WO2015194543A1 - Matériau de couvercle d'étanchéité hermétique, et boîtier de logement de composant électronique - Google Patents

Matériau de couvercle d'étanchéité hermétique, et boîtier de logement de composant électronique Download PDF

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Publication number
WO2015194543A1
WO2015194543A1 PCT/JP2015/067288 JP2015067288W WO2015194543A1 WO 2015194543 A1 WO2015194543 A1 WO 2015194543A1 JP 2015067288 W JP2015067288 W JP 2015067288W WO 2015194543 A1 WO2015194543 A1 WO 2015194543A1
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WIPO (PCT)
Prior art keywords
layer
surface layer
electronic component
lid
stainless steel
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PCT/JP2015/067288
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English (en)
Japanese (ja)
Inventor
将幸 横田
雅春 山本
Original Assignee
株式会社Ｎｅｏｍａｘマテリアル
日立金属株式会社
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Publication of WO2015194543A1 publication Critical patent/WO2015194543A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to an airtight sealing lid and an electronic component storage package using the same.
  • an electronic component storage package using a hermetically sealing lid member having a Ni layer or a Ni alloy layer on the surface is known.
  • an airtight sealing lid is joined to the electronic component storage member in which the electronic component is stored by solder bonding or resistance welding, and the inside of the electronic component storage member is hermetically sealed.
  • this hermetic sealing it is effective to have a Ni layer or a Ni alloy layer in the hermetic sealing lid material in order to improve wettability with solder and resistance weldability.
  • Japanese Utility Model Laid-Open No. 62-68238 discloses a Ni-plated cap (cover material) which is a component of a semiconductor package, and the cap is soldered to the outer periphery of a package body that houses a semiconductor chip. It is attached.
  • Japanese Patent Laid-Open No. 2012-74807 discloses a lid member (cover material) made of Ni-plated 29Ni (nickel) -16Co (cobalt) -Fe (iron) alloy, which is a component of a piezoelectric vibrator. The lid member is disclosed, and is soldered to the outer peripheral portion of the insulating substrate package body that accommodates the piezoelectric vibration element therein.
  • lid member obtained by performing Ni plating on a thin plate made of a Fe-based alloy such as 42Ni—Fe alloy or 29Ni-16Co—Fe alloy. It is described as a technology.
  • a cover material is made of a base layer made of an Fe-based alloy such as 42Ni—Fe alloy or 29Ni-16Co—Fe alloy, and Ni or Ni alloy plated on the surface of the base layer. And a surface layer (Ni layer or Ni alloy layer).
  • a lid material is generally manufactured by forming a plate material using the Fe-based alloy by rolling, forming individual pieces from the plate material, and performing Ni plating treatment on the individual pieces.
  • Japanese Laid-Open Patent Publication No. 4-96256 discloses a metal hermetic seal lid (cover material) made of a clad material of 42Ni—Fe and Ni, which is a component part of an alumina package.
  • a solder thin plate (seal ring) is used for soldering to the outer periphery of the alumina package main body that houses the silicon chip.
  • Such a cover material includes a base layer made of an Fe-based alloy such as 42Ni—Fe alloy, and a surface layer made of Ni or Ni alloy clad to the surface of the base layer (Ni layer or Ni layer). Ni alloy layer).
  • a lid material is formed by rolling to form a plate material using the Fe-based alloy and a plate material using Ni or a Ni alloy, and clad rolling the plate material to form a clad material. A manufacturing method in which individual pieces are formed from the clad material is common.
  • the Ni-plated lid material In the production of the Ni-plated lid material described above, when electroless Ni plating is performed on the base material, it is exclusively to add a dummy member for the purpose of suppressing overlapping of the base materials in the barrel. The number of base materials that can be put into the barrel is reduced. In addition, when electrolytic Ni plating is performed on the base material, the current density is exclusively reduced for the purpose of suppressing variation in plating thickness, and thus the plating speed is reduced. Further, in the electroless Ni plating process or the electrolytic Ni plating process, it is necessary to sufficiently wash the material to be plated (cover material) after the process to prevent the cover material from being corroded by the remaining plating solution. As a result, the Ni plated lid material disclosed in Japanese Utility Model Laid-Open No.
