WO2016024529A1 - Film de revêtement et encapsulation de composant électronique l'utilisant - Google Patents

Film de revêtement et encapsulation de composant électronique l'utilisant Download PDF

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Publication number
WO2016024529A1
WO2016024529A1 PCT/JP2015/072403 JP2015072403W WO2016024529A1 WO 2016024529 A1 WO2016024529 A1 WO 2016024529A1 JP 2015072403 W JP2015072403 W JP 2015072403W WO 2016024529 A1 WO2016024529 A1 WO 2016024529A1
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WIPO (PCT)
Prior art keywords
mass
cover film
layer
resin
heat seal
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PCT/JP2015/072403
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English (en)
Japanese (ja)
Inventor
佐々木　彰
貴之 岩崎
高範 阿津坂
忠昭 弘岡
坂本　繁
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電気化学工業株式会社
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Priority to CN201580043894.5A priority Critical patent/CN106604816B/zh
Priority to JP2016542558A priority patent/JP6694387B2/ja
Priority to KR1020177004913A priority patent/KR102337822B1/ko
Publication of WO2016024529A1 publication Critical patent/WO2016024529A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00—Packages comprising articles attached to cards, sheets or webs
    • B65D73/02—Articles, e.g. small electrical components, attached to webs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21—Anti-static
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/31—Heat sealable

Definitions

  • the present invention relates to a cover film used for a package of electronic components and an electronic component package using the same.
  • the surface-mounting electronic component is stored in a carrier tape in which embossed pockets that can be stored in accordance with the shape of the electronic component are interlockedly formed.
  • a cover film is stacked as a lid on the upper surface of the carrier tape, and both ends of the cover film are continuously heat-sealed in the length direction with a heated seal bar to form a package.
  • the cover film material a material in which a biaxially stretched polyester film is used as a base material and a thermoplastic resin sealant layer is laminated is used.
  • the cover film is peeled off from the carrier tape by an automatic peeling device when the electronic component is mounted in the manufacturing process of the electronic device or the like. Therefore, it is particularly important for the function of the cover film that the peel strength from the carrier tape is stable within an appropriate range. If the peel strength is too strong, the cover film may be cut off. If the peel strength is too weak, the cover film may be peeled off from the carrier tape when the transport body is transferred, and the electronic component as the contents may fall off. In addition, when the transport body is transferred, it may be exposed to a high temperature environment of 40 to 60 ° C., and the heat seal layer of the thermoplastic resin may be softened and the portions other than the heat sealed ends may adhere to the carrier tape. The peel strength may increase.
  • the peeling speed of the cover film is also extremely high at 0.1 second or less / tact.
  • a large impact stress is applied to the cover film.
  • film cut there arises a problem called “film cut” in which the cover film is cut.
  • the peel strength of the cover film is 0.1 to 1.0 N for an 8 mm wide carrier tape and 0.1 to 1 .1 for a 12 mm to 56 mm wide carrier tape when the peel speed is 300 mm per minute in JIS C0806-3. 3N.
  • the peeling speed is faster than 300 mm per minute, and particularly when large connector parts are accommodated, taping is often performed at the upper limit peel strength. As a result, the cover film is peeled off. It is easy to cause “cut film” when doing.
  • the cover film may be required to have high transparency so that the electronic parts that are stored items can be easily identified.
  • a method of discriminating defects such as deformation of IC pins by taking a picture with a CCD camera from the cover film and analyzing the image is performed.
  • a cover film having properties is required.
  • a haze (cloudiness value) of 50% or less is required.
  • the above-mentioned sealant composition is mixed with polyethylene or polypropylene by mixing a styrene-butadiene-styrene block copolymer.
  • a method for solving the problem has been proposed (see Patent Document 5).
  • Patent Document 5 A method for solving the problem has been proposed (see Patent Document 5).
  • Patent Document 6 a cover film has been proposed in which layers made of styrene-based hydrocarbon resin are coextruded to improve the adhesion between the layers (see Patent Document 6).
  • JP-A-8-119373 Japanese Patent Laid-Open No. 10-250020 JP 2000-327024 A JP 2006-327624 A JP-A-8-324676 JP 2007-90725 A
  • An object of the present invention is to provide a cover film having a peel strength that is constant within a predetermined value range, excellent in transparency, and less likely to cause “film breakage” during high-speed peeling.
  • the present inventor has provided a resin composition having a specific structure in the adhesive layer and the heat seal layer located between the base material layer and the intermediate layer.
