WO2015149308A1 - 照明装置及其制造方法 - Google Patents

照明装置及其制造方法 Download PDF

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Publication number
WO2015149308A1
WO2015149308A1 PCT/CN2014/074649 CN2014074649W WO2015149308A1 WO 2015149308 A1 WO2015149308 A1 WO 2015149308A1 CN 2014074649 W CN2014074649 W CN 2014074649W WO 2015149308 A1 WO2015149308 A1 WO 2015149308A1
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WO
WIPO (PCT)
Prior art keywords
light
heat sink
led
extending portion
light emitting
Prior art date
Application number
PCT/CN2014/074649
Other languages
English (en)
French (fr)
Inventor
林明吉
吕畹铃
Original Assignee
方与圆电子(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 方与圆电子(深圳)有限公司 filed Critical 方与圆电子(深圳)有限公司
Priority to PCT/CN2014/074649 priority Critical patent/WO2015149308A1/zh
Publication of WO2015149308A1 publication Critical patent/WO2015149308A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention belongs to the technical field of lighting devices, and in particular to a lighting device and a manufacturing method thereof.
  • the current lighting device such as an LED lighting device, includes a heat sink and an LED light-emitting component.
  • the heat sink is formed by die-casting or machining, and the production efficiency is low, the production cost is high, and the light can not be freely arbitrarily distributed to achieve high-angle illumination of the product. Or with light, the heat dissipation area can not be increased freely.
  • the object of the present invention is to overcome the deficiencies of the prior art described above, and to provide a lighting device and a manufacturing method thereof, which have high production efficiency, freely configurable illumination angle, low production cost, and good heat dissipation effect of the product.
  • the technical solution of the present invention is: a lighting device comprising an LED lighting component, a light transmitting member and a seat body, and further comprising a heat sink formed by bending a metal plate, the LED lighting component comprising a metal plate and being disposed on the metal
  • a heat sink formed by bending a metal plate, the LED lighting component comprising a metal plate and being disposed on the metal
  • the heat sink includes a main body portion and a mounting portion, one end of the main body portion is inserted into the seat body, the mounting portion is integrally connected to the other end of the main body portion, and the metal plate is further
  • the light transmissive member is disposed on the heat sink and the LED light emitting component and is connected to the base body.
  • the body portion has a polygonal cylindrical shape.
  • each of the side ends of the main body portion is extended with the mounting portion, and the mounting portion has a strip shape.
  • the mounting portion includes a radial extension portion disposed radially outward along the main body portion and an axial extension portion disposed axially along the main body portion, one end of the axial extension portion being integrally connected to The radial extension.
  • the other end of the axial extension is connected with an oblique extending portion, one end of the oblique extending portion is integrally connected to the axial extending portion, and the other end of the oblique extending portion is connected to the The body is inserted or inserted into the body.
  • the LED lighting component includes a radial light emitting portion attached to the radial extending portion and an axial light emitting portion attached to the axial extending portion, and the axial light emitting portion is integrally connected to the diameter To the light emitting section.
  • the LED light emitting component includes a radial light emitting portion attached to the radial extending portion, an axial light emitting portion attached to the axial extending portion, and oblique light emitting to the oblique extending portion
  • the radial light emitting portion, the axial light emitting portion, and the oblique light emitting portion are integrally connected.
  • one end of the heat sink inserted into the base body has a root portion, and the root portion is embedded in the base body.
  • the metal plate includes a first plate body and a second plate body, and a gap is disposed between the first plate body and the second plate body;
  • the LED chip includes a plurality of first chip carriers, and multiple a first lead frame is arranged on the first plate body and electrically connected to each other through the first plate body; a plurality of first guiding portions are arranged on the second plate body and pass each other
  • the second board is electrically connected to the first chip holder, and the LED chip further includes a plurality of LED components, and each of the LED modules is electrically connected to the first board and the first board a two-plate body, wherein each of the light-emitting diode assemblies is electrically connected to each other through the first plate body and the second plate body.
