WO2015145548A1 - Dispositif à rayons x, dispositif de mesure à rayons x et procédé de production de structure - Google Patents

Dispositif à rayons x, dispositif de mesure à rayons x et procédé de production de structure Download PDF

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Publication number
WO2015145548A1
WO2015145548A1 PCT/JP2014/058105 JP2014058105W WO2015145548A1 WO 2015145548 A1 WO2015145548 A1 WO 2015145548A1 JP 2014058105 W JP2014058105 W JP 2014058105W WO 2015145548 A1 WO2015145548 A1 WO 2015145548A1
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Prior art keywords
ray
measured
ray apparatus
mounting table
placement
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PCT/JP2014/058105
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English (en)
Japanese (ja)
Inventor
信介 武田
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株式会社ニコン
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Priority to PCT/JP2014/058105 priority Critical patent/WO2015145548A1/fr
Publication of WO2015145548A1 publication Critical patent/WO2015145548A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G01N23/046—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material using tomography, e.g. computed tomography [CT]

Definitions

  • the present invention relates to an X-ray apparatus, an X-ray measurement apparatus, and a structure manufacturing method.
  • Patent Document 1 an X-ray apparatus that generates projection image data from a plurality of different directions by irradiating an object to be measured mounted on a mounting table with X-rays.
  • an X-ray apparatus includes an X-ray source that irradiates an object to be measured with X-rays, an X-ray detector that acquires a transmission image of X-rays transmitted through the object to be measured, Based on the configuration information of the object to be measured, the mounting table that is arranged between the radiation source and the X-ray detector and on which the object to be measured is to be placed, and the mounting position on which the object to be measured is to be placed on the mounting table A calculating unit for calculating.
  • the mounting table includes a rotation mechanism that rotates the X-ray source or the X-ray detector around the rotation axis.
  • the calculation unit places a moment due to the weight of the measurement object. It is preferable that the position of the object to be measured on the mounting table that is balanced at each position of the mounting table is calculated as the mounting position with the rotation axis of the mounting table or the position through which the extended line of the rotating shaft passes as a fulcrum.
  • the calculation unit calculates the first centroid position of the object to be measured from the configuration information, and based on the first centroid position, It is preferable to calculate the mounting position.
  • the surface of the object to be measured that is to come into contact with the mounting table when the measuring object is mounted on the mounting table based on the configuration information. It is preferable to provide a setting unit for setting as a contact surface.
  • the calculation unit calculates the position when the first centroid position is projected on the contact surface set by the setting unit as the second centroid position. Then, based on the second center of gravity position and the position through which the rotation axis of the mounting table or the extension line of the rotation axis passes, the position of the second center of gravity and the position through which the rotation axis or the extension line of the mounting table passes substantially match. It is preferable to calculate the mounting position.
  • the display device projects the placement position calculated by the calculation unit onto the placement surface of the placement table, and then on the placement surface. It is preferable to be configured by a projection unit indicating a position where the object to be measured is to be placed.
  • the X-ray apparatus further includes an index provided on the mounting surface of the mounting table, and the display device includes information regarding the mounting position and the index. It is preferable to display them together.
  • the display device has a positional relationship between the measurement object and the index in a state where the measurement object is placed on the placement position of the placement table. Is preferably displayed.
  • the display device in the X-ray apparatus according to the ninth or tenth aspect, includes an image of the mounting surface of the mounting table and a target in a state of being mounted at the mounting position of the mounting table. It is preferable to display the measured object image and the index image as the same image.
  • the calculation unit places the measured object at the placement position for each of the plurality of indices. In this case, it is preferable to calculate the positional relationship with a part of the contour of the object to be measured.
  • the display device is based on the positional relationship between the part of the contour of the measured object and the index calculated by the calculation unit. It is preferable to display a part of the contour of the object and an index closest to the part of the contour of the object to be measured.
  • the index preferably represents orthogonal coordinates.
  • the index is preferably formed by a plurality of concentric circles or a plurality of concentric polygons.
  • the index is preferably formed by a plurality of points.
  • the transfer unit that transfers the object to be measured to the mounting table, and the mounting unit that is calculated by the calculation unit by controlling the transfer unit.
  • an X-ray apparatus includes an X-ray source that irradiates an object to be measured with X-rays, an X-ray detector that acquires an X-ray transmission image transmitted through the object to be measured, Based on the configuration information of the object to be measured, the mounting table disposed between the X-ray source and the X-ray detector and on which the object to be measured is rotatably mounted, and the position of the object to be measured with respect to the rotation center of the mounting table. And a calculation unit for calculating.
  • the position of the center of gravity of the measurement object on the mounting surface of the mounting table is determined according to the position of the measurement object calculated by the calculation unit. It is preferable to further include an adjusting unit for adjusting.
  • the calculation unit preferably uses the design information of the object to be measured as the configuration information.
  • the imaging unit includes an imaging unit that images the measurement object and outputs an image signal, and the calculation unit is output by the imaging unit.
  • the X-ray apparatus according to the first to twenty-first aspects and the object to be measured are placed on the optical axis connecting the focal spot of the X-ray source and the center of the imaging region of the X-ray detector. It is preferable to include a moving unit that moves relative to or along the optical axis.
  • the X-ray measurement apparatus includes a reconstruction unit that calculates the internal structure information of the object to be measured using the transmission image acquired by the X-ray detector. It is preferable.
  • the design information related to the shape of the structure is created, the structure is created based on the design information, and the shape of the created structure is Alternatively, the shape information is obtained by measurement using the X-ray measurement apparatus according to the twenty-third aspect, and the obtained shape information is compared with the design information.
  • the structure manufacturing method according to the twenty-fourth aspect it is preferable that the structure is re-processed based on a comparison result between the shape information and the design information.
  • the reworking of the structure is performed again based on the design information.
