1st base material layer 11 comprises the magnetic core of a coil conductor.
  • FIG. 4A is a plan view showing the operating principle of the surface-mounted antenna 101 according to the first embodiment
  • FIG. 4B is a cross-sectional view showing the operating principle of the surface-mounted antenna 101.
  • the coil conductor has a length X2 in the direction of the winding axis AX1 of the formation area PA2 of the second linear conductor patterns 51A to 51E at the same position as viewed from the second main surface VS2.
  • a portion SP1 shorter than the length X1 in the direction of the winding axis AX1 of the formation area PA1 of 21A to 21D is provided. Therefore, at the central portion in the short direction (Y direction) of the surface-mounted antenna 101, as shown in FIG. 4B, the magnetic flux ⁇ 2 that enters from the diagonally upper side of the surface-mounted antenna 101 and tries to pass diagonally upward.
  • a current i1 is generated that generates a magnetic flux in a direction that cancels the magnetic flux ⁇ 2 in the coil conductor.
  • FIG. 5 is a cross-sectional view showing a path of magnetic flux interlinking with the coil opening of the coil conductor when the surface-mounted antenna 101 is mounted on the circuit board 80.
  • the surface mount antenna 101 is mounted on one main surface (the upper surface in FIG. 5) of the circuit board 80 having the ground conductor 81 inside, and in the vicinity of the edge of the circuit board 80. Has been placed.
  • the circuit board 80 is a printed wiring board, for example.
  • the surface mount antenna 101 and the circuit board 80 are provided in an electronic device (not shown).
  • the ground conductor 81 is formed on substantially the entire surface of the circuit board 80. Therefore, the surface mount antenna 101 is disposed in the vicinity of the edge portion of the ground conductor 81.
  • the magnetic flux ⁇ 3 that wraps around the mounting surface (the lower surface in FIG. 5) of the surface-mounted antenna 101 at the coil opening of the coil conductor of the surface-mounted antenna 101 also interlink. In this way, it is possible to suppress the magnetic flux interlinking with the coil opening of the coil conductor from being blocked by the ground conductor 81 formed on the circuit board 80.
  • the line distance D1 in the winding axis AX1 direction at the center in the short side direction (Y direction) is the winding axis AX1 direction on the first main surface side of the coil conductor. It is narrower than the distance D2 between lines (D1 ⁇ D2). For this reason, in the central portion in the short side direction (Y direction) on the second main surface side of the coil conductor, cancellation of magnetic fluxes generated from adjacent coil conductors (second linear conductor patterns) is suppressed, and inductance is improved. To do. Therefore, as a result, the inductance value contributing to the antenna is increased, and a surface mount antenna having a high Q value can be realized.
  • the direct current resistance component of the metal post can be made sufficiently smaller than the direct current resistance (DCR) of a conductor film such as an aggregate of metal particles of a conductive paste or a thin metal film formed by etching a conductive thin film. Therefore, with this configuration, a surface mount antenna having a coil conductor having a high Q value (low loss) can be obtained.
  • DCR direct current resistance
  • the second main surface side (second linear conductor patterns 51A to 51E) of the coil conductor is formed and exposed on the surface of the first base material layer 11 which is a magnetic member. Therefore, a minor loop (local loop) of magnetic flux is hardly generated, and a magnetic field can be radiated efficiently.
  • the base material 1 showed the example which is the laminated body of the 1st base material layer 11, the 2nd base material layer 12, and the 3rd base material layer 13, it is not limited to this structure. Absent.
  • the second base material layer 12 and the third base material layer 13 are not essential components.
  • the base material 1 may be composed of only the first base material layer 11, and either the second base material layer 12 or the third base material layer 13 is on one main surface of the first base material layer 11. A structure in which only the layers are stacked may be used.
  • the present invention is not limited to this configuration.
  • the planar shapes of the surface mounting connection terminals 2A and 2B and the NC terminals 3A and 3B can be appropriately changed.
  • the NC terminals 3A and 3B are not essential components.
  • first metal posts 31A to 31E and the second metal posts 41A to 4E are embedded in the base material 1
  • present invention is not limited to this configuration.
  • the side portions of the first metal posts 31A to 31E and the second metal posts 41A to 41E may be partially exposed from the first side surface VS3 and the second side surface VS4 of the substrate 1.
  • the winding axis AX1 of the coil conductor is curved so as to face the upper side of the mounting surface on the printed wiring board or the like, as shown in FIG. 1 and FIG. That is, in the present invention, the state in which the winding axis AX1 of the coil conductor is “along” with the first main surface VS1 and the second main surface VS2 is, for example, that the winding axis AX1 is the first main surface VS1 and the second main surface. It is within the range of 0 ° to less than ⁇ 45 ° with respect to VS2. The same applies to the embodiments described below.
  • FIG. 6A is a plan view of the surface-mounted antenna 102A according to the second embodiment
  • FIG. 6B is a bottom view of the surface-mounted antenna 102A
  • FIG. FIG. 7 is a cross-sectional view taken along the line BB in FIG.
  • FIG. 7A is a plan view of a surface mount antenna 102B according to the second embodiment
  • FIG. 7B is a bottom view of the surface mount antenna 102B
  • FIG. It is CC sectional drawing in (A) and FIG. 7 (B).
  • the surface-mounted antennas 102A and 102B according to the second embodiment are different from the surface-mounted antenna 101 in the shapes of the second linear conductor patterns 52A to 52E.
  • the surface mount antennas 102A and 102B do not have NC terminals, and the planar shapes of the surface mount connection terminals 2A and 2B are different from those of the surface mount antenna 101.
  • Other configurations are the same as those of the surface mount antenna 101 according to the first embodiment.
  • the second linear conductor pattern 51B is linearly formed in the short direction (Y direction) of the substrate. Yes.
  • the second linear conductor patterns 51A, 51C, 51D, and 51E are formed so that the central portion in the short direction (Y direction) of the substrate 1 is bent toward the second linear conductor pattern 51B.
  • the connection terminals 2A and 2B for surface mounting are conductor patterns having an L shape in plan view, and are arranged close to both sides in the longitudinal direction (X direction) of the second base material layer 12 (base material 1). Has been.
  • the coil conductor of the surface-mounted antenna 102A is located at the same position as viewed from the second main surface VS2 (short of the base material).
  • the length X2 in the direction of the winding axis AX2A of the formation area of the second linear conductor patterns 52A to 52E from the center in the hand direction (Y direction) to the first side surface VS4 is the first linear conductor.
