WO2015129236A1 - Corps moulé en résine et procédé de fabrication de celui-ci - Google Patents

Corps moulé en résine et procédé de fabrication de celui-ci Download PDF

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Publication number
WO2015129236A1
WO2015129236A1 PCT/JP2015/000855 JP2015000855W WO2015129236A1 WO 2015129236 A1 WO2015129236 A1 WO 2015129236A1 JP 2015000855 W JP2015000855 W JP 2015000855W WO 2015129236 A1 WO2015129236 A1 WO 2015129236A1
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WO
WIPO (PCT)
Prior art keywords
resin member
thermosetting resin
thermoplastic resin
sulfur
containing film
Prior art date
Application number
PCT/JP2015/000855
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English (en)
Japanese (ja)
Inventor
山川　裕之
龍介 泉
智之 原田
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株式会社デンソー
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Publication of WO2015129236A1 publication Critical patent/WO2015129236A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed

Definitions

  • the present disclosure relates to a resin molded body in which a part of the surface of a thermosetting resin member is sealed with a thermoplastic resin member, and the remainder of the surface of the thermosetting resin member is exposed from the thermoplastic resin member, and the It is related with the manufacturing method of such a resin molding.
  • thermosetting resin member made of a thermosetting resin that seals the sealed component
  • thermosetting resin member made of a thermosetting resin that seals the sealed component
  • thermosetting resin member seals the sealing surface which is a part of the surface of the thermosetting resin member, and exposes the exposed surface which is the remaining part of the surface.
  • thermosetting resin is preferable in terms of high adhesion and low stress to a sealed part, and a thermoplastic resin has advantages such as good dimensional accuracy and toughness of a molded product. It is something that was made use of.
  • an epoxy resin etc. are mentioned as a thermosetting resin
  • PPS polyphenylene sulfide
  • PBT polybutylene terephthalate
  • thermosetting resin material that is a raw material of the thermosetting resin member, and this is heated to complete the curing to form a thermosetting resin member, that is, primary molding. I do.
  • thermoplastic resin member A a thermoplastic resin material that is a raw material of the thermoplastic resin member A process, that is, secondary molding is performed.
  • a resin molded body is completed.
  • JP H10-170379 A JP 3620184 B2
  • thermosetting resin member since the adhesiveness of the thermoplastic resin to the thermosetting resin is poor, peeling is likely to occur at the interface between the thermosetting resin member and the thermoplastic resin member.
  • thermosetting resin member In this type of resin molded body, as described above, the sealing surface that is a part of the surface of the thermosetting resin member is sealed with the thermoplastic resin member, but the exposed surface that is the remainder of the surface. Is exposed from the thermoplastic resin member.
  • Patent Document 1 With respect to such peeling at the interface, in Patent Document 1, after the thermoplastic molding process, another filling material is applied to the end located at the boundary between the sealing surface and the exposed surface of the interface. By disposing, the end portion of the interface is covered, and peeling of the interface is prevented.
  • a filler material since it is necessary to use a filler material separately, improvement can be sought in terms of restrictions on the shape of the resin molded body and cost increase.
  • the present disclosure is intended to improve adhesion between a thermosetting resin member and a thermoplastic resin member in a resin molded body formed by sealing a part of the surface of the thermosetting resin member with a thermoplastic resin member. Objective.
  • thermosetting resin member made of a thermosetting resin and a thermoplastic that seals a sealing surface that is a part of the surface of the thermosetting resin member.
  • a thermoplastic resin member made of resin, and the exposed surface which is the remaining part of the surface of the thermosetting resin member is a method for producing a resin molded body exposed from the thermoplastic resin member, and further includes the following steps: Is provided.
  • thermosetting resin material that is the raw material of the thermosetting resin member is used, and the thermosetting resin member is heated to complete the curing, thereby forming the thermosetting resin member.