  • Japanese Patent Laid-Open No. 2012-74807 has a Ni plating treatment per lid material. Since the time (takt time) required is long, there is a problem that the time (lead time) required for manufacturing one lid member is long. In addition, there is a problem that the manufacturing cost of the lid material increases as the lead time becomes longer.
  • a base material using a Fe-based alloy such as a 42Ni—Fe alloy or a 29Ni-16Co—Fe alloy is used.
  • a lid member made of a clad material in which a Ni material or a Ni alloy material is bonded on one side or both sides is exclusively formed to a predetermined size by a simple means such as press working (punching).
  • the lid material made of the clad material may corrode from the exposed base material portion in the punched section, and there is a problem that the corrosion resistance of the lid material is lowered.
  • An object of the present invention is to provide a hermetic sealing lid that can shorten the lead time required for manufacturing one hermetic sealing lid material, and as a result, can reduce the manufacturing cost, and can be expected to improve the corrosion resistance. And providing an electronic component storage package using the hermetically sealing lid.
  • an important feature of the present invention is for hermetic sealing using a clad material that does not require conventional Ni plating to improve corrosion resistance (including resistance to discoloration and oxidation during heat treatment).
  • stainless steel is applied to the base material layer.
  • the lid for hermetic sealing of the present invention is made of a clad material in which a surface layer made of Ni or Ni alloy is bonded to one surface of a base material layer made of stainless steel.
  • this clad material having a surface layer made of Ni or Ni alloy, the surface layer is disposed on the electronic component storage member side for storing the electronic component, and the electronic component storage member is hermetically sealed. Therefore, it is not necessary to perform Ni plating treatment on the surface of the base material layer.
  • the clad material can be manufactured by forming two or more plate materials by rolling and joining the two or more plate materials to each other by clad rolling.
  • the rolling for forming the plate material for the clad material is not much different from the conventional rolling for forming the plate material for the lid material plated with Ni.
  • the takt time required for the production of the clad material can be expected to be the time required for the finish rolling in the conventional rolling process of the plate material or the time required for adding the time required for the clad rolling. is there.
  • the hermetic sealing lid material of the present invention that does not require the Ni plating treatment, compared to the case of performing the Ni plating treatment that normally increases the tact time as described above, even in the production of the clad material. Even if the required tact time is added, the lead time required for manufacturing one hermetic sealing lid can be sufficiently shortened. As a result, it is possible to reduce the manufacturing cost required for manufacturing one hermetic sealing lid by the amount corresponding to the shortened lead time.
  • the Ni plating treatment that has been performed in the past generally has a high manufacturing cost because there are many factors that increase costs such as cleaning before plating, management of plating solution concentration and impurities, and sufficient cleaning after plating.
  • the conventional clad rolling has a lower manufacturing cost than the conventional Ni plating treatment, and it is necessary to finish the plate material even if it is a lid material to be subjected to the Ni plating treatment. Even if the clad rolling is added to the stage, the manufacturing cost does not increase greatly. Therefore, even if clad rolling is added in place of the Ni plating process, the manufacturing cost required for manufacturing one hermetic sealing lid can be reduced by the amount that the Ni plating process is not performed. .
  • the lid for hermetic sealing of the present invention has a base material layer made of stainless steel.
  • a passive film mainly made of Cr 2 O 3 is formed on the surface of the base material layer, so that the base material layer is made of 42Ni—Fe alloy or 29Ni.
  • the corrosion resistance of the base material layer can be improved as compared with the case of using a Fe-based alloy such as a -16Co-Fe alloy.
  • the corrosion of the base material layer from the portion not covered by the surface layer made of Ni or Ni alloy such as the cross section exposed by press punching is suppressed, so the corrosion resistance of the hermetic sealing lid material is improved Can be made.
  • Stainless steel is generally steel containing 10.5% by mass or more of Cr (chromium), and steel having particularly high corrosion resistance among steels containing 50% by mass or more of Fe.
