WO2015126174A1 - Film d'encapsulation et dispositif électronique organique comprenant celui-ci - Google Patents

Film d'encapsulation et dispositif électronique organique comprenant celui-ci Download PDF

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Publication number
WO2015126174A1
WO2015126174A1 PCT/KR2015/001657 KR2015001657W WO2015126174A1 WO 2015126174 A1 WO2015126174 A1 WO 2015126174A1 KR 2015001657 W KR2015001657 W KR 2015001657W WO 2015126174 A1 WO2015126174 A1 WO 2015126174A1
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WIPO (PCT)
Prior art keywords
resin
encapsulation film
film
layer
electronic device
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PCT/KR2015/001657
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English (en)
Korean (ko)
Inventor
문정옥
유현지
이승민
김현석
최반석
양세우
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from KR1020140071989A external-priority patent/KR20150097359A/ko
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2016550857A priority Critical patent/JP6775867B2/ja
Priority to US15/115,862 priority patent/US10720600B2/en
Priority to CN201580009339.0A priority patent/CN106030844B/zh
Priority to EP15751814.3A priority patent/EP3109913A4/fr
Publication of WO2015126174A1 publication Critical patent/WO2015126174A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers

Definitions

  • the present invention relates to an encapsulation film, an organic electronic device including the same, and a manufacturing method of the organic electronic device.
  • An organic electronic device refers to a device including an organic material layer that generates an exchange of electric charge using holes and electrons.
  • organic electronic devices include photovoltaic devices, rectifiers, transmitters, and organic light emitting diodes (OLEDs).
  • an organic light emitting diode has a low power consumption, a fast response speed, and is advantageous in thinning a display device or an illumination light as compared with a conventional light source.
  • OLEDs are also expected to be applied in a variety of fields across a variety of portable devices, monitors, notebooks and TVs due to their excellent space utilization.
  • the main problem is durability.
  • Organic materials and metal electrodes included in the OLED are very easily oxidized by external factors such as moisture.
  • the portion where the wiring is deposited and the portion other than the portion is deposited in the peripheral portion of the display.
  • the non-deposited portion may be reflected or scattered by the light inside or outside, which causes a problem of appearance defects that appear to be bright when viewed from the outside.
  • the present invention not only realizes excellent moisture blocking properties, but also absorbs and blocks light inside or outside to prevent reflection or scattering of light, thereby preventing an external defect of an organic electronic device, and an organic electronic including the same.
  • a device and a method for manufacturing an organic electronic device are provided.
  • the present invention relates to a film for encapsulating an organic electronic device.
  • the encapsulation film of the present invention can be applied to encapsulating or encapsulating the entire area of an organic electronic device such as, for example, an OLED.
  • the encapsulation film can include a light absorbing region.
  • the light absorbing region may mean a region in which the L * value is in a range of 0 to 50 in the CIE LAB color space in the encapsulation film.
  • the light absorbing region may contain an encapsulating resin and a light absorbing material.
  • the encapsulation film comprises a light absorbing layer containing an encapsulating resin and a light absorbing material, the light absorbing layer comprising a light absorbing region having an L * value in a range of 0 to 50 in a CIE LAB color space; And it may include a moisture barrier.
  • the present invention also relates to an organic electronic device including a substrate, an organic electronic device existing on the substrate, and an encapsulation film having the light absorption region attached to the front surface of the organic electronic device.
  • the light absorbing region may mean a region including a light absorbing material in a thickness direction. That is, in this case, some regions of the moisture barrier layer may be defined as light absorbing regions together with some regions of the light absorbing layer.
  • organic electronic device means an article or device having an element including an organic material layer that generates an exchange of electric charge using holes and electrons between a pair of electrodes facing each other, for example
  • the photovoltaic device, a rectifier, a transmitter, and an organic light emitting diode (OLED) may be mentioned, but is not limited thereto.
  • the organic electronic device may be an OLED.
  • the term "Commission Internationale de l'Eclairage (LA) color space” refers to a color space defined by the CIE in order to easily express the error range and direction of the color of the object.
  • the CIE LAB color space represents a color space in L *, a *, and b *, where L * represents a reflectance (brightness), and may be expressed to a unit below the decimal point in the range of 0 to 100.
  • a * and b * are chromaticity diagrams, + a * for the red direction, -a * for the green direction, + b * for the yellow direction, and -b * for the blue direction.
  • the term “absorption layer” or “moisture prevention layer” may mean an adhesive layer, an adhesive layer, or an adhesive layer forming a sealing film. Therefore, if necessary, the encapsulation film and the light absorbing layer and / or the moisture barrier may be used in the same sense.
  • the term adhesive layer is maintained at a solid or semi-solid at room temperature, and when heated, flow is generated to attach the adherend without bubbles, and after solidification, the object is attached with an adhesive. It means the adhesive layer of the form that can be fixed firmly.
  • the term “absorption layer” means a layer including the light absorption region described above.
  • the "moisture barrier layer” has a water vapor transmission rate (WVTR) of 50 g / m 2 ⁇ day or less, preferably 30 g / m 2 ⁇ day or less, more preferably 20 g / m 2 ⁇ day or less, more preferably 15 g / m 2 ⁇ day or less.
  • WVTR water vapor transmission rate
  • the moisture permeability is crosslinked or cured the encapsulating resin described later, the crosslinked product or cured product to a film shape of 80 ⁇ m thick, and then the crosslinked material or cured product under 38 ° C. and 100% relative humidity. It is the moisture permeability measured about the direction. In addition, the moisture permeability is measured according to ASTM F1249.
  • the moisture barrier layer may include an encapsulation resin, and may further include a moisture adsorbent.
  • the components constituting the moisture barrier layer such as the encapsulating resin or the moisture absorbent may be the same as or different from the components constituting the light absorbing layer.
  • the term "sealing composition” means a component constituting the light absorbing layer or the moisture barrier of the sealing film.
  • the encapsulation composition can include encapsulating resin, light absorbing material, moisture adsorbent or other additives.
  • the light absorbing layer and the moisture preventing layer of the encapsulation film may be the same as or different from each other in the composition of the encapsulation composition, for example, the encapsulating resin, the moisture absorbent, other additives, or fillers, except for the light absorbing material.
  • the description regarding the sealing composition described later corresponds to both the light absorbing layer and the moisture barrier of the sealing film, unless otherwise specified.
  • the structure of the encapsulation film is not particularly limited.
  • the encapsulation film may have a single layer or a multilayer structure of two or more.
  • the encapsulation film when it has a single layer structure, it may include the light absorbing layer described above, and when the encapsulation film has a multilayer structure of two or more, it may include a light absorbing layer and a moisture barrier layer.