  • the block diagram explaining the X-ray measuring device by one embodiment of this invention The figure which shows an example of the parameter
  • Conceptual diagram explaining installation position guidance processing The figure which shows an example of the screen displayed on a display monitor by display processing
  • the flowchart explaining the process for displaying a mounting position The figure explaining the structure of the structure manufacturing system by embodiment Flowchart explaining processing of structure manufacturing system
  • the X-ray measurement apparatus irradiates the object to be measured with X-rays and detects transmitted X-rays transmitted through the object to be measured, thereby acquiring non-destructive internal information (for example, internal structure) of the object to be measured.
  • non-destructive internal information for example, internal structure
  • the X-ray measuring apparatus is called an industrial X-ray CT inspection apparatus that inspects an industrial part.
  • the present embodiment is for specifically describing the purpose of the invention, and does not limit the present invention unless otherwise specified.
  • FIG. 1 is a diagram illustrating an example of a configuration of an X-ray measurement apparatus 100 according to the present embodiment.
  • the X-ray measurement apparatus 100 includes a housing 1, an X-ray source 2, a placement unit 3, a detector 4, a first control device 5, a display monitor 6 and a frame 8, and a second control device 7. And.
  • the housing 1 is disposed on a floor surface of a factory or the like so as to be substantially parallel (horizontal) to the XZ plane, and inside the X-ray source 2, the placement unit 3, the detector 4, and the frame 8. And is housed.
  • the housing 1 contains lead as a material in order to prevent X-rays from leaking to the outside.
  • the X-ray source 2 spreads in a conical shape along the optical axis Zr parallel to the Z axis with the emission point Q shown in FIG. 1 as the apex in accordance with control by the second control device 7.
  • X-rays (so-called cone beams) are emitted.
  • This exit point Q coincides with the focal spot of the X-ray source 2. That is, the optical axis Zr is an axis that connects the exit point Q, which is the focus spot of the X-ray source 2, and the center of the imaging region of the detector 4 described later.
  • the X-ray source 2 is not limited to one that emits conical X-rays, but one that also emits fan-shaped X-rays (so-called fan beams) or linear X-rays (so-called pencil beams). Included in embodiments.
  • the X-ray source 2 irradiates at least one high-energy X-ray such as 200 keV, 250 keV, 300 keV, 350 keV, 400 keV, 450 keV, 500 keV, 500 keV, 550 keV, 600 keV, 650 keV, 700 keV, and 750 keV to give a heavy metal or the like.
  • the measurement object S is configured to be measurable.
  • the X-ray source 2 emits at least one of, for example, an ultra soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, an X-ray of about 2 to 20 keV, and a hard X-ray of about 20 to 100 keV. can do.
  • the X-ray source 2 may be constituted by a transmission type X-ray source or a reflection type X-ray source.
  • the mounting unit 3 includes a mounting table 30 on which a mounting surface 311 on which the object to be measured S is mounted, a rotation driving unit 32, an X-axis moving unit 33, a Y-axis moving unit 34, and a Z-axis moving unit 35. And is provided on the Z axis + side from the X-ray source 2.
  • an index P (see FIG. 2) for guiding the placement position of the object S to be measured is provided. Details of the index P and details of the process for guiding the object to be measured S to the placement position will be described later.
  • the mounting table 30 is rotatably provided by a rotation drive unit 32, and moves together when the rotation center axis Yr by the rotation drive unit 32 moves in the X-axis, Y-axis, and Z-axis directions as will be described later.
  • a rotation shaft 301 extending in the Y-axis direction-side is provided on the lower surface of the center of the mounting table 30, and a bearing (not shown) at the Y-axis-side end of the rotation shaft 301 is provided in the rotation drive unit 32.
  • the rotation shaft 301 is rotated by the rotation drive unit 32 around the rotation center axis Yr passing through the center of the mounting table 30.
  • the rotational drive part 32 is comprised by the electric motor etc., for example, and is controlled by the 2nd control apparatus 7 mentioned later.
  • the electric motor is driven according to the control by the second control device 7, the mounting table 30 is rotated via the rotation shaft 301 by the rotational force.
  • the X-axis moving unit 33, the Y-axis moving unit 34, and the Z-axis moving unit 35 are controlled by the second control device 7, and the object S to be measured is positioned within the irradiation range of the X-rays emitted from the X-ray source 2.
  • the mounting table 30 is moved in the X-axis direction, the Y-axis direction, and the Z-axis direction, respectively.
  • the Z-axis moving unit 35 is controlled by the second control device 7 so that the distance from the X-ray source 2 to the measured object S is a distance corresponding to the magnification of the measured object S in the captured image. Then, the mounting table 30 is moved in the Z-axis direction.
  • FIG. 2 shows an example of the index P provided on the mounting surface 311 of the mounting table 30.
  • the case where the placement surface 311 is circular is shown as an example, but the shape of the placement surface 311 is not limited to a circle. It is included in one aspect.
  • a plurality of lines ax along the x-axis direction and a plurality of lines ay along the y-axis direction are formed on the mounting surface 311. Each line ax is parallel to each other with a predetermined interval, and each line ay is parallel to each other with a predetermined interval.
  • Each of the lines ax forms a plurality of line segments by intersecting with the plurality of lines ay
  • each of the lines ay forms a plurality of line segments by intersecting with the plurality of lines ax.
  • the area surrounded by the mark constitutes a scale.
  • An alphabet is formed in the vicinity of the intersection of the line ax and the line ay passing through the center of the placement surface 311 (that is, the rotation center axis Yr), and a number is formed in the vicinity of the intersection of the line ay and the line ax passing through the rotation center axis Yr. Is formed.
  • the index P is formed by the plurality of lines ax and the plurality of lines ay described above. That is, the index P forms an orthogonal coordinate system composed of the x axis and the y axis on a plane parallel to the XZ plane.
  • the user is guided by the index P by referring to the scale composed of the line segments ax and ay configured as the index P, and the measured object S is calculated by the processing described later on the placement surface 311.
  • the object to be measured S can be placed on the placement position.
  • the interval between the line ax and the interval between the lines ay that is, the size of the scale, even if the measured object S is placed with the middle of the scale as a guide as will be described later, the placement table 30. It is determined as an interval at which the occurrence of distortion or the like can be suppressed.