  • the region where the patterns 22A to 22D are formed has a portion shorter than the length X1 in the direction of the winding axis AX2A (region where the relationship of X2 ⁇ X1 is established). Therefore, the same operation and effect as the surface-mounted antenna 101 are obtained.
  • winding axis AX2A of the coil conductor of the surface mount antenna 102A is different from the winding axis AX1 of the coil conductor of the surface mount antenna 101 as shown in FIG. Therefore, a surface-mounted antenna 102A having a different directivity from the surface-mounted antenna 101 can be realized.
  • the surface-mounted antenna 102B includes the second linear conductor patterns 52A, 52B, 52C, 52D, and 52E and the second linear conductor pattern 51A. It is formed to bend between the second linear conductor pattern 51B. Note that the second linear conductor patterns 52A to 52E are not located in the central portion of the base 1 in the short direction (Y direction) but on one side (Y direction) of the base 1 (see FIG. 7A). The upper part is bent.
  • connection terminals 2A and 2B for surface mounting are conductor patterns having an L shape in plan view, and are arranged close to both sides in the longitudinal direction (X direction) of the second base material 12 (base material 1).
  • the coil conductor of the surface-mounted antenna 102B is located at the same position as viewed from the second main surface VS2 (short of the base material).
  • the length X2 in the direction of the winding axis AX2B of the region where the second linear conductor patterns 52A to 52E are formed is the first linear conductor.
  • the region where the patterns 22A to 22D are formed has a portion shorter than the length X1 in the direction of the winding axis AX2B (region where the relationship of X2 ⁇ X1 is established). Therefore, the same operation and effect as the surface-mounted antenna 101 are obtained.
  • the second main surface side (second linear conductor pattern) of the coil conductor is formed so that the central portion in the short direction (Y direction) of the substrate 1 is bent.
  • the configuration is not limited.
  • the second linear conductor pattern is not a central portion in the short direction (Y direction) of the base material 1, but closer to one side in the short direction (Y direction) of the base material 1. These portions may be bent.
  • the second linear conductor pattern (for example, the second linear shape in the surface-mounted antenna 102A) is formed linearly in the short direction (Y direction) of the substrate 1.
  • the conductor pattern 51B) is not an essential configuration. As shown by the surface-mounted antenna 102B, the second linear conductor pattern may be entirely bent.
  • FIG. 8A is a plan view of the surface mount antenna 103 according to the third embodiment
  • FIG. 8B is a bottom view of the surface mount antenna 103
  • FIG. FIG. 9 is a DD cross-sectional view in (A) and FIG. 8 (B).
  • the surface mount antenna 103 according to the third embodiment is different from the surface mount antenna 101 in the configuration of the coil conductor.
  • the surface mount antenna 103 is different from the surface mount antenna 101 in that the substrate 1 is a laminate of a plurality of first substrate layers 11a, 11b, 11c, and 11d.
  • Other configurations are the same as those of the surface mount antenna 101 according to the first embodiment.
  • the surface mount antenna 103 includes a base material 1 having a first main surface VS1 and a second main surface VS2, and a coil conductor (described in detail later) formed on the base material 1.
  • the base material 1 is a laminated body in which a plurality of first base material layers 11a to 11d are laminated in this order in the laminating direction (Z direction) as shown in FIG.
  • the plurality of first base material layers 11a to 11d are cuboidal magnetic plates.
  • the base material 1 has connection terminals 2A and 2B for surface mounting on the first main surface VS1.
  • the connection terminals 2A and 2B for surface mounting are conductor patterns having a rectangular planar shape.
  • the surface mount antenna 103 includes a first linear conductor pattern 23A, 23B, 23C, 23D, 23E, a second linear conductor pattern 53A, 53B, 53C, 53D, 53E, 53F, a plurality of internal conductor patterns 5 and A plurality of interlayer connection conductors 6 are provided.
  • the plurality of conductor patterns 5 are formed on the main surfaces of the plurality of first base material layers 11a to 11d, and the plurality of interlayer connection conductors 6 extend in the stacking direction (Z direction) of the plurality of first base material layers 11a to 11d.
  • the plurality of interlayer connection conductors are, for example, via conductors.
  • the first linear conductor patterns 23A to 23E are conductor patterns formed on the first main surface VS1 of the substrate 1, and are arranged in the longitudinal direction (X direction) of the substrate 1.
  • the second linear conductor patterns 53A to 53F are conductor patterns formed on the second major surface VS2 of the base material 1, and are arranged in the longitudinal direction (X direction) of the base material 1, and the short direction of the base material 1 It extends in the (Y direction).
  • the surface mounting connection terminals 2 ⁇ / b> A and 2 ⁇ / b> B are conductor patterns having a rectangular planar shape formed on the first main surface VS ⁇ b> 1 of the substrate 1, and are disposed in the vicinity of the corners of the substrate 1.
  • the first linear conductor patterns 23A to 23E and the surface mounting connection terminals 2A and 2B are connected to the second line via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6, respectively. Connected to the conductor patterns 53A to 53F.
  • FIG. 8C only the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6 that connect the first linear conductor pattern 23A and the second linear conductor pattern 53A are shown as representatives.
  • the surface mounting connection terminal 2A is connected to the second end of the second linear conductor pattern 53A through the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the first end of the second linear conductor pattern 53A is connected to the first end of the first linear conductor pattern 23A via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the second end of the first linear conductor pattern 23A is connected to the second end of the second linear conductor pattern 53B via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the first end of the second linear conductor pattern 53B is connected to the first end of the first linear conductor pattern 23B via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the second end of the first linear conductor pattern 23B is connected to the second end of the second linear conductor pattern 53C via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the first end of the second linear conductor pattern 53C is connected to the first end of the first linear conductor pattern 23C via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the second end of the first linear conductor pattern 23C is connected to the second end of the second linear conductor pattern 53D via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the first end of the second linear conductor pattern 53D is connected to the first end of the first linear conductor pattern 23D via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the second end of the first linear conductor pattern 23D is connected to the second end of the second linear conductor pattern 53E via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the first end of the second linear conductor pattern 53E is connected to the first end of the first linear conductor pattern 23E via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the second end of the first linear conductor pattern 23E is connected to the second end of the second linear conductor pattern 53F via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the first ends of the second linear conductor patterns 53F are connected to the surface mounting connection terminals 2B via the plurality of conductor patterns 5 and the plurality of interlayer connection conductors 6.