  • the lid material for hermetic sealing of the present invention is the first material made of Ni or Ni alloy on the other surface of the base material layer made of stainless steel to which the surface layer made of Ni or Ni alloy is not bonded. It is preferable to use a clad material to which two surface layers are bonded. This configuration eliminates the need to distinguish between the front and back of the hermetic sealing lid when the hermetic sealing lid is bonded to the electronic component storage member and hermetically seals, so the productivity of the electronic component storage package is eliminated. Can be improved. In addition, since the front and back surfaces of the base material layer are covered with a highly corrosion-resistant surface layer and a second surface layer made of Ni or Ni alloy, thereby reducing the exposure of the base material layer, stainless steel having a slightly low corrosion resistance. Even so, it can be a base material layer.
  • the airtight sealing lid material of the present invention is formed using the clad material having a thickness of 50 ⁇ m or more and 150 ⁇ m or less.
  • the thickness of the clad material is 50 ⁇ m or more, it can have mechanical strength that can withstand hermetic sealing. It can suppress that it becomes difficult to stop.
  • the thickness of the clad material is 150 ⁇ m or less, it is effective for reducing the weight and size of the electronic component storage package.
  • the thickness of the first surface layer made of Ni or Ni alloy is preferably 1 ⁇ m or more and 12 ⁇ m or less.
  • the thickness of the first surface layer is 12 ⁇ m or less, it is effective for reducing the weight and size of the electronic component storage package, and Ni or Ni alloy is generally expensive and effective for reducing the cost.
  • the thickness of the first surface layer is 12 ⁇ m or less, the possibility that Ni or Ni alloy melts more than necessary and flows into the electronic component housing member is reduced.
  • the thickness of the first surface layer made of Ni or Ni alloy is 1 ⁇ m or more and 12 ⁇ m or less
  • the thickness of the second surface layer made of Ni or Ni alloy is used. Is preferably 1 ⁇ m or more and 12 ⁇ m or less.
  • the thickness of the first surface layer and the second surface layer is 1 ⁇ m or more and 12 ⁇ m or less, even if the thickness of the layer made of Ni or Ni alloy on one surface of the hermetic sealing lid is 1 ⁇ m, Even if the thickness of the layer made of Ni or Ni alloy is 12 ⁇ m, the effect of obtaining a sufficient amount of melting of Ni or Ni alloy necessary for the above-described hermetic sealing, Since it is not necessary to distinguish between the front and back of the hermetic sealing lid without losing the effect of being effective for weight reduction, compactness, and cost reduction, the productivity of the electronic component storage package can be improved.
  • the first surface layer and the second surface layer made of Ni or Ni alloy have equivalent characteristics (ductility, melting point, thermal expansion coefficient, etc.), and the hermetically sealing lid material And the workability of joining the electronic component housing member can be further improved.
  • the stainless steel of the base material layer is preferably stainless steel containing 12% by mass or more of Cr.
  • austenitic SUS301 series, SUS304 series, SUS316 series, ferritic SUS430 series, SUS436 series, martensitic SUS440 series, precipitation, etc. containing 12 mass% or more and 18 mass% or less of Cr.
  • Cured SUS630 series or the like can be used.
  • the stainless steel of the base material layer is stainless steel containing 18% by mass or more and 25% by mass or less of Cr.
  • an austenitic 310 series containing 18 mass% or more and 25 mass% or less of Cr, an austenitic-ferrite based 329 series, a ferrite based 445 series, or the like can be used as the stainless steel. If comprised in this way, a base material layer can be comprised so that the above-mentioned Cr-type passive film may be produced
  • the stainless steel of the base layer is preferably austenitic or austenitic-ferritic stainless steel. If comprised in this way, since the stainless steel which is excellent in corrosion resistance can be used, the corrosion resistance of a base material layer can be improved more. Note that austenitic stainless steel is more preferable because of its particularly excellent corrosion resistance. The austenite-ferrite system is preferable because it has excellent corrosion resistance if not as much as the austenite system.
  • the stainless steel of the base material layer is preferably a ferritic stainless steel.
  • the front and back surfaces of the base material layer are covered with the highly corrosion-resistant surface layer and the second surface layer made of Ni or Ni alloy, thereby reducing the exposure of the base material layer.
  • ferritic stainless steel as a base layer, which is slightly lower than austenite, the base layer is effectively prevented from corroding, and the press workability and low cost of ferritic stainless steel are low. Benefits can be gained.