  • the present inventors have found that a cover film overcoming the above can be obtained, and have reached the present invention.
  • the present invention provides (1) a cover film having at least (A) a base material layer, (B) an adhesive layer, (C) an intermediate layer, and (D) a heat seal layer, wherein (B) the adhesive layer is (D)
  • the resin constituting the heat seal layer comprises (d-1) an olefin component in an amount of 58% by mass to 82% by a cured product of a main component containing a polyester resin and a curing agent containing 50% by mass or more of isophorone diisocyanate.
  • an olefin resin 50% by mass to 90% by mass of an olefin resin containing one or both of an olefin-styrene block copolymer containing 75% by mass and an ethylene-vinyl acetate copolymer containing 75% by mass to 88% by mass of an olefin component; d-2) 10% to 40% by mass of potassium ionomer having antistatic performance, and (D) surface resistance value of the outermost surface on the heat seal layer side of the cover film A cover film to equal to or less than 10 12 Omega.
  • the cover film comprises at least (A) a base material layer, (B) an adhesive layer, (C) an intermediate layer, and (D) a heat seal layer having a heat sealable resin
  • the adhesive layer is composed of a cured product of a two-component curable adhesive of a main agent and a curing agent, the main agent is a polyester resin, and 50% by mass or more of the curing agent is isophorone diisocyanate
  • the resin constituting the heat seal layer is any one of (d-1) an olefin-styrene block copolymer containing 58 to 82% by mass of an olefin component and an ethylene-vinyl acetate copolymer containing 75 to 88% by mass of an olefin component. 50% to 90% by mass of one or more olefinic resins, (d-2) 10% to 40% by mass of potassium ionomer having antistatic performance, and (D)
  • the surface resistance of Toshiru layer can be configured
  • the heat seal layer preferably contains (d-3) one or both of organic fine particles and inorganic fine particles in a total of 10% by mass or less.
  • the content of isophorone diisocyanate in the precuring agent is preferably 4% by mass to 13% by mass with respect to the total with the polyester resin.
  • middle layer is 5 N / 15mm or more.
  • the intermediate layer is made of a metallocene linear low density polyethylene resin having a density of 0.900 ⁇ 10 3 kg / m 3 to 0.925 ⁇ 10 3 kg / m 3 , Is preferably 15 ⁇ m to 25 ⁇ m.
  • the heat seal layer is configured to have (E) a second heat seal layer mainly composed of an acrylic resin on the surface opposite to the (B) intermediate layer side. Can do.
  • the present invention is an electronic component package using the cover film according to any one of the above (1) to (6) as a cover material for a carrier tape made of a thermoplastic resin.
  • the present invention it is possible to obtain a cover film in which the peel strength is constant within a predetermined value range, excellent in transparency, and difficult to cause “film breakage” during high-speed peeling.
  • the cover film of the present invention includes at least (A) a base material layer, (B) an adhesive layer, (C) an intermediate layer, and (D) a heat seal layer.
  • An example of the structure of the cover film of the present invention is shown in FIG.
  • a cover film 1 shown in FIG. 1 includes a base material layer 2, an adhesive layer 3, an intermediate layer 4, and a heat seal layer 5.
  • a base material layer 2, an adhesive material layer 3, an intermediate layer 4, and a heat seal layer 5 are laminated in this order.
  • the base material layer is a layer made of biaxially stretched polyester or biaxially stretched nylon, and biaxially stretched polyethylene terephthalate (PET), biaxially stretched polyethylene naphthalate (PEN), or biaxially stretched 6 , 6-nylon or 6-nylon can be used particularly preferably.
  • PET biaxially stretched polyethylene terephthalate
  • PEN biaxially stretched polyethylene naphthalate
  • 6 , 6-nylon or 6-nylon can be used particularly preferably.
  • an antistatic agent for antistatic treatment was applied or kneaded in addition to those commonly used. Can be used, or those subjected to corona treatment or easy adhesion treatment.
  • the base material layer is too thin, the tensile strength of the cover film itself is lowered, so that “breakage of the film” tends to occur when the cover film is peeled off.
  • a thickness of (A) the base material layer of usually 12 ⁇ m to 25 ⁇ m can be suitably used.
  • the adhesive layer is composed of a cured product of a two-component curable adhesive of a main agent and a curing agent, the main agent is a polyester resin, and 50% by mass or more constituting the curing agent is isophorone diisocyanate.
  • isophorone diisocyanate is 60 mass% or more.
