WO2015126176A1 - Film d'encapsulation, et dispositif électronique organique le comprenant - Google Patents

Film d'encapsulation, et dispositif électronique organique le comprenant Download PDF

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Publication number
WO2015126176A1
WO2015126176A1 PCT/KR2015/001659 KR2015001659W WO2015126176A1 WO 2015126176 A1 WO2015126176 A1 WO 2015126176A1 KR 2015001659 W KR2015001659 W KR 2015001659W WO 2015126176 A1 WO2015126176 A1 WO 2015126176A1
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WIPO (PCT)
Prior art keywords
resin
encapsulation film
film
layer
electronic device
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PCT/KR2015/001659
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English (en)
Korean (ko)
Inventor
최반석
유현지
김현석
이승민
문정옥
양세우
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020140071989A external-priority patent/KR20150097359A/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to US15/116,167 priority Critical patent/US10096797B2/en
Priority to JP2016551160A priority patent/JP6685913B2/ja
Priority to CN201580009337.1A priority patent/CN106030846B/zh
Priority to EP15752523.9A priority patent/EP3109918B1/fr
Publication of WO2015126176A1 publication Critical patent/WO2015126176A1/fr
Priority to US16/119,600 priority patent/US10181577B1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers

Definitions

  • the present invention relates to an encapsulation film, an organic electronic device including the same, and a manufacturing method of the organic electronic device.
  • An organic electronic device refers to a device including an organic material layer that generates an exchange of electric charge using holes and electrons.
  • organic electronic devices include photovoltaic devices, rectifiers, transmitters, and organic light emitting diodes (OLEDs).
  • an organic light emitting diode has a low power consumption, a fast response speed, and is advantageous in thinning a display device or an illumination light as compared with a conventional light source.
  • OLEDs are also expected to be applied in a variety of fields across a variety of portable devices, monitors, notebooks and TVs due to their excellent space utilization.
  • the main problem is durability.
  • Organic materials and metal electrodes included in the OLED are very easily oxidized by external factors such as moisture.
  • the portion where the wiring is deposited and the portion other than the portion is deposited in the peripheral portion of the display.
  • the non-deposited portion may be reflected or scattered by the light inside or outside, which causes a problem of appearance defects that appear to be bright when viewed from the outside.
  • the present invention not only realizes excellent moisture blocking properties, but also absorbs and blocks light inside or outside to prevent reflection or scattering of light, thereby preventing an appearance defect of the organic electronic device, and an organic film including the same.
  • the present invention relates to a film for encapsulating an organic electronic device.
  • the encapsulation film of the present invention can be applied to encapsulating or encapsulating the entire area of an organic electronic device such as, for example, an OLED.
  • the encapsulation film can include a light absorbing region.
  • the light absorbing region may contain an encapsulating resin and a light absorbing material.
  • the light absorption region may mean a region having a surface resistance of 10 11 ⁇ / cm 2 or more in the encapsulation film.
  • the encapsulation film may include a light absorbing layer and a moisture barrier layer containing an encapsulating resin and a light absorbing material and including an light absorbing region having a surface resistance of 10 11 ⁇ / cm 2 or more.
  • the present invention also relates to an organic electronic device including a substrate, an organic electronic device existing on the substrate, and an encapsulation film having the light absorption region attached to the front surface of the organic electronic device.
  • the light absorbing region may mean a region including a light absorbing material in a thickness direction. That is, in this case, some regions of the moisture barrier layer may be defined as light absorbing regions together with some regions of the light absorbing layer.
  • organic electronic device means an article or device having an element including an organic material layer that generates an exchange of electric charge using holes and electrons between a pair of electrodes facing each other, for example
  • the photovoltaic device, a rectifier, a transmitter, and an organic light emitting diode (OLED) may be mentioned, but is not limited thereto.
  • the organic electronic device may be an OLED.
  • the term “absorption layer” or “moisture prevention layer” may mean an adhesive layer, an adhesive layer, or an adhesive layer forming a sealing film. Therefore, if necessary, the encapsulation film and the light absorbing layer and / or the moisture barrier may be used in the same sense.
  • the term adhesive layer is maintained at a solid or semi-solid at room temperature, and when heated, flow is generated to attach the adherend without bubbles, and after solidification, the object is attached with an adhesive. It means the adhesive layer of the form that can be fixed firmly.
  • the term “absorption layer” means a layer including the light absorption region described above.
  • the "moisture barrier layer” has a water vapor transmission rate (WVTR) of 50 g / m 2 ⁇ day or less, preferably 30 g / m 2 ⁇ day or less, more preferably 20 g / m 2 ⁇ day or less, more preferably 15 g / m 2 ⁇ day or less.
  • WVTR water vapor transmission rate
  • the moisture permeability is crosslinked or cured the encapsulating resin described later, the crosslinked product or cured product to a film shape of 80 ⁇ m thick, and then the crosslinked material or cured product under 38 ° C. and 100% relative humidity. It is the moisture permeability measured about the direction. In addition, the moisture permeability is measured according to ASTM F1249.
  • the moisture barrier layer may include an encapsulation resin, and may further include a moisture adsorbent.
  • the components constituting the moisture barrier layer such as the encapsulating resin or the moisture absorbent may be the same as or different from the components constituting the light absorbing layer.
  • the term "sealing composition” means a component constituting the light absorbing layer or the moisture barrier of the sealing film.
  • the encapsulation composition can include encapsulating resin, light absorbing material, moisture adsorbent or other additives.
  • the light absorbing layer and the moisture preventing layer of the encapsulation film may be the same as or different from each other in the composition of the encapsulation composition, for example, the encapsulating resin, the moisture absorbent, other additives, or fillers, except for the light absorbing material.
  • the description regarding the sealing composition described later corresponds to both the light absorbing layer and the moisture barrier of the sealing film, unless otherwise specified.
  • the structure of the encapsulation film is not particularly limited.
  • the encapsulation film may have a single layer or a multilayer structure of two or more.
  • the encapsulation film when it has a single layer structure, it may include the light absorbing layer described above, and when the encapsulation film has a multilayer structure of two or more, it may include a light absorbing layer and a moisture barrier layer.
  • an exemplary encapsulation film 1 may include a light absorbing layer 2.
  • the encapsulation film 1 may have two or more multilayer structures, in which case the encapsulation film 1 may include at least one light absorbing layer 2.
  • the light absorbing layer 2 may be included.
  • the light absorbing layer includes a light absorbing material (3), or as shown in (b), the light absorbing layer includes a light absorbing material (3) and a moisture absorbent ( 5) may be included.
  • the light absorbing layer 2 and the moisture barrier layer 4 may be included.
  • the lamination order of the light absorbing layer and the moisture barrier layer is not particularly limited.
