WO2015184635A1 - 栅格阵列封装模块 - Google Patents

栅格阵列封装模块 Download PDF

Info

Publication number
WO2015184635A1
WO2015184635A1 PCT/CN2014/079356 CN2014079356W WO2015184635A1 WO 2015184635 A1 WO2015184635 A1 WO 2015184635A1 CN 2014079356 W CN2014079356 W CN 2014079356W WO 2015184635 A1 WO2015184635 A1 WO 2015184635A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
lga
lga module
plated
module
Prior art date
Application number
PCT/CN2014/079356
Other languages
English (en)
French (fr)
Inventor
谢宗良
陶文辉
谷日辉
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201480002066.2A priority Critical patent/CN104737287B/zh
Priority to PCT/CN2014/079356 priority patent/WO2015184635A1/zh
Publication of WO2015184635A1 publication Critical patent/WO2015184635A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to microelectronics technology, and more particularly to a grid array package module. Background technique
  • LGA Land Grid Array
  • the existing production process it is inevitable that defective products will appear, such as the bottom of the LGA module, such as tin, less tin, and weak soldering. Since the soldering end of the LGA module is below the package, the existing X-RAY detection method can only detect the tin connection problem of the LGA module soldering end. It is impossible to detect the soldering end of the LGA module and the X-RAY inspection. The dependency on the device is high. Moreover, in the event of any defects, the LGA module needs to be removed from the board by professional equipment and then repaired.
  • an embodiment of the present invention provides a grid array package LGA module.
  • an embodiment of the present invention provides a grid array package LGA module, including: a module body, and a plurality of soldering ends disposed on a lower surface of the module body;
  • a plurality of through holes are further disposed in the module body corresponding to the respective soldering ends, and the upper opening of each of the through holes is opened on the upper surface of the module body, and the lower opening is opened on the lower surface of the module body And the lower opening is covered by the soldering end at the corresponding position.
  • the through hole is a plated through hole.
  • the plated through hole is a circular through hole or a square through hole.
  • the upper surface of the module body is on each of the through holes A plated through hole plate is also provided at the opening.
  • the plated through hole disk is circular or square.
  • a plurality of through holes are disposed in a position corresponding to each soldering end in the main body of the LGA module, and a lower opening of the through hole is connected with a soldering end of the lower surface of the LGA module, the through hole
  • the upper opening is opened on the upper surface of the LGA module, so that the detecting device can directly detect and repair the problems of the virtual welding, the less tin, the tin, and the like which occur at the welding end of the lower surface of the LGA module and the single plate through the through hole.
  • the utility model overcomes the problem that the prior art cannot detect the virtual soldering and the less tin in the joint between the soldering end and the single board of the lower surface of the LGA module, and does not need to remove the LGA module from the whole board for maintenance.
  • the operation time with rework is short, and it is not easy to cause the solder joint end of the LGA module to fall off, and it is not easy to cause the disadvantage of the device on the LGA module.
  • FIG. 1 is a schematic structural view of an embodiment of an LGA module according to the present invention.
  • FIG. 2 is a schematic structural view of a first embodiment of a plated through hole on an upper surface of an LGA module of the present invention
  • FIG. 3 is a schematic structural view of a second embodiment of a plated through hole on an upper surface of an LGA module of the present invention
  • FIG. 5 is a schematic structural view of a second embodiment of a plated through hole and a plated through hole plate of an upper surface of an LGA module according to the present invention
  • Embodiment 6 is a schematic structural view of Embodiment 3 of the plated through hole and the plated through hole plate of the upper surface of the LGA module of the present invention
  • FIG. 7 is a schematic structural view of a fourth embodiment of a plated through hole and a plated through hole plate on the upper surface of the LGA module of the present invention.
  • the Grid Array (LGA) module provided in this embodiment specifically includes: a module body 11 and a plurality of soldering ends 102 disposed on a lower surface of the module body 11 .
  • a plurality of through holes 101 are further disposed in the module body 11 at positions corresponding to the respective soldering ends 102, and the upper opening of each of the through holes 101 is opened on the upper surface of the module body 11, and the lower opening is opened on the lower surface of the module body 11. And the lower opening is covered by the solder end 102 at the corresponding position.
  • a plurality of through holes 101 are disposed in the LGA module body 11 at positions corresponding to the respective soldering ends 102.
  • the shape of the through holes 101 may be a circular through hole or a square through hole.
  • the shape and aperture size of the through hole 101 may be The setting is based on actual use and is not limited here.
  • the lower opening of the through hole 101 is connected to the soldering end 102 of the lower surface of the LGA module main body 11, and the upper opening of the through hole 101 is opened on the upper surface of the LGA module main body 11.
  • the through hole 101 can be used to detect the bonding end 102 and the board bonding portion of the lower surface of the LGA module body 11.
  • the detecting probe For example, by directly inserting the detecting probe along the through hole 101 through the detecting device, the problem of the virtual soldering, the tinning, the tinning, and the like occurring at the bonding portion between the soldering end 102 and the single board is detected.
  • the LGA module body 11 After the problem is determined by the detecting device, the LGA module body 11 is not removed from the single board as a whole, and the through hole 101 can be used to add tin to the problematic solder joint 102 and the board joint portion, or the excess tin can pass through.
  • the hole 101 is taken out for easy inspection and maintenance.
  • a plurality of through holes are formed in a position corresponding to each soldering end in the main body of the LGA module, and a lower opening of the through hole is connected to a soldering end of a lower surface of the main body of the LGA module, and an upper opening of the through hole is opened in the LGA
  • the detection device can directly detect and repair the problems such as the virtual welding, the less tin, the connecting tin, etc., which occur at the welding end of the lower surface of the main body of the LGA module through the through hole, and overcome the present problem.
  • the through hole 101 may be a plated through hole 201, and the upper surface of the LGA module main body 11 may be provided with an electroplated through hole plate 103 at the upper opening of each through hole 101.
  • the plated through hole 201 may be a circular through hole or a square through hole, and the plated through hole hole plate 103
  • the shape and size of the plated through hole 201 and the plated through hole plate 103 can be set according to actual use, which is not limited herein.
  • 2 is a schematic structural view of a first embodiment of a plated through hole on an upper surface of an LGA module of the present invention
  • FIG. 3 is a schematic structural view of a second embodiment of a plated through hole on an upper surface of the LGA module of the present invention. As shown in FIG. 2 and FIG.
  • the function of the plated through hole 201 is that the detecting device can directly contact the detecting probe with the upper opening of the plated through hole 201, and the soldering of the butt welding end 102 and the board joint portion is performed.
  • the problem of tin, tin, and the like is detected because the plated through hole 201 is electrically connected to the soldering end 102 of the lower surface of the LGA module body 11, that is, the detection probe is not inserted along the plated through hole 201, and only the detecting probe is required
  • the upper opening of the plated through hole 201 is contacted for detection.
  • the plated through hole 201 can also be used to add tin to the joint portion of the LGA module body 11 and the veneer joint portion, or to increase the fluidity of the solder during the maintenance process of taking out excess tin.
  • FIG. 4 is a schematic structural view of the first embodiment of the plated through hole and the plated through hole plate of the upper surface of the LGA module of the present invention
  • FIG. 5 is an embodiment of the plated through hole and the plated through hole plate of the upper surface of the LGA module of the present invention
  • FIG. 6 is a schematic structural view of a third embodiment of an electroplated through hole and a plated through hole plate on the upper surface of the LGA module of the present invention
  • FIG. 7 is a plated through hole and a plated through hole on the upper surface of the LGA module of the present invention.
  • Schematic diagram of the fourth embodiment of the disk As shown in FIG. 4, FIG. 5, FIG. 6, and FIG.
  • a plated through hole hole plate 103 is further provided, which functions to increase plating of the upper surface of the LGA module body 11.
  • the surface area of the electrical connection between the through hole 201 and the detecting device can be more conveniently detected.

