WO2015192499A1 - 一种光模块散热装置及利用该散热装置的通信设备 - Google Patents

一种光模块散热装置及利用该散热装置的通信设备 Download PDF

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Publication number
WO2015192499A1
WO2015192499A1 PCT/CN2014/086562 CN2014086562W WO2015192499A1 WO 2015192499 A1 WO2015192499 A1 WO 2015192499A1 CN 2014086562 W CN2014086562 W CN 2014086562W WO 2015192499 A1 WO2015192499 A1 WO 2015192499A1
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WO
WIPO (PCT)
Prior art keywords
heat
optical module
heat dissipation
guide rail
conducting block
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PCT/CN2014/086562
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English (en)
French (fr)
Inventor
过乾
刘秀
李婷婷
梁冬冬
林伟儒
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP14895040.5A priority Critical patent/EP3145287A4/en
Priority to RU2017100656A priority patent/RU2669364C2/ru
Priority to MYPI2016002252A priority patent/MY197746A/en
Publication of WO2015192499A1 publication Critical patent/WO2015192499A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins

Definitions

  • the present invention relates to the field of electronic communications, and in particular, to a heat dissipation device for an optical module and a communication device using the same.
  • FIG. 1 A common heat dissipation device for an optical module is shown in FIG. 1.
  • a system board 12 is disposed in a space surrounded by the device housing 11, and a metal rail 13 is disposed on the system board 12, and the optical module 14 passes through a hole in the device housing 11. 15 is inserted into the metal rail 13 to be connected to other hardware (not shown) on the system board 12, and then pulled out when not in use.
  • a heat dissipation block 16 is disposed above the optical module 14 , and the heat dissipation teeth 17 on the heat dissipation block 16 extend away from the optical module 14 .
  • This structure causes the height of the entire optical module assembly to multiply. Since the optical module is a larger device on the system board, this determines the overall space thickness of the system version, which is not conducive to the miniaturization of the system.
  • the technical problem to be solved by the present invention is how to provide a heat dissipation device for an optical module and a communication device using the same, which can not only ensure heat dissipation efficiency, but also effectively solve the problem of high definition of optical module components, thereby facilitating the system. Miniaturization.
  • an embodiment of the present invention provides a heat dissipation device for an optical module, including a guide rail.
  • the guide rail is disposed on the circuit board for accommodating the optical module, and the rail is covered with a heat conducting block.
  • a heat dissipating tooth is formed in a partial region, and the heat dissipating tooth is located at a tail portion of the guide rail.
  • the heat dissipating teeth extend toward a direction close to the circuit board such that the heat dissipating teeth and the rail are located on the same side of the heat conducting block.
  • the rail may be disposed as a heat transfer rail to transfer heat indirectly, or an opening may be provided on a surface of the rail.
  • the heat conducting block is brought into contact with the light module inserted in the guide rail through the opening to directly transfer heat.
  • the height of the heat dissipating teeth can be made smaller than the height of the guide rails, so that a gap can be left between the heat dissipating teeth and the circuit board, which is convenient for installation and facilitates heat dissipation.
  • the shape of the heat conducting block may be determined according to the heat dissipation intensity and the size of the guide rail that houses the light module. For example, in some embodiments of the present invention, a length of a portion of the heat conducting block on which the heat dissipating teeth are formed may be set to be larger than a length of the remaining area of the heat conducting block; in other technical solutions of the present invention The width of the portion of the heat conducting block on which the heat dissipating teeth are formed may be set to be larger than the width of the remaining area of the heat conducting block.
  • the height and arrangement density of the heat dissipating teeth may also vary according to actual conditions. For example, in some embodiments of the present invention, the farther away from the optical module inserted in the guide rail, the smaller the height of the heat dissipating tooth; in other technical solutions of the present invention, the farther away from being inserted into the guide rail
  • the light module has a sparse distribution of the heat dissipating teeth.
  • the heat dissipation device for an optical module of the present invention further includes a buckle for fixing the heat conduction block to the guide rail, the buckle comprising the surface of the heat conduction block a main plane extending from opposite sides of the main plane to form two opposite sides perpendicular to the main plane, each side being provided with an opening, the opening and the rail disposed on the rail
  • the fasteners match.