  • an exemplary encapsulation film 1 may include a light absorbing layer 2.
  • the encapsulation film 1 may have two or more multilayer structures, in which case the encapsulation film 1 may include at least one light absorbing layer 2.
  • the light absorbing layer 2 may be included.
  • the light absorbing layer includes a light absorbing material (3), or as shown in (b), the light absorbing layer includes a light absorbing material (3) and a moisture absorbent ( 5) may be included.
  • the light absorbing layer 2 and the moisture barrier layer 4 may be included.
  • the lamination order of the light absorbing layer and the moisture barrier layer is not particularly limited.
  • the moisture barrier layer may have a multilayer structure.
  • the light absorbing layer may be disposed between the two or more moisture barrier layers, or may be formed on one or both sides of a structure in which two or more moisture barrier layers are stacked.
  • the encapsulation film may include two or more light absorbing layers.
  • the light absorbing layer may be two layers stacked in succession, and may be configured to include a moisture barrier layer between the two light absorbing layers.
  • the encapsulation film may contain an encapsulation resin and a light absorbing material as described above, and include an absorbing region having an L * value in the range of 0 to 50 in the CIE LAB color space.
  • the non-absorbing region other than the light absorbing region in the encapsulation film may be composed of the same components as the components constituting the light absorbing region, except that the light absorbing material does not contain a small amount of the light absorbing material.
  • the non-absorbing region may have an L * value greater than 50 and no greater than 100 in the CIE LAB color space.
  • the portion where the light absorbing region is formed in the encapsulation film is not particularly limited.
  • the light absorbing region may be formed at at least one peripheral portion of the encapsulation film.
  • the term "peripheral part" means a peripheral edge portion. That is, the periphery of the film in the above may mean a peripheral portion of the film.
  • the light absorption region may be formed over the entire area of the encapsulation film. That is, when viewed in a plan view, the encapsulation film has an L * value in the range of 0 to 50 in the CIE LAB color space for the entire area of the encapsulation film, or at least one peripheral portion has an L * value in the CIE LAB color space. It may be in the range of 0 to 50.
  • the L * value in the CIE LAB color space may be an L * coordinate measured according to CIE LAB with respect to an absorption region of the film in the single layer when the film is formed in a single layer.
  • the film when the film is formed in a multilayered structure, the film may be L * coordinates measured according to CIE LAB measured in a multilayer structure including at least one light absorbing layer and / or at least one moisture barrier layer.
  • the light absorbing region described above may refer to a region having an L * value in a range of 0 to 50 in the CIE LAB color space in the laminated structure when the encapsulation film according to the present invention is observed in a plan view.
  • the absorption region of the film according to the invention may have an L * value in the range of 0-50, 0-47, 0-45 or 0-40 in the CIE LAB color space.
  • L * value in the range of 0-50, 0-47, 0-45 or 0-40 in the CIE LAB color space.
  • the encapsulation film serves to block and absorb the reflected or scattered light.
  • 5 to 8 show a plan view of the encapsulation film of the present invention.
  • the encapsulation film may have a light absorption region formed over the entire area of the encapsulation film, as shown in FIG. 5, but is not limited thereto. That is, when the encapsulation film is observed in a plan view, light absorbing regions may be formed in at least one peripheral portion as shown in FIGS. 6 to 8. That is, in the CIE LAB color space of the encapsulation film 1, a region having an L * value within a range of 0 to 50 is called an absorption region or a first region 10, and a region where the L * value exceeds 50 is not absorbed. When referred to as a region or a second region 11, the encapsulation film may have a total area of the first region 10.
  • only one peripheral portion of the encapsulation film 1 may be the first region 10. That is, as shown in FIG. 6, only one peripheral portion of the four peripheral portions may be the first region 10 and the remaining portion may be the second region 11. In addition, as shown in FIG. 8, all four peripheral portions may be the first region 10.
  • the thickness of each peripheral portion can be appropriately adjusted according to the field and application examples in which the skilled person applies the encapsulation film.
  • the term first region 10 may be used as the same meaning as the light absorbing region described above.
  • the light absorption region of the encapsulation film may have a light transmittance of 15% or less with respect to the visible light region.
  • the light transmittance may be a light transmittance of the visible light region measured in the thickness direction of the light absorbing region in the single layer when the film is formed of a single layer.
  • the film when the film is formed in a multi-layer structure, it may be a light transmittance measured in a multi-layer laminated structure including at least one light absorbing layer and / or at least one moisture barrier layer.
  • the light absorption region described above may mean a region having a light transmittance of 15% or less in the thickness direction of the film of the laminated structure when the encapsulation film according to the present invention is observed in a plan view.
  • the lower limit of the light transmittance in the visible light region according to the present invention may be 0.2%.
  • the light transmittance may be, for example, 0.2 to 15%, 0.5% to 15%, 0.9% to 15%.
  • a display is implemented by using an OLED, a portion in which wiring is deposited and a portion other than the portion are deposited on the side of the display. Accordingly, external light may be reflected or scattered at the undeposited portion, wherein the encapsulation film serves to block and absorb the reflected or scattered light.
  • the light transmittance may be measured at 550nm using a UV-Vis Spectrometer.
  • the encapsulation composition constituting the light absorbing layer or the moisture barrier layer may be made of a known material.
  • the encapsulation composition constituting the light absorbing region of the light absorbing layer may include an encapsulating resin and a light absorbing material as described above.
  • the light absorbing material may be included to adjust the type or content of the material so that the light absorbing region of the encapsulation film is satisfied the L * range according to the above-described CIE LAB, which is appropriately controlled by those skilled in the art can do.
  • the kind of sealing resin which comprises the said sealing composition is not specifically limited.
  • the encapsulation resin described herein may be included in both the light absorbing layer and the moisture barrier layer.
  • the encapsulation resin may be solid or semi-solid, preferably solid at room temperature.
  • the fact that the resin is solid or semi-solid at room temperature means that the resin does not exhibit fluidity at room temperature.
  • the term solid or semi-solid at room temperature herein may mean that the viscosity at room temperature of the object is about 10 6 poise or more or about 10 7 poise or more.
  • the viscosity is measured at 5% strain and 1Hz frequency condition using ARES (Advanced Rheometric Expansion System).
  • the sealing resin When the sealing resin is solid or semisolid at room temperature, the film or sheet shape can be maintained even in an uncured state. Accordingly, in the encapsulation or encapsulation process of the organic electronic device using the encapsulation film, physical or chemical damage may be prevented from being applied to the device, and the process may be smoothly performed. In addition, during the encapsulation or encapsulation process of the organic electronic device, it is possible to prevent bubbles from mixing or deteriorating the life of the device.
