WO2015147456A1 - Procédé de découpe et de chanfreinage de verre trempé - Google Patents

Procédé de découpe et de chanfreinage de verre trempé Download PDF

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Publication number
WO2015147456A1
WO2015147456A1 PCT/KR2015/002076 KR2015002076W WO2015147456A1 WO 2015147456 A1 WO2015147456 A1 WO 2015147456A1 KR 2015002076 W KR2015002076 W KR 2015002076W WO 2015147456 A1 WO2015147456 A1 WO 2015147456A1
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WIPO (PCT)
Prior art keywords
tempered glass
cutting
chamfering
heat source
cut surface
Prior art date
Application number
PCT/KR2015/002076
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English (en)
Korean (ko)
Inventor
이한배
김종민
이동헌
탁광용
Original Assignee
동우화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020140175692A external-priority patent/KR102258106B1/ko
Application filed by 동우화인켐 주식회사 filed Critical 동우화인켐 주식회사
Publication of WO2015147456A1 publication Critical patent/WO2015147456A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
    • C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
    • C03B29/025—Glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Definitions

  • the present invention relates to a method of cutting and chamfering tempered glass, and more particularly, to a method of cutting and processing a tempered glass used in a touch screen panel to have high strength without damage.
  • Glass products are treated as essential components in a wide range of technologies and industries, such as monitors, cameras, VTRs, mobile phones, video and optical equipment, automobiles, transportation equipment, various tableware, and construction facilities. According to the present invention, glass having various physical properties is manufactured and used.
  • a touch screen is a display and input device installed on a monitor for a terminal to perform a specific command to a computer by inputting various data such as simple contact or drawing a character or a picture by using an auxiliary input means such as a finger or a pen.
  • Such touch screens are increasingly important as a key component for various digital devices that transmit or exchange information to one or both of mobile communication devices such as smartphones, computers, cameras, certificates such as certificates, and industrial equipment. The range is expanding rapidly.
  • the upper transparent protective layer directly contacting the user among the components constituting the touch screen is mainly a plastic organic material such as polyester or acrylic, and the material is deformed due to continuous and repeated use and contact due to its low heat resistance and low mechanical strength. There is a limit in durability, such as being scratched or scratched. Therefore, the upper transparent protective layer of the touch screen is gradually replaced by the tempered laminated glass having excellent heat resistance, mechanical strength and hardness from the conventional transparent plastic. In addition to the use of tempered thin glass as a transparent protective window of the LCD or OLED monitor in addition to the touch screen, its use area is gradually expanding.
  • Tempered glass is compressed due to the large compressive stress present on the surface when it is cut, and it breaks out of chaotic debris instead of the intended shape, or even if the cut is made in the intended shape. Since the stress disappears and the strength decreases, it is difficult to cut to a desired size or shape once it is strengthened regardless of the composition of the glass.
  • the cutting method of tempered glass requires very precise and stringent conditions as compared with the conventional cutting method of glass.
  • the method introduced as the cutting method of such tempered glass is as follows.
  • the diamond or carbide notching wheels are pulled across the glass surface so that the scale is mechanically inscribed on the glass plate, which is then cut by bending the glass plate along the scale to create a cutting edge.
  • mechanical cutting will produce lateral cracks of about 100 to 150 ⁇ m deep, which cracks arise from the cutting line of the eyewheel. Since the lateral cracks lower the strength of the window substrate, the cutouts of the window substrate must be polished and removed.
  • the method expands the glass surface by moving the laser along a predetermined path on the glass surface through a check on the edge of the window substrate, and along the path of the laser, by pulling the surface along with the cooler moving behind it.
  • the window substrate is cut by thermally propagating the cracks.
  • the cutting process is performed with a laser beam after forming a touch pattern electrode or the like in a region corresponding to the unit window substrate in advance, if the laser beam is irradiated from the surface where the pattern portion is formed, it is irradiated close to the pattern of the high temperature laser beam. If the pattern is damaged, the pattern may be damaged, and if the laser beam is irradiated from the opposite side of the pattern, the laser beam may be refracted while passing through the window substrate, thereby damaging the pattern portion.
  • the large-area glass was cut before the tempering treatment to obtain a unit glass product, and the touch electrodes required for the unit glass product were patterned. In this case, it takes a long time to form the pattern electrode, there is a problem that the process efficiency is lowered.
  • Chamfering process is generally performed by rotating the polishing wheel for the processing of the cut, that is, chamfering. Through the chamfering process, the smoothness of the cut portion is improved and the strength is increased. However, it was difficult to provide a window substrate having excellent strength in the conventional chamfering process.