  • the first surface layer is preferably made of a Ni alloy containing 60% by mass or more of Cu.
  • the first surface layer has a lower melting point and a lower resistance, which is effective for reducing the bonding temperature and power saving when joining by seam welding or the like.
  • the hermetic sealing lid material of the present invention By using the hermetic sealing lid material of the present invention, it is possible to obtain an electronic component storage package that can enjoy the effects of the above-described hermetic sealing lid material of the present invention. That is, the electronic component storage package of the present invention has an electronic component storage member for storing an electronic component, and a hermetic sealing lid member for hermetically sealing the electronic component storage member, and the hermetic sealing lid
  • the material is formed by using a clad material having a base material layer made of stainless steel and a first surface layer made of Ni or Ni alloy bonded to one surface of the base material layer. Is an electronic component storage package that is welded to the electronic component storage member.
  • the lid for hermetic sealing is bonded to the electronic component storage member in which the electronic component is stored, for example, by solder bonding or resistance welding, and the inside of the electronic component storage member is hermetically sealed by the bonding,
  • an electronic component storage package in which electronic components are stored is obtained. Therefore, since the electronic component storage package of the present invention reflects all the operational effects exhibited by the above-described hermetic sealing lid material of the present invention, the hermetic sealing is highly reliable, lightweight, and compact. Therefore, it can be put into practical use as an inexpensive electronic component storage package.
  • the above-described preferred structure of the hermetic sealing lid of the present invention that is, the second surface layer made of Ni or Ni alloy is bonded to the other surface of the base material layer. It is preferable to use the clad material.
  • the first surface layer is preferably made of a Ni alloy containing 60% by mass or more of Cu.
  • the second surface layer is preferably made of Ni or Ni alloy containing 70% by mass or more of Ni. If comprised in this way, coloring of the surface of the airtight sealing cover material can be suppressed.
  • the second surface layer is made of a Ni alloy containing 60% by mass or more of Cu, and Ni or Ni containing 70% by mass or more of Ni on the surface of the second surface layer.
  • a third surface layer made of an alloy is preferably bonded. If comprised in this way, the coloring of the surface of the cover material for airtight sealing can be suppressed by the 3rd surface layer. Further, even if the second surface layer and the third surface layer are arranged on the side to be welded to the electronic component housing member, the second surface layer has a lower melting point and a lower resistance, so that seam welding is performed. This is effective in reducing the bonding temperature and power saving when bonding.
  • the thickness of the clad material is preferably 50 ⁇ m or more and 150 ⁇ m or less. Moreover, it is preferable that the thickness of the 1st surface layer is 1 micrometer or more and 12 micrometers or less.
  • the stainless steel of the base material layer is preferably an austenitic or austenitic-ferritic stainless steel.
  • the thickness of a 1st surface layer and the thickness of a 2nd surface layer are the structures of the airtight sealing lid
  • the stainless steel of the base material layer is preferably ferritic stainless steel.
  • the lead time required for manufacturing one hermetic sealing lid material can be shortened.
  • the manufacturing cost can be reduced, and in addition, an improvement in corrosion resistance can be expected.
  • a material can be obtained.
  • an electronic component storage package that can enjoy the effects of the present invention can be obtained.
  • FIG. 1 shows the configuration of a hermetic sealing lid 1 (hereinafter referred to as “lid 1”) according to an embodiment of the hermetic sealing lid of the present invention.
  • 2 has the surface layer 3 only on one surface of the base material layer 2, and corresponds to the second surface layer 4 (hereinafter referred to as “surface layer 4”) of the lid 1 shown in FIG. 1 shows a configuration of an airtight sealing lid material (hereinafter referred to as “lid material 1 ′”).
  • FIG. 3 shows a configuration of an electronic component storage package 100 (hereinafter referred to as “package 100”) according to an embodiment of the electronic component storage package of the present invention using the lid member 1 shown in FIG.
  • the lid 1 shown in FIG. 1 has a length L, a width W, a thickness T, and a thickness of a lower surface 2a that is one surface of the base material layer 2 with respect to the base material layer 2 having a thickness T1.