  • the upper limit is not particularly limited, and may be 80% by mass or less, 90% by mass or less, or 100% by mass.
  • polyester-based resin examples include polyester-based resins having two or more hydroxyl groups and active hydrogen groups such as amino groups in the molecule, specifically polyester polyols and polyester polyamines.
  • the polyester polyol preferably has a hydroxyl value (mgKOH / g) of 1 to 200 and a number average molecular weight of 1,000 to 50,000.
  • the number average molecular weight here is a value when measured according to JIS K7252.
  • the polyester polyol include a condensation reaction product of a polyhydric hydroxyl group-containing compound and an ester-forming derivative such as a polycarboxylic acid or an anhydride and a lower alkyl (alkyl group having 1 to 4 carbon atoms) ester. .
  • the mass fraction of isophorone diisocyanate used as a curing agent is preferably 4 to 13 mass%, more preferably 5 to 10 mass%, based on the total amount with the polyester resin. By making it 4% by mass or more, it is possible to prevent the adhesive strength between the (A) base material layer and the (C) intermediate layer from becoming insufficient, and by making it 13% by mass or less, suppressing an increase in cost, It can be prevented that the material becomes brittle and the breaking strength decreases.
  • the two-component curable adhesive is preferably used after being diluted in a solvent and then mixed at a predetermined ratio.
  • the dilution solvent is not particularly limited, and water, ethyl acetate, toluene, methyl ethyl ketone, or the like can be used.
  • the (B) adhesive layer is formed by applying a two-component curable adhesive to the (A) substrate layer and then drying it.
  • the thickness after drying (that is, the thickness of the (B) adhesive layer) is preferably 1 ⁇ m to 5 ⁇ m.
  • (C) an intermediate layer is provided on one side of (A) the base material layer via (B) an adhesive layer.
  • LLDPE linear low-density polyethylene
  • the cover film can be used, and in particular, by using a resin having a density in the range of 0.900 ⁇ 10 3 kg / m 3 to 0.925 ⁇ 10 3 kg / m 3 , due to heat and pressure at the time of heat sealing.
  • the intermediate layer resin hardly protrudes from the end. For this reason, not only is it difficult for the iron to become dirty during heat sealing, but the intermediate layer softens when the cover film is heat-sealed, so that the contact spots on the heat-sealing iron are alleviated. Peel strength is easily obtained.
  • the LLDPE includes those polymerized with a Ziegler type catalyst and those polymerized with a metallocene catalyst (hereinafter referred to as m-LLDPE). Since m-LLDPE has a narrow molecular weight distribution, it has particularly high tear strength, and it is particularly preferable to use m-LLDPE as the (B) intermediate layer of the present invention.
  • the above-mentioned m-LLDPE is a copolymer of ethylene with an olefin having 3 or more carbon atoms as a comonomer, preferably a linear, branched or aromatic nucleus substituted with 3 to 18 carbon atoms.
  • linear monoolefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, -Octadecene and the like.
  • branched monoolefin examples include 3-methyl-1-butene, 3-methyl-1-pentene, 4-methyl-1-pentene, 2-ethyl-1-hexene and the like.
  • styrene etc. are mentioned as a monoolefin substituted by the aromatic nucleus.
  • These comonomers can be copolymerized with ethylene singly or in combination of two or more.
  • polyenes such as butadiene, isoprene, 1,3-hexadiene, dicyclopentadiene, and 5-ethylidene-2-norbornene may be copolymerized.
  • the thickness of the intermediate layer is preferably 15 ⁇ m to 25 ⁇ m, more preferably 15 ⁇ m to 20 ⁇ m. (C) If the thickness of the intermediate layer is less than 15 ⁇ m, it may be difficult to obtain the effect of alleviating unevenness of the heat seal iron when the cover film is heat sealed to the carrier tape. On the other hand, if it exceeds 25 ⁇ m, the total thickness of the cover film is so thick that it may be difficult to obtain sufficient peel strength when the cover film is heat-sealed to the carrier tape.
  • (D) Heat seal layer In the cover film of the present invention, (D) a heat seal layer is formed on the surface of (C) the intermediate layer. (D) The resin of the heat seal layer contains (d-1) an olefin resin and (d-2) an antistatic potassium ionomer.
  • olefin-styrene block copolymer examples include hydrogenated styrene-butadiene block copolymer, hydrogenated styrene-isoprene block copolymer, hydrogenated styrene-butadiene-styrene block copolymer, styrene- Examples thereof include hydrogenated products of isoprene-styrene copolymer resin, and one or more selected from these can be used.