  • Korean Patent No. 0895830 discloses a method of using a cup wheel as an edge processing method of a flat panel display glass substrate, but a method of using a cup chop is a mechanical chamfering method, and it is necessary to perform repeatedly to obtain a desired surface state. There is a problem that takes a long time to process.
  • the chamfering processing method using a laser has been introduced, but the laser method is a method of cutting the chamfering surface to a fine size (chipping) also has a problem that the processing surface is not uniform, focusing on the cutting surface surface for processing You need a matching step.
  • Patent Document 1 Korean Registered Patent No. 0895830
  • Another object of the present invention is to provide a cutting and chamfering method capable of effectively reinforcing the cut surface of the cut tempered glass to exhibit high strength.
  • the contact area is 0.001 to 1mm 2 cutting and chamfering method of the tempered glass.
  • the heat source is in surface contact with the cut surface of the tempered glass, the contact area is 0.01 to 2.5mm 2 cutting and chamfering method of the tempered glass.
  • the wavelength of the laser is 800 ⁇ 1100nm cutting and chamfering method of the tempered glass.
  • the chamfering is performed at room temperature, cutting and chamfering method of the tempered glass.
  • the tempered glass be cut quickly and without defects, but also can be precisely cut in a lower cost manner than the conventional method.
  • the present invention can be effectively chamfered by contacting the cut surface of the cut tempered glass by contacting the heat source under specific conditions, thereby effectively having a high strength.
  • the present invention can further improve the strength of the tempered glass by reinforcing the cutting surface by etching or polishing with hydrofluoric acid or polishing wheel after the heat source is in contact.
  • FIG. 1 is a schematic cross-sectional view (a) and a front view (b) of a cut surface chamfered according to the present invention.
  • FIG. 2 is a schematic cross-sectional view of a cut surface chamfered according to the present invention.
  • FIG 3 is a schematic cross-sectional view of a cut surface chamfered according to the present invention.
  • FIG. 4 is a schematic cross-sectional view of a cut surface chamfered according to the present invention.
  • Figure 5 shows the change in phase and volume with the heating temperature of the tempered glass.
  • Figure 6 is a photograph of the cutting surface chamfered in accordance with the present invention.
  • FIG. 7 is a schematic cross-sectional view of a cut surface in the case where a shape change occurs due to a small amount of volume change when chamfering the cut surface of tempered glass.
  • FIG. 8 is a photograph of a cut surface in a case where a shape change occurs due to a small amount of volume change during cutting surface chamfering of tempered glass.
  • the present invention comprises the steps of cutting the tempered glass by irradiating an infrared laser having a pulse width of 1ps to 20ps, output 4W to 75W; And contacting the cut surface of the tempered glass with a heat source having a temperature below the slow cooling point or more than the vaporization point of the tempered glass with an area of 0.001 to 2.5 mm 2 , and then moving at a moving speed of 5 to 300 mm / sec to chamfer the cut surface.
  • the present invention relates to a method of cutting a tempered glass quickly without defects and chamfering to have a uniform surface and good strength.
  • the cutting step is performed by irradiating an infrared laser having a pulse width of 1ps to 20ps and an output of 4W to 75W.
  • the laser method is a method that has been widely used for cutting ordinary glass other than tempered glass, and is known as a method capable of precisely cutting glass.
  • the present invention provides a method capable of precisely cutting tempered glass by providing characteristic conditions of a laser method capable of cutting tempered glass.
  • the tempered glass to which the cutting and chamfering methods of the present invention can be applied is not particularly limited as long as it is known in the art, but in a preferred embodiment, the depth of the tempered layer is 10 ⁇ m to 200 ⁇ m, and in another embodiment, 40 ⁇ m to 200 ⁇ m, in another embodiment 120 ⁇ m to 200 ⁇ m.
  • the tempered glass to which the cutting and chamfering method of the present invention may be applied may have a Vickers hardness of 600 to 700 kgf / mm 2 , preferably 650 to 690 kgf / mm 2 .
  • the tempered glass to which the cutting and chamfering method of the present invention may be applied may have a Young's modulus of 60 to 90 GPa, preferably 65 to 85 GPa.
  • an infrared laser is used to cut the tempered glass.
  • the wavelength may be 800 to 1,100 nm. If the wavelength of the laser is less than 800 nm, the cutting time of the tempered glass is increased, which may cause the size of the chippings and the breakage of the tempered glass.
  • the electrode laminate for the touch panel is formed, the pattern may be damaged, and since a separate cooling device and a cooling process are required, there is a problem that the process efficiency is lowered.