Abstract

一种栅格阵列封装LGA模块，包括：LGA模块主体（11），以及设置在所述LGA模块主体（11）下表面上的多个焊端（102）；在所述LGA模块主体（11）中与各焊端（102）对应的位置上还设置有多个通孔（101），且各通孔（101）的上开口开设于所述LGA模块主体（11）的上表面，下开口开设于所述LGA模块主体（11）的下表面，且所述下开口被对应位置上的所述焊端（102）所覆盖。该栅格阵列封装LGA模块克服了现有技术无法检测模块主体下表面的焊端与单板结合部位出现的虚焊、少锡问题，而且不用将LGA模块主体从单板上取下即可进行维修。

Description

栅格阵列封装模块
技术领域
本发明涉及微电子技术， 尤其涉及一种栅格阵列封装模块。 背景技术
随着微电子技术的飞速发展， 栅格阵列封装 （Land Grid Array, 简称： LGA) 技术也用得越来越多。
在现有的生产过程中难免会出现不良品， 例如 LGA模块底部焊端连锡， 少锡， 虚焊等问题。 由于 LGA模块焊端是在封装体的下方， 现有的 X-RAY 检测方法只能检测 LGA模块焊端的连锡问题， 对 LGA模块焊端少锡和虚焊 无法检测，并且做 X-RAY检测对设备的依赖性较高。而且一旦出现任何的缺 陷都需要用专业设备将 LGA模块从单板上整体取下， 然后进行维修。
这样， 不仅返修的操作时间长， 而且容易导致 LGA模块焊端脱落报废， 还容易引起 LGA模块上器件不良。 发明内容
针对现有技术存在的问题， 本发明实施例提供一种栅格阵列封装 LGA 模块。
第一个方面， 本发明实施例提供一种栅格阵列封装 LGA模块， 包括： 模块主体， 以及设置在所述模块主体下表面上的多个焊端；
在所述模块主体中与各焊端对应的位置上还设置有多个通孔， 且各通 孔的上开口开设于所述模块主体的上表面， 下开口开设于所述模块主体的 下表面， 且所述下开口被对应位置上的所述焊端所覆盖。
在第一方面的第一种可能的实现方式中， 所述通孔为电镀通孔。
根据第一方面的第一种可能的实现方式， 在第二种可能的实现方式中， 所述电镀通孔为圆形通孔或方形通孔。
根据第一方面或第一方面的第一种可能或第一方面的第二种可能的实现 方式， 在第三种可能的实现方式中， 所述模块主体的上表面上， 各通孔的上 开口处还设置有电镀通孔孔盘。
根据第一方面的第三种可能的实现方式， 在第四种可能的实现方式中， 所述电镀通孔孔盘为圆形或方形。
本发明实施例栅格阵列封装 LGA模块，通过在 LGA模块主体中与各 个焊端对应的位置上设置有多个通孔， 通孔的下开口与 LGA模块下表面 的焊端所连接， 通孔的上开口开设于 LGA模块的上表面上， 实现了检测 设备可以通过通孔直接对 LGA模块下表面的焊端与单板结合部位出现的 虚焊、 少锡、 连锡等问题进行检测和维修， 克服了现有技术无法检测 LGA 模块下表面的焊端与单板结合部位出现的虚焊、 少锡问题， 而且不用将 LGA模块从单板上整体取下进行维修。具有返修的操作时间短， 不容易导 致 LGA模块焊端脱落报废， 还不容易引起 LGA模块上器件不良等优势。 附图说明
图 1为本发明 LGA模块实施例的结构示意图；
图 2为本发明 LGA模块上表面的电镀通孔实施例一的结构示意图； 图 3为本发明 LGA模块上表面的电镀通孔实施例二的结构示意图； 图 4为本发明 LGA模块上表面的电镀通孔与电镀通孔孔盘实施例一 的结构示意图；
图 5为本发明 LGA模块上表面的电镀通孔与电镀通孔孔盘实施例二 的结构示意图；
图 6为本发明 LGA模块上表面的电镀通孔与电镀通孔孔盘实施例三 的结构示意图；
图 7为本发明 LGA模块上表面的电镀通孔与电镀通孔孔盘实施例四 的结构示意图。 具体实施方式 为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本 发明实施例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描 述， 显然，所描述的实施例是本发明一部分实施例， 而不是全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有作出创造性劳动前提 下所获得的所有其他实施例， 都属于本发明保护的范围。