  • the moisture barrier layer may have a multilayer structure.
  • the light absorbing layer may be disposed between the two or more moisture barrier layers, or may be formed on one or both sides of a structure in which two or more moisture barrier layers are stacked.
  • the encapsulation film may include two or more light absorbing layers.
  • the light absorbing layer may be two layers stacked in succession, and may be configured to include a moisture barrier layer between the two light absorbing layers.
  • the encapsulation film may contain an encapsulation resin and a light absorbing material as described above, and may include an light absorbing region having a surface resistance of 10 11 ⁇ / cm 2 or more.
  • the non-absorbing region, which is a region other than the light absorbing region, in the encapsulation film may be composed of the same components as those constituting the light absorbing region, except that the light absorbing material is not included.
  • a portion where a wiring is deposited and a portion that is not on the side of the display are distinguished. Accordingly, external light may be reflected or scattered at the non-deposited portion.
  • the light absorbing region of the encapsulation film serves to block and absorb the reflected or scattered light.
  • the portion where the light absorbing region is formed in the encapsulation film is not particularly limited.
  • the light absorbing region may be formed at at least one peripheral portion of the encapsulation film.
  • the term "peripheral part" means a peripheral edge portion. That is, the periphery of the film in the above may mean a peripheral portion of the film.
  • the light absorption region may be formed over the entire area of the encapsulation film. That is, when the encapsulation film is observed in a plan view, the surface resistance of the encapsulation film may be 10 11 ⁇ / cm 2 or more, or at least one peripheral portion thereof may have a surface resistance of 10 11 ⁇ / cm 2 or more.
  • the surface resistance when the film is formed of a single layer, the surface resistance may be the surface resistance measured for the light absorbing region of the single layer.
  • the film when the film is formed in a multi-layer structure, it may be a surface resistance measured in a multi-layer laminated structure including at least one light absorbing layer and / or at least one moisture barrier layer.
  • the light absorbing region described above may include a light absorbing material, and may mean a region having a surface resistance of 10 11 ⁇ / cm 2 or more measured on a surface of the encapsulation film in contact with the organic electronic device.
  • the upper limit of the surface resistance of the encapsulation film according to the present invention is not particularly limited, but may be, for example, 10 18 ⁇ / cm 2 .
  • the surface resistance may be, for example, 10 11 ⁇ / cm 2 or more, 10 12 ⁇ / cm 2 or more, 10 13 ⁇ / cm 2 or more, 10 14 ⁇ / cm 2 or more, or 10 15 ⁇ / cm 2 or more.
  • the conductivity of the encapsulation film may be adjusted to an appropriate range.
  • the conductivity of the encapsulation film it can be controlled by measuring the surface resistance.
  • the measurement of the surface resistance can be measured by conventional methods in the art.
  • the surface resistance in the present invention can be measured according to standard test methods with MITSUBISHI CHEMICAL CORPORATION, MCP-HT450 surface resistance meter.
  • the measurement of the surface resistance measured the surface resistance of the light absorbing region of the encapsulation film from which the release film was removed, and the surface resistance value after applying a voltage of 500 V for 1 minute under 23 ° C. and 50% RH environment. Measured.
  • 5 to 8 show a plan view of the encapsulation film of the present invention.
  • the encapsulation film may have a light absorption region formed over the entire area of the encapsulation film, as shown in FIG. 5, but is not limited thereto. That is, when the encapsulation film is observed in a plan view, light absorbing regions may be formed in at least one peripheral portion as shown in FIGS. 6 to 8. That is, when the area including the light absorbing material in the encapsulation film 1 is called the light absorbing area or the first area 10, and the area not including the light absorbing material is called the non-light absorbing area or the second area 11, The encapsulation film may have a total area of the first region 10. In addition, only one peripheral portion of the encapsulation film 1 may be the first region 10. That is, as shown in FIG.
  • first region 10 only one peripheral portion of the four peripheral portions may be the first region 10 and the remaining portion may be the second region 11.
  • all four peripheral portions may be the first region 10.
  • the thickness of each peripheral portion can be appropriately adjusted according to the field and application examples in which the skilled person applies the encapsulation film.
  • the term first region 10 may be used as the same meaning as the light absorbing region described above.
  • the encapsulation film may exhibit a haze of 40% to 90%, 55% to 85%, or 60% to 80%.
  • the measurement of the haze can be measured by a conventional method in the art, in the case of a single layer can be measured for the entire area of the film of a single layer, in the case of a multi-layer can be measured for the entire area of the film laminated in a multilayer.
  • haze can be measured using a haze meter according to JIS K7105 standard test method.
  • a person skilled in the art can control the haze value in an appropriate range depending on the intended use of the sealing film.
  • haze value can be controlled in the above-mentioned specific range by the method of adjusting content or particle diameter of a water
  • the haze value By controlling the haze value to be maintained at 40% or more, it can be seen that the moisture absorbent does not react with moisture in the air during the film manufacturing process and maintains moisture barrier performance. That is, the haze value may be used as a numerical value that can evaluate the moisture barrier performance of the film.
  • the light absorption region of the encapsulation film may have a light transmittance of 15% or less with respect to the visible light region.
  • the light transmittance may be a light transmittance of the visible light region measured in the thickness direction of the light absorbing region in the single layer when the film is formed of a single layer.
  • the film when the film is formed in a multi-layer structure, it may be a light transmittance measured in a multi-layer laminated structure including at least one light absorbing layer and / or at least one moisture barrier layer.
  • the light absorption region described above may mean a region having a light transmittance of 15% or less in the thickness direction of the film of the laminated structure when the encapsulation film according to the present invention is observed in a plan view.
  • the lower limit of the light transmittance in the visible light region according to the present invention is not particularly limited and may be 0%.
  • the light transmittance is, for example, 0.2 to 15%, 0.5% to 15%, 1% to 15%. 1% to 14%, 1% to 13%, 2% to 12%, 3% to 11%, or 3% to 10%.
  • a portion in which wiring is deposited and a portion other than the portion are deposited on the side of the display.
  • the encapsulation film serves to block and absorb the reflected or scattered light.
  • the light transmittance may be measured at 550nm using a UV-Vis Spectrometer.
  • the encapsulation composition constituting the light absorbing layer or the moisture barrier layer may be made of a known material.
  • the encapsulation composition constituting the light absorbing layer may include an encapsulating resin and a light absorbing material as described above.
  • the light absorbing material may be included in the type or content of the material is adjusted so that the light absorbing region of the encapsulation film is satisfied the above-described range of the surface resistance or light transmittance, which is appropriately controlled by those skilled in the art can do.
  • the kind of sealing resin which comprises the said sealing composition is not specifically limited.