  • the surface layer 3 of T2 is formed by using a three-layer clad material in which a second surface layer 4 having a thickness of T3 is joined to the upper surface 2b which is the other surface of the base material layer 2 by clad rolling. In some cases, the surface layer 4 may not be provided. If the base material layer 2 and the material corresponding to the surface layer 3 are clad-rolled and joined, a two-layer clad material that does not have the surface layer 4 is provided.
  • the base material layer 2 can be made of corrosion-resistant stainless steel (for example, austenitic SUS304 or ferrite SUS430), and the surface layer 3 and the surface layer 4 can be Ni or Ni alloy. (For example, pure Ni (purity 99% or more) or Ni alloy containing Cu) can be used.
  • the base layer 2 can be made of stainless steel having high corrosion resistance (for example, austenitic SUS304), and the surface layer 3 can be made of Ni or Ni alloy (for example, pure Ni ( A purity of 99% or more) or a Ni alloy containing Cu).
  • L, W, and T of the lid member 1 shown in FIG. 1 are preferably 0.8 mm or more and 7.0 mm or less, 0.8 mm or more and 7.0 mm or less, and 50 ⁇ m or more and 150 ⁇ m or less, for example, L: 5.0 mm ⁇ W: 3.2 mm ⁇ T: 100 ⁇ m, L: 2.3 mm ⁇ W: 1.8 mm ⁇ T: 80 ⁇ m, L: 1.6 mm ⁇ W: 1.2 mm ⁇ T: 60 ⁇ m, etc. are formed. be able to.
  • T1, T2, and T3 of the lid material 1 are each preferably 26 ⁇ m or more and 148 ⁇ m or less, 1 ⁇ m or more and 12 ⁇ m or less, and 1 ⁇ m or more and 12 ⁇ m or less.
  • the lid material 1 such as T1: 74 ⁇ m, T2: 3 ⁇ m, and T3: 3 ⁇ m is used.
  • T is within a preferable thickness range (50 ⁇ m or more and 150 ⁇ m or less) of the clad material
  • T2 is within a preferable thickness range (1 ⁇ m or more and 12 ⁇ m or less) of the surface layer 3
  • T3 is a surface layer. 4 within a preferable thickness range (1 ⁇ m or more and 12 ⁇ m or less).
  • L, W, T, T1, and T2 of the lid member 1 'shown in FIG. 2 can be formed with the same dimensions as the lid member 1 shown in FIG.
  • the lid 1 shown in FIG. 1 or the lid 1 ′ shown in FIG. 2 can be bonded to an electronic component storage member 10 (hereinafter referred to as “storage member 10”) as shown in FIG.
  • storage member 10 an electronic component storage member 10
  • the surface layer 3 disposed on the lower surface 1a side of the material 1 or the cover material 1 ′ can be welded to the storage member 10 by seam welding which is a kind of resistance welding.
  • the lid 1 or the surface layer 3 of the lid 1 'melts and functions as a bonding layer.
  • the surface layer 4 disposed on the upper surface 1 b side functions as a coating layer that covers the upper surface 2 b of the base material layer 2.
  • the cover material 1 has a three-layer structure provided with a surface layer 4 that functions as a coating layer when ferritic stainless steel is used for the base material layer 2.
  • a surface layer 4 that functions as a coating layer when ferritic stainless steel is used for the base material layer 2.
  • austenitic stainless steel it may be a lid material 1 ′ having a two-layer structure in which the surface layer 4 is not provided.
  • the lid member 1 or the lid member 1 ′ made of stainless steel is used for the base material layer 2 to be hermetically sealed by joining the housing member 10 by, for example, seam welding
  • 42Ni used in the past is used. It is considered that defects in hermetic sealing such as leaks and cracks are likely to occur as compared with a base material layer using a Fe-based alloy such as a -Fe alloy or a 29Ni-16Co-Fe alloy.
  • the present inventors appropriately adjust seam welding conditions such as a current value and energization time, and take measures against heat removal around the joint, so that the lid member 1 or the lid member 1 ′ and the storage member 10.
  • the influence of heat on the surface can be minimized, and it has been confirmed that it is possible to prevent the problems of hermetic sealing such as leakage and cracks described above.