  • a hollow is formed on the main plane to form a claw extending in a space facing the hollow, and a surface of the heat conductive block is formed by a groove, and the claw is buckled in the groove to improve the The fastening force of the buckle.
  • the claws may also be inclined toward the direction of the heat conducting block to apply a certain pressure to the heat conducting block to further increase the fastening force of the buckle.
  • a transverse rib is formed in the hollow space of the main plane of the buckle to ensure the buckle Strength of.
  • the embodiment of the present invention further provides a communication device, including a device housing, wherein the device housing is provided with a circuit board, and the circuit board is provided with a heat dissipation device for the optical module for dissipating heat of the optical module thereon.
  • the light module heat dissipation device is the light module heat dissipation device in any one of the above technical solutions.
  • the heat dissipating teeth on the heat conducting plate are located at the tail portion of the rail, and the heat dissipating teeth extend toward the circuit board to enable The heat dissipating tooth and the rail are located on the same side of the heat conducting block, which reduces the height of the optical module assembly and effectively solves the optical module assembly, compared with the structure in which the heat dissipating teeth and the rail are located on both sides of the heat conducting block.
  • the problem of high height limitation is beneficial to the miniaturization of the system, and the heat dissipation of the heat transfer block and the heat dissipation of the heat dissipating teeth also ensure the heat dissipation efficiency of the heat sink.
  • FIG. 1 is a schematic diagram of a heat dissipation device of an optical module in the related art
  • FIG. 2 is a schematic diagram of a heat dissipation device for an optical module according to an embodiment of the present invention
  • FIG. 3 is a schematic view of a guide rail in the heat dissipation device of the optical module shown in FIG. 2;
  • FIG. 4a is a schematic view of a heat conducting block in the optical module rapid heat dissipation device shown in FIG. 2;
  • Figure 4b is a side view of the thermal block shown in Figure 4a;
  • FIG. 4c and 4d are schematic views of variations of the heat conducting block shown in Fig. 4a;
  • FIG. 4e and 4f are schematic views showing a modification of the heat dissipating tooth shown in Fig. 4b;
  • FIG. 5 is a schematic view of a buckle in the heat dissipation device of the optical module shown in FIG. 2;
  • FIG 6 is a schematic view of the thermal block shown in Figure 4a assembled with the clip shown in Figure 5.
  • Figure 1 11 - equipment housing, 12-system board, 13-metal rail, 14-light module, 15-hole, 16-heat block, 17-heating teeth;
  • Figure 2 to Figure 6 21-circuit board, 22-rail, 221-screw hole, 222-fastener, 23-thermal block, 231-groove, 24-heating tooth, 25-opening, 26-fastening , 261 - main plane, 262 - side, 263 - opening, 264 - claw, 265 - transverse reinforcement.
  • the heat dissipation device of the optical module includes a guide rail 22 disposed on the circuit board 21 for accommodating an optical module (not shown).
  • the guide rail 22 can be mounted on the circuit through a connection structure such as a screw hole 221
  • the guide rail 22 is covered with a heat conducting block 23, and a heat dissipating tooth 24 is formed in a partial area on the heat conducting block 23, and the heat dissipating tooth 24 is located at the tail end of the guide rail 22 (in Fig. 2, the right side of the guide rail 22 is the tail portion thereof)
  • the heat dissipating teeth 24 extend toward the circuit board 21 such that the heat dissipating teeth 24 and the rails 22 are located on the same side of the heat conducting block 23.
  • the heat dissipating teeth 24 on the heat conducting plate 23 are located at the tail of the rail 22, and the heat dissipating teeth 24 extend toward the circuit board 21 such that the heat dissipating teeth 24 and the rail 22 are located on the same side of the heat conducting block 23.
  • the height of the optical module assembly is reduced, and the problem of the height limitation of the optical module assembly is effectively solved, thereby facilitating miniaturization of the system and heat conduction.
  • Block heat transfer and heat dissipation of the heat dissipating teeth also ensure the heat dissipation efficiency of the heat sink.
  • the guide rail 22 may be disposed as a heat transfer guide to indirectly transfer heat, and the guide rail 22 is preferably a metal guide rail having good heat transfer performance.
  • an opening 25 may be provided in the surface of the guide rail 22, and the heat conducting block 23 is brought into contact with the optical module inserted in the guide rail 22 through the opening 25 to directly transfer heat.