  • thermosetting resin member at the interface between the thermosetting resin member and the thermoplastic resin member that seals the sealing surface in the thermosetting resin member, a new surface from which contaminants on the sealing surface are removed is formed, On this new surface, chemical bonding between the thermosetting resin member and the thermoplastic resin member via the thiol group is realized. Therefore, according to this structure, the adhesiveness improvement of a thermosetting resin member and a thermoplastic resin member is realizable.
  • thermosetting resin member made of a thermosetting resin and a thermoplastic resin made of a thermoplastic resin that seals a sealing surface that is a part of the surface of the thermosetting resin member.
  • the exposed surface that is the remaining part of the surface of the thermosetting resin member is a resin molded body exposed from the thermoplastic resin member, and is at least one of the sealing surfaces in the thermosetting resin member.
  • the composition is different from the thermoplastic resin constituting the thermosetting resin member and the thermoplastic resin constituting the thermoplastic resin member, and contains a sulfur component.
  • the entire portion located immediately below the sulfur-containing film as the base of the sulfur-containing film in the sealing surface of the thermosetting resin member is a roughened surface roughened from the exposed surface. Yes.
  • the sulfur-containing film and the roughened surface serving as the base in the resin molded body are appropriately manufactured by the manufacturing method of the first example. Therefore, also by the 2nd example, the improvement of the adhesiveness of a thermosetting resin member and a thermoplastic resin member is realizable like a 1st example.
  • FIG. 2 is a process diagram showing a method for manufacturing the semiconductor device shown in FIG. Process drawing showing the manufacturing method following FIG. Process drawing showing the manufacturing method following FIG. Process drawing showing the manufacturing method following FIG. Process drawing showing the manufacturing method following FIG.
  • External view which shows the principal part of the semiconductor device as a resin molding concerning 2nd Embodiment of this indication
  • This resin molded body is mounted on a vehicle such as an automobile, and is applied as a semiconductor device for driving various electronic devices for the vehicle.
  • the semiconductor device as the resin molded body of the present embodiment is roughly configured to include a thermosetting resin member 10 and a thermoplastic resin member 20 that seals a part of the surface of the thermosetting resin member 10. Yes.
  • the thermosetting resin member 10 is made of a thermosetting resin such as an epoxy resin, and a filler made of an insulating material such as silica or alumina may be contained in the resin as necessary. Such a thermosetting resin member 10 is formed by performing transfer molding, compression molding, molding by a potting method, and thermosetting treatment.
  • the thermoplastic resin member 20 is made of a thermoplastic resin such as PPS (polyphenylene sulfide) or PBT (polyphenylene terephthalate), and injection molding is performed so as to seal a part of the thermosetting resin member 10. Is formed.
  • PPS polyphenylene sulfide
  • PBT polyphenylene terephthalate
  • thermoplastic resin member 20 seals a part of the surface of the thermosetting resin member 10, so that a part of the surface of the thermosetting resin member 10 is sealed by the thermoplastic resin member 20.
  • the surface 11 is used. And the remainder which is parts other than the sealing surface 11 among the surfaces of the thermosetting resin member 10 is the exposed surface 12 exposed from the thermoplastic resin member 20.
  • thermosetting resin member 10 is configured to have a rectangular parallelepiped block shape. A part of the surface of the thermosetting resin member 10 on the one end 10a side in the longitudinal direction of the thermosetting resin member 10 is used as a sealing surface 11, and the thermosetting resin on the other end 10b side in the longitudinal direction. The remainder of the surface of the member is an exposed surface 12.
  • thermosetting resin member 10 shown in FIGS. 1 and 2 has a rectangular parallelepiped shape having one end surface in the longitudinal direction, the other end surface facing the one end surface, and four side surfaces extending in the longitudinal direction. I am doing.
  • the sealing surface 11 of the thermosetting resin member 10 is a portion on the one end 10a side in the longitudinal direction among the one end surface in the longitudinal direction and the four side surfaces.