  • the first linear conductor patterns 23A to 23E, the plurality of conductor patterns 5, the plurality of interlayer connection conductors 6, and the second linear conductor patterns 53A to 53F constitute a six-turn helical coil conductor.
  • the first linear conductor patterns 23A to 23E, the plurality of conductor patterns 5, the plurality of interlayer connection conductors 6, and the second linear conductor patterns 53A to 53F are the “helical coil conductors” according to the present invention. Is equivalent to.
  • the coil conductor has a winding axis AX3 in a direction along the first main surface VS1 and the second main surface VS2, as shown in FIG. 8 (B).
  • the winding axis AX3 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.
  • the coil conductor of the surface-mounted antenna 103 is located at the same position as viewed from the second major surface VS2 (the center in the short direction (Y direction) of the substrate 1). ),
  • the length X2 in the direction of the winding axis AX3 of the formation region of the second linear conductor patterns 53A to 53F is the length in the direction of the winding axis AX3 of the formation region of the first linear conductor patterns 23A to 23E. It has a portion shorter than X1 (a region where the relationship of X2 ⁇ X1 is established).
  • the portion of the coil conductor that extends from the first main surface VS1 to the second main surface VS2 is composed of the interlayer connection conductor 6.
  • the basic configuration of the surface-mounted antenna 103 is the same as that of the surface-mounted antenna 101 according to the first embodiment, and functions and effects similar to those of the surface-mounted antenna 101 are obtained. Play.
  • FIG. 9A is a plan view of the surface-mounted antenna 104 according to the fourth embodiment
  • FIG. 9B is a bottom view of the surface-mounted antenna 104
  • FIG. 10A is a cross-sectional view taken along line EE in FIG. 9B.
  • the surface-mounted antenna 104 according to the fourth embodiment is the third embodiment in that a portion of the coil conductor extending from the first main surface VS1 to the second main surface VS2 of the base material 1 is a metal post. Different from the surface mount antenna 103 according to FIG. Other configurations are the same as those of the surface mount antenna 103 according to the third embodiment.
  • the base material 1 of the present embodiment is a magnetic resin member containing magnetic powder such as ferrite powder.
  • the surface-mounted antenna 104 includes first linear conductor patterns 24A, 24B, 24C, 24D, and 24E, first metal posts 34A, 34B, 34C, 34D, 34E, and 34F, a second metal post (not shown), and a second metal post. It has linear conductor patterns 54A, 54B, 54C, 54D, 54E, 54F and connection terminals 2A, 2B for surface mounting.
  • the configurations of the first linear conductor patterns 24A to 24E, the second linear conductor patterns 54A to 54F, and the surface mounting connection terminals 2A and 2B are the same as those of the surface mount antenna 103 according to the third embodiment.
  • the first metal posts 34A to 34F are arranged to extend from the first main surface VS1 of the base material 1 to the second main surface VS2, and reach the first main surface VS1 and the second main surface VS2 of the base material 1. . Further, as shown in FIG. 9C, the first metal posts 34A to 34F are arranged at a predetermined angle with respect to the first main surface VS1 of the substrate 1, and the first side surface of the substrate 1 is disposed. It is arranged in the vicinity of VS3.
  • the first ends of the first metal posts 34A to 34F are connected to the connection terminals 2B for surface mounting and the first linear conductor patterns 24A to 24E.
  • the second metal post is arranged so as to extend from the first main surface VS1 of the base material 1 to the second main surface VS2, and reaches the first main surface VS1 and the second main surface VS2 of the base material 1.
  • the second metal posts are arranged at a predetermined angle with respect to the first main surface VS1 of the substrate 1, and the second metal posts 34A to 34F are arranged on the second side surface VS4 of the substrate 1. It is arranged in the vicinity.
  • the above-mentioned “predetermined angle” is an acute angle, and for example, the angle formed between the second main surface VS2 of the substrate 1 and the first metal posts 34A to 34F or the second metal post.
  • the first end of the second metal post is connected to the connection 2A for surface mounting and the first linear conductor patterns 24A to 24E.
  • the first ends of the second linear conductor patterns 54A to 54F are connected to the second ends of the first metal posts 34A to 34F, and the second ends of the second linear conductor patterns 54A to 54F are the second metal posts. Connected to the second end.
  • the first linear conductor patterns 24A to 24E, the first metal posts 34A to 34F, the second metal posts, and the second linear conductor patterns 53A to 53F constitute a helical coil conductor of 6 turns.
  • the first linear conductor patterns 24A to 24E, the first metal posts 34A to 34F, the second metal posts, and the second linear conductor patterns 53A to 53F are the “helical coil conductors” according to the present invention. Is equivalent to.
  • the basic configuration of the surface-mounted antenna 104 is the same as that of the surface-mounted antenna 103 according to the third embodiment, and functions and effects similar to those of the surface-mounted antenna 103 are obtained. Play.
  • FIG. 10 is an external perspective view of a surface mount antenna 105 according to the fifth embodiment.
  • FIG. 11A is a plan view of the surface-mounted antenna 105
  • FIG. 11B is a bottom view of the surface-mounted antenna 105 with the second base material layer 12 removed
  • FIG. It is a bottom view of the surface mount antenna 105.
  • 12 is a cross-sectional view taken along line FF in FIGS. 11A, 11B, and 11C.
  • the surface-mounted antenna 105 according to the fifth embodiment is different from the surface-mounted antenna 101 in the shapes of the connection terminals 2A and 2B, the first linear conductor patterns 25A to 25F, and the second linear conductor patterns 55A to 55E. Other configurations are substantially the same as those of the surface mount antenna 101 according to the first embodiment.
  • the first linear conductor patterns 25A, 25B, 25C, 25D, 25E, and 25F are substantially the second main surface LS2 of the first base material layer 11. It is formed on the entire surface.
  • the first linear conductor patterns 25A to 25F are arranged in order along the longitudinal direction (X direction) of the first base material layer 11.
  • the first linear conductor pattern 25A is a conductor pattern having a right triangle shape in plan view.
  • the first linear conductor pattern 25 ⁇ / b> A is adjacent to one side in the short direction of the first base material layer 11 (upper side of the first base material layer 11 in FIG. 11B), and the first base material layer 11. It is a taper shape which becomes thin toward the other side (lower side of the 1st base material layer 11 in Drawing 11 (B)) from one side of the transverse direction.
