WO2015178336A1 - Dispositif d'eclairage - Google Patents

Dispositif d'eclairage Download PDF

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Publication number
WO2015178336A1
WO2015178336A1 PCT/JP2015/064158 JP2015064158W WO2015178336A1 WO 2015178336 A1 WO2015178336 A1 WO 2015178336A1 JP 2015064158 W JP2015064158 W JP 2015064158W WO 2015178336 A1 WO2015178336 A1 WO 2015178336A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
surface light
path
emitting element
emitting module
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PCT/JP2015/064158
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English (en)
Japanese (ja)
Inventor
正利 米山
伸哉 三木
淳弥 若原
木村　直樹
Original Assignee
コニカミノルタ株式会社
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Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to JP2016521087A priority Critical patent/JPWO2015178336A1/ja
Publication of WO2015178336A1 publication Critical patent/WO2015178336A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source

Definitions

  • the present disclosure relates to a lighting device, and more particularly, to a lighting device having a planar light emitting element.
  • Patent Document 1 discloses an LED lighting device for reducing a decrease in luminance due to an open failure of an LED or the like. As a specific means for solving this, the LED illumination device bypasses the current in parallel with the LEDs connected in series, and lights other LEDs than the failed LED.
  • lighting devices including light emitting elements such as OLEDs and LEDs are often provided with a current circuit for controlling the current flowing through the light emitting elements so that the luminance of the light emitting elements is constant.
  • a large voltage is applied to the current circuit due to a short circuit failure or an open failure of the light emitting element, and the current circuit may fail.
  • the illuminating device which can avoid the failure of the current circuit accompanying the failure of a light emitting element is desired.
  • light emitting elements such as OLEDs cause uneven light emission due to a temperature difference in the surface of the light emitting elements due to heat generation in the current circuit.
  • the OLED becomes brighter as the temperature of the light emitting surface is higher, and darker as the temperature of the light emitting surface is lower.
  • Such luminance unevenness is a problem peculiar to planar light emitting elements such as OLEDs. Therefore, the LED lighting device disclosed in Patent Document 1 cannot solve this problem.
  • the disclosure in the present application has been made to solve the above-described problems, and an object in one aspect is to avoid inconvenience caused by the failure of the light emitting element and to improve the light emission unevenness of the light emitting element. It is to provide a lighting device that can.
  • an illuminating device including a current circuit and a surface emitting module connected in series to the current circuit.
  • the surface light emitting module includes a first path connected in series to the current circuit, a surface light emitting element interposed in the first path, a second path connected in parallel to the surface light emitting element, and a second path.
  • a sheet-like load inserted in the path, a switch circuit capable of bringing one of the first path and the second path into a conductive state, and a voltage applied to both ends of the surface emitting module is predetermined.
  • the switch circuit is driven so that the first path is turned on and the second path is turned off, and the voltage applied to both ends of the surface emitting module is included in the predetermined range.
  • a control circuit that drives the switch circuit so that the first path is turned off and the second path is turned on.
  • the sheet-like load is in direct or indirect contact with the current circuit.
  • FIG. 2 is a cross-sectional view taken along line II-II in FIG. It is the figure which showed visually the electric current which flows into the illuminating device according to Embodiment 1 when a surface emitting element is operate
  • FIG. 10 is a cross-sectional view taken along line VV in FIG. 9. It is a front view which shows the illuminating device according to Embodiment 2.
  • FIG. 12 is a cross-sectional view taken along line VII-VII in FIG. 11.
  • FIG. 6 is a circuit diagram of a lighting device according to a third embodiment.
  • FIG. 1 is a front view showing the surface emitting module 10 and shows a state when the surface emitting module 10 is viewed from the back surface 19 side of the surface emitting module 10.
  • FIG. 2 is a cross-sectional view taken along line II-II in FIG.
  • the surface light emitting module 10 includes a transparent substrate 11 (cover layer), a surface light emitting element 31 formed on the transparent substrate 11, and a load 45 formed on the surface light emitting element 31.
  • the surface emitting module 10 has a size of about 10 cm in length and width.
  • the surface emitting module 10 includes a path 41, a path 43, a switch circuit 47, and a control circuit 49 in addition to the surface light emitting element 31 and the load 45, as shown in FIG.
  • the surface light emitting element 31 includes an anode (anode) 14, an organic layer 15, a cathode (cathode) 16, a sealing member 17, and an insulating layer 18.
  • the transparent substrate 11 forms the light emitting surface 12 (surface) of the surface light emitting module 10.
  • the anode 14, the organic layer 15, and the cathode 16 are sequentially stacked on the back surface 13 of the transparent substrate 11.