  • the surface layer of the lid member is made of Ni alloy containing approximately 60% by mass or more of Cu, the surface layer has a lower melting point and lower resistance, It is effective for reducing the junction temperature and saving power.
  • the lid 1 which is an embodiment of the hermetic sealing lid of the present invention includes the base material layer 2 made of stainless steel and Ni or The surface layer 3 (first surface layer) made of Ni alloy is joined to the other surface of the base material layer 2 on the opposite side of the surface layer 3, and the surface layer 4 (first surface layer) made of Ni or Ni alloy. 2 surface layers) is used for the cladding material.
  • a lid 1 ′ which is another example of the embodiment of the hermetic sealing lid of the present invention includes a base material layer 2 made of stainless steel and Ni or Ni with respect to one surface of the base material layer 2. The clad material is joined to the surface layer 3 (first surface layer) made of an alloy.
  • a layer of another material may be further formed on the surface layer 4 of the lid material 1, or as long as the lid material 1 ′ does not have the surface layer 4.
  • a layer of another material may be formed on the exposed portion of the base material layer 2.
  • the package 100 has the lid 1 and the storage member 10 shown in FIG. In addition, it can replace with the cover material 1 shown in FIG. 1, and the cover material 1 'shown in FIG. 2 which does not provide the surface layer 4 can also be used. Since the difference between the lid material 1 shown in FIG. 1 and the lid material 1 ′ shown in FIG. 2 is limited to the presence or absence of the surface layer 4, description of a specific example using the lid material 1 ′ shown in FIG. 2 will be omitted. .
  • a crystal resonator 20 which is an electronic component is housed.
  • the lid member 1 and the storage member 10 are hermetically sealed in a state where the crystal resonator 20 is stored inside the storage member 10.
  • This hermetic sealing is performed, for example, by performing seam welding in a state where the surface layer 3 of the lid member 1 is disposed opposite to the storage member 10, and in an atmosphere introduced with air, nitrogen gas, argon gas, or the like as necessary. , In a reduced pressure atmosphere.
  • the surface layer of the lid material contains approximately 70% by mass or more of Ni, it is effective for suppressing the coloring of the surface of the lid material.
  • the outer surface layer 4 is formed into at least two layers, and the outermost layer contains Ni or approximately 70% by mass or more of Ni.
  • An outermost layer made of Ni alloy is provided, and a layer (intermediate layer) made of Ni alloy containing approximately 60% by mass or more of the Cu described above is provided between the outermost layer and the base material layer 2.
  • it is effective not only for suppressing the coloring of the surface of the lid material described above, but also effective for reducing the bonding temperature and power saving described above in seam welding.
  • the storage member 10 shown in FIG. 3 includes a base 11 formed into a hollow box shape using alumina (Al 2 O 3 ), which is ceramic, and a ring brazed to the base 11.
  • covers the seal ring 12 are included.
  • the base 11 includes a bottom portion 11a formed so as to be a box-shaped bottom, a side portion 11b formed so as to stand up from an outer peripheral portion of the bottom portion 11a to be a box-shaped side surface, and an upper end of the side portion 11b. And a metallized layer 11d.
  • the metallized layer 11d joins the base 11 made of a ceramic (Al 2 O 3 ) material and the seal ring 12 made of a metal material using a brazing material
  • the metallized layer 11d improves the wettability with respect to the brazing material and maintains a joined state. It has a function of improving the structure, and has a structure (not shown) in which a W layer, a Ni layer, and an Au layer are laminated in order from the upper end of the side portion 11b toward the seal ring 12.
  • a concave portion 11 c surrounded by the side portion 11 b is the main body of the cavity, and the crystal resonator 20 is fixed to the bottom portion 11 a by a bump 21.
  • the metal seal ring 12 has a base material 12a formed using a 29Ni-16Co-Fe alloy or the like, and a silver brazing portion 12b provided on the lower surface side of the base material 12a.
  • the silver brazing portion 12b of the seal ring 12 is bonded to the metallized layer 11d of the base 11, and for example, the silver brazing portion 32b of the seal ring 12 is heated while being in contact with the metallized layer 11d.