  • the laser has a pulse width of 1 ps to 20 ps (pico second). If the pulse width is less than 1 ps, it is impossible to cut the tempered glass. If the pulse width is greater than 20 ps, there is a problem of increasing the size of the chippings and breaking the tempered glass.
  • the laser is irradiated with an output of 4 W to 75 W, if the output is less than 4 W is impossible to cut the tempered glass, if it is more than 75 W the size of the chipping (Chipping) and the breakage of the tempered glass there is a problem.
  • the tempered glass may form a protective resin film on at least one surface before the cutting process of the present invention is performed.
  • a protective resin film damage can be prevented from occurring on the glass surface due to debris generated during the cutting step.
  • the tempered glass to be cut in the present invention may be a pre-formed electrode laminate for a touch panel on one surface thereof.
  • the electrode layer for the touch panel is formed in advance in the position to be cut into the unit window cover substrate of the ledger tempered glass substrate before cutting into the unit window cover substrate. Afterwards, carrying out the cutting process can double the productivity. Therefore, if the electrode laminated body for touch panels is formed in the tempered glass substrate to be cut
  • a protective resin film used in the art may be used without particular limitation. For example, after apply
  • disconnected may perform a removal process before a cutting process, but may perform a cutting process without removing.
  • the process of forming and removing the protective resin film may be performed even after the cutting process.
  • a process of forming and removing the protective resin film may be performed after the heat chamfering process.
  • the tempered glass that has undergone the cutting process of the present invention is in a state where the strength is remarkably lowered, fine cracks are present on the cut surface, and the cut surface is sharp, thus requiring a chamfering process.
  • the present invention thus provides a chamfering method that can be carried out continuously following the cutting method of the present invention described above.
  • the chamfering method of this invention is performed by making a heat source contact the cut surface of tempered glass.
  • the tempered glass may remarkably change the state of the cut surface or the physical properties of the tempered glass depending on the specific conditions of the cutting process. Accordingly, the present invention is a chamfering method that can recover the strength lowered by the cutting process, remove fine cracks, and can effectively process the cut surface following the cutting method of the present invention described above, in contact with the heat source of the above conditions It provides a chamfering method by.
  • the temperature of the heat source is above the slow cooling point of the tempered glass and below the vaporization point.
  • the tempered glass when the tempered glass is heated to a temperature above an annealing point, the tempered glass turns into a supercooled liquid or liquid phase. Due to the low thermal conductivity of the tempered glass, the temperature difference between the outside and the inside occurs severely when heating. When the tempered glass is cooled while heated above the slow cooling point, a volume difference occurs according to the temperature difference, and thus an internal stress is generated. In this case, a region having a temperature above the slow cooling point is stripped to a predetermined depth. If the temperature of the heat source is above the vaporization point of the tempered glass, the process itself is impossible.
  • the slow cooling point and the vaporization point may vary depending on the tempered glass, and the temperature range is not limited, and may be adjusted to the tempered glass.
  • the specific temperature range may be 700 ° C. to 1,700 ° C., but is not limited thereto.
  • the temperature of the heat source may be equal to or more than the softening point of the tempered glass.
  • the volume difference between the region having a temperature above the softening point and the cooled part is remarkably large.
  • the internal stress is largely generated, so that a region having a temperature above the softening point can easily fall off in a strip form to a predetermined depth.
  • the softening point and the vaporization point may vary depending on the tempered glass, and the temperature range is not limited, and may be adjusted to the tempered glass.
  • the specific temperature range may be 850 ° C to 1,700 ° C, but is not limited thereto. If the heat source temperature is higher than 1700 ° C, the heat source may be damaged by the oxidation reaction, so the upper limit of the temperature is preferably 1700 ° C or lower.
  • FIGS. 2 and 3 The cross section in which the heated portion is cut off in strip form at the cut surface is shown in FIGS. 2 and 3 in an even shape, and is the same as the actual cross section of FIG. 6.
  • the generated internal stress does not exceed the bonding energy between the materials, resulting in morphological deformation rather than cracking, and the shape becomes hard as the viscosity increases.
  • an even cross section is not obtained, and the form as shown in FIG. 7 is obtained.
  • the heat source having a temperature range according to the present invention When the heat source having a temperature range according to the present invention is in contact with the cut surface of the tempered glass, due to the characteristics of the glass having a low heat transfer rate, thermal stress is generated in the cut surface portion, so that the portion from the heat source contact portion to a predetermined depth is separated.
  • the chamfering method according to the present invention the elongation of the tempered glass significantly lowered by the cutting step can be significantly increased to 0.4% or more.