  • the hydrogenated styrene-butadiene-styrene block copolymer or ethylene-vinyl acetate is excellent in heat sealability with carrier tapes composed of polystyrene, polycarbonate, polyethylene terephthalate, etc. during heat sealing. Moreover, since it is hard to raise
  • a preferable content ratio of the olefin component is 58% by mass to 70% by mass.
  • the olefin component is less than 58% by mass, since the styrene content is large, the (D) heat seal layer becomes hard, so the variation in peel strength tends to increase, and when it exceeds 82% by mass, the heat sealability is high. It tends to be insufficient.
  • the preferred olefin component ratio is 75% by mass to 84% by mass.
  • the olefin component is less than 75% by mass, the content of vinyl acetate is large, and the adhesiveness of the heat seal layer (D) becomes strong. Therefore, when exposed to a high temperature environment, the carrier tape other than the heat seal location Adhesion may occur. If it exceeds 88% by mass, the heat sealability tends to be insufficient.
  • the olefin-styrene block copolymer and the ethylene-vinyl acetate copolymer may be used in combination.
  • a preferable addition amount is 50 mass% to 70 mass%. If it is less than 50% by mass, the heat seal performance is insufficient, and if it exceeds 90% by mass, the (D) heat seal layer becomes more sticky. In some cases, adhesion to the carrier tape may occur.
  • (D-2) Antistatic Potassium Ionomer (D) To the heat seal layer, (d-2) antistatic potassium ionomer is added in the range of 10% by mass to 40% by mass. (D-2)
  • the antistatic potassium ionomer includes neutralization of some or all of the carboxyl groups of an ethylene copolymer composed of ethylene and an unsaturated carboxylic acid or, optionally, another monomer as potassium. Potassium ionomers. These impart sufficient antistatic properties to the outermost surface on the (D) heat seal layer side of the cover film. Specifically, the ambient temperature is 23 ° C., the ambient humidity is 30% R.D. H.
  • the surface resistance value of the heat seal layer is 10 12 ⁇ or less, preferably 10 11 ⁇ or less.
  • Examples of unsaturated carboxylic acids in such antistatic potassium ionomers include acrylic acid, methacrylic acid, maleic anhydride, monoethyl maleate, etc., depending on other additives contained in the heat seal layer. it can. Among these, acrylic acid or methacrylic acid is particularly preferable from the viewpoint of copolymerization with ethylene. Moreover, as said other monomer which can become a copolymerization component, the vinyl ester mentioned above and unsaturated carboxylic acid ester can be mentioned as a representative example. Such other monomers are contained in the above copolymer in a proportion of, for example, 0 to 30% by mass.
  • the antistatic potassium ionomer is contained in 10 to 40% by mass in the (D) heat seal layer.
  • a preferable addition amount is 10% by mass to 30% by mass. If this component is less than 10% by mass, it is difficult to make the surface resistance value of the (D) heat seal layer 10 12 ⁇ or less, and if it exceeds 40% by mass, the heat sealability of the cover film will be lowered and sufficient. Peel strength may not be obtained.
  • (D-3) Fine particles In order to prevent blocking when the cover film is wound, (d-3) fine particles comprising at least one of organic fine particles and inorganic fine particles ( Hereinafter, it may simply contain (d-3) fine particles).
  • the fine particles include organic fine particles such as spherical or crushed acrylic particles, styrene particles, and silicone particles; inorganic particles such as talc particles, silica particles, mica particles, calcium carbonate, and magnesium carbonate. Fine particles can be added. In particular, acrylic particles and silica particles are less likely to decrease transparency when added, and can be used more suitably.
  • the maximum frequency diameter obtained from the mass distribution curve of the fine particles is preferably 1 ⁇ m to 10 ⁇ m, more preferably 2 ⁇ m to 7 ⁇ m. If the maximum frequency diameter is less than 1 ⁇ m, the antiblocking effect due to the addition of particles may not be sufficiently exhibited. On the other hand, when it exceeds 10 ⁇ m, the blocking prevention effect is good, but a large amount is required to prevent blocking, which causes an increase in cost and is visible on the heat seal layer surface of the cover film. Since the projections and depressions are generated, the appearance of the cover film may be impaired.
  • the maximum frequency diameter based on the mass distribution curve means a maximum frequency diameter obtained by a laser diffraction / scattering method, for example, “LS13320” manufactured by Beckman Coulter.
