WO2015174981A1 - Dispositif d'élimination de particules et son procédé de fonctionnement - Google Patents

Dispositif d'élimination de particules et son procédé de fonctionnement Download PDF

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Publication number
WO2015174981A1
WO2015174981A1 PCT/US2014/038130 US2014038130W WO2015174981A1 WO 2015174981 A1 WO2015174981 A1 WO 2015174981A1 US 2014038130 W US2014038130 W US 2014038130W WO 2015174981 A1 WO2015174981 A1 WO 2015174981A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
recess
load lock
vacuum
removal device
Prior art date
Application number
PCT/US2014/038130
Other languages
English (en)
Inventor
Byung Wook JEE
Original Assignee
Applied Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials, Inc. filed Critical Applied Materials, Inc.
Priority to PCT/US2014/038130 priority Critical patent/WO2015174981A1/fr
Priority to CN201480078899.7A priority patent/CN106304833A/zh
Priority to KR1020167035076A priority patent/KR20170008270A/ko
Priority to JP2016567808A priority patent/JP2017520112A/ja
Priority to TW104115683A priority patent/TW201605550A/zh
Publication of WO2015174981A1 publication Critical patent/WO2015174981A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • B08B5/023—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool

Definitions

  • Embodiments relate to cleaning of a carrier at or within a vacuum processing system. Embodiments particularly relate to a particle removal device, a load lock chamber and a vacuum processing system.
  • Substrates are often coated, for example, in vacuum coating plants, under high- vacuum conditions, at pressures within the range of 5* 10-4 hPa to 0.5 hPa.
  • load and unload locks are used for the substrates.
  • a particle removal device for a vacuum processing system for processing a substrate supported on a carrier.
  • the particle removal device includes a base body having a recess, wherein the recess is configured such that a portion of the carrier can be moved through the recess, and a brush provided in the recess and being configured to be in contact with the portion of the carrier when moved through the recess.
  • a load lock chamber for a vacuum processing system for processing a substrate supported on a carrier.
  • the load lock chamber includes load lock walls forming a load lock chamber volume, an inlet configured for locking in the carrier into the load lock chamber, wherein the inlet is provided at an inlet wall of the load lock walls, a vacuum generating device for evacuating the load lock chamber, and a particle removal device being located adjacent to the inlet at the inlet wall of the load lock chamber.
  • the particle removal device includes a base body having a recess, wherein the recess is configured such that a portion of the carrier can be moved through the recess, and a brush provided in the recess and being configured to be in contact with the portion of the carrier when moved through the recess.
  • a vacuum processing system for processing a substrate.
  • the system includes a vacuum processing chamber, which is adapted for processing the substrate, a load lock chamber, which is configured for transferring the substrate from atmospheric conditions into the vacuum processing chamber.
  • the load lock chamber includes load lock walls forming a load lock chamber volume, an inlet configured for locking in the carrier into the load lock chamber, wherein the inlet is provided at an inlet wall of the load lock walls, a vacuum generating device for evacuating the load lock chamber, and a particle removal device being located adjacent to the inlet at the inlet wall of the load lock chamber.
  • the particle removal device includes a base body having a recess, wherein the recess is configured such that a portion of the carrier can be moved through the recess, and a brush provided in the recess and being configured to be in contact with the portion of the carrier when moved through the recess.
  • a method of cleaning a carrier in a vacuum processing system includes locking the carrier into a load lock chamber of the vacuum processing system, and cleaning a portion of the carrier with a brush while the carrier is locked into the load lock chamber.
  • FIG. 1 shows a portion of a vacuum processing system a including a particle removal device according to embodiments described herein;
  • FIG. 2A shows a schematic view of a particle removal device according to embodiments described herein and having a brush for cleaning of a carrier;
  • FIG. 2B shows a schematic view of a further particle removal device according to embodiments described herein and having a brush for cleaning of a carrier, gas nozzles and a suction port;
  • FIGS. 3 and 4 show a respective portion of a load lock chamber and a particle removal device according to embodiments described herein;
  • FIGS. 5A and 5B show schematic views of a particle removal device according to embodiments described herein; and FIG. 6 shows a processing system with a load lock chamber according to embodiments described herein.
  • a particle trap or a particle removal device includes a base body and a brush.
  • the brush can clean the carrier at or within a vacuum processing system.
  • the brush can be a vacuum brush, i.e. the brush in combination with suction port for vacuum cleaning of particles cleaned from the carrier with the brush.
  • the particle trap or particle removal device can be beneficial to provide an effective way to prevent particles from reaching the substrate, e.g. a substrate on which flat panel displays are manufactured.
  • PVD physical vapor deposition
  • AKT Pivot and NewAristo from Applied Materials Inc.
  • substrate carriers move on a transportation system, wherein a rod of a carrier is moved on a roller arrangement.
  • particles accumulate on the rod of the substrate carrier.