  • the first linear conductor pattern 25 ⁇ / b> A is disposed in the vicinity of one side in the longitudinal direction of the first base material layer 11 (the left side of the first base material layer 11 in FIG. 11B).
  • the first linear conductor pattern 25F is a conductor pattern having a right triangle shape in plan view.
  • the first linear conductor pattern 25F is tapered such that its bottom side is close to the other side of the first base material layer 11 in the short direction and becomes thinner from the other side of the first base material layer 11 toward the one side. Shape.
  • the first linear conductor pattern 25F is arranged in the vicinity of the other side in the longitudinal direction of the first base material layer 11 (the right side of the first base material layer 11 in FIG. 11B).
  • the first linear conductor patterns 25 ⁇ / b> B, 25 ⁇ / b> C, 25 ⁇ / b> D, and 25 ⁇ / b> E are parallelogram conductor patterns, and extend from one side of the first base material layer 11 toward the other side.
  • the first linear conductor patterns 25B, 25C, 25D, and 25E are disposed between the first linear conductor patterns 25A and 25F.
  • the second linear conductor patterns 55A, 55B, 55C, 55D, and 55E are formed on the first main surface LS1 of the first base material layer 11.
  • the second linear conductor patterns 55A to 55E are arranged in order along the longitudinal direction of the first base material layer 11.
  • the second linear conductor pattern 55C is disposed at the center in the longitudinal direction of the first base material layer 11, and is linear (I-shaped) toward the short direction (Y direction) of the first base material layer 11. Is formed.
  • the second linear conductor patterns 55B and 55D have such a shape that the central portion in the short direction (Y direction) of the first base material layer 11 is bent (recessed) toward the second linear conductor pattern 55C. Is formed.
  • the second linear conductor patterns 55A and 55E are formed such that the central portion in the short direction (Y direction) of the first base material layer 11 is bent toward the second linear conductor pattern 55C.
  • the first metal posts 35A1, 35A2, 35B1, 35B2, 35C1, 35C2, 35D1, 35D2, 35E1, and 35E2 are disposed so as to extend from the first main surface VS1 to the second main surface VS2 of the base material 1, and The first base surface LS1 and the second main surface LS2 of the first base material layer 11 are reached.
  • the first metal posts 35A1 to 35E2 are arranged along the longitudinal direction (X direction) of the substrate 1 (first substrate layer 11). The first ends of the first metal posts 35A1 to 35E2 are connected to the first linear conductor patterns 25A to 21E.
  • first ends of the first metal posts 35A1 and 35A2 are connected in parallel to the first linear conductor pattern 25A.
  • the first ends of the first metal posts 35B1 and 35B2 are connected in parallel to the first linear conductor pattern 25B.
  • the first ends of the first metal posts 35C1 and 35C2 are connected in parallel to the first linear conductor pattern 25C.
  • the first ends of the first metal posts 35D1 and 35D2 are connected in parallel to the first linear conductor pattern 25D.
  • the first ends of the first metal posts 35E1 and 35E2 are connected in parallel to the first linear conductor pattern 25E.
  • the second metal posts 45A1, 45A2, 45B1, 45B2, 45C1, 45C2, 45D1, 45D2, 45E1, and 45E2 face the second main surface VS2 from the first main surface VS1 of the base material 1 (first base material layer 11). And extend to the first main surface LS1 and the second main surface LS2 of the first base material layer 11.
  • the second metal posts 45A1 to 45E2 are arranged along the longitudinal direction (X direction) of the substrate 1.
  • the first ends of the second metal posts 45A1 to 45E2 are connected to the first linear conductor patterns 25A to 21E.
  • first ends of the second metal posts 45A1 and 45A2 are connected in parallel to the first linear conductor pattern 25B.
  • the first ends of the second metal posts 45B1 and 45B2 are connected in parallel to the first linear conductor pattern 25C.
  • the first ends of the second metal posts 45C1 and 45C2 are connected in parallel to the first linear conductor pattern 25D.
  • the first ends of the second metal posts 45D1 and 45D2 are connected in parallel to the first linear conductor pattern 25E.
  • the first ends of the second metal posts 45E1 and 45E2 are connected in parallel to the first linear conductor pattern 25F.
  • the first ends of the second linear conductor patterns 55A to 55E are connected to the second ends of the first metal posts 35A1 to 35E2, and the second ends of the second linear conductor patterns 55A to 55E are the second metal posts 45A1. To the second end of 45E2.
  • first end of the second linear conductor pattern 55A is connected to the second ends of the first metal posts 35A1 and 35A2, and the second end of the second linear conductor pattern 55A is the second metal post. Connected to the second ends of 45A1 and 45A2.
  • the first end of the second linear conductor pattern 55B is connected to the second end of the first metal posts 35B1 and 35A2, and the second end of the second linear conductor pattern 55B is the second end of the second metal posts 45B1 and 45B2. Connected to the two ends.
  • the first end of the second linear conductor pattern 55C is connected to the second end of the first metal posts 35C1 and 35C2, and the second end of the second linear conductor pattern 55C is the second end of the second metal posts 45C1 and 45C2. Connected to the two ends.
  • the first end of the second linear conductor pattern 55D is connected to the second end of the first metal posts 35D1 and 35D2, and the second end of the second linear conductor pattern 55D is the second end of the second metal posts 45D1 and 45D2. Connected to the two ends.
  • the first end of the second linear conductor pattern 55E is connected to the second end of the first metal posts 35E1 and 35E2, and the second end of the second linear conductor pattern 55E is the second end of the second metal posts 45E1 and 45E2. Connected to the two ends.
  • connection terminals 2A and 2B for surface mounting are conductor patterns having a straight line shape (I shape) in plan view, and are arranged close to both sides in the longitudinal direction (X direction) of the second base material layer 12. ing.
  • the first metal posts 35A3 and 35A4 are arranged so as to extend from the first main surface VS1 of the base material 1 toward the second main surface VS2, and the first main surface LS1 of the first base material layer 11 and the base material The first main surface VS1 is reached.
  • the first metal posts 35A3 and 35A4 connect the connection terminals 2A for surface mounting and the first linear conductor pattern 25A in parallel.
  • the second metal posts 45E3 and 45E4 are arranged so as to extend from the first main surface VS1 of the base material 1 toward the second main surface VS2, and the first main surface LS1 of the first base material layer 11 and the base material The first main surface VS1 is reached.