  • the exposed surface 12 is the other end surface in the longitudinal direction and a portion on the other end 10b side in the longitudinal direction among the four side surfaces.
  • thermosetting resin member 10 includes therein a semiconductor element 30 as a first sealed component sealed by the thermosetting resin member 10 and an electrical connection member 40 as a second sealed component. Have.
  • the semiconductor element 30 as the first sealed component is a sensor chip made of a silicon semiconductor or the like used for a magnetic sensor, an optical sensor, a pressure sensor, or the like. Such a semiconductor element 30 is formed by a normal semiconductor process.
  • the entire semiconductor element 30 is sealed with the thermosetting resin member 10, and the semiconductor element 30 detects external magnetism via the thermosetting resin member 10. Like to do.
  • an opening for opening a part of the semiconductor element 30 is formed in the thermosetting resin member 10, and the semiconductor element 30 is interposed through the opening. It detects light and pressure.
  • the electrical connection member 40 as the second sealed component is for electrically connecting the semiconductor element 30 and a wiring member (not shown) outside the semiconductor device.
  • a part 41 of the electrical connection member 40 is covered with the thermosetting resin member 10, and the remaining part 42 protrudes from the sealing surface 11 of the thermosetting resin member 10. Further, the remaining part 42 of the electrical connection member 40 is sealed by the thermoplastic resin member 20 outside the thermosetting resin member 10.
  • connection method with this semiconductor element 30 is not specifically limited, Here, it connects with the bonding wires 50, such as Al and Au.
  • thermoplastic resin member 20 seals the remaining part 42 of the electrical connection member 40, but the thermoplastic resin member 20 has an opening 21. In the opening 21, a part of the remaining portion 42 of the electrical connection member 40 is exposed to the outside of the thermoplastic resin member 20.
  • the opening 21 of the thermoplastic resin member 20 is a portion to which an external wiring member (not shown) such as a connector member is inserted and connected, whereby the external wiring member and the electrical connection member 40 are connected to each other. It is designed to be electrically connected.
  • the electrical connection member 40 functions as a device for detecting and outputting the semiconductor element 30, and the semiconductor element 30 can be electrically exchanged with the outside of the apparatus via the electrical connection member 40.
  • a terminal terminal made of a rod-shaped member such as Cu or Al is used as such an electrical connection member 40, but a circuit board or the like may be used as the electrical connection member 40.
  • a sulfur-containing film 60 containing a sulfur (S) component is interposed between a part of the sealing surface 11 of the thermosetting resin member 10 and the thermoplastic resin member 20.
  • the sulfur-containing film 60 contains a sulfur atom or a sulfur compound, and has a composition different from that of the thermosetting resin constituting the thermosetting resin member 10 and the thermoplastic resin constituting the thermoplastic resin member 20. It becomes more.
  • the entire part is a roughened roughened surface 11a.
  • the roughening degree of the roughened surface 11a is larger than that of the sealing surface 11 and the exposed surface 12 other than the roughened surface 11a.
  • the sulfur-containing film 60 is formed by a chemical reaction between a thiol group and a thermoplastic resin in a thiol group forming step and a plastic molding step in the manufacturing method described later.
  • the thickness of the sulfur-containing film 60 is about several nm.
  • the roughened surface 11a is formed by a surface layer removing step in the manufacturing method described later, and the surface roughness Ra of the roughened surface 11a is several ⁇ m or more (for example, 3 ⁇ m or more).
  • the sealing surface 11 and the exposed surface 12 other than the roughened surface 11a correspond to surfaces on which a surface layer 13 (see FIG. 3) described later exists.
  • the surface roughness Ra is an arithmetic average roughness Ra defined in JIS (abbreviation of Japanese Industrial Standards).
  • the uneven shape of the roughened surface 11a contains sulfur as shown in FIG. The shape is inherited by the membrane 60.
  • the remaining portion 42 of the electrical connection member 40 that is the second sealed component protrudes from the sealing surface 11 of the thermosetting resin member 10 and is sealed by the thermoplastic resin member 20. .
