WO2015093727A1 - Procédé de découpe et de chanfreinage de verre trempé - Google Patents

Procédé de découpe et de chanfreinage de verre trempé Download PDF

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Publication number
WO2015093727A1
WO2015093727A1 PCT/KR2014/010528 KR2014010528W WO2015093727A1 WO 2015093727 A1 WO2015093727 A1 WO 2015093727A1 KR 2014010528 W KR2014010528 W KR 2014010528W WO 2015093727 A1 WO2015093727 A1 WO 2015093727A1
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WO
WIPO (PCT)
Prior art keywords
tempered glass
cutting
chamfering
cut surface
heat source
Prior art date
Application number
PCT/KR2014/010528
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English (en)
Korean (ko)
Inventor
이한배
손동진
이동헌
박대출
Original Assignee
동우화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 동우화인켐 주식회사 filed Critical 동우화인켐 주식회사
Priority to CN201480050338.6A priority Critical patent/CN105579409B/zh
Publication of WO2015093727A1 publication Critical patent/WO2015093727A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C5/00—Devices or accessories for generating abrasive blasts
    • B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins

Definitions

  • the present invention relates to a method of cutting and chamfering a tempered glass, and more particularly, to a method of cutting and processing a tempered glass used in a touch screen panel to have a high strength without damage.
  • Glass products are treated as essential components in a wide range of technologies and industries, such as monitors, cameras, VTRs, mobile phones, video and optical equipment, automobiles, transportation equipment, various tableware, and construction facilities. According to the present invention, glass having various physical properties is manufactured and used.
  • a touch screen is a display and input device installed on a monitor for a terminal to perform a specific command to a computer by inputting various data such as simple contact or drawing a character or a picture by using an auxiliary input means such as a finger or a pen.
  • Such touch screens are increasingly important as a key component for various digital devices that transmit or exchange information to one or both of mobile communication devices such as smartphones, computers, cameras, certificates such as certificates, and industrial equipment. The range is expanding rapidly.
  • the upper transparent protective layer directly contacting the user among the components constituting the touch screen is mainly a plastic organic material such as polyester or acrylic, and the material is deformed due to continuous and repeated use and contact due to its low heat resistance and low mechanical strength. There is a limit in durability, such as being scratched or scratched. Therefore, the upper transparent protective layer of the touch screen is gradually replaced by the tempered laminated glass having excellent heat resistance, mechanical strength and hardness from the conventional transparent plastic. In addition to the use of tempered thin glass as a transparent protective window of the LCD or OLED monitor in addition to the touch screen, its use area is gradually expanding.
  • Tempered glass is compressed due to the large compressive stress present on the surface when it is cut, and it breaks out of chaotic debris instead of the intended shape, or even if the cut is made in the intended shape. Since the stress disappears and the strength decreases, it is difficult to cut to a desired size or shape once it is strengthened regardless of the composition of the glass.
  • the cutting method of tempered glass requires very precise and stringent conditions as compared with the conventional cutting method of glass.
  • the method introduced as the cutting method of such tempered glass is as follows.
  • the diamond or carbide notching wheels are pulled across the glass surface so that the scale is mechanically inscribed on the glass plate, which is then cut by bending the glass plate along the scale to create a cutting edge.
  • mechanical cutting will produce lateral cracks of about 100 to 150 ⁇ m deep, which cracks arise from the cutting line of the eyewheel. Since the lateral cracks lower the strength of the window substrate, the cutouts of the window substrate must be polished and removed.
  • the method expands the glass surface by moving the laser along a predetermined path on the glass surface through a check on the edge of the window substrate, and along the path of the laser, by pulling the surface along with the cooler moving behind it.
  • the window substrate is cut by thermally propagating the cracks.
  • the laser cutting method has a disadvantage of expensive equipment.
  • Chamfering process is generally performed by rotating the polishing wheel for the processing of the cut, that is, chamfering. Through the chamfering process, the smoothness of the cut portion is improved and the strength is increased. However, it was difficult to provide a window substrate having excellent strength in the conventional chamfering process.
  • Korean Patent No. 0895830 discloses a method of using a cup wheel as an edge processing method of a flat panel display glass substrate, but a method of using a cup chop is a mechanical chamfering method, and it is necessary to perform repeatedly to obtain a desired surface state. There is a problem that takes a long time to process.