  • the content of (d-3) fine particles in the heat seal layer is preferably 10% by mass or less, more preferably 5% by mass to 10% by mass. If the addition amount is 10% by mass or less, a balance can be achieved in any of transparency, heat sealability and antiblocking effect.
  • the thickness of the heat seal layer is preferably 5 to 40 ⁇ m, more preferably 7 to 20 ⁇ m.
  • the thickness of the heat seal layer is less than 5 ⁇ m, sufficient peel strength cannot be obtained when heat sealing with the carrier tape, and the film may be cut. If it exceeds 40 ⁇ m, not only will the cost be increased, but the transparency tends to decrease.
  • the cover film of this invention can form (E) 2nd heat seal layer in the outermost surface of (D) heat seal layer located in the other surface of (C) intermediate
  • (D) the heat seal layer can be configured to have (E) a second heat seal layer on the surface opposite to the (B) intermediate layer side.
  • the second heat seal layer is made of a thermoplastic resin.
  • the thermoplastic resin is not particularly limited, but the thermoplastic resin mainly composed of an acrylic resin is extremely excellent in heat sealability with respect to polystyrene, polycarbonate and the like which are materials constituting the carrier tape. preferable.
  • the glass transition temperature of the acrylic resin is preferably 45 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C.
  • the “main component” means that the content of the acrylic resin in the thermoplastic resin is 30% by mass or more, preferably 50% by mass or more.
  • the second heat seal layer may be a layer made of an acrylic resin.
  • acrylic resin constituting the second heat seal layer acrylic acid esters such as methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate , A resin containing 50 mass percent or more of at least one (meth) acrylate component such as methacrylic acid esters such as butyl methacrylate and cyclohexyl methacrylate, and a resin obtained by copolymerizing two or more of these.
  • acrylic acid esters such as methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, propyl methacrylate
  • a resin containing 50 mass percent or more of at least one (meth) acrylate component such as methacrylic acid esters such as butyl methacrylate and cyclohexyl methacrylate,
  • the thickness of the second heat seal layer is preferably 0.1 ⁇ m to 5 ⁇ m, more preferably 0.1 ⁇ m to 3 ⁇ m, and still more preferably 0.1 ⁇ m to 0.5 ⁇ m.
  • the second heat seal layer shows more sufficient peel strength.
  • the thickness of the heat seal layer is 5 ⁇ m or less, an increase in cost is suppressed, and variation in peel strength when peeling the cover film hardly occurs.
  • an inorganic filler for the purpose of imparting anti-blocking and antistatic properties can be added to the second heat seal layer.
  • the inorganic filler is not particularly limited, and can contain, for example, at least one of conductive tin oxide particles, conductive zinc oxide particles, and conductive titanium oxide particles.
  • conductive tin oxide particles, conductive zinc oxide particles, and conductive titanium oxide particles can be spherical or needle-shaped. In particular, when acicular tin oxide doped with antimony is used, a cover film having particularly good antistatic performance can be obtained.
  • the mass fraction of the inorganic filler in the second heat seal layer is 50% by mass to 90% by mass, and preferably 65% by mass to 90% by mass.
  • the addition amount of the conductive particles is less than 50% by mass, there is a possibility that the surface resistance value on the (D) heat seal layer side of the cover film is 10 12 ⁇ or less, and when it exceeds 90% by mass, Since the relative amount of the thermoplastic resin is reduced, it may be difficult to obtain sufficient peel strength by heat sealing.
  • the method for producing the cover film is not particularly limited, and a general method can be used.
  • a two-component curable adhesive composed of a polyester-based resin and isophorone diisocyanate is applied to the surface of the biaxially stretched polyester film of (A) the base material layer, (B) an adhesive layer is formed, and (C) intermediate A resin composition mainly composed of m-LLDPE is extruded from a T-die and coated on the coated surface of the (B) adhesive layer, whereby (A) a base layer and (C) an intermediate layer.
  • a layer film is formed and the adhesive is cured.
  • the target cover film can be obtained by coating the surface of the (C) intermediate layer with the (D) heat seal layer resin extruded from the T-die.
  • the intermediate layer and (D) the film constituting the heat seal layer are each formed by T-die casting method or inflation method, (A) biaxially stretched PET film,
  • the target cover film can also be obtained by a dry laminating method in which each film is bonded through a two-component curable adhesive layer composed of a polyester resin and isophorone diisocyanate.