  • the sulfur-containing film 60 is around the remaining portion 42 of the electrical connection member 40. It is provided so as to form a continuous ring shape. At this time, the arrangement pattern of the roughened surface 11a has a similar closed ring shape.
  • the remaining part 42 of the electrical connection member 40 protrudes from the one end surface of the rectangular parallelepiped thermosetting resin member 10.
  • the arrangement pattern of the sulfur-containing film 60 and the roughened surface 11a is a closed ring pattern continuous over the four side surfaces of the rectangular parallelepiped thermosetting resin member 10.
  • FIG. 1 shows, the sulfur containing film
  • the roughened surface 11a is a surface from which the surface layer 13 of the sealing surface 11 is removed, and the film thickness of the sulfur-containing film 60 is as small as nanometer order.
  • the step 11b having the end of the sulfur-containing film 60 as a boundary is formed so that the part on the exposed surface 12 on the sulfur-containing film 60 side is recessed from the part outside the end of the sulfur-containing film 60. Yes.
  • the height of the step 11b is several ⁇ m or more (for example, 5 ⁇ m or more).
  • thermosetting resin material that is a raw material of the thermosetting resin member 10 is used, and the thermosetting resin material is heated to complete the curing.
  • the member 10 is formed.
  • thermosetting resin member 10 is completed.
  • the surface layer 13 made of contaminants exists on the outermost surface of the thermosetting resin member 10 formed in this curing mold process.
  • the contaminant is, for example, a release agent or a foreign matter attached to the surface of the thermosetting resin member 10 during the process.
  • the mold release agent is provided on the mold surface or mixed with the thermosetting resin material itself in order to ensure mold release in the molding, and is made of, for example, siloxane or fatty acid.
  • thermosetting resin member 10 a surface layer removing process is performed on the thermosetting resin member 10.
  • a part of the sealing surface 11 in the thermosetting resin member 10, that is, a portion of the sealing surface 11 where the sulfur-containing film 60 is formed is removed by removing the surface layer 13 located on the outermost surface. This part is defined as a new surface 14.
  • the surface layer 13 is removed by using a technique such as laser irradiation, shot blasting, and polishing on the portion of the sealing surface 11 where the sulfur-containing film 60 is to be formed.
  • a technique such as laser irradiation, shot blasting, and polishing on the portion of the sealing surface 11 where the sulfur-containing film 60 is to be formed.
  • the processing surface is cut to form irregularities, and laser irradiation is the most desirable method.
  • the surface layer 13 as a contaminant is removed, and the new surface 14 as a base of the surface layer 13 is roughened.
  • the new surface 14 is provided with a roughened surface 11a to which an anchor effect is imparted and which has excellent adhesion to the thermoplastic resin member 20.
  • On the new surface 14 as the roughened surface 11 a there are hydroxyl groups, epoxy groups, and the like in the thermosetting resin constituting the thermosetting resin member 10.
  • a thiol group forming step shown in FIG. 5 is performed.
  • the new surface 14 of the thermosetting resin member 10 is chemically treated to form a thiol group (—SH) on the new surface 14 that is chemically bonded to the thermoplastic resin constituting the thermoplastic resin member 20.
  • the thiol group is indicated by SH.
  • TES is an abbreviation for 6- (3- (triethoxysilyl) propylamino) -1,3,5-triazine-2,4-dithiol monosodium.
  • thermosetting resin member 10 on which the new surface 14 is formed is immersed in a water / ethanol solution of TES, it is taken out from the TES solution and heated, and this is washed with ethanol or the like. Residues such as non-reactants are removed.
  • H in the hydroxyl group present on the new surface 14 of the thermosetting resin member 10 is replaced with a functional group containing a thiol group (for example, a functional group containing a compound in which a thiol group is bonded to triazine).
  • a functional group containing a thiol group for example, a functional group containing a compound in which a thiol group is bonded to triazine.
