TWI407049B - 燈具結構 - Google Patents
燈具結構 Download PDFInfo
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- TWI407049B TWI407049B TW099112126A TW99112126A TWI407049B TW I407049 B TWI407049 B TW I407049B TW 099112126 A TW099112126 A TW 099112126A TW 99112126 A TW99112126 A TW 99112126A TW I407049 B TWI407049 B TW I407049B
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- fins
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
本發明係有關於一種燈具結構,特別係有關於一種發光二極體燈具結構。
由於發光二極體(Light-Emitting Diode,LED)具有壽命長以及省電之優點,近年來已逐漸被應用在照明燈具等相關領域。一般而言,在使用發光二極體作為光源的燈具上通常會設有複數個金屬材質之鰭片,藉此可將發光二極體所產生之熱能排出,以避免發光二極體因過熱而損壞。
傳統的鰭片結構大多是透過金屬擠型(die extrusion)或壓鑄成型(die casing)兩種方式加以製作,惟金屬擠型技術具有成本較高以及不易製作複雜形狀等缺點,而壓鑄成型技術則具有結構強度較弱以及鰭片間距過大等缺點。有鑑於習知鰭片在結構與製程上仍存在有諸多限制,因此如何設計出一種能兼顧散熱且成本低廉的燈具結構始成為一重要之課題。
本發明之一實施例提供一種燈具結構,包括一散熱模組、一發光元件、一電性接頭以及一連接構件,前述散熱模組包括一第一導熱元件以及一第二導熱元件,其中第一導熱元件具有複數個第一鰭片,第二導熱元件具有一基板以及複數個第二鰭片。前述基板上形成有複數個通孔,第二鰭片設置於基板上,且第一、第二鰭片以交錯方式間隔配置。前述發光元件設置於第二導熱元件上,前述電性接頭電性連接發光元件,前述連接構件則連接散熱模組以及電性接頭。
於一實施例中,前述第二鰭片與基板相互垂直。
於一實施例中,前述第二導熱元件更具有一底座,其中第二鰭片以及底座分別位於基板的相反側,且發光元件設置於底座上。
於一實施例中,前述連接構件穿過第一導熱元件並連接第二導熱元件。
於一實施例中,前述第一、第二鰭片分別以放射狀排列於第一、第二導熱元件上。
於一實施例中,前述第一、第二導熱元件以壓鑄成型方式製作。
於一實施例中,前述連接構件以金屬擠型方式製作並具有複數個散熱鰭片。
於一實施例中,前述第一、第二導熱元件以鋁壓鑄成型方式製作。
於一實施例中,前述連接構件以鋁擠型方式製作。
於一實施例中,前述燈具結構更包括一燈罩,連接第二導熱元件並且包覆發光元件。
為使本發明之上述目的、特徵、和優點能更明顯易懂,下文特舉較佳實施例並配合所附圖式做詳細說明。
首先請一併參閱第1、2圖,本發明一實施例之燈具結構係由一電性接頭10、一連接構件20、一散熱模組30、一燈罩40以及至少一發光元件50所組成,前述電性接頭10例如為E27接頭,前述發光元件50例如為發光二極體,前述連接構件20以及散熱模組30則可包含鋁或其他具高導熱係數之金屬材質。需特別說明的是,本實施例中的散熱模組30主要係由一第一導熱元件31以及一第二導熱元件32所組成,其中第一、第二導熱元件31、32可以利用壓鑄成型的方式製作,前述連接構件20則例如可透過金屬擠型的方式製作。
如第1、2圖所示,在本實施例中的第一導熱元件31上形成有複數個第一鰭片311,第二導熱元件32上則形成有複數個第二鰭片321,其中第一、第二導熱元件31、32例如可分別以壓鑄成型的方式製作(例如鋁壓鑄成型),組裝時再使第一、第二導熱元件31、32相互嵌合,並使第一、第二鰭片311、321以交錯方式間隔配置。由第1圖中可以清楚看出,前述發光元件50係設置於第二導熱元件32底側,燈罩40則與第二導熱元件32相互結合,用以包覆前述發光元件50。
需特別說明的是,由於壓鑄成型技術在製作導熱元件上的鰭片結構時,對於散熱鰭片的間距有其尺寸上之限制,故在實際製作上難以達到縮短間距以及增加鰭片數量之目的。為了克服傳統製程上的缺點,本發明透過使第一、第二導熱元件31、32以相互嵌合的方式組裝,並使第一、第二鰭片311、321以交錯的方式間隔配置,藉此能讓散熱模組30上的鰭片數量倍增,進而可大幅增加散熱模組30的散熱面積並提升散熱效率。
接著請參閱第3圖,於本實施例中的連接構件20可以透過金屬擠型的方式製作(例如鋁擠型),其中連接構件20中央形成有一穿孔202,可用以容置電路板或其他電子元件,進而使前述電性接頭10和發光元件50電性連接。如第3圖所示,在連接構件20周圍另形成有複數個散熱鰭片201,藉此可增加連接構件20的散熱面積以提升散熱效率。
請一併參閱第4、5圖,前述第一導熱元件31具有一圓形之開孔312,其中開孔312的尺寸大致對應於連接構件20,此外在第一導熱元件31周圍則形成有複數個呈放射狀排列之第一鰭片311。再請參閱第6圖,於本實施例中的第二導熱元件32具有一基板322以及複數個第二鰭片321,前述第二鰭片321與基板322大致垂直,且第二鰭片321係以放射狀的方式排列於基板322上,組裝時可使第一、第二鰭片311、321以交錯方式間隔配置(如第2圖所示),其中連接構件20係穿過第一導熱元件31之開孔312,並且固定於基板322中央之一結合部323。
請參閱第7圖,前述第二導熱元件32下方具有一底座324,其中第二鰭片321和底座324分別位於基板322的相反側,發光元件50則設置在底座324上。需特別說明的是,本實施例的基板322上另形成有複數個通孔H,前述通孔H分佈於底座324周圍,其中發光元件50所產生的熱能可以氣體對流的方式經由通孔H迅速排出,藉以避免發光元件50因過熱而損壞(如第8圖所示)。