  • the detector 4 shown in FIG. 1 is provided on the Z axis + side from the X-ray source 2 and the mounting table 30. That is, the mounting table 30 is provided between the X-ray source 2 and the detector 4 in the Z-axis direction.
  • the detector 4 has an incident surface 41 parallel to the XY plane, and X-rays including transmitted X-rays emitted from the X-ray source 2 and transmitted through the object S placed on the mounting table 30 are incident. Incident on the surface 41.
  • the detector 4 is composed of a scintillator section containing a known scintillation substance, a photomultiplier tube, a light receiving section, and the like, and converts X-rays incident on the incident surface 41 of the scintillator section into light energy to produce photomultiplier.
  • the light is amplified by a tube, the amplified light energy is converted into electric energy by the light receiving unit, and is output to the second control device 7 as an electric signal.
  • the detector 4 may convert an incident X-ray into an electric signal without converting it into light energy and output it.
  • the detector 4 has a structure in which a scintillator section, a photomultiplier tube, and a light receiving section are each divided into a plurality of pixels, and these pixels are two-dimensionally arranged. Thereby, the intensity distribution of the X-rays radiated from the X-ray source 2 and passed through the object to be measured S can be acquired at once.
  • the detector 4 may have a structure in which a photomultiplier tube is not provided and the scintillator portion is formed directly on the light receiving portion (photoelectric conversion portion).
  • the frame 8 supports the X-ray source 2, the moving unit 36 of the mounting unit 3, and the detector 4.
  • the frame 8 is manufactured with sufficient rigidity. Therefore, it is possible to support the X-ray source 2, the moving unit 36, and the detector 4 without changing the relative positions during acquisition of the projection image of the measurement object S. Further, the frame 8 is supported by a vibration isolation mechanism 81 to prevent vibration generated outside from being transmitted to the frame 8 as it is.
  • the first control device 5 includes a microprocessor, peripheral circuits, and the like, and performs processing for guiding the object to be measured S to be placed at an optimum position on the placement surface 311 of the stage 30 (hereinafter referred to as placement). (Position position guidance processing) is performed.
  • the display monitor 6 is constituted by a liquid crystal monitor, for example, and notifies the operator of the placement position of the object S to be measured on the stage 30 by displaying the result of the placement position guidance process.
  • the second control device 7 has a microprocessor and its peripheral circuits, etc., and reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby performing X-ray measurement. Each part of the apparatus 100 is controlled.
  • the second control device 7 is based on the X-ray control unit 71 that controls the operation of the X-ray source 2, the movement control unit 72 that controls the movement operation of the moving unit 36, and the electrical signal output from the detector 4.
  • a known image reconstruction process is performed on the basis of the projection image data of the measurement object S having different projection directions while controlling the image generation unit 73 and the movement unit 36 that generate X-ray projection image data of the object S.
  • An image reconstruction unit 74 that generates a reconstructed image is provided as a function.
  • the image reconstruction process includes a back projection method, a filtered back projection method, a successive approximation method, and the like.
  • a rotation center axis Yr that is the center of the mounting table 30 or a bearing (not shown) at the end of the rotating shaft 301 provided in the rotation driving unit 32 is used as a fulcrum, it can be at any point on the mounting table 30.
  • the weight of the object to be measured S distorts the mounting table 30, particularly the rotation shaft 301, and the Y axis.
  • the rotation center axis Yr is inclined. In particular, when the object to be measured S is heavy, the tendency becomes remarkable.
  • the first control device 5 sets the position at which the tilt of the rotation center axis Yr of the placement base 30 can be suppressed to the placement base of the measurement object S. It is calculated as an optimal placement position to 30.
  • the first control device 5 calculates, as the placement position, a position where the measurement object S should be placed so that the moment described above is balanced at an arbitrary point on the placement table 30 by the placement position guidance process.
  • the first control device 5 calculates a position at which the rotation center axis Yr passes the center of gravity of the measurement object S as a placement position of the measurement object S.
  • the 1st control apparatus 5 calculates the positional relationship of the to-be-measured object S and the parameter
  • the first control device 5 includes, as the placement position guide processing unit 51, a center-of-gravity calculation processing unit 511 that calculates the center of gravity of the measurement object S, a contact surface determination processing unit 512 that determines a contact surface of the measurement object S, and a measurement target. It has a center-of-gravity position calculation processing unit 513 that calculates the center of gravity of the object S on the contact surface, and a positional relationship determination processing unit 514 that determines the positional relationship between the measured object S and the index P.
  • a center-of-gravity position calculation processing unit 513 that calculates the center of gravity of the object S on the contact surface
  • a positional relationship determination processing unit 514 that determines the positional relationship between the measured object S and the index P.
  • the center-of-gravity calculation processing unit 511 calculates the center of gravity G1 of the object to be measured S using the configuration information of the object to be measured S.
  • the configuration information information (horizontal width, vertical width, depth, corner position, etc.) that can specify the three-dimensional shape of the object to be measured S, and a plurality of members constituting the object to be measured S are formed of different materials.
  • information such as material, specific gravity, weight distribution, etc., that is, information necessary for calculating the center of gravity G1 of the object S to be measured is included.
  • design information such as three-dimensional CAD data is input as configuration information and used to calculate the center of gravity G1 of the object S to be measured.
  • the center of gravity G1 of the device under test S can be calculated by a known method by dividing the three-dimensional shape of the device under test S into fine voxels and calculating weight data for each voxel.
  • the configuration information does not necessarily have information that faithfully indicates the structure of the object to be measured S.
  • it may be configured by information indicating a position substantially coincident with the center of gravity G1, and information for estimating the configuration of the DUT S may be used as configuration information. .
  • the contact surface determination processing unit 512 determines a surface that comes into contact with the placement surface 311 among the surfaces of the measurement object S, and the surface. Is set as the contact surface D.
  • the contact surface determination processing unit 512 sets the contact surface D using the above-described configuration information (three-dimensional CAD data in the present embodiment).
  • the contact surface D can be determined by considering the following surface as an example.