  • the present invention also provides a production method for manufacturing the above lighting device, comprising the following steps:
  • the preparation of the heat sink includes the following steps: preparing the heat sink by cutting and bending the metal sheet;
  • the light transmissive member is coupled to the seat body.
  • the lighting device and the manufacturing method thereof provided by the invention have high production efficiency, low production cost and good heat dissipation effect of the product.
  • FIG. 1 is a perspective view showing the assembly of a light transmitting member, a heat sink, and a seat body in a lighting device according to an embodiment of the present invention
  • FIG. 2 is a perspective view showing the assembly of a heat sink and a base in the lighting device according to an embodiment of the present invention
  • FIG. 3 is a perspective view of a heat sink in a lighting device according to an embodiment of the present invention.
  • FIG. 4 is a perspective view of an LED lighting component in a lighting device according to an embodiment of the present invention.
  • FIG. 5 is a three-dimensional assembly diagram of an LED light-emitting component and a heat sink in a lighting device according to an embodiment of the present invention
  • FIG. 6 is a schematic plan view showing a root portion of a heat sink extending in a lighting device according to an embodiment of the present invention
  • FIG. 7 is a schematic plan view showing a root portion of a heat sink extending in a lighting device according to an embodiment of the present invention.
  • FIG. 8 is a schematic plan view showing a root portion of a heat sink extending in a lighting device according to an embodiment of the present invention.
  • FIG. 9 is a perspective view of a heat sink according to another embodiment of a lighting device according to an embodiment of the invention.
  • an illumination device provided by an embodiment of the present invention includes an LED light-emitting component 1, a light-transmitting member 2, a seat body 3, and a stamped or/or metal sheet or any bendable material.
  • the heat-dissipating seat 4 is formed by bending, and the light-transmitting member 2 can be made of a transparent material.
  • the seat body 3 can be made of a ceramic and a thermally conductive plastic material having good thermal conductivity, and a heat dissipation rib can be disposed on the outer side to increase the heat dissipation area.
  • the LED light-emitting component 1 includes a metal plate and an LED chip disposed on one side of the metal plate, and the metal plate may have a strip shape or the like.
  • the heat sink 4 includes a main body portion 41 and a mounting portion 42 for connecting the LED light-emitting component 1 .
  • One end of the main body portion 41 is inserted into the base body 3 , and the mounting portion 42 is integrally connected to the main body portion 41 .
  • the other end of the metal plate is attached to the mounting portion 42.
  • the light transmissive member 2 is disposed on the heat sink 4 and the LED light emitting component 1 and is connected to the base 3.
  • the heat sink 4 can be formed by stamping, cutting and bending, and the production efficiency is high, the production cost is low, and the parts are integrally bent and formed, the heat resistance is small, and the product has good heat dissipation effect.
  • the heat sink 4 can be made of an aluminum plate, an iron plate or a copper plate.
  • the seat body 3 can be processed by injection molding or ceramic firing or resin thermosetting.
  • the heat sink 4 can be integrally formed by stamping, and the heat dissipation effect of the joint body is good.
  • the main body portion 41 may have a polygonal cylindrical shape or a cylindrical shape.
  • the main body portion 41 has a regular polygonal cross section, such as a regular pentagon or a regular hexagon.
  • the shape, the regular octagon, and the like can be specifically set according to the number of the LED light-emitting members 1 and the like.
  • One side of the main body portion 41 is abutting portion, and the main body portion 41 may be formed by bending a metal plate.
  • the joints can be welded or coated with a heat-conducting material, or they can only be in contact with each other.
  • each of the side end portions of the main body portion 41 is extended with the mounting portion 42 described above, and the mounting portion 42 has a strip shape.
  • the mounting portion 42 can be arbitrarily extended in length and area.