  • These accumulated particles are transported through the system by the rod of the substrate carrier and circulate in the system.
  • these particles can reach a flat panel substrate either because of airflow patterns, e.g. during venting and pumping of a vacuum chamber such as a load lock chamber, or because of electrostatic and/or dynamic effects.
  • a particle trap or particle removal device can be beneficially adapted to clean the rod of the carrier, at least with a brush, specifically with a brush, a vacuum suction arrangement and/or gas outlets (e.g. gas nozzles) for providing a cleaning gas stream.
  • a brush specifically with a brush
  • a vacuum suction arrangement and/or gas outlets e.g. gas nozzles
  • An effective way to prevent particles from reaching the panels is to trap or remove the particles.
  • FIG. 1 shows an embodiment of a load lock chamber 122 being connected to a processing chamber 124.
  • a particle trap or particle removal device 200 is provided, e.g. at an inlet wall of the load lock chamber. .
  • the load lock chamber 122 may include a vacuum generating device 135, such as a pump.
  • the substrate is essentially vertically-oriented in the load lock chamber and the processing chamber. It is to be understood that a vertically oriented substrate can have some deviation from a vertical, i.e., 90°, orientation in a processing system in order to allow for stable transport or to reduce particle contamination of the substrate (if inclined with the substrate facing slightly downwardly) with an inclination by a few degrees, i.e. the substrates can have a deviation from the vertical orientation of ⁇ 20° or less, for example ⁇ 10° or less.
  • the load lock chamber as described herein may be adapted for large area substrates.
  • large area substrates or respective carriers, wherein the carriers have a plurality of substrates may have a size of at least 0.67 m 2 .
  • the size can be about 0.67m 2 (0.73x0.92m - Gen 4.5) or above, more typically about 2 m 2 to about 9 m 2 or even up to 12 m 2 .
  • the substrates or carriers, for which the structures, systems, chambers, sluices, and valves according to embodiments described herein are provided are large area substrates as described herein.
  • a large area substrate or carrier can be GEN 4.5, which corresponds to about 0.67 m 2 substrates (0.73x0.92m), GEN 5, which corresponds to about 1.4 m 2 substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m 2 substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7m 2 substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m 2 substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented.
  • the system may be configured for TFT manufacturing, e.g. with static deposition, or may be configured for color filter manufacturing, e.g. with dynamic deposition.
  • the load lock chamber as described herein, components thereof, such as the substrate support or tracking system, the slit valves or sluices, or the processing chamber as described herein may be adapted for handling substrates.
  • Substrates may include glass substrates or substrates made of a plastic material, i.e. substrates which are used, for example, for the manufacturing of displays.
  • the embodiments described herein can be utilized for display manufacturing, e.g. PVD, i.e. sputter deposition on large area substrates for the display market.
  • the load lock chamber may include vacuum generating devices, such as vacuum pumps, and may be adapted for maintaining a vacuum within the load lock chamber, e.g. by providing respective vacuum sealable valves at an inlet chamber wall and an outlet chamber wall.
  • the load lock chamber as described herein is adapted for providing a vacuum less than 1 mbar.
  • the load lock chamber is adapted for providing a vacuum typically between about 0.01 mbar and about 1 mbar, more typically between about 0.1 mbar to about 1 mbar.
  • the vacuum processing chamber as described herein may be adapted to be a high vacuum chamber.
  • the processing chamber may include respective vacuum pumps, seals, valves and sluices for generating and maintaining a vacuum in the processing chamber.
  • the processing chamber is adapted for providing a vacuum below about 10 ⁇ 3 mbar.
  • the processing chamber is adapted for providing a vacuum having a pressure typically between about 10 " 12 mbar and about 10 "3 mbar, more typically between about 10 "9 mbar and about 10 "5 mbar.
  • a substrate which is supported by the carrier, is first provided in a load lock chamber 122 through a vacuum sealable valve.
  • the carrier passes over the particle removal device 200 when entering the local chamber 122. Accordingly, particles which adhere to the carrier or a portion of the carrier, e.g. the rod of the carrier, are removed before the carrier enters the load lock chamber 122.
  • the vacuum sealable valve at the inlet wall of the load lock chamber 122 can be closed in order to evacuate the load lock chamber 122 from atmospheric pressure to a lower pressure for operation of the vacuum processing system. After evacuation of the load lock chamber 122 the vacuum sealable valve at the outlet wall of the load lock chamber can be opened such that the substrate can be transferred into the vacuum processing chamber 124.
  • cathodes 113 can be provided in the vacuum processing chamber 124.
  • FIG. 2A shows particle removal device 200, which can be used to illustrate further embodiments described herein.
  • the particle removal device 200 includes a base body 210 and a brush 220.
  • the base body 210 has a recess, e.g. a recess at the upper side of the base body 210.
  • the brush 220 is provided within the recess of the base body 210.
  • a portion of the carrier for example the rod of the carrier, is moved through the recess of the base body 210, the rod can be brushed by the brush 220.
  • a gas outlet arrangement or a gas nozzle arrangement can be provided.