  • X-rays in the object S to be measured A plane that has a posture that makes the passage path when passing through the plane as short as possible
  • a plane that has the smallest aspect ratio in the vertical and horizontal directions for example, a plane that has a shape close to a square or a circle.
  • the contact surface determination processing unit 512 has, for example, an area of the surface of the object to be measured S.
  • the maximum plane can be set as the contact surface D.
  • the contact surface determination processing unit 512 sets a surface where the jig and the mounting surface 311 are in contact with the mounting surface 311 as the contact surface D of the object S to be measured.
  • the contact surface setting processing unit 512 extracts a part of the contour of the contact surface D as the feature point C.
  • This feature point C is an index P determined by the positional relationship determination process described later when the user places the object S to be measured on the mounting table 30 with reference to the index P provided on the mounting surface 311. It is used for positioning for overlapping or positioning in the vicinity.
  • the contact surface determination processing unit 512 preferably extracts, as the feature point C, a corner portion of the contour of the contact surface D, particularly a position where the direction and curvature of the contour line changes.
  • the contact surface determination processing unit 512 extracts feature points C (feature points C1 and C2 in the example shown in FIG. 3B) from at least two points of the contour of the contact surface D.
  • the contact surface D is formed of a polygon, the shortest side or the longest side of the polygon may be extracted as a feature line.
  • center-of-gravity position calculation processing unit 513 calculates the position of the center of gravity (referred to as the second center of gravity in the following description) G2 on the contact surface D.
  • the center-of-gravity position calculation processing unit 513 projects the calculated center-of-gravity G1 of the measured object S perpendicularly to the contact surface D set by the contact surface determination processing unit 512 (from the measured object S to the contact surface D
  • the position where the perpendicular to the contact surface D intersects is defined as the second center of gravity G2 on the contact surface D.
  • Position relationship determination processing unit 514 places the measured object S on the mounting table 30 when the calculated second center of gravity G2 and the rotation center axis Yr of the mounting table 30 are substantially matched. The positional relationship between the contact surface D and the index P provided on the placement surface 311 is calculated. In other words, when the measurement object S is placed on the placement position of the placement table 30, the positional relationship determination processing unit 514 has the feature points C1 and C2 extracted by the contact surface determination processing unit 512 as a plurality of indices P. Which index P is coincident with or located in the vicinity. When the contact surface determination processing unit 512 extracts feature lines, the positional relationship determination processing unit 514 calculates on which index P the feature line should be located.
  • the positional relationship determination processing unit 514 performs the following processing as an example of calculating the positional relationship. First, the positional relationship determination processing unit 514 calculates the coordinates (x1, y1) of the feature point C1 on the coordinate system with the second centroid G2 as a reference, using the configuration information. Similarly, the positional relationship determination processing unit 514 calculates the coordinates (x2, y2) of the feature point C2 in the coordinate system with the second centroid G2 as a reference.
  • the positional relationship determination processing unit 514 converts the coordinates (x1, y1) of the feature point C1 and the coordinates (x2, y2) of the feature point C2 onto the coordinate system on the placement surface 311 shown in FIG. Then, the coordinates of the corresponding points E1 and E2 are calculated.
  • FIG. 3C shows the coordinates at which the feature points C1 and C2 of the contact surface D are positioned on the xy coordinate system when the object to be measured S is placed at the placement position on the placement surface 311. ing.
  • numerals and alphabets assigned to the scales formed on the placement surface 311 are represented outside the placement surface 311.
  • the corresponding point E1 of the feature point C1 coincides with the coordinates (d, 11) of the intersection of the lines ax and ay.
  • the positional relationship determination processing unit 514 sets the coordinates (d, 11) as the coordinates of the corresponding point E1.
  • FIG. 3C shows the coordinates at which the feature points C1 and C2 of the contact surface D are positioned on the xy coordinate system when the object to be measured S is placed at the placement position on the placement surface 311. ing.
  • numerals and alphabets assigned to the scales formed on the placement surface 311 are represented outside the placement surface 311.
  • the corresponding point E1 of the feature point C1 coincides
  • the corresponding point E2 of the feature point C2 has coordinates (g, 2), (g, 3), (h, 2) and (h) in the xy coordinate system where the coordinates of the intersections of the lines ax and ay. 3).
  • the positional relationship determination processing unit 514 uses the intersection of the lines ax and ay located in the vicinity of the corresponding point E2, and sets the x coordinate to (g to h) and the y coordinate to (2 to 3).
  • the feature points C1 and C2 are not limited to one square or a boundary position, and are not limited to the two squares shown as the coordinates of the corresponding points E1 and E2, but 3 for each feature point C1 and C2.
  • a range continuous with a plurality of squares equal to or larger than the square may be indicated as the coordinates of the corresponding points E1 and E2.
  • the feature point C1 of the object to be measured S is matched with the corresponding point E1 (d, 11) of the placement surface 311 and the feature point C2 is the corresponding point of the placement surface 311.
  • E2 g to h, 2 to 3
  • the measured object S can be placed on the mounting table 30 so that the rotation center axis Yr passes through the center of gravity G1 of the measured object S. it can.
  • the first control device 5 performs display control processing for causing the display monitor 6 to display the positional relationship calculated by the positional relationship determination processing.
  • FIG. 4 shows an example of a screen displayed on the display monitor 6 by the display control process.
  • a work display area R1 On the display monitor 6, a work display area R1, a stage display area R2, and a point list display area R3 are displayed.
  • the first control device 5 causes the work display area R1 to display an image showing the appearance of the object to be measured S and an image showing the extracted feature points C1 and C2 as the same image.
  • a case where an external perspective view created using design information such as three-dimensional CAD data as configuration information is displayed as the external appearance of the object S to be measured.
  • the first control device 5 displays, on the stage display region R2, an image showing the contact surface D of the measurement object S, an image showing the extracted feature points C1 and C2, and a placement surface 311 on which the index P is formed.
  • the displayed image is displayed as the same image.