  • the heat source is in contact with the cut surface of the tempered glass in an area of 0.001 to 2.5 mm 2 .
  • the chamfered surface may be rough and the chamfered shape may be uneven, and if it is more than 2.5 mm 2 , the shape change may occur due to excessive melting of the glass.
  • the heat source may be in point contact or line contact with the cut surface of the tempered glass.
  • the point contact or the line contact geometrically includes a case where the two objects meet at one point and a line at the same point, as well as a case where the point contact or the line contact is made substantially.
  • the point contact or the line contact is made substantially.
  • a conical heat source is in contact with a tempered glass cut edge
  • the heat source and the edge meet at one point
  • a planar heat source is in contact with the cut edge
  • mathematically the heat source and edge are contacted.
  • the additional line meets, mathematically the point or line does not have an area.
  • the contact is made with a predetermined area, and the point contact or line contact in the present invention includes such a case.
  • the contact area is 0.001 to 1 mm 2 . If the contact area is less than 0.001 mm 2, the chamfered surface may be rough and the chamfered shape may be uneven, and if it is more than 1 mm 2 , the shape change may occur due to excessive melting of the glass.
  • the heat source may also be in surface contact with the cut surface of the tempered glass.
  • the surface contact means a case where surface contact is made even when geometrically interpreted.
  • the heat source may be in surface contact with the cut surface of the tempered glass.
  • the contact area thereof is 0.01 to 2.5 mm 2 . If the contact area is less than 0.01mm 2, the chamfered surface may be rough and the chamfered shape may be uneven. If the contact area is larger than 2.5mm 2 , the shape change may occur due to excessive melting of the glass.
  • the tempered glass may be quenched after the heat source contacts.
  • Quenching can be performed, for example, by carrying out the chamfering step at room temperature (eg, 15 to 30 ° C).
  • room temperature eg, 15 to 30 ° C.
  • the portion is heated, but if the heat source moves out of the portion, the heated portion may be exposed to room temperature and quenched.
  • the heat source in contact with the cutting surface moves along the portion to be chamfered, and the moving speed is 5 to 300 mm / sec. If the moving speed is less than 5 mm / sec, the protective layer may be damaged, the cutting amount may be increased, and the shape change may occur due to excessive melting of the glass, and if it is more than 300 mm / sec, the chamfering surface may be rough and the chamfering shape may be uneven. have.
  • the material that can be used as the heat source is not particularly limited as long as it is a material that can transmit the temperature of the aforementioned heat source without deformation.
  • a ceramic material is mentioned, it is not limited to this.
  • the chamfering method of the present invention may be further applied to the means for controlling the pressure or the position of the tempered glass or heat source to achieve a stable chamfering quality.
  • Chamfering method is a method of processing the upper edge portion and the lower edge portion of the cut surface inclined
  • Figure 1 is a schematic cross-sectional view (a) and front view (b) of the chamfered cut surface is shown.
  • the method of processing the inclined upper and lower corners of the cut surface is in particular limited to the detailed conditions such as the specific order, the number of times, the inclination angle of contacting the heat source if the final shape is inclined to the upper and lower corners. There is no
  • the present invention can be performed by contacting the heat source to the upper edge portion and the lower edge portion of the cut surface.
  • the inclined surface may be formed by contacting the heat source with the upper edge portion 1 and the lower edge portion 2 of the cut surface.
  • the heat source may be contacted with the upper edge portion and the lower edge portion of the cut surface and then contacted with the heat source in a direction parallel to the cut surface.
  • This embodiment can be adopted where necessary, as is the case where there are many parts of the tempered glass removed by the chamfering method.
  • Figure 2 schematically shows the chamfering method of this embodiment. Referring to Figure 2, first to form an inclined surface to a predetermined portion (1) by contacting the heat source to the upper edge of the cut surface. Next, a heat source is contacted to the upper edge portion of the cut surface to form an inclined surface up to a predetermined portion (2). Subsequently, the final cross-sectional shape can be obtained by contacting the heat source in a direction parallel to the cut surface to remove the glass to the required portion 3.
  • the order of the chamfering process can be changed, and thus, the chamfering process may be performed in a different order from that shown in FIG. 2.
  • the chamfering process may be performed in the order of 2, 1 and 3, or may be performed in the order of 3, 2, and 1, but is not limited thereto.
  • the laser cutting method of the present invention can form the cut surface evenly, but through such a reinforcing process can have a more uniform surface and excellent strength.
  • the reinforcing process according to the present invention may be a method of polishing the cut surface with a polishing wheel, or etching the cut surface with an etchant containing hydrofluoric acid.
