WO2016028098A1 - Carte de circuit imprimé à noyau métallique et son procédé de fabrication - Google Patents

Carte de circuit imprimé à noyau métallique et son procédé de fabrication Download PDF

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Publication number
WO2016028098A1
WO2016028098A1 PCT/KR2015/008691 KR2015008691W WO2016028098A1 WO 2016028098 A1 WO2016028098 A1 WO 2016028098A1 KR 2015008691 W KR2015008691 W KR 2015008691W WO 2016028098 A1 WO2016028098 A1 WO 2016028098A1
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WO
WIPO (PCT)
Prior art keywords
thermal
circuit board
insulating layer
conductor
passages
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Application number
PCT/KR2015/008691
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English (en)
Korean (ko)
Inventor
차승진
이양수
이영수
Original Assignee
(주)엘리텍
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Publication of WO2016028098A1 publication Critical patent/WO2016028098A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to a metal core printed circuit board (MCPCB), and more particularly, to a MCPCB for heat dissipation of various electronic components and a method of manufacturing the same.
  • MCPCB metal core printed circuit board
  • LED light emitting diodes
  • a cooling technology capable of efficiently cooling the heat of electronic components is an important issue.
  • LED has been used in various fields due to its many advantages such as long life, easy miniaturization and light weight, and low power consumption.
  • the LED used as a light source for illumination is increasing luminous efficiency, it is generally known that 50% or more of the supply power is consumed for heat generation. Therefore, it is very important to solve problems such as deterioration of characteristics and shortened life due to heat generation of the LED chip.
  • LED packages are generally mounted on PCBs, metal PCBs (Metal PCBs, MPCBs), MCPCBs, etc. by surface mount technology (SMT).
  • MPCB and MCPCB are heat dissipation substrates that transfer heat from an LED chip to a metal base with high thermal conductivity.
  • a chip-on-board LED package is manufactured by directly mounting an LED chip, that is, a bare chip or a bare die on a heat dissipation board, and then packaging the LED chip. There is an advantage to improve the productivity by shortening the process.
  • US patent application 2012/0268896 A1 discloses a MCPCB and a metal core printed circuit board and electronic package structure.
  • the MCPCB of this patent application is composed of a circuit layer in which electronic components are mounted on the surface, and a metal layer disposed on the back surface of the circuit layer.
  • a plurality of through holes are formed in the circuit layer and the metal layer of the MCPCB.
  • a plurality of thermal passages are connected to an external circuit board through the through holes of the MCPCB. Pins of the electronic component are connected to the thermal passages. The heat of the electronic component is transferred to the circuit board through the thermal passages and is released.
  • the conventional MCPCB inserts a plastic sheath through the through holes of the MCPCB with a plurality of insulating layers for insulation of the metal layer and the thermal passages, and then rivets the thermal passages with the MCPCB. Since the fitting is to pass through the through-holes of the assembly, there is a problem that the configuration is quite complicated and difficult to assemble the productivity is lowered. In addition, a separate soldering process for connecting the pins of the electronic component to the thermal passages is additionally required.
  • the present invention is to solve various problems of the conventional MCPCB as described above.
  • An object of the present invention is to provide a new MCPCB capable of efficiently dissipating heat of an electronic component by a thermal passage extending from an edge of a conductive pattern and a metal layer, and improving heat dissipation performance, and a manufacturing method thereof. .
  • Another object of the present invention is that the conductor pattern and the thermal passage are simply integrally formed by photolithography of the conductor plate to improve productivity and reduce production costs.
  • Method for manufacturing MCPCB comprises the steps of etching one side of the top conductor plate to form a plurality of primary thermal passage patterns; Further etching one side of the top conductor plate to form a plurality of thermal passages having a plurality of secondary thermal passage patterns extending from the plurality of primary thermal passage patterns; Stacking each of the first insulating layer, the metal layer, the second insulating layer, and the bottom conductor plate in a plurality of thermal passages on one side of the top conductor plate; Etching the other side of the top conductor plate to form a plurality of top circuit boards having a plurality of conductor patterns each of which extends a plurality of thermal passages; Etching the bottom conductor board to form a plurality of bottom circuit boards having a conductor pattern to which each of the plurality of thermal passages is connected.
