WO2016009939A1 - ハロゲン化スルホニルアルキル基を有するシリコン含有レジスト下層膜形成組成物 - Google Patents
ハロゲン化スルホニルアルキル基を有するシリコン含有レジスト下層膜形成組成物 Download PDFInfo
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- WO2016009939A1 WO2016009939A1 PCT/JP2015/069761 JP2015069761W WO2016009939A1 WO 2016009939 A1 WO2016009939 A1 WO 2016009939A1 JP 2015069761 W JP2015069761 W JP 2015069761W WO 2016009939 A1 WO2016009939 A1 WO 2016009939A1
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- ZDYVRSLAEXCVBX-UHFFFAOYSA-N pyridinium p-toluenesulfonate Chemical compound C1=CC=[NH+]C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1 ZDYVRSLAEXCVBX-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 125000001567 quinoxalinyl group Chemical group N1=C(C=NC2=CC=CC=C12)* 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 235000009518 sodium iodide Nutrition 0.000 description 1
- KAVUKAXLXGRUCD-UHFFFAOYSA-M sodium trifluoromethanesulfinate Chemical compound [Na+].[O-]S(=O)C(F)(F)F KAVUKAXLXGRUCD-UHFFFAOYSA-M 0.000 description 1
- LYPGDCWPTHTUDO-UHFFFAOYSA-M sodium;methanesulfinate Chemical compound [Na+].CS([O-])=O LYPGDCWPTHTUDO-UHFFFAOYSA-M 0.000 description 1
- 229940100515 sorbitan Drugs 0.000 description 1
- 229940035044 sorbitan monolaurate Drugs 0.000 description 1
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 1
- 239000001570 sorbitan monopalmitate Substances 0.000 description 1
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 239000001589 sorbitan tristearate Substances 0.000 description 1
- 235000011078 sorbitan tristearate Nutrition 0.000 description 1
- 229960004129 sorbitan tristearate Drugs 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960004274 stearic acid Drugs 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- SEEPANYCNGTZFQ-UHFFFAOYSA-N sulfadiazine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)NC1=NC=CC=N1 SEEPANYCNGTZFQ-UHFFFAOYSA-N 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- NVQCTSGVFRPZCZ-UHFFFAOYSA-N tert-butyl 3-oxohexaneperoxoate;zirconium Chemical compound [Zr].CCCC(=O)CC(=O)OOC(C)(C)C.CCCC(=O)CC(=O)OOC(C)(C)C NVQCTSGVFRPZCZ-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003866 tertiary ammonium salts Chemical class 0.000 description 1
- 125000005497 tetraalkylphosphonium group Chemical group 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- MCZDHTKJGDCTAE-UHFFFAOYSA-M tetrabutylazanium;acetate Chemical compound CC([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MCZDHTKJGDCTAE-UHFFFAOYSA-M 0.000 description 1
- BRGJIIMZXMWMCC-UHFFFAOYSA-N tetradecan-2-ol Chemical compound CCCCCCCCCCCCC(C)O BRGJIIMZXMWMCC-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- RAOIDOHSFRTOEL-UHFFFAOYSA-N tetrahydrothiophene Chemical compound C1CCSC1 RAOIDOHSFRTOEL-UHFFFAOYSA-N 0.000 description 1
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- MRYQZMHVZZSQRT-UHFFFAOYSA-M tetramethylazanium;acetate Chemical compound CC([O-])=O.C[N+](C)(C)C MRYQZMHVZZSQRT-UHFFFAOYSA-M 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- ZUEKXCXHTXJYAR-UHFFFAOYSA-N tetrapropan-2-yl silicate Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)OC(C)C ZUEKXCXHTXJYAR-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- YZVRVDPMGYFCGL-UHFFFAOYSA-N triacetyloxysilyl acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)OC(C)=O YZVRVDPMGYFCGL-UHFFFAOYSA-N 0.000 description 1
- GYZQBXUDWTVJDF-UHFFFAOYSA-N tributoxy(methyl)silane Chemical compound CCCCO[Si](C)(OCCCC)OCCCC GYZQBXUDWTVJDF-UHFFFAOYSA-N 0.000 description 1
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- PUOCWUHEMWGXIQ-UHFFFAOYSA-N trichloro-(2-methoxy-2-phenylethyl)silane Chemical compound COC(C[Si](Cl)(Cl)Cl)C1=CC=CC=C1 PUOCWUHEMWGXIQ-UHFFFAOYSA-N 0.000 description 1
- YTWFIHFZPSAMFV-UHFFFAOYSA-N trichloro-(2-methoxyphenyl)silane Chemical compound COC1=CC=CC=C1[Si](Cl)(Cl)Cl YTWFIHFZPSAMFV-UHFFFAOYSA-N 0.000 description 1
- SBNVEGJDYHYOSA-UHFFFAOYSA-N trichloro-(2-propan-2-yloxyphenyl)silane Chemical compound CC(C)OC1=CC=CC=C1[Si](Cl)(Cl)Cl SBNVEGJDYHYOSA-UHFFFAOYSA-N 0.000 description 1
- BXYASSFFTRSIGT-UHFFFAOYSA-N trichloro-[(2-methylpropan-2-yl)oxy-phenylmethyl]silane Chemical compound CC(C)(C)OC([Si](Cl)(Cl)Cl)C1=CC=CC=C1 BXYASSFFTRSIGT-UHFFFAOYSA-N 0.000 description 1
- OUMAYXXJSADQBQ-UHFFFAOYSA-N trichloro-[2-[(2-methylpropan-2-yl)oxy]phenyl]silane Chemical compound CC(C)(C)OC1=CC=CC=C1[Si](Cl)(Cl)Cl OUMAYXXJSADQBQ-UHFFFAOYSA-N 0.000 description 1
- ZZARCDHCAFJWJC-UHFFFAOYSA-N trichloro-[ethoxy(phenyl)methyl]silane Chemical compound CCOC([Si](Cl)(Cl)Cl)C1=CC=CC=C1 ZZARCDHCAFJWJC-UHFFFAOYSA-N 0.000 description 1
- SMGOKIYLLQQVJE-UHFFFAOYSA-N trichloro-[methoxy(phenyl)methyl]silane Chemical compound COC([Si](Cl)(Cl)Cl)C1=CC=CC=C1 SMGOKIYLLQQVJE-UHFFFAOYSA-N 0.000 description 1
- UEUXEIHYBASMLX-UHFFFAOYSA-N trichloro-[phenyl(propan-2-yloxy)methyl]silane Chemical compound CC(C)OC([Si](Cl)(Cl)Cl)C1=CC=CC=C1 UEUXEIHYBASMLX-UHFFFAOYSA-N 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- UNKMHLWJZHLPPM-UHFFFAOYSA-N triethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CCO[Si](OCC)(OCC)COCC1CO1 UNKMHLWJZHLPPM-UHFFFAOYSA-N 0.000 description 1
- OHKFEBYBHZXHMM-UHFFFAOYSA-N triethoxy-[1-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)C(CCC)OCC1CO1 OHKFEBYBHZXHMM-UHFFFAOYSA-N 0.000 description 1
- SJQPASOTJGFOMU-UHFFFAOYSA-N triethoxy-[1-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CCO[Si](OCC)(OCC)C(C)OCC1CO1 SJQPASOTJGFOMU-UHFFFAOYSA-N 0.000 description 1
- NFRRMEMOPXUROM-UHFFFAOYSA-N triethoxy-[1-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)C(CC)OCC1CO1 NFRRMEMOPXUROM-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- FVMMYGUCXRZVPJ-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CC(CC)OCC1CO1 FVMMYGUCXRZVPJ-UHFFFAOYSA-N 0.000 description 1
- CFUDQABJYSJIQY-UHFFFAOYSA-N triethoxy-[2-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CC(C)OCC1CO1 CFUDQABJYSJIQY-UHFFFAOYSA-N 0.000 description 1
- NLKPPXKQMJDBFO-UHFFFAOYSA-N triethoxy-[3-(7-oxabicyclo[4.1.0]heptan-4-yl)propyl]silane Chemical compound C1C(CCC[Si](OCC)(OCC)OCC)CCC2OC21 NLKPPXKQMJDBFO-UHFFFAOYSA-N 0.000 description 1
- KPNCYSTUWLXFOE-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCC(C)OCC1CO1 KPNCYSTUWLXFOE-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- PSUKBUSXHYKMLU-UHFFFAOYSA-N triethoxy-[4-(7-oxabicyclo[4.1.0]heptan-4-yl)butyl]silane Chemical compound C1C(CCCC[Si](OCC)(OCC)OCC)CCC2OC21 PSUKBUSXHYKMLU-UHFFFAOYSA-N 0.000 description 1
- GSUGNQKJVLXBHC-UHFFFAOYSA-N triethoxy-[4-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCCOCC1CO1 GSUGNQKJVLXBHC-UHFFFAOYSA-N 0.000 description 1
- CSDVDSUBFYNSMC-UHFFFAOYSA-N triethoxysilylmethyl acetate Chemical compound CCO[Si](OCC)(OCC)COC(C)=O CSDVDSUBFYNSMC-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- JOHWNGGYGAVMGU-UHFFFAOYSA-N trifluorochlorine Chemical compound FCl(F)F JOHWNGGYGAVMGU-UHFFFAOYSA-N 0.000 description 1
- GRGCWBWNLSTIEN-UHFFFAOYSA-N trifluoromethanesulfonyl chloride Chemical compound FC(F)(F)S(Cl)(=O)=O GRGCWBWNLSTIEN-UHFFFAOYSA-N 0.000 description 1
- 125000005951 trifluoromethanesulfonyloxy group Chemical group 0.000 description 1
- LFBULLRGNLZJAF-UHFFFAOYSA-N trimethoxy(oxiran-2-ylmethoxymethyl)silane Chemical compound CO[Si](OC)(OC)COCC1CO1 LFBULLRGNLZJAF-UHFFFAOYSA-N 0.000 description 1
- DAVVOFDYOGMLNQ-UHFFFAOYSA-N trimethoxy-[1-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CO[Si](OC)(OC)C(C)OCC1CO1 DAVVOFDYOGMLNQ-UHFFFAOYSA-N 0.000 description 1
- FNBIAJGPJUOAPB-UHFFFAOYSA-N trimethoxy-[1-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)C(CC)OCC1CO1 FNBIAJGPJUOAPB-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- ZNXDCSVNCSSUNB-UHFFFAOYSA-N trimethoxy-[2-(oxiran-2-ylmethoxy)ethyl]silane Chemical compound CO[Si](OC)(OC)CCOCC1CO1 ZNXDCSVNCSSUNB-UHFFFAOYSA-N 0.000 description 1
- HTVULPNMIHOVRU-UHFFFAOYSA-N trimethoxy-[2-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CC(C)OCC1CO1 HTVULPNMIHOVRU-UHFFFAOYSA-N 0.000 description 1
- DBUFXGVMAMMWSD-UHFFFAOYSA-N trimethoxy-[3-(7-oxabicyclo[4.1.0]heptan-4-yl)propyl]silane Chemical compound C1C(CCC[Si](OC)(OC)OC)CCC2OC21 DBUFXGVMAMMWSD-UHFFFAOYSA-N 0.000 description 1
- ZQPNGHDNBNMPON-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)butyl]silane Chemical compound CO[Si](OC)(OC)CCC(C)OCC1CO1 ZQPNGHDNBNMPON-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- ZFEAYIKULRXTAR-UHFFFAOYSA-M triphenylsulfanium;chloride Chemical compound [Cl-].C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 ZFEAYIKULRXTAR-UHFFFAOYSA-M 0.000 description 1
- NBNZEBUNZGWIRJ-UHFFFAOYSA-N triphenylsulfanium;nitrate Chemical compound [O-][N+]([O-])=O.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 NBNZEBUNZGWIRJ-UHFFFAOYSA-N 0.000 description 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 1
- XMUJIPOFTAHSOK-UHFFFAOYSA-N undecan-2-ol Chemical compound CCCCCCCCCC(C)O XMUJIPOFTAHSOK-UHFFFAOYSA-N 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- G03F7/327—Non-aqueous alkaline compositions, e.g. anhydrous quaternary ammonium salts
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3081—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their composition, e.g. multilayer masks, materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/308—Chemical or electrical treatment, e.g. electrolytic etching using masks
- H01L21/3083—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/3086—Chemical or electrical treatment, e.g. electrolytic etching using masks characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
Definitions
- the present invention relates to a composition for forming a lower layer film between a substrate used for manufacturing a semiconductor device and a resist (for example, a photoresist or an electron beam resist). More specifically, the present invention relates to a resist underlayer film forming composition for lithography for forming an underlayer film used as a lower layer of a photoresist in a lithography process for manufacturing a semiconductor device. Moreover, it is related with the formation method of the resist pattern using the said lower layer film formation composition.
- a film known as a hard mask containing a metal element such as silicon or titanium is used as a lower layer film between the semiconductor substrate and the photoresist.
- the rate of removal by dry etching largely depends on the type of gas used for dry etching. Then, by appropriately selecting the gas type, it is possible to remove the hard mask by dry etching without greatly reducing the thickness of the photoresist.
- Patent Document 1 For example, a resist underlayer film containing polysiloxane using a silane having a sulfone structure has been proposed (see Patent Document 1).
- Patent Document 2 A resist underlayer film containing polysiloxane using a silane having a sulfonamide structure has been proposed (see Patent Document 2).
- Patent Document 3 A resist underlayer film containing polysiloxane using a silane having a sulfone structure and an amine structure has been proposed (see Patent Document 3).
- An object of the present invention is to provide a resist underlayer film forming composition for lithography that can be used in the manufacture of a semiconductor device. Specifically, it is to provide a resist underlayer film forming composition for lithography for forming a resist underlayer film that can be used as a hard mask. Moreover, it is providing the resist underlayer film forming composition for lithography for forming the resist underlayer film which can be used as an antireflection film. Another object of the present invention is to provide a resist underlayer film for lithography that does not cause intermixing with the resist and has a higher dry etching rate than the resist, and a resist underlayer film forming composition for forming the underlayer film.
- the present invention is a resist underlayer film that can form an excellent resist pattern shape when the upper layer resist film is exposed and developed with an alkali developer or an organic solvent, and a rectangular resist pattern can be transferred to the lower layer by subsequent dry etching.