  • the sealing member 17 forms the back surface 19 of the surface emitting module 10.
  • a transparent member is used as a member constituting the transparent substrate 11.
  • a light transmissive film substrate such as polyethylene terephthalate (PET) or polycarbonate (PC) is used.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • Various glass substrates may be used for the transparent substrate 11.
  • polyimide polyethylene naphthalate (PEN), polystyrene (PS), polyethersulfone (PES), polypropylene (PP), etc. are used as the light transmissive film substrate.
  • PEN polyethylene naphthalate
  • PS polystyrene
  • PS polyethersulfone
  • PP polypropylene
  • the anode 14 is a conductive film having transparency.
  • ITO Indium Tin Oxide
  • PEDOT polyethylenedioxythiophene
  • the organic layer 15 (light emitting unit) can generate light (visible light) when power is supplied.
  • the organic layer 15 may be composed of a single light emitting layer, or may be composed of a hole transport layer, a light emitting layer, a hole blocking layer, an electron transport layer, and the like that are sequentially laminated. .
  • the cathode 16 is, for example, aluminum (AL).
  • the cathode 16 is formed so as to cover the organic layer 15 by a vacuum deposition method or the like. In order to pattern the cathode 16 into a predetermined shape, a mask may be used during vacuum deposition.
  • Other materials for the cathode 16 include lithium fluoride (LiF), a stack of Al and Ca, a stack of Al and LiF, a stack of Al and Ba, and the like.
  • An insulating layer 18 is provided between the cathode 16 and the anode 14 so that the cathode 16 and the anode 14 are not short-circuited.
  • the insulating layer 18 is formed in a desired pattern so as to cover a portion that insulates the anode 14 and the cathode 16 from each other using a photolithography method or the like after, for example, a SiO 2 film is formed using a sputtering method.
  • the sealing member 17 is made of an insulating resin or a glass substrate.
  • the sealing member 17 is formed to protect the organic layer 15 from moisture and the like.
  • the sealing member 17 seals substantially the whole of the anode 14, the organic layer 15, and the cathode 16 (a member provided inside the surface emitting module 10) on the transparent substrate 11. A part of the anode 14 is exposed from the sealing member 17 for electrical connection.
  • the sealing member 17 has gas barrier properties by laminating a plurality of layers of inorganic thin films such as SiO2, AL2O3, SiNx and flexible acrylic resin thin films on a film of PET, PEN, PS, PES, polyimide, etc. What is provided with is used. Gold, silver, copper, or the like may be further laminated on the electrode portion 21 and the electrode portion 22.
  • the portion exposed from the sealing member 17 of the anode 14 (left side in FIG. 2) constitutes an electrode portion 21 (for anode).
  • the electrode portion 21 and the anode 14 are made of the same material.
  • the electrode portion 21 is located on the outer periphery of one side surface of the surface emitting module 10.
  • the portion of the cathode 16 exposed from the sealing member 17 (on the right side in FIG. 2) constitutes an electrode portion 22 (for the cathode).
  • the electrode part 22 and the cathode 16 are made of the same material.
  • the electrode part 22 is also located on the other outer periphery of the surface emitting module 10.
  • the electrode part 21 and the electrode part 22 are located on opposite sides of the organic layer 15.
  • a wiring pattern (not shown) is attached to the electrode portion 21 and the electrode portion 22 using soldering (silver paste) or the like.
  • the load 45 is composed of a sheet-like resistor.
  • the load 45 is provided so as to directly or indirectly contact a current circuit 50 described later.
  • the load 45 is provided so as to be overlapped on one surface of the surface light emitting element 31. More specifically, the load 45 is provided on the surface opposite to the light emitting surface of the surface light emitting element 31. As will be described later, when the surface light emitting element 31 fails, the load 45 bypasses the current flowing in the surface light emitting element 31 before the failure. Details of the load 45 will be described later.
  • the organic layer 15 constituting the surface light emitting element 31 of the surface light emitting module 10 configured as described above is supplied with an electrode unit 21, an electrode unit 22, an anode 14, and an external power supply device (a constant current source). Power is supplied through the cathode 16. The light generated in the organic layer 15 is taken out from the light emitting surface 12 (surface) through the anode 14 and the transparent substrate 11.
  • FIG. 3 is a diagram visually showing a current flowing through the lighting device 100 when the surface light emitting element 31 is operating normally.
  • FIG. 4 is a diagram visually showing the current flowing through the lighting device 100 immediately after the surface light emitting element 31 has failed.
  • FIG. 5 is a diagram visually showing a current flowing through the lighting device 100 after a predetermined time has elapsed since the surface light emitting element 31 has failed.