  • the gas nozzle arrangement can include a first set of one or more gas outlets or gas nozzles 231 and a second set of one or more gas outlets or gas nozzles 233.
  • the gas nozzles are connected to a conduit, for example a conduit in which air, dry air, compressed dry air, or another gas configured for cleaning a portion of the carrier can be introduced.
  • the first set of one or more gas outlets or gas nozzles 231 can for example be provided on the left-hand side and the second set of one or more gas outlets or gas nozzles 233 can for example be provided on the right hand side of the base body such that the gas is blown downwardly into the recess of the base body 210 and/or into a lower portion of the recess.
  • a portion of the carrier such as a rod of the carrier, which is moved through the recess of the base body 210, is exposed to the stream of gas from the gas outlet arrangement or gas nozzle arrangement. Exposure to the stream of gas can additionally remove particles, which adhere to the portion of the carrier, for example the rod of the carrier.
  • the one or more gas nozzles of one or both of the set of one or more gas nozzles can include a nozzle outlet for directing a gas jet on the portion of the carrier, e.g. the rod of the carrier.
  • a vacuum arrangement or suction arrangement 240 can be provided.
  • a suction port 241 is in fluid communication with an opening in the recess.
  • the suction port 241 is connected to a conduit 243.
  • the suction port 241 is in fluid communication with a conduit 243.
  • the conduit 243 can be connected to a pump. Particles, which are released from a portion of the carrier, can be vacuum cleaned by the suction arrangement 240.
  • the suction arrangement 240 is beneficial such that particles do not accumulate in particle removal device and/or yet further particles are removed by the suction arrangement, e.g. similar to a vacuum cleaner.
  • Figure 3 shows particle removal device 200, which is mounted to an inlet wall of a local chamber.
  • the brush 220 is mounted in the base body 210, e.g. in the recess of the base body 210.
  • the recess in the base body can have a concave shape, for example with a curved portion, such that a rod of carrier can pass through the recess of the base body 210.
  • a first set of one or more gas outlets or gas nozzles 231 is provided on one side of the base body, for example in an upper portion of the base body and/or on one side of the recess.
  • second set of one or more gas outlets or gas nozzles 232 is provided on an opposing side of the base body, for example in an upper portion of the base body and/or on an opposing side of the recess.
  • Figure 3 further shows a portion of the conduit 243, which can be connected to a pump of the suction arrangement.
  • FIG. 4 shows a portion of a load lock chamber.
  • the load lock chamber has an inlet wall 422 with an opening 492.
  • the opening 492 can be closed with a vacuum sealable valve.
  • the vacuum sealable valve can be selected from the group consisting of: a slit valve, a sluice valve, and a gate valve.
  • the carrier 40 is inserted in the opening 492. As can be seen the carrier includes a rod 42, which moves through the recess in the base body 210.
  • the particle removal device 200 is mounted to the inlet wall 422 with support 410.
  • the first set of one or more gas nozzles 231 and a second set of one or more gas nozzles 233 are provided at the base body to blow air or another gas onto the rod 42 of the carrier 40.
  • the brush in the recess of the base body 210 further removes particles from the rod 42 of the carrier 40. Particles which are removed by the brush and/or the airstream of the gas outlet arrangement or gas nozzle arrangement are removed from the particle removal device 200 with a suction arrangement, wherein a pump is connected to the conduit 243.
  • Figure 5A shows a cross-sectional view of a particle removal device 200 according to some embodiments of the present disclosure.
  • the base body 210 has a recess.
  • a brush 220 is provided within the recess such that the brush can be in contact with the rod 42 of the carrier 40.
  • one or more brushes e.g. one , two or three brushes can be provide in one recess of the base body
  • the brush brushes off particles, which adhere to the rod of the carrier, in order to clean the carrier.
  • the gas nozzle arrangement includes a first set of one or more gas nozzles 231 and the second set of one or more gas nozzles 233. The gas nozzle arrangement further removes particles from the rod 42.
  • Particles which have been removed from the carrier or the rod 42 of the carrier 40, respectively, can be removed from the charged particle removal device 200 through the conduit 243, which can be connected to a pump.
  • the particles are removed by suction arrangement including suction port, the conduit, and/or a pump.
  • FIG. 5B illustrate yet further embodiments, which can be combined with other embodiments described herein.
  • the base body has a first recess, in which a first brush 220 is provided. Further, the base body has second recess, in which the second brush 220 is provided.
  • the first recess and the second recess, or the respective brushes are spaced apart from each other such that carriers, which are moved on a dual track transportation system, can be moved through the respective recesses.
  • the brush on the right-hand side can relate to an inlet of the carrier in the load lock chamber, wherein the brush on the left-hand side can relate to an outlet of the carrier out of the load lock chamber.
  • the brushes are provided within openings, which are essentially circular.
  • the openings are provided as suction openings of the suction arrangement. Particles, which are removed from a rod of a carrier by a brush, can fall into the opening and can be removed through the conduit by means of the pump.