- the present invention provides a resist underlayer film forming composition for forming a film.
- the present invention includes, as a first aspect, hydrolyzable silane as a silane, a hydrolyzate thereof, a hydrolyzate condensate thereof, or a combination thereof, wherein the hydrolyzable silane is represented by the formula (1):
- R 1 is Formula (2):
- R 4 represents an optionally substituted alkylene group having 1 to 10 carbon atoms
- R 5 represents a sulfonyl group or a sulfonamide group
- R 6 represents a halogen-containing organic group.
- R 2 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an organic group having an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, or a cyano group. And bonded to a silicon atom by a Si—C bond.
- R 3 represents an alkoxy group, an acyloxy group, or a halogen group.
- a represents an integer of 1
- b represents an integer of 0 to 2
- a + b represents an integer of 1 to 3.
- the hydrolyzable silane is a combination of a hydrolyzable silane represented by the formula (1) and another hydrolyzable silane, and the other hydrolyzable silane is represented by the formula (3):
- R 7 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyan
- R 8 represents an alkoxy group, an acyloxy group, or a halogen group, and c represents an integer of 0 to 3
- Formula (4) (In the formula (4), R 9 represents an alkyl group and is bonded to a silicon atom through a Si—C bond, R 10 represents an alkoxy group, an acyloxy group, or a halogen group, and Y represents an alkylene group.
- the first aspect or the second is an at least one hydrolyzable silane selected from the group consisting of The resist underlayer film forming composition described in the viewpoint,
- hydrolysis of a hydrolyzable silane comprising a combination of a hydrolyzable silane represented by the formula (1) described in the first aspect and a hydrolyzable silane represented by the formula (3) described in the fourth viewpoint.
- a resist underlayer film-forming composition comprising a decomposition condensate as an underlayer film-forming polymer
- the resist underlayer film forming composition according to any one of the first to fifth aspects further comprising an acid as a hydrolysis catalyst
- the resist underlayer film forming composition according to any one of the first to sixth aspects further containing water
- a resist underlayer film obtained by applying and baking the resist underlayer film forming composition according to any one of the first to seventh aspects on a semiconductor substrate As a ninth aspect, a step of applying the resist underlayer film forming composition according to any one of the first aspect to the seventh aspect on a semiconductor substrate and baking to form a resist underlayer film, on the underlayer film
- a step of applying a resist composition to form a resist film, a step of exposing the resist film, a step of developing the resist film after exposure to obtain a resist pattern, a step of etching the resist underlayer film with the resist pattern, and a patterning A method of manufacturing
- a method for manufacturing a semiconductor device includes a step of etching a lower layer film and a step of processing a semiconductor substrate with a patterned organic lower layer film.
- the resist underlayer film forming composition of the present invention can be used for the production of a semiconductor device by lithography and can function as a hard mask.
- the composition contains a hydrolyzable silane containing a sulfonyl or sulfonamide and a halogen-containing organic group in its skeleton, and an underlayer film formed therefrom is irradiated with light of each wavelength such as KrF, ArF, EUV, EB, and electron beam.
- the contrast of the photoresist can be increased by controlling the resist shape by adjusting the acidity of the lower layer film, which is useful.
- the resist underlayer film comprising the resist underlayer film forming composition of the present invention can also be used as an antireflection film, and does not cause intermixing with the resist and has a higher dry etching rate than the resist. Therefore, the resist underlayer film forming composition of the present invention includes resist underlayer film forming compositions such as ArF and KrF photoresists, resist underlayer film forming compositions such as EUV resists, EUV resist upper layer film forming compositions, and electron beam resists. It can be used for a resist underlayer film forming composition, an electron beam resist upper layer film forming composition, a reverse material forming composition, and the like.
- the present invention is a resist underlayer film forming composition for lithography comprising hydrolyzable silane as a silane, a hydrolyzate thereof, a hydrolyzate condensate thereof, or a combination thereof, wherein the hydrolyzable silane contains formula (1). .
- R 1 represents an organic group represented by the formula (2) and is bonded to a silicon atom by a Si—C bond.
- R 2 represents an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an organic group having an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, an amino group, or a cyano group. And bonded to a silicon atom by a Si—C bond.
- R 3 represents an alkoxy group, an acyloxy group, or a halogen group.
- R 4 represents an optionally substituted alkylene group having 1 to 10 carbon atoms
- R 5 represents a sulfonyl group or a sulfonamide group
- R 6 represents a halogen-containing organic group.
- R 6 in the above formula (2) is preferably a fluorine-containing organic group, and particularly preferably a trifluoromethyl group.
- the silane represented by the formula (1) in all silanes is used in a range of 50 mol% or less, or 0.05 to 50 mol%, 0.1 to 30 mol%, or 0.1 to 10 mol%. it can.
- the resist underlayer film forming composition of the present invention is a hydrolyzable silane represented by the formula (1), or a hydrolyzable silane represented by the formula (1) and other hydrolyzable silanes (for example, represented by the formula (3)). Hydrolyzable silane), its hydrolyzate, or its hydrolysis condensate, and a solvent. As optional components, acid, water, alcohol, curing catalyst, acid generator, other organic polymer, light-absorbing compound, surfactant and the like can be included.
- the solid content in the resist underlayer film forming composition of the present invention is, for example, 0.1 to 50% by mass, or 0.1 to 30% by mass, and 0.1 to 25% by mass.
- the solid content is obtained by removing the solvent component from all the components of the resist underlayer film forming composition.
- the ratio of the hydrolyzable silane, its hydrolyzate, and its hydrolysis condensate in the solid content is 20% by mass or more, for example, 50 to 100% by mass, 60 to 99% by mass, 70 to 99% by mass. It is.
- hydrolyzable silane, its hydrolyzate, and its hydrolysis condensate can also be used as a mixture thereof. It can be used as a condensate obtained by hydrolyzing a hydrolyzable silane and condensing the obtained hydrolyzate.
- a hydrolysis-condensation product a partial hydrolysis product or a silane compound in which hydrolysis is not completely completed are mixed with the hydrolysis-condensation product, and the mixture can also be used.
- This condensate is a polymer having a polysiloxane structure.
- the polysiloxane includes a hydrolyzable silane represented by the formula (1), or a hydrolyzable silane represented by the formula (1) and other hydrolyzable silanes (for example, a hydrolyzable silane represented by the formula (3)).
- Hydrolysis comprising a hydrolyzable silane represented by the formula (1) or a hydrolyzable silane represented by the formula (1) and a hydrolyzable silane represented by the formula (3) on the hydrolysis condensate (polysiloxane)
- a functional silane can be added.
- the alkyl group is a linear or branched alkyl group having 1 to 10 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, or an i-butyl group.
- a cyclic alkyl group can also be used.
- a cyclic alkyl group having 1 to 10 carbon atoms includes a cyclopropyl group, a cyclobutyl group, a 1-methyl-cyclopropyl group, a 2-methyl-cyclopropyl group, a cyclopentyl group, 1-methyl-cyclobutyl group, 2-methyl-cyclobutyl group, 3-methyl-cyclobutyl group, 1,2-dimethyl-cyclopropyl group, 2,3-dimethyl-cyclopropyl group, 1-ethyl-cyclopropyl group, 2 -Ethyl-cyclopropyl group, cyclohexyl group, 1-methyl-cyclopentyl group, 2-methyl-cyclopentyl group, 3-methyl-cyclopentyl group, 1-ethyl-cyclobutyl group, 2-ethyl-cyclobutyl group, 3-ethyl-cyclobutyl Group, 1,2-di
- alkylene group examples include an alkylene group derived from the alkyl group.
- a methyl group includes a methylene group
- an ethyl group includes an ethylene group
- a propyl group includes a propylene group.
- the alkenyl group is an alkenyl group having 2 to 10 carbon atoms, and includes an ethenyl group, 1-propenyl group, 2-propenyl group, 1-methyl-1-ethenyl group, 1-butenyl group, 2-butenyl group, 3 -Butenyl group, 2-methyl-1-propenyl group, 2-methyl-2-propenyl group, 1-ethylethenyl group, 1-methyl-1-propenyl group, 1-methyl-2-propenyl group, 1-pentenyl group, 2-pentenyl group, 3-pentenyl group, 4-pentenyl group, 1-n-propylethenyl group, 1-methyl-1-butenyl group, 1-methyl-2-butenyl group, 1-methyl-3-butenyl group 2-ethyl-2-propenyl, 2-methyl-1-butenyl, 2-methyl-2-butenyl, 2-methyl-3-butenyl, 3-methyl-1-butenyl, 3-methyl Ru-2-buten
- aryl group examples include aryl groups having 6 to 20 carbon atoms, such as a phenyl group, o-methylphenyl group, m-methylphenyl group, p-methylphenyl group, o-chlorophenyl group, m-chlorophenyl.
- organic group having an epoxy group examples include glycidoxymethyl, glycidoxyethyl, glycidoxypropyl, glycidoxybutyl, and epoxycyclohexyl.
- Examples of the organic group having an acryloyl group include acryloylmethyl, acryloylethyl, acryloylpropyl, and the like.
- Examples of the organic group having a methacryloyl group include methacryloylmethyl, methacryloylethyl, and methacryloylpropyl.
- Examples of the organic group having a mercapto group include ethyl mercapto, butyl mercapto, hexyl mercapto, and octyl mercapto.
- Examples of the organic group having an amino group include aminomethyl, aminoethyl, aminopropyl, and the like.
- Examples of the organic group having a cyano group include cyanoethyl and cyanopropyl.
- alkoxy group examples include alkoxy groups having a linear, branched, or cyclic alkyl portion having 1 to 20 carbon atoms, such as a methoxy group, an ethoxy group, an n-propoxy group, an i-propoxy group, and an n-butoxy group.
- Examples of the acyloxy group having 2 to 20 carbon atoms include a methylcarbonyloxy group, an ethylcarbonyloxy group, an n-propylcarbonyloxy group, an i-propylcarbonyloxy group, an n-butylcarbonyloxy group, and an i-butylcarbonyloxy group.
- halogen group and the halogen group part of the halogenated alkyl group or the halogenated aryl group include fluorine, chlorine, bromine, iodine and the like.
- halogen of the halogen-containing organic group examples include fluorine, chlorine, bromine and iodine.
- a halogen-containing organic group bonded to a sulfone group or a sulfonamide group, or a halogen-containing organic group having a salt structure can be used.
- examples of the halogen-containing organic group include an alkyl group substituted with a halogen atom and an organic group containing an alkyl group substituted with a halogen atom.
- alkyl group substituted with a halogen atom examples include a perfluoromethyl group (that is, a trifluoromethyl group), a perfluoroethyl group, a perfluoropropyl group, a perfluorobutyl group, and the like.
- T represents an alkyl group having 1 to 10 carbon atoms such as a methyl group or an ethyl group.
- the hydrolyzable silane is a combination of the hydrolyzable silane represented by the formula (1) and other hydrolyzable silanes, and the other hydrolyzable silanes are derived from the formulas (3) and (4). At least one hydrolyzable silane selected from the group can be used.
- R 7 has an alkyl group, an aryl group, a halogenated alkyl group, a halogenated aryl group, an alkoxyaryl group, an alkenyl group, or an epoxy group, an acryloyl group, a methacryloyl group, a mercapto group, or a cyano group.
- R 8 represents an alkoxy group, an acyloxy group, or a halogen group
- c represents an integer of 0 to 3.
- R 9 represents an alkyl group and is bonded to a silicon atom by a Si—C bond
- R 10 represents an alkoxy group, an acyloxy group, or a halogen group
- Y represents an alkylene group or Represents an arylene group
- d represents an integer of 0 or 1
- e represents an integer of 0 or 1.
- arylene group Organic group having an alkyl group, aryl group, halogenated alkyl group, halogenated aryl group, alkenyl group, or epoxy group, acryloyl group, methacryloyl group, mercapto group, or cyano group, alkoxy group, acyloxy group, halogen group.
- Examples of the silicon-containing compound represented by the formula (3) include tetramethoxysilane, tetrachlorosilane, tetraacetoxysilane, tetraethoxysilane, tetra n-propoxysilane, tetraisopropoxysilane, tetra n-butoxysilane, and methyltrimethoxysilane.
- Methyltrichlorosilane methyltriacetoxysilane, methyltripropoxysilane, methyltributoxysilane, methyltriamyloxysilane, methyltriphenoxysilane, methyltribenzyloxysilane, methyltriphenethyloxysilane, glycidoxymethyltrimethoxysilane Glycidoxymethyltriethoxysilane, ⁇ -glycidoxyethyltrimethoxysilane, ⁇ -glycidoxyethyltriethoxysilane, ⁇ -glycidoxyethyltrimethoxysilane ⁇ -glycidoxyethyltriethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysi
- hydrolyzable silanes can also be used.
- Examples of the silicon-containing compound represented by the formula (4) include methylene bistrimethoxysilane, methylene bistrichlorosilane, methylene bistriacetoxysilane, ethylene bistriethoxysilane, ethylene bistrichlorosilane, ethylene bistriacetoxysilane, propylene bistriethoxysilane, and butylene bistrimethoxysilane.
- hydrolysis condensate polysiloxane
- the hydrolyzable condensate (polyorganosiloxane) of the hydrolyzable silane can obtain a condensate having a weight average molecular weight of 1,000 to 1,000,000, or 1,000 to 100,000. These molecular weights are molecular weights obtained in terms of polystyrene by GPC analysis.
- GPC measurement conditions are, for example, GPC apparatus (trade name HLC-8220 GPC, manufactured by Tosoh Corporation), GPC column (trade names Shodex KF803L, KF802, KF801, Showa Denko), column temperature is 40 ° C., and eluent (elution solvent) Is tetrahydrofuran, the flow rate (flow rate) is 1.0 ml / min, and the standard sample is polystyrene (manufactured by Showa Denko KK).
- hydrolysis of the alkoxysilyl group, acyloxysilyl group, or halogenated silyl group 0.5 to 100 mol, preferably 1 to 10 mol of water is used per mol of the hydrolyzable group. Further, 0.001 to 10 mol, preferably 0.001 to 1 mol of hydrolysis catalyst can be used per mol of the hydrolyzable group.