  • the chamfering processing method using a laser has been introduced, but the laser method is a method of cutting the chamfering surface to a fine size (chipping) also has a problem that the processing surface is not uniform, focusing on the cutting surface surface for processing You need a matching step.
  • Patent Document 1 Korean Registered Patent No. 0895830
  • An object of the present invention is to provide a method capable of quickly cutting a tempered glass without any defects.
  • Another object of the present invention is to provide a method capable of precisely cutting tempered glass.
  • Another object of the present invention is to provide a chamfering method capable of effectively removing fine cracks on the cut surface of the cut tempered glass and exhibiting high strength.
  • Another object of the present invention is to provide a chamfering method capable of effectively reinforcing the cut surface of the cut tempered glass to exhibit high strength.
  • the cutting particles are at least one selected from the group consisting of aluminum oxide, garnet and tungsten carbide, cutting method of tempered glass.
  • the tempered glass Vickers hardness is 600 to 700 kgf / mm 2 , the cutting method of the tempered glass.
  • the upper edge portion and the lower edge portion of the cut surface is inclined by the contact of the heat source, chamfering method of the tempered glass.
  • the upper edge and the lower edge of the cut surface is performed by contacting the heat source, chamfering method of the tempered glass.
  • the tempered glass by using a waterjet method performed under specific conditions in cutting the tempered glass, not only can the tempered glass be quickly cut without defect but also can be precisely cut at a lower cost than in the prior art.
  • the present invention can be effectively chamfered by contacting the cut surface of the cut tempered glass by contacting the heat source under specific conditions, thereby effectively having a high strength.
  • the present invention can further improve the strength of the tempered glass by polishing with hydrofluoric acid or a polishing wheel after reinforcing the cut surface after contact with the heat source.
  • FIG. 1 is a schematic cross-sectional view (a) and a front view (b) of a cut surface chamfered according to the present invention.
  • FIG. 2 is a view schematically showing an embodiment of a chamfering method according to the present invention.
  • FIG 3 is a view schematically showing another embodiment of the chamfering method according to the present invention.
  • the present invention sprays water (H 2 O) with the cutting particles of 120 to 600 mesh at an injection pressure of 100 to 800 Bar and the cutting speed is 1,500 mm / min or less of the tempered glass
  • the waterjet method has been widely used for cutting ordinary glass, not tempered glass, and is known to be able to cut glass economically and precisely.
  • the present invention provides a characteristic condition of a waterjet method for cutting tempered glass, thereby making it possible to cut the glass economically and precisely. To provide.
  • the tempered glass to which the cutting method of the present invention may be applied is not particularly limited as long as it is known in the art, but in a preferred embodiment, the depth of the tempered layer is 10 ⁇ m to 200 ⁇ m, and in another embodiment, 40 ⁇ m to 200 ⁇ m. In another embodiment, the thickness may be 120 ⁇ m to 200 ⁇ m.
  • the tempered glass to which the cutting method of the present invention may be applied may have a Vickers hardness of 600 to 700 kgf / mm 2 , preferably 650 to 690 kgf / mm 2 .
  • the tempered glass to which the cutting method of the present invention may be applied may have a Young's modulus of 60 to 90 GPa, preferably 65 to 85 GPa.
  • water (H 2 O) is sprayed at an injection pressure of 100 to 800 Bar, preferably 200 to 700 Bar, and a cutting speed is 1,500 mm / min or less, preferably 400 To 1,000 mm / min.
  • the cutting speed means a speed at which the sprayed water moves while cutting the tempered glass along the cutting line of the tempered glass.
  • the cutting speed according to the present invention exceeds 1,500 mm / min, there is a problem that the stability of the cutting is lowered, such as not cutting or increasing the size of the chipping where the tempered glass breaks and fragments are separated.
  • the slow cutting speed only affects productivity, so the lower limit of the cutting speed is not particularly limited.
  • the cutting speed is more preferably 400 to 1,000 mm / min.
  • the glass cutting method of the present invention together with water (H 2 O) spraying the particles for cutting.
  • the cutting particles function to cut the tempered glass with water.
  • Cutting particles used in the present invention is used that is 120 to 600 mesh. If the cutting particles are less than 120 mesh, there is a problem of increasing chipping size and breakage of tempered glass. If the cutting particles are larger than 600 mesh, a taper angle of the cutting surface is greatly generated, and errors occurring in subsequent chamfering and reinforcing processes are accumulated, resulting in the final product. Causes the failure of.
  • particles for cutting materials used in the art may be used without particular limitation, and for example, aluminum oxide, garnet, tungsten carbide, and the like may be used, and these may be used alone or in combination of two or more thereof.