  • the target cover film can be obtained also by the sand laminating method. That is, (D) a film constituting the heat seal layer is formed by a T-die casting method or an inflation method. Next, a resin composition containing molten m-LLDPE as a main component is supplied between (D) the heat seal layer film and (A) the substrate layer film, and (C) an intermediate layer is formed and laminated. This is a method for obtaining a target cover film. Also in the case of this method, as in the above method, (A) a surface on which the base layer film is laminated is coated with a two-component curable adhesive composed of a polyester resin and isophorone diisocyanate.
  • the cover film of the present invention uses a multi-manifold or a feed block, (C) a resin composition mainly composed of m-LLDPE as an intermediate layer, and (D) a heat seal layer resin.
  • the two-layer film is laminated by coextrusion by an inflation method, etc., and this cover film is laminated by extrusion lamination method on a PET film coated with a two-part curable adhesive layer composed of polyester resin and isophorone diisocyanate. It is preferable to obtain. Further, it is more preferable to laminate this two-layer film by a dry laminating method on a PET film coated with a two-component curable adhesive layer composed of a polyester resin and isophorone diisocyanate.
  • an antistatic treatment can be performed on at least one side of the cover film.
  • an antistatic agent for example, an anionic, cationic, nonionic, or betaine surfactant type antistatic agent, a polymer type antistatic agent, or a conductive material dispersed in a binder, a gravure roll is used. It can be applied by a conventional roll coater, lip coater, spray or the like.
  • the corona discharge treatment or ozone treatment is preferably performed on the film surface before the antistatic treatment, and corona discharge treatment is particularly preferred.
  • the electronic component package of the present invention is a package using the above-described cover film as a cover material for a carrier tape that is a storage container for electronic components.
  • the carrier tape is a belt-like object having a width of about 8 mm to 100 mm having a pocket for storing an electronic component.
  • the material constituting the carrier tape is not particularly limited, and commercially available materials can be used, for example, polystyrene, polyester, polycarbonate, polyvinyl chloride, etc. Can do.
  • an acrylic resin is used for the second heat seal layer, a combination with a carrier tape of polystyrene and polycarbonate is preferably used.
  • Carrier tapes are those in which conductivity is imparted by kneading carbon black or carbon nanotubes into the resin, those in which an antistatic agent or conductive filler is kneaded, or surfactant type antistatic agents or polypyrrole on the surface.
  • an antistatic property can be used by applying a coating liquid in which a conductive material such as polythiophene is dispersed in an organic binder such as acrylic.
  • the packaging body containing the electronic components may include, for example, the cover film as a cover after the electronic components are stored in the electronic component storage portion of the carrier tape, and heat sealing both edges in the longitudinal direction of the cover film. Obtained by packaging and winding on a reel. Electronic parts and the like are stored and transported by packaging in this form.
  • the packaging body containing electronic components etc. is peeled off the cover film intermittently while being transported using a hole called a carrier tape transport sprocket hole provided at the longitudinal edge of the carrier tape, and the component mounting apparatus Thus, the electronic component is taken out while confirming the presence, orientation, and position of the electronic component and mounted on the substrate.
  • B-2 Main agent: LIS-441A (manufactured by Toyo Morton), olefin resin, methyl ethyl ketone solution, solid content concentration 50 mass%
  • B-3 Main agent: Seika Bond A-159 (manufactured by Dainichi Seika Co., Ltd.), polyether resin, ethyl acetate solution, solid content concentration 60% by mass (B-4)
  • Curing agent component in adhesive layer (b-5) Curing agent: LIOSTAR 500H (manufactured by Toyo Morton), isophorone diisocyanate, ethyl acetate solution, solid content concentration 70% by mass (B-6) Curing agent: CAT-CT (manufactured by Toyo Morton), diphenylmethane diisocyanate, ethyl acetate solution, solid content concentration 70% by mass (B-7) Curing agent: CAT-10 (manufactured by Toyo Morton), tolylene diisocyanate, ethyl acetate solution, solid content concentration 75% by mass (B-8) Curing agent: CAT-RT8 (manufactured by Toyo Morton), xylylene diisocyanate, ethyl acetate solution, solid concentration 75% by mass (B-6) Curing agent: CAT-RT8 (manufactured by Toyo Morton), xylylene diisocyanate,
  • Antistatic agent in heat seal layer (d-2-1) Antistatic agent: ENTILA MK440 (Mitsui / DuPont), Potassium ionomer (d-2-2) Antistatic agent: Pelestat HS (Sanyo Kasei) ), Polyether ester amide (d-2-3) antistatic agent: Elest Master HE-110 (manufactured by Kao Corporation), nonionic surfactant master batch (1% by weight of nonionic surfactant, High density polyethylene 99% by mass)
  • Fine particles in heat seal layer (d-3) Fine particles: PEX-ABT-16 (manufactured by Tokyo Ink), talc, silica masterbatch (talc content 5 mass%, silica content 45 mass%, low density polyethylene 50 mass%)
  • Example 1 As a resin constituting the sealant layer (heat seal layer), 50% by mass of styrene-butadiene-styrene triblock copolymer hydrogenated resin (Asahi Kasei Chemicals Co., Ltd., “Tuftec H1041”, olefin component amount 70% by mass) and styrene -Butadiene-styrene triblock copolymer hydrogenated resin (Asahi Kasei Chemicals, "Tuftec H1043”, olefin component amount 33% by mass) 30% by mass, and potassium ionomer (Mitsui DuPont, "MK440”) 20% by mass was pre-blended with a tumbler and kneaded at 200 ° C.
