WO2015184614A1 - 大功率高温白光led封装及其制作方法 - Google Patents
大功率高温白光led封装及其制作方法 Download PDFInfo
- Publication number
- WO2015184614A1 WO2015184614A1 PCT/CN2014/079243 CN2014079243W WO2015184614A1 WO 2015184614 A1 WO2015184614 A1 WO 2015184614A1 CN 2014079243 W CN2014079243 W CN 2014079243W WO 2015184614 A1 WO2015184614 A1 WO 2015184614A1
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- WIPO (PCT)
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- led package
- yag
- bracket
- temperature white
- white led
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
Definitions
- the invention relates to the technical field of LED illumination, in particular to a high-power high-temperature white LED package structure and a manufacturing method thereof.
- LEDs are solid-state semiconductor devices that convert electrical energy directly into light energy. Compared with traditional incandescent lamps and fluorescent lamps, white LEDs have the advantages of low power consumption, high luminous efficiency, long service life, energy saving and environmental protection. Therefore, they are widely used not only in the field of daily lighting, but also in the field of display devices. At present, the technology for obtaining white LEDs can be divided into two categories, namely: (1) mixing with three kinds of LED chips emitting red, green and blue light; (2) exciting with monochromatic (blue or ultraviolet) LED chips. Suitable fluorescent material.
- white LEDs mainly use a blue LED chip and a yellow-emitting phosphor Ce:YAG which can be effectively excited by blue light, and then use a lens principle to mix complementary yellow and blue light to obtain white light.
- conventional phosphors have disadvantages such as low excitation efficiency, low light conversion efficiency, and poor uniformity.
- epoxy resin or silica gel mixed with phosphors tends to age at high temperatures, resulting in a decrease in transmittance, which ultimately affects white light devices. Light output efficiency.
- the present invention provides a high power high temperature white LED package and a method of fabricating the same.
- the technical problem to be solved by the present invention is that the existing white light LED has low excitation efficiency and light conversion efficiency, poor uniformity, and the epoxy resin or the silica gel is easily aged at a high temperature to lower the light transmittance and have a short service life.
- the technical solution of the present invention is: a high power high temperature white LED package, including a blue chip, a Ce:YAG solid fluorescent material, and a package bracket surrounding the blue chip and the Ce:YAG solid fluorescent material;
- the Ce:YAG solid fluorescent material is coated on the blue chip.
- the high-power high-temperature white LED package further includes a heat-conducting substrate, and the heat-conductive substrate is attached to the blue chip.
- the surface of the Ce:YAG solid fluorescent material is provided with a red light film, and the red light film can convert part of blue light into red light having an emission band of 580 nm to 660 nm.
- the thermal expansion coefficient of the package holder is equivalent to the thermal expansion coefficient of the Ce:YAG solid fluorescent material.
- the package bracket is any one of a molybdenum bracket, an invar alloy bracket, an aluminum nitride bracket, an aluminum bracket, a copper bracket or a glass bracket.
- the blue chip is a gallium nitride based blue chip.
- the Ce:YAG solid fluorescent material is any one of a Ce:YAG fluorescent single crystal, a Ce:YAG fluorescent polycrystal, a Ce:YAG fluorescent ceramic, or a Ce:YAG fluorescent glass.
- the chemical composition of the main component of the Ce:YAG solid fluorescent material is: (Y 1-xm A x Ce m ) 3 (Al 1-y B y ) 5 O 12 , wherein 0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ m ⁇ 0.05; wherein A is one of Lu, Tb, Pr, La, Gd; B is one of Ga, Ti, Mn, Cr, Zr.
- the invention also discloses a manufacturing method of a high-power high-temperature white LED package, comprising the following steps:
- step B cutting and polishing the Ce:YAG solid fluorescent material prepared in step A to obtain a solid fluorescent sheet of a desired size
- step C The soldering paste inside the package holder obtained in step C is soldered, and then the blue chip and the solid fluorescent sheet are closely attached and fixed in the bracket, wherein the blue chip is fixed on the lower part of the bracket, and the solid fluorescent sheet is fixed on the upper part of the bracket; finally, The fixed device is baked in a 180-260 degree high temperature oven for 2-30 seconds to form an integral package structure.
- step D includes the following steps:
- the invention provides a high-power high-temperature white LED package and a manufacturing method thereof, which directly adheres a solid fluorescent material and a high-power blue chip through a bracket structure, and utilizes a lens principle to convert blue and solid fluorescent light of the chip.
- the material turns yellowish green light and mixes to give white light.
- the high-power high-temperature white LED package structure does not require the use of adhesives, has high fluorescence efficiency, can work at temperatures greater than 150 degrees, is energy-saving and environmentally friendly, and greatly improves the service life of LED lighting equipment.
- Embodiment 1 is a schematic structural view of Embodiment 1 of the present invention.
- Embodiment 2 is a schematic structural view of Embodiment 2 of the present invention.
- FIG. 3 is a schematic structural diagram of Embodiment 3 of the present invention.
- the bracket is square frame-shaped, and a step is formed inside;
- the obtained high-power high-temperature white LED package structure is shown in FIG. 1 .