  • the brush and the opening can be moved along an elongated insert in the base body, which is provided as a portion of the conduit being a part of the suction arrangement.
  • the opening and the brush can be moved in position, which is closer to the inlet wall of the load lock chamber for an inlet track of the dual track transportation system.
  • the opening and the brush can be moved within the elongated insert in a position, which is further away from the inlet wall of the load lock chamber for an outlet track of the dual track transportation system.
  • a carrier rod cleaner which can be placed at the entrance of the vacuum processing system, is provided according to embodiments described herein.
  • a nozzle arrangement i.e. air shower or gas shower, which provides the stream of air on top of the carrier rod can be provided.
  • multiple nozzles blow gas or air on the carrier rod for removing accumulated particles.
  • the air flow direction or gas flow direction can be essentially perpendicular (80° to 100°) to the axis of the carrier rod.
  • a suction arrangement i.e. a suction port
  • the suction port can be below the carrier rod. Particles, which are moved away by the nozzle arrangement or by the air shower are drawn away by that suction port, e.g. a vacuum port.
  • a brush can be provided between the air shower and suction port. Accumulated particles, which are not removed by the airflow of the nozzle arrangement, i.e. the air shower, are trapped by a brush. The brush rubs the carrier rod during transfer or movement of the carrier within the vacuum processing system.
  • one or more brushes can be provided in a recess of a base body.
  • the brush can have an antistatic material to allow for better tracking of particles, which are removed from the rod.
  • Fig. 6 shows a processing system 100 according to embodiments described herein.
  • the processing system includes a first vacuum chamber 101, a second vacuum chamber 102, a third vacuum chamber 103, and a fourth vacuum chamber 121.
  • the vacuum chambers can be deposition chambers or other processing chambers, wherein a vacuum is generated within the chambers.
  • a load lock chamber 122 can be seen, which provides for the transition from atmospheric conditions exterior of the processing system to vacuum conditions within the chambers of the processing system.
  • the load lock chamber 122 may be a load lock chamber as described in detail above and may include a particle removal device, e.g. at the inlet wall of the load lock chamber.
  • the particle removal device 200 can be implemented according to any of the embodiments described herein.
  • the load lock chamber 122 and the vacuum chambers 101, 102, 103, and 121 are connected via linear transport paths by a transport system.
  • the load lock chamber 122 is connected to a further vacuum chamber 121, for example a transfer chamber.
  • the transfer chamber is connected to a further vacuum chamber 101, for example deposition chamber.
  • a further particle removal device 600 can be provided alternatively or additionally in the transfer chamber, such that the carrier or a portion of the carrier, for example a rod of the carrier, is cleaned before entering the deposition chamber.
  • the particle removal device 600 as shown in figure 6 may be manufactured from materials such as PEEK, stainless steel and other materials, which have a sufficiently low outgassing to allow for operation on the vacuum conditions within the vacuum processing system.
  • further vacuum removal devices 600 can be provided within one or more of the other vacuum chambers, for example in the vacuum rotation module 150.
  • the transport system may include a dual track transportation system including several transportation tracks 161, 163, 164.
  • the transport system further includes a rotation module 150 allowing the rotation of substrates along the transportation path.
  • large area substrates which are typically used for display manufacturing, can be transported along the linear transportation paths in the substrate processing system 100.
  • the linear transport paths are provided by transportation tracks 161 and 163, such as linear transportation tracks having, e.g., a plurality of rollers arranged along a line.
  • the transportation tracks and/or rotation tracks can be provided by a transportation system at the bottom of the large area substrates and a guiding system, e.g. a magnetic guiding system, at the top of the essentially vertically oriented large area substrates.
  • a transportation system at the bottom of the large area substrates and a guiding system, e.g. a magnetic guiding system, at the top of the essentially vertically oriented large area substrates.
  • the dual track transportation systems in the vacuum chambers can be provided by a fixed dual track system, a movable single track system, or a movable dual track system.
  • the fixed dual track system includes a first transportation track and a second transportation track, wherein the first transportation track and the second transportation track cannot be laterally displaced, i.e. a substrate cannot be moved in a direction perpendicular to the transport direction.
  • a movable single track system provides a dual track transportation system by having a linear transportation track, which can be displaced laterally, i.e. perpendicular to the transport direction, such that the substrate can either be provided on the first transportation path or the second transportation path, wherein the first transportation path and the second transportation path are distant from each other.
  • a movable dual track system includes the first transportation track and a second transportation track, wherein both transportation tracks can be displaced laterally, i.e. both transportation tracks can switch their respective position from the first transportation path to the second transportation path and vice versa.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