綜上所述,本發明提供一種燈具結構,其主要包括一散熱模組、一發光元件、一電性接頭以及一連接構件,前述發光元件設置於散熱模組上。應了解的是,散熱模組主要包括第一導熱元件以及第二導熱元件,且第一、第二導熱元件上的第一、第二鰭片係以交錯方式間隔配置,藉此能使散熱模組上的鰭片數量倍增,進而地大幅增加散熱面積並提升散熱效率;尤其,本發明另藉由在第二導熱元件上形成複數個通孔,如此一來可有效地將發光元件所產生之熱能以氣體對流的方式經由通孔迅速排出,藉此可強化散熱效率,以避免發光元件因過熱而損壞。
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
10...電性接頭
20...連接構件
201...散熱鰭片
202...穿孔
30...散熱模組
31...第一導熱元件
311...第一鰭片
312...開孔
32...第二導熱元件
321...第二鰭片
322...基板
323...結合部
324...底座
40...燈罩
50...發光元件
H...通孔
第1圖表示本發明一實施例之燈具結構爆炸圖;
第2圖表示第1圖的燈具結構於組裝後之示意圖;
第3圖表示本發明一實施例之連接構件示意圖;
第4、5圖表示本發明一實施例之第一導熱元件示意圖;
第6、7圖表示本發明一實施例之第二導熱元件示意圖;以及
第8圖表示本發明一實施例之燈具結構剖面圖。
10...電性接頭
20...連接構件
31...第一導熱元件
32...第二導熱元件
40...燈罩
50...發光元件
H...通孔
Claims (10)
- 一種燈具結構,包括:一散熱模組,包括:一第一導熱元件,具有複數個第一鰭片;一第二導熱元件,具有一基板以及複數個第二鰭片,其中該基板上形成有複數個通孔,該些第二鰭片設置於該基板上,且每一該些第一鰭片位於兩相鄰的該些第二鰭片之間並且接觸該基板;一發光元件,設置於該第二導熱元件上,其中該發光元件所產生的熱能經由該些通孔排出該燈具結構;一電性接頭,與該發光元件電性連接;以及一連接構件,連接該散熱模組以及該電性接頭。
- 如申請專利範圍第1項所述之燈具結構,其中該些第二鰭片與該基板相互垂直。
- 如申請專利範圍第1項所述之燈具結構,其中該第二導熱元件更具有一底座,該些第二鰭片以及該底座分別位於該基板的相反側,且該發光元件設置於該底座上。
- 如申請專利範圍第1項所述之燈具結構,其中該連接構件穿過該第一導熱元件並連接該第二導熱元件。
- 如申請專利範圍第1項所述之燈具結構,其中該些第一、第二鰭片分別呈放射狀排列於該第一、第二導熱元件上。
- 如申請專利範圍第1項所述之燈具結構,其中該第一、第二導熱元件以壓鑄成型方式製作。
- 如申請專利範圍第1項所述之燈具結構,其中該連 接構件以金屬擠型方式製作並具有複數個散熱鰭片。
- 如申請專利範圍第1項所述之燈具結構,其中該第一、第二導熱元件以鋁壓鑄成型方式製作。
- 如申請專利範圍第1項所述之燈具結構,其中該連接構件以鋁擠型方式製作。
- 如申請專利範圍第1項所述之燈具結構,其中該燈具結構更包括一燈罩,連接該第二導熱元件並且包覆該發光元件。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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TW099112126A TWI407049B (zh) | 2010-04-19 | 2010-04-19 | 燈具結構 |
EP10007058.0A EP2378185B1 (en) | 2010-04-19 | 2010-07-08 | Lamp assembly |
US12/834,823 US8459841B2 (en) | 2010-04-19 | 2010-07-12 | Lamp assembly |
JP2010211678A JP5408734B2 (ja) | 2010-04-19 | 2010-09-22 | ランプアセンブリー |
Applications Claiming Priority (1)
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TW099112126A TWI407049B (zh) | 2010-04-19 | 2010-04-19 | 燈具結構 |
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TW201137277A TW201137277A (en) | 2011-11-01 |
TWI407049B true TWI407049B (zh) | 2013-09-01 |
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TW099112126A TWI407049B (zh) | 2010-04-19 | 2010-04-19 | 燈具結構 |
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US (1) | US8459841B2 (zh) |
EP (1) | EP2378185B1 (zh) |
JP (1) | JP5408734B2 (zh) |
TW (1) | TWI407049B (zh) |
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Also Published As
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EP2378185A3 (en) | 2014-12-10 |
US20110253358A1 (en) | 2011-10-20 |
TW201137277A (en) | 2011-11-01 |
EP2378185A2 (en) | 2011-10-19 |
US8459841B2 (en) | 2013-06-11 |
JP5408734B2 (ja) | 2014-02-05 |
EP2378185B1 (en) | 2015-08-26 |
JP2011228254A (ja) | 2011-11-10 |
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