  • the water and the cutting particles are stored in a separate space, and then the outlet of the cutting particles is placed in the water spray path, and when the water is sprayed at a high injection pressure, The cutting particles are discharged by the negative pressure generated at the outlet and sprayed together with water, or sprayed together with water and cutting particles mixed in advance.
  • the latter method is preferred, which has the advantages of suppressing scattering of the cutting particles, increasing the cutting energy density, reducing the chipping and reducing the angle of the cutting surface taper.
  • the tempered glass may form a protective resin film on at least one surface before the cutting process of the present invention is performed.
  • a protective resin film damage can be prevented from occurring on the glass surface due to debris generated during the cutting step.
  • the tempered glass to be cut in the present invention may be a pre-formed electrode laminate for a touch panel on one surface thereof.
  • the electrode layer for the touch panel is formed in advance in the position to be cut into the unit window cover substrate of the ledger tempered glass substrate before cutting into the unit window cover substrate. Afterwards, carrying out the cutting process can double the productivity. Therefore, if the electrode laminated body for touch panels is formed in the tempered glass substrate to be cut
  • a protective resin film used in the art may be used without particular limitation. For example, after apply
  • disconnected may perform a removal process before a cutting process, but may perform a cutting process without removing.
  • the process of forming and removing the protective resin film may be performed even after the cutting process.
  • a process of forming and removing the protective resin film may be performed after the heat chamfering process.
  • the tempered glass that has undergone the cutting process of the present invention is in a state where the strength is remarkably lowered, fine cracks are present on the cut surface, and the cut surface is sharp, thus requiring a chamfering process.
  • the present invention thus provides a chamfering method that can be carried out continuously following the cutting method of the present invention described above.
  • the tempered glass to which the chamfering method of the present invention can be applied is not particularly limited as long as it is known in the art, but in a preferred embodiment, the depth of the strengthening layer is 10 ⁇ m to 200 ⁇ m, and in another embodiment, 40 ⁇ m to 200 ⁇ m. In another embodiment, the thickness may be 120 ⁇ m to 200 ⁇ m.
  • the tempered glass to which the chamfering method of the present invention may be applied may have a Vickers hardness of 600 to 700 kgf / mm 2 , preferably 650 to 690 kgf / mm 2 .
  • the tempered glass to which the chamfering method of the present invention may be applied may have a Young's modulus of 60 to 90 GPa, preferably 65 to 85 GPa.
  • Chamfering method of the present invention is carried out by contacting the cut surface of the tempered glass with a heat source having a temperature of 700 to 1,700 °C.
  • the tempered glass may remarkably change the state of the cut surface or the physical properties of the tempered glass depending on the specific conditions of the cutting process. Accordingly, the present invention is a chamfering method that can recover the strength lowered by the cutting process, remove fine cracks, and can effectively process the cut surface following the cutting method of the present invention described above, in contact with the heat source of the above conditions It provides a chamfering method by.
  • the heat source having a temperature range according to the present invention When the heat source having a temperature range according to the present invention is in contact with the cut surface of the tempered glass, due to the characteristics of the glass having a low heat transfer rate, thermal stress is generated in the cut surface portion, so that the portion from the heat source contact portion to a predetermined depth is separated.
  • the chamfering method according to the present invention the elongation of the tempered glass significantly lowered by the cutting step can be significantly increased to 0.4% or more.
  • chamfering when the temperature of the heat source is less than 700 ° C., chamfering may not be performed, and when the temperature of the heat source is greater than 1,700 ° C., the tempered glass may be melted.
  • the heat source in contact with the cut surface is moved along the portion to be chamfered, the moving speed is 5 to 300mm / sec. If the moving speed is less than 5 mm / sec, problems of damage to the protective layer, an increase in cutting amount, and melting of tempered glass may occur, and if it is more than 300 mm / sec, the chamfering surface may be rough and the chamfering shape may be uneven.
  • the material that can be used as the heat source is not particularly limited as long as it is a material that can transmit the temperature of the aforementioned heat source without deformation.
  • a ceramic material is mentioned, it is not limited to this.
  • the chamfering method of the present invention may be further applied to the means for controlling the pressure or the position of the tempered glass or heat source to achieve a stable chamfering quality.