  • an MCPCB includes a top circuit having a plurality of conductor patterns for mounting electronic components, and a plurality of thermal passages extending from the rear surfaces of the plurality of conductor patterns so as to transfer heat of the electronic components.
  • a substrate A first insulating layer laminated on the rear surface of the top circuit board so as to be disposed between the plurality of thermal passages;
  • the bottom circuit board is stacked on the rear surface of the second insulating layer and has a plurality of conductor patterns connected to each of the plurality of thermal passages.
  • the plurality of thermal passages are formed by multistage photolithography so as to be perpendicular to the plurality of conductor patterns of the top circuit board.
  • the MCPCB and the method of manufacturing the same according to the present invention can improve the heat dissipation performance by efficiently dissipating heat of the electronic component by the thermal passage and the metal layer extending from the edge of the conductor pattern, thereby improving performance and reliability of the electronic component. have.
  • by simply configuring the thermal passages integrally with the conductor pattern by at least two or more multi-stage photolithography it is possible to improve productivity and reduce production costs.
  • FIG. 1 is a cross-sectional view showing the configuration of an MCPCB according to the present invention.
  • FIG. 2 is a plan view showing the configuration of the MCPCB according to the present invention.
  • FIG 3 is a view showing for explaining the first photolithography of the top conductor plate in the manufacturing method of MCPCB according to the present invention.
  • FIG. 4 is a diagram illustrating secondary photolithography of a top conductor plate continuous to FIG. 3.
  • FIG. 4 is a diagram illustrating secondary photolithography of a top conductor plate continuous to FIG. 3.
  • FIG. 5 is a diagram for explaining the tertiary photolithography of the top conductor plate continuous to FIG. 4.
  • FIG. 6 is an enlarged cross-sectional view illustrating a configuration of a thermal passage in FIG. 5.
  • FIG. 7 is a view illustrating a lamination of a first insulating layer, a metal layer, a second insulating layer and a bottom conductor plate in the method of manufacturing MCPCB according to the present invention.
  • FIG. 8 is a diagram illustrating photolithography for forming conductor patterns of a top and a bottom circuit board in a method of manufacturing an MCPCB according to the present invention.
  • FIG. 9 is a view showing for explaining a method of mounting the LED package in the MCPCB according to the present invention.
  • FIG. 10 is a plan view illustrating the cutting of the MCPCB according to the present invention.
  • FIG. 11 is a cross-sectional view illustrating the cutting of the MCPCB according to the present invention.
  • the MCPCB 10 transmits and discharges heat of an electronic component 20, for example, an LED package 22, downward.
  • the LED package 22 includes an LED chip 24, a first lead wire 26a, a second lead wire 26b, and an encapsulant 28.
  • the encapsulation 28 is composed of a convex lens for diffusing light of the LED chip 24, and may be made of silicon.
  • the MCPCB 10 includes a top circuit board 30 on which the LED package 20 is mounted.
  • the top circuit board 30 is composed of a first conductor pattern 32a, a second conductor pattern 32b, a first thermal passage 34a and a second thermal passage 34b.
  • Each of the first and second thermal passages 34a and 34b extends downward from the rear edge of each of the first and second conductor patterns 32a and 32b.
  • the first and second thermal passages 34a and 34b are formed in a square rim shape or a skirt shape having a recess 36 therein.
  • the first and second conductor patterns 32a and 32b and the first and second thermal passages 34a and 34b of the top circuit board 30 may be formed of a conductive plate, for example, a copper plate. It is formed by photolithography.
  • the LED chip 24 is mounted on the surface of the first conductor pattern 32a among the first and second conductor patterns 32a and 32b by soldering a solder 24a.
  • Each of the first and second lead wires 26a and 26b is wire bonded to each of the first and second conductor patterns 32a and 32b.
  • the encapsulation 28 is packaged in the LED chip 24 and the first and second lead wires 26a and 26b.