  • numbers and alphabets provided on the scale in the xy coordinate system formed by the index P are also displayed, and the measurement object S is placed on the placement surface 311 according to the result of the positional relationship determination process. Is displayed.
  • the feature point C1 of the contact surface D intersects with the corresponding point E1 (d, 11) on the xy coordinate, and the feature point C2 corresponds to the corresponding point E2 (g to h, 2 to 3 on the xy coordinate).
  • the numbers and alphabets provided on the scale formed on the placement surface 311 are displayed on the placement surface 311 as illustrated in order to facilitate confirmation of the coordinate values by the user. It is preferable to represent it externally.
  • the first control device 5 causes the point list display area R3 to display the feature points C1 and C2 and the coordinates on the xy coordinates as character strings according to the result of the positional relationship determination process.
  • the case where it is displayed is shown.
  • the measurement object S can be placed at the placement position on the placement surface 311 of the placement table 30.
  • the measuring object S can be placed so that the rotation center axis Yr of the mounting table 30 passes through the center of gravity G1 of the measuring object S. Therefore, the mounting table 30 is distorted during measurement of the measuring object S, and the Y axis is In contrast, the rotation center axis Yr can be prevented from being inclined. Therefore, the error factor contained in the reconstructed image obtained by reconstructing the image obtained by irradiating the object to be measured S with X-rays can be suppressed, and an accurate measurement result can be obtained.
  • stage display area R2 and the point list display area R3 are displayed on the display monitor 6 based on the positional relationship determination process.
  • stage display area R2 is described.
  • a case where any one of the point list display area R3 is displayed is also included in one aspect of the present invention.
  • the relationship between the feature points C1 and C2 and the xy coordinates may be notified to the user using voice.
  • step S1 the configuration information of the object S to be measured is read and the process proceeds to step S2.
  • step S2 the center-of-gravity calculation processing unit 511 calculates the center of gravity G1 of the object S to be measured using the configuration information, and proceeds to step S3.
  • step S3 the contact surface setting processing unit 512 sets the contact surface D of the object S to be measured with the mounting surface 311 of the mounting table 30, and the process proceeds to step S4.
  • step S2 and step S3 are not limited to the above, and the center of gravity G1 may be calculated after the contact surface D is set.
  • the 1st control apparatus 5 is comprised so that parallel processing is possible, you may perform calculation of the gravity center G1, and the setting of the contact surface D simultaneously.
  • step S4 the centroid position calculation processing unit 513 calculates the second centroid G2 on the contact surface D by projecting the calculated centroid G1 on the contact surface D, and then proceeds to step S5.
  • step S5 the positional relationship determination processing unit 514 extracts feature points C1 and C2 that are part of the contour of the contact surface D, and proceeds to step S6.
  • step S6 when the rotation center axis Yr and the second center of gravity G2 of the contact surface D are substantially matched, an index P that coincides with or is adjacent to each of the feature points C1 and C2 is calculated, and step S7 is performed. Proceed to In step S7, the positional relationship between the feature points C1 and C2 and the index P calculated in step S6 is displayed in the stage display area R2 and the point list display area R3 of the display monitor 6, and the process is terminated.
  • the workpiece S is placed on the placement table 30.
  • a measurement process for the measurement object S is performed.
  • the movement control unit 72 of the second control device 7 controls the X-axis moving unit 33, the Y-axis moving unit 34, and the Z-axis moving unit 35, and moves the mounting table 30 to the X-ray.
  • the object to be measured S is positioned at a desired photographing position and magnification by moving relative to the source 2 and the detector 4.
  • the movement control unit 71 controls the rotation driving unit 32 to rotate the mounting table 30 that supports the object to be measured S about the rotation center axis Yr.
  • the X-ray control unit 71 of the second control device 7 controls the X-ray source 2 to irradiate the measurement object S with X-rays.
  • the detector 4 detects transmitted X-rays that the mounting table 30 has transmitted through the measurement object S at every predetermined rotation angle, and outputs the detected X-rays to the second control device 7 as electrical signals.
  • the image processing unit 73 of the second control device 7 generates projection image data of the measurement object S for each projection direction based on the electrical signal acquired for each rotation angle of the mounting table 30. That is, the image processing unit 73 generates projection image data of the measurement object S from a plurality of different directions.
  • the image reconstruction unit 74 of the second control device 7 performs a known image reconstruction process using a plurality of projection image data of the measurement object S, and is an internal structure (cross-sectional structure) of the measurement object S 3 Generate dimensional data.
  • the image reconstruction process includes a back projection method, a filtered back projection method, a successive approximation method, and the like.
  • the generated three-dimensional data of the internal structure of the measured object S is displayed on a display (not shown) or the like.
  • the structure manufacturing system creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.
  • FIG. 6 is a block diagram showing an example of the configuration of the structure manufacturing system 400 according to this embodiment.
  • the structure manufacturing system 400 includes the X-ray measurement apparatus 100, the design apparatus 410, the molding apparatus 420, the control system 430, and the repair apparatus 440 described in the embodiment.
  • the design device 410 performs a design process for creating design information related to the shape of the structure.
  • the design information is information indicating the coordinates of each position of the structure.
  • the design information is output to the molding apparatus 420 and a control system 430 described later.
  • the molding apparatus 420 performs a molding process for creating and molding a structure using the design information created by the design apparatus 410.
  • the molding apparatus 420 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.
  • the X-ray measurement apparatus 100 performs a measurement process for measuring the shape of the structure molded by the molding apparatus 420.
  • the X-ray apparatus 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of the structure, to the control system 430.
  • the control system 430 includes a coordinate storage unit 431 and an inspection unit 432.
  • the coordinate storage unit 431 stores design information created by the design apparatus 410 described above.
  • the inspection unit 432 determines whether the structure molded by the molding device 420 is molded according to the design information created by the design device 410. In other words, the inspection unit 432 determines whether or not the molded structure is a good product. In this case, the inspection unit 432 reads the design information stored in the coordinate storage unit 431 and performs an inspection process for comparing the design information with the shape information input from the X-ray measurement apparatus 100. The inspection unit 432 compares, for example, the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection processing, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection processing.