  • the upper limit of the viscosity of the encapsulating resin is not particularly limited, and can be controlled in the range of about 10 9 poise or less, for example, in consideration of processability and the like.
  • the encapsulating resin may be acrylic resin, epoxy resin, silicone resin, fluorine resin, styrene resin, polyolefin resin, thermoplastic elastomer, polyoxyalkylene resin, polyester resin, polyvinyl chloride resin, polycarbonate resin, polyphenylene Sulfide resins, polyamide resins or mixtures thereof and the like can be exemplified.
  • styrene resin for example, styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), acrylonitrile-butadiene-styrene block copolymer (ABS) , Acrylonitrile-styrene-acrylate block copolymers (ASA), styrene-butadiene-styrene block copolymers (SBS), styrene-based homopolymers or mixtures thereof.
  • SEBS styrene-ethylene-butadiene-styrene block copolymer
  • SIS styrene-isoprene-styrene block copolymer
  • ABS acrylonitrile-butadiene-styrene block copolymer
  • ASA Acrylonitrile-styrene-acrylate block
  • the olefin resin for example, a high density polyethylene resin, a low density polyethylene resin, a polypropylene resin or a mixture thereof can be exemplified.
  • the thermoplastic elastomer for example, an ester thermoplastic elastomer, an olefin thermoplastic elastomer, a mixture thereof, or the like can be used.
  • polybutadiene resin or polyisobutylene resin may be used as the olefinic thermoplastic elastomer.
  • the polyoxyalkylene resins include polyoxymethylene resins, polyoxyethylene resins, mixtures thereof, and the like.
  • polyester resins examples include polyethylene terephthalate resins, polybutylene terephthalate resins, and mixtures thereof.
  • polyvinyl chloride resin polyvinylidene chloride etc. can be illustrated, for example.
  • a mixture of hydrocarbon resins may be included, for example, hexatriacotane or paraffin may be exemplified.
  • polyamide resin nylon etc. can be illustrated, for example.
  • acrylate resin polybutyl (meth) acrylate etc. can be illustrated, for example.
  • silicone resin polydimethylsiloxane etc. can be illustrated, for example.
  • polytrifluoroethylene resin polytetrafluoroethylene resin, polychlorotrifluoroethylene resin, polyhexafluoropropylene resin, polyvinylidene fluoride, polyvinylidene fluoride, polyfluoro Ethylene propylene propylene or mixtures thereof and the like can be exemplified.
  • the above-listed resins may be used, for example, by grafting with maleic anhydride, or the like, or may be used after being copolymerized with other listed resins or monomers for preparing the resins, or may be modified with other compounds.
  • the other compounds include carboxyl-terminated butadiene-acrylonitrile copolymers.
  • the encapsulation resin of the encapsulation composition may include polyisobutylene-based resin.
  • the polyisobutylene resin may have hydrophobicity to exhibit low water vapor permeability and low surface energy.
  • polyisobutylene resin For example, homopolymer of isobutylene monomer; Or the copolymer which copolymerized the isobutylene monomer and the other monomer which can superpose
  • the other monomers polymerizable with the isobutylene monomer may include, for example, 1-butene, 2-butene, isoprene or butadiene.
  • the copolymer may be butyl rubber.
  • a base resin having a weight average molecular weight (Mw) that can be molded into a film shape may be used.
  • Mw weight average molecular weight
  • the weight average molecular weight may be about 100,000 to 2 million, 100,000 to 1.5 million, or 100,000 to 1 million.
  • weight average molecular weight means a conversion value with respect to standard polystyrene measured by gel permeation chromatography (GPC).
  • 1 type may be used among the structures mentioned above, and 2 or more types may be used.
  • 2 or more types 2 or more types of resin from a different kind may be used, 2 or more types of resin from which a weight average molecular weight differs, or 2 or more types of resin from a both type and weight average molecular weight may be used.
  • the encapsulation resin according to the invention can be a curable resin.
  • the specific kind of curable resin that can be used in the present invention is not particularly limited, and various thermosetting or photocurable resins known in the art may be used.
  • the term "thermosetting resin” means a resin that can be cured through an appropriate heat application or aging process
  • the term "photocurable resin” means a resin that can be cured by irradiation of electromagnetic waves.
  • the curable resin may be a dual curable resin including both thermosetting and photocuring properties.
  • the curable resin of the present invention constitutes an encapsulation composition together with a light absorbing material described below, the curable resin may be preferably a thermosetting resin, and photocurable resin may be excluded, but is not limited thereto.
  • curable resin in this invention will not be restrict
  • it may be cured to exhibit adhesive properties, and may include one or more thermosetting functional groups such as glycidyl group, isocyanate group, hydroxy group, carboxyl group or amide group, or may be an epoxide group or a cyclic ether. and resins containing at least one functional group curable by irradiation of electromagnetic waves such as a (cyclic ether) group, a sulfide group, an acetal group, or a lactone group.
  • specific types of the resin may include an acrylic resin, a polyester resin, an isocyanate resin, an epoxy resin, and the like, but is not limited thereto.
  • the curable resin aromatic or aliphatic; Or an epoxy resin of linear or branched chain type can be used.
  • an epoxy resin having an epoxy equivalent of 180 g / eq to 1,000 g / eq may be used as containing two or more functional groups.
  • an epoxy resin having an epoxy equivalent in the above range it is possible to effectively maintain properties such as adhesion performance and glass transition temperature of the cured product.
  • examples of such epoxy resins include cresol novolac epoxy resins, bisphenol A epoxy resins, bisphenol A novolac epoxy resins, phenol novolac epoxy resins, tetrafunctional epoxy resins, biphenyl epoxy resins, and triphenol methane types.
  • an epoxy resin containing a cyclic structure in a molecular structure can be used as the curable resin, and an epoxy resin containing an aromatic group (for example, a phenyl group) can be used.
  • an epoxy resin containing an aromatic group for example, a phenyl group
  • the cured product may have excellent thermal and chemical stability while exhibiting low moisture absorption, thereby improving reliability of the organic electronic device encapsulation structure.
  • aromatic group-containing epoxy resin examples include biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene modified phenol type epoxy resin, cresol type epoxy resin, Bisphenol-based epoxy resins, xylox-based epoxy resins, polyfunctional epoxy resins, phenol novolac epoxy resins, triphenol methane-type epoxy resins and alkyl-modified triphenol methane epoxy resins, such as one or a mixture of two or more, but is not limited thereto. no.
  • a silane-modified epoxy resin or a silane-modified epoxy resin having an aromatic group can be used as the epoxy resin.