- bracket 3 is a square frame shape, and the frame thickness is 0.3 mm;
- the obtained high-power high-temperature white LED package structure is shown in FIG. 2 .
- the bracket is strip-shaped to avoid short circuit of the chip, and the thickness of the frame is 0.5 mm;
- a 45 watt high power blue chip 1 having a size of 5*5 mm is fixed on the lower portion of the holder 3, and the fluorescent wafer 2 is fixed on the upper portion of the holder 3, and the blue chip is fixed. 1 is closely adhered to the fluorescent wafer 2, and the fixed device is baked in a 230-degree high-temperature furnace for 10 seconds, and finally the device is integrally soldered on the heat-conductive substrate 6 to form a high-power high-temperature white LED overall package structure.
- a red light film 7 is added on the surface of the fluorescent wafer.
- the obtained high-power high-temperature white LED package structure is shown in FIG.
- the bracket is in a square frame shape, and a step is formed inside;
- the bracket is a rectangular frame shape, and a step is formed inside;
- the bracket has a square frame shape, and the frame thickness is 0.3 mm;
- the bracket is a rectangular frame shape, and a step is formed inside;
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (10)
- 大功率高温白光LED封装,包括蓝光芯片、Ce:YAG固态荧光材料,以及包围所述蓝光芯片和Ce:YAG固态荧光材料的封装支架;所述Ce:YAG固态荧光材料覆盖贴合于蓝光芯片上。
- 根据权利要求1所述的大功率高温白光LED封装,其特征在于,所述大功率高温白光LED封装还包括导热基板,所述导热基板与所述蓝光芯片贴合。
- 根据权利要求1所述的大功率高温白光LED封装,其特征在于,所述Ce:YAG固态荧光材料的表面设有红光膜,所述红光膜可将部分蓝光转换为发光波段为580nm到660nm的红光。
- 根据权利要求1~3任一所述的大功率高温白光LED封装,其特征在于,所述封装支架的热膨胀系数与Ce:YAG固态荧光材料的热膨胀系数相当。
- 根据权利要求4所述的大功率高温白光LED封装,其特征在于,所述封装支架为钼支架、因瓦合金支架、氮化铝支架、铝支架、铜支架或玻璃支架中的任意一种。
- 根据权利要求1~3任一所述的大功率高温白光LED封装,其特征在于,所述蓝光芯片为氮化镓基蓝光芯片。
- 根据权利要求1~3任一所述的大功率高温白光LED封装,其特征在于,所述Ce:YAG固态荧光材料为Ce:YAG荧光单晶、Ce:YAG荧光多晶、Ce:YAG荧光陶瓷或Ce:YAG荧光玻璃中的任意一种。
- 根据权利要求7所述的大功率高温白光LED封装,其特征在于,所述Ce:YAG固态荧光材料主体成分化学式为:(Y1-x-mAxCem)3(Al1-yBy)5O12,其中,0≤x≤1,0≤y≤1,0≤m≤0.05;其中A为Lu、Tb、Pr、La、Gd中的一种;B为Ga、Ti、Mn、Cr、Zr中的一种。
- 权利要求1所述的大功率高温白光LED封装的制作方法,其特征在于,包括以下步骤:A.制作Ce:YAG固态荧光材料;B.对步骤A制得的Ce:YAG固态荧光材料切磨抛光得到所需尺寸的固态荧光片;C.制作封装支架;D.在步骤C制得的封装支架内部镀锡膏,然后将蓝光芯片和固态荧光片贴紧后固定在支架内,其中蓝光芯片固定在支架下部,固态荧光片固定于支架上部;最后,将固定好的器件放入180-260度高温炉内烘烤2-30秒,形成整体封装结构。
- 根据权利要求9所述的大功率高温白光LED封装的制作方法,其特征在于,所述步骤D后包括以下步骤:E.将封装结构的下部蓝光芯片端固定于导热基板上;F.在固态荧光片的表面增加红光膜。
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PCT/CN2014/079243 WO2015184614A1 (zh) | 2014-06-05 | 2014-06-05 | 大功率高温白光led封装及其制作方法 |
CN201480000542.7A CN105431503B (zh) | 2014-06-05 | 2014-06-05 | 大功率高温白光led封装及其制作方法 |
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CN111285674A (zh) * | 2018-12-07 | 2020-06-16 | 上海航空电器有限公司 | 大功率激光照明用超薄荧光陶瓷、制备方法及光学系统 |
CN111333417A (zh) * | 2020-03-09 | 2020-06-26 | 西北工业大学 | 一种共晶荧光复合陶瓷及其制备方法和应用 |
CN113025306A (zh) * | 2019-12-09 | 2021-06-25 | 上海航空电器有限公司 | 自带复合抛物面集光能力的荧光体及其制备方法 |
CN113024242A (zh) * | 2019-12-09 | 2021-06-25 | 上海航空电器有限公司 | 获得高流明激光照明的超细陶瓷荧光体及其制备方法 |
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CN111333417A (zh) * | 2020-03-09 | 2020-06-26 | 西北工业大学 | 一种共晶荧光复合陶瓷及其制备方法和应用 |
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CN105431503B (zh) | 2018-05-04 |
CN105431503A (zh) | 2016-03-23 |
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