  • the height of the heat dissipating teeth 24 can be made smaller than the height of the guide rails 22, so that the purpose is to leave a gap between the heat dissipating teeth 24 and the circuit board 21, which not only facilitates the heat conducting block 23 The installation and the use of the gap for heat dissipation prevent the heat radiated from the heat dissipating teeth 24 from damaging other components on the circuit board 21.
  • Figure 4a shows the basic structure of the heat-conducting block 23 used in the embodiment of the heat-dissipating device of the optical module.
  • the shape of the heat-conducting block 23 in the embodiments of the present invention may be based on the heat-dissipating strength and the light-receiving module.
  • the size of the guide rail 22 is determined such that the shape of the heat transfer block 23 can be varied according to actual requirements.
  • the length of the partial region of the heat conductive block 23 on which the heat dissipating teeth 24 are formed may be set to be larger than The length of the remaining area on the heat conducting block 23, that is, the length of the heat conducting block 23 is extended toward the tail thereof.
  • the width of the partial region of the heat conductive block 23 on which the heat dissipating teeth 24 are formed may be formed. It is set to be larger than the width of the remaining area on the heat conducting block 23, that is, the width of the heat conducting block 23 is expanded toward both sides.
  • Fig. 4b shows the basic structure of the heat dissipating teeth 24 used in the embodiment of the above-described optical module heat sink, but in actual use, the height and arrangement density of the heat dissipating teeth 24 can also be varied according to actual conditions.
  • the farther away from the optical module inserted in the guide rail 22 the thinner and looser the distribution of the heat dissipating teeth 24, which not only saves material, but also increases heat dissipation. It facilitates the transfer of heat to the outside of the heat sink.
  • a positioning device may be provided to connect the heat conducting block 23 and the guide rail 22, so that the position of the heat conducting block 23 is fixed, and the heat conducting block is fixed. It is also possible to better contact the heat generating surface of the optical module by the positioning device.
  • the positioning device may be a buckle 26 for fixing the heat conductive block 23 on the guide rail 22, and the buckle 26 can increase the fastening force between the heat conductive block 23 and the light film block, so that the optical module is close to the heat conductive block 23.
  • the clip 26 includes a main plane 261 adapted to the surface of the heat conducting block 23, and two opposite sides 262 perpendicular to the main plane 261 are formed extending from opposite sides of the main plane 261, each Each of the side surfaces 262 is provided with an opening 263.
  • the opening 263 cooperates with the fastener 222 disposed on the guide rail 22.
  • the structure of the mating is specifically as shown in FIG.
  • the fastener provided on the guide rail 22 may be an elastic member, and the opening 263 may be a hole on the side surface 262 of the buckle 26 that matches the elastic member.
  • the position of the heat conducting block 23 is fixed by the engagement of the elastic member and the card hole.
  • the buckle 26 in this embodiment can also be regarded as a casing sleeve matching the guide rail 22, as shown in FIG. 6, and the casing sleeve (ie, the buckle 26) is first used in the assembly.
  • the heat conducting block 23 is then caught on the fastener 222 of the guide rail 22 by the opening 263 of the outer casing, so that the outer casing is sleeved on the outer surface of the guide rail 22, so that the lower surface of the heat conducting block 23 is in close contact with the optical module. Better heat dissipation.
  • the claw 264 extending from the hollow space is formed on the main plane 261 of the buckle 26, and the surface of the heat conducting block 23 is formed by the groove 231, and the claw 264 is buckled.
  • the groove 231 in order to increase the fastening force of the buckle 26.
  • the buckle 26 of the buckle 26 is provided with six claws 264.
  • a groove 231 matching the six claws 264 is disposed on the heat conducting block 23, and the heat conducting block 23 is tightly fastened on the light module through the claw 264 and the groove 231, thereby further increasing the heat conducting block 23
  • the fastening force between the optical module and the optical module further improves the heat dissipation effect of the heat conductive block 23.
  • the number of the claws 264 in this embodiment may be set according to actual conditions, and may be one or more.
  • the claws 264 can also be inclined toward the direction of the heat transfer block 23 to have a certain deformation (i.e., have a certain elasticity), so that the guide heat block 23 exerts a certain pressure to further increase the fastening force of the buckle 26.