  • the corona discharge treatment is performed on the new surface 14 of the thermosetting resin member 10 in order to make the new surface 14 have many hydroxyl groups for forming thiol groups before being immersed in the TES solution. It is desirable to apply.
  • thermoplastic resin material that is a raw material of the thermoplastic resin member 20 is injection-molded on the new surface 14 of the thermosetting resin member 10 on which the thiol group is formed.
  • the sealing surface 11 in the thermosetting resin member 10 is sealed with the thermoplastic resin member 20 while the thiol group and the thermoplastic resin material are chemically bonded.
  • thermoplastic resin member 20 is PPS
  • sulfur atoms in the PPS react with thiol groups on the new surface 14 to form a covalent bond.
  • each process after said surface layer formation process processes selectively with respect to a part of surface of the thermosetting resin member 10, masking etc. are suitably performed on the surface which does not process. After applying, each step is performed.
  • the semiconductor device of this embodiment in which the sulfur-containing film 60 is formed on the new surface 14 by this chemical bond is completed. Therefore, according to the present embodiment, it is possible to improve the adhesion between the thermosetting resin member 10 and the thermoplastic resin member 20.
  • thermoplastic resin member 20 in the sealing form of the thermoplastic resin member 20 like this embodiment, it is located in the boundary of the sealing surface 11 and the exposed surface 12 among the interfaces of the thermosetting resin member 10 and the thermoplastic resin member 20. Intruding substances such as external moisture and contaminants may enter the apparatus along the interface from the end portion. In particular, in the case of an in-vehicle semiconductor device like this embodiment, there is a risk that contaminants such as moisture and oil existing in the use environment may enter.
  • sulfur in the sealing surface 11 of the thermosetting resin member 10 is located between the exposed surface 12 and the remaining portion 42 of the electrical connection member 40 protruding from the sealing surface 11.
  • the containing film 60 and the roughened surface 11a are provided so as to form the closed ring shape.
  • this closed ring-shaped part becomes a part where peeling is prevented by the effect of the sulfur-containing film 60 and the roughened surface 11a as described above. Therefore, according to the present embodiment, it is possible to prevent the intruding substance from reaching the remaining portion 42 of the electrical connection member 40 from the exposed surface 12 side through the interface between the two resin members 10 and 20 as much as possible.
  • FIGS. 7 to 9 are merely examples showing the effect of improving the adhesion, and the effect is not limited to this.
  • thermosetting resin corresponding to the thermosetting resin member 10 a rectangular plate-shaped test made of a thermoplastic resin corresponding to the thermoplastic resin member 20 are used. Based on the said manufacturing method, the resin molding was produced so that it might be in the state by which the piece was bonded together. And the shear strength (unit: MPa) of the bonding part of these both test pieces is measured.
  • step P1 corresponds to a surface layer removing step by laser irradiation
  • step P2 corresponds to a thiol group forming step by TES treatment.
  • P1 only in FIG. 7 corresponds to the case where the plastic molding process is performed without performing the process P2 after performing the process P1.
  • “Only P2” corresponds to the case where the plastic molding process is performed after the process P2 is performed without performing the process P1.
  • “P1 + P2” corresponds to the case where the plastic molding process is performed after the processes P1 and P2 are performed as in the manufacturing method of the present embodiment.
  • FIG. 8 and FIG. 9 respectively show the surface roughness Ra of the roughened surface 11a when laser irradiation, shot blasting, and polishing (manual polishing by hand) are used as the methods used in the surface layer removing step.
  • the relationship between (unit: ⁇ m) and shear strength and the relationship between processing depth Z (unit: ⁇ m) and shear strength are investigated. This processing depth Z corresponds to the height of the step 11b.
  • the surface layer 13 was removed by scanning the surface of the laser, and in shot blasting, the surface layer 13 was removed by spraying alundum (alumina powder # 220) on the surface. In the polishing, the surface layer 13 was removed by manual polishing with abrasive paper (# 220).