  • Chamfering method is a method of processing the upper edge portion and the lower edge portion of the cut surface inclined
  • Figure 1 is a schematic cross-sectional view (a) and front view (b) of the chamfered cut surface is shown.
  • the method of processing the inclined upper and lower corners of the cut surface is in particular limited to the detailed conditions such as the specific order, the number of times, the inclination angle of contacting the heat source if the final shape is inclined to the upper and lower corners. There is no
  • the present invention can be performed by contacting the heat source to the upper edge portion and the lower edge portion of the cut surface.
  • the inclined surface may be formed by contacting the heat source with the upper edge portion 1 and the lower edge portion 2 of the cut surface.
  • the heat source may be contacted to the upper edge portion and the lower edge portion of the cut surface and then contact the heat source in a direction parallel to the cut surface.
  • This embodiment can be adopted where necessary, as is the case where there are many parts of the tempered glass removed by the chamfering method.
  • Figure 2 schematically shows the chamfering method of this embodiment. Referring to Figure 2, first to form an inclined surface to a predetermined portion (1) by contacting the heat source to the upper edge of the cut surface. Next, a heat source is contacted to the upper edge portion of the cut surface to form an inclined surface up to a predetermined portion (2). Subsequently, the final cross-sectional shape can be obtained by contacting the heat source in a direction parallel to the cut surface to remove the glass to the required portion 3.
  • the order of the chamfering process can be changed, and thus, the chamfering process may be performed in a different order from that shown in FIG. 2.
  • the chamfering process may be performed in the order of 2, 1 and 3, or may be performed in the order of 3, 2, and 1, but is not limited thereto.
  • the reinforcing process of the surface of the cutting surface can be further performed as necessary.
  • the reinforcing process according to the present invention may be a method of polishing the cut surface with a polishing wheel, or etching the cut surface with an etchant containing hydrofluoric acid.
  • a method of polishing with a polishing wheel is a method of polishing the cut surface more evenly by bringing the rotating polishing wheel into contact with the cut surface after the inclined surface processing by the heat source is completed. This reinforces the cut surface by grinding the microcracks and the like present on the surface.
  • the polishing wheel may use a wheel made of abrasive particles such as cerium oxide.
  • the size of the abrasive grains is preferably 5 ⁇ m or less in view of sufficiently showing the cut surface reinforcement effect. The smaller the size of the abrasive particles, the higher the polishing accuracy is. Therefore, the lower limit is not particularly limited, but considering the process time or the like, about 0.01 ⁇ m can be used.
  • the method of etching using hydrofluoric acid is a method of applying an etching solution containing hydrofluoric acid to a cut surface to etch a surface portion of the cut surface.
  • an etchant containing hydrofluoric acid When the cutting surface is etched with an etchant containing hydrofluoric acid, the cutting surface exhibits an embossed pattern and is etched to reinforce the surface.
  • the etchant including hydrofluoric acid is an aqueous hydrofluoric acid solution, and may further include components known in the art as free etching components such as hydrochloric acid, nitric acid, and sulfuric acid, in addition to hydrofluoric acid.
  • the time for etching the cut surface with an etchant containing hydrofluoric acid is not particularly limited, for example, etching between 30 seconds and 10 minutes can increase the strength without excessively etching the cut surface .
  • the temperature of the etching liquid containing hydrofluoric acid is not specifically limited, For example, it is preferable that it is 20-50 degreeC. If the temperature is lower than 20 °C process time is long and the etching may proceed inadequately, if the temperature is higher than 50 °C process time is short but the etching may proceed unevenly.
  • An etchant including hydrofluoric acid may be applied to the cut surface in a manner known in the art, such as sprayed on the cut surface or immersing the cut surface in the etchant.
  • the embodiments of the injection pressure and the cutting speed range of the present invention were all capable of cutting the tempered glass, but the comparative examples outside the scope of the present invention were impossible to cut or the tempered glass was broken during cutting.
  • Elongation is an index for evaluating strength.
  • the upper span is provided with two support spans spaced from both sides from the center of the substrate to the lower part of the tempered glass substrate, and a load is applied to the upper part of the window substrate with an upper span positioned above the center of the substrate.
  • the distance (crosshead displacement) from the point of contact with the window substrate to the point at which the window substrate was broken was measured and calculated according to the following equation.
  • T is the thickness of the window substrate (mm)
  • ⁇ is the crosshead displacement (mm)
  • s is the distance between the support spans (mm)