  • the mounting portion 42 includes a radially extending portion 421 disposed radially outward of the main body portion 41 and an axial extending portion disposed axially along the main body portion 41. 422.
  • One end of the axial extension 422 is integrally connected to the radial extension 421.
  • the width of the radially extending portion 421 and the axially extending portion 422 may be equal to or smaller than the side length of the main body portion 41.
  • the LED light-emitting component 1 includes a radial light-emitting portion 11 attached to the radially extending portion 421 and an axial light-emitting portion 12 attached to the axially extending portion 422.
  • the axial light-emitting portion 12 is integrated. Connected to the radial light emitting portion 11.
  • the other end of the axially extending portion 422 is connected with an obliquely extending portion 423 , and one end of the obliquely extending portion 423 is integrally connected to the axially extending portion 422 .
  • the other end of the obliquely extending portion 423 is connected to the seat body 3 or inserted into the seat body 3.
  • the end of the obliquely extending portion 423 extends with a contact portion 424 that is in contact with the side surface of the main body portion 41.
  • the contact portion 424 may also be connected to the side wall of the main body portion 41 by soldering to improve the structure of the heat sink 4. Reliability and heat dissipation.
  • the LED light-emitting component 1 includes a radial light-emitting portion 11 attached to the radially extending portion 421, and an axial light-emitting portion attached to the axially extending portion 422. 12 and an oblique light emitting portion 13 attached to the obliquely extending portion 423, wherein the radial light emitting portion 11, the axial light emitting portion 12, and the oblique light emitting portion 13 are integrally connected.
  • the structural shape of the heat sink 4 may be set according to actual conditions. As shown in FIG. 9 , a sloped structure may be disposed between the radially extending portion 421 and the axially extending portion 421 , and of course, other suitable settings may be adopted. Structure and so on.
  • the root portion of the heat sink 4 embedded in the base 3 can be continuously bent into a wave shape or a zigzag shape to meet the heat dissipation requirement. The angle can be adjusted according to the light distribution requirements of any "three-dimensional".
  • the seat body 3 is made of a plastic material or/and a ceramic material, and the heat sink 4 and the seat body 3 are formed by insert molding.
  • the inside of the seat body 3 is made of ceramic, and the outer side of the ceramic is covered with a plastic layer.
  • the metal plate includes a first plate body and a second plate body, and a gap is disposed between the first plate body and the second plate body;
  • the LED chip includes a plurality of first chip carriers, and a plurality of first plates a plurality of first chip carriers are arranged on the first plate body and electrically connected to each other through the first plate body; a plurality of first guiding portions are arranged on the second plate body, and the plurality of first guiding portions are arranged on the second plate body.
  • the second board is electrically connected to the first chip holder, and the LED chip further includes a plurality of LED components, and each of the LED modules is electrically connected to the first board and the second a plate body, wherein each of the light emitting diode assemblies is electrically connected to each other through the first plate body and the second plate body.
  • the heat sink 4 is inserted into one end of the seat body 3 , and the root portion 43 is extended at the end portion thereof, and the root portion 43 is also embedded in the seat body 3 .
  • the root portion 43 may be in the form of a roll, a straight sheet, a bent sheet or a wave, etc., on the one hand, the contact area between the heat sink 4 and the seat body 3 is increased to improve the heat dissipation effect, and on the other hand, the structural stability is increased.
  • the present application also provides a production method for the above lighting device, comprising the following steps:
  • the LED light-emitting component 1 is prepared, and the heat-dissipating component 4 is prepared.
  • the heat-dissipating component 2 is made of a light-transmitting material.
  • the heat-dissipating component 4 is prepared by the following steps: the heat-dissipating block is obtained by cutting and bending the metal plate. 4; sheet metal is aluminum, iron or copper.
  • the inside of the seat body 3 is made of ceramic, and the outer side of the ceramic is covered with a plastic layer.