  • the adhesion is in the order of laser irradiation> shot blast> polishing.
  • the method is not limited as long as the surface layer 13 can be removed, but laser irradiation is preferable if high adhesion strength is required. In this case, it is needless to say that shot blasting and polishing can be employed as long as surface roughness Ra and processing depth Z equivalent to laser irradiation can be realized.
  • the principal part of the semiconductor device as a resin molded body according to the second embodiment of the present disclosure will be described with reference to FIG.
  • the present embodiment is different from the first embodiment in that the arrangement pattern of the sulfur-containing film 60 and the roughened surface 11a in the thermosetting resin member 10 is modified.
  • the difference is as follows. It will be described in the center.
  • the arrangement pattern of the sulfur-containing film 60 and the roughened surface 11 a is a closed pattern that extends continuously over the four side surfaces of the rectangular parallelepiped thermosetting resin member 10. It was a ring pattern.
  • the sulfur-containing film 60 and the roughened surface 11 a are arranged only on the end face on the one end 10 a side, that is, on one end face of the rectangular parallelepiped thermosetting resin member 10. Has been.
  • the arrangement pattern of the sulfur-containing film 60 and the roughened surface 11a has a closed ring shape surrounding the remaining portion 42 of the electrical connection member 40 protruding from the one end surface which is the sealing surface 11.
  • the effect of the closed ring pattern is exhibited as in the first embodiment.
  • the sulfur-containing film 60 and the roughened surface 11 a immediately below it are formed on the sealing surface 11 of the thermosetting resin member 10. Although provided in part, it may be provided on the entire sealing surface 11. In other words, the sulfur-containing film 60 and the roughened surface 11a directly below it may be provided on at least a part of the sealing surface 11.
  • the sulfur-containing film 60 and the roughened surface 11 a may be formed up to the exposed surface 12 in addition to the sealing surface 11. Furthermore, the sulfur-containing film 60 and the roughened surface 11 a may be formed on the entire surface of the thermosetting resin member 10.
  • the continuous closed ring arrangement pattern as mentioned above is preferable, but in addition to that, the sulfur containing film
  • the surface 11 a may be arranged in an island shape with respect to the sealing surface 11.
  • the sulfur-containing film 60 and the roughened surface 11 a are formed continuously beyond the sealing surface 11 in the thermosetting resin member 10 to a part of the exposed surface 12. Is exposed from the thermoplastic resin member 20 and is visible.
  • the sulfur-containing film 60 and the roughened surface 11a may of course be provided within the range of the sealing surface 11. In this case, the step 11b It is sealed with the plastic resin member 20.
  • first sealed component and the second sealed component may be anything as long as they can be sealed with the thermosetting resin member 10, and the semiconductor element 30 and the electrical connection member described above. It is not limited to 40 or a circuit board.
  • thermosetting resin member 10 is not limited to the above-mentioned rectangular parallelepiped shape, and may be spherical or other indefinite shape.
  • the thermoplastic resin member 20 may be sealed as long as a part of the surface of the thermosetting resin member 10 is sealed and the remaining part is exposed.
  • the one end 10a side is not limited to the sealing surface 11 and the other end 10b side is an exposed surface.
  • the resin molding was a semiconductor device, and the to-be-sealed part sealed with the thermosetting resin member 10 was provided in the thermosetting resin member 10 inside.
  • the resin molded body is not limited to such a semiconductor device.
  • the thermosetting resin member 10 may have a configuration without a sealed component.
  • the present disclosure is not limited to the above-described embodiment, and can be appropriately changed within the scope described in the claims.
  • the above embodiments are not irrelevant to each other, and can be combined as appropriate unless the combination is clearly impossible, and the above embodiments are not limited to the illustrated examples. Absent.
  • elements constituting the embodiment are not necessarily essential unless explicitly stated as essential and clearly considered essential in principle. Yes.