  • the encapsulation resin described herein may be included in both the light absorbing layer and the moisture barrier layer.
  • the encapsulation resin may be solid or semi-solid, preferably solid at room temperature.
  • the fact that the resin is solid or semi-solid at room temperature means that the resin does not exhibit fluidity at room temperature.
  • the term solid or semi-solid at room temperature herein may mean that the viscosity at room temperature of the object is about 10 6 poise or more or about 10 7 poise or more.
  • the viscosity is measured at 5% strain and 1Hz frequency condition using ARES (Advanced Rheometric Expansion System).
  • the sealing resin When the sealing resin is solid or semisolid at room temperature, the film or sheet shape can be maintained even in an uncured state. Accordingly, in the encapsulation or encapsulation process of the organic electronic device using the encapsulation film, physical or chemical damage may be prevented from being applied to the device, and the process may be smoothly performed. In addition, during the encapsulation or encapsulation process of the organic electronic device, it is possible to prevent bubbles from mixing or deteriorating the life of the device.
  • the upper limit of the viscosity of the encapsulating resin is not particularly limited, and can be controlled in the range of about 10 9 poise or less, for example, in consideration of processability and the like.
  • the encapsulating resin may be acrylic resin, epoxy resin, silicone resin, fluorine resin, styrene resin, polyolefin resin, thermoplastic elastomer, polyoxyalkylene resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, polyphenylene Sulfide resins, polyamide resins or mixtures thereof and the like can be exemplified.
  • styrene resin for example, styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), acrylonitrile-butadiene-styrene block copolymer (ABS) , Acrylonitrile-styrene-acrylate block copolymers (ASA), styrene-butadiene-styrene block copolymers (SBS), styrene-based homopolymers or mixtures thereof.
  • SEBS styrene-ethylene-butadiene-styrene block copolymer
  • SIS styrene-isoprene-styrene block copolymer
  • ABS acrylonitrile-butadiene-styrene block copolymer
  • ASA Acrylonitrile-styrene-acrylate block
  • the olefin resin for example, a high density polyethylene resin, a low density polyethylene resin, a polypropylene resin or a mixture thereof can be exemplified.
  • the thermoplastic elastomer for example, an ester thermoplastic elastomer, an olefin thermoplastic elastomer, a mixture thereof, or the like can be used.
  • polybutadiene resin or polyisobutylene resin may be used as the olefinic thermoplastic elastomer.
  • the polyoxyalkylene resins include polyoxymethylene resins, polyoxyethylene resins, mixtures thereof, and the like.
  • polyester resins examples include polyethylene terephthalate resins, polybutylene terephthalate resins, and mixtures thereof.
  • polyvinyl chloride resin polyvinylidene chloride etc. can be illustrated, for example.
  • a mixture of hydrocarbon resins may be included, for example, hexatriacotane or paraffin may be exemplified.
  • polyamide resin nylon etc. can be illustrated, for example.
  • acrylate resin polybutyl (meth) acrylate etc. can be illustrated, for example.
  • silicone resin polydimethylsiloxane etc. can be illustrated, for example.
  • polytrifluoroethylene resin polytetrafluoroethylene resin, polychlorotrifluoroethylene resin, polyhexafluoropropylene resin, polyvinylidene fluoride, polyvinylidene fluoride, polyfluoro Ethylene propylene propylene or mixtures thereof and the like can be exemplified.
  • the above-listed resins may be used, for example, by grafting with maleic anhydride, or the like, or may be used after being copolymerized with other listed resins or monomers for preparing the resins, or may be modified with other compounds.
  • the other compounds include carboxyl-terminated butadiene-acrylonitrile copolymers.
  • the encapsulation resin of the encapsulation composition may include polyisobutylene resin.
  • the polyisobutylene resin may have hydrophobicity to exhibit low moisture permeability and low surface energy.
  • polyisobutylene resin For example, homopolymer of isobutylene monomer; Or the copolymer which copolymerized the isobutylene monomer and the other monomer which can superpose
  • the other monomers polymerizable with the isobutylene monomer may include, for example, 1-butene, 2-butene, isoprene or butadiene.
  • the copolymer may be butyl rubber.
  • a base resin having a weight average molecular weight (Mw) that can be molded into a film shape may be used.
  • Mw weight average molecular weight
  • the weight average molecular weight may be about 100,000 to 2 million, 100,000 to 1.5 million, or 100,000 to 1 million.
  • weight average molecular weight means a conversion value with respect to standard polystyrene measured by gel permeation chromatography (GPC).
  • 1 type may be used among the structures mentioned above, and 2 or more types may be used.
  • 2 or more types 2 or more types of resin from a different kind may be used, 2 or more types of resin from which a weight average molecular weight differs, or 2 or more types of resin from a both type and weight average molecular weight may be used.
  • the encapsulation resin according to the invention can be a curable resin.
  • the specific kind of curable resin that can be used in the present invention is not particularly limited, and various thermosetting or photocurable resins known in the art may be used.
  • the term "thermosetting resin” means a resin that can be cured through an appropriate heat application or aging process
  • the term "photocurable resin” means a resin that can be cured by irradiation of electromagnetic waves.
  • the curable resin may be a dual curable resin including both thermosetting and photocuring properties.
  • the curable resin of the present invention constitutes an encapsulation composition together with a light absorbing material described below, the curable resin may be preferably a thermosetting resin, and photocurable resin may be excluded, but is not limited thereto.
  • curable resin in this invention will not be restrict
  • it may be cured to exhibit adhesive properties, and may include one or more thermosetting functional groups such as glycidyl group, isocyanate group, hydroxy group, carboxyl group or amide group, or may be an epoxide group or a cyclic ether. and resins containing at least one functional group curable by irradiation of electromagnetic waves such as a (cyclic ether) group, a sulfide group, an acetal group, or a lactone group.
  • specific types of the resin may include an acrylic resin, a polyester resin, an isocyanate resin, an epoxy resin, and the like, but is not limited thereto.
  • the curable resin aromatic or aliphatic; Or an epoxy resin of linear or branched chain type can be used.
  • an epoxy resin having an epoxy equivalent of 180 g / eq to 1,000 g / eq may be used as containing two or more functional groups.
  • an epoxy resin having an epoxy equivalent in the above range it is possible to effectively maintain properties such as adhesion performance and glass transition temperature of the cured product.
  • examples of such epoxy resins include cresol novolac epoxy resins, bisphenol A epoxy resins, bisphenol A novolac epoxy resins, phenol novolac epoxy resins, tetrafunctional epoxy resins, biphenyl epoxy resins, and triphenol methane types.
  • a kind or mixture of an epoxy resin, an alkyl modified triphenol methane epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, or a dicyclopentadiene modified phenol type epoxy resin is mentioned.