图 1为本发明 LGA模块实施例的结构示意图。 如图 1所示， 本实施 例提供的栅格阵列封装 （Land Grid Array, 简称： LGA) 模块具体包括： 模块主体 11， 以及设置在模块主体 11下表面上的多个焊端 102。
在模块主体 11中与各焊端 102对应的位置上还设置有多个通孔 101， 且各通孔 101 的上开口开设于模块主体 11 的上表面， 下开口开设于模块 主体 11的下表面， 且下开口被对应位置上的焊端 102所覆盖。
在 LGA模块主体 11中与各个焊端 102对应的位置上设置有多个通孔 101， 其中， 通孔 101 的形状可以为圆形通孔或者方形通孔， 通孔 101 的 形状与孔径尺寸可以根据实际使用进行设定， 在此不加以限定。 通孔 101 的下开口与 LGA模块主体 11下表面的焊端 102所连接， 通孔 101的上开 口开设于 LGA模块主体 11的上表面上。 通孔 101可以用于对 LGA模块 主体 11下表面的焊端 102与单板结合部位进行检测。 例如， 通过检测设 备直接将检测探针顺着通孔 101插入， 对焊端 102与单板结合部位出现的 虚焊、 少锡、 连锡等问题进行检测。 通过检测设备确定出问题后， 不用将 LGA模块主体 11从单板上整体取下， 可以通过通孔 101向出现问题的焊 端 102与单板结合部位进行加锡， 或者将多余的锡通过通孔 101取出， 方 便检测和维修。
本实施例， 通过在 LGA模块主体中与各个焊端对应的位置上设置有 多个通孔， 通孔的下开口与 LGA模块主体下表面的焊端所连接， 通孔的 上开口开设于 LGA模块主体的上表面上， 实现了检测设备可以通过通孔 直接对 LGA模块主体下表面的焊端与单板结合部位出现的虚焊、 少锡、 连锡等问题进行检测和维修， 克服了现有技术无法检测 LGA模块主体下 表面的焊端与单板结合部位出现的虚焊、 少锡问题， 而且不用将 LGA模 块主体从单板上整体取下进行维修。 具有返修的操作时间短， 不容易导致 LGA模块主体焊端脱落报废， 还不容易引起 LGA模块主体上器件不良等 优势。
在上述实施例的基础上， 通孔 101可以为电镀通孔 201， LGA模块主 体 11的上表面上，各通孔 101的上开口处还可以设置有电镀通孔孔盘 103。
其中， 电镀通孔 201可以为圆形通孔或方形通孔， 电镀通孔孔盘 103 可以为圆形孔盘或方形孔盘， 电镀通孔 201和电镀通孔孔盘 103的形状与 尺寸可以根据实际使用进行设定， 在此不加以限定。 图 2 为本发明 LGA 模块上表面的电镀通孔实施例一的结构示意图， 图 3为本发明 LGA模块 上表面的电镀通孔实施例二的结构示意图。 如图 2、 图 3所示， 电镀通孔 201 的作用是检测设备可以直接将检测探针与电镀通孔 201 的上开口接 触， 进行对焊端 102与单板结合部出现的虚焊、 少锡、 连锡等问题进行检 测，因为电镀通孔 201与 LGA模块主体 11下表面的焊端 102是电气连接， 即不用将检测探针顺着电镀通孔 201 插入， 只需将检测探针与电镀通孔 201的上开口接触即可进行检测。 另外， 电镀通孔 201还可以用于在 LGA 模块主体 11 的焊端 102与单板结合部进行加锡， 或者将多余的锡取出的 维修过程中， 增加焊锡的流动性。
进一歩的， 图 4为本发明 LGA模块上表面的电镀通孔与电镀通孔孔 盘实施例一的结构示意图， 图 5为本发明 LGA模块上表面的电镀通孔与 电镀通孔孔盘实施例二的结构示意图， 图 6为本发明 LGA模块上表面的 电镀通孔与电镀通孔孔盘实施例三的结构示意图， 图 7为本发明 LGA模 块上表面的电镀通孔与电镀通孔孔盘实施例四的结构示意图。 如图 4、 图 5、 图 6、 图 7所示， 在 LGA模块主体上表面的电镀通孔 201外侧， 还设 置有电镀通孔孔盘 103， 其作用是增加 LGA模块主体 11上表面的电镀通 孔 201周围与检测设备之间电气连接的表面积， 可以更加方便进行检测。
最后应说明的是： 以上各实施例仅用以说明本发明的技术方案， 而非对 其限制； 尽管参照前述各实施例对本发明进行了详细的说明， 本领域的普通 技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改， 或者对其中部分或者全部技术特征进行等同替换； 而这些修改或者替换， 并 不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims

权 利 要 求 书
1、 一种栅格阵列封装 LGA模块， 其特征在于， 包括：
LGA模块主体，以及设置在所述 LGA模块主体下表面上的多个焊端; 在所述 LGA模块主体中与各焊端对应的位置上还设置有多个通孔， 且各通孔的上开口开设于所述 LGA模块主体的上表面， 下开口开设于所 述 LGA模块主体的下表面， 且所述下开口被对应位置上的所述焊端所覆 rm。
2、 根据权利要求 1所述的 LGA模块， 其特征在于， 所述通孔为电镀 通孔。
3、 根据权利要求 2所述的 LGA模块， 其特征在于， 所述电镀通孔为 圆形通孔或方形通孔。
4、 根据权利要求 1或 2或 3所述的 LGA模块， 其特征在于， 所述 LGA模块主体的上表面上， 各通孔的上开口处还设置有电镀通孔孔盘。
5、 根据权利要求 4所述的 LGA模块， 其特征在于， 所述电镀通孔孔 盘为圆形或方形。
PCT/CN2014/079356 2014-06-06 2014-06-06 栅格阵列封装模块 WO2015184635A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201480002066.2A CN104737287B (zh) 2014-06-06 2014-06-06 栅格阵列封装模块
PCT/CN2014/079356 WO2015184635A1 (zh) 2014-06-06 2014-06-06 栅格阵列封装模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/079356 WO2015184635A1 (zh) 2014-06-06 2014-06-06 栅格阵列封装模块