  • the inspection unit 432 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.
  • the inspection unit 432 outputs repair information indicating the defective portion and the repair amount to the repair device 440.
  • the defective part is the coordinate of the shape information that does not match the coordinate of the design information
  • the repair amount is the difference between the coordinate of the design information and the coordinate of the shape information in the defective part.
  • the repair device 440 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 440 performs again the same process as the molding process performed by the molding apparatus 420 in the repair process.
  • step S11 the design apparatus 410 creates design information related to the shape of the structure by the design process, and proceeds to step S12. Note that the present invention is not limited to only the design information created by the design apparatus 410, and the case where the design information is acquired by inputting the existing design information is also included in one aspect of the present invention.
  • step S12 the forming apparatus 420 creates and forms a structure based on the design information by the forming process, and proceeds to step S13.
  • step S13 the X-ray measurement apparatus 100 performs measurement processing, measures the shape of the structure, outputs shape information, and proceeds to step S14.
  • step S14 the inspection unit 432 performs an inspection process for comparing the design information created by the design apparatus 410 with the shape information measured and output by the X-ray measurement apparatus 100, and the process proceeds to step S15.
  • step S15 based on the result of the inspection process, the inspection unit 432 determines whether the structure formed by the forming apparatus 420 is a non-defective product. If the structure is a non-defective product, that is, if the coordinates of the design information coincide with the coordinates of the shape information, an affirmative determination is made in step S15 and the process ends.
  • step S15 If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S15 and the process proceeds to step S16.
  • step S16 the inspection unit 432 determines whether or not the defective portion of the structure can be repaired. If the defective part is not repairable, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective part exceeds the predetermined range, a negative determination is made in step S16 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S16 and the process proceeds to step S17. In this case, the inspection unit 432 outputs repair information to the repair device 440.
  • step S17 the repair device 440 performs a repair process on the structure based on the input repair information, and returns to step S3. As described above, the repair device 440 performs again the same processing as the molding processing performed by the molding device 420 in the repair processing.
  • the placement position guidance processing unit 51 calculates the placement position where the measurement object S should be placed on the placement table 30 based on the configuration information of the measurement object S. Specifically, the placement position guidance processing unit 51 extends the rotation center axis Yr or the rotation axis 301 of the placement table 30 along the Y axis, which is generated when the measurement object S is placed on the placement table 30. The position where the moment due to the weight generated at the position of the mounting table 30 is balanced is calculated as the mounting position with the position through which the extended line passes as a fulcrum.
  • the center-of-gravity calculation processing unit 511 calculates the center of gravity G1 of the measurement object S from the configuration information, and the positional relationship determination processing unit 514 calculates the placement position based on the calculated center of gravity G1. Therefore, prior to placing the measurement object S on the mounting table 30, the measurement object S is optimally placed on the mounting table 30, and distortion or the like is suppressed on the mounting table 30. The position can be determined. As a result, by placing the object S to be measured with the calculated placement position as a guide, generation of a false image due to distortion of the placement table 30 during the measurement by X-ray is suppressed and generated. Image quality of the projection data and the reconstructed image can be suppressed.
  • the centroid position calculation processing unit 513 calculates the position when the centroid G1 is projected on the contact surface D set by the contact surface determination processing unit 512 as the second centroid G2. Then, the positional relationship determination processing unit 514 substantially determines that the second center of gravity G2 and the position through which the rotation center axis Yr of the mounting table 30 passes are substantially based on the second center of gravity G2 and the position through which the rotation center axis Yr of the mounting table 30 passes.
  • the mounting position is calculated so as to coincide with each other.
  • the rotation center axis Yr of the mounting table 30 passes through the center of gravity G1 of the object to be measured S, and distortion or the like is generated on the mounting table 30.
  • An optimal placement position that can be suppressed can be obtained.
  • the measurement object S can be measured in a state in which the rotation center axis Yr is prevented from being tilted with respect to the Y axis, so that an error factor included in the reconstructed image obtained as a measurement result is suppressed. , Accurate measurement results can be obtained.
  • the display monitor 6 displays the positional relationship between the measurement object S and the index P in a state where the measurement object S is placed on the placement position of the placement table 30.
  • the display monitor 6 has the same image of the mounting surface 311 of the mounting table 30 as the image of the measurement object S in the state of being mounted at the mounting position of the mounting table 30 and the image of the index P. Display as an image. Therefore, since the user can place the object S to be placed on the placement position on the placement table 30 while checking the display monitor 6 and the index P, the work for placing the object S can be facilitated. Can be improved.
  • the positional relationship determination processing unit 514 positions the characteristic point C that is a part of the contour of the measurement object S when the measurement object S is placed at the placement position for each of the plurality of indices P. Calculate the relationship. Then, the display monitor 6 is closest to the feature point C and the feature point C based on the positional relationship between the feature point C of the measurement object S and the index P calculated by the positional relationship determination processing unit 514. The indicator P is displayed. Therefore, since the corner portion of the measurement object S to be used as a mark and the index P can be confirmed when placing at the placement position, the workability can be further improved.
  • the placement position guidance processing unit 51 uses design information (three-dimensional CAD data or the like) of the measurement object S as configuration information. Therefore, since it is based on accurate design data, the mounting position, which is a position for preventing the mounting table 30 from being distorted, is accurately calculated, which contributes to improvement in measurement accuracy.
  • the X-ray measurement apparatus 100 of the structure manufacturing system 400 performs measurement processing for acquiring shape information of the structure created by the molding apparatus 420 based on the design processing of the design apparatus 410, and inspects the control system 430.
  • the unit 432 performs an inspection process for comparing the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether or not a structure is a non-defective product created according to design information by inspecting the defect of the structure and information inside the structure by nondestructive inspection. Contribute to.
  • the repair device 440 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.
  • FIG. 8A shows an example where the index P is composed of a plurality of concentric circles.
  • the index P is composed of a plurality of concentric circles.
  • FIG. 8A illustrates a case where the intervals between the concentric circles are substantially constant.