  • the seat body 3 is injection molded, and the heat sink 4 is inserted into the seat body 3 by insert molding or the like; the LED light emitting part 1 is connected to the heat sink. 4; connecting the light transmissive member 2 to the seat body 3.
  • the heat sink 4 can be formed by stamping, cutting and bending, and the production efficiency is high, the production cost is low, and the parts are integrally bent and formed, the heat resistance is small, and the product has good heat dissipation effect.

Abstract

一种照明装置，包括LED发光部件（1）、透光件（2）和座体（3），还包括由金属板材折弯成型的散热座（4），散热座（4）包括主体部（41）和安装部（42），主体部（41）的一端插入座体（3）内，安装部（42）一体连接于主体部（41）的另一端，LED发光部件（1）包括金属板和设置于金属板一面的LED芯片，金属板的另一面与安装部（42）相贴，透光件（2）罩设于散热座（4）和LED发光部件（1）且连接于所述座体（3）。还提供一种照明装置的生产方法。该照明装置及其制造方法，具有生产效率高、成本低、散热效果好的优点。

Description

照明装置及其制造方法
本发明属于照明装置技术领域，尤其涉及一种照明装置及其制造方法。
目前的照明装置，例如LED照明装置，其包括散热座和LED发光部件，一般散热座通过压铸或机加工方式成型，其生产效率低、生产成本高，而且无法自由任意配光达到产品大角度发光或配光，散热面积也无法自由加大。
本发明的目的在于克服上述现有技术的不足，提供了一种照明装置及其制造方法，其生产效率高、发光角度可自由配置生产成本低且产品散热效果好。
本发明的技术方案是：一种照明装置，包括LED发光部件、透光件和座体，还包括由金属板材折弯成型的散热座，所述LED发光部件包括金属板和设置于所述金属板一面的LED芯片，所述散热座包括主体部和安装部，所述主体部的一端插入所述座体内，所述安装部一体连接于所述主体部的另一端，所述金属板的另一面与所述安装部相贴，所述透光件罩设于所述散热座和所述LED发光部件且连接于所述座体。
可选地，所述主体部呈多边形筒状。
可选地，所述主体部的每条侧边端部均延伸设置有所述的安装部，所述安装部呈条状。
可选地，所述安装部包括沿所述主体部径向向外设置的径向延伸部和沿所述主体部轴向设置的轴向延伸部，所述轴向延伸部的一端一体连接于所述径向延伸部。
可选地，所述轴向延伸部的另一端连接有斜向延伸部，所述斜向延伸部的一端一体连接于所述轴向延伸部，所述斜向延伸部的另一端连接于所述座体或插入所述座体内。
可选地，所述LED发光部件包括贴于所述径向延伸部的径向发光部和贴于所述轴向延伸部的轴向发光部，所述轴向发光部一体连接于所述径向发光部。
可选地，所述LED发光部件包括贴于所述径向延伸部的径向发光部、贴于所述轴向延伸部的轴向发光部和贴于所述斜向延伸部的斜向发光部，所述径向发光部、所述轴向发光部和所述斜向发光部一体连接。
可选地，所述散热座插入所述座体的一端延伸有根部，所述根部嵌设于座体中。
可选地，所述金属板包括第一板体和第二板体，所述第一板体与第二板体之间间隙设置；所述LED芯片包括多个第一芯片架、多个第一导接部，多个第一芯片架排列于所述第一板体上且彼此通过该第一板体电性连接；多个第一导接部排列于该第二板体上，彼此通过该第二板体电性连接，且分别一一对应各所述第一芯片架；所述LED芯片还包括多个发光二极管组件，各发光二极管组件皆电性连接该第一板体与该第二板体，其中各所述发光二极管组件彼此通过该第一板体与该第二板体进行电性相接。