  • the joining can be performed by melting the brazing portion 32b.
  • the seal ring 12 bonded to the metallized layer 11d is covered with a plating layer 13 having a structure (not shown) in which an Ni plating layer and an Au plating layer are sequentially laminated.
  • the package 100 includes the storage member 10 for storing the crystal resonator 20 that is an electronic component, and the lid member 1 shown in FIG. 1 for hermetically sealing the storage member 10.
  • the base material layer 2 which uses stainless steel, and the surface layer 3 which uses Ni or Ni alloy with respect to one side of the base material layer 2 are joined, and the base material where the surface layer 3 is not joined
  • the surface layer 3 of the lid 1 made of the clad material in which the surface layer 4 (second surface layer) made of Ni or Ni alloy is bonded to the other surface of the layer 2 is attached to the storage member 10. Are welded.
  • the base material layer 2 made of stainless steel and the surface layer 3 made of Ni or Ni alloy are bonded to one surface of the base material layer 2 using the lid 1 ′ shown in FIG.
  • the surface layer 3 of the lid member 1 ′ using the clad material is welded to the storage member 10.
  • the package 100 which is an embodiment of the electronic component storage package of the present invention includes a lid member 1 shown in FIG. 1 or a surface layer 3 of the lid member 1 ′ shown in FIG. 2 and a plating layer 13 covering the seal ring 12.
  • a SAW filter surface acoustic wave filter
  • Lid (lid material for hermetic sealing), 1 '. Lid material (lid material for hermetic sealing), 1a. Lower surface, 1b. Top surface, 2. Substrate layer, 2a. Bottom surface, 2b. Top surface, 3. Surface layer 4, surface layer (second surface layer), 10. 10.
  • Storage member (electronic component storage member), Base, 11a. Bottom, 11b. Side, 11c. Recess, 11d.
  • Metallized layer 12. Seal ring, 12a. Base material, 13. Plating layer, 20. Crystal resonator, 21. Bump, 100.
  • Package (electronic component storage package)

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

L'invention concerne un matériau de couvercle d'étanchéité hermétique (1, 1') qui est utilisé dans un boîtier (100) de logement de composant électronique comprenant un élément (10) de logement de composant électronique permettant de loger un composant électronique (20), et qui est constitué d'un matériau de gainage dans lequel une première couche de surface (3) constituée de Ni ou d'un alliage de Ni est jointe à une surface d'une couche de matériau de base (2) constituée d'acier inoxydable.
PCT/JP2015/067288 2014-06-19 2015-06-16 Matériau de couvercle d'étanchéité hermétique, et boîtier de logement de composant électronique WO2015194543A1 (fr)

Applications Claiming Priority (2)

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JP2014126008A JP2017139246A (ja) 2014-06-19 2014-06-19 気密封止用蓋材、それを用いた電子部品収納パッケージ
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188349A (ja) * 1998-12-22 2000-07-04 Nec Kansai Ltd 気密パッケージ、その製造用金属キャップ、その金属キャップの製造方法および気密パッケージの製造方法
JP2000236228A (ja) * 1999-02-12 2000-08-29 Daishinku Corp 圧電振動子の気密封止構造
JP2002255167A (ja) * 2001-02-26 2002-09-11 Murata Mfg Co Ltd 電子部品パッケージおよびその製造方法
JP2005151493A (ja) * 2003-11-20 2005-06-09 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2005176319A (ja) * 2003-11-19 2005-06-30 Nippon Dempa Kogyo Co Ltd 水晶振動子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000188349A (ja) * 1998-12-22 2000-07-04 Nec Kansai Ltd 気密パッケージ、その製造用金属キャップ、その金属キャップの製造方法および気密パッケージの製造方法
JP2000236228A (ja) * 1999-02-12 2000-08-29 Daishinku Corp 圧電振動子の気密封止構造
JP2002255167A (ja) * 2001-02-26 2002-09-11 Murata Mfg Co Ltd 電子部品パッケージおよびその製造方法
JP2005176319A (ja) * 2003-11-19 2005-06-30 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2005151493A (ja) * 2003-11-20 2005-06-09 Nippon Dempa Kogyo Co Ltd 水晶振動子

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