  • the fastening force of the buckle 26 is increased, the deformation of the buckle 26 under the action of the large fastening force is prevented, and the horizontal rib 265 can be disposed on the buckle 26, and the transverse rib 26 is disposed on the main plane 261 of the buckle 26 In the space, the main plane edges on both sides of the hollow space are connected to ensure that the buckle 26 has sufficient strength.
  • the structural shape of the heat dissipation device of the optical module in the above embodiments reduces the height of the optical module assembly, but causes the lateral area occupied by the heat conduction block 23 to increase. Nonetheless, since the main chip is generally surrounded by passive components with low height, the density of the devices on the board can be kept constant according to a reasonable layout.
  • the embodiment of the present invention further provides a communication device, including a device housing, wherein the device housing is provided with a circuit board, and the circuit board is provided with a heat dissipation module for the optical module thereon.
  • the light module heat dissipation device is the light module heat dissipation device in any of the above embodiments.
  • the heat dissipating teeth on the heat conducting plate are located at the tail portion of the rail, and the heat dissipating teeth extend toward the circuit board to enable The heat dissipating tooth and the rail are located on the same side of the heat conducting block, which reduces the height of the optical module assembly and effectively solves the optical module assembly, compared with the structure in which the heat dissipating teeth and the rail are located on both sides of the heat conducting block.
  • the problem of high height limitation is beneficial to the miniaturization of the system, and the heat dissipation of the heat transfer block and the heat dissipation of the heat dissipating teeth also ensure the heat dissipation efficiency of the heat sink.

Abstract

本发明提供了一种光模块散热装置。所述光模块散热装置包括导轨（22），设于电路板（21）上用于容纳光模块（14），所述导轨（22）上覆盖有导热块（23），所述导热块（23）上的部分区域中形成有散热齿（24），所述散热齿（24）位于所述导轨（22）的尾部，且所述散热齿（24）朝向靠近电路板（21）的方向延伸，以使所述散热齿（24）和所述导轨（22）位于所述导热块（23）的同侧。与已有技术中散热齿和导轨位于导热块两侧的结构相比，应用本发明，可以降低光模块组件的高度，有效地解决光模块组件配件高度限制的问题，从而有利于系统的小型化，而且通过导热块（23）传热和散热齿（24）的散热，还保证了散热装置的散热效率。