  • an epoxy resin modified with silane and structurally having a silane group is used, the adhesion of the organic electronic device to the glass substrate or the substrate inorganic material can be maximized, and the moisture barrier property, durability and reliability can be improved.
  • the specific kind of the above epoxy resin that can be used in the present invention is not particularly limited, and such a resin can be easily obtained from a place of purchase such as, for example, National Chemical.
  • absorbing material may mean a material capable of absorbing visible light, and examples thereof include a pigment or a dye.
  • the light absorbing material may be a nonconductive material.
  • the encapsulation composition including the light absorbing material is manufactured in the form of a film and applied to the encapsulation of the organic electronic device, if the film becomes electrically conductive, it causes an abnormality in driving the organic electronic device.
  • the light absorbing material may preferably be a nonconductive material.
  • the light absorbing material is not particularly limited as described above, but for example, a pigment or a dye can be used.
  • the light absorbing material is not particularly limited as long as it is a material capable of absorbing a radio wave field or a specific wavelength band, for example, carbon black, carbon nanotubes, florene (C6), phthalocyanine derivatives, porphyrin derivatives, triphenyl Amine derivatives, zinc sulfur, cadmium yellow, chromium yellow, yellow iron oxide, photoluminescence, red iron oxide, cadmium red, cobalt blue, bluish blue or mixtures thereof.
  • the light absorbing material is 0.6 parts by weight, 0.6 to 50 parts by weight, 0.6 to 48 parts by weight, 0.7 to 45 parts by weight, 0.8 to 43 parts by weight, 0.9 to 42 parts by weight based on 100 parts by weight of the encapsulating resin. Or 0.9 to 41 parts by weight.
  • the light absorbing material may be adjusted to absorb a light source in a specific wavelength band as needed.
  • the light absorbing layer or the moisture barrier of the encapsulation film of the present invention may contain a moisture adsorbent as necessary.
  • moisture adsorbent may be used as a generic term for components that can adsorb or remove moisture or moisture introduced from the outside through physical or chemical reactions. That is, it means a moisture reactive adsorbent or a physical adsorbent, and mixtures thereof may also be used.
  • the moisture reactive adsorbent chemically reacts with moisture, moisture, or oxygen introduced into the encapsulation film to adsorb moisture or moisture.
  • the physical adsorbent can inhibit the penetration by lengthening the movement path of moisture or moisture that penetrates into the encapsulation structure, and maximizes the barrier to moisture and moisture through interaction with the matrix structure of the encapsulating resin and the water reactive adsorbent. can do.
  • the specific kind of water adsorbent that can be used in the present invention is not particularly limited.
  • metal powder such as alumina, metal oxide, metal salt or phosphorus pentoxide (P 2 O 5 ), or the like
  • P 2 O 5 phosphorus pentoxide
  • the physical adsorbent include silica, zeolite, titania, zirconia, montmorillonite, and the like.
  • the metal oxides include lithium oxide (Li 2 O), sodium oxide (Na 2 O), barium oxide (BaO), calcium oxide (CaO), magnesium oxide (MgO), and the like.
  • Examples include lithium sulfate (Li 2 SO 4 ), sodium sulfate (Na 2 SO 4 ), calcium sulfate (CaSO 4 ), magnesium sulfate (MgSO 4 ), cobalt sulfate (CoSO 4 ), gallium sulfate (Ga 2 (SO 4 ) 3 ), sulfates such as titanium sulfate (Ti (SO 4 ) 2 ) or nickel sulfate (NiSO 4 ), etc., calcium chloride (CaCl 2 ), magnesium chloride (MgCl 2 ), strontium chloride (SrCl 2 ), yttrium chloride (YCl 3 ) , Copper chloride (CuCl 2 ), cesium fluoride (CsF), tantalum flu
  • a water adsorbent such as the metal oxide can be blended into the composition in a state of being properly processed.
  • the encapsulation film prepared by using the encapsulation composition described above in the form of a film may be formed into a thin film having a thickness of 30 ⁇ m or less according to the type of organic electronic device to be applied, and in this case, a grinding step of a moisture absorbent is required.
  • a process such as a three roll mill, bead mill or ball mill may be used.
  • the light absorbing layer or the moisture preventing layer of the encapsulation film of the present invention is a water adsorbent, based on 100 parts by weight of the encapsulating resin, 0 to 100 parts by weight, 1 to 90 parts by weight, 5 to 80 parts by weight or 10 to 60 parts by weight. It can be included in negative amounts.
  • the moisture adsorbent may not be included as an optional component, but preferably, by controlling the content of the moisture adsorbent to 5 parts by weight or more, the cured product may exhibit excellent moisture and moisture barrier properties. In addition, by controlling the content of the moisture adsorbent to 100 parts by weight or less, while forming the sealing structure of the thin film, it is possible to exhibit excellent moisture barrier properties.
  • a unit “weight part” means the weight ratio between each component.
  • the moisture adsorbent may be appropriately controlled according to the structure of encapsulating the organic electronic device.
  • the layer in contact with the organic electronic device may include 0 to 20% of the water absorbent based on the total mass of the water absorbent in the encapsulation film.
  • the moisture barrier layer 6 positioned below the two moisture barrier layers 4 and 6 when the moisture barrier layer 6 positioned below the two moisture barrier layers 4 and 6 is in contact with the element at the time of encapsulation of the organic electronic device, 6) may include 0 to 20% of the water absorbent based on the total weight of the water absorbent, the upper moisture barrier layer (4) does not contact the organic electronic device 80 to 100% based on the total weight of the water absorbent. May contain a moisture adsorbent.
  • the light absorption layer or the moisture prevention layer of the sealing film of this invention can contain a filler, Preferably an inorganic filler is needed.
  • the filler can suppress the penetration by lengthening the movement path of moisture or moisture that penetrates into the encapsulation structure, and can maximize the barrier to moisture and moisture through interaction with the matrix structure of the encapsulating resin and the moisture absorbent.
  • the specific kind of filler that can be used in the present invention is not particularly limited, and for example, one kind or a mixture of two or more kinds such as clay, talc or silica can be used.
  • a product surface-treated with an organic material may be used as the filler, or a coupling agent may be additionally added.
  • the light absorbing layer or the moisture prevention layer of the encapsulation film of the present invention may include a filler in an amount of 0 to 50 parts by weight, 1 to 40 parts by weight, or 1 to 20 parts by weight with respect to 100 parts by weight of the encapsulation resin. .
  • the filler may not be included in the encapsulation film as an optional component, but preferably controlled to 1 part by weight or more, to provide an encapsulation structure having excellent moisture or moisture barrier properties and mechanical properties.