  • an epoxy resin containing a cyclic structure in a molecular structure can be used as the curable resin, and an epoxy resin containing an aromatic group (for example, a phenyl group) can be used.
  • an epoxy resin containing an aromatic group for example, a phenyl group
  • the cured product may have excellent thermal and chemical stability while exhibiting low moisture absorption, thereby improving reliability of the organic electronic device encapsulation structure.
  • aromatic group-containing epoxy resin examples include biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene modified phenol type epoxy resin, cresol type epoxy resin, Bisphenol-based epoxy resins, xylox-based epoxy resins, polyfunctional epoxy resins, phenol novolac epoxy resins, triphenol methane-type epoxy resins and alkyl-modified triphenol methane epoxy resins, such as one or a mixture of two or more, but is not limited thereto. no.
  • the epoxy resin a silane-modified epoxy resin or a silane-modified epoxy resin having an aromatic group can be used.
  • an epoxy resin modified with silane and structurally having a silane group is used, the adhesion of the organic electronic device to the glass substrate or the substrate inorganic material can be maximized, and the moisture barrier property, durability and reliability can be improved.
  • the specific kind of the above epoxy resin that can be used in the present invention is not particularly limited, and such a resin can be easily obtained from a place of purchase such as, for example, National Chemical.
  • the light absorbing layer of the encapsulation film may include a light absorbing material, and the light absorbing material is included in which the kind or content of the material is controlled so as to satisfy the above-described range of surface resistance or light transmittance. Which may be appropriately controlled by those skilled in the art.
  • absorbing material may mean a material capable of absorbing visible light, and examples thereof include a pigment or a dye.
  • the light absorbing material may be a nonconductive material.
  • the encapsulation composition including the light absorbing material is manufactured in the form of a film and applied to the encapsulation of the organic electronic device, if the film becomes electrically conductive, it causes an abnormality in driving the organic electronic device. Therefore, by using the non-conductive material as the light absorbing material, it is possible to limit the surface resistance of the film to the above-described range, thereby preventing the abnormal operation of the organic electronic device due to the electrical conductivity of the film.
  • the light absorbing material is not particularly limited as described above, but for example, a pigment or a dye can be used.
  • the light absorbing material is not particularly limited as long as it is a material capable of absorbing a radio wave field or a specific wavelength band, for example, carbon black, carbon nanotubes, florene (C6), phthalocyanine derivatives, porphyrin derivatives, triphenyl Amine derivatives or mixtures thereof.
  • the light absorbing material is 0.01 part by weight, 0.01 part by weight to 50 parts by weight, 0.6 to 40 parts by weight, 0.7 to 30 parts by weight, 0.8 to 20 parts by weight, and 0.9 to 14 parts by weight of the encapsulation resin.
  • the light absorbing material may be adjusted to absorb a light source in a specific wavelength band as needed.
  • the light absorbing layer or the moisture barrier of the encapsulation film of the present invention may contain a moisture adsorbent as necessary.
  • moisture adsorbent may be used as a generic term for components that can adsorb or remove moisture or moisture introduced from the outside through physical or chemical reactions. That is, it means a moisture reactive adsorbent or a physical adsorbent, and mixtures thereof may also be used.
  • the moisture reactive adsorbent chemically reacts with moisture, moisture, or oxygen introduced into the encapsulation film to adsorb moisture or moisture.
  • the physical adsorbent can inhibit the penetration by lengthening the movement path of moisture or moisture that penetrates into the encapsulation structure, and maximizes the barrier to moisture and moisture through interaction with the matrix structure of the encapsulating resin and the water reactive adsorbent. can do.
  • the specific kind of water adsorbent that can be used in the present invention is not particularly limited.
  • metal powder such as alumina, metal oxide, metal salt or phosphorus pentoxide (P 2 O 5 ), or the like
  • P 2 O 5 phosphorus pentoxide
  • the physical adsorbent include silica, zeolite, titania, zirconia, montmorillonite, and the like.
  • the metal oxides include lithium oxide (Li 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO), magnesium oxide (MgO), and the like.
  • Examples include lithium sulfate (Li 2 SO 4 ), sodium sulfate (Na 2 SO 4 ), calcium sulfate (CaSO 4 ), magnesium sulfate (MgSO 4 ), cobalt sulfate (CoSO 4 ), gallium sulfate (Ga 2 (SO 4 ) 3 ), sulfates such as titanium sulfate (Ti (SO 4 ) 2 ) or nickel sulfate (NiSO 4 ), etc., calcium chloride (CaCl 2 ), magnesium chloride (MgCl 2 ), strontium chloride (SrCl 2 ), yttrium chloride (YCl 3 ) , Copper chloride (CuCl 2 ), cesium fluoride (CsF), tantalum flu
  • a water adsorbent such as the metal oxide can be blended into the composition in a state of being properly processed.
  • the encapsulation film prepared by using the encapsulation composition described above in the form of a film may be formed into a thin film having a thickness of 30 ⁇ m or less according to the type of organic electronic device to be applied, and in this case, a grinding step of a moisture absorbent is required.
  • a process such as a three roll mill, bead mill or ball mill may be used.
  • the light absorbing layer or the moisture preventing layer of the encapsulation film of the present invention is a water adsorbent, based on 100 parts by weight of the encapsulating resin, 0 to 100 parts by weight, 1 to 90 parts by weight, 5 to 80 parts by weight or 10 to 60 parts by weight. It can be included in negative amounts.
  • the moisture adsorbent may not be included as an optional component, but preferably, by controlling the content of the moisture adsorbent to 5 parts by weight or more, the cured product may exhibit excellent moisture and moisture barrier properties. In addition, by controlling the content of the moisture adsorbent to 100 parts by weight or less, while forming the sealing structure of the thin film, it is possible to exhibit excellent moisture barrier properties.
  • a unit “weight part” means the weight ratio between each component.
  • the moisture adsorbent may be appropriately controlled according to the structure of encapsulating the organic electronic device.
  • the layer in contact with the organic electronic device may include 0 to 20% of the water absorbent based on the total mass of the water absorbent in the encapsulation film.
  • the moisture barrier layer ( 6) may include 0 to 20% of the water absorbent based on the total weight of the water absorbent
  • the upper moisture barrier layer (4) does not contact the organic electronic device 80 to 100% based on the total weight of the water absorbent. May contain a moisture adsorbent.
  • the light absorption layer or the moisture prevention layer of the sealing film of this invention can contain a filler, Preferably an inorganic filler is needed.
  • the filler can suppress the penetration by lengthening the movement path of moisture or moisture that penetrates into the encapsulation structure, and can maximize the barrier to moisture and moisture through interaction with the matrix structure of the encapsulating resin and the moisture absorbent.