本发明还提供了一种用于制造上述的照明装置的生产方法， 包括以下步骤：
制备LED发光部件、制备散热座、透光件和座体，
其中制备所述散热座包括如下步骤，采用金属板材经过裁切、折弯方式制得所述散热座；
将所述LED发光部件连接于所述散热座；
将所述透光件连接于所述座体。
本发明提供的照明装置及其制造方法，其生产效率高、生产成本低且产品散热效果好。
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的照明装置中透光件、散热座和座体的装配立体示意图；
图2是本发明实施例提供的照明装置中散热座和座体的装配立体示意图；
图3是本发明实施例提供的照明装置中散热座的立体示意图；
图4是本发明实施例提供的照明装置中LED发光部件的立体示意图；
图5是本发明实施例提供的照明装置中LED发光部件和散热座的立体装配示意图；
图6是本发明实施例提供的照明装置中散热座延伸有根部的平面示意图；
图7是本发明实施例提供的照明装置中散热座延伸有根部的平面示意图；
图8是本发明实施例提供的照明装置中散热座延伸有根部的平面示意图；
图9是本发明实施例提供的照明装置中另一实施例的散热座的立体示意图。
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
需要说明的是，当组件被称为“固定于”或“设置于”另一个组件，它可以直接在另一个组件上或者可能同时存在居中组件。当一个组件被称为是“连接于”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。
还需要说明的是，本实施例中的左、右、上、下等方位用语，仅是互为相对概念或是以产品的正常使用状态为参考的，而不应该认为是具有限制性的。
如图1～图5所示，本发明实施例提供的一种照明装置，包括LED发光部件1、透光件2、座体3和由金属板材或任何可折弯的材料经冲压或/和折弯成型的散热座4，透光件2可采用透明材料制成。座体3可以采用陶瓷及导热性好的导热塑胶材料制成，其外侧可设置有散热凸筋，以增加散热面积。所述LED发光部件1包括金属板和设置于所述金属板一面的LED芯片，金属板可呈条状等。所述散热座4包括主体部41和用于连接LED发光部件1的安装部42，所述主体部41的一端插入所述座体3内，所述安装部42一体连接于所述主体部41的另一端，所述金属板的另一面与所述安装部42相贴，所述透光件2罩设于所述散热座4和所述LED发光部件1且连接于所述座体3。散热座4可以采用金属板材通过冲压、载切、折弯的方式成型，其生产效率高，生产成本低，且各部一体折弯成型，其热阻小，产品散热效果好。具体应用中，散热座4可以采用铝板、铁板或铜板等材料制造。座体3可以采用加工注塑或陶瓷烧型加工或树脂热固塑成型。散热座4可一体冲压成型，其连体散热效果好。
具体地，如图1～图5所示，所述主体部41可呈多边形筒状或圆筒状等，本实施例中，主体部41的横截面呈正多边形，例如正五边形、正六形形、正八边形等，具体可以根据LED发光部件1的数量等设定。主体部41的其中一侧边为对接处，主体部41可由金属板折弯围合而成。对接处可进行焊接或涂导热材料处理，也可以仅为相互接触。
具体地，如图1～图5所示，所述主体部41的每条侧边端部均延伸设置有所述的安装部42，所述安装部42呈条状。安装部42可任意延伸长度及面积。
具体地，如图1～图5所示，所述安装部42包括沿所述主体部41径向向外设置的径向延伸部421和沿所述主体部41轴向设置的轴向延伸部422，所述轴向延伸部422的一端一体连接于所述径向延伸部421。径向延伸部421与轴向延伸部422的宽度可与主体部41的边长相等或小于主体部41的边长。具体地，所述LED发光部件1包括贴于所述径向延伸部421的径向发光部11和贴于所述轴向延伸部422的轴向发光部12，所述轴向发光部12一体连接于所述径向发光部11。