- the reaction temperature during the hydrolysis and condensation is usually 20 to 80 ° C.
- Hydrolysis may be performed completely or partially. That is, a hydrolyzate or a monomer may remain in the hydrolysis condensate.
- a catalyst can be used in the hydrolysis and condensation.
- the hydrolysis catalyst include metal chelate compounds, organic acids, inorganic acids, organic bases, and inorganic bases.
- Examples of the metal chelate compound as the hydrolysis catalyst include triethoxy mono (acetylacetonato) titanium, tri-n-propoxy mono (acetylacetonato) titanium, tri-i-propoxy mono (acetylacetonato) titanium, tri -N-Butoxy mono (acetylacetonato) titanium, tri-sec-butoxy mono (acetylacetonato) titanium, tri-t-butoxy mono (acetylacetonato) titanium, diethoxy bis (acetylacetonato) titanium , Di-n-propoxy bis (acetylacetonato) titanium, di-i-propoxy bis (acetylacetonato) titanium, di-n-butoxy bis (acetylacetonato) titanium, di-sec-butoxy bis (Acetylacetonate) titanium, di-t Butoxy bis (acetylacetonato) titanium, monoethoxy tris (acetylacetonato) titanium
- Organic acids as hydrolysis catalysts are, for example, acetic acid, propionic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, oxalic acid, maleic acid, methylmalonic acid, adipic acid, sebacin Acid, gallic acid, butyric acid, merit acid, arachidonic acid, 2-ethylhexanoic acid, oleic acid, stearic acid, linoleic acid, linolenic acid, salicylic acid, benzoic acid, p-aminobenzoic acid, p-toluenesulfonic acid, benzenesulfone Examples include acid, monochloroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoroacetic acid, formic acid, malonic acid, sulfonic acid, phthal
- Examples of the inorganic acid as the hydrolysis catalyst include hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, and phosphoric acid.
- Organic bases as hydrolysis catalysts include, for example, pyridine, pyrrole, piperazine, pyrrolidine, piperidine, picoline, trimethylamine, triethylamine, monoethanolamine, diethanolamine, dimethylmonoethanolamine, monomethyldiethanolamine, triethanolamine, diazabicyclooctane, diazine.
- Examples include zabicyclononane, diazabicycloundecene, and tetramethylammonium hydroxide.
- the inorganic base include ammonia, sodium hydroxide, potassium hydroxide, barium hydroxide, calcium hydroxide and the like. Of these catalysts, metal chelate compounds, organic acids, and inorganic acids are preferred, and these may be used alone or in combination of two or more.
- organic solvent used in the hydrolysis examples include n-pentane, i-pentane, n-hexane, i-hexane, n-heptane, i-heptane, 2,2,4-trimethylpentane, n-octane, i- Aliphatic hydrocarbon solvents such as octane, cyclohexane and methylcyclohexane; benzene, toluene, xylene, ethylbenzene, trimethylbenzene, methylethylbenzene, n-propyl benzene, i-propyl benzene, diethylbenzene, i-butylbenzene, triethylbenzene, di -Aromatic hydrocarbon solvents such as i-propyl benzene, n-amyl naphthalene, trimethylbenzene; methanol, ethanol, ethanol
- acetone methyl ethyl ketone, methyl-n-propyl ketone, methyl-n-butyl ketone, diethyl ketone, methyl-i-butyl ketone, methyl-n-pentyl ketone, ethyl-n-butyl ketone, methyl-n-hexyl ketone, di- Ketone solvents such as i-butyl ketone, trimethylnonanone, cyclohexanone, methylcyclohexanone, 2,4-pentanedione, acetonylacetone, diacetone alcohol, acetophenone, and fenchon are preferred from the viewpoint of storage stability of the solution.
- bisphenol S or a bisphenol S derivative can be added as an additive.
- Bisphenol S or a bisphenol S derivative is 0.01 to 20 parts by mass, 0.01 to 10 parts by mass, or 0.01 to 5 parts by mass with respect to 100 parts by mass of the polyorganosiloxane.
- Preferred bisphenol S or bisphenol S derivatives are exemplified below.
- the resist underlayer film forming composition of the present invention can contain a curing catalyst.
- the curing catalyst functions as a curing catalyst when a coating film containing polyorganosiloxane composed of a hydrolysis condensate is heated and cured.
- ammonium salts As the curing catalyst, ammonium salts, phosphines, phosphonium salts, and sulfonium salts can be used.
- ammonium salt the formula (D-1): (Wherein m is an integer of 2 to 11, n is an integer of 2 to 3, R 21 is an alkyl group or an aryl group, and Y A - is an anion.)
- the formula (D-7) (However, R 31 , R 32 , R 33 , and R 34 represent an alkyl group or an aryl group, P represents a phosphorus atom, Y A ⁇ represents an anion, and R 31 , R 32 , R 33 , and R 34 are each linked to a phosphorus atom by a CP bond).
- the formula (D-8) (However, R 35 , R 36 and R 37 represent an alkyl group or an aryl group, S represents a sulfur atom, Y A ⁇ represents an anion, and R 35 , R 36 and R 37 represent C—S, respectively. And a tertiary sulfonium salt which is bonded to a sulfur atom by a bond).
- the compound represented by the formula (D-1) is a quaternary ammonium salt derived from an amine, m represents an integer of 2 to 11, and n represents an integer of 2 to 3.
- R 21 of this quaternary ammonium salt represents an alkyl group having 1 to 18 carbon atoms, preferably 2 to 10 carbon atoms, or an aryl group.
- a linear alkyl group such as an ethyl group, a propyl group, or a butyl group
- Examples include a benzyl group, a cyclohexyl group, a cyclohexylmethyl group, and a dicyclopentadienyl group.
- Anions (Y A ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO ⁇ ), sulfonates (—SO 3 — ). And acid groups such as alcoholate (—O ⁇ ).
- R 22 R 23 R 24 R 25 N + Y A - is a quaternary ammonium salt represented by.
- R 22 , R 23 , R 24 and R 25 are an alkyl group having 1 to 18 carbon atoms, an aryl group, or a silane compound bonded to a silicon atom by a Si—C bond. .
- the anion (Y A ⁇ ) is a halogen ion such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ). And acid groups such as alcoholate (—O ⁇ ).
- This quaternary ammonium salt can be obtained commercially, for example, tetramethylammonium acetate, tetrabutylammonium acetate, triethylbenzylammonium chloride, triethylbenzylammonium bromide, trioctylmethylammonium chloride, tributylbenzyl chloride.
- Examples include ammonium and trimethylbenzylammonium chloride.
- the compound represented by the above formula (D-3) is a quaternary ammonium salt derived from 1-substituted imidazole, and R 26 and R 27 are each an alkyl group having 1 to 18 carbon atoms or an aryl group. It is preferable that the total number of carbon atoms of R 26 and R 27 is 7 or more.
- R 26 can be exemplified by methyl group, ethyl group, propyl group, phenyl group and benzyl group
- R 27 can be exemplified by benzyl group, octyl group and octadecyl group.
- the anion (Y A ⁇ ) is a halogen ion such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ). And acid groups such as alcoholate (—O ⁇ ).
- This compound can be obtained as a commercial product. For example, imidazole compounds such as 1-methylimidazole and 1-benzylimidazole are reacted with alkyl halides and aryl halides such as benzyl bromide and methyl bromide. Can be manufactured.
- the compound represented by the above formula (D-4) is a quaternary ammonium salt derived from pyridine, and R 28 is an alkyl group having 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms, or Examples of the aryl group include a butyl group, an octyl group, a benzyl group, and a lauryl group.
- the anion (Y A ⁇ ) is a halogen ion such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ).
- this compound can be obtained as a commercial product, it is produced, for example, by reacting pyridine with an alkyl halide such as lauryl chloride, benzyl chloride, benzyl bromide, methyl bromide, octyl bromide, or an aryl halide. I can do it. Examples of this compound include N-laurylpyridinium chloride and N-benzylpyridinium bromide.
- the compound represented by the above formula (D-5) is a quaternary ammonium salt derived from a substituted pyridine represented by picoline or the like, and R 29 has 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms.
- R 29 has 1 to 18 carbon atoms, preferably 4 to 18 carbon atoms.
- the alkyl group or aryl group include a methyl group, an octyl group, a lauryl group, and a benzyl group.
- R 30 is an alkyl group having 1 to 18 carbon atoms or an aryl group. For example, in the case of quaternary ammonium derived from picoline, R 30 is a methyl group.
- the anion (Y A ⁇ ) is a halogen ion such as chlorine ion (Cl ⁇ ), bromine ion (Br ⁇ ), iodine ion (I ⁇ ), carboxylate (—COO ⁇ ), sulfonate (—SO 3 ⁇ ). And acid groups such as alcoholate (—O ⁇ ).
- This compound can also be obtained as a commercial product. For example, a substituted pyridine such as picoline is reacted with an alkyl halide such as methyl bromide, octyl bromide, lauryl chloride, benzyl chloride or benzyl bromide, or an aryl halide. Can be manufactured. Examples of this compound include N-benzylpicolinium chloride, N-benzylpicolinium bromide, N-laurylpicolinium chloride and the like.
- the compound represented by the above formula (D-6) is a tertiary ammonium salt derived from an amine, m represents an integer of 2 to 11, and n represents an integer of 2 to 3.
- Anions (Y A ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO ⁇ ), sulfonates (—SO 3 — ). And acid groups such as alcoholate (—O ⁇ ). It can be produced by reacting an amine with a weak acid such as carboxylic acid or phenol. Examples of the carboxylic acid include formic acid and acetic acid.
- the anion (Y A ⁇ ) When formic acid is used, the anion (Y A ⁇ ) is (HCOO ⁇ ), and when acetic acid is used, the anion (Y A ⁇ ) is (CH 3 COO ⁇ ). When phenol is used, the anion (Y A ⁇ ) is (C 6 H 5 O ⁇ ).
- the compound represented by the above formula (D-7) is a quaternary phosphonium salt having a structure of R 31 R 32 R 33 R 34 P + Y A — .
- R 31 , R 32 , R 33 , and R 34 are an alkyl group having 1 to 18 carbon atoms, an aryl group, or a silane compound bonded to a silicon atom by a Si—C bond, and preferably R 31 or three among the four substituents of R 34 is a phenyl group or substituted phenyl group, for example, can be exemplified a phenyl group or a tolyl group, also remaining one of 1 to 18 carbon atoms A silane compound bonded to a silicon atom through an alkyl group, an aryl group, or a Si—C bond.
- Anions (Y A ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO ⁇ ), sulfonates (—SO 3 — ). And acid groups such as alcoholate (—O ⁇ ).
- This compound can be obtained as a commercial product, for example, a halogenated tetraalkylphosphonium such as tetra-n-butylphosphonium halide, tetra-n-propylphosphonium halide, or a trialkylbenzyl halide such as triethylbenzylphosphonium halide.
- Triphenylmonoalkylphosphonium halides such as phosphonium, triphenylmethylphosphonium halide, triphenylethylphosphonium halide, triphenylbenzylphosphonium halide, tetraphenylphosphonium halide, tritolylmonoarylphosphonium halide, or tritolyl monohalogenate Examples thereof include alkylphosphonium (the halogen atom is a chlorine atom or a bromine atom).
- halogens such as triphenylmonoalkylphosphonium halides such as triphenylmethylphosphonium halide, triphenylethylphosphonium halide, triphenylmonoarylphosphonium halides such as triphenylbenzylphosphonium halide, and halogens such as tritolylmonophenylphosphonium halide.
- Preferred is a tolylyl monoarylphosphonium halide, or a tolyl monoalkylphosphonium halide such as a tolyl monomethylphosphonium halide (the halogen atom is a chlorine atom or a bromine atom).
- the phosphines include methylphosphine, ethylphosphine, propylphosphine, isopropylphosphine, isobutylphosphine, phenylphosphine and the like first phosphine, dimethylphosphine, diethylphosphine, diisopropylphosphine, diisoamylphosphine, diphenylphosphine and the like.
- tertiary phosphines such as trimethylphosphine, triethylphosphine, triphenylphosphine, methyldiphenylphosphine, and dimethylphenylphosphine.
- R 35 R 36 R 37 S + Y A - is a tertiary sulfonium salt having a structure.
- R 35 , R 36 , and R 37 are each an alkyl group or aryl group having 1 to 18 carbon atoms, or a silane compound that is bonded to a silicon atom through a Si—C bond, preferably R 35 to R 37 .
- three are phenyl groups or substituted phenyl groups, and examples thereof include phenyl groups and tolyl groups, and the remaining one is an alkyl group having 1 to 18 carbon atoms, or An aryl group.
- Anions (Y A ⁇ ) include halogen ions such as chlorine ions (Cl ⁇ ), bromine ions (Br ⁇ ), iodine ions (I ⁇ ), carboxylates (—COO ⁇ ), sulfonates (—SO 3 — ). ), Alcoholate (—O ⁇ ), maleate anion, nitrate anion and the like. This compound is available as a commercial product.
- halogenated tetraalkylsulfonium such as tri-n-butylsulfonium halide and tri-n-propylsulfonium halide
- trialkylbenzyl halide such as diethylbenzylsulfonium halide.
- Halogenated diphenylmonoalkylsulfonium such as sulfonium, halogenated diphenylmethylsulfonium, halogenated diphenylethylsulfonium, halogenated triphenylsulfonium, (halogen atom is chlorine or bromine atom), tri-n-butylsulfonium carboxylate, tri-n- Tetraalkylphosphonium carboxylates such as propylsulfonium carboxylate and trialkylbenzines such as diethylbenzylsulfonium carboxylate Sulfonium carboxylate, diphenylmethyl sulfonium carboxylate, diphenyl monoalkyl sulfonium carboxylate, triphenylsulfonium carboxylate such as diphenylethyl sulfonium carboxylate. Further, triphenylsulfonium halide and triphenylsulfonium carboxylate can
- a nitrogen-containing silane compound can be added as a curing catalyst.
- the nitrogen-containing silane compound include imidazole ring-containing silane compounds such as N- (3-triethoxysilylpropyl) -4,5-dihydroimidazole.