  • the index P may be formed by a plurality of discrete points provided on a straight line orthogonal to each other. In this case, the index P is preferably formed by at least two points.
  • the intervals of the indicators P formed on the same line indicated by the broken lines are substantially constant. However, all the intervals are different or partly different. It is included in one embodiment of the present invention.
  • the index P shown in FIGS. 2 and 8 may be configured to be changeable according to the shape of the contact surface D of the object S to be measured.
  • a plurality of types of indices P shown in FIGS. 2 and 8 are printed on different sheets or the like, and the sheets may be exchanged according to the shape of the contact surface D of the object S to be measured. More preferably, it is configured to notify which sheet P should be used according to the shape of the contact surface D.
  • the X-ray measurement apparatus 100 includes an imaging device including an imaging element configured by a CCD, a CMOS, or the like.
  • the imaging device outputs an image signal generated by imaging the outer shape of the measurement object S to the first control device 5.
  • the placement position guidance processing unit 51 of the first control device 5 performs a known edge detection process or the like on the input image signal, and extracts the contour of the measurement object S on the image signal as contour information.
  • the center-of-gravity calculation processing unit 511, the contact surface determination processing unit 512, the center-of-gravity position calculation processing unit 513, and the positional relationship determination processing unit 514 use the extracted contour information as the configuration information regarding the appearance structure of the object S to be measured.
  • design information can be used as configuration information regarding the internal structure of the object S to be measured.
  • a photographed image is used as the appearance of the object to be measured S displayed in the work display area R1, and images indicating the feature points C1 and C2 extracted are superimposed and displayed on the photographed image. it can.
  • the contour information is not limited to that obtained by the imaging device.
  • the contour information is measured using a contact type or scanning laser probe using a touch probe or an optical non-contact type three-dimensional measuring device. Information obtained by measuring the measurement object S is also included in one embodiment of the present invention.
  • the display monitor 6 In place of the display monitor 6 indicating the position of the feature point of the object S to be measured together with the index as the placement position, the display monitor 6 is mounted using a projector provided on the ceiling portion (Y-axis + side inner wall surface) of the housing 1. You may show the mounting position of the to-be-measured object S by projecting an image on the mounting surface 311 of the mounting base 30. FIG. In this case, the projector may indicate the positions of the feature points C1 and C2 of the measurement object S on the placement surface 311 by projecting an index such as an arrow. Further, the projector may project an image of the measurement object S on the placement surface 311 reflecting the posture when the measurement object S is placed at the placement position.
  • the image of the object S to be measured may be an image based on the configuration information, or may be an image acquired by the imaging device.
  • the placement surface 311 may have a structure in which the index P is not provided.
  • the X-ray measurement apparatus 100 may include a manipulator device 90 that transfers the measurement object S onto the mounting surface 311 of the mounting table 30.
  • the manipulator device 90 is controlled by the manipulator control unit 52 of the first control device 5, so that the manipulator device 90 is placed on the mounting position of the mounting surface 311 that satisfies the positional relationship determined by the mounting position guidance processing unit 51.
  • the measurement object S is placed.
  • work efficiency is improved as compared with the case where the object to be measured S is manually placed on the placement position of the placement surface 311.
  • an XZ stage 312 is further provided on the mounting table 30, and the measured object S placed on the XZ stage 312 is moved to the position of the center of gravity of the measured object S and the rotation center axis Yr.
  • a configuration in which the position is moved to a position where the positions substantially coincide with each other is also included in one embodiment of the present invention.
  • the XZ stage 312 has a mechanism capable of moving the measurement object S to arbitrary positions in the X direction and the Z direction with respect to the rotation center axis Yr.
  • the XZ stage control unit 75 performs drive control of the XZ stage 312 to adjust the measured object S to be actually positioned at the mounting position of the measured object S calculated by the positional relationship determination processing unit 514.
  • a mechanism for detecting the position where the measurement object S is actually placed on the XZ stage 312 is further provided, and the position of the center of gravity of the measurement object S is determined using the position actually placed on the XZ stage 312.
  • the position on the XZ stage 312 may be detected.
  • the mechanism for detecting the position where the object to be measured S is actually placed is an imaging device arranged so that the placement table 30 is included in the imaging range from the ceiling portion (Y axis + side inner wall) of the housing 1.
  • it can be configured by a weight distribution detector or the like provided on the mounting surface of the XZ stage 312.
  • the second centroid G2 is not limited to the one calculated by setting the centroid G1 calculated by the centroid calculation processing unit 511 as the position projected on the contact surface D.
  • the placement position guidance processing unit 51 calculates the second center of gravity G2 as follows. First, the placement surface determination processing unit 512 determines the placement surface D as in the case of the embodiment. Then, the center-of-gravity position determination processing unit 513 selects a plurality of candidate points (hereinafter referred to as temporary centers of gravity) that can become the second center of gravity G2.
  • the center-of-gravity position determination processing unit 513 refers to, for example, the configuration information, calculates the center of gravity of the contact surface D from the contour shape of the contact surface D, and is concentric with the center of gravity of the contact surface D as the center. A plurality of points above are arbitrarily selected and set as a temporary center of gravity.
  • the center-of-gravity position determination processing unit 513 uses the configuration information of the measured object S to calculate the moment amount generated at each position of the measured object S when the temporary center of gravity is used as a fulcrum for each of the plurality of selected temporary centroids. To do. Then, the center-of-gravity position determination processing unit 513 compares the calculated moment amounts, and sets the temporary center of gravity corresponding to the smallest moment amount as the second center of gravity G2.
  • a light source such as an LED may be attached to the intersection of line segments ax and ay formed on the placement surface 311 shown in FIG.
  • the first control device 5 turns on the indicator P calculated by the positional relationship determination process, that is, the LED that coincides with or is close to the feature points C1 and C2 of the object S, and calculates the positional relationship. Can be notified to the user.
  • a display for display may be used as the mounting surface 311 and the calculated mounting position may be displayed on the display for display.
  • an imaging device including the placement surface 311 in the imaging range from the Y axis + side is provided.