  • the MCPCB 10 includes a top circuit board 30 having first and second conductor patterns 32a and 32b for electrical connection between the first and second lead wires 26a and 26b. Although illustrated and described, this is exemplary and the number of conductor patterns may be increased according to the number of lead wires.
  • MCPCB 10 is the first insulating layer 40, the metal layer 50 or the metal base (Metal base) and the second insulating layer 60 which are sequentially disposed below the top circuit board 30 ).
  • Each of the first insulating layer 40, the metal layer 50, and the second insulating layer 60 is accommodated in the recess 36 of the first and second thermal passages 34a and 34b.
  • the first and second insulating layers 40 and 60 cover the entire surface and the rear surface of the metal layer 50 to insulate the top circuit board 30 and the metal layer 50 from each other.
  • the first and second insulating layers 40 and 60 may be formed of a ceramic-based insulating plate having good insulation. In some embodiments, the first and second insulating layers 40 and 60 may be formed by coating of epoxy resin.
  • the metal layer 50 may be formed of an aluminum plate having good conductivity.
  • the third insulating layer 70 is further provided between the first and second thermal passages 34a and 34b and the metal layer 50 to insulate the first and second thermal passages 34a and 34b and the metal layer 50. Formed.
  • the third insulating layer 70 may be formed by coating an insulating material, for example, an epoxy resin, an insulating oil, or the like, on the edge of the metal layer 50.
  • the third insulating layer 70 may be composed of an air layer by the gap between the first and second thermal passages 34a and 34b and the metal layer 50.
  • the MCPCB 10 further includes a bottom circuit board 80 mounted on the rear surface of the second insulating layer 60.
  • the bottom circuit board 80 includes first and second conductor patterns 82a and 82b to which the first and second thermal passages 34a and 34b are connected, respectively.
  • the bottom circuit board 80 is housed in the recess 36 of the first and second thermal passages 34a and 34b.
  • the bottom circuit board 80 may be configured by etching the copper plate as a conductor board.
  • the conductor layer 90 is further plated on the back surface of the bottom circuit board 80.
  • the conductor layer 90 is made of the same copper as the material of the bottom circuit board 80. By plating the conductor layer 90, the surfaces of the first and second thermal passages 34a and 34b and the bottom circuit board 80 are precisely formed.
  • the first and second thermal passages 34a and 34b extend downwardly from the rear edges of the first and second conductor patterns 32a and 32b in the form of a rectangular border, thereby improving heat transfer efficiency. Accordingly, the first and second thermal passages 34a and 34b rapidly transfer heat from the first and second conductor patterns 32a and 32b to the metal layer 50 and the bottom circuit board 80 to improve heat dissipation performance. do. Meanwhile, the first and second conductor patterns 32a and 32b and the first and second thermal passages 34a and 34b of the top circuit board 30 are simply configured by etching the copper plate, thereby improving productivity. have.
  • a copper plate is prepared as the top conductor board 100 to manufacture the top circuit board 30.
  • the top conductor plate 100 has the flat 1st surface 102a and the 2nd surface 102b, and the thing of thickness 1mm is used.
  • the first surface 102a of the top conductor board 100 is the back surface of the top circuit board 30, and the second surface 102b is the surface of the top circuit board 30.
  • a preform for forming the first and second thermal passages 34a and 34b a plurality of primary passage patterns 104a are formed on the first side of the top conductor plate 100. Patterned by primary photolithography at 102a).
  • primary photolithography forms a photoresist layer 110 by coating a photoresist with a uniform thickness on the first surface 102a.
  • the photoresist layer 110 may be formed by various methods such as spin coating, roller coating, screen printing, and dispensing.
  • a photomask 120 is disposed on the photoresist layer 110, and a window of the photomask 120 is formed.
  • Ultraviolet light 124 is irradiated onto the photoresist layer 110 through the light 122 to perform exposure.
  • the photomask 120 is removed and the photoresist layer 110 is developed by a developer.
  • the exposed photoresist 112 remains on the first surface 102a without being dissolved, and the non-exposed portion 114 is dissolved and removed.
  • descum may be further performed.