  • the second metal posts 45E3 and 45E4 connect the connection terminals 2B for surface mounting and the first linear conductor pattern 25F in parallel.
  • First linear conductor patterns 25A-25F, first metal posts 35A1, 35A2, 35B1, 35B2, 35C1, 35C2, 35D1, 35D2, 35E1, 35E2, second linear conductor patterns 55A-55E and second metal posts 45A1, 45A2, 45B1, 45B2, 45C1, 45C2, 45D1, 45D2, 45E1, and 45E2 constitute a helical coil conductor of about 4.5 turns.
  • the first linear conductor patterns 25A to 25F, the first metal posts 35A1 to 35E2, the second linear conductor patterns 55A to 55E, and the second metal posts 45A1 to 45E2 are the “helical shape” according to the present invention. Corresponds to “coil conductor”.
  • the coil conductor is formed on the base material 1 as shown in FIG. 12 and the like, and has a winding axis AX5 in a direction along the first main surface VS1 and the second main surface VS2.
  • the winding axis AX5 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.
  • the coil conductor of the surface-mounted antenna 105 is located at the same position as viewed from the second main surface VS2 (on the base material 1).
  • the length X2 in the direction of the winding axis AX5 of the formation area of the second linear conductor patterns 55A to 55E in the short direction (Y direction central portion) is the formation area of the first linear conductor patterns 25A to 25D.
  • the widths of the first linear conductor patterns 25A to 25F are adjacent to each other. It is larger than the gap between the first linear conductor patterns (the gap between the adjacent first linear conductor patterns in the winding axis AX5 direction). Further, as shown in FIG. 11A, the widths of the second linear conductor patterns 55A to 55E are larger than the gap between the adjacent second linear conductor patterns. Therefore, the direct current resistance (DCR) of the coil conductor can be reduced. In addition, this configuration makes it difficult for minor loops (local loops) due to leakage of magnetic flux from the gaps between adjacent linear conductor patterns (the first linear conductor pattern and the second linear conductor pattern) to efficiently generate magnetic fields. Can radiate well.
  • DCR direct current resistance
  • the metal posts 35A1 to 35E2, 45A1 to 45E2 are connected in parallel to the first linear conductor patterns 25A to 25F and the second linear conductor patterns 55A to 55E, respectively. And disposed along the longitudinal direction (X direction) of the substrate 1. Therefore, in this embodiment, the direct current resistance (DCR) of the coil conductor can be further reduced.
  • the gaps between the adjacent metal posts 35A1 to 35E2 and 45A1 to 45E2 are smaller than the metal posts in the above-described embodiment. Therefore, a minor loop (local loop) due to leakage of magnetic flux from the gap between the adjacent metal posts 35A1 to 35E2 and 45A1 to 45E2 is further less likely to occur.
  • the first linear conductor patterns 25A to 25F are formed on the substantially entire surface of the second main surface LS2 of the first base material layer 11, and adjacent to each other.
  • the gap between the first linear conductor patterns 25A to 25F is small. Therefore, the magnetic flux leaking from the gap between the adjacent first linear conductor patterns can be reduced. Therefore, when a surface mount antenna is mounted on a substrate, even if a metal member such as a ground conductor is formed on the substrate, unnecessary coupling between the metal member and the coil antenna is suppressed, resulting in a coil A change in communication characteristics of the antenna can be suppressed.
  • FIG. 13 is an external perspective view of a wireless IC device 201 according to the sixth embodiment.
  • 14A is a plan view of the wireless IC device 201
  • FIG. 14B is a bottom view of the wireless IC device 201
  • FIG. 14C is a plan view of the substrate 1 (first of the substrate 4).
  • FIG. 14A is a plan view of the wireless IC device 201
  • FIG. 14B is a bottom view of the wireless IC device 201
  • FIG. 14C is a plan view of the substrate 1 (first of the substrate 4).
  • the wireless IC device 201 includes a base material 1, a coil conductor (described in detail later), and an RFIC element 61.
  • the RFIC element 61 corresponds to a “feed circuit connected to a coil conductor” according to the present invention.
  • the base material 1 of this embodiment has the resin member 70 and the flat board
  • the resin member 70 has a rectangular parallelepiped shape, the first main surface VS1, the second main surface VS2 facing the first main surface VS1, and the first side surface VS3 connected to the first main surface VS1 and the second main surface VS2. And a second side surface VS4.
  • the board 4 is a printed wiring board having a rectangular planar shape, and wiring conductor patterns 7A and 7B and power supply terminals 8A and 8B are formed on the first main surface PS1 of the board 4 (the upper surface of the board 4 from the viewpoint of FIG. 13). And NC terminals 9A and 9B are formed. These wiring conductor patterns 7A and 7B, power supply terminals 8A and 8B, and NC terminals 9A and 9B are patterned by, for example, etching of Cu foil or the like.
  • the substrate 4 is embedded in the resin member 70 so that the second main surface PS2 of the substrate 4 and the second main surface VS2 of the resin member 70 are flush with each other.
  • the first linear conductor patterns 26A, 26B, 26C, 26D, 26E, 26F, and 26G are formed on the second main surface PS2 of the substrate 4 and the second main surface VS2 of the resin member 70 that are the same surface.
  • the substrate 4 includes interlayer connection conductors 10A and 10B (through-hole plating).
  • the first linear conductor pattern 26A and the wiring conductor pattern 7A are electrically connected through the interlayer connection conductor 10A, respectively, and the first linear conductor pattern 26G and the wiring conductor pattern 7B are respectively connected through the interlayer connection conductor 10B. Electrically connected. That is, the first linear conductor pattern 26A is connected in series to the wiring conductor pattern 7A including the power supply terminal 8A, and the first linear conductor pattern 26G is connected in series to the wiring conductor pattern 7B including the power supply terminal 8B. Connected to.
  • the interlayer connection conductors 10A and 10B may be through-hole conductor type interlayer conductors as described above, but may also be end face conductor type interlayer conductors in which a conductor is formed on the end face of the substrate by coating or the like.
  • a via-hole type interlayer conductor formed by forming a through hole in a substrate and filling a conductive paste or the like therewith may be used.
  • the wireless IC device 201 has first metal posts 36A, 36B, 36C, 36D, 36E, 36F and second metal posts 46A, 46B, 46C, 46D, 46E, 46F.