  • a method of polishing with a polishing wheel is a method of polishing the cut surface more evenly by bringing the rotating polishing wheel into contact with the cut surface after the inclined surface processing by the heat source is completed. This reinforces the cut surface by grinding the microcracks and the like present on the surface.
  • the polishing wheel may use a wheel made of abrasive particles such as cerium oxide.
  • the size of the abrasive grains is preferably 5 ⁇ m or less in view of sufficiently showing the cut surface reinforcement effect. The smaller the size of the abrasive particles, the higher the polishing accuracy is. Therefore, the lower limit is not particularly limited, but considering the process time or the like, about 0.01 ⁇ m can be used.
  • the rotation speed of the polishing wheel is not particularly limited and may be appropriately selected so that the cut surface is sufficiently polished to obtain a desired level of strength, for example, it may be 1,000 to 10,000 rpm.
  • the method of etching using hydrofluoric acid is a method of applying an etching solution containing hydrofluoric acid to a cut surface to etch a surface portion of the cut surface.
  • an etchant containing hydrofluoric acid When the cutting surface is etched with an etchant containing hydrofluoric acid, the cutting surface exhibits an embossed pattern and is etched to reinforce the surface.
  • the etchant including hydrofluoric acid is an aqueous hydrofluoric acid solution, and may further include components known in the art as free etching components such as hydrochloric acid, nitric acid, and sulfuric acid, in addition to hydrofluoric acid.
  • the time for etching the cut surface with an etchant containing hydrofluoric acid is not particularly limited, for example, etching between 30 seconds and 10 minutes can increase the strength without excessively etching the cut surface .
  • the temperature of the etching liquid containing hydrofluoric acid is not specifically limited, For example, it is preferable that it is 20-50 degreeC. If the temperature is lower than 20 °C process time is long and the etching may proceed inadequately, if the temperature is higher than 50 °C process time is short but the etching may proceed unevenly.
  • An etchant including hydrofluoric acid may be applied to the cut surface in a manner known in the art, such as sprayed on the cut surface or immersing the cut surface in the etchant.
  • the comparative examples outside the conditions of the present invention are impossible to cut or the tempered glass breaks during cutting. Also, even if cutting is possible, the chipping size was large.
  • Elongation is an index for evaluating strength.
  • the upper span is provided with two support spans spaced from both sides from the center of the substrate to the lower part of the tempered glass substrate, and a load is applied to the upper part of the window substrate with an upper span positioned above the center of the substrate.
  • the distance (crosshead displacement) from the point of contact with the window substrate to the point at which the window substrate was broken was measured and calculated according to the following equation.
  • T is the thickness of the window substrate (mm)
  • ⁇ is the crosshead displacement (mm)
  • s is the distance between the support spans (mm)
  • Example 6 shows a cut surface of Example 6, referring to this, it can be seen that chamfering was performed evenly.
  • Example 11 chamfering was performed with a heat source having a temperature lower than the slow cooling point and the softening point, so that some regions fell off in a strip form and some regions did not, so that a cut surface was formed as shown in FIG.

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Abstract

La présente invention concerne un procédé de découpe et de chanfreinage de verre trempé, et plus précisément, un procédé comprenant les étapes consistant : à découper le verre trempé par l'émission d'un laser infrarouge ayant une largeur d'impulsion de 1 à 20 ps et une sortie de 4 à 75 W ; et à amener une source de chaleur, ayant une température non inférieure au point de recuit du verre trempé et inférieure son point d'évaporation, en contact avec une surface de découpe du verre trempé ayant une aire de 0,001 à 2,5 mm2, puis à chanfreiner la surface découpée en déplaçant le verre trempé à une vitesse de mouvement de 5 à 300 mm/sec, ce qui permet de découper rapidement le verre trempé sans défauts et de chanfreiner le verre trempé pour avoir une surface uniforme et une excellente résistance.
PCT/KR2015/002076 2014-03-26 2015-03-04 Procédé de découpe et de chanfreinage de verre trempé WO2015147456A1 (fr)

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KR20140035079 2014-03-26
KR10-2014-0035079 2014-03-26
KR1020140175692A KR102258106B1 (ko) 2014-03-26 2014-12-09 강화 유리의 절단 및 면취 방법
KR10-2014-0175692 2014-12-09

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KR20120079204A (ko) * 2011-01-04 2012-07-12 공석태 불산을통한 유리면취방법
KR101358672B1 (ko) * 2012-08-13 2014-02-11 한국과학기술원 극초단 펄스 레이저를 이용한 투명시편 절단방법 및 다이싱 장치

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