  • the lighting device 100 includes a surface emitting module 10, a voltage source 40, and a current circuit 50.
  • the surface emitting module 10 and the current circuit 50 are made of a flexible material so that the lighting device 100 has flexibility (flexibility).
  • the lighting device 100 is configured so that its thickness is within 1 mm.
  • the surface emitting module 10 is connected in series with the voltage source 40 and the current circuit 50.
  • the surface emitting module 10 includes a surface light emitting element 31, a path 41 (first path) connected in series to the current circuit 50, a path 43 (second path) connected in parallel to the path 41, a load 45, a switch circuit 47, and a control circuit 49.
  • the surface light emitting element 31 includes, for example, an OLED.
  • the surface light emitting element 31 is inserted in the path 41.
  • the load 45 is inserted in the path 43.
  • the switch circuit 47 includes a switch 47A inserted in the path 41 and a switch 47B inserted in the path 43.
  • the voltage source 40 supplies a voltage to the surface emitting module 10 and the current circuit 50.
  • the current circuit 50 includes a constant current circuit for supplying a constant current to the surface emitting module 10. Thereby, the brightness
  • the control circuit 49 can drive one of the path 41 and the path 43 and drive the other to a non-conductive state by driving the switch circuit 47. That is, the control circuit 49 can switch the path to be turned on between the path 41 and the path 43. As shown in FIG. 3, when the surface light emitting element 31 is normal, the control circuit 49 drives the switch circuit 47 so that the path 41 is turned on and the path 43 is turned off. . Thereby, the voltage from the voltage source 40 is applied to the surface emitting module 10 and the current circuit 50. Along with this, a current flows to the surface light emitting element 31, and the surface light emitting element 31 emits light.
  • the lighting device 100 prevents the current circuit 50 from failing due to the failure of the surface light emitting element 31.
  • the failure of the surface light emitting element 31 according to the present embodiment includes a short failure and an open failure.
  • the short fault in this Embodiment means the fault which the surface emitting element 31 short-circuits.
  • the open failure in the present embodiment refers to a failure in which the surface light emitting element 31 is disconnected.
  • V ALL V F + V I is established.
  • the voltage V F according to the surface-emitting module 10 becomes zero. Accordingly, the voltage V I applied to the current circuit 50 is increased from V ALL -V F to V ALL. That is, the voltage V I applied to the current circuit 50 increases by the amount of the voltage V F applied to the surface light emitting element 31 before the failure of the surface light emitting element 31.
  • the current circuit 50 When the voltage applied to the current circuit 50 exceeds a certain voltage (hereinafter, also referred to as “allowable voltage”), the current circuit 50 generates heat, resulting in failure. In particular, when the surface emitting module 10 is thinned, the allowable voltage of the current circuit 50 is reduced, so that the risk of failure of the current circuit 50 is increased.
  • a certain voltage hereinafter, also referred to as “allowable voltage”
  • the resistance value of the load 45 is determined so that the voltage applied to the current circuit 50 does not change before and after the surface light emitting element 31 is short-circuited.
  • Whether or not the surface light emitting element 31 has a short circuit failure is determined, for example, by the control circuit 49 monitoring the voltage applied to the surface light emitting module 10. More specifically, when the surface light emitting element 31 is short-circuited, the voltage applied to the surface light emitting module 10 is reduced. For this reason, the control circuit 49 determines that the surface light emitting element 31 has a short circuit failure when the voltage applied to both ends of the surface light emitting module 10 is not included in the predetermined range. In this case, the control circuit 49 drives the switch circuit 47 so as to set the path 41 in a non-conductive state and to set the path 43 in a conductive state.
  • control circuit 49 determines that the surface light emitting element 31 is normal when the voltage applied to both ends of the surface light emitting module 10 is included in a predetermined range. In this case, the control circuit 49 drives the switch circuit 47 so that the path 41 is turned on and the path 43 is turned off.
  • the predetermined range in the present embodiment includes a range having only a lower limit, a range having only an upper limit, and a range having both a lower limit and an upper limit.
  • a lower limit is set in a predetermined range. That is, the control circuit 49 determines that the surface light emitting element 31 has a short circuit failure when the voltage applied to both ends of the surface light emitting module is lower than the lower limit voltage. In this case, the control circuit 49 drives the switch circuit 47 so that the path 41 is turned off and the path 43 is turned on.
  • the illuminating device 100 may include a plurality of surface emitting modules 10 as illustrated in FIGS. 11 and 12 described later. When a plurality of surface light emitting modules 10 are connected in series, there is a possibility that all the surface light emitting elements 31 are extinguished due to an open failure of one surface light emitting element 31. For this reason, the illuminating device 100 according to the present embodiment prevents the other normal surface light emitting elements 31 from being turned off even if one surface light emitting element 31 has an open failure.