Cette invention concerne un dispositif d'élimination de particules (200) pour système de traitement sous vide permettant de traiter un substrat supporté sur un support (40). Le dispositif d'élimination de particules (200) comprend un corps de base (210) comportant un évidement. L'évidement est conçu pour qu'une partie du support (40) puisse passer dans ledit évidement, et une brosse (210) logée dans l'évidement est conçue pour être en contact avec ladite partie du support (40) lors de son passage dans l'évidement.
PCT/US2014/038130 2014-05-15 2014-05-15 Dispositif d'élimination de particules et son procédé de fonctionnement WO2015174981A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/US2014/038130 WO2015174981A1 (fr) 2014-05-15 2014-05-15 Dispositif d'élimination de particules et son procédé de fonctionnement
CN201480078899.7A CN106304833A (zh) 2014-05-15 2014-05-15 粒子去除装置及其操作方法
KR1020167035076A KR20170008270A (ko) 2014-05-15 2014-05-15 입자 제거 디바이스 및 이의 작동 방법
JP2016567808A JP2017520112A (ja) 2014-05-15 2014-05-15 粒子除去デバイス、及び粒子除去デバイスを操作する方法
TW104115683A TW201605550A (zh) 2014-05-15 2015-05-15 粒子去除裝置、具有粒子去除裝置的加載鎖定腔室、具有粒子去除裝置的真空處理系統及其操作方法