  • by controlling the filler content to 50 parts by weight or less in the present invention it is possible to manufacture a film form, it is possible to provide a cured product exhibiting excellent moisture barrier properties even when formed into a thin film.
  • the term "encapsulation structure” may mean the encapsulation film of the above-described single layer or multilayer structure, and furthermore, the organic electronic device encapsulation product including an encapsulation film and an organic electronic device encapsulating the entire surface of the organic electronic device. Can mean.
  • the encapsulation film may further include a dispersant such that a light absorbing material or a moisture absorbent may be uniformly dispersed.
  • a dispersant such that a light absorbing material or a moisture absorbent may be uniformly dispersed.
  • a nonionic surfactant having affinity with the surface of the light absorbing material and having good compatibility with the encapsulating resin can be used.
  • the light absorbing layer or the moisture barrier of the encapsulation film may further include a curing agent, depending on the type of encapsulation resin.
  • a curing agent capable of reacting with the above-mentioned encapsulating resin to form a crosslinked structure or the like or an initiator capable of initiating a curing reaction of the resin.
  • An appropriate kind can be selected and used according to the kind of sealing resin or the functional group contained in the resin for a hardening
  • the curing agent is a curing agent of an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent.
  • an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent.
  • One kind or more than one kind may be used, but is not limited thereto.
  • the curing agent may be an imidazole compound which is solid at room temperature and has a melting point or decomposition temperature of 80 ° C. or higher.
  • an imidazole compound which is solid at room temperature and has a melting point or decomposition temperature of 80 ° C. or higher.
  • the content of the curing agent may be selected according to the composition of the composition, for example, the type or proportion of the encapsulating resin.
  • the curing agent may include 1 part by weight to 20 parts by weight, 1 part by weight to 10 parts by weight, or 1 part by weight to 5 parts by weight, based on 100 parts by weight of the encapsulating resin.
  • the weight ratio may be changed depending on the type and ratio of the encapsulating resin or functional group of the resin, or the crosslinking density to be implemented.
  • the sealing resin is a resin which can be cured by irradiation of active energy rays
  • the initiator for example, a cationic photopolymerization initiator can be used.
  • an onium salt or an organometallic salt-based ionizing cation initiator or an organosilane or a latent sulfuric acid-based or non-ionized cationic photopolymerization initiator may be used.
  • the onium salt-based initiator include a diaryliodonium salt, a triarylsulfonium salt, an aryldiazonium salt, and the like.
  • the zero, iron arene and the like can be exemplified.
  • the organosilane-based initiator include o-nitrobenzyl triaryl silyl ether and triaryl silyl peroxide.
  • the latent sulfuric acid-based initiator may be exemplified by ⁇ -sulfonyloxy ketone or ⁇ -hydroxymethylbenzoin sulfonate and the like, but is not limited thereto. .
  • an ionized cationic photopolymerization initiator may be used as the cationic initiator.
  • sealing resin is resin which can be bridge
  • an initiator a radical initiator can be used, for example.
  • the radical initiator may be a photoinitiator or a thermal initiator.
  • Specific types of photoinitiators may be appropriately selected in consideration of the curing rate and the possibility of yellowing. For example, a benzoin type, a hydroxy ketone type, an amino ketone type, or a phosphine oxide type photoinitiator etc.
  • benzoin benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether , Benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2 -Hydroxy-2-methyl-1-phenylpropane-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propane-1- On, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-
  • the content of the initiator may be changed according to the type and ratio of the encapsulating resin or the functional group of the resin, or the crosslinking density to be implemented, as in the case of the curing agent.
  • the initiator may be blended in an amount of 0.01 to 10 parts by weight or 0.1 to 3 parts by weight with respect to 100 parts by weight of the encapsulating resin.
  • the light absorbing layer or the moisture barrier of the encapsulation film of the present invention may further include a high molecular weight resin.
  • the high molecular weight resin may serve to improve moldability, for example, when molding the encapsulation composition of the present invention into a film or sheet shape.
  • it may serve as a high temperature viscosity regulator to control the flowability.
  • the kind of high molecular weight resin that can be used in the present invention is not particularly limited as long as it has compatibility with other components such as the encapsulating resin.
  • Specific examples of high molecular weight resins that can be used are resins having a weight average molecular weight of 20,000 or more, such as phenoxy resins, acrylate resins, high molecular weight epoxy resins, ultra high molecular weight epoxy resins, high polarity functional group-containing rubbers and high One kind or a mixture of two or more kinds such as a high polarity functional group-containing reactive rubber, but is not limited thereto.
  • the content is not particularly limited to be adjusted according to the desired physical properties.
  • the high molecular weight resin may be included in an amount of about 200 parts by weight or less, preferably 150 parts by weight or less, and more preferably about 100 parts by weight or less based on 100 parts by weight of the encapsulation resin.
  • the content of the high molecular weight resin is controlled to 200 parts by weight or less, effectively maintaining compatibility with each component of the resin composition, and may also serve as an adhesive.
  • the encapsulation composition constituting the light absorbing layer or the moisture barrier layer according to the present invention
  • various additives may be used depending on the use, the type of encapsulation resin, and the manufacturing process of the encapsulation film described below, in a range that does not affect the effects of the invention described above. May be included.
  • the encapsulation composition may include a coupling agent, a crosslinking agent, a curable material, a tackifier, an ultraviolet stabilizer, an antioxidant, or the like in an appropriate range of contents depending on the desired physical properties.
  • the curable material may mean a material having a thermosetting functional group and / or an active energy ray curable functional group which are separately included in addition to the components constituting the encapsulation composition described above.
  • a functional group capable of participating in a polymerization reaction by irradiation of an active energy ray such as a functional group including an ethylenically unsaturated double bond such as acryloyl group or methacryloyl group, a functional group such as an epoxy group or an oxetane group It may mean a compound containing two or more.
  • the encapsulation film may further include a metal layer in addition to the light absorbing layer or the moisture barrier layer.
  • the metal layer may be transparent and opaque.
  • the metal layer may be a metal deposited on a thin metal foil (Metal foil) or a polymer substrate film.
  • the metal layer may be used without limitation as long as it has a thermal conductivity and a material having moisture barrier property.
  • the metal layer may comprise any one of metals, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof.
  • the metal layer may include an alloy in which one or more metal elements or nonmetal elements are added to one metal, and may include, for example, an iron-nickel alloy or stainless steel (SUS).
  • the metal layer may include copper, aluminum, nickel, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, tin indium, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof.
  • the metal layer may be deposited by electrolytic, rolling, heat evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma chemical vapor deposition or electron cyclotron resonance source plasma chemical vapor deposition means.