  • the control circuit 49 determines that the surface emitting element 31 has an open failure.
  • an upper limit is set in a predetermined range. That is, the control circuit 49 determines that the surface light emitting element 31 has an open failure when the voltage applied to both ends of the surface light emitting module 10 becomes higher than the upper limit voltage. In this case, the control circuit 49 drives the switch circuit 47 so that the path 41 is turned off and the path 43 is turned on.
  • FIG. 6 is a circuit diagram of the surface light emitting module 10 corresponding to a short circuit failure of the surface light emitting element 31.
  • the surface light emitting module 10 in FIG. 6 prevents the current circuit 50 from failing by bypassing the current flowing through the surface light emitting element 31 to the load 45 even when the surface light emitting element 31 has a short circuit failure.
  • the surface light emitting module 10 includes a surface light emitting element 31, a path 41, a path 43, a load 45, a switch circuit 47, and a control circuit 49 as main components.
  • the surface light emitting element 31 is connected between the node N11 and the node N14.
  • the load 45 is connected between the node N11 and the node N12.
  • the switch circuit 47 includes a switch 47A and a switch 47B.
  • the switch 47A is configured by, for example, a transistor Q11 (NPN type).
  • the collector C of the transistor Q11 is connected to the node N14.
  • the base B of the transistor Q11 is connected to the node N12.
  • the emitter E of the transistor Q11 is connected to the node N13.
  • the switch 47B is configured by, for example, a transistor Q12 (NPN type).
  • the collector C of the transistor Q12 is connected to the node N12.
  • the base B of the transistor Q12 is connected to the node N15.
  • the emitter E of the transistor Q12 is connected to the node N13.
  • the control circuit 49 includes resistors R11 to R14. Resistor R11 is connected between nodes N11 and N12. Resistor R12 is connected between nodes N12 and N13. Resistor R13 is connected between nodes N14 and N15. Resistor R14 is connected between nodes N13 and N15.
  • the control circuit 49 When a voltage is applied to the surface emitting module 10, the voltage applied to both ends of the surface emitting element 31 (that is, between the anode and the cathode) gradually increases. As an example, a voltage of about 5 to 7 V is generated in the surface light emitting element 31. At the same time, the voltage applied to the resistors R11 and R12 gradually increases.
  • setting the path 41 in a conductive state is also referred to as turning on the transistor Q11, and setting the path 41 in a non-conductive state is also referred to as turning off the transistor Q11.
  • setting the path 43 in a conductive state is also referred to as turning on the transistor Q12, and setting the path 43 in a non-conductive state is also referred to as turning off the transistor Q12.
  • the timing at which the transistor Q11 is turned on can be adjusted by the ratio between the resistance value of the resistor R11 and the resistance value of the resistor R12. This is because the voltage applied to the resistor R12 is determined by this ratio.
  • the resistance value of the resistor R11 and the resistance value of the resistor R12 are adjusted so that the transistor Q11 is turned on when the voltage applied to the surface light emitting element 31 is 3 V or higher.
  • the timing at which the transistor Q12 is turned on can be adjusted by the ratio between the resistance value of the resistor R13 and the resistance value of the resistor R14.
  • the resistance values of the resistors R11 to R14 are adjusted so that the transistor Q11 is turned on and the transistor Q12 is turned off when the surface light emitting element 31 is normal.
  • the voltage V F according to the surface-emitting module 10 is lowered. Along with this, the voltage applied to the resistor R12 decreases. For this reason, since the voltage applied between the base B and the emitter E of the transistor Q11 is lower than the predetermined voltage, the transistor Q11 is turned off.
  • the lighting device 100 causes the voltage applied to the current circuit 50 to be distributed to the load 45 by causing a voltage drop at the load 45.
  • the lighting apparatus 100 can prevent the failure of the current circuit 50 due to the short-circuit failure of the surface light emitting element 31.
  • FIG. 7 is a circuit diagram of the surface light emitting module 10 corresponding to the open failure of the surface light emitting element 31.
  • the surface light emitting module 10 includes a surface light emitting element 31, a path 41, a path 43, a load 45, a switch circuit 47, and a control circuit 49 as main components.
  • the switch circuit 47 includes a switch 47A and a switch 47B.
  • the switch 47A is formed of, for example, a transistor Q21 (NPN type).
  • the collector C of the transistor Q21 is connected to the surface light emitting element 31.
  • the base B of the transistor Q21 is connected to the node N22.
  • the emitter E of the transistor Q21 is connected to the node N23.
  • the switch 47B is composed of, for example, a transistor Q22 (NPN type).