具体地，如图1～图5所示，所述轴向延伸部422的另一端连接有斜向延伸部423，所述斜向延伸部423的一端一体连接于所述轴向延伸部422，所述斜向延伸部423的另一端连接于所述座体3或插入所述座体3内。本实施中，斜向延伸部423的末端延伸有与主体部41侧面相贴的接触部424，接触部424也可以通过焊接的方式连接于主体部41的侧壁，以提高散热座4的结构可靠性及散热效果。
更具体地，如图1～图5所示，所述LED发光部件1包括贴于所述径向延伸部421的径向发光部11、贴于所述轴向延伸部422的轴向发光部12和贴于所述斜向延伸部423的斜向发光部13，所述径向发光部11、所述轴向发光部12和所述斜向发光部13一体连接。通过设置斜向发光部13和斜向延伸部423，可以有效增加本申请提供的照明装置的照明角度，照明角度可达270度以上。
具体应用中，也可以根据实际情况设置散热座4的结构形状，如图9所示，径向延伸部421与轴向延伸部421之间可设置有斜面结构等，当然也可以设置为其它合适的结构等。散热座4中嵌入于座体3的根部可连续折弯呈波浪状或锯齿状等，以满足散热需求。角度可以根据配光需求任意”立体式”的调整。
具体地，所述座体3采用塑胶材料或/和陶瓷材料制成，所述散热座4与所述座体3之间通过镶嵌件注塑方式成型。具体应用中，座体3内部采用陶瓷烧制而成，陶瓷外侧包覆有塑胶层。
具体地，所述金属板包括第一板体和第二板体，所述第一板体与第二板体之间间隙设置；所述LED芯片包括多个第一芯片架、多个第一导接部，多个第一芯片架排列于所述第一板体上且彼此通过该第一板体电性连接；多个第一导接部排列于该第二板体上，彼此通过该第二板体电性连接，且分别一一对应各所述第一芯片架；所述LED芯片还包括多个发光二极管组件，各发光二极管组件皆电性连接该第一板体与该第二板体，其中各所述发光二极管组件彼此通过该第一板体与该第二板体进行电性相接。
具体应用中，如图1～图8所示，散热座4插入座体3的一端，其端部可延伸有根部43，根部43同样嵌设于座体3中。根部43可呈卷状、直片状、折弯片状或波浪状等，一方面增加了散热座4与座体3之间的接触面积以提高散热效果，另一方面增加了结构稳定性。
本申请还提供了一种用于上述的照明装置的生产方法， 包括以下步骤：
制备LED发光部件1、制备散热座4、由透光材料制成的透光件2，其中制备所述散热座4包括如下步骤，采用金属板材经过裁切、折弯方式制得所述散热座4；金属板材为铝板、铁板或铜板等。具体应用中，座体3内部采用陶瓷烧制而成，陶瓷外侧包覆有塑胶层。
或者，注塑成型所述座体3，并将所述散热座4通过镶嵌注塑成型的方式等使所述散热座4插入所述座体3；将所述LED发光部件1连接于所述散热座4；将所述透光件2连接于所述座体3。散热座4可以采用金属板材通过冲压、载切、折弯的方式成型，其生产效率高，生产成本低，且各部一体折弯成型，其热阻小，产品散热效果好。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换或改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种照明装置，包括LED发光部件、透光件和座体，其特征在于，还包括由金属板材折弯成型的散热座，所述LED发光部件包括金属板和设置于所述金属板一面的LED芯片，所述散热座包括主体部和安装部，所述主体部的一端插入所述座体内，所述安装部一体连接于所述主体部的另一端，所述金属板的另一面与所述安装部相贴，所述透光件罩设于所述散热座和所述LED发光部件且连接于所述座体。
  2. 如权利要求1所述的照明装置，其特征在于，所述主体部呈多边形筒状。
  3. 如权利要求2所述的照明装置，其特征在于，所述主体部的每条侧边端部均延伸设置有所述的安装部，所述安装部呈条状。
  4. 如权利要求3所述的照明装置，其特征在于，所述安装部包括沿所述主体部径向向外设置的径向延伸部和沿所述主体部轴向设置的轴向延伸部，所述轴向延伸部的一端一体连接于所述径向延伸部。
  5. 如权利要求4所述的照明装置，其特征在于，所述轴向延伸部的另一端连接有斜向延伸部，所述斜向延伸部的一端一体连接于所述轴向延伸部，所述斜向延伸部的另一端连接于所述座体或插入所述座体内。
  6. 如权利要求4所述的照明装置，其特征在于，所述LED发光部件包括贴于所述径向延伸部的径向发光部和贴于所述轴向延伸部的轴向发光部，所述轴向发光部一体连接于所述径向发光部。