  • numerical values such as the number, numerical value, quantity, range, etc. of the constituent elements of the embodiment are mentioned, it is clearly limited to a specific number when clearly indicated as essential and in principle. The number is not limited to the specific number except for the case.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Un élément de résine thermodurcissable (10) est formé par chauffage et durcissement complet d'un matériau de type résine thermodurcissable. Au niveau d'une face d'étanchéité (11) qui est une portion d'une surface de l'élément de résine thermodurcissable, une couche de surface (13) qui est située au niveau de la surface la plus externe de l'élément de résine thermodurcissable est éliminée pour faire de la face d'étanchéité une face neuve (14). Par traitement chimique de la face neuve, un groupement thiol (-SH) est formé et se lie chimiquement à une résine thermoplastique qui constitue un élément de résine thermoplastique (20). Ensuite, un matériau de type résine thermoplastique est moulé par injection sur la face neuve de l'élément de résine thermodurcissable sur lequel est formé le groupement thiol. Ainsi, tandis que le groupement thiol et l'élément de résine thermodurcissable se lient chimiquement, la face d'étanchéité de l'élément de résine thermodurcissable est scellée par l'élément de résine thermoplastique.
PCT/JP2015/000855 2014-02-26 2015-02-23 Corps moulé en résine et procédé de fabrication de celui-ci WO2015129236A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017128092A (ja) * 2016-01-22 2017-07-27 株式会社デンソー 樹脂成形体
US10395947B2 (en) 2014-02-27 2019-08-27 Denso Corporation Manufacturing method of a resin molded article

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6497301B2 (ja) * 2015-11-17 2019-04-10 株式会社デンソー 樹脂成形体の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002186129A (ja) * 2000-12-15 2002-06-28 Auto Network Gijutsu Kenkyusho:Kk 電線用モールドハウジングの製造方法及び電線用モールドハウジング
JP2002326220A (ja) * 2001-04-27 2002-11-12 Toppan Printing Co Ltd 二層プリフォームの製造方法
JP2002329815A (ja) * 2001-05-01 2002-11-15 Sony Corp 半導体装置と、その製造方法、及びその製造装置
WO2009154083A1 (fr) * 2008-06-16 2009-12-23 株式会社いおう化学研究所 Corps laminé et carte de câblage de circuits
WO2014013697A1 (fr) * 2012-07-16 2014-01-23 株式会社デンソー Dispositif électronique et son procédé de fabrication

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264686A (ja) * 1995-03-22 1996-10-11 Hitachi Ltd 樹脂封止型半導体装置及びその製造方法
JP2013191690A (ja) * 2012-03-13 2013-09-26 Shin Etsu Chem Co Ltd 半導体装置及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002186129A (ja) * 2000-12-15 2002-06-28 Auto Network Gijutsu Kenkyusho:Kk 電線用モールドハウジングの製造方法及び電線用モールドハウジング
JP2002326220A (ja) * 2001-04-27 2002-11-12 Toppan Printing Co Ltd 二層プリフォームの製造方法
JP2002329815A (ja) * 2001-05-01 2002-11-15 Sony Corp 半導体装置と、その製造方法、及びその製造装置
WO2009154083A1 (fr) * 2008-06-16 2009-12-23 株式会社いおう化学研究所 Corps laminé et carte de câblage de circuits
WO2014013697A1 (fr) * 2012-07-16 2014-01-23 株式会社デンソー Dispositif électronique et son procédé de fabrication

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10395947B2 (en) 2014-02-27 2019-08-27 Denso Corporation Manufacturing method of a resin molded article
JP2017128092A (ja) * 2016-01-22 2017-07-27 株式会社デンソー 樹脂成形体
WO2017126347A1 (fr) * 2016-01-22 2017-07-27 株式会社デンソー Corps moulé en résine
CN108367500A (zh) * 2016-01-22 2018-08-03 株式会社电装 树脂成型体
CN108367500B (zh) * 2016-01-22 2020-06-09 株式会社电装 树脂成型体

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