- the curing catalyst is 0.01 to 10 parts by mass, 0.01 to 5 parts by mass, or 0.01 to 3 parts by mass with respect to 100 parts by mass of the polyorganosiloxane.
- Hydrolyzable silane is hydrolyzed using a catalyst in a solvent to condense, and the resulting hydrolyzed condensate (polymer) simultaneously removes by-product alcohol, used hydrolysis catalyst, and water by distillation under reduced pressure. be able to.
- the acid and base catalyst used for hydrolysis can be removed by neutralization or ion exchange.
- an organic acid, water, alcohol, or a combination thereof can be added to the resist underlayer film forming composition containing the hydrolysis condensate for stabilization. .
- organic acid examples include oxalic acid, malonic acid, methylmalonic acid, succinic acid, maleic acid, malic acid, tartaric acid, phthalic acid, citric acid, glutaric acid, citric acid, lactic acid, and salicylic acid. Of these, oxalic acid and maleic acid are preferred.
- the organic acid to be added is 0.1 to 5.0 parts by mass with respect to 100 parts by mass of the condensate (polyorganosiloxane).
- pure water, ultrapure water, ion exchange water, etc. can be used for the water to add, and the addition amount can be 1-20 mass parts with respect to 100 mass parts of resist underlayer film forming compositions.
- alcohol to add what is easy to be scattered by the heating after application
- coating is preferable, for example, methanol, ethanol, propanol, isopropanol, a butanol etc. are mentioned.
- the added alcohol can be 1 to 20 parts by mass with respect to 100 parts by mass of the resist underlayer film forming composition.
- the underlayer film forming composition for lithography of the present invention can contain an organic polymer compound, a photoacid generator, a surfactant, and the like as necessary in addition to the above components.
- the dry etching rate (thickness reduction per unit time), attenuation coefficient, refractive index, etc. of the resist underlayer film formed from the underlayer film forming composition for lithography of the present invention are adjusted. can do.
- an organic polymer compound A various organic polymer can be used.
- Polycondensation polymers and addition polymerization polymers can be used.
- Addition polymerization polymers and condensation polymerization polymers such as polyester, polystyrene, polyimide, acrylic polymer, methacrylic polymer, polyvinyl ether, phenol novolak, naphthol novolak, polyether, polyamide, and polycarbonate can be used.
- An organic polymer having an aromatic ring structure such as a benzene ring, a naphthalene ring, an anthracene ring, a triazine ring, a quinoline ring, and a quinoxaline ring that functions as a light absorption site is preferably used.
- organic polymer compounds include addition polymerizable monomers such as benzyl acrylate, benzyl methacrylate, phenyl acrylate, naphthyl acrylate, anthryl methacrylate, anthryl methyl methacrylate, styrene, hydroxystyrene, benzyl vinyl ether, and N-phenylmaleimide.
- addition-polymerized polymers containing as a structural unit, and polycondensation polymers such as phenol novolac and naphthol novolak.
- the polymer compound When an addition polymerization polymer is used as the organic polymer compound, the polymer compound may be a homopolymer or a copolymer.
- An addition polymerizable monomer is used for the production of the addition polymerization polymer.
- examples of such addition polymerizable monomers include acrylic acid, methacrylic acid, acrylic ester compounds, methacrylic ester compounds, acrylamide compounds, methacrylamide compounds, vinyl compounds, styrene compounds, maleimide compounds, maleic anhydride, acrylonitrile and the like. It is done.
- acrylic ester compounds include methyl acrylate, ethyl acrylate, normal hexyl acrylate, isopropyl acrylate, cyclohexyl acrylate, benzyl acrylate, phenyl acrylate, anthryl methyl acrylate, 2-hydroxyethyl acrylate, 3-chloro-2-hydroxypropyl acrylate, 2-hydroxypropyl acrylate, 2,2,2-trifluoroethyl acrylate, 2,2,2-trichloroethyl acrylate, 2-bromoethyl acrylate, 4-hydroxybutyl acrylate, 2-methoxyethyl acrylate, tetrahydrofurfuryl acrylate, 2-Methyl-2-adamantyl acrylate, 5-acryloyloxy-6-hydroxynorbornene-2-carboxy Examples thereof include silic-6-lactone, 3-acryloxypropyltriethoxysilane, and glycidyl acryl
- Methacrylic acid ester compounds include methyl methacrylate, ethyl methacrylate, normal hexyl methacrylate, isopropyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, phenyl methacrylate, anthryl methyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, 2,2, 2-trifluoroethyl methacrylate, 2,2,2-trichloroethyl methacrylate, 2-bromoethyl methacrylate, 4-hydroxybutyl methacrylate, 2-methoxyethyl methacrylate, tetrahydrofurfuryl methacrylate, 2-methyl-2-adamantyl methacrylate, 5 -Methacryloyloxy-6-hydroxynorbornene-2-carboxyl Examples include ku-6-lactone, 3-methacryloxypropyltriethoxysilane,
- acrylamide compound examples include acrylamide, N-methylacrylamide, N-ethylacrylamide, N-benzylacrylamide, N-phenylacrylamide, N, N-dimethylacrylamide and N-anthrylacrylamide.
- methacrylamide compounds include methacrylamide, N-methyl methacrylamide, N-ethyl methacrylamide, N-benzyl methacrylamide, N-phenyl methacrylamide, N, N-dimethyl methacrylamide and N-anthryl acrylamide. .
- vinyl compounds include vinyl alcohol, 2-hydroxyethyl vinyl ether, methyl vinyl ether, ethyl vinyl ether, benzyl vinyl ether, vinyl acetic acid, vinyl trimethoxysilane, 2-chloroethyl vinyl ether, 2-methoxyethyl vinyl ether, vinyl naphthalene, and vinyl anthracene. Can be mentioned.
- styrene compound examples include styrene, hydroxystyrene, chlorostyrene, bromostyrene, methoxystyrene, cyanostyrene, and acetylstyrene.
- maleimide compounds include maleimide, N-methylmaleimide, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide and N-hydroxyethylmaleimide.
- examples of such a polymer include a polycondensation polymer of a glycol compound and a dicarboxylic acid compound.
- examples of the glycol compound include diethylene glycol, hexamethylene glycol, butylene glycol and the like.
- examples of the dicarboxylic acid compound include succinic acid, adipic acid, terephthalic acid, maleic anhydride and the like.
- examples thereof include polyesters such as polypyromellitimide, poly (p-phenylene terephthalamide), polybutylene terephthalate, polyethylene terephthalate, polyamide, and polyimide.
- the organic polymer compound contains a hydroxyl group
- this hydroxyl group can form a crosslinking reaction with the polyorganosiloxane.
- a polymer compound having a weight average molecular weight of, for example, 1,000 to 1,000,000, 3,000 to 300,000, 5,000 to 200,000, or 10,000 to 100,000 can be used. Only one organic polymer compound can be used, or two or more organic polymer compounds can be used in combination.
- the proportion thereof is 1 to 200 parts by mass, 5 to 100 parts by mass, or 10 to 50 parts by mass, or 20 with respect to 100 parts by mass of the condensate (polyorganosiloxane). Thru
- the resist underlayer film forming composition of the present invention may contain an acid generator.
- the acid generator include a thermal acid generator and a photoacid generator.
- the photoacid generator generates an acid upon exposure of the resist. Therefore, the acidity of the lower layer film can be adjusted. This is a method for matching the acidity of the lower layer film with the acidity of the upper layer resist. Further, the pattern shape of the resist formed in the upper layer can be adjusted by adjusting the acidity of the lower layer film.
- Examples of the photoacid generator contained in the resist underlayer film forming composition of the present invention include onium salt compounds, sulfonimide compounds, and disulfonyldiazomethane compounds.
- onium salt compounds include diphenyliodonium hexafluorophosphate, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium nonafluoronormalbutanesulfonate, diphenyliodonium perfluoronormaloctanesulfonate, diphenyliodoniumcamphorsulfonate, bis (4-tert-butylphenyl) iodoniumcamphor.
- Iodonium salt compounds such as sulfonate and bis (4-tert-butylphenyl) iodonium trifluoromethanesulfonate, and triphenylsulfonium hexafluoroantimonate, triphenylsulfonium nonafluoronormal butanesulfonate, triphenylsulfonium camphorsulfonate, and triphenyls Sulfonium salt compounds such as phosphonium trifluoromethanesulfonate, and the like.
- sulfonimide compounds include N- (trifluoromethanesulfonyloxy) succinimide, N- (nonafluoronormalbutanesulfonyloxy) succinimide, N- (camphorsulfonyloxy) succinimide and N- (trifluoromethanesulfonyloxy) naphthalimide. Can be mentioned.
- disulfonyldiazomethane compound examples include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, and bis (2,4-dimethylbenzenesulfonyl). And diazomethane, and methylsulfonyl-p-toluenesulfonyldiazomethane.
- a photo-acid generator can use only 1 type, or can be used in combination of 2 or more type.
- the ratio is 0.01 to 15 parts by mass, or 0.1 to 10 parts by mass, or 0.5 with respect to 100 parts by mass of the condensate (polyorganosiloxane). Thru
- the surfactant is effective in suppressing the occurrence of pinholes and installations when the resist underlayer film forming composition for lithography of the present invention is applied to a substrate.
- Examples of the surfactant contained in the resist underlayer film forming composition of the present invention include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetyl ether, and polyoxyethylene oleyl ether.
- Polyoxyethylene alkyl allyl ethers such as polyoxyethylene octylphenol ether and polyoxyethylene nonylphenol ether, polyoxyethylene / polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan monopalmitate, sorbitan monostearate, sorbitan Sorbitan fatty acid esters such as monooleate, sorbitan trioleate, sorbitan tristearate, polyoxyethylene Nonionic surfactants such as polyoxyethylene sorbitan fatty acid esters such as bitane monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan trioleate, polyoxyethylene sorbitan tristearate Agents, trade names F-top EF301, EF303, EF352 (manufactured by Tochem Products Co., Ltd.), trade names MegaFuck F171, F173, R-08, R-30, R-30N, R
- surfactants may be used alone or in combination of two or more.
- the ratio is 0.0001 to 5 parts by mass, or 0.001 to 1 part by mass, or 0.01 to 1 with respect to 100 parts by mass of the condensate (polyorganosiloxane). Part by mass.
- a rheology adjusting agent, an adhesion aid and the like can be added to the resist underlayer film forming composition of the present invention.
- the rheology modifier is effective for improving the fluidity of the underlayer film forming composition.
- the adhesion aid is effective for improving the adhesion between the semiconductor substrate or resist and the lower layer film.
- any solvent can be used without particular limitation as long as it can dissolve the solid content.
- solvents include methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, methyl isobutyl carbinol, propylene glycol monobutyl ether, propylene glycol monomethyl ether acetate, propylene glycol mono Ether ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, toluene, xylene, methyl ethyl ketone, cyclopentanone, cyclohexanone, ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate , Ethyl
- a resist underlayer film is formed on a substrate by a coating method, or a resist underlayer film is formed thereon via an organic underlayer film on the substrate, and the resist underlayer film A resist film (for example, a photoresist or an electron beam resist) is formed thereon.
- a resist pattern is formed by exposure and development, and the resist underlayer film is dry-etched using the resist pattern to transfer the pattern, and the substrate is processed by the pattern, or the organic underlayer film is etched by pattern transfer. Then, the substrate is processed with the organic underlayer film.
- the resist film thickness tends to be thin to prevent pattern collapse.
- the resist underlayer film (containing an inorganic silicon compound) of the present invention is coated on the substrate with or without an organic underlayer film, and a resist film (organic resist) is formed thereon.
- the organic component film and the inorganic component film differ greatly in the dry etching rate depending on the selection of the etching gas.
- the organic component film has an oxygen-based gas and the dry etching rate increases.
- the inorganic component film has a halogen-containing gas. This increases the dry etching rate.
- a resist pattern is formed, and the resist underlayer film of the present invention existing under the resist pattern is dry-etched with a halogen-containing gas to transfer the resist pattern to the resist underlayer film, and the resist pattern transferred to the resist underlayer film
- the substrate is processed using a halogen-containing gas.
- dry etching the organic underlayer film with an oxygen-based gas to transfer the resist pattern to the organic underlayer film, and the resist pattern is transferred.
- the substrate is processed using a halogen-containing gas with the organic underlayer film.
- the resist underlayer film forming composition of the present invention is applied by an appropriate application method such as a spinner or a coater, and then baked to form a resist underlayer film.
- the conditions for firing are appropriately selected from firing temperatures of 80 ° C. to 250 ° C. and firing times of 0.3 to 60 minutes.
- the firing temperature is 150 ° C. to 250 ° C.
- the firing time is 0.5 to 2 minutes.
- the thickness of the formed lower layer film is, for example, 10 to 1000 nm, 20 to 500 nm, 50 to 300 nm, or 100 to 200 nm.
- a photoresist layer for example, is formed on the resist underlayer film. Formation of the photoresist layer can be performed by a well-known method, that is, by applying a photoresist composition solution onto the lower layer film and baking.
- the film thickness of the photoresist is, for example, 50 to 10,000 nm, 100 to 2000 nm, or 200 to 1000 nm.
- the resist underlayer film of the present invention can be formed thereon, and a photoresist can be further coated thereon.
- the substrate can be processed by selecting an appropriate etching gas.
- an appropriate etching gas For example, it is possible to process the resist underlayer film of the present invention using a fluorine-based gas that has a sufficiently high etching rate for photoresist as an etching gas, and a sufficiently high etching rate for the resist underlayer film of the present invention.
- the organic underlayer film can be processed using an oxygen-based gas as an etching gas, and the substrate can be processed using a fluorine-based gas that provides a sufficiently high etching rate for the organic underlayer film as an etching gas.
- the photoresist formed on the resist underlayer film of the present invention is not particularly limited as long as it is sensitive to light used for exposure. Either a negative photoresist or a positive photoresist can be used.