Publications (1)

Publication Number Publication Date
WO2015184635A1 true WO2015184635A1 (zh) 2015-12-10

Family

ID=53459267

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/079356 WO2015184635A1 (zh) 2014-06-06 2014-06-06 栅格阵列封装模块

Country Status (2)

Country Link
CN (1) CN104737287B (zh)
WO (1) WO2015184635A1 (zh)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1136220A (zh) * 1995-02-23 1996-11-20 松下电器产业株式会社 载片及其制造方法和安装方法
JPH10313166A (ja) * 1997-03-11 1998-11-24 Ibiden Co Ltd パッケージ搭載用基板
CN201122777Y (zh) * 2007-08-10 2008-09-24 何建志 电连接装置
CN101924284A (zh) * 2009-06-16 2010-12-22 富士康(昆山)电脑接插件有限公司 电连接器及其端子及该电连接器的制造方法
US20110001222A1 (en) * 2008-02-18 2011-01-06 Nozomu Nishimura Electronic device, layered substrate, and methods of manufacturing same
CN102544825A (zh) * 2010-12-20 2012-07-04 泰科电子公司 接点栅格阵列互连件

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1136220A (zh) * 1995-02-23 1996-11-20 松下电器产业株式会社 载片及其制造方法和安装方法
JPH10313166A (ja) * 1997-03-11 1998-11-24 Ibiden Co Ltd パッケージ搭載用基板
CN201122777Y (zh) * 2007-08-10 2008-09-24 何建志 电连接装置
US20110001222A1 (en) * 2008-02-18 2011-01-06 Nozomu Nishimura Electronic device, layered substrate, and methods of manufacturing same
CN101924284A (zh) * 2009-06-16 2010-12-22 富士康(昆山)电脑接插件有限公司 电连接器及其端子及该电连接器的制造方法
CN102544825A (zh) * 2010-12-20 2012-07-04 泰科电子公司 接点栅格阵列互连件

Also Published As

Publication number Publication date
CN104737287A (zh) 2015-06-24
CN104737287B (zh) 2017-11-17

Similar Documents

Publication Publication Date Title
JP2010538463A5 (zh)
TWI491886B (zh) 探針組合體及含有該探針組合體之探針卡以及其製造方法
JP6396633B2 (ja) 回路基板
CN105813397A (zh) 一种提高金手指耐腐蚀性的方法
US9502378B1 (en) Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the same
WO2015184635A1 (zh) 栅格阵列封装模块
JP2015514226A5 (zh)
CN103298250A (zh) 印刷电路板
JP6387620B2 (ja) 品質管理システム
TW201513470A (zh) 電路板連接器
CN208400839U (zh) 用于烧结工艺的跳线
CN103869211B (zh) 一种以手套测试孔内开路的方法
CN206977779U (zh) 一种pcb板v‑cut防呆结构
JP6250309B2 (ja) 多層配線基板の製造方法
CN204730947U (zh) 一种温度传感器的封装结构
JP2010109337A5 (zh)
TWM441826U (en) Improved structure of micro pin fixture connector
TWI639829B (zh) 太陽能電池的檢測方法與檢測系統
TWM547674U (zh) 晶圓測試針座結構改良及其針座
JP4774091B2 (ja) 電源タワーを具えた多層バーンイン基板構造
CN204104224U (zh) 无引线器件的焊膏丝印装置
CN207326297U (zh) 一种用于电路板焊接时固定电子元器件的辅助工装
KR101350793B1 (ko) 인쇄회로기판 통전 검사 지그
Li et al. Fine pitch BGA device solder bridging mechanism investigation through solder shape modeling
JP3183766U (ja) ビアサイズのテスト補助装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14894022

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14894022

Country of ref document: EP

Kind code of ref document: A1