Description

一种光模块散热装置及利用该散热装置的通信设备 技术领域
本发明涉及电子通信领域，尤其涉及一种光模块散热装置及利用该散热装置的通信设备。
背景技术
随着系统板(也可称之为主板)的设计日趋小型化和扁平化，系统板的空间占有率问题受到了更多的重视。以系统板上的较大器件——光模块组件的散热为例，如何设计才能使光模块组件既能达到较好的散热效果还能满足系统板的扁平化和小型化的要求，已经成为一个研究的热点问题。
一种常见的光模块散热装置如图1所示，设备壳体11围成的空间内设有系统板12，系统板12上设有金属导轨13，光模块14通过设备壳体11上的孔15插入到金属导轨13中，以便与系统板12上的其它硬件(未示出)连接，不使用时再将其拔出。由图1可知，为了对光模块14进行散热，在光模块14的上方设有散热块16，且该散热块16上的散热齿17远离光模块14而朝向上方延伸。
这种结构导致整个光模块组件的高度成倍增长，由于光模块是系统板上的较大器件，这就决定系统版的整体空间厚度增加，不利于系统的小型化的目标。
发明内容
本发明要解决的技术问题是，如何提供一种光模块散热装置及利用该散热装置的通信设备，既能够保证散热效率，又能有效地解决光模块组件配高限制的问题，从而有利于系统的小型化。
为解决上述技术问题，本发明的实施例提供一种光模块散热装置，包括导轨，所述导轨设于电路板上用于容纳光模块，所述导轨上覆盖有导热块，所述导热块上的部分区域中形成有散热齿，所述散热齿位于所述导轨的尾部， 且所述散热齿朝向靠近电路板的方向延伸以使所述散热齿和所述导轨位于所述导热块的同侧。
为了便于将插在所述导轨中的光模块发出的热量传递至所述导热块，可以将所述导轨设置为传热导轨以间接传递热量，或者在所述导轨的表面上设有开孔，所述导热块通过所述开孔与插在所述导轨中的光模块形成接触以便直接传递热量。
在制作散热齿时，可以使所述散热齿的高度小于所述导轨的高度，这样能够在所述散热齿与所述电路板之间留有空隙，方便安装、并有利于散热。
所述导热块的形状可根据散热强度和容纳光模块的所述导轨的尺寸来确定。例如：在本发明的一些技术方案中，可以将所述导热块上形成有散热齿的部分区域的长度设置为大于所述的导热块上其余区域的长度；在本发明的另一些技术方案中，可以将所述导热块上形成有散热齿的部分区域的宽度设置为大于所述导热块上其余区域的宽度。
所述散热齿的高度和排列密度也可以根据实际情况进行变动。例如：在本发明的一些技术方案中，越远离插在所述导轨中的光模块，所述散热齿的高度越小；在本发明的另一些技术方案中，越远离插在所述导轨中的光模块，所述散热齿的分布越稀疏。
在上述介绍的光模块散热装置的基础上，本发明的光模块散热装置还包括扣具，将所述导热块固定在所述导轨上，所述扣具包括与所述导热块的表面相适应的主平面，从所述主平面的两相对侧边开始延伸形成有垂直于所述主平面的两个相对侧面，每个侧面上均设有开口，所述开口与设在所述导轨上的扣件相配合。
更进一步地，在所述主平面上镂空形成由朝向镂空的空间内延伸的扣爪，所述导热块的表面上形成由凹槽，所述扣爪扣在所述凹槽中，以便提高所述扣具的扣合力。
而且，所述扣爪还可以朝向所述导热块的方向倾斜，从而向所述导热块施加一定的压力，以便进一步提高所述扣具的扣合力。
另外，在所述扣具的主平面的镂空空间内形成有横筋，以保证所述扣具 的强度。
另一方面，本发明实施例还提供了一种通信设备，包括设备壳体，所述设备壳体内设有电路板，所述电路板上设有为其上的光模块散热的光模块散热装置，所述光模块散热装置为上述任一项技术方案中的光模块散热装置。
本发明的上述技术方案的有益效果如下：
在本发明实施例提供的光模块散热装置和利用该散热装置的通信设备中，所述导热板上的散热齿位于所述导轨的尾部，且所述散热齿朝向靠近电路板的方向延伸以使所述散热齿和所述导轨位于所述导热块的同侧，这与相关技术中散热齿和导轨位于导热块两侧的结构相比，降低了光模块组件的高度，有效地解决光模块组件配高限制的问题，从而有利于系统的小型化，而且通过导热块传热和散热齿的散热，还保证了散热装置的散热效率。
附图概述
图1为相关技术中光模块散热装置的示意图；
图2为本发明实施例提供的光模块散热装置的示意图；
图3为图2所示光模块散热装置中导轨的示意图；
图4a为图2所示光模快散热装置中导热块的示意图；
图4b为图4a所示导热块的侧视图；
图4c和图4d为图4a所示导热块的变型示意图；
图4e和图4f为图4b所示散热齿的变型示意图；
图5为图2所示光模块散热装置中扣具的示意图；
图6为将图4a所示的导热块与图5所示的扣具装配在一起的示意图。
附图标记：
图1中：11-设备壳体、12-系统板、13-金属导轨、14-光模块、15-孔、16-散热块、17-散热齿；
图2至图6中：21-电路板、22-导轨、221-螺钉孔，222-扣件、23-导热块、231-凹槽、24-散热齿、25-开孔、26-扣具、261-主平面、262-侧面、263-开口、264-扣爪、265-横筋。
本发明的较佳实施方式
下面将结合附图及具体实施例进行详细描述。