  • the specific kind of filler that can be used in the present invention is not particularly limited, and for example, one kind or a mixture of two or more kinds such as clay, talc or silica can be used.
  • a product surface-treated with an organic material may be used as the filler, or a coupling agent may be additionally added.
  • the light absorbing layer or the moisture prevention layer of the encapsulation film of the present invention may include a filler in an amount of 0 to 50 parts by weight, 1 to 40 parts by weight, or 1 to 20 parts by weight with respect to 100 parts by weight of the encapsulation resin. .
  • the filler may not be included in the encapsulation film as an optional component, but preferably controlled to 1 part by weight or more, to provide an encapsulation structure having excellent moisture or moisture barrier properties and mechanical properties.
  • by controlling the filler content to 50 parts by weight or less in the present invention it is possible to manufacture a film form, it is possible to provide a cured product exhibiting excellent moisture barrier properties even when formed into a thin film.
  • the term "encapsulation structure” may mean the encapsulation film of the above-described single layer or multilayer structure, and furthermore, the organic electronic device encapsulation product including an encapsulation film and an organic electronic device encapsulating the entire surface of the organic electronic device. Can mean.
  • the encapsulation film may further include a dispersant such that a light absorbing material or a moisture absorbent may be uniformly dispersed.
  • a dispersant such that a light absorbing material or a moisture absorbent may be uniformly dispersed.
  • a nonionic surfactant having affinity with the surface of the light absorbing material and having good compatibility with the encapsulating resin can be used.
  • the light absorbing layer or the moisture barrier of the encapsulation film may further include a curing agent, depending on the type of encapsulation resin.
  • a curing agent capable of reacting with the above-mentioned encapsulating resin to form a crosslinked structure or the like or an initiator capable of initiating a curing reaction of the resin.
  • An appropriate kind can be selected and used according to the kind of sealing resin or the functional group contained in the resin for a hardening
  • the curing agent is a curing agent of an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent.
  • an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent.
  • One kind or more than one kind may be used, but is not limited thereto.
  • the curing agent may be an imidazole compound which is solid at room temperature and has a melting point or decomposition temperature of 80 ° C. or higher.
  • an imidazole compound which is solid at room temperature and has a melting point or decomposition temperature of 80 ° C. or higher.
  • the content of the curing agent may be selected according to the composition of the composition, for example, the type or proportion of the encapsulating resin.
  • the curing agent may include 1 part by weight to 20 parts by weight, 1 part by weight to 10 parts by weight, or 1 part by weight to 5 parts by weight, based on 100 parts by weight of the encapsulating resin.
  • the weight ratio may be changed depending on the type and ratio of the encapsulating resin or functional group of the resin, or the crosslinking density to be implemented.
  • the sealing resin is a resin which can be cured by irradiation of active energy rays
  • the initiator for example, a cationic photopolymerization initiator can be used.
  • an onium salt or an organometallic salt-based ionizing cation initiator or an organosilane or a latent sulfuric acid-based or non-ionized cationic photopolymerization initiator may be used.
  • the onium salt-based initiator include a diaryliodonium salt, a triarylsulfonium salt, an aryldiazonium salt, and the like.
  • the zero, iron arene and the like can be exemplified.
  • the organosilane-based initiator include o-nitrobenzyl triaryl silyl ether and triaryl silyl peroxide.
  • the latent sulfuric acid-based initiator may be exemplified by ⁇ -sulfonyloxy ketone or ⁇ -hydroxymethylbenzoin sulfonate and the like, but is not limited thereto. .
  • an ionized cationic photopolymerization initiator may be used as the cationic initiator.
  • sealing resin is resin which can be bridge
  • an initiator a radical initiator can be used, for example.
  • the radical initiator may be a photoinitiator or a thermal initiator.
  • Specific types of photoinitiators may be appropriately selected in consideration of the curing rate and the possibility of yellowing. For example, a benzoin type, a hydroxy ketone type, an amino ketone type, or a phosphine oxide type photoinitiator etc.
  • benzoin benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether , Benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2 -Hydroxy-2-methyl-1-phenylpropane-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1- On, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-
  • the content of the initiator may be changed according to the type and ratio of the encapsulating resin or the functional group of the resin, or the crosslinking density to be implemented, as in the case of the curing agent.
  • the initiator may be blended in an amount of 0.01 to 10 parts by weight or 0.1 to 3 parts by weight with respect to 100 parts by weight of the encapsulating resin.
  • the light absorbing layer or the moisture barrier of the encapsulation film of the present invention may further include a high molecular weight resin.
  • the high molecular weight resin may serve to improve moldability, for example, when molding the encapsulation composition of the present invention into a film or sheet shape.
  • it may serve as a high temperature viscosity regulator to control the flowability.
  • the kind of high molecular weight resin that can be used in the present invention is not particularly limited as long as it has compatibility with other components such as the encapsulating resin.
  • Specific examples of high molecular weight resins that can be used are resins having a weight average molecular weight of 20,000 or more, such as phenoxy resins, acrylate resins, high molecular weight epoxy resins, ultra high molecular weight epoxy resins, high polarity functional group-containing rubbers and high One kind or a mixture of two or more kinds such as a high polarity functional group-containing reactive rubber, but is not limited thereto.
  • the content is not particularly limited to be adjusted according to the desired physical properties.
  • the high molecular weight resin may be included in an amount of about 200 parts by weight or less, preferably 150 parts by weight or less, and more preferably about 100 parts by weight or less based on 100 parts by weight of the encapsulation resin.
  • the content of the high molecular weight resin is controlled to 200 parts by weight or less, effectively maintaining compatibility with each component of the resin composition, and may also serve as an adhesive.
  • the encapsulation composition constituting the light absorbing layer or the moisture barrier layer according to the present invention
  • various additives may be used depending on the use, the type of encapsulation resin, and the manufacturing process of the encapsulation film described below, in a range that does not affect the effects of the above-described invention. May be included.
  • the encapsulation composition may include a coupling agent, a crosslinking agent, a curable material, a tackifier, an ultraviolet stabilizer, an antioxidant, or the like in an appropriate range of contents depending on the desired physical properties.
  • the curable material may mean a material having a thermosetting functional group and / or an active energy ray curable functional group which are separately included in addition to the components constituting the encapsulation composition described above.
  • a functional group capable of participating in a polymerization reaction by irradiation of an active energy ray such as a functional group including an ethylenically unsaturated double bond such as acryloyl group or methacryloyl group, a functional group such as an epoxy group or an oxetane group It may mean a compound containing two or more.
  • the encapsulation film may further include a metal layer in addition to the light absorbing layer or the moisture barrier layer.