- a positive photoresist comprising a novolac resin and 1,2-naphthoquinonediazide sulfonic acid ester, a chemically amplified photoresist comprising a binder having a group that decomposes with an acid to increase the alkali dissolution rate and a photoacid generator, an acid
- a chemically amplified photoresist comprising a low-molecular compound that decomposes to increase the alkali dissolution rate of the photoresist, an alkali-soluble binder, and a photoacid generator, and a binder having a group that decomposes with an acid to increase the alkali dissolution rate
- a chemically amplified photoresist composed of a low molecular weight compound that de
- Examples include trade name APEX-E manufactured by Shipley, trade name PAR710 manufactured by Sumitomo Chemical Co., Ltd., and trade name SEPR430 manufactured by Shin-Etsu Chemical Co., Ltd. Also, for example, Proc. SPIE, Vol. 3999, 330-334 (2000), Proc. SPIE, Vol. 3999, 357-364 (2000), Proc. SPIE, Vol. 3999, 365-374 (2000), and fluorine-containing polymer-based photoresists.
- a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), an F2 excimer laser (wavelength 157 nm), or the like can be used.
- post-exposure bake can be performed as necessary.
- the post-exposure heating is performed under conditions appropriately selected from a heating temperature of 70 ° C. to 150 ° C. and a heating time of 0.3 to 10 minutes.
- a resist for electron beam lithography or a resist for EUV lithography can be used instead of a photoresist as a resist.
- the electron beam resist either a negative type or a positive type can be used.
- Chemically amplified resist comprising a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate, a low molecular weight compound that decomposes with an alkali-soluble binder, an acid generator and an acid to change the alkali dissolution rate of the resist
- a chemically amplified resist comprising: a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate; and a chemically amplified resist comprising a low-molecular compound that decomposes with an acid to change the alkali dissolution rate of the resist,
- non-chemically amplified resists composed of a binder having a group that changes the alkali dissolution rate by being
- EUV resist a methacrylate resin resist, a methacrylate-polyhydroxystyrene hybrid resin resist, and a polyhydroxystyrene resin resist can be used.
- EUV resist either a negative type or a positive type can be used.
- Chemically amplified resist comprising a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate, a low molecular weight compound that decomposes with an alkali-soluble binder, an acid generator and an acid to change the alkali dissolution rate of the resist
- a chemically amplified resist comprising: a binder having a group that decomposes with an acid generator and an acid to change the alkali dissolution rate; and a chemically amplified resist comprising a low-molecular compound that decomposes with an acid to change the alkali dissolution rate of the resist,
- a non-chemically amplified resist composed of a binder having a group that is decomposed by EUV light to change the alkali dissolution rate
- a non-chemically amplified resist composed of a binder having a portion that is cut by EUV light to change the alkali dissolution rate.
- developer for example, an alkali developer
- Developers include aqueous solutions of alkali metal hydroxides such as potassium hydroxide and sodium hydroxide, aqueous solutions of quaternary ammonium hydroxides such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline, ethanolamine, propylamine, An alkaline aqueous solution such as an aqueous amine solution such as ethylenediamine can be mentioned as an example. Further, a surfactant or the like can be added to these developers.
- the development conditions are appropriately selected from a temperature of 5 to 50 ° C. and a time of 10 to 600 seconds.
- an organic solvent can be used as a developer. After the exposure, development is performed with a developer (solvent). As a result, for example, when a positive photoresist is used, the unexposed portion of the photoresist is removed, and a photoresist pattern is formed.
- Developers include, for example, methyl acetate, butyl acetate, ethyl acetate, isopropyl acetate, amyl acetate, isoamyl acetate, ethyl methoxyacetate, ethyl ethoxy acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl Ether acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monophenyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monophenyl ether acetate, diethylene glycol monobutyl ether acetate, 2-methoxybutyl acetate Tate, 3-methoxybutyl acetate, 4-methoxybutyl acetate, 3-methyl
- the resist underlayer film (intermediate layer) of the present invention is removed using the photoresist (upper layer) pattern thus formed as a protective film, and then the patterned photoresist and the resist underlayer film of the present invention are removed.
- the organic underlayer film (lower layer) is removed using the film made of (intermediate layer) as a protective film.
- the semiconductor substrate is processed using the patterned resist underlayer film (intermediate layer) and organic underlayer film (lower layer) of the present invention as a protective film.
- the resist underlayer film (intermediate layer) of the present invention in a portion where the photoresist has been removed is removed by dry etching to expose the semiconductor substrate.
- dry etching of the resist underlayer film of the present invention tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), perfluoropropane (C 3 F 8 ), trifluoromethane, carbon monoxide, argon, oxygen, Gases such as nitrogen, sulfur hexafluoride, difluoromethane, nitrogen trifluoride and chlorine trifluoride, chlorine, trichloroborane and dichloroborane can be used.
- a halogen-based gas for dry etching of the resist underlayer film.
- a photoresist made of an organic substance is basically difficult to remove.
- the resist underlayer film of the present invention containing a large amount of silicon atoms is quickly removed by the halogen-based gas. Therefore, it is possible to suppress a decrease in the thickness of the photoresist accompanying dry etching of the resist underlayer film. As a result, the photoresist can be used as a thin film.
- the dry etching of the resist underlayer film is preferably performed using a fluorine-based gas.
- fluorine-based gas examples include tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), and perfluoropropane (C 3 F 8 ). , Trifluoromethane, and difluoromethane (CH 2 F 2 ).
- the organic underlayer film is removed using the patterned photoresist and the film made of the resist underlayer film of the present invention as a protective film.
- the organic underlayer film (underlayer) is preferably formed by dry etching with an oxygen-based gas. This is because the resist underlayer film of the present invention containing a large amount of silicon atoms is difficult to remove by dry etching with an oxygen-based gas.
- the processing of the semiconductor substrate is preferably performed by dry etching with a fluorine-based gas.
- fluorine-based gas examples include tetrafluoromethane (CF 4 ), perfluorocyclobutane (C 4 F 8 ), perfluoropropane (C 3 F 8 ), trifluoromethane, and difluoromethane (CH 2 F 2 ). Can be mentioned.
- an organic antireflection film can be formed on the resist underlayer film of the present invention before the formation of the photoresist.
- the antireflective coating composition used there is not particularly limited, and can be arbitrarily selected from those conventionally used in the lithography process, and can be used by a conventional method such as a spinner.
- the antireflection film can be formed by coating and baking with a coater.
- the substrate to which the resist underlayer film forming composition of the present invention is applied may have an organic or inorganic antireflection film formed on its surface by a CVD method or the like.
- a resist underlayer film can also be formed from the resist underlayer film forming composition of the invention.
- the resist underlayer film functions as a hard mask, and the acidity of the underlayer film must be adjusted to control the resist shape in any development process of any generation of lithography.
- the hydrolyzable silane skeleton incorporated in the composition of the present invention so as to generate an acid upon irradiation with light of each wavelength such as KrF, ArF, EUV, EB, and electron beam makes the contrast of the photoresist more. It can be increased and is considered useful.
- a trifluoromethanesulfone skeleton it is possible to generate an acid and a base characteristically in EUV exposure, and it is possible to improve pattern resolution.
- the resist underlayer film formed from the resist underlayer film forming composition of the present invention may also absorb light depending on the wavelength of light used in the lithography process. In such a case, it can function as an antireflection film having an effect of preventing reflected light from the substrate. Further, the underlayer film formed from the resist underlayer film forming composition of the present invention includes a layer for preventing the interaction between the substrate and the photoresist, a material used for the photoresist, or a substance generated upon exposure to the photoresist.
- a layer having a function of preventing adverse effects on the substrate a layer having a function of preventing diffusion of a substance generated from the substrate upon heating and baking into the upper layer photoresist, and a poisoning effect of the photoresist layer by the semiconductor substrate dielectric layer It can also be used as a barrier layer or the like for decreasing.
- the EUV resist underlayer film can be used for the following purposes. Without intermixing with the EUV resist, it is possible to prevent reflection of unwanted exposure light such as UV and DUV (ArF light, KrF light) from the substrate or interface during EUV exposure (wavelength 13.5 nm).
- the resist underlayer film forming composition can be used as a resist underlayer antireflection film. Reflection can be efficiently prevented in the lower layer of the EUV resist.
- the process can be performed in the same manner as the photoresist underlayer film.
- the resist underlayer film formed from the resist underlayer film forming composition is applied to a substrate on which via holes used in the dual damascene process are formed, and can be used as a filling material that can fill the holes without gaps. Moreover, it can also be used as a planarizing material for planarizing the surface of an uneven semiconductor substrate.
- the reaction solution was separated with toluene and water, and then the toluene was removed with an evaporator to obtain a crude product.
- the crude product was distilled under reduced pressure to obtain the target compound 1 (trifluoromethanesulfonylpropyltriethoxysilane).
- Synthesis example 1 24.82 g (70 mol%) of tetraethoxysilane, 1.69 g (5 mol%) of phenyltrimethoxysilane, 6.07 g (20 mol%) of methyltriethoxysilane, 2.89 g (5 mol%) of trifluoromethanesulfonylpropyltriethoxysilane, 53.19 g of acetone was placed in a 300 ml flask, and 11.35 g of 0.01 mol / l hydrochloric acid was added dropwise to the mixed solution while stirring the mixed solution with a magnetic stirrer. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C.
- reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation.
- a product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-1), and the weight average molecular weight by GPC was Mw 1800 in terms of polystyrene.
- Synthesis example 2 Tetraethoxysilane 25.91 g (70 mol%), methyltriethoxysilane 6.34 g (20 mol%), trifluoromethanesulfonylpropyltriethoxysilane 3.00 g (5 mol%), 4-methoxybenzyltrimethoxysilane 2.15 g (5 mol) %) And 52.89 g of acetone were put into a 300 ml flask, and 11.85 g of 0.01 mol / l hydrochloric acid was added dropwise to the mixed solution while stirring the mixed solution with a magnetic stirrer. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C.
- reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation.
- a product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-2), and the weight average molecular weight by GPC was Mw 1600 in terms of polystyrene.
- Synthesis example 3 24.32 g (70 mol%) of tetraethoxysilane, 1.65 g (5 mol%) of phenyltrimethoxysilane, 3.87 g (13 mol%) of methyltriethoxysilane, 2.82 g (5 mol%) of trifluoromethanesulfonylpropyltriethoxysilane, 4-Methoxybenzyltrimethoxysilane 0.81 g (2 mol%), phenylsulfonylpropyltriethoxysilane 2.89 g (5 mol%) and acetone 53.33 g were placed in a 300 ml flask, and the mixed solution was stirred with a magnetic stirrer.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-3), and the weight average molecular weight by GPC was Mw 1800 in terms of polystyrene.
- Synthesis example 4 23.42 g (70 mol%) of tetraethoxysilane, 1.59 g (5 mol%) of phenyltrimethoxysilane, 2.29 g (8 mol%) of methyltriethoxysilane, 2.71 g (5 mol%) of trifluoromethanesulfonylpropyltriethoxysilane, 4-methoxybenzyltrimethoxysilane 0.77 g (2 mol%), phenylsulfonylpropyltriethoxysilane 2.78 g (5 mol%), 2, 2, 2, 5-trimethyl-5- (3- (triethoxysilyl) propyl ) -1,3-dioxane-4,6-dione (2.91 g, 5 mol%) and acetone (53.57 g) were placed in a 300 ml flask, and the mixed solution was stirred with a magnetic stirrer to 0.01 mol / l hydrochloric acid
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-4), and the weight average molecular weight by GPC was Mw 1700 in terms of polystyrene.
- Hydrochloric acid (10.57 g) was added dropwise to the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C. and reacted for 240 minutes under heating and reflux. Thereafter, the reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation. A product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-5), and the weight average molecular weight by GPC was Mw2100 in terms of polystyrene.
- reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation.
- a product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-6), and the weight average molecular weight by GPC was Mw1800 in terms of polystyrene.
- Synthesis example 7 24.63 g (70 mol%) of tetraethoxysilane, 1.67 g (5 mol%) of phenyltrimethoxysilane, 5.72 g (19 mol%) of methyltriethoxysilane, 2.86 g (5 mol%) of trifluoromethanesulfonylpropyltriethoxysilane, Benzenesulfonamidopropyltriethoxylane 0.61 g (0.1 mol%) and acetone 53.24 g were placed in a 300 ml flask, and the mixed solution was stirred with a magnetic stirrer and 11.26 g of 0.01 mol / l hydrochloric acid was added.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-7), and the weight average molecular weight by GPC was Mw1800 in terms of polystyrene.
- Synthesis Example 8 24.55 g (70 mol%) of tetraethoxysilane, 7.60 g (20 mol%) of methyltriethoxysilane, 3.01 g (5 mol%) of triethoxysilylpropyltrifluoromethanesulfonamide, and 53.18 g of acetone were placed in a 300 ml flask. While stirring the mixed solution with a magnetic stirrer, 11.36 g of 1 mol / l hydrochloric acid was added dropwise to the mixed solution. After the addition, the flask was transferred to an oil bath adjusted to 85 ° C. and reacted for 240 minutes under heating and reflux.
- reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation.
- a product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (3-8), and the weight average molecular weight by GPC was Mw1800 in terms of polystyrene.
- reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation.
- a product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (4-1), and the weight average molecular weight by GPC was Mw 1700 in terms of polystyrene.
- reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation.
- a product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (4-2), and the weight average molecular weight by GPC was Mw1800 in terms of polystyrene.
- reaction solution is cooled to room temperature, 70.00 g of propylene glycol monomethyl ether acetate is added to the reaction solution, and methanol, ethanol, acetone, water and hydrochloric acid as reaction by-products are distilled off under reduced pressure and concentrated to hydrolytic condensation.
- a product (polymer) propylene glycol monomethyl ether acetate solution was obtained.
- Propylene glycol monoethyl ether was added, and the solvent ratio of propylene glycol monomethyl ether acetate / propylene glycol monoethyl ether 20/80 was adjusted to 20 weight percent in terms of solid residue at 140 ° C.
- the obtained polymer corresponded to Formula (4-3), and the weight average molecular weight by GPC was Mw1800 in terms of polystyrene.
- Si-containing resist underlayer film composition A silicon-containing polymer, an acid, a curing catalyst, an additive, a solvent, and water obtained from Synthesis Examples 1 to 8 and Comparative Synthesis Examples 1 to 3 are mixed at a ratio shown in Table 1, and are made of 0.1 ⁇ m fluororesin. Each solution of the composition for forming a resist underlayer film was prepared by filtering with a filter. The addition ratio of the polymer in Table 1 indicates not the addition amount of the polymer solution but the addition amount of the polymer itself.