  • the metal layer may be deposited by reactive sputtering.
  • the encapsulation film including the metal layer may prevent the external light from being reflected or scattered at the portion where the wiring or the like of the organic electronic device is not deposited by the metal layer through the light absorption region. have.
  • the reflectance of the metal layer may be 15% to 90%, 18% to 88% or 20% to 86% in Specular Component Included (SCI).
  • the reflectance of the metal layer may be 15% to 80%, 18% to 75%, 20% to 70% or 20% to 65% in Specular Component Excluded (SCE).
  • SCI means total reflectance
  • SCE means diffuse reflectance by scattering.
  • the reflectance can be measured by a method known in the art, for example, it can be measured using CM2006d of Konika minolta (measurement conditions: M / I + E, M / SCI, M / SCE, S / Setting value of any one of I + E, S / SCI and S / SCE, setting value of any one of UV 0% to 100%, D65, D50, C, A, F2, F6, F7, F8, F10, F11 And a light source of any one of F12, viewing field of 10 ° or 2 °.
  • Konika minolta measurement conditions: M / I + E, M / SCI, M / SCE, S / Setting value of any one of I + E, S / SCI and S / SCE, setting value of any one of UV 0% to 100%, D65, D50, C, A, F2, F6, F7, F8, F10, F11 And a light source of any one of F12, viewing field of 10 ° or
  • the encapsulation film of the present invention includes a metal layer
  • the light absorbing layer includes a moisture adsorbent or a filler
  • the water blocking layer includes a water adsorbent or a filler
  • the light absorbing layer or the moisture blocking layer serves as an intermediate layer for scattering light, and thus is formed on one surface of the organic electronic device. The effect of reducing the reflectance of the polarizer to be reduced is reduced, whereby the part without the metal wiring is cloudyly recognized.
  • the encapsulation film including the metal layer may prevent the external light from being reflected or scattered at the portion where the wiring or the like of the organic electronic device is not deposited by the metal layer through the light absorption region.
  • the metal layer is 50 W / mK or more, 60 W / mK or more, 70 W / mK or more, 80 W / mK or more, 90 W / mK or more, 100 W / mK or more, 110 W / mK or more, 120 W / mK or more, 130 W / mK or more, 140 W / mK or more, 150 W / mK or more, 200 W / mK or more, or 250 W / mK or more.
  • the high thermal conductivity By having such high thermal conductivity, it is possible to release heat generated at the bonding interface more quickly during the metal layer bonding process. In addition, the high thermal conductivity quickly releases heat accumulated during the operation of the organic electronic device to the outside, thereby keeping the temperature of the organic electronic device itself lower and reducing the occurrence of cracks and defects.
  • thermal conductivity is a degree indicating the ability of a material to transfer heat by conduction, and a unit may be represented by W / mK.
  • the unit represents the degree of heat transfer of the material at the same temperature and distance, and means the unit of heat (watt) with respect to the unit of distance (meter) and the unit of temperature (Kelvin).
  • the structure of the sealing film of this invention is not specifically limited, For example, a base film or a release film (henceforth a "first film” may be called.); And the light absorbing layer or the moisture barrier layer formed on the base film or the release film.
  • the sealing film of this invention may further contain the base film or release film (henceforth a "second film” may be called.) Formed on the said light absorption layer or a moisture prevention layer.
  • the specific kind of the said 1st film which can be used by this invention is not specifically limited.
  • a general polymer film of this field can be used as the first film.
  • Ethylene-vinyl acetate film, ethylene-propylene copolymer film, ethylene-ethyl acrylate copolymer film, ethylene-methyl acrylate copolymer film, polyimide film and the like can be used.
  • an appropriate release treatment may be performed on one side or both sides of the base film or the release film of the present invention.
  • Alkyd-based, silicone-based, fluorine-based, unsaturated ester-based, polyolefin-based, or wax-based may be used as an example of the release agent used in the release treatment of the base film, and among these, it is preferable to use an alkyd-based, silicone-based, or fluorine-based release agent in terms of heat resistance. Preferred, but not limited to.
  • the kind of 2nd film (Hereinafter, a "cover film” may be called.) Which can be used by this invention is not specifically limited, either.
  • the second film the same or different kind as the first film can be used within the range exemplified in the above-described first film.
  • an appropriate release treatment may also be performed on the second film.
  • the thickness of the base film or the release film (first film) as described above is not particularly limited and may be appropriately selected depending on the application to be applied.
  • the thickness of the first film may be about 10 ⁇ m to 500 ⁇ m, preferably about 20 ⁇ m to 200 ⁇ m. If the thickness is less than 10 ⁇ m, deformation of the base film may occur easily during the manufacturing process. If the thickness is more than 500 ⁇ m, the economy is inferior.
  • the thickness of the second film in the present invention is also not particularly limited. In this invention, you may set the thickness of the said 2nd film similarly to a 1st film, for example. In the present invention, the thickness of the second film can also be set relatively thinner than the first film in consideration of processability and the like.
  • the thickness of the light absorbing layer or the moisture barrier layer included in the sealing film of the present invention is not particularly limited and may be appropriately selected according to the following conditions in consideration of the use to which the film is applied.
  • the light absorbing layer or moisture barrier layer included in the encapsulation film of the present invention may have a thickness of about 5 ⁇ m to 200 ⁇ m, preferably about 10 ⁇ m to 150 ⁇ m.
  • the method of manufacturing such a sealing film is not specifically limited. For example, a first step of coating a coating liquid containing the above-described sealing composition on a base film or a release film; And a second step of drying the coating solution coated in the first step.
  • each light absorbing layer or the moisture barrier layer is not particularly limited.
  • a light absorbing layer or a moisture barrier layer formed on a separate release film may be laminated to each other to form a sealing film having a multi-layer structure, or a moisture barrier layer may be directly formed on the light absorbing layer, or vice versa.
  • a third step of additionally compressing the base film or the release film on the coating liquid dried in the second step may be further performed.
  • the first step of the present invention is to prepare a coating solution by dissolving or dispersing the above-described encapsulation composition in a suitable solvent.
  • the content of the encapsulating resin and the like contained in the coating liquid may be appropriately controlled according to the desired water barrier property and the film formability.
  • the kind of the solvent used for preparing the coating liquid is not particularly limited.
  • the drying time of the solvent is too long or when drying at a high temperature is required, problems may occur in terms of workability or durability of the encapsulation film, and it is preferable to use a solvent having a volatilization temperature of 100 ° C. or less.
  • a small amount of a solvent having a volatilization temperature of the above range or more can be mixed and used.