  • the imaging device captures an image of a state in which the object to be measured S is placed on the placement surface 311 and outputs an image signal to the first control device 5.
  • the first control device 5 receives the image of the input image signal, the image displayed on the stage display region R2 of the display monitor 6 (the image indicating the contact surface D of the object S to be measured, and the image indicating the feature points C1 and C2.
  • the image showing the placement surface 311 on which the index P is formed is compared with the same image).
  • the first control device 5 determines that the object to be measured S is not placed at the placement position and gives a warning when the deviation exceeds a predetermined size.
  • the first control device 5 may display a message notifying that the object to be measured S is not placed at the placement position on the display monitor 6. It may be output as a voice message.
  • the measurement object S When the measurement object S is not placed on the placement position of the placement surface 311 and the rotation center axis Yr of the placement table 30 is tilted, the measurement object S is placed so that the rotation center axis Yr is along the Y axis.
  • What adjusts the inclination of the pedestal 30 is also included in one embodiment of the present invention.
  • a plurality of load cell and other gravity center position detectors for detecting the gravity center position of the mounting table 30 are provided on the mounting table 30, and the tilt and shift of the moving unit 36 are finely adjusted to adjust the position of the mounting table 30 together with the moving unit 36.
  • An adjustment mechanism for adjusting the inclination with respect to the XZ plane is provided in the moving unit 36.
  • the center-of-gravity position detector detects the weight applied to different positions of the mounting table 30 and outputs the detected weight to the first control device 5.
  • the first control device 5 operates the adjustment mechanism so that the plurality of input detection amounts become substantially uniform values.
  • the mounting table 30 on which the object to be measured S is mounted is moved in the X-axis, Y-axis, and Z-axis directions by the X-axis moving unit 33, the Y-axis moving unit 34, and the Z-axis moving unit 35. It is not limited to things.
  • the mounting table 30 does not move in the X-axis, Y-axis, and Z-axis directions, and the X-ray source 2 and the detector 4 are moved in the X-axis, Y-axis, and Z-axis directions, so that What relatively moves the radiation source 2 and the detector 4 is also included in one aspect of the present invention.
  • the feature point C may be configured to be designated by the user.
  • an edge or the like desired by the user may be designated by operating an operation member (not shown).
  • the contact surface determination processing unit 512 may set the corner portion designated by the user or a plurality of corner portions near the designated position as the feature point C. In this case, the contour of the contact surface D by the user and the index P in the vicinity of the feature point C specified by the user are displayed in the stage display region R2 of the display monitor 6.
  • the configuration information of the measurement object S and the X-ray source 2 are used.
  • the closest possible distance between the object to be measured S and the X-ray source 2 may be obtained from the relationship with the irradiation region of the X-rays reaching the detection device 4.
  • the installation position of the designated object to be measured S can also be acquired. Using this information and the position information of the rotation center axis Yr as necessary, the closest possible distance between the object S to be measured and the X-ray source 2 may be calculated by the setting unit 52 or the like.
  • the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

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Abstract

La présente invention concerne un dispositif à rayons X qui est pourvu : d'une source de rayons X qui irradie un objet à mesurer à l'aide d'un rayon X; un détecteur de rayons X qui acquiert une image de transmission des rayons X qui est passé à travers l'objet à mesurer; une monture qui est agencée entre la source de rayons X et le détecteur de rayons X et sur laquelle l'objet à mesurer est monté; et une unité de calcul qui calcule la position de montage à laquelle l'objet à mesurer devrait être monté sur la monture sur la base d'informations structurelles de l'objet à mesurer.
PCT/JP2014/058105 2014-03-24 2014-03-24 Dispositif à rayons x, dispositif de mesure à rayons x et procédé de production de structure WO2015145548A1 (fr)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306972A (ja) * 1992-04-30 1993-11-19 Toshiba Corp 断層撮影装置
JP2002310943A (ja) * 2001-04-12 2002-10-23 Toshiba It & Control Systems Corp コンピュータ断層撮影装置
JP2005050853A (ja) * 2003-07-29 2005-02-24 Hitachi Kasado Eng Co Ltd 板状試料重心位置想定方法及び装置
JP2005351879A (ja) * 2004-05-14 2005-12-22 Shimadzu Corp Ｘ線ｃｔ装置
JP2006189342A (ja) * 2005-01-06 2006-07-20 Shimadzu Corp Ｘ線ｃｔ装置
JP2007170921A (ja) * 2005-12-20 2007-07-05 Rigaku Corp Ｘ線ｃｔ装置
JP2008188279A (ja) * 2007-02-06 2008-08-21 Shimadzu Corp Ｘ線ｃｔ装置
JP2012112790A (ja) * 2010-11-24 2012-06-14 Shimadzu Corp Ｘ線ｃｔ装置
JP2013217797A (ja) * 2012-04-10 2013-10-24 Nikon Corp 装置、判定方法、及び構造物の製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306972A (ja) * 1992-04-30 1993-11-19 Toshiba Corp 断層撮影装置
JP2002310943A (ja) * 2001-04-12 2002-10-23 Toshiba It & Control Systems Corp コンピュータ断層撮影装置
JP2005050853A (ja) * 2003-07-29 2005-02-24 Hitachi Kasado Eng Co Ltd 板状試料重心位置想定方法及び装置
JP2005351879A (ja) * 2004-05-14 2005-12-22 Shimadzu Corp Ｘ線ｃｔ装置
JP2006189342A (ja) * 2005-01-06 2006-07-20 Shimadzu Corp Ｘ線ｃｔ装置
JP2007170921A (ja) * 2005-12-20 2007-07-05 Rigaku Corp Ｘ線ｃｔ装置
JP2008188279A (ja) * 2007-02-06 2008-08-21 Shimadzu Corp Ｘ線ｃｔ装置
JP2012112790A (ja) * 2010-11-24 2012-06-14 Shimadzu Corp Ｘ線ｃｔ装置
JP2013217797A (ja) * 2012-04-10 2013-10-24 Nikon Corp 装置、判定方法、及び構造物の製造方法

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