  • the metal layer may be transparent and opaque.
  • the metal layer may be a metal deposited on a thin metal foil (Metal foil) or a polymer substrate film.
  • the metal layer may be used without limitation as long as it has a thermal conductivity and a material having moisture barrier property.
  • the metal layer may comprise any one of metals, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof.
  • the metal layer may include an alloy in which one or more metal elements or nonmetal elements are added to one metal, and may include, for example, an iron-nickel alloy or stainless steel (SUS).
  • the metal layer may include copper, aluminum, nickel, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof. have.
  • the metal layer may be deposited by electrolytic, rolling, heat evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma chemical vapor deposition or electron cyclotron resonance source plasma chemical vapor deposition means.
  • the encapsulation film including the metal layer may prevent the external light from being reflected or scattered at the portion where the wiring or the like of the organic electronic device is not deposited by the metal layer through the light absorption region. have.
  • the reflectance of the metal layer may be 15% to 90%, 18% to 88% or 20% to 86% in Specular Component Included (SCI).
  • the reflectance of the metal layer may be 15% to 80%, 18% to 75%, 20% to 70% or 20% to 65% in Specular Component Excluded (SCE).
  • SCI means total reflectance
  • SCE means diffuse reflectance by scattering.
  • the reflectance can be measured by a method known in the art, for example, it can be measured using CM2006d of Konika minolta (measurement conditions: M / I + E, M / SCI, M / SCE, S / Setting value of any one of I + E, S / SCI and S / SCE, setting value of any one of UV 0% to 100%, D65, D50, C, A, F2, F6, F7, F8, F10, F11 And a light source of any one of F12, viewing field of 10 ° or 2 °.
  • Konika minolta measurement conditions: M / I + E, M / SCI, M / SCE, S / Setting value of any one of I + E, S / SCI and S / SCE, setting value of any one of UV 0% to 100%, D65, D50, C, A, F2, F6, F7, F8, F10, F11 And a light source of any one of F12, viewing field of 10 ° or
  • the encapsulation film of the present invention includes a metal layer
  • the light absorbing layer includes a moisture adsorbent or a filler
  • the water blocking layer includes a water adsorbent or a filler
  • the light absorbing layer or the moisture blocking layer serves as an intermediate layer for scattering light, and thus is formed on one surface of the organic electronic device.
  • the effect of reducing the reflectance of the polarizer to be reduced is reduced, whereby the part without the metal wiring is cloudyly recognized. Therefore, as described above, the encapsulation film including the metal layer may prevent the external light from being reflected or scattered at the portion where the wiring or the like of the organic electronic device is not deposited by the metal layer through the light absorption region. have.
  • the metal layer is 50 W / mK or more, 60 W / mK or more, 70 W / mK or more, 80 W / mK or more, 90 W / mK or more, 100 W / mK or more, 110 W / mK or more, 120 W / mK 130 W / mK or more, 140 W / mK or more, 150 W / mK or more, 200 W / mK or more, or 250 W / mK or more.
  • the high thermal conductivity quickly releases heat accumulated during the operation of the organic electronic device to the outside, thereby keeping the temperature of the organic electronic device itself lower and reducing the occurrence of cracks and defects.
  • thermal conductivity is a degree indicating the ability of a material to transfer heat by conduction, and a unit may be represented by W / mK.
  • the unit represents the degree of heat transfer of the material at the same temperature and distance, and means the unit of heat (watt) with respect to the unit of distance (meter) and the unit of temperature (Kelvin).
  • the structure of the sealing film of this invention is not specifically limited, For example, a base film or a release film (henceforth a "first film” may be called.); And the light absorbing layer or the moisture barrier layer formed on the base film or the release film.
  • the sealing film of this invention may further contain the base film or release film (henceforth a "second film” may be called.) Formed on the said light absorption layer or a moisture prevention layer.
  • the specific kind of the said 1st film which can be used by this invention is not specifically limited.
  • a general polymer film of this field can be used as the first film.
  • Ethylene-vinyl acetate film, ethylene-propylene copolymer film, ethylene-ethyl acrylate copolymer film, ethylene-methyl acrylate copolymer film, polyimide film and the like can be used.
  • an appropriate release treatment may be performed on one side or both sides of the base film or the release film of the present invention.
  • Alkyd-based, silicone-based, fluorine-based, unsaturated ester-based, polyolefin-based, or wax-based may be used as an example of the release agent used in the release treatment of the base film, and among these, it is preferable to use an alkyd-based, silicone-based, or fluorine-based release agent in terms of heat resistance. Preferred, but not limited to.
  • the kind of 2nd film (Hereinafter, a "cover film” may be called.) Which can be used by this invention is not specifically limited, either.
  • the second film the same or different kind as the first film can be used within the range exemplified in the above-described first film.
  • an appropriate release treatment may also be performed on the second film.
  • the thickness of the base film or the release film (first film) as described above is not particularly limited and may be appropriately selected depending on the application to be applied.
  • the thickness of the first film may be about 10 ⁇ m to 500 ⁇ m, preferably about 20 ⁇ m to 200 ⁇ m. If the thickness is less than 10 ⁇ m, deformation of the base film may occur easily during the manufacturing process. If the thickness is more than 500 ⁇ m, the economy is inferior.
  • the thickness of the second film in the present invention is also not particularly limited. In this invention, you may set the thickness of the said 2nd film similarly to a 1st film, for example. In the present invention, the thickness of the second film can also be set relatively thinner than the first film in consideration of processability and the like.
  • the thickness of the light absorbing layer or the moisture barrier layer included in the sealing film of the present invention is not particularly limited and may be appropriately selected according to the following conditions in consideration of the use to which the film is applied.
  • the light absorbing layer or moisture barrier layer included in the encapsulation film of the present invention may have a thickness of about 5 ⁇ m to 200 ⁇ m, preferably about 10 ⁇ m to 150 ⁇ m.
  • the method of manufacturing such a sealing film is not specifically limited. For example, a first step of coating a coating liquid containing the above-described sealing composition on a base film or a release film; And a second step of drying the coating solution coated in the first step.
  • each light absorbing layer or the moisture barrier layer is not particularly limited.
  • a light absorbing layer or a moisture barrier layer formed on a separate release film may be laminated to each other to form a sealing film having a multi-layer structure, or a moisture barrier layer may be directly formed on the light absorbing layer, or vice versa.
  • a third step of additionally compressing the base film or the release film on the coating liquid dried in the second step may be further performed.
  • the first step of the present invention is to prepare a coating solution by dissolving or dispersing the above-described encapsulation composition in a suitable solvent.
  • the content of the encapsulating resin and the like contained in the coating liquid may be appropriately controlled according to the desired water barrier property and the film formability.