如图2所示，本发明实施例提供的光模块散热装置包括设于电路板21上用于容纳光模块(未示出)的导轨22，导轨22可以通过螺钉孔221等连接结构安装在电路板21上，导轨22上覆盖有导热块23，导热块23上的部分区域中形成有散热齿24，散热齿24位于导轨22的尾部(在图2中，导轨22的右方即为其尾部)，且散热齿24朝向靠近电路板21的方向延伸以使散热齿24和导轨22位于导热块23的同侧。
在该光模块散热装置中，导热板23上的散热齿24位于导轨22的尾部，且散热齿24朝向靠近电路板21的方向延伸以使散热齿24和导轨22位于导热块23的同侧，这与相关技术中散热齿和导轨位于导热块两侧的结构相比，降低了光模块组件的高度，有效地解决光模块组件配高限制的问题，从而有利于系统的小型化，而且通过导热块传热和散热齿的散热，还保证了散热装置的散热效率。
为了便于将插在导轨22中的光模块发出的热量传递至导热块23，可以将导轨22设置为传热导轨以间接传递热量，此时该导轨22优选为传热性能好的金属导轨。或者，如图3所示，可以在导轨22的表面上设有开孔25，导热块23通过开孔25与插在导轨22中的光模块形成接触以便直接传递热量。
另外，在制作散热齿24时，可以使散热齿24的高度小于导轨22的高度，这样做的目的是能够在散热齿24与电路板21之间留有空隙，这不仅方便了导热块23的安装，而且有利于利用该空隙进行散热，避免散热齿24所散发的热量危害电路板21上的其它元器件。
图4a所示为在上述光模块散热装置实施例中使用的导热块23的基础结构，但在实际的使用中，本发明各实施例中的导热块23形状可以根据散热强度和容纳光模块的导轨22的尺寸来确定，即导热块23的形状可以根据实际要求进行变化。
例如：如图4c所示，在一些实施例中，当导轨22宽度方向的尺寸较小、且散热强度要求高时，可以将导热块23上形成有散热齿24的部分区域的长度设置为大于所述的导热块23上其余区域的长度，也就是将导热块23的长度向其尾部方向进行延伸。
再例如：如图4d所示，在另一些实施例中，当导轨22宽度方向的尺寸较大、且散热强度要求也高时，可以将导热块23上形成有散热齿24的部分区域的宽度设置为大于导热块23上其余区域的宽度，也就是将导热块23的宽度向两侧方向扩展。
图4b所示为在上述光模块散热装置实施例中使用的散热齿24的基础结构，但在实际的使用中，散热齿24的高度和排列密度也可以根据实际情况进行变动。
例如：如图4e所示，在一些实施例中，越远离插在导轨22中的光模块，散热齿24的高度可以越小，也就是散热齿24可以越短，这样可节约材料且节省空间。
再例如：如图4f所示，在另一些实施例中，越远离插在导轨22中的光模块，散热齿24的分布越稀疏、越松散，这样不仅可以节约材料，而且还可以增加散热效果，便于热量向散热装置外部传递。
在实际应用时，为了使光模块散热装置中的导热块23能够定位和固定在导轨22上，可以设置一个定位装置连接导热块23和导轨22，从而使导热块23的位置固定，并且导热块23还可以通过该定位装置与光模块的发热面更好地接触。
具体而言，该定位装置可以是将导热块23固定在导轨22上的扣具26，该扣具26能够增加导热块23与光膜块之间的扣合力，使光模块与导热块23紧密接触，提高散热效果。如图5所示，该扣具26包括与导热块23的表面相适应的主平面261，从主平面261的两相对侧边开始延伸形成有垂直于主平面261的两个相对侧面262，每个侧面262上均设有开口263，开口263与设在导轨22上的扣件222相配合，该配合的结构具体如图2所示。
上述设在导轨22上的扣件可以为弹性部件，开口263可以是扣具26的侧面262上的与该弹性部件相匹配的卡孔。这样通过弹性部件和卡孔的配合，固定导热块23的位置。从结构形状上看，本实施例中的扣具26也可以看作是与导轨22相匹配的外壳套，如图6所示，在装配时首先使用该外壳套(即扣具26)套在导热块23上，然后再用该外壳套上的开口263卡在导轨22的扣件222上，从而将该外壳套套在导轨22的外表面，使得导热块23的下表面与光模块紧密接触，更好地实现散热。
更进一步地，如图6所示，在扣具26的主平面261上镂空形成由朝向镂空的空间内延伸的扣爪264，导热块23的表面上形成由凹槽231，扣爪264扣在凹槽231中，以便提高扣具26的扣合力。如图5所示，图中的扣具26镂空的边沿设置了6个扣爪264。同时，在导热块23上设置了与该6个扣爪264相匹配的凹槽231，通过扣爪264与凹槽231能使导热块23紧密地扣在光模块上，进一步地增加导热块23与光模块之间的扣合力，进一步地提高导热块23的散热效果。本实施例中的扣爪264的数量可根据实际情况来设置，可以为一个或者多个。
而且，扣爪264还可以朝向导热块23的方向倾斜以具有一定的变形(即具有一定的弹性)，从而向导热块23施加一定的压力，以便进一步提高扣具26的扣合力。
此外，在提高扣具26扣合力的同时，防止扣具26在较大扣合力作用下的变形，可以在扣具26上设置横筋265，该横筋26设在扣具26的主平面261的镂空空间内，连接镂空空间两侧的主平面边缘，以保证扣具26具有足够的强度。
上述各实施例中的光模块散热装置的结构形状使得光模块组件的高度降低了，但导致了导热块23占用的横向面积增多。虽然如此，由于主芯片周围一般都是配高很低的无源器件，因此可以根据合理的版图布局保证单板上器件的密度不变。