- MA for maleic acid
- BTEAC for benzyltriethylammonium chloride
- IMIDTEOS for N- (3-triethoxysilylpropyl) -4,5-dihydroimidazole
- TPSNO3 for triphenylsulfonium nitrate
- monotriphenylsulfonium maleate Is TPSMA
- triphenylsulfonium trifluoroacetate is TPSTFA
- triphenylsulfonium chloride is TPSCl
- triphenylsulfonium camphorsulfonate is TPSCS
- triphenylsulfonium trifluoromethanesulfonate is TPSTf
- nonafluorobutanesulfonate triphenylsulfonium is TPSNf
- triphenylsulfonium adamantanecarboxy-1,1,2-trifluorobutanesulfonate is TPSA
- the mixture is filtered using a polyethylene microfilter having a pore size of 0.10 ⁇ m, and further filtered using a polyethylene microfilter having a pore size of 0.05 ⁇ m, so that the organic resist underlayer film (A layer) used in the lithography process using a multilayer film is used.
- a solution of the forming composition was prepared.
- Si-containing resist underlayer film forming compositions prepared in Examples 1 to 8 and Comparative Examples 1 to 3 were each applied onto a silicon wafer using a spinner.
- a Si-containing resist underlayer film (thickness 0.05 ⁇ m) was formed by heating on a hot plate at 200 ° C. for 1 minute.
- a spectroscopic ellipsometer manufactured by JA Woollam, VUV-VASEVU-302 was used for these resist underlayer films, and both the refractive index (n value) and optical absorption coefficient (k value and attenuation coefficient) at a wavelength of 193 nm were used. Measured).
- the organic underlayer film forming composition was applied onto a silicon wafer using a spinner to form a coating film (film thickness 0.20 ⁇ m).
- the dry etching rate was measured using CF 4 gas or O 2 gas as an etching gas, and the dry etching rates of the Si-containing resist underlayer films of Examples 1 to 8 and Comparative Examples 1 to 3 were compared.
- the dry etching rate of the fluorine-based gas is described as (nm / min).
- the rate ratio of oxygen-based gas was calculated by (Dry etching rate of Si-containing resist underlayer film) / (Dry etching rate of organic underlayer film).
- An organic underlayer film (A layer) forming composition containing the above formula (5-1) is applied onto a silicon wafer, baked on a hot plate at 240 ° C. for 60 seconds, and an organic underlayer film (A layer) having a thickness of 200 nm. Got.
- the Si-containing resist underlayer film (B layer) forming composition obtained in Examples 1 to 8 and Comparative Examples 1 to 3 was applied and baked on a hot plate at 240 ° C. for 60 seconds.
- a lower layer film (B layer) was obtained.
- the film thickness of the Si-containing resist underlayer film (B layer) was 30 nm.
- a commercially available photoresist solution (trade name FAiRS-9521NT05, manufactured by FUJIFILM Corporation) was applied onto the B layer with a spinner and heated on a hot plate at 100 ° C. for 1 minute to form a 85 nm thick photoresist.
- a film (C layer) was formed.
- Table 2 shows the results of observation of the refractive index at 193 nm, optical absorption coefficient, fluorine gas etch rate, oxygen gas resistance, and resist bottom shape after lithography evaluation.
- the organic underlayer film (A layer) forming composition was applied onto a silicon wafer and baked on a hot plate at 215 ° C. for 60 seconds to obtain an organic underlayer film (A layer) having a thickness of 90 nm.
- the resist underlayer film forming composition solutions prepared in Examples 1, 6 to 8 and Comparative Examples 1 to 3 of the present invention were spin-coated, and heated at 215 ° C. for 1 minute, whereby a resist underlayer film ( B layer) (20 nm) was formed.
- an EUV resist solution methacrylate resin resist
- C layer EUV resist film
- the resist underlayer film forming composition of the present invention is a resist underlayer film forming composition such as ArF or KrF photoresist, a resist underlayer film forming composition such as an EUV resist, an EUV resist upper layer film forming composition, or a resist underlayer film such as an electron beam resist. It can be used for a film forming composition, an electron beam resist upper layer film forming composition, a reverse material forming composition, and the like.
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Abstract
Description
また、半導体基板とフォトレジストとの間の下層膜として、シリコンやチタン等の金属元素を含むハードマスクとして知られる膜を使用することが行なわれている。この場合、レジストとハードマスクでは、その構成成分に大きな違いが有るため、それらのドライエッチングによって除去される速度は、ドライエッチングに使用されるガス種に大きく依存する。そして、ガス種を適切に選択することにより、フォトレジストの膜厚の大きな減少を伴うことなく、ハードマスクをドライエッチングによって除去することが可能となる。このように、近年の半導体装置の製造においては、反射防止効果を初め、さまざまな効果を達成するために、半導体基板とフォトレジストの間にレジスト下層膜が配置されるようになってきている。そして、これまでもレジスト下層膜用の組成物の検討が行なわれてきているが、その要求される特性の多様性などから、レジスト下層膜用の新たな材料の開発が望まれている。
特に本発明は、上層レジスト膜を露光しアルカリ現像液や有機溶剤で現像した時に優れたレジストパターン形状が形成でき、後のドライエッチングにより下層に矩形なレジストパターンを転写することができるレジスト下層膜を形成するためのレジスト下層膜形成組成物を提供することにある。
〔式(1)中、R1は式(2):
(式(2)中、R4は置換されていても良い炭素原子数1乃至10のアルキレン基を示し、R5はスルホニル基、又はスルホンアミド基を示し、R6はハロゲン含有有機基を示す。)で示される有機基を示し且つSi-C結合によりケイ素原子結合しているものである。R2はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、アミノ基、もしくはシアノ基を有する有機基を示し且つSi-C結合によりケイ素原子と結合しているものである。R3はアルコキシ基、アシルオキシ基、又はハロゲン基を示す。aは1の整数を示し、bは0乃至2の整数を示し、a+bは1乃至3の整数を示す。〕で示される加水分解性シランを含むリソグラフィー用レジスト下層膜形成組成物、
第2観点として、上記式(2)中、R6がフッ素含有有機基を示す第1観点に記載のレジスト下層膜形成組成物、
第3観点として、上記式(2)中、R6がトリフルオロメチル基を示す第1観点に記載のレジスト下層膜形成組成物、
第4観点として、該加水分解性シランが、式(1)で示される加水分解性シランとその他の加水分解性シランとの組み合わせであり、その他の加水分解性シランが式(3):
(式(3)中、R7はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基を示し且つSi-C結合によりケイ素原子と結合しているものであり、R8はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、cは0乃至3の整数を示す。)、及び式(4):
(式(4)中、R9はアルキル基を示し且つSi-C結合によりケイ素原子と結合しているものであり、R10はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、Yはアルキレン基又はアリーレン基を示し、dは0又は1の整数を示し、eは0又は1の整数である。)からなる群より選ばれた少なくとも1種の加水分解性シランである第1観点又は第2観点に記載のレジスト下層膜形成組成物、
第5観点として、第1観点に記載の式(1)で示される加水分解性シランと第4観点に記載の式(3)で示される加水分解性シランの組み合わせからなる加水分解性シランの加水分解縮合物を下層膜形成ポリマーとして含むレジスト下層膜形成組成物、
第6観点として、更に加水分解触媒として酸を含む第1観点乃至第5観点のいずれか一つに記載のレジスト下層膜形成組成物、
第7観点として、更に水を含む第1観点乃至第6観点のいずれか一つに記載のレジスト下層膜形成組成物、
第8観点として、第1観点乃至第7観点のいずれか一つに記載のレジスト下層膜形成組成物を半導体基板上に塗布し焼成することによって得られるレジスト下層膜、
第9観点として、第1観点乃至第7観点のいずれか一つに記載のレジスト下層膜形成組成物を半導体基板上に塗布し、焼成しレジスト下層膜を形成する工程、前記下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後にレジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、及びパターン化されたレジスト下層膜により半導体基板を加工する工程を含む半導体装置の製造方法、及び
第10観点として、半導体基板上に有機下層膜を形成する工程、その上に第1観点乃至第7観点のいずれか一つに記載のレジスト下層膜形成組成物を塗布し焼成しレジスト下層膜を形成する工程、前記レジスト下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後にレジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、パターン化されたレジスト下層膜により有機下層膜をエッチングする工程、及びパターン化された有機下層膜により半導体基板を加工する工程を含む半導体装置の製造方法である。
従って、本発明の組成物は半導体基板上又はその上の有機下層膜等の上に塗布したとき、上層のレジスト膜を露光しアルカリ現像液や有機溶剤で現像することにより、優れたレジストパターン形状が形成でき、後のドライエッチングにより下層に矩形なレジストパターンを転写することができるレジスト下層膜を提供できる。本発明のレジスト下層膜形成組成物からなるレジスト下層膜はまた、反射防止膜としても使用でき、しかも、レジストとのインターミキシングを起こさず、レジストに比較して大きなドライエッチング速度を有する。
従って、本発明のレジスト下層膜形成組成物はArF、KrFフォトレジスト等のレジスト下層膜形成組成物、EUVレジスト等のレジスト下層膜形成組成物、EUVレジスト上層膜形成組成物、電子線レジスト等のレジスト下層膜形成組成物、電子線レジスト上層膜形成組成物、リバース材料形成組成物、等に利用することができる。
式(2)中、R4は置換されていても良い炭素原子数1乃至10のアルキレン基を示し、R5はスルホニル基、又はスルホンアミド基を示し、R6はハロゲン含有有機基を示す。
上記式(2)中のR6がフッ素含有有機基であることが好ましく、特にトリフルオロメチル基が好ましい。
全シラン中で式(1)で示されるシランは、50モル%以下、又は0.05乃至50モル%、0.1乃至30モル%、又は0.1乃至10モル%の範囲で用いることができる。
本発明のレジスト下層膜形成組成物における固形分は、例えば0.1乃至50質量%、又は0.1乃至30質量%、0.1乃至25質量%である。ここで固形分とはレジスト下層膜形成組成物の全成分から溶剤成分を除いたものである。
固形分中に占める加水分解性シラン、その加水分解物、及びその加水分解縮合物の割合は、20質量%以上であり、例えば50乃至100質量%、60乃至99質量%、70乃至99質量%である。
また環状アルキル基を用いることもでき、例えば炭素原子数1乃至10の環状アルキル基としては、シクロプロピル基、シクロブチル基、1-メチル-シクロプロピル基、2-メチル-シクロプロピル基、シクロペンチル基、1-メチル-シクロブチル基、2-メチル-シクロブチル基、3-メチル-シクロブチル基、1,2-ジメチル-シクロプロピル基、2,3-ジメチル-シクロプロピル基、1-エチル-シクロプロピル基、2-エチル-シクロプロピル基、シクロヘキシル基、1-メチル-シクロペンチル基、2-メチル-シクロペンチル基、3-メチル-シクロペンチル基、1-エチル-シクロブチル基、2-エチル-シクロブチル基、3-エチル-シクロブチル基、1,2-ジメチル-シクロブチル基、1,3-ジメチル-シクロブチル基、2,2-ジメチル-シクロブチル基、2,3-ジメチル-シクロブチル基、2,4-ジメチル-シクロブチル基、3,3-ジメチル-シクロブチル基、1-n-プロピル-シクロプロピル基、2-n-プロピル-シクロプロピル基、1-i-プロピル-シクロプロピル基、2-i-プロピル-シクロプロピル基、1,2,2-トリメチル-シクロプロピル基、1,2,3-トリメチル-シクロプロピル基、2,2,3-トリメチル-シクロプロピル基、1-エチル-2-メチル-シクロプロピル基、2-エチル-1-メチル-シクロプロピル基、2-エチル-2-メチル-シクロプロピル基及び2-エチル-3-メチル-シクロプロピル基等が挙げられる。これらの例は上記ハロゲン化アルキル基のアルキル基部分にも適用される。