  • the kind of the solvent used for preparing the coating liquid is not particularly limited.
  • the drying time of the solvent is too long or when drying at a high temperature is required, problems may occur in terms of workability or durability of the encapsulation film, and it is preferable to use a solvent having a volatilization temperature of 100 ° C. or less.
  • a small amount of a solvent having a volatilization temperature of the above range or more can be mixed and used.
  • solvent examples include methyl ethyl ketone (MEK), acetone, toluene, dimethylformamide (DMF), methyl cellosolve (MCS), tetrahydrofuran (THF) or N-methylpyrrolidone (NMP) and the like or a mixture of two or more thereof may be mentioned, but is not limited thereto.
  • MEK methyl ethyl ketone
  • DMF dimethylformamide
  • MCS methyl cellosolve
  • THF tetrahydrofuran
  • NMP N-methylpyrrolidone
  • the method of applying the coating liquid to the base film or the release film in the first step of the present invention is not particularly limited, for example, knife coat, roll coat, spray coat, gravure coat, curtain coat, comma coat or lip Known methods such as coats and the like can be used without limitation.
  • the second step of the present invention is to dry the coating solution coated in the first step, to form a light absorbing layer or a moisture barrier. That is, in the second step of the present invention, a light absorbing layer or a moisture barrier layer can be formed by heating and removing the solvent by heating the coating liquid applied to the film.
  • the drying conditions are not particularly limited, for example, the drying may be performed for 1 to 10 minutes at a temperature of 70 °C to 200 °C.
  • the 3rd step of crimping an additional base film or a release film on the light absorbing layer or moisture prevention layer formed on the film may further be performed.
  • the third step of the present invention is carried out by coating an additional release film or base film (cover film or second film) on the dried light absorbing layer or the moisture barrier layer by coating the film, followed by pressing by a hot roll laminate or pressing process.
  • an additional release film or base film cover film or second film
  • the present invention as shown in Figure 9, the substrate 21;
  • An organic electronic device (23) comprising a transparent electrode layer on the substrate, an organic layer on the transparent electrode layer and including at least a light emitting layer and a reflective electrode layer on the organic layer;
  • an encapsulation film 1 encapsulating the entire surface of the organic electronic device 23 and having a light absorption region having a surface resistance of 10 11 ⁇ / cm 2 or more.
  • the organic layer may be formed in various structures further including other various functional layers known in the art, as long as it includes a light emitting layer.
  • Examples of the layer that may be included in the organic layer may include an electron injection layer, a hole blocking layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.
  • a hole or electron injection electrode layer and an organic layer for example, a light emitting layer, an electron injection or transport layer, a hole injection or transport layer, and a method of forming the same are known and can be used without limitation.
  • the organic electronic device 23 may be an organic light emitting diode.
  • the organic electronic device according to the present invention may be a bottom emission type.
  • the organic electronic device may further include a protective film protecting the organic electronic device between the encapsulation film and the organic electronic device.
  • the organic electronic device may include an encapsulation film further including a metal layer, in which case a cover substrate to be described later may be omitted.
  • Yet another embodiment of the present invention provides a method of forming an organic electronic device, comprising: forming an organic electronic device on a substrate, the organic electronic device including a transparent electrode layer, an organic layer on the transparent electrode layer and at least including a light emitting layer, and a reflective electrode layer on the organic layer; And applying the aforementioned encapsulation film to the substrate on which the organic electronic device is formed so as to encapsulate the entire surface of the organic electronic device.
  • the applying of the encapsulation film to the organic electronic device may be performed by hot roll lamination, hot pressing, or vacuum compression of the encapsulation film, and is not particularly limited.
  • the applying of the encapsulation film to the organic electronic device may be performed at a temperature of 50 ° C. to 90 ° C., followed by a curing step, which may be heated to a temperature range of 70 ° C. to 110 ° C. or irradiated with UV. Can be done.
  • FIG. 9 is a cross-sectional view illustrating an organic electronic device according to one example of the present invention.
  • a transparent electrode is formed on a substrate 21 such as glass or a film by vacuum deposition or sputtering, and an organic material layer is formed on the transparent electrode.
  • the organic material layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer and / or an electron transport layer.
  • a second electrode is further formed on the organic material layer. Then, the above-described encapsulation film 1 is applied to cover all of the organic electronic device 23 on the organic electronic device 23 on the substrate 21.
  • a method of applying the encapsulation film 1 is not particularly limited, and for example, the encapsulation film 1 of the present invention is transferred in advance to the upper portion of the organic electronic device 23 formed on the substrate 21.
  • the cover substrate (ex. Glass or polymer film) 22 may be applied by heating, pressing, autoclave or the like.
  • the above step for example, when transferring the encapsulation film 1 on the cover substrate 22, using the encapsulation film 1 of the present invention described above, after peeling off the substrate or release film formed on the film While applying heat, it is possible to transfer onto the cover substrate 22 using a vacuum press or a vacuum laminator or the like.
  • the adhesion or adhesion of the encapsulation film 1 may decrease, so that the process temperature is controlled to about 100 ° C. or less and the process time is within 5 minutes. It is desirable to.
  • a vacuum press or a vacuum laminator may be used even when the cover substrate 22 to which the encapsulation film 1 is transferred is heat-compressed to the organic electronic device 23.
  • the temperature conditions at this stage can be set as described above, and the process time is preferably within 10 minutes.
  • an additional curing process may be performed on the encapsulation film on which the organic electronic device is pressed.
  • This curing process (main curing) may be performed in, for example, a heating chamber or a UV chamber, and preferably, heating. It can proceed in the chamber. Conditions in the present curing may be appropriately selected in consideration of the stability of the organic electronic device.
  • the above-described manufacturing process is only one example for encapsulating the organic electronic device of the present invention, and the process sequence or process conditions may be freely modified.
  • the present invention transfers the sealing film 1 of the present invention to the organic electronic device 23 on the substrate 21 first, and then compresses the cover substrate 22 in the order of the transfer and the pressing process. You can change it in a way.
  • the protective layer may be formed on the organic electronic device 23, the encapsulation film may be applied, and then the cover substrate 22 may be omitted and cured.
  • the organic electronic device When the organic electronic device is encapsulated using the encapsulation film according to the embodiments of the present invention, the organic electronic device not only realizes excellent moisture blocking properties but also absorbs and blocks light from inside or outside to prevent reflection or scattering of light. Appearance defects of the device can be prevented.
  • 1 to 4 are cross-sectional views showing an encapsulation film according to one example of the present invention.
  • 5 to 8 are plan views showing encapsulation films according to one example of the present invention.
  • FIG. 9 is a cross-sectional view illustrating an organic electronic device according to one example of the present invention.