  • the first metal posts 36A to 36F are arranged so as to extend in the normal line direction with respect to the second main surface VS2 of the resin member 70, and reach the first main surface VS1 and the second main surface VS2 of the resin member 70. . Further, the first metal posts 36A to 36F are disposed in the vicinity of the first side surface VS3 of the resin member 70 as shown in FIG. The first ends of the first metal posts 36A to 36F are connected to the first linear conductor patterns 26B to 26G.
  • first end of the first metal post 36A is connected to the first linear conductor pattern 26B.
  • the first end of the first metal post 36B is connected to the first linear conductor pattern 26C.
  • the first end of the first metal post 36C is connected to the first linear conductor pattern 26D.
  • the first end of the first metal post 36D is connected to the first linear conductor pattern 26E.
  • the first end of the first metal post 36E is connected to the first linear conductor pattern 26F.
  • the first end of the first metal post 36F is connected to the first linear conductor pattern 26G.
  • the second metal posts 46A to 46F are arranged so as to extend in the normal line direction with respect to the second main surface VS2 of the resin member 70, and reach the first main surface VS1 and the second main surface VS2 of the resin member 70. . Further, the second metal posts 46A to 46F are arranged in the vicinity of the second side surface VS4 of the resin member 70 as shown in FIG. The first ends of the second metal posts 46A to 46F are connected to the first linear conductor patterns 26A to 26F.
  • the first end of the second metal post 46A is connected to the first linear conductor pattern 26A.
  • the first end of the second metal post 46B is connected to the first linear conductor pattern 26B.
  • the first end of the second metal post 46C is connected to the first linear conductor pattern 26C.
  • the first end of the second metal post 46D is connected to the first linear conductor pattern 26D.
  • the first end of the second metal post 46E is connected to the first linear conductor pattern 26E.
  • the first end of the second metal post 46F is connected to the first linear conductor pattern 26F.
  • the wireless IC device 201 includes second linear conductor patterns 56A, 56B, 56C, 56D, 56D, 56E, and 56F formed on the first main surface VS1 of the resin member 70.
  • the first ends of the second linear conductor patterns 56A to 56F are connected to the second ends of the first metal posts 36A to 36F, and the second ends of the second linear conductor patterns 56A to 56F are the second metal posts 46A to 46F. Is connected to the second end.
  • the first end of the second linear conductor pattern 56A is connected to the second end of the first metal post 36A, and the second end of the second linear conductor pattern 56A is the second end of the second metal post 46A. Connected to the end.
  • the first end of the second linear conductor pattern 56B is connected to the second end of the first metal post 36B, and the second end of the second linear conductor pattern 56B is connected to the second end of the second metal post 46B.
  • the first end of the second linear conductor pattern 56C is connected to the second end of the first metal post 36C, and the second end of the second linear conductor pattern 56C is connected to the second end of the second metal post 46C.
  • the first end of the second linear conductor pattern 56D is connected to the second end of the first metal post 36D, and the second end of the second linear conductor pattern 56D is connected to the second end of the second metal post 46D.
  • the first end of the second linear conductor pattern 56E is connected to the second end of the first metal post 36E, and the second end of the second linear conductor pattern 56E is connected to the second end of the second metal post 46E.
  • the first end of the second linear conductor pattern 56F is connected to the second end of the first metal post 36F, and the second end of the second linear conductor pattern 56F is connected to the second end of the second metal post 46F.
  • the first linear conductor patterns 26A to 26G extend in the longitudinal direction of the resin member 70 (Y direction in FIG. 14B), and the second linear conductor patterns 56A to 56F extend in the longitudinal direction of the resin member 70 (Y direction). It extends to.
  • the meaning of “extending in the longitudinal direction (Y direction) of the resin member 70” is not limited to the fact that the first linear conductor patterns 26A to 26G and the second linear conductor patterns 56A to 56F are all parallel.
  • the direction in which the first linear conductor patterns 26A to 26G and the second linear conductor patterns 56A to 56F extend generally faces the longitudinal direction (Y direction) of the resin member 70, that is, substantially extends in the Y direction. Including.
  • the second linear conductor patterns 56A to 56F are arranged in the short direction (X direction in FIG. 14A) of the resin member 70 and extend in the longitudinal direction (Y direction) of the resin member 70.
  • the second linear conductor patterns 56C and 56D arranged in the center in the short direction (X direction) of the resin member 70 are arranged in the longitudinal direction ( (Y direction) is linearly formed.
  • the second linear conductor patterns 56 ⁇ / b> A, 56 ⁇ / b> B, 56 ⁇ / b> E, and 56 ⁇ / b> F bend toward the central portion of the resin member 70 in the longitudinal direction (Y direction). It is formed as follows. In other words, the second linear conductor patterns 56A, 56B, 56E, and 56F are formed such that the center portion in the longitudinal direction (Y direction) of the resin member 70 is bent toward the second linear conductor patterns 56C and 56D. It can be said that.
  • the first metal posts 36A to 36F are arranged in the short direction (X direction) of the resin member 70 and extend in the height direction (Z direction) of the resin member 70 as shown in FIG.
  • the second metal posts 46A to 46F are arranged in the short direction (X direction) of the resin member 70 and extend in the height direction (Z direction) of the resin member 70. That is, these metal posts are parallel to each other.
  • the first linear conductor patterns 26A to 26G, the first metal posts 36A to 36F, the second linear conductor patterns 56A to 56F, and the second metal posts 46A to 46F constitute a 6-turn rectangular helical coil conductor.
  • the first linear conductor patterns 26A to 26G, the first metal posts 36A to 36F, the second linear conductor patterns 56A to 56F, and the second metal posts 46A to 46F are formed in a “helical shape” according to the present invention. Corresponds to “coil conductor”.
  • the coil conductor has a winding axis AX6 in a direction along the first main surface VS1 and the second main surface VS2, as shown in FIGS. 14 (A) and 14 (B).
  • the winding axis AX6 can be represented by a straight line extending in the lateral direction (X direction) when viewed from the first main surface VS1.
  • the coil conductor of the wireless IC device 201 is located at the same position as viewed from the second main surface VS2 (the short direction (Y direction of the base member 1 or the resin member 70). ) In the direction of the winding axis AX6 of the formation region of the second linear conductor patterns 56A to 56F at the position near the first side surface VS3) from the center of the first linear conductor patterns 26B to 26F. It has a portion shorter than the length X1 in the direction of the winding axis AX6 of the formation region (region where the relationship X2 ⁇ X1 is established).