また上記アリーレン基としては、上記例示のアリール基から誘導される二価の有機基を挙げることができる。
上記メタクリロイル基を有する有機基としては、メタクリロイルメチル、メタクリロイルエチル、メタクリロイルプロピル等が挙げられる。
上記アミノ基を有する有機基としては、アミノメチル、アミノエチル、アミノプロピル等が挙げられる。
上記シアノ基を有する有機基としては、シアノエチル、シアノプロピル等が挙げられる。
ハロゲン含有有機基としては、スルホン基、スルホンアミド基に結合したハロゲン含有有機基や、塩構造を形成したハロゲン含有有機基を用いることができる。
さらにハロゲン含有有機基としては、ハロゲン原子が置換したアルキル基や、ハロゲン原子が置換したアルキル基を含む有機基が挙げられる。ハロゲン原子が置換したアルキル基としては、例えばパーフルオロメチル基(即ち、トリフルオロメチル基)、パーフルオロエチル基、パーフルオロプロピル基、パーフルオロブチル基等が挙げられる。
式(3)中、R7はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基を示し且つSi-C結合によりケイ素原子と結合しているものであり、R8はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、cは0乃至3の整数を示す。
式(4)中、R9はアルキル基を示し且つSi-C結合によりケイ素原子と結合しているものであり、R10はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、Yはアルキレン基又はアリーレン基を示し、dは0又は1の整数を示し、eは0又は1の整数である。
上記アルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基、アルコキシ基、アシルオキシ基、ハロゲン基、アリーレン基は上述の例を用いることができる。
GPCの測定条件は、例えばGPC装置(商品名HLC-8220GPC、東ソー株式会社製)、GPCカラム(商品名ShodexKF803L、KF802、KF801、昭和電工製)、カラム温度は40℃、溶離液(溶出溶媒)はテトラヒドロフラン、流量(流速)は1.0ml/min、標準試料はポリスチレン(昭和電工株式会社製)を用いて行うことができる。
また、加水分解性基の1モル当たり0.001乃至10モル、好ましくは0.001乃至1モルの加水分解触媒を用いることができる。
加水分解は完全に加水分解を行うことも、部分加水分解することでも良い。即ち、加水分解縮合物中に加水分解物やモノマーが残存していても良い。
加水分解触媒としては、金属キレート化合物、有機酸、無機酸、有機塩基、無機塩基を挙げることができる。
アンモニウム塩としては、式(D-1):
(但し、mは2乃至11、nは2乃至3の整数を、R21 はアルキル基又はアリール基を、YA -は陰イオンを示す。)で示される構造を有する第4級アンモニウム塩、式(D-2):
(但し、R22、R23、R24及びR25はアルキル基又はアリール基を、Nは窒素原子を、YA -は陰イオンを示し、且つR22、R23、R24、及びR25はそれぞれC-N結合により窒素原子と結合されているものである)で示される構造を有する第4級アンモニウム塩、
式(D-3):
(但し、R26及びR27はアルキル基又はアリール基を、YA -は陰イオンを示す)で示される構造を有する第4級アンモニウム塩、
式(D-4):
(但し、R28はアルキル基又はアリール基を、YA -は陰イオンを示す)で示される構造を有する第4級アンモニウム塩、
式(D-5):
(但し、R29及びR30はアルキル基又はアリール基を、YA -は陰イオンを示す)で示される構造を有する第4級アンモニウム塩、
式(D-6):
(但し、mは2乃至11、nは2乃至3の整数を、Hは水素原子を、YA -は陰イオンを示す)で示される構造を有する第3級アンモニウム塩が挙げられる。
(但し、R31、R32、R33、及びR34はアルキル基又はアリール基を、Pはリン原子を、YA -は陰イオンを示し、且つR31、R32、R33、及びR34はそれぞれC-P結合によりリン原子と結合されているものである)で示される第4級ホスホニウム塩が挙げられる。
(但し、R35、R36、及びR37はアルキル基又はアリール基を、Sは硫黄原子を、YA -は陰イオンを示し、且つR35、R36、及びR37はそれぞれC-S結合により硫黄原子と結合されているものである)で示される第3級スルホニウム塩が挙げられる。
硬化触媒はポリオルガノシロキサン100質量部に対して、0.01乃至10質量部、または0.01乃至5質量部、または0.01乃至3質量部である。
有機ポリマー化合物としては特に制限はなく、種々の有機ポリマーを使用することができる。縮重合ポリマー及び付加重合ポリマー等を使用することができる。ポリエステル、ポリスチレン、ポリイミド、アクリルポリマー、メタクリルポリマー、ポリビニルエーテル、フェノールノボラック、ナフトールノボラック、ポリエーテル、ポリアミド、ポリカーボネート等の付加重合ポリマー及び縮重合ポリマーを使用することができる。吸光部位として機能するベンゼン環、ナフタレン環、アントラセン環、トリアジン環、キノリン環、及びキノキサリン環等の芳香環構造を有する有機ポリマーが好ましく使用される。
有機ポリマー化合物としては、重量平均分子量が、例えば1000乃至1000000であり、または3000乃至300000であり、または5000乃至200000であり、または10000乃至100000であるポリマー化合物を使用することができる。
有機ポリマー化合物は一種のみを使用することができ、または二種以上を組み合わせて使用することができる。
有機ポリマー化合物が使用される場合、その割合としては、縮合物(ポリオルガノシロキサン)100質量部に対して、1乃至200質量部、または5乃至100質量部、または10乃至50質量部、または20乃至30質量部である。
酸発生剤としては、熱酸発生剤や光酸発生剤が挙げられる。
光酸発生剤は、レジストの露光時に酸を生ずる。そのため、下層膜の酸性度の調整ができる。これは、下層膜の酸性度を上層のレジストとの酸性度に合わせるための一方法である。また、下層膜の酸性度の調整によって、上層に形成されるレジストのパターン形状の調整ができる。
光酸発生剤が使用される場合、その割合としては、縮合物(ポリオルガノシロキサン)100質量部に対して、0.01乃至15質量部、または0.1乃至10質量部、または0.5乃至1質量部である。
本発明の組成物を用いて、基板上にレジスト下層膜を塗布法により形成するか、又は基板上の有機下層膜を介してその上にレジスト下層膜を塗布法により形成し、そのレジスト下層膜上にレジスト膜(例えば、フォトレジスト、電子線レジスト)を形成する。そして、露光と現像によりレジストパターンを形成し、そのレジストパターンを用いてレジスト下層膜をドライエッチングしてパターンの転写を行い、そのパターンにより基板を加工するか、又は有機下層膜をエッチングによりパターン転写しその有機下層膜により基板の加工を行う。
本発明では基板上に有機下層膜を成膜した後、この上に本発明のレジスト下層膜を成膜し、更にその上にフォトレジストを被覆することができる。これによりフォトレジストのパターン幅が狭くなり、パターン倒れを防ぐ為にフォトレジストを薄く被覆した場合でも、適切なエッチングガスを選択することにより基板の加工が可能になる。例えば、フォトレジストに対して十分に早いエッチング速度となるフッ素系ガスをエッチングガスとして本発明のレジスト下層膜に加工が可能であり、また本発明のレジスト下層膜に対して十分に早いエッチング速度となる酸素系ガスをエッチングガスとして有機下層膜の加工が可能であり、更に有機下層膜に対して十分に早いエッチング速度となるフッ素系ガスをエッチングガスとして基板の加工を行うことができる。
現像液としては、水酸化カリウム、水酸化ナトリウムなどのアルカリ金属水酸化物の水溶液、水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム、コリンなどの水酸化四級アンモニウムの水溶液、エタノールアミン、プロピルアミン、エチレンジアミンなどのアミン水溶液等のアルカリ性水溶液を例として挙げることができる。さらに、これらの現像液に界面活性剤などを加えることもできる。現像の条件としては、温度5乃至50℃、時間10乃至600秒から適宜選択される。
現像液としては、例えば、酢酸メチル、酢酸ブチル、酢酸エチル、酢酸イソプロピル、酢酸アミル、酢酸イソアミル、メトキシ酢酸エチル、エトキシ酢酸エチル、プロピレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテルアセテート、エチレングリコールモノプロピルエーテルアセテート、エチレングリコールモノブチルエーテルアセテート、エチレングリコールモノフェニルエーテルアセテート、ジエチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノプロピルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート、ジエチレングリコールモノフェニルエーテルアセテート、ジエチレングリコールモノブチルエーテルアセテート、2-メトキシブチルアセテート、3-メトキシブチルアセテート、4-メトキシブチルアセテート、3-メチル-3-メトキシブチルアセテート、3-エチル-3-メトキシブチルアセテート、プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールモノプロピルエーテルアセテート、2-エトキシブチルアセテート、4-エトキシブチルアセテート、4-プロポキシブチルアセテート、2-メトキシペンチルアセテート、3-メトキシペンチルアセテート、4-メトキシペンチルアセテート、2-メチル-3-メトキシペンチルアセテート、3-メチル-3-メトキシペンチルアセテート、3-メチル-4-メトキシペンチルアセテート、4-メチル-4-メトキシペンチルアセテート、プロピレングリコールジアセテート、蟻酸メチル、蟻酸エチル、蟻酸ブチル、蟻酸プロピル、乳酸エチル、乳酸ブチル、乳酸プロピル、炭酸エチル、炭酸プロピル、炭酸ブチル、ピルビン酸メチル、ピルビン酸エチル、ピルビン酸プロピル、ピルビン酸ブチル、アセト酢酸メチル、アセト酢酸エチル、プロピオン酸メチル、プロピオン酸エチル、プロピオン酸プロピル、プロピオン酸イソプロピル、2-ヒドロキシプロピオン酸メチル、2-ヒドロキシプロピオン酸エチル、メチル-3-メトキシプロピオネート、エチル-3-メトキシプロピオネート、エチル-3-エトキシプロピオネート、プロピル-3-メトキシプロピオネート等を例として挙げることができる。さらに、これらの現像液に界面活性剤などを加えることもできる。現像の条件としては、温度5乃至50℃、時間10乃至600秒から適宜選択される。
フッ素系ガスとしては、例えば、テトラフルオロメタン(CF4)、パーフルオロシクロブタン(C4F8)、パーフルオロプロパン(C3F8)、トリフルオロメタン、及びジフルオロメタン(CH2F2)等が挙げられる。
500mlナスフラスコに、3-クロロプロピルトリエトキシシラン28.00g(0.116mol)、トリフルオロメタンスルフィン酸ナトリウム23.59g(0.152mol)、テトラブチルアンモニウムヨージド(TBAI)8.59g(0.023mol)、トルエン84.00g、N-メチルピロリドン(NMP)28.00gを入れ、100℃に加熱し、24時間反応させた。反応液は、トルエン、水にて分液を行った後、エバポレーターにてトルエンを除去することで、粗生成物を得た。粗生成物を、減圧蒸留することで、目的物である化合物1(トリフルオロメタンスルホニルプロピルトリエトキシシラン)を得た。
1H-NMR(500MHz、DMSO-d6):0.78ppm(m、2H)、1.16ppm(t、9H)、1.84ppm(m、2H)、3.78ppm(m、8H)
13C-NMR(500MHz、DMSO-d6):8.6ppm、15.3ppm、18.1ppm、50.6ppm、57.9ppm、119.2ppm(q)
500mlナスフラスコに、3-クロロプロピルトリエトキシシラン50.00g(0.208mol)、メタンスルフィン酸ナトリウム22.26g(0.218mol)、よう化ナトリウム6.22g(0.042mol)、N-メチルピロリドン200.00gを入れ、150℃に加熱し、7時間反応させた。反応液は、トルエン、水にて分液を行った後、エバポレーターにてトルエンを除去することで、粗生成物を得た。粗生成物を、減圧蒸留することで、目的物である化合物2(メタンスルホニルプロピルトリエトキシシラン)を得た。
1H-NMR(500MHz、DMSO-d6):0.70ppm(m、2H)、1.16ppm(t、9H)、1.74ppm(m、2H)、2.93ppm(s、3H)、3.11ppm(m、2H)、3.76ppm(m、6H)
200ml四つ口フラスコに、3-アミノプロピルトリエトキシシラン15.00g(0.068mol)、トリエチルアミン(TEA)7.20g(0.071mol)、アセトニトリル(MeCN)60gを加え、5℃にて撹拌した。トリフルオロメタンスルホニルクロリド11.42g(0.068mol)を滴下後、25℃に昇温し、3時間撹拌した。塩をろ過後、減圧蒸留することで、目的物であるトリフルオロメタンスルホンアミドプロピルトリエトキシシランを得た。
1H-NMR(500MHz、DMSO-d6):0.58ppm(t、2H)、1.15ppm(t、9H)、1.53ppm(m、2H)、3.11ppm(d、2H)、3.75(q、6H)、9.32(s、1H)
テトラエトキシシラン24.82g(70mol%)、フェニルトリメトキシシラン1.69g(5mol%)、メチルトリエトキシシラン6.07g(20mol%)、トリフルオロメタンスルホニルプロピルトリエトキシシラン2.89g(5mol%)、アセトン53.19gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.35gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-1)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン25.91g(70mol%)、メチルトリエトキシシラン6.34g(20mol%)、トリフルオロメタンスルホニルプロピルトリエトキシシラン3.00g(5mol%)、4-メトキシベンジルトリメトキシシラン2.15g(5mol%)、アセトン52.89gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.85gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-2)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1600であった。
テトラエトキシシラン24.32g(70mol%)、フェニルトリメトキシシラン1.65g(5mol%)、メチルトリエトキシシラン3.87g(13mol%)、トリフルオロメタンスルホニルプロピルトリエトキシシラン2.82g(5mol%)、4-メトキシベンジルトリメトキシシラン0.81g(2mol%)、フェニルスルホニルプロピルトリエトキシシラン2.89g(5mol%)、アセトン53.33gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.12gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-3)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン23.42g(70mol%)、フェニルトリメトキシシラン1.59g(5mol%)、メチルトリエトキシシラン2.29g(8mol%)、トリフルオロメタンスルホニルプロピルトリエトキシシラン2.71g(5mol%)、4-メトキシベンジルトリメトキシシラン0.77g(2mol%)、フェニルスルホニルプロピルトリエトキシシラン2.78g(5mol%)、2, 2, 2, 5-トリメチル-5-(3-(トリエトキシシリル)プロピル)-1,3-ジオキサン-4,6-ジオン2.91g(5mol%)、アセトン53.57gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸10.71gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-4)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1700であった。
テトラエトキシシラン23.11g(70mol%)、フェニルトリメトキシシラン1.57g(5mol%)、アセトキシメチルトリエトキシシラン2.79g(8mol%)、トリフルオロメタンスルホニルプロピルトリエトキシシラン2.68g(5mol%)、4-メトキシベンジルトリメトキシシラン0.77g(2mol%)、フェニルスルホニルプロピルトリエトキシシラン2.75g(5mol%)、2, 2, 2, 5-トリメチル-5-(3-(トリエトキシシリル)プロピル)-1,3-ジオキサン-4,6-ジオン2.87g(5mol%)、アセトン53.66gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸10.57gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-5)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw2100であった。