  • FIG. 3D after development of the photoresist layer 110, the first surface 102a of the unexposed portion 114 is etched.
  • FIG. 3 (e) after etching the top conductor plate 100, the first thermal passage is formed by stripping the remaining photoresist remaining on the first surface 102a. Patterns the patterns 106.
  • the heights of the first and second thermal passages 34a and 34b are first insulated. Secondary photolithography is performed so that the total thickness of the layer 40, the metal layer 50, and the second insulating layer 60 is at least. Secondary photolithography further forms a plurality of secondary thermal passage patterns 104b extending from the plurality of primary thermal passage patterns 104a. As the etching depth of the top conductor plate 100 becomes deeper, the cross-sectional direction is also corroded, so that it is difficult to perform fine processing with high precision.
  • first and second thermal passages 34a and 34b are corroded in the cross-sectional direction, the cross-sectional area is reduced, resulting in a low heat transfer efficiency, and in the case of severe corrosion, they may be damaged.
  • the primary and secondary photolithography are performed separately in order to increase the accuracy of the first and second thermal passages 34a and 34b.
  • secondary photolithography includes a primary etching face 106a and a primary thermal passivation pattern 104a of the top conductor plate 100 that have undergone primary photolithography.
  • the photoresist is coated with a uniform thickness on the surfaces of the layers to form the photoresist layer 130.
  • the photoresist may be uniformly coated on the side surfaces of the primary thermal passage patterns 104a by spraying.
  • FIG. 4B after the photoresist layer 130 is coated, the photomask 140 is mounted on the surface of the photoresist layer 130 coated on the primary etching surface 106a. do.
  • the photomask 140 has a plurality of holes 142 that are formed such that the first thermal passage patterns 104a are inserted through the photomask 140.
  • the first thermal passage patterns 104a are inserted through the holes 142 of the photomask 140, and the photomask 140 is brought into close contact with the surface of the photoresist layer 130.
  • the ultraviolet rays 144 are irradiated onto the surfaces of the primary thermal passage patterns 104a exposed on the upper surface of the photomask 140 to perform exposure.
  • the photomask 140 may be disposed above the top conductor plate 100 to perform exposure.
  • the photomask 140 is removed, and the photoresist layer 130 is developed using a developer, and then the exposed portion 132 is exposed.
  • the exposed portion 132 is exposed.
  • the unexposed portion 134 is dissolved and removed.
  • FIG. 4D after development of the photoresist layer 130, the primary etching surface 106a of the unexposed portion 134 is etched.
  • FIG. 4E after etching the top conductor plate 100, the second thermal passage pattern 104b is formed by stripping the photoresist remaining on the surface of the primary preform 106a. Pattern them.
  • the first and second thermal passages 34a and 3 may be formed according to the total thicknesses of the first insulating layer 40, the metal layer 50, and the second insulating layer 60.
  • tertiary photolithography can be further performed.
  • the thickness of the top conductor plate 100 is 1 mm
  • the etching depth of the primary photolithography may be set to 450 ⁇ m
  • the etching depth of each of the secondary and tertiary photolithography may be set to 250 ⁇ m.
  • Tertiary photolithography is performed almost the same as secondary photolithography.
  • tertiary photolithography coats the photoresist layer 150 on the secondary etch surface 106b of the top conductor plate 100.
  • the hole 162 of the photomask 160 is fitted to the photoresist layer 150 by being inserted into the secondary thermal passivation pattern 104b, and then exposed to ultraviolet light 164 for exposure.
  • the photoresist layer 150 is developed to leave the exposed portions 152 and remove the unexposed portions 154.
  • the third thermal passage pattern 104c is patterned by etching and stripping the top conductor plate 100.
  • the photolithography is performed by a negative photoresist, but is illustrated and described, but may also be performed by a positive photoresist.
  • FIG. 6 shows an enlarged thermal passage through primary, secondary and tertiary photolithography.
  • marks 38a, 38b are formed at the boundaries of each of the primary, secondary and tertiary thermal passage patterns 104a, 104b and 104c by performing the first, second and third photolithography stepwise. ) Is formed.