  • the coil opening of the coil conductor can be made larger than the coil opening in the case where the above configuration is not used, and the substantial coil opening that functions as an antenna can be made larger. Therefore, the basic configuration of the wireless IC device 201 is the same as that of the surface mount antenna 101 according to the first embodiment, and has the same operations and effects as the surface mount antenna 101.
  • the RFIC element 61 in which the RFIC chip (bare chip) is packaged is connected (mounted) to the power supply terminal 8A of the wiring conductor pattern 7A and the power supply terminal 8B of the wiring conductor pattern 7B. That is, the RFIC element 61 as a power feeding circuit is connected to the coil conductor of the surface mount antenna.
  • the RFIC element 61 is mounted on the first main surface PS ⁇ b> 1 of the substrate 4 and embedded in the resin member 70.
  • the RFIC element 61 may be a bare chip RFIC.
  • the RFIC has an Au electrode terminal and is connected to the Au plating film of the power supply terminal by ultrasonic bonding.
  • the wireless IC device 201 not only the RFIC element 61 but also chip capacitors 62 and 63 are mounted on the substrate 4. Similarly to the RFIC element 61, the chip capacitors 62 and 63 are connected to the wiring conductor pattern 7A and the wiring conductor pattern 7B, mounted on the first main surface PS1 of the substrate 4, and embedded in the resin member 70.
  • FIG. 15 is a circuit diagram of the wireless IC device 201.
  • the coil conductor ANT is connected to the RFIC element 61, and chip capacitors 62 and 63 are connected in parallel to the coil conductor ANT.
  • the LC conductor circuit is constituted by the coil conductor ANT, the chip capacitors 62 and 63, and the capacitance component of the RFIC element 61 itself.
  • the capacitances of the chip capacitors 62 and 63 are selected so that the resonance frequency of the LC resonance circuit is substantially equal to the communication frequency of the RFID system (for example, 13.56 MHz).
  • One of the chip capacitors 62 and 63 is a coarse adjustment capacitor, and the other is a fine adjustment capacitor. Note that the number of capacitors for setting the resonance frequency may be one.
  • the “RFID element” may be an RFIC chip itself or an RFIC package in which a matching circuit or the like is integrated with the RFIC chip.
  • An “RFID tag” has an RFIC element and a coil conductor connected to the RFIC element, and uses non-contact information to read and write data in a built-in memory using radio waves (electromagnetic waves) or magnetic fields. Defined as medium. That is, the wireless IC device of this embodiment is configured as an RFID tag.
  • the RFIC element 61 includes, for example, an HF band high frequency wireless IC chip for an HF band RFID system.
  • the wireless IC device 201 is provided, for example, on an article to be managed. By bringing the wireless IC device 201 (that is, the RFID tag) attached to the article close to the reader / writer device, the coil conductor of the wireless IC device 201 and the coil conductor of the RFID reader / writer device are magnetically coupled. Thus, RFID communication is performed between the RFID tag and the reader / writer device.
  • the mounting electrode (land pattern) of the RFIC element 61 forms a magnetic field of the coil conductor. It is hard to disturb. Further, the adverse effect (malfunction, unstable operation, etc.) on the RFIC element 61 due to the magnetic field of the coil conductor is small. Further, the adverse effect on the coil conductor due to noise generated from the digital circuit portion of the RFIC element 61 (decrease in reception sensitivity, wraparound of the transmission signal to the reception circuit, etc.) is small.
  • the first linear conductor patterns 26A to 26G and the second linear conductor patterns 56A to 56F extending in the X-axis direction are all formed by forming a plating film such as Cu.
  • the film thickness can be increased. Therefore, the direct current resistance component of the coil conductor can be further reduced.
  • the wireless IC device 201 includes a capacitor connected to the RFIC element, a circuit for matching the RFIC element 61 and the coil conductor or setting a resonance frequency can be easily configured, and an external circuit can be eliminated or simplified. It can be made.
  • the entire wireless IC device 201 is robust.
  • the solder connection portion of the surface mount chip component is protected against a high temperature resin (for example, a high temperature resin of 300 ° C. or higher) that flows during injection molding.
  • a high temperature resin for example, a high temperature resin of 300 ° C. or higher
  • the resin member 70 and the substrate 4 are bonded together by joining the resins, and the mounted components and metal posts do not come off or deform.
  • the joined state of the joined portion returns to normal. Therefore, the inductance value of the coil conductor can be maintained.
  • the RFIC element 61 is not exposed to the outside of the wireless IC device 201, the protection function of the RFIC element 61 is enhanced, and an increase in size caused by mounting the RFIC element 61 outside can be avoided. Further, the reliability of the connection portion of the RFIC element 61 to the substrate 4 is increased. As a result, it is possible to realize a highly heat-resistant wireless IC device that can be incorporated in a resin molded product such as plastic, that is, can withstand high temperatures during injection molding.
  • the wireless IC device 201 has a structure in which the substrate 4 is embedded in the resin member 70 so that the second main surface PS2 of the substrate 4 and the second main surface VS2 of the resin member 70 are flush with each other. Therefore, the first linear conductor patterns 26A and 26G are routed across the second main surface PS2 of the substrate 4 and the second main surface VS2 of the resin member 70. Thereby, the connection between the interlayer connection conductors 10A and 10B of the substrate 4 and the first linear conductor patterns 26A and 26G can be facilitated.
  • the first linear conductor patterns 26B to 26F pass through the region overlapping the second main surface PS2 of the substrate 4 when viewed from the Z direction, and the first ends of the first metal posts 36A to 36E and the second The first ends of the metal posts 46B to 46F are connected. That is, the bridge pattern (jumper wiring) can be formed using the second main surface PS2 opposite to the first main surface PS1 on which the RFIC element 61 is mounted.
  • the RFIC element 61 of the wireless IC device 201 is connected to the interlayer connection conductors 10A and 10B via the wiring conductor patterns 7A and 7B formed on the first main surface PS1 of the substrate 4. Therefore, the bridge pattern can be easily formed.
  • the RFIC element 61 may be directly connected to the interlayer connection conductors 10A and 10B. However, the RFIC element 61 is connected to the interlayer connection conductors 10A and 10B via the wiring conductor patterns 7A and 7B for routing.
  • the interlayer connection conductors 10A and 10B can be drawn out to any position of the four second main surfaces PS2.