テトラエトキシシラン23.74g(70mol%)、トリエトキシシリルプロピルジアリルイソシアヌレート3.37g(5mol%)、メチルトリエトキシシラン5.80g(20mol%)、トリフルオロメタンスルホニルプロピルトリエトキシシラン2.75g(5mol%)、アセトン53.66gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸10.85gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-6)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン24.63g(70mol%)、フェニルトリメトキシシラン1.67g(5mol%)、メチルトリエトキシシラン5.72g(19mol%)、トリフルオロメタンスルホニルプロピルトリエトキシシラン2.86g(5mol%)、ベンゼンスルホンアミドプロピルトリエトキシラン0.61g(0.1mol%)、アセトン53.24gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.26gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-7)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン24.55g(70mol%)、メチルトリエトキシシラン7.60g(20mol%)、トリエトキシシリルプロピルトリフルオロメタンスルホンアミド3.01g(5mol%)、アセトン53.18gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら1mol/lの塩酸11.36gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(3-8)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン25.81g(70mol%)、メチルトリエトキシシラン9.47g(30mol%)、アセトン52.92gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.80gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(4-1)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1700であった。
テトラエトキシシラン25.21g(70mol%)、メチルトリエトキシシラン7.71g(25mol%)、メタンスルホニルプロピルトリエトキシシラン2.45g、アセトン53.08gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸11.53gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(4-2)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
テトラエトキシシラン23.22g(70mol%)、メチルトリエトキシシラン5.68g(20mol%)、トリフルオロメチルスルホニルフェノキシプロピルトリエトキシシラン6.85g、アセトン53.63gを300mlのフラスコに入れ、混合溶液をマグネチックスターラーにて撹拌しながら0.01mol/lの塩酸10.62gを混合溶液に滴下した。添加後、85℃に調整されたオイルバスにフラスコを移し、加温還流下で240分反応させた。その後、反応溶液を室温まで冷却し、反応溶液にプロピレングリコールモノメチルエーテルアセテート70.00gを加え、反応副生物であるメタノール、エタノール、アセトン、水、塩酸を減圧留去し、濃縮して加水分解縮合物(ポリマー)プロピレングリコールモノメチルエーテルアセテート溶液を得た。プロピレングリコールモノエチルエーテルを加え、プロピレングリコールモノメチルエーテルアセテート/プロピレングリコールモノエチルエーテル20/80の溶媒比率として140℃における固形残物換算で20重量パーセントとなるように調整した。得られたポリマーは式(4-3)に相当し、GPCによる重量平均分子量はポリスチレン換算でMw1800であった。
上記合成例1乃至8、比較合成例1乃至3から得られたケイ素含有ポリマー、酸、硬化触媒、添加剤、溶媒、水を表1に示す割合で混合し、0.1μmのフッ素樹脂製のフィルターで濾過することによって、レジスト下層膜形成用組成物の溶液をそれぞれ調製した。表1中のポリマーの添加割合はポリマー溶液の添加量ではなく、ポリマー自体の添加量を示した。
表1中でマレイン酸はMA、ベンジルトリエチルアンモニウムクロリドはBTEAC、N-(3-トリエトキシシリルプロピル)-4,5-ジヒドロイミダゾールはIMIDTEOS、トリフェニルスルホニウム硝酸塩はTPSNO3、マレイン酸モノトリフェニルスルフォニウムはTPSMA、トリフェニルスルホニウムトリフルオロ酢酸塩はTPSTFA、トリフェニルスルホニウムクロリドはTPSCl、トリフェニルスルホニウムカンファースルホン酸塩はTPSCS、トリフェニルスルホニウムトリフルオロメタンスルホン酸塩はTPSTf、ノナフルオロブタンスルホン酸トリフェニルスルホニウムはTPSNf、トリフェニルスルホニウムアダマンタンカルボキシ-1,1,2-トリフルオロブタンスルホン酸塩はTPSAdTF、ジヒドロキシフェニルフェニルスルホニウムpトルエンスルホン酸塩はDHTPPSpTS、ビスフェニルスルホンはBPS、プロピレングリコールモノメチルエーテルアセテートはPGMEA、プロピレングリコールモノエチルエーテルはPGEE、プロピレングリコールモノメチルエーテルはPGMEと略した。水は超純水を用いた。各添加量は質量部で示した。
窒素下、100mL四口フラスコにカルバゾール(6.69g、0.040mol、東京化成工業(株)製)、9-フルオレノン(7.28g、0.040mol、東京化成工業(株)製)、パラトルエンスルホン酸一水和物(0.76g、0.0040mol、東京化成工業(株)製)を加え、1,4-ジオキサン(6.69g、関東化学(株)製)を仕込み撹拌し、100℃まで昇温し溶解させ重合を開始した。24時間後60℃まで放冷後、クロロホルム(34g、関東化学(株)製)を加え希釈し、メタノール(168g、関東化学(株)製)へ再沈殿させた。得られた沈殿物をろ過し、減圧乾燥機で80℃、24時間乾燥し、目的とするポリマー(式(5-1)、以下PCzFLと略す)9.37gを得た。
PCzFLの1H-NMRの測定結果は以下の通りであった。
1H-NMR(400MHz,DMSO-d6):δ7.03-7.55(br,12H),δ7.61-8.10(br,4H),δ11.18(br,1H)
PCzFLのGPCによるポリスチレン換算で測定される重量平均分子量Mwは2800、多分散度Mw/Mnは1.77であった。
得られた樹脂20gに、架橋剤としてテトラメトキシメチルグリコールウリル(三井サイテック(株)製、商品名パウダーリンク1174)3.0g、触媒としてピリジニウムパラトルエンスルホネート0.30g、界面活性剤としてメガファックR-30(大日本インキ化学(株)製、商品名)0.06gを混合し、プロピレングリコールモノメチルエーテルアセテート88gに溶解させ溶液とした。その後、孔径0.10μmのポリエチレン製ミクロフィルターを用いて濾過し、更に、孔径0.05μmのポリエチレン製ミクロフィルターを用いて濾過して、多層膜によるリソグラフィープロセスに用いる有機レジスト下層膜(A層)形成組成物の溶液を調製した。
実施例1乃至8、比較例1乃至3で調製したSi含有レジスト下層膜形成組成物をスピナーを用い、シリコンウェハー上にそれぞれ塗布した。ホットプレート上で200℃1分間加熱し、Si含有レジスト下層膜(膜厚0.05μm)を形成した。そして、これらのレジスト下層膜について分光エリプソメーター(J.A.Woollam社製、VUV-VASEVU-302)を用い、波長193nmでの屈折率(n値)及び光学吸光係数(k値、減衰係数とも呼ぶ)を測定した。
ドライエッチング速度の測定に用いたエッチャー及びエッチングガスは以下のものを用いた。
ES401(日本サイエンティフィック製):CF4
RIE-10NR(サムコ製):O2
実施例1乃至8、比較例1乃至3で調製したSi含有レジスト下層膜形成組成物の溶液をスピナーを用い、シリコンウェハー上に塗布した。ホットプレート上で240℃1分間加熱し、Si含有レジスト下層膜(膜厚0.08μm(CF4ガスでのエッチング速度測定用)、0.05μm(O2ガスでのエッチング速度測定用))をそれぞれ形成した。また、同様に有機下層膜形成組成物をスピナーを用い、シリコンウェハー上に塗布して塗膜を形成(膜厚0.20μm)した。エッチングガスとしてCF4ガス又はO2ガスを使用してドライエッチング速度を測定し、実施例1乃至8、比較例1乃至3のSi含有レジスト下層膜のドライエッチング速度について比較を行った。フッ素系ガスのドライエッチレートは(nm/min)として記載した。また、酸素系ガスの速度比は、(Si含有レジスト下層膜のドライエッチング速度)/(有機下層膜のドライエッチング速度)で計算した。
上記式(5-1)を含む有機下層膜(A層)形成組成物をシリコンウエハー上に塗布し、ホットプレート上で240℃で60秒間ベークし、膜厚200nmの有機下層膜(A層)を得た。その上に、実施例1乃至8、比較例1乃至3で得られたSi含有レジスト下層膜(B層)形成組成物を塗布し、ホットプレート上で240℃で60秒間ベークし、Si含有レジスト下層膜(B層)を得た。Si含有レジスト下層膜(B層)の膜厚は30nmであった。
B層の上に市販のフォトレジスト溶液(富士フイルム(株)製、商品名FAiRS-9521NT05)をスピナーによりそれぞれ塗布し、ホットプレート上で100℃にて1分間加熱し、膜厚85nmのフォトレジスト膜(C層)を形成した。
(株)ニコン製NSR-S307Eスキャナー(波長193nm、NA、σ:0.85、0.93/0.85)を用い、現像後にフォトレジストのライン幅及びそのライン間の幅が0.060μm、すなわち0.060μmのラインアンドスペース(L/S)=1/2のデンスラインが形成されるように設定されたマスク、また現像後にフォトレジストのライン幅及びそのライン間の幅が0.058μm、すなわち0.058μmのラインアンドスペース(L/S)=1/1のデンスラインが形成されるように設定されたマスクにそれぞれを通して露光を行った。その後、ホットプレート上100℃で60秒間ベークし、冷却後、酢酸ブチル(溶剤現像液)を用いて60秒現像し、レジスト下層膜(B層)上にネガ型のパターンを形成した。得られたフォトレジストパターンについて、大きなパターン剥がれやアンダーカット、ライン底部の太り(フッティング)が発生しないものを良好として評価した。
上記有機下層膜(A層)形成組成物をシリコンウエハー上に塗布し、ホットプレート上で215℃で60秒間ベークし、膜厚90nmの有機下層膜(A層)を得た。その上に、本発明の実施例1、6乃至8、比較例1乃至3で調製されたレジスト下層膜形成組成物溶液をスピンコートし、215℃で1分間加熱することにより、レジスト下層膜(B層)(20nm)を形成した。そのハードマスク上に、EUV用レジスト溶液(メタクリレート樹脂系レジスト)をスピンコートし加熱を行い、EUVレジスト膜(C層)を形成し、EUV露光装置(Micro Exposure Tool 略称MET)を用い、NA=0.30、σ=0.36/0.93 Quadropoleの条件で露光した。露光後、PEBを行い、クーリングプレート上で室温まで冷却し、現像及びリンス処理をし、レジストパターンを形成した。評価は、26nmのラインアンドスペースの形成可否、パターン断面観察によるパターン形状を評価した。
表3で(良好)とはフッティングからアンダーカットの間の形状であり、かつスペース部に著しい残渣がないという状態を示し、(倒れ)とはレジストパターンが剥がれ倒壊しているという好ましくない状態を示し、(ブリッジ)とはレジストパターンの上部もしくは下部同士が接触しているという好ましくない状態を示し、(レジスト塗布性×)とはレジスト製膜後に弾きが見られ製膜状態が好ましくなかった状態を示す。
Claims (10)
- シランとして加水分解性シラン、その加水分解物、その加水分解縮合物、又はそれらの組み合わせを含み、該加水分解性シランが式(1):
〔式(1)中、R1は式(2):
(式(2)中、R4は置換されていても良い炭素原子数1乃至10のアルキレン基を示し、R5はスルホニル基、又はスルホンアミド基を示し、R6はハロゲン含有有機基を示す。)で示される有機基を示し且つSi-C結合によりケイ素原子結合しているものである。R2はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、アミノ基、もしくはシアノ基を有する有機基を示し且つSi-C結合によりケイ素原子と結合しているものである。R3はアルコキシ基、アシルオキシ基、又はハロゲン基を示す。aは1の整数を示し、bは0乃至2の整数を示し、a+bは1乃至3の整数を示す。〕で示される加水分解性シランを含むリソグラフィー用レジスト下層膜形成組成物。 - 上記式(2)中、R6がフッ素含有有機基を示す請求項1に記載のレジスト下層膜形成組成物。
- 上記式(2)中、R6がトリフルオロメチル基を示す請求項1に記載のレジスト下層膜形成組成物。
- 該加水分解性シランが、式(1)で示される加水分解性シランとその他の加水分解性シランとの組み合わせであり、その他の加水分解性シランが式(3):
(式(3)中、R7はアルキル基、アリール基、ハロゲン化アルキル基、ハロゲン化アリール基、アルコキシアリール基、アルケニル基、又はエポキシ基、アクリロイル基、メタクリロイル基、メルカプト基、もしくはシアノ基を有する有機基を示し且つSi-C結合によりケイ素原子と結合しているものであり、R8はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、cは0乃至3の整数を示す。)、及び式(4):
(式(4)中、R9はアルキル基を示し且つSi-C結合によりケイ素原子と結合しているものであり、R10はアルコキシ基、アシルオキシ基、又はハロゲン基を示し、Yはアルキレン基又はアリーレン基を示し、dは0又は1の整数を示し、eは0又は1の整数である。)からなる群より選ばれた少なくとも1種の加水分解性シランである請求項1又は請求項2に記載のレジスト下層膜形成組成物。 - 請求項1に記載の式(1)で示される加水分解性シランと請求項4に記載の式(3)で示される加水分解性シランの組み合わせからなる加水分解性シランの加水分解縮合物を下層膜形成ポリマーとして含むレジスト下層膜形成組成物。
- 更に加水分解触媒として酸を含む請求項1乃至請求項5のいずれか1項に記載のレジスト下層膜形成組成物。
- 更に水を含む請求項1乃至請求項6のいずれか1項に記載のレジスト下層膜形成組成物。
- 請求項1乃至請求項7のいずれか1項に記載のレジスト下層膜形成組成物を半導体基板上に塗布し焼成することによって得られるレジスト下層膜。
- 請求項1乃至請求項7のいずれか1項に記載のレジスト下層膜形成組成物を半導体基板上に塗布し、焼成しレジスト下層膜を形成する工程、前記下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後にレジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、及びパターン化されたレジスト下層膜により半導体基板を加工する工程を含む半導体装置の製造方法。
- 半導体基板上に有機下層膜を形成する工程、その上に請求項1乃至請求項7のいずれか1項に記載のレジスト下層膜形成組成物を塗布し焼成しレジスト下層膜を形成する工程、前記レジスト下層膜の上にレジスト組成物を塗布しレジスト膜を形成する工程、前記レジスト膜を露光する工程、露光後にレジスト膜を現像しレジストパターンを得る工程、前記レジストパターンによりレジスト下層膜をエッチングする工程、パターン化されたレジスト下層膜により有機下層膜をエッチングする工程、及びパターン化された有機下層膜により半導体基板を加工する工程を含む半導体装置の製造方法。
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WO2021166567A1 (ja) * | 2020-02-19 | 2021-08-26 | Jsr株式会社 | ケイ素含有組成物及び半導体基板の製造方法 |
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KR20170033265A (ko) | 2017-03-24 |
TWI713461B (zh) | 2020-12-21 |
KR102417843B1 (ko) | 2022-07-06 |
CN106662820A (zh) | 2017-05-10 |
US20170168397A1 (en) | 2017-06-15 |
US11022884B2 (en) | 2021-06-01 |
JPWO2016009939A1 (ja) | 2017-04-27 |
SG11201700298XA (en) | 2017-02-27 |
TW201615758A (zh) | 2016-05-01 |
CN106662820B (zh) | 2021-06-22 |
JP6597980B2 (ja) | 2019-10-30 |
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