  • styrene-butadiene-styrene triblock copolymer hydrogenated resin Asahi Kasei Chemicals Co., Ltd., “Tuftec H1041”, olefin
  • Examples 2 to 11, Examples 13 to 24, Examples 26 to 40, Comparative Examples 1 to 22 A cover film was produced in the same manner as in Example 1 except that the adhesive layer and the heat seal layer were formed using raw materials such as resins listed in Tables 1 to 5.
  • Example 12 Using the laminated film obtained in Example 4, (D) the surface of the heat seal layer was corona-treated, and then relative to 20% by mass of a random copolymer of styrene-butyl methacrylate [(e-1) resin]. [(E-2) Conductive filler] A carrier tape cover film having conductive performance was obtained by applying a solution of 80% by mass so that the thickness after drying was 0.3 ⁇ m.
  • Example 25 A cover film was produced in the same manner as in Example 12 except that the laminated film obtained in Example 17 was used.
  • a sample having an average peel strength in the range of 0.3N to 0.5N is defined as “excellent”, and a sample having an average peel strength in the range of 0.2N to less than 0.3N and greater than 0.5N to 0.6N And those having an average peel strength other than those described above were indicated as “bad”.
  • the results are shown in the sealability column of Tables 1-5.
  • the cover films of Examples 1 to 40 are cover films used in combination with carrier tapes such as polystyrene and polycarbonate, and are peeled off when the cover film is peeled to take out electronic components.
  • the cover film has a constant strength within a predetermined value range, is excellent in transparency, and is less likely to cause “film breakage” during high-speed peeling.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

　La présente invention concerne un film de revêtement qui présente une résistance au pelage qui reste constante en continu dans une plage de valeurs prescrites pendant le décollement du film de revêtement, et qui possède en outre une transparence exceptionnelle, et qui ne donne pas facilement naissance à une "déchirure de film" pendant un décollement à grande vitesse. Ce film de revêtement comprend au moins (A) une couche de matériau de base, (B) une couche adhésive, (C) une couche intermédiaire, et (D) une couche de thermoscellage contenant une résine thermoscellable. Le constituant principal de la (B) couche adhésive est une résine polyester, et 50 % en masse ou plus de l'agent de durcissement est du diisocyanate d'isophorone. Le (D) couche de thermoscellage comprend (d-1) de 50 à 90 % en masse d'une résine d'oléfine comprenant l'un quelconque ou plusieurs copolymères parmi des copolymères bloc oléfine-styrène qui contiennent de 58 à 82 % en masse d'un composé d'oléfine et des copolymères d'éthylène-acétate de vinyle qui contiennent de 75 à 88 % en masse d'un composé d'oléfine, et (d-2) de 10 à 40 % en masse d'un ionomère de potassium ayant des propriétés anti-statiques.