  • Carbon black (# 2600 Mitsubishi carbon black) having a primary particle size of about 20 nm or less as a light absorbing material was added to MEK as a solvent at a concentration of 10% by weight of solid to prepare a carbon black dispersion. Meanwhile, 100 g of calcined dolomite as a water adsorbent and MEK as a solvent were added at a concentration of 50% by weight of solid content to prepare a water adsorbent solution.
  • the water adsorbent solution prepared in advance in the solution is added so that the content of calcined dolomite is 30 parts by weight relative to 100 parts by weight of the encapsulating resin of the light absorbing layer, and the carbon black dispersion is 10 parts by weight of 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • the light absorbing layer solution was prepared by adding as much as possible and mixing.
  • the solution of the said light absorbing layer was apply
  • Carbon black (# 2600 Mitsubishi carbon black) having a primary particle size of about 20 nm or less as a light absorbing material was added to MEK as a solvent at a concentration of 10% by weight of solid to prepare a carbon black dispersion.
  • a silane-modified epoxy resin KSR-177, Kukdo Chemical
  • 150 g of a phenoxy resin YP-50, Kyodo Chemical
  • 4 g of imidazole Shikoku Chemical
  • the water adsorbent solution prepared in advance in the solution was added so that the content of calcined dolomite was 30 parts by weight relative to 100 parts by weight of the encapsulating resin of the moisture barrier layer.
  • the solution of the moisture barrier layer was applied to the release surface of the release PET and dried at 130 ° C. for 3 minutes to form a moisture barrier layer having a thickness of 20 ⁇ m.
  • the solution of the light absorbing layer was applied to the release surface of the release PET, dried at 130 ° C. for 3 minutes to form a light absorbing layer having a thickness of 10 ⁇ m.
  • the moisture barrier layer and the light absorbing layer were laminated to prepare a sealing film having a moisture barrier layer and a light absorbing layer two-layer structure.
  • the solution of the moisture prevention layer prepared in Example 2 was apply
  • the solution of the light absorption layer of Example 2 was apply
  • the moisture barrier layer and the light absorbing layer were laminated in a three-layer structure of a light absorbing layer / moisture preventing layer / light absorbing layer to prepare an encapsulation film.
  • An encapsulation film was prepared in the same manner as in Example 1 except that the carbon black dispersion was added so that the carbon black content was 1 part by weight based on 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • An encapsulation film was prepared in the same manner as in Example 2, except that the moisture adsorbent content was added so as to be 10 parts by weight based on 100 parts by weight of the encapsulating resin.
  • an encapsulation film was prepared in the same manner as in Example 1, except that conductive carbon black (# 3030B, Mitsubishi carbon black, about 55 nm) was added at 15 parts by weight based on 100 parts by weight of the encapsulating resin.
  • an encapsulation film was manufactured in the same manner as in Example 2, except that conductive carbon black (# 3030B, Mitsubishi carbon black, about 55 nm) was added at 10 parts by weight based on 100 parts by weight of the encapsulating resin.
  • An encapsulation film was prepared in the same manner as in Comparative Example 2, except that the content of the moisture adsorbent was 5 parts by weight based on 100 parts by weight of the encapsulating resin.
  • the light transmittance at 550 nm was measured using the UV-Vis Spectrometer for the light absorption region of the film prepared above.
  • the light transmittance was measured in the thickness direction with respect to the light absorption region of the light absorbing layer in the case of a single layer, and in the thickness direction with respect to the light absorption region in the state where a plurality of layers were laminated in the case of a multilayer structure.
  • haze was measured using the haze meter according to JISK7105 standard test method. The haze was measured for the total area of the light absorbing layer in the case of a single layer, and for the total area in the state in which a plurality of layers were laminated in the case of a multilayer structure.
  • the surface resistance was measured according to standard test methods with MITSUBISHI CHEMICAL CORPORATION, MCP-HT450 surface resistance meter. The measurement of the surface resistance measured the surface resistance of the light absorption area of the encapsulation film from which the release film was removed, and was measured at 23 ° C. and 50% R.H. Under the environment, the surface resistance value after measuring a voltage of 500 V for 1 minute was measured. The surface resistance was measured for the light absorbing region of the light absorbing layer in the case of a single layer, and for the light absorbing region in the state in which a plurality of layers were laminated in the case of a multilayer structure.
  • the film was placed between the TFT and the glass on which the organic electronic device was deposited, and thermally bonded to prepare an organic electronic device panel.
  • the sealing film was affixed so that a light absorption layer might contact TFT surface.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention porte sur un film d'encapsulation, un dispositif électronique organique le comprenant, et un procédé de fabrication d'un dispositif électronique organique. Dans le cas de l'encapsulation d'un dispositif électronique organique à l'aide du film d'encapsulation, il est possible non seulement d'implémenter d'excellentes propriétés de protection contre l'humidité, mais aussi de prévenir des défauts d'aspect du dispositif électronique organique en évitant la réflexion ou la diffusion de la lumière par l'absorption et le blocage d'une lumière interne ou externe.
PCT/KR2015/001659 2014-02-18 2015-02-17 Film d'encapsulation, et dispositif électronique organique le comprenant WO2015126176A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US15/116,167 US10096797B2 (en) 2014-02-18 2015-02-17 Encapsulation film and organic electronic device comprising the same
JP2016551160A JP6685913B2 (ja) 2014-02-18 2015-02-17 封止フィルム及びこれを含む有機電子装置
CN201580009337.1A CN106030846B (zh) 2014-02-18 2015-02-17 封装膜及包括该封装膜的有机电子装置
EP15752523.9A EP3109918B1 (fr) 2014-02-18 2015-02-17 Film d'encapsulation, et dispositif électronique organique le comprenant
US16/119,600 US10181577B1 (en) 2014-02-18 2018-08-31 Encapsulation film and organic electronic device comprising the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2014-0018669 2014-02-18
KR20140018669 2014-02-18
KR1020140071989A KR20150097359A (ko) 2014-02-18 2014-06-13 봉지 필름 및 이를 포함하는 유기전자장치
KR10-2014-0071989 2014-06-13
KR10-2014-0130495 2014-09-29
KR1020140130495A KR20150097371A (ko) 2014-02-18 2014-09-29 봉지 필름 및 이를 포함하는 유기전자장치

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US15/116,167 A-371-Of-International US10096797B2 (en) 2014-02-18 2015-02-17 Encapsulation film and organic electronic device comprising the same
US16/119,600 Continuation US10181577B1 (en) 2014-02-18 2018-08-31 Encapsulation film and organic electronic device comprising the same

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CN110573985A (zh) * 2017-04-14 2019-12-13 惠普发展公司，有限责任合伙企业 被能量吸收材料包封的基材

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