  • the collector C of the transistor Q22 is connected to the load 45.
  • the base B of the transistor Q22 is connected to the node N24.
  • the emitter E of the transistor Q22 is connected to the node N23.
  • the surface light emitting element 31 is connected between the node N21 and the collector C of the transistor Q21.
  • Load 45 is connected between node N21 and collector C of transistor Q22.
  • the control circuit 49 includes resistors R21 to R24. Resistor R21 is connected between nodes N21 and N22. Resistor R22 is connected between nodes N22 and N23. Resistor R23 is connected between nodes N22 and N24. Resistor R24 is connected between nodes N23 and N24.
  • the control circuit 49 When a voltage is applied to the surface emitting module 10, the voltage applied to both ends of the surface emitting element 31 (that is, between the anode and the cathode) gradually increases. As an example, a voltage of about 5 to 7 V is generated in the surface light emitting element 31. At the same time, the voltage applied to the resistors R21 and R22 also gradually increases.
  • the transistor Q21 since the voltage applied between the base B and the emitter E of the transistor Q21 is equal to the voltage applied to the resistor R22, the transistor Q21 is turned on when the voltage applied to the resistor R22 exceeds a predetermined voltage. That is, the path 41 is switched from the non-conductive state to the conductive state, and accordingly, the surface light emitting element 31 emits light.
  • the timing at which the transistor Q21 is turned on can be adjusted by the ratio between the resistance value of the resistor R21 and the resistance value of the resistor R22.
  • the resistance value of the resistor R21 and the resistance value of the resistor R22 are adjusted so that the transistor Q21 is turned on when the voltage applied to the surface light emitting element 31 is 3 V or higher.
  • the timing at which the transistor Q22 is turned on can be adjusted by the ratio of the resistance value of the resistor R21, the resistance value of the resistor R23, and the resistance value of the resistor R24.
  • the resistance values of the resistors R21 to R24 are adjusted so that the transistor Q21 is turned on and the transistor Q22 is turned off when the surface light emitting element 31 is normal.
  • the voltage V F according to the surface-emitting module 10 becomes larger.
  • the voltage applied to the resistor R24 increases.
  • the resistance value of the load 45 when the transistor Q22 is turned ON, the voltage V F is adjusted to be above 7V (e.g., 8V). This prevents a large voltage from being applied to the current circuit 50.
  • the lighting device 100 can prevent the other surface light emitting elements 31 from being turned off even when one surface light emitting element 31 has an open failure.
  • FIG. 8 is a circuit diagram of the surface emitting module 10 corresponding to both a short circuit failure and an open failure of the surface light emitting element 31.
  • the surface emitting module 10 in FIG. 8 prevents the current circuit 50 from failing by bypassing the current flowing through the surface light emitting element 31 to the load 45 even when the surface light emitting element 31 has a short circuit failure. .
  • the surface light emitting module 10 bypasses the current flowing through the surface light emitting element 31 to the load 45 so that a current is supplied to the surface light emitting element 31 that has not failed. To prevent all the surface light emitting elements 31 from being turned off.
  • the surface light emitting module 10 includes a surface light emitting element 31, a path 41, a path 43, a load 45, a switch circuit 47, and a control circuit 49 as main components.
  • Switch circuit 47 includes a switch 47A, a switch 47B, and a switch 47C.
  • the switch 47A is composed of, for example, a transistor Q31 (NPN type).
  • the collector C of the transistor Q31 is connected to the node N34.
  • the base B of the transistor Q31 is connected to the node N32.
  • the emitter E of the transistor Q31 is connected to the node N33.
  • the switch 47B is composed of, for example, a transistor Q32 (NPN type).
  • the collector C of the transistor Q32 is connected to the node N32.
  • the base B of transistor Q32 is connected to node N35.
  • the emitter E of the transistor Q32 is connected to the node N33.
  • the switch 47C is composed of, for example, a transistor Q33 (NPN type).
  • the collector C of the transistor Q32 is connected to the node N32.
  • the base B of transistor Q32 is connected to node N36.
  • the emitter E of the transistor Q32 is connected to the node N33.
  • the surface light emitting element 31 is connected between the node N31 and the node N34.
  • the load 45 is connected between the node N31 and the node N32.
  • the control circuit 49 includes resistors R31 to R36. Resistor R31 is connected between nodes N31 and N32. Resistor R32 is connected between nodes N32 and N33. Resistor R33 is connected between nodes N34 and N35. Resistor R34 is connected between nodes N33 and N35. Resistor R35 is connected between nodes N31 and N36. Resistor R36 is connected between nodes N33 and N36.