  • the outer surface of each of the first and second thermal passages 34a and 34b is a vertical line indicated by a dashed line with respect to the first surface 102a of the top conductor plate 100.
  • it is formed vertically with little difference to maintain an ideal squareness.
  • heat transfer efficiency may be improved, and defects during the manufacturing process may be prevented to improve productivity.
  • the first insulating layer 40, the metal layer 50, and the second insulating layer are formed.
  • the first ceramic plate 170, the aluminum plate 180, the second ceramic plate 190, and the bottom conductor plate 200 are sequentially inserted.
  • the stack is stacked on the secondary etching surface 106b of the top conductor plate 100.
  • Each of the first ceramic plate 170, the aluminum plate 180, the second ceramic plate 190, and the bottom conductor plate 200 is fitted in a relationship in which the first and second thermal passages 34a and 34b correspond to each other.
  • a plurality of through holes 172, 182, 192, 202 are formed to pass through. End portions of each of the first and second thermal passages 34a and 34b may protrude out of the through holes 202 of the bottom conductor plate 200.
  • the top conductor plate after lamination of the first ceramic plate 170, the aluminum plate 180, the second ceramic plate 190, and the bottom conductor plate 200 100, the first ceramic plate 170, the aluminum plate 180, the second ceramic plate 190, and the bottom conductor plate 200 are hot pressed in a vacuum atmosphere.
  • the top conductor plate 100, the first ceramic plate 170, the aluminum plate 180, the second ceramic plate 190, and the bottom conductor plate 200 are provided. After each pressure contact, the ends of each of the first and second thermal passages 34a and 34b protruding out of the through holes 202 of the bottom conductor plate 200 are planarized.
  • the conductor layer 180 is plated on the surface.
  • the conductor layer 180 is made of the same copper as the material of the top conductor plate 100 and the bottom conductor plate 200, so that the top conductor plate 100 and the bottom conductor plate 200 are the first and the second.
  • the thermal passages 34a and 34b are integrally connected. Therefore, the heat of the top circuit board 30 is efficiently transferred to the bottom circuit board 80 through the first and second thermal passages 34a and 34b.
  • the second surface 102b of the top conductor plate 100 is etched by photolithography to form a plurality of first and second conductor patterns 32a and 32b. do.
  • Each of the first and second thermal passages 34a and 34b may extend to each of the first and second conductor patterns 32a and 32b during the etching of the second surface 102b.
  • a plurality of top circuit boards 30 including first and second conductor patterns 32a and 32b and first and second thermal passages 34a and 34b are formed.
  • the thickness of the first and second conductor patterns 32a and 32b is about 100 ⁇ m. As shown in FIG.
  • the plurality of bottom conductor plates 200 are etched by photolithography to form a plurality of first and second conductor patterns 82a and 82b.
  • Each of the first and second conductor patterns 82a and 82b may be connected to each of the first and second thermal passages 34a and 34b when the bottom conductive plate 200 is etched. Therefore, each of the first and second conductor patterns 82a and 82b is formed by the first and second thermal passages 34a and 34b, respectively.
  • a plurality of bottom circuit boards 80 are integrally connected to the 32a and 32b.
  • the LED chips 24 are mounted on each of the first conductor patterns 32a among the first and second conductor patterns 32a and 32b, and the first and second lead wires 26a, Each of the LED chips 24 is connected to each of the first and second conductor patterns 32a and 32b by the 26b).
  • the LED packages 22 are formed by packaging the LED chips 24 and each of the first and second lead wires 26a and 26b with silicon to form an encapsulation 28.
  • the boundary 34c of each of the first and second thermal passages 34a and 34b is cut off to be separated.
  • the first and second thermal passages 34a and 34b may be precisely cut by a dicing saw like the semiconductor wafer.
  • each of the first and second thermal passages 34a and 34b may have a width of about 500 ⁇ m.
  • the distance between the first and second thermal passages 34a and 34b neighboring each other may be configured to be about 320 ⁇ m.