  7. 如权利要求5所述的照明装置，其特征在于，所述LED发光部件包括贴于所述径向延伸部的径向发光部、贴于所述轴向延伸部的轴向发光部和贴于所述斜向延伸部的斜向发光部，所述径向发光部、所述轴向发光部和所述斜向发光部一体连接。
  8. 如权利要求1至7中任一项所述的照明装置，其特征在于，所述散热座插入所述座体的一端延伸有根部，所述根部嵌设于座体中。
  9. 如权利要求1至7中任一项所述的照明装置，其特征在于，所述金属板包括第一板体和第二板体，所述第一板体与第二板体之间间隙设置；所述LED芯片包括多个第一芯片架、多个第一导接部，多个第一芯片架排列于所述第一板体上且彼此通过该第一板体电性连接；多个第一导接部排列于该第二板体上，彼此通过该第二板体电性连接，且分别一一对应各所述第一芯片架；所述LED芯片还包括多个发光二极管组件，各发光二极管组件皆电性连接该第一板体与该第二板体，其中各所述发光二极管组件彼此通过该第一板体与该第二板体进行电性相接。
  10. 一种用于制造如权利要求1至9中任一项所述的照明装置的生产方法，其特征在于， 包括以下步骤：
    制备LED发光部件、制备散热座、透光件和座体，
    其中制备所述散热座包括如下步骤，采用金属板材经过裁切、折弯方式制得所述散热座；
    将所述LED发光部件连接于所述散热座；
    将所述透光件连接于所述座体。
PCT/CN2014/074649 2014-04-02 2014-04-02 照明装置及其制造方法 WO2015149308A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201206817Y (zh) * 2008-05-23 2009-03-11 富准精密工业(深圳)有限公司 散热装置及其应用的发光二极管灯具
CN101424394A (zh) * 2007-11-02 2009-05-06 富准精密工业(深圳)有限公司 散热装置及其应用的发光二极管灯具
CN101614383A (zh) * 2008-06-27 2009-12-30 富准精密工业(深圳)有限公司 发光二极管灯具
US20130010472A1 (en) * 2011-07-05 2013-01-10 Industrial Technology Research Institute Illumination device and assembling method thereof
CN103174996A (zh) * 2011-12-23 2013-06-26 诠盛科技股份有限公司 灯具结构
CN103672442A (zh) * 2012-08-31 2014-03-26 深圳市海洋王照明工程有限公司 灯具

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101424394A (zh) * 2007-11-02 2009-05-06 富准精密工业(深圳)有限公司 散热装置及其应用的发光二极管灯具
CN201206817Y (zh) * 2008-05-23 2009-03-11 富准精密工业(深圳)有限公司 散热装置及其应用的发光二极管灯具
CN101614383A (zh) * 2008-06-27 2009-12-30 富准精密工业(深圳)有限公司 发光二极管灯具
US20130010472A1 (en) * 2011-07-05 2013-01-10 Industrial Technology Research Institute Illumination device and assembling method thereof
CN103174996A (zh) * 2011-12-23 2013-06-26 诠盛科技股份有限公司 灯具结构
CN103672442A (zh) * 2012-08-31 2014-03-26 深圳市海洋王照明工程有限公司 灯具

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