WO2014021687A1 - Film adhésif et procédé d'encapsulation d'un dispositif électronique organique utilisant le film - Google Patents

Film adhésif et procédé d'encapsulation d'un dispositif électronique organique utilisant le film Download PDF

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Publication number
WO2014021687A1
WO2014021687A1 PCT/KR2013/007013 KR2013007013W WO2014021687A1 WO 2014021687 A1 WO2014021687 A1 WO 2014021687A1 KR 2013007013 W KR2013007013 W KR 2013007013W WO 2014021687 A1 WO2014021687 A1 WO 2014021687A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
film
adhesive
organic electronic
electronic device
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PCT/KR2013/007013
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English (en)
Korean (ko)
Inventor
배경열
유현지
이승민
조윤경
장석기
심정섭
Original Assignee
주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN201380051906.XA priority Critical patent/CN104685018B/zh
Priority claimed from KR1020130092126A external-priority patent/KR101408603B1/ko
Publication of WO2014021687A1 publication Critical patent/WO2014021687A1/fr
Priority to US14/609,172 priority patent/US9343702B2/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an adhesive film and a method of encapsulating an organic electronic device using the same.
  • An organic electronic device refers to a device including an organic material layer that generates an exchange of electric charges using holes and electrons, and examples thereof include a photovoltaic device, a rectifier, Transmitters and organic light emitting diodes (OLEDs); and the like.
  • organic light emitting diodes have low power consumption, fast response speed, and are advantageous for thinning a display device or lighting, as compared with conventional light sources.
  • OLED has excellent space utilization, and is expected to be applied in various fields including various portable devices, monitors, notebooks, and TVs.
  • the conventional OLED encapsulation adhesive film is composed of a single layer between two release films, and has a problem in that the adhesion peeling property is very low.
  • the peeling failure rate of the adhesive film during the encapsulation process of the OLED increases. For example, peeling defects in which the lifting phenomenon of the adhesive film occurs during peeling of the protective film or the release film protecting the adhesive film are generated.
  • Embodiments of the present invention provide an adhesive film, an organic electronic device encapsulation product using the same, and a method of encapsulating an organic electronic device.
  • the present invention is a protective film; A first adhesive layer formed on the protective film; A second adhesive layer formed on the first adhesive layer; And a release film formed on the second adhesive layer, wherein the first adhesive layer and the second adhesive layer provide an adhesive film for sealing an organic electronic device satisfying the following general formula (1).
  • A represents the peel force between the first adhesive layer and the protective film
  • B represents the peel force between the second adhesive layer and the release film
  • C is the peel force between the first adhesive layer and the encapsulation substrate after the protective film is removed.
  • the present invention is a substrate; An organic electronic device formed on the substrate; And the adhesive film encapsulating the organic electronic device, wherein the adhesive film includes a first adhesive layer and a second adhesive layer.
  • FIG. 1 is a cross-sectional view showing an adhesive film according to one example of the present invention.
  • FIGS. 2 to 4 are cross-sectional views illustrating some processes of applying an adhesive film according to an example of the present invention to an organic electronic device encapsulation process.
  • Adhesive film is a protective film; A first adhesive layer formed on the protective film; A second adhesive layer formed on the first adhesive layer; And a release film formed on the second adhesive layer, wherein the first adhesive layer and the second adhesive layer satisfy the following general formula (1).
  • A represents the peel force between the first adhesive layer and the protective film
  • B represents the peel force between the second adhesive layer and the release film
  • C is the peel force between the first adhesive layer and the encapsulation substrate after the protective film is removed.
  • the first adhesive layer and the second adhesive layer may satisfy the following general formula (2).
  • first adhesive layer and the second adhesive layer may satisfy the following general formula (3).
  • the encapsulation substrate may be a glass or a polymer film, but is not limited thereto. Any encapsulation substrate may be used without limitation as long as it can encapsulate an adhesive film.
  • the adhesive film according to embodiments of the present invention may have various structures as long as the structure satisfies the above structure.