  • FIG. 16 is a perspective view of an electronic apparatus 301 according to the seventh embodiment.
  • FIG. 18 is a partially enlarged view of FIG.
  • the electronic device 301 is a portable electronic device such as a smartphone, and includes a wireless IC device 201 and a booster antenna 120 having a resonance frequency. From the viewpoint of FIG. 16, there is a lower housing 401 on the upper surface side of the electronic device 301 and an upper housing 402 on the lower surface side. A circuit board 80, a wireless IC device 201, and a booster antenna 120 having a resonance frequency are provided in a space surrounded by the lower casing 401 and the upper casing 402.
  • the wireless IC device 201 is as shown in the sixth embodiment.
  • the wireless IC device 201 is mounted on the circuit board 80 as shown in FIGS. Components other than the wireless IC device 201 are also mounted on the circuit board 80.
  • the booster antenna 120 having a resonance frequency is attached to the inner surface of the lower housing 401.
  • the booster antenna 120 is disposed at a position that does not overlap the battery pack 130.
  • Booster antenna 120 includes insulator base material 123 and coil patterns 121 and 122 formed on insulator base material 123.
  • the wireless IC device 201 is arranged so that the magnetic flux is linked to the coil conductor and the booster antenna 120. That is, the wireless IC device 201 and the booster antenna 120 are arranged so that the coil conductor of the wireless IC device 201 is magnetically coupled to the coil of the booster antenna 120.
  • the broken line in FIG. 18 conceptually represents the magnetic flux contributing to the magnetic field coupling.
  • the RFIC element 61 of the wireless IC device 201 faces (closes) the circuit board 80 side, and the coil conductor faces (closes) the booster antenna 120 side. Therefore, the degree of coupling between the coil conductor of the wireless IC device 201 and the booster antenna 120 is high. Further, since the wiring (particularly the digital signal line and the power supply line) connecting the RFIC element 61 and other circuit elements is wired substantially in parallel with the magnetic flux of the coil conductor, the coupling with the coil conductor is small.
  • FIG. 19 is a perspective view of the booster antenna 120.
  • FIG. 20 is a circuit diagram of the booster antenna 120.
  • the first coil pattern 121 and the second coil pattern 122 are conductors patterned in a rectangular spiral shape, and are patterned so as to be capacitively coupled in a state where current flows in the same direction in plan view. .
  • a stray capacitance is formed between the first coil pattern 121 and the second coil pattern 122.
  • An LC resonance circuit is configured by the inductance of the first coil pattern 121 and the second coil pattern 122 and the capacitance of the stray capacitance.
  • the resonance frequency of the LC resonance circuit is substantially equal to the communication frequency of the RFID system.
  • the communication frequency is, for example, the 13.56 MHz band.
  • communication can be performed using a large coil opening of the booster antenna, so that the maximum communicable distance can be expanded.
  • This configuration makes it possible to realize an electronic device equipped with a surface mount antenna used in a communication system of HF band or UHF band.
  • the surface mount antenna (and also the RFID tag) in the present invention can be used as a primary antenna for supplying a magnetic field to the booster antenna.
  • connection terminals 2A and 2B are provided on the first main surface VS1 of the base 1
  • connection terminal connected to the coil conductor may be configured to be formed other than the first main surface VS1 of the base 1.
  • the surface mount antenna (and also the RFID tag) in the present invention is not limited to the HF band, but can be applied to the UHF band.
  • one end and the other end of the coil conductor may be used as a feeding end, but one end may be used as a feeding end and the other end may be an open end.
  • the first linear conductor pattern on the first main surface VS1 (mounting surface) side and the second linear conductor pattern on the second main surface VS2 (top surface) constituting the coil conductor are connected on the side surface of the substrate 1. It may be a structure. That is, the metal post and the interlayer connection conductor may be exposed on the side surface of the substrate 1. Further, the first linear conductor pattern and the second linear conductor pattern constituting the coil conductor may be connected by a conductor pattern formed on the side surface of the substrate 1 without using a metal post or an interlayer connection conductor. Good.
  • ANT ... Coil conductors AX1, AX2A, AX2B, AX3, AX5, AX6 ... Winding axes C0, C1 ... Coil openings D1, D2 ... Distance between lines i1 ... Current LS1 ... First main surface LS2 of first base material layer 11 ... Second main surface PS1 of the first base material layer 11 ... First main surface PS2 of the substrate 4 ... Second main surface VS1 of the substrate 4 ... First main surface VS2 of the base material 1 ... Second main surface VS3 of the base material 1 ... 1st side surface VS4 of base material 1 ... 2nd side surface 1 of base material 1 ... Base material 2A, 2B ...
  • substrate 5 Internal conductor pattern 6 .
  • the length of the forming region in the winding axis direction is shorter than the length of the first main surface side conductor forming region in the winding axis direction 61... RFIC elements 62 and 63... Chip capacitor 70.
  • Substrate 81 Ground conductors 101, 102A, 102B, 103, 104, 105 ... Surface mount antenna 120 ... Booster antenna 121 ... First coil pattern 122 ... Second coil pattern 123 ... Insulator base 130 ... Battery Click 201 ... wireless IC device 301 ... electronic device 401 ... lower housing 402 ... upper housing

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)
  • Coils Or Transformers For Communication (AREA)
PCT/JP2015/071058 2014-08-27 2015-07-24 表面実装型アンテナおよび電子機器 WO2016031454A1 (ja)

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CN107729973A (zh) * 2016-08-12 2018-02-23 国民技术股份有限公司 一种通信模块、用户识别卡及通信设备
CN107732418A (zh) * 2016-08-12 2018-02-23 国民技术股份有限公司 一种非接触天线模块及通信设备
JPWO2017145505A1 (ja) * 2016-02-25 2018-08-16 株式会社村田製作所 無線ｉｃデバイスおよび無線ｉｃデバイスの製造方法
CN109888468A (zh) * 2017-12-06 2019-06-14 三星电机株式会社 天线装置以及包括该天线装置的设备
CN111293420A (zh) * 2019-01-31 2020-06-16 展讯通信（上海）有限公司 天线单元、天线系统及电子装置

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JP2009206974A (ja) * 2008-02-28 2009-09-10 Murata Mfg Co Ltd 磁性体アンテナ及びアンテナ装置
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JP2017158200A (ja) 2017-09-07
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CN206628599U (zh) 2017-11-10
JPWO2016031454A1 (ja) 2017-05-25

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