  • solvent examples include methyl ethyl ketone (MEK), acetone, toluene, dimethylformamide (DMF), methyl cellosolve (MCS), tetrahydrofuran (THF) or N-methylpyrrolidone (NMP) and the like or a mixture of two or more thereof may be mentioned, but is not limited thereto.
  • MEK methyl ethyl ketone
  • DMF dimethylformamide
  • MCS methyl cellosolve
  • THF tetrahydrofuran
  • NMP N-methylpyrrolidone
  • the method of applying the coating liquid to the base film or the release film in the first step of the present invention is not particularly limited, for example, knife coat, roll coat, spray coat, gravure coat, curtain coat, comma coat or lip Known methods such as coats and the like can be used without limitation.
  • the second step of the present invention is to dry the coating solution coated in the first step, to form a light absorbing layer or a moisture barrier. That is, in the second step of the present invention, a light absorbing layer or a moisture barrier layer can be formed by heating and removing the solvent by heating the coating liquid applied to the film.
  • the drying conditions are not particularly limited, for example, the drying may be performed for 1 to 10 minutes at a temperature of 70 °C to 200 °C.
  • the 3rd step of crimping an additional base film or a release film on the light absorbing layer or moisture prevention layer formed on the film may further be performed.
  • the third step of the present invention is carried out by coating an additional release film or base film (cover film or second film) on the dried light absorbing layer or the moisture barrier layer by coating the film, followed by pressing by a hot roll laminate or pressing process.
  • an additional release film or base film cover film or second film
  • the present invention as shown in Figure 9, the substrate 21;
  • An organic electronic device (23) comprising a transparent electrode layer on the substrate, an organic layer on the transparent electrode layer and including at least a light emitting layer and a reflective electrode layer on the organic layer;
  • an encapsulation film 1 encapsulating the entire surface of the organic electronic device 23 and having an absorption region in which the L * value is in a range of 0 to 50 in the CIE LAB color space.
  • the organic layer may be formed in various structures further including other various functional layers known in the art, as long as it includes a light emitting layer.
  • Examples of the layer that may be included in the organic layer may include an electron injection layer, a hole blocking layer, an electron transport layer, a hole transport layer, a hole injection layer, and the like.
  • a hole or electron injection electrode layer and an organic layer for example, a light emitting layer, an electron injection or transport layer, a hole injection or transport layer, and a method of forming the same are known and can be used without limitation.
  • the organic electronic device 23 may be an organic light emitting diode.
  • the organic electronic device according to the present invention may be a bottom emission type.
  • the organic electronic device may further include a protective film protecting the organic electronic device between the encapsulation film and the organic electronic device.
  • the organic electronic device may include an encapsulation film further including a metal layer, in which case a cover substrate to be described later may be omitted.
  • the applying of the encapsulation film to the organic electronic device may be performed by hot roll lamination, hot pressing, or vacuum compression of the encapsulation film, and is not particularly limited.
  • the applying of the encapsulation film to the organic electronic device may be performed at a temperature of 50 ° C. to 90 ° C., followed by a curing step, which may be heated to a temperature range of 70 ° C. to 110 ° C. or irradiated with UV. Can be done.
  • FIG. 9 is a cross-sectional view illustrating an organic electronic device according to one example of the present invention.
  • a transparent electrode is formed on a substrate 21 such as glass or a film by vacuum deposition or sputtering, and an organic material layer is formed on the transparent electrode.
  • the organic material layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer and / or an electron transport layer.
  • a second electrode is further formed on the organic material layer. Then, the above-described encapsulation film 1 is applied to cover all of the organic electronic device 23 on the organic electronic device 23 on the substrate 21.
  • a method of applying the encapsulation film 1 is not particularly limited, and for example, the encapsulation film 1 of the present invention is transferred in advance to the upper portion of the organic electronic device 23 formed on the substrate 21.
  • the cover substrate (ex. Glass or polymer film) 22 may be applied by heating, pressing, autoclave or the like.
  • the above step for example, when transferring the encapsulation film 1 on the cover substrate 22, using the encapsulation film 1 of the present invention described above, after peeling off the substrate or release film formed on the film While applying heat, it is possible to transfer onto the cover substrate 22 using a vacuum press or a vacuum laminator or the like.
  • the adhesion or adhesion of the encapsulation film 1 may decrease, so that the process temperature is controlled to about 100 ° C. or less and the process time is within 5 minutes. It is desirable to.
  • a vacuum press or a vacuum laminator may be used even when the cover substrate 22 to which the encapsulation film 1 is transferred is heat-compressed to the organic electronic device 23.
  • the temperature conditions at this stage can be set as described above, and the process time is preferably within 10 minutes.
  • an additional curing process may be performed on the encapsulation film on which the organic electronic device is pressed.
  • This curing process (main curing) may be performed in, for example, a heating chamber or a UV chamber, and preferably, heating. It can proceed in the chamber. Conditions in the present curing may be appropriately selected in consideration of the stability of the organic electronic device.
  • the above-described manufacturing process is only one example for encapsulating the organic electronic device of the present invention, and the process sequence or process conditions may be freely modified.
  • the present invention transfers the sealing film 1 of the present invention to the organic electronic device 23 on the substrate 21 first, and then compresses the cover substrate 22 in the order of the transfer and the pressing process. You can change it in a way.
  • the protective layer may be formed on the organic electronic device 23, the encapsulation film may be applied, and then the cover substrate 22 may be omitted and cured.
  • the organic electronic device When the organic electronic device is encapsulated using the encapsulation film according to the embodiments of the present invention, the organic electronic device not only realizes excellent moisture blocking properties but also absorbs and blocks light from inside or outside to prevent reflection or scattering of light. Appearance defects of the device can be prevented.
  • 1 to 4 are cross-sectional views showing an encapsulation film according to one example of the present invention.
  • 5 to 8 are plan views showing encapsulation films according to one example of the present invention.
  • FIG. 9 is a cross-sectional view illustrating an organic electronic device according to one example of the present invention.
  • Carbon black (# 2600 Mitsubishi carbon black) having a primary particle size of about 20 nm or less as a light absorbing material was added to MEK as a solvent at a concentration of 10% by weight of solid to prepare a carbon black dispersion. Meanwhile, 100 g of calcined dolomite as a water adsorbent and MEK as a solvent were added at a concentration of 50% by weight of solid content to prepare a water adsorbent solution.
  • the water adsorbent solution prepared in advance was added to the solution so that the content of calcined dolomite was 50 parts by weight relative to 100 parts by weight of the encapsulating resin of the light absorbing layer, and the carbon black dispersion was 10 parts by weight based on 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • the light absorbing layer solution was prepared by adding as much as possible and mixing.