  • the control circuit 49 When a voltage is applied to the surface emitting module 10, the voltage applied to both ends of the surface emitting element 31 (that is, between the anode and the cathode) gradually increases. As an example, a voltage of about 5 to 7 V is generated in the surface light emitting element 31. At the same time, the voltage applied to the resistors R31 and R32 also gradually increases.
  • the voltage applied between the base B and the emitter E of the transistor Q31 is equal to the voltage applied to the resistor R32. For this reason, when the voltage applied to the resistor R32 exceeds a predetermined voltage, the transistor Q31 is turned on. Along with this, a current flows through the surface light emitting element 31, and the surface light emitting element 31 emits light.
  • the timing at which the transistor Q31 is turned on can be adjusted by the ratio between the resistance value of the resistor R31 and the resistance value of the resistor R32. This is because the voltage applied to the resistor R32 is determined by this ratio. As an example, the resistance value of the resistor R31 and the resistance value of the resistor R32 are adjusted so that the transistor Q31 is turned on when the voltage applied to the surface light emitting element 31 is 3 V or higher. Similarly, the timing at which the transistor Q32 is turned on can be adjusted by the ratio between the resistance value of the resistor R33 and the resistance value of the resistor R34. Similarly, the timing at which the transistor Q33 is turned on can be adjusted by the ratio between the resistance value of the resistor R35 and the resistance value of the resistor R36. The resistance values of the resistors R31 to R36 are adjusted so that the transistor Q31 is turned on and the transistors Q32 and Q33 are turned off when the surface emitting element 31 is normal.
  • the voltage V F according to the surface-emitting module 10 is lowered. Along with this, the voltage applied to the resistor R32 decreases. For this reason, since the voltage applied between the base B and the emitter E of the transistor Q31 is lower than the predetermined voltage, the transistor Q31 is turned off.
  • the lighting device 100 can distribute the voltage applied to the current circuit 50 to the load 45 by causing a voltage drop at the load 45. Thereby, the failure of the current circuit 50 due to the short failure of the surface light emitting element 31 can be prevented.
  • the voltage V F according to the surface-emitting module 10 becomes larger.
  • the voltage applied to the resistor R36 increases.
  • the voltage applied between the base B and the emitter E of the transistor Q33 exceeds a predetermined voltage, so that the transistor Q33 is turned on.
  • the resistance value of the load 45 when the transistor Q33 is turned ON, the voltage V F is adjusted to be above 7V (e.g., 8V). This prevents a large voltage from being applied to the current circuit 50.
  • the lighting device 100 can prevent the other surface light emitting elements 31 from being turned off even when one surface light emitting element 31 has an open failure.
  • the details of the load 45 will be described with reference to FIGS. 1 and 2 again.
  • the luminance of the surface light emitting module 10 is affected by the temperature in the surface. More specifically, the brightness of the surface light emitting element 31 increases as the temperature increases, and decreases as the temperature decreases. Since the power source such as the voltage source 40 and the current circuit 50 generates heat, the temperature in the region in the surface emitting module 10 closer to the position where the power source is disposed becomes higher. Thereby, luminance unevenness caused by the temperature difference occurs in the surface emitting module 10.
  • the load 45 is composed of a sheet-like resistor (hereinafter also referred to as “sheet resistor”), and is provided so as to diffuse the heat generated from the current circuit 50 to the sheet resistor. That is, the sheet resistance is provided so as to contact the current circuit 50 directly or indirectly. In other words, the sheet resistance is provided so that heat generated from the current circuit 50 is conducted to the sheet resistance. That is, the sheet resistance may be provided so as to be in direct contact with the current circuit 50, or another object may be provided between the sheet resistance and the current circuit 50.
  • sheet resistor a sheet-like resistor
  • the sheet resistance is provided so as to be overlapped on one surface of the surface light emitting element 31. More specifically, the sheet resistance is provided on the surface opposite to the light emitting surface of the surface light emitting element 31. Thereby, the sheet resistance can diffuse and dissipate heat in the surface light emitting module 10, and a temperature difference in the surface light emitting module 10 can be reduced. As a result, luminance unevenness in the surface emitting module 10 is reduced.
  • the sheet resistance is configured such that its thermal conductivity is higher than the thermal conductivity of the surface light emitting element 31. Thereby, the heat in the surface emitting module 10 can be more reliably diffused to the sheet resistance.
  • the sheet resistance is made of, for example, copper, nickel, manganese, chromium, and other metal alloys having high thermal conductivity. Further, the sheet resistance is provided so as to overlap a part or all of the light emitting region of the surface light emitting element 31 (that is, the region of the organic layer 15 in FIG. 1). By providing the sheet resistance in this way, heat in the surface emitting module 10 is effectively diffused into the sheet resistance.