PCT/JP2015/072403 2014-08-15 2015-08-06 Film de revêtement et encapsulation de composant électronique l'utilisant WO2016024529A1 (fr)

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CN201580043894.5A CN106604816B (zh) 2014-08-15 2015-08-06 覆盖膜及使用其的电子部件包装体
JP2016542558A JP6694387B2 (ja) 2014-08-15 2015-08-06 カバーフィルムおよびそれを用いた電子部品包装体
KR1020177004913A KR102337822B1 (ko) 2014-08-15 2015-08-06 커버 필름 및 이를 이용한 전자 부품 포장체

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WO2018101295A1 (fr) * 2016-12-02 2018-06-07 大日本印刷株式会社 Bande de revêtement électroconductrice transparente
WO2019087999A1 (fr) * 2017-10-31 2019-05-09 デンカ株式会社 Film de recouvrement
WO2020129740A1 (fr) * 2018-12-19 2020-06-25 デンカ株式会社 Film de revêtement et boîtier de composant électronique l'utilisant
WO2021070936A1 (fr) * 2019-10-11 2021-04-15 大日本印刷株式会社 Bande de recouvrement d'emballage de composant électronique, emballage et ensemble d'emballages
JP2021138411A (ja) * 2020-03-05 2021-09-16 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
JP2021155098A (ja) * 2020-03-30 2021-10-07 住友ベークライト株式会社 カバーテープおよび電子部品包装体
US20220242634A1 (en) * 2019-07-11 2022-08-04 Denka Company Limited Cover film and electronic component package using same
WO2023145919A1 (fr) * 2022-01-31 2023-08-03 大日本印刷株式会社 Film hygroscopique et stratifié hygroscopique

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JP6763421B2 (ja) * 2018-09-18 2020-09-30 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP2022013968A (ja) 2018-11-14 2022-01-19 デンカ株式会社 放熱基板を収容するパッケージおよび梱包箱
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WO2018101295A1 (fr) * 2016-12-02 2018-06-07 大日本印刷株式会社 Bande de revêtement électroconductrice transparente
WO2019087999A1 (fr) * 2017-10-31 2019-05-09 デンカ株式会社 Film de recouvrement
JPWO2019087999A1 (ja) * 2017-10-31 2020-11-19 デンカ株式会社 カバーフィルム
US11541645B2 (en) 2017-10-31 2023-01-03 Denka Company Limited Cover film
JP7138651B2 (ja) 2017-10-31 2022-09-16 デンカ株式会社 カバーフィルム
WO2020129740A1 (fr) * 2018-12-19 2020-06-25 デンカ株式会社 Film de revêtement et boîtier de composant électronique l'utilisant
KR20210106420A (ko) 2018-12-19 2021-08-30 덴카 주식회사 커버 필름 및 이것을 사용한 전자 부품 포장체
JP7382346B2 (ja) 2018-12-19 2023-11-16 デンカ株式会社 カバーフィルムおよびそれを用いた電子部品包装体
JPWO2020129740A1 (ja) * 2018-12-19 2021-11-04 デンカ株式会社 カバーフィルムおよびそれを用いた電子部品包装体
US20220242634A1 (en) * 2019-07-11 2022-08-04 Denka Company Limited Cover film and electronic component package using same
JP7446301B2 (ja) 2019-07-11 2024-03-08 デンカ株式会社 カバーフィルム及びそれを用いた電子部品包装体
JP2022024059A (ja) * 2019-10-11 2022-02-08 大日本印刷株式会社 電子部品包装用カバーテープ、包装体、および包装体用セット
CN114502482A (zh) * 2019-10-11 2022-05-13 大日本印刷株式会社 电子部件包装用盖带、包装体和包装体用套组
JPWO2021070936A1 (ja) * 2019-10-11 2021-11-11 大日本印刷株式会社 電子部品包装用カバーテープ、包装体、および包装体用セット
CN114502482B (zh) * 2019-10-11 2023-10-24 大日本印刷株式会社 电子部件包装用盖带、包装体和包装体用套组
WO2021070936A1 (fr) * 2019-10-11 2021-04-15 大日本印刷株式会社 Bande de recouvrement d'emballage de composant électronique, emballage et ensemble d'emballages
JP2021138411A (ja) * 2020-03-05 2021-09-16 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
JP7469914B2 (ja) 2020-03-05 2024-04-17 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体
JP2021155098A (ja) * 2020-03-30 2021-10-07 住友ベークライト株式会社 カバーテープおよび電子部品包装体
JP7289816B2 (ja) 2020-03-30 2023-06-12 住友ベークライト株式会社 カバーテープおよび電子部品包装体
WO2023145919A1 (fr) * 2022-01-31 2023-08-03 大日本印刷株式会社 Film hygroscopique et stratifié hygroscopique

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KR20170044661A (ko) 2017-04-25
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CN106604816B (zh) 2020-07-24
JP6694387B2 (ja) 2020-05-13
TWI659838B (zh) 2019-05-21
TW201613761A (en) 2016-04-16

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