  • the first and second thermal passages 34a and 34b of the top circuit board 30 formed by photolithography of the top conductor board 100 are the bottom circuit boards. It is connected to the unit 80 integrally, and the first insulating layer 40, the metal layer 50 and the second insulating layer 60 is interposed between the top circuit board 30 and the bottom circuit board 80.
  • the configuration can improve productivity and reduce production costs.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne une carte de circuit imprimé à noyau métallique pour la dissipation de chaleur de composants électroniques, et son procédé de fabrication. La carte de circuit imprimé à noyau métallique selon la présente invention comprend une carte de circuit imprimé supérieure, une première couche isolante, une couche métallique, une deuxième couche isolante et une carte de circuit imprimé inférieure. La carte de circuit imprimé supérieure a une pluralité de motifs conducteurs pour le montage de composants électroniques, et une pluralité de passages thermique qui s'étendent depuis la surface arrière de chacun de la pluralité de motifs conducteurs de façon pouvoir transmettre la chaleur des composants électroniques. La première couche isolante, la couche métallique, la seconde couche isolante et la carte de circuit imprimé inférieure sont empilées sur la surface arrière de la carte de circuit imprimé supérieure de sorte à être disposées entre la pluralité de passages thermiques. La carte de circuit imprimé inférieure a une pluralité de motifs conducteurs, chacun étant relié à chacun de la pluralité de passages thermiques. Le procédé de fabrication selon la présente invention comprend les étapes consistant à : former un premier passage thermique et un second passage thermique de la carte de circuit imprimé supérieure au moyen d'une photolithographie multi-colonnes ; configurer la première couche isolante, la couche métallique, la seconde couche isolante et la carte de circuit imprimé inférieure dans une structure d'empilement ; et former une pluralité de motifs conducteurs sur chacune de la carte de circuit imprimé supérieure et de la carte de circuit imprimé inférieure. La présente invention permet à la chaleur de composants électroniques d'être émise de manière efficace à travers la couche de métal et les passages thermiques s'étendant depuis les bords des motifs conducteurs, ce qui permet d'améliorer la performance de dissipation de chaleur.
PCT/KR2015/008691 2014-08-20 2015-08-20 Carte de circuit imprimé à noyau métallique et son procédé de fabrication WO2016028098A1 (fr)

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KR1020140108653A KR101575127B1 (ko) 2014-08-20 2014-08-20 메탈 코어 인쇄회로기판 및 그 제조 방법
KR10-2014-0108653 2014-08-20

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CN105764239B (zh) * 2015-12-15 2019-04-30 惠州市蓝微电子有限公司 一种高散热性能的大功率电子元件线路板及其制作方法
DE102017221861A1 (de) * 2017-12-05 2019-06-06 Zf Friedrichshafen Ag Leiterplatte und Verfahren zur Fertigung einer Leiterplatte

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012982A (ja) * 1996-06-19 1998-01-16 Nippon Avionics Co Ltd メタルコアプリント配線板およびその製造方法
KR19990044869A (ko) * 1997-11-12 1999-06-25 포만 제프리 엘 인쇄 회로 기판 제조 방법 및 이에 의해 형성된 인쇄 회로 기판
JP2004104045A (ja) * 2002-09-13 2004-04-02 Nippon Mektron Ltd 多層回路配線基板
KR20090053622A (ko) * 2007-11-23 2009-05-27 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR20120053690A (ko) * 2010-11-18 2012-05-29 한국단자공업 주식회사 메탈코어를 구비한 인쇄회로기판 및 그 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012982A (ja) * 1996-06-19 1998-01-16 Nippon Avionics Co Ltd メタルコアプリント配線板およびその製造方法
KR19990044869A (ko) * 1997-11-12 1999-06-25 포만 제프리 엘 인쇄 회로 기판 제조 방법 및 이에 의해 형성된 인쇄 회로 기판
JP2004104045A (ja) * 2002-09-13 2004-04-02 Nippon Mektron Ltd 多層回路配線基板
KR20090053622A (ko) * 2007-11-23 2009-05-27 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
KR20120053690A (ko) * 2010-11-18 2012-05-29 한국단자공업 주식회사 메탈코어를 구비한 인쇄회로기판 및 그 제조방법

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