  • the protective film layer 1 and the curable adhesive layer 2 are sequentially formed from the bottom.
  • a release film layer 3 on the curable adhesive layer 2 wherein the curable adhesive layer 2 has a two-layer structure, and includes a first adhesive layer 2a and a second adhesive layer 2b.
  • the release film layer 3 is formed on the second adhesive layer 2b.
  • the method for allowing the adhesive layer 2 to have a multi-layer structure may be any method used in the art without limitation, provided that the adhesive layer 2 has a multi-layer structure.
  • the protective film layer (1) is formed to protect the curable adhesive layer (2) in the storage and transport step after the manufacture of the adhesive film, the release film layer (3) as a substrate in the manufacture of the curable adhesive layer (2) A film that is used and subsequently peeled off after being applied to an adherend. That is, when the adhesive film according to the embodiments of the present invention is ultimately applied to the encapsulation of the organic electronic device, the protective film layer 1 and the release film layer 3 are not included in the organic electronic device encapsulation product.
  • 2 to 4 are cross-sectional views illustrating some processes of applying an adhesive film according to an example of the present invention to an organic electronic device encapsulation process.
  • 2 to 4 are processes that take place in order.
  • the protective film layer 1 is peeled from the adhesive film at room temperature in order to use the adhesive film of the present invention for sealing an organic electronic device.
  • the first adhesive layer 2a in contact with the outside is attached to the encapsulation substrate 4, and the encapsulation substrate (for example, a hot-roll lamination process) is attached to the encapsulation substrate 4. 4) and increase the adhesive strength of the adhesive film.
  • the release film layer 3 on the opposite side of the adhesive film to which the encapsulation substrate is finally attached is peeled off, and the adhesive film is used for the sealing process of the organic electronic device.
  • the peel force between the first adhesive layer (2a) and the protective film layer (1) as shown in the general formula 1 (A) is lower than the peeling force B between the 2nd contact bonding layer 2b and the release film layer 3. Therefore, as shown in FIG. 2, it is possible to prevent the adhesive layer 2 from lifting at the interface with the release film layer 3 during the peeling process of the protective film layer from which the protective film layer 1 is removed.
  • the peeling force B between the second adhesive layer 2b and the release film layer 3 has a peeling force between the first adhesive layer 2a and the encapsulation substrate 4. Lower than (C). Therefore, after attaching the first adhesive layer 2a exposed to the outside after peeling off of the protective film layer 1 to the encapsulation substrate 4 as shown in FIG. 3, the adhesive film is adhered to the encapsulation substrate by a thermal bonding process. In the process of removing the release film layer 3 as illustrated in FIG. 4, the adhesive layer 2 may be prevented from being lifted or torn off from the encapsulation substrate 4 when the release film layer 3 is peeled off.
  • the adhesive film according to embodiments of the present invention can improve the peeling failure by varying the two-side peeling force of the two or more adhesive layers.
  • the difference BA of each release peel force between the first adhesive layer 2a and the second adhesive layer 2b is 5 gf / 25mm or more and 5 gf / 25mm or more, as shown in the general formula (2).
  • the difference CB between the first adhesive layer 2a and the encapsulation substrate 4 and the peel force between the second adhesive layer 2b and the release film layer 3 is 16 gf / 25mm.
  • the above may be 16 gf / 25mm to 60 gf / 25mm, 17 gf / 25mm to 50gf / 25mm, 18 gf / 25mm to 45 gf / 25mm, or 20 gf / 25mm to 40 gf / 25mm.
  • the peel force may be measured using a texture analyzer and measured using ASTM3330.
  • setting the peel force of the adhesive film to be higher in the order of A, B, and C may be performed, for example, as follows.
  • controlling the peeling force A between the first adhesive layer 2a and the protective film layer 1 to be lower than the peeling force B between the second adhesive layer 2b and the release film layer 3 controls the composition of each layer. It may be set differently or by imparting a surface additive to each adhesive layer. For example, to adjust the composition of the two adhesive