  • the solution of the said light absorbing layer was apply
  • An encapsulation film was prepared in the same manner as in Example 1 except that the carbon black dispersion was added so that the carbon black content was 3 parts by weight based on 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • An encapsulation film was prepared in the same manner as in Example 1 except that the carbon black dispersion was added so that the carbon black content was 1.5 parts by weight based on 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • An encapsulation film was prepared in the same manner as in Example 1 except that the carbon black dispersion was added so that the carbon black content was 1 part by weight based on 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • An encapsulation film was prepared in the same manner as in Example 1 except that the carbon black dispersion was added so that the carbon black content was 40 parts by weight based on 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • Carbon black (# 2600 Mitsubishi carbon black) having a primary particle size of about 20 nm or less as a light absorbing material was added to MEK as a solvent at a concentration of 10% by weight of solid to prepare a carbon black dispersion.
  • a silane-modified epoxy resin KSR-177, Kukdo Chemical
  • 150 g of a phenoxy resin YP-50, Kyodo Chemical
  • 4 g of imidazole Shikoku Chemical
  • the water adsorbent solution prepared in advance in the solution was added so that the content of calcined dolomite was 50 parts by weight relative to 100 parts by weight of the encapsulating resin of the moisture barrier layer.
  • the solution of the moisture barrier layer was applied to the release surface of the release PET and dried at 130 ° C. for 3 minutes to form a moisture barrier layer having a thickness of 20 ⁇ m.
  • the solution of the light absorbing layer was applied to the release surface of the release PET, dried at 130 ° C. for 3 minutes to form a light absorbing layer having a thickness of 10 ⁇ m.
  • the moisture barrier layer and the light absorbing layer were laminated to prepare a sealing film having a moisture barrier layer and a light absorbing layer two-layer structure.
  • the solution of the moisture barrier layer prepared in Example 6 was applied to the mold release surface of the release PET, and dried at 130 ° C. for 3 minutes to form a moisture barrier layer having a thickness of 20 ⁇ m.
  • the solution of the light absorbing layer of Example 6 was applied to the release surface of the release PET, dried at 130 ° C. for 3 minutes to form a light absorbing layer having a thickness of 5 ⁇ m.
  • the moisture barrier layer and the light absorbing layer were laminated in a three-layer structure of a light absorbing layer / moisture preventing layer / light absorbing layer to prepare an encapsulation film.
  • An encapsulation film was prepared in the same manner as in Example 1 except that the carbon black dispersion was added so that the carbon black content was 0.5 part by weight based on 100 parts by weight of the encapsulating resin of the light absorbing layer.
  • An encapsulation film was prepared in the same manner as in Example 1 except that the carbon black dispersion was not added.
  • the light transmittance at 550 nm was measured using the UV-Vis Spectrometer for the light absorption region of the film prepared above.
  • the light transmittance was measured in the thickness direction with respect to the light absorption region of the light absorbing layer in the case of a single layer, and in the thickness direction with respect to the light absorption region in the state where a plurality of layers were laminated in the case of a multilayer structure.
  • the encapsulation films prepared according to the Examples and Comparative Examples are applied to the entire surface of the organic electronic device formed on the glass to manufacture the organic electronic device and to connect the metal wires.
  • a transparent electrode is formed on the glass by a vacuum deposition method, and an organic material layer is formed on the transparent electrode.
  • the organic material layer includes a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer and an electron transport layer.
  • a reflective electrode is further formed on the organic material layer.
  • the encapsulation films of Examples and Comparative Examples are applied to cover all of the organic electronic devices (transparent electrodes, reflective electrodes and organic material layers) on the organic electronic devices on the glass (removal of release PET).
  • the encapsulation film is 58.32% of one side (shiny side) and 20.7% of the other side (rough side) in a 20 ⁇ m thick copper film (Specular Component Included (SCI)).
  • SCI Standard Component Included
  • one side (shiny side) of the copper film is 45.59% and the other side (rough side) is 20.02%) and the encapsulation film is laminated on one side of the light absorbing layer and / or the moisture barrier layer. to be.
  • the organic electronic device When the organic electronic device is placed in front of a white background and viewed from a distance of about 1 m (roughness of 150 lux or more), depending on whether the wiring is visually visible, O is visually visible and X is not visible.
  • L * according to CIE LAB was measured in accordance with JIS-K-7105 using a COH400 instrument (light source D65) manufactured by NIPPON DENSHOKU Co., Ltd. for the light absorption region of the film prepared above.
  • the L * value was measured for the light absorbing region of the light absorbing layer in the case of a single layer, and for the light absorbing region in the state of stacking a plurality of layers in the case of a multilayer structure.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un film d'encapsulation, un dispositif électronique organique comprenant celui-ci, et un procédé de fabrication dudit dispositif électronique organique. Lorsqu'un dispositif électronique organique est encapsulé au moyen du film d'encapsulation, une excellente propriété d'étanchéité à l'eau est obtenue et il est en outre possible d'empêcher l'apparition d'un défaut externe du dispositif électronique organique par absorption et blocage de la lumière interne ou externe de sorte à empêcher la réflexion ou la diffusion de la lumière.
PCT/KR2015/001657 2014-02-18 2015-02-17 Film d'encapsulation et dispositif électronique organique comprenant celui-ci WO2015126174A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016550857A JP6775867B2 (ja) 2014-02-18 2015-02-17 封止フィルム及びこれを含む有機電子装置
US15/115,862 US10720600B2 (en) 2014-02-18 2015-02-17 Encapsulation film and organic electronic device including the same
CN201580009339.0A CN106030844B (zh) 2014-02-18 2015-02-17 包封薄膜以及含有该包封薄膜的有机电子器件
EP15751814.3A EP3109913A4 (fr) 2014-02-18 2015-02-17 Film d'encapsulation et dispositif électronique organique comprenant celui-ci

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KR20140018669 2014-02-18
KR10-2014-0018669 2014-02-18
KR1020140071989A KR20150097359A (ko) 2014-02-18 2014-06-13 봉지 필름 및 이를 포함하는 유기전자장치
KR10-2014-0071989 2014-06-13
KR1020140130495A KR20150097371A (ko) 2014-02-18 2014-09-29 봉지 필름 및 이를 포함하는 유기전자장치
KR10-2014-0130495 2014-09-29

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CN107619575A (zh) * 2016-07-13 2018-01-23 京瓷株式会社 光半导体用树脂组合物及其制造方法、以及光半导体装置

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KR102404648B1 (ko) * 2015-09-21 2022-05-31 엘지디스플레이 주식회사 표시장치
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