  • the circuit board 60 on which the current circuit 50 is mounted has a heat radiation pattern for the current circuit 50 in the board.
  • a conductive adhesive or conductive grease may be used between the sheet resistance and the circuit board. This stabilizes the contact and thermal conductivity between the sheet resistance and the circuit board.
  • the sheet resistance is configured as a member different from the surface light emitting element 31, but the sheet resistance may be configured inside the surface light emitting element 31. That is, the sheet resistance may be configured integrally with the surface light emitting element 31.
  • FIG. 9 is a front view showing the lighting device 100, and shows a state when the lighting device 100 is viewed from the front side of the lighting device 100.
  • 10 is a cross-sectional view taken along line VV in FIG.
  • the lighting device 100 includes a surface light emitting module 10, a load 45, a current circuit 50, and a circuit board 60.
  • the surface emitting module 10, the load 45, the current circuit 50, and the circuit board 60 are configured by members having flexibility so that the lighting device 100 has flexibility.
  • the lighting device 100 is configured so that its thickness is within 1 mm.
  • the current circuit 50 is electrically connected to the surface light emitting module 10 so that a constant current is supplied to the surface light emitting module 10. As described above, when the surface light emitting element 31 is short-circuited, the current flowing in the surface light emitting module 10 is bypassed to the load 45.
  • the load 45 (that is, the sheet resistance) is provided so as to directly or indirectly contact the current circuit 50 in order to diffuse the heat generated from the current circuit 50 to the load 45. That is, the load 45 may be provided so as to contact the current circuit 50, or another object (for example, the circuit board 60) may be provided between the load 45 and the current circuit 50. Note that the arrangement of the circuit board 60 and the current circuit 50 in FIG. 10A may be reversed and the arrangement shown in FIG. In this case, the current circuit 50 and the load 45 are in direct contact.
  • a circuit configuration such as the control circuit 49 described above is mounted on the circuit board 60.
  • the load 45, the current circuit 50, and the lighting device 100 are electrically connected to each other.
  • FIG. 11 is a front view showing the lighting device 100A, and shows a state when the lighting device 100A is viewed from the front side of the lighting device 100A.
  • 12 is a cross-sectional view taken along line VII-VII in FIG.
  • Lighting device 100A according to the present embodiment is different from lighting device 100 according to the first embodiment in that it includes a plurality of surface emitting modules. Since other points are similar to those of lighting apparatus 100A according to the first embodiment, description thereof will not be repeated.
  • the lighting device 100A includes a surface light emitting module 10A, a surface light emitting module 10B, a load 45A, a load 45B, a current circuit 50, and a circuit board 60.
  • the surface emitting module 10A, the surface emitting module 10B, the load 45A, the load 45B, the current circuit 50, and the circuit board 60 are configured by members having flexibility so that the lighting device 100A has flexibility.
  • the As an example, the lighting device 100A is configured to have a thickness of 1 mm or less.
  • the surface emitting module 10A and the surface emitting module 10B are connected to each other in series so that a constant current is supplied to each. Since the surface light emitting module 10A and the surface light emitting module 10B are connected in series, when one of the surface light emitting modules fails to open, both the surface light emitting module 10A and the surface light emitting module 10B may be extinguished. There is. For this reason, lighting apparatus 100A according to the present embodiment does not turn off other normal surface emitting modules even when one of the surface emitting modules has an open failure. That is, the lighting device 100A bypasses the current to the load 45A when the surface emitting module 10A fails. The lighting device 100A bypasses the current to the load 45B when the surface emitting module 10B fails. Since the details of the operation of the lighting device 100A when the surface light emitting module 10A is short-circuited are the same as those of the lighting device 100 described above, the description will not be repeated.
  • FIG. 13 is a circuit diagram of the lighting device 100B.
  • the configuration of switch circuit 47 is different from that of lighting apparatus 100 according to the first embodiment. Since other points are similar to those of lighting apparatus 100 according to the first embodiment, description thereof will not be repeated.
  • the switch circuit 47 included in the lighting device 100B includes a single-pole double-throw switch 47D. More specifically, one end of the switch 47D can be electrically connected to the path 41 or the path 43. With this configuration, the switch circuit 47 can be configured with one switch 47D, and thus the manufacturing cost can be reduced.
  • a lighting device including a current circuit and a surface emitting module connected in series to the current circuit.
  • the surface light emitting module includes a first path connected in series to the current circuit, a surface light emitting element interposed in the first path, a second path connected in parallel to the surface light emitting element, and a second path.
  • a sheet-like load inserted in the path, a switch circuit capable of bringing one of the first path and the second path into a conductive state, and a voltage applied to both ends of the surface emitting module is predetermined.