Applications Claiming Priority (1)

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PCT/US2014/038130 WO2015174981A1 (fr) 2014-05-15 2014-05-15 Dispositif d'élimination de particules et son procédé de fonctionnement

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JP2019510360A (ja) * 2017-01-31 2019-04-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板キャリア及び基板を処理する方法
JP2020516061A (ja) * 2017-03-24 2020-05-28 ネックスヴァーフェ・ゲー・エム・ベー・ハーＮｅｘｗａｆｅ Ｇｍｂｈ プロセスチャンバガイド、プロセスチャンバ、及び、基板キャリアをプロセスポジションへガイドする方法
WO2022128113A1 (fr) * 2020-12-17 2022-06-23 Applied Materials, Inc. Tête de nettoyage de support pour nettoyage de support se déplaçant le long d'une direction de transport, système de traitement de substrat, procédé de maintien de système de traitement de substrat et procédé de fabrication de dispositif
CN116159809A (zh) * 2022-12-28 2023-05-26 深圳市纳设智能装备有限公司 晶圆传输方法

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CN110055488B (zh) * 2019-05-28 2021-05-25 珠海长安富士金属热处理有限公司 一种真空热处理渗碳装置

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EP0528405A2 (fr) * 1991-08-19 1993-02-24 Praxair Technology, Inc. Système de traitement sans air ambiant
EP0599087A1 (fr) * 1992-11-27 1994-06-01 Satzinger GmbH & Co. Dispositif pour la lubrification et le nettoyage des chaînes et des rails
US5778485A (en) * 1995-01-19 1998-07-14 Tokyo Electron Limited Probe card cleaning apparatus, probe apparatus with the cleaning apparatus, and probe card cleaning method
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JP2019510360A (ja) * 2017-01-31 2019-04-11 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板キャリア及び基板を処理する方法
JP2020516061A (ja) * 2017-03-24 2020-05-28 ネックスヴァーフェ・ゲー・エム・ベー・ハーＮｅｘｗａｆｅ Ｇｍｂｈ プロセスチャンバガイド、プロセスチャンバ、及び、基板キャリアをプロセスポジションへガイドする方法
JP7145518B2 (ja) 2017-03-24 2022-10-03 ネックスヴァーフェ・ゲー・エム・ベー・ハー プロセスチャンバガイド、プロセスチャンバ、及び、基板キャリアをプロセスポジションへガイドする方法
WO2022128113A1 (fr) * 2020-12-17 2022-06-23 Applied Materials, Inc. Tête de nettoyage de support pour nettoyage de support se déplaçant le long d'une direction de transport, système de traitement de substrat, procédé de maintien de système de traitement de substrat et procédé de fabrication de dispositif
CN116159809A (zh) * 2022-12-28 2023-05-26 深圳市纳设智能装备有限公司 晶圆传输方法

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TW201605550A (zh) 2016-02-16
KR20170008270A (ko) 2017-01-23
CN106304833A (zh) 2017-01-04

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