此外，虽然未图示，本发明实施例还提供了一种通信设备，其包括设备壳体，所述设备壳体内设有电路板，所述电路板上设有为其上的光模块散热 的光模块散热装置，所述光模块散热装置为上述任一个实施例中的光模块散热装置。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明所述原理的前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。
工业实用性
在本发明实施例提供的光模块散热装置和利用该散热装置的通信设备中，所述导热板上的散热齿位于所述导轨的尾部，且所述散热齿朝向靠近电路板的方向延伸以使所述散热齿和所述导轨位于所述导热块的同侧，这与相关技术中散热齿和导轨位于导热块两侧的结构相比，降低了光模块组件的高度，有效地解决光模块组件配高限制的问题，从而有利于系统的小型化，而且通过导热块传热和散热齿的散热，还保证了散热装置的散热效率。

Claims (10)

  1. 一种光模块散热装置，包括导轨，所述导轨设于电路板上用于容纳光模块，所述导轨上覆盖有导热块，所述导热块上的部分区域中形成有散热齿，所述散热齿位于所述导轨的尾部，且所述散热齿朝向靠近电路板的方向延伸以使所述散热齿和所述导轨位于所述导热块的同侧。
  2. 根据权利要求1所述的光模块散热装置，其中，所述导轨为传热导轨；或者，所述导轨的表面上设有开孔，所述导热块通过所述开孔与插在所述导轨中的光模块形成接触。
  3. 根据权利要求1或2所述的光模块散热装置，其中，所述散热齿的高度小于所述导轨的高度，在所述散热齿与所述电路板之间留有空隙。
  4. 根据权利要求3所述的光模块散热装置，其中，所述导热块上形成有散热齿的部分区域的长度大于所述的导热块上其余区域的长度；或者，所述导热块上形成有散热齿的部分区域的宽度大于所述导热块上其余区域的宽度。
  5. 根据权利要求3所述的光模块散热装置，其中，越远离插在所述导轨中的光模块，所述散热齿的高度越小；或者，越远离插在所述导轨中的光模块，所述散热齿的分布越稀疏。
  6. 根据权利要求1或2所述的光模块散热装置，其中，还包括扣具，所述扣具将所述导热块固定在所述导轨上，所述扣具包括与所述导热块的表面相适应的主平面，从所述主平面的两相对侧边开始延伸形成有垂直于所述主平面的两个相对侧面，每个侧面上均设有开口，所述开口与设在所述导轨上的扣件相配合。
  7. 根据权利要求6所述的光模块散热装置，其中，在所述主平面上镂空形成由朝向镂空的空间内延伸的扣爪，所述导热块的表面上形成由凹槽，所述扣爪扣在所述凹槽中。
  8. 根据权利要求7所述的光模块散热装置，其中，所述扣爪朝向所述导热块的方向倾斜。
  9. 根据权利要求7所述的光模块散热装置，其中，在所述主平面的镂空空间内形成有横筋。
  10. 一种通信设备，包括设备壳体，所述设备壳体内设有电路板，其特征在于，所述电路板上设有为其上的光模块散热的光模块散热装置，所述散热装置为如权利要求1-9中任一项所述的光模块散热装置。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304786A (zh) * 2016-08-30 2017-01-04 镇海建设集团有限公司 一种户外通信机柜

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109874281B (zh) * 2019-03-29 2024-03-19 武汉联特科技股份有限公司 通讯设备及其具有散热结构的光模块
CN113156590B (zh) * 2020-01-22 2022-07-19 华为技术有限公司 光模块的散热结构及通信设备
CN112038852A (zh) * 2020-09-14 2020-12-04 东莞立讯技术有限公司 散热外壳与电连接器模块
CN115857113A (zh) * 2021-09-24 2023-03-28 华为技术有限公司 光模块和光通信设备
CN216437764U (zh) * 2021-12-17 2022-05-03 广东省新一代通信与网络创新研究院 一种射频拉远单元散热外壳及射频拉远单元

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587608A (en) * 1995-10-27 1996-12-24 Meng; Ching-Ming Structure heat sink for power semiconductors
CN1530737A (zh) * 2003-03-17 2004-09-22 扬明光学股份有限公司 积分柱承托装置
CN1946277A (zh) * 2006-10-30 2007-04-11 陈鸿文 高效无风扇散热装置
CN102128364A (zh) * 2010-01-20 2011-07-20 台达电子工业股份有限公司 照明装置及其发光模块
CN102155685A (zh) * 2011-02-18 2011-08-17 深圳市华星光电技术有限公司 背光模块