  • the switch circuit is driven so that the first path is turned on and the second path is turned off, and the voltage applied to both ends of the surface emitting module is included in the predetermined range.
  • a control circuit that drives the switch circuit so that the first path is turned off and the second path is turned on.
  • the sheet-like load is in direct or indirect contact with the current circuit.
  • the predetermined range has a first voltage as a lower limit.
  • the control circuit switches the first path to the non-conductive state and the second path to the conductive state when the voltage applied to both ends of the surface emitting module is lower than the first voltage.
  • the switch circuit is driven so as to drive.
  • the predetermined range has a second voltage higher than the first voltage as an upper limit.
  • the control circuit switches the first path to the non-conductive state and the second path to the conductive state when the voltage applied to both ends of the surface emitting module becomes higher than the second voltage. Drive.
  • the sheet-like load is provided on the surface opposite to the light emitting surface of the surface light emitting element.
  • the thermal conductivity of the sheet-like load is higher than the thermal conductivity of the surface light emitting element.
  • the sheet-like load is provided so as to overlap a part or all of the light emitting region of the surface light emitting element.
  • the current circuit and the surface emitting module are made of a flexible material.
  • the current circuit includes a constant current circuit for supplying a constant current to the surface emitting module.
  • the lighting device includes a plurality of surface emitting modules connected in series to a current circuit.
  • 10, 10A, 10B surface light emitting module 11 transparent substrate, 12 light emitting surface, 13 back surface, 14 anode, 15 organic layer, 16 cathode, 17 sealing member, 18 insulating layer, 19 back surface, 21, 22 electrode part, 31 surface Light emitting element, 40 voltage source, 41, 43 path, 45, 45A, 45B load (sheet resistance), 47 switch circuit, 47A, 47B, 47C, 47D switch, 49 control circuit, 50 current circuit, 60 circuit board, 100, 100A, 100B lighting device, N11 to N36 nodes, Q11 to Q33 transistors, R11 to R36 resistors.

Landscapes

  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

　L'objet de l'invention est d'éviter les problèmes provoqués par un dysfonctionnement d'un élément électroluminescent, et de réduire l'irrégularité d'émission de lumière par l'élément électroluminescent. Pour ce faire, un module (10) électroluminescent de surface comprend : un trajet (41) connecté en série à un circuit de courant (50); un élément électroluminescent (31) de surface interposé dans le trajet (41); un trajet (43) connecté en parallèle à l'élément électroluminescent (31) de surface; une charge en forme de feuille (45) interposée dans le trajet (43); un circuit de commutation (47) qui peut mettre le trajet (41) et/ou le trajet (43) dans un état conducteur; et un circuit de commande (49) destiné à attaquer le circuit de commutation (47) de sorte que, lorsqu'une tension appliquée aux deux extrémités du module (10) électroluminescent de surface est située dans une plage prescrite, le trajet (41) soit mis dans un état conducteur et le trajet (43) soit mis dans un état non conducteur, et, lorsque la tension appliquée aux deux extrémités du module (10) électroluminescent de surface n'est pas située dans la plage prescrite, le trajet (41) soit mis dans un état non conducteur et le trajet (43) soit mis dans un état conducteur. La charge (45) est directement ou indirectement en contact avec le circuit de courant.
PCT/JP2015/064158 2014-05-21 2015-05-18 Dispositif d'eclairage WO2015178336A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073102U (ja) * 1993-06-02 1995-01-17 株式会社タイセー 自動車用送風機の制御装置
JP2008097994A (ja) * 2006-10-12 2008-04-24 Hitachi Ltd 液晶表示装置
JP2008204866A (ja) * 2007-02-21 2008-09-04 Toshiba Lighting & Technology Corp Ｌｅｄ点灯装置及び照明装置システム
WO2011158786A1 (fr) * 2010-06-18 2011-12-22 コニカミノルタホールディングス株式会社 Dispositif d'attaque pour élément électroluminescent organique et dispositif d'éclairage électroluminescent organique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073102U (ja) * 1993-06-02 1995-01-17 株式会社タイセー 自動車用送風機の制御装置
JP2008097994A (ja) * 2006-10-12 2008-04-24 Hitachi Ltd 液晶表示装置
JP2008204866A (ja) * 2007-02-21 2008-09-04 Toshiba Lighting & Technology Corp Ｌｅｄ点灯装置及び照明装置システム
WO2011158786A1 (fr) * 2010-06-18 2011-12-22 コニカミノルタホールディングス株式会社 Dispositif d'attaque pour élément électroluminescent organique et dispositif d'éclairage électroluminescent organique

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