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

La présente invention concerne un procédé de découpe et de chanfreinage de verre trempé. Elle concerne plus particulièrement un procédé rapide de découpe et de chanfreinage de verre trempé, sans occasionner de défauts, par pulvérisation d'eau (H2O) à une pression d'injection de 100 à 800 bars, conjointement à une découpe en treillis de 120 à 600 particules, avec une vitesse de coupe maintenue à au plus 1500 mm/min.
PCT/KR2014/010528 2013-12-17 2014-11-04 Procédé de découpe et de chanfreinage de verre trempé WO2015093727A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201480050338.6A CN105579409B (zh) 2013-12-17 2014-11-04 切割和倒角强化玻璃的方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20130157566 2013-12-17
KR10-2013-0157566 2013-12-17
KR1020140027121A KR101454451B1 (ko) 2013-12-17 2014-03-07 강화 유리의 절단 방법 및 면취 방법
KR10-2014-0027121 2014-03-07

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CN (1) CN105579409B (fr)
TW (1) TWI649280B (fr)
WO (1) WO2015093727A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018144577A1 (fr) * 2017-01-31 2018-08-09 Corning Incorporated Procédés de réduction de particules sur les tranches d'une feuille de verre

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112017002734T5 (de) * 2016-05-31 2019-02-21 AGC Inc. Abdeckglas und Anzeigevorrichtung
RU2731559C1 (ru) * 2020-08-09 2020-09-04 Андрей Алексеевич Спиридонов Способ гидроабразивного резания материалов

Citations (4)

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Publication number Priority date Publication date Assignee Title
US4703591A (en) * 1985-04-15 1987-11-03 Libbey-Owens-Ford Co. Ultra-high pressure abrasive jet cutting of glass
JP2001294437A (ja) * 2000-04-13 2001-10-23 Sharp Corp 液晶表示装置のガラス基板の面取り方法およびその方法に用いる加熱器
KR20100037690A (ko) * 2008-10-02 2010-04-12 이유진 워터젯 커팅기를 이용한 글라스 커팅방법
KR20120079204A (ko) * 2011-01-04 2012-07-12 공석태 불산을통한 유리면취방법

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US4702042A (en) * 1984-09-27 1987-10-27 Libbey-Owens-Ford Co. Cutting strengthened glass
JP5113462B2 (ja) * 2007-09-12 2013-01-09 三星ダイヤモンド工業株式会社 脆性材料基板の面取り方法
US9114467B2 (en) * 2009-05-14 2015-08-25 Picodrill Sa Method of smoothing and/or bevelling an edge of a substrate
JP5541449B2 (ja) * 2010-03-02 2014-07-09 日本電気硝子株式会社 薄板ガラス又は薄板ガラスを含むガラス積層体の加工方法

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Publication number Priority date Publication date Assignee Title
US4703591A (en) * 1985-04-15 1987-11-03 Libbey-Owens-Ford Co. Ultra-high pressure abrasive jet cutting of glass
JP2001294437A (ja) * 2000-04-13 2001-10-23 Sharp Corp 液晶表示装置のガラス基板の面取り方法およびその方法に用いる加熱器
KR20100037690A (ko) * 2008-10-02 2010-04-12 이유진 워터젯 커팅기를 이용한 글라스 커팅방법
KR20120079204A (ko) * 2011-01-04 2012-07-12 공석태 불산을통한 유리면취방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018144577A1 (fr) * 2017-01-31 2018-08-09 Corning Incorporated Procédés de réduction de particules sur les tranches d'une feuille de verre

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Publication number Publication date
TWI649280B (zh) 2019-02-01
KR101454451B1 (ko) 2014-10-23
CN105579409A (zh) 2016-05-11
TW201529498A (zh) 2015-08-01
CN105579409B (zh) 2019-04-26

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