CN102299127A (zh) * 2011-07-13 2011-12-28 台达电子企业管理（上海）有限公司 用于封装元件的双向散热器及其组装方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6980437B2 (en) * 2004-03-03 2005-12-27 Tyco Electronics Corporation Pluggable electronic receptacle with heat sink assembly
US7457126B2 (en) * 2005-06-27 2008-11-25 Intel Corporation Optical transponder with active heat transfer
US20080148052A1 (en) * 2006-10-25 2008-06-19 Motorola, Inc. Method and system for authentication bonding two devices and sending authenticated events
RU73091U1 (ru) * 2007-08-06 2008-05-10 Интернэйшнал Карренси Текнолоджиз Корпорэйшн Линзовый модуль
KR101644480B1 (ko) * 2009-02-02 2016-08-01 코닌클리케 필립스 엔.브이. 조명 장치를 위해 코드화된 경고 시스템
CN201569965U (zh) * 2009-12-31 2010-09-01 宏碁股份有限公司 偏心型散热装置
CN201628780U (zh) * 2010-03-18 2010-11-10 华为技术有限公司 一种光模块的笼子
JP5522066B2 (ja) * 2011-01-21 2014-06-18 日立金属株式会社 光通信用カードモジュール
RU106335U1 (ru) * 2011-03-23 2011-07-10 Общество с ограниченной ответственностью "Оптимум" Светильник уличный светодиодный
CN103162269B (zh) * 2011-12-16 2016-08-10 海洋王照明科技股份有限公司 防爆荧光灯的灯筒及具有该灯筒的防爆荧光灯
CN202759723U (zh) * 2012-07-13 2013-02-27 中兴通讯股份有限公司 一种光模块散热装置
CA2882260C (en) * 2012-08-20 2020-07-07 Cooper Technologies Company Lighting applications using organic light emitting diodes
US8879267B2 (en) * 2012-10-09 2014-11-04 Tyco Electronics Corporation Transceiver assembly
US10091911B2 (en) * 2012-12-11 2018-10-02 Infinera Corporation Interface card cooling using heat pipes
CN104053336A (zh) * 2013-03-15 2014-09-17 中兴通讯股份有限公司 光学收发器散热板及光学收发器导轨装置
CN203301922U (zh) * 2013-04-28 2013-11-20 东莞市铝美铝型材有限公司 散热器
CN103582342A (zh) * 2013-10-15 2014-02-12 王磊 高性能控制器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587608A (en) * 1995-10-27 1996-12-24 Meng; Ching-Ming Structure heat sink for power semiconductors
CN1530737A (zh) * 2003-03-17 2004-09-22 扬明光学股份有限公司 积分柱承托装置
CN1946277A (zh) * 2006-10-30 2007-04-11 陈鸿文 高效无风扇散热装置
CN102128364A (zh) * 2010-01-20 2011-07-20 台达电子工业股份有限公司 照明装置及其发光模块
CN102155685A (zh) * 2011-02-18 2011-08-17 深圳市华星光电技术有限公司 背光模块
CN102299127A (zh) * 2011-07-13 2011-12-28 台达电子企业管理（上海）有限公司 用于封装元件的双向散热器及其组装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304786A (zh) * 2016-08-30 2017-01-04 镇海建设集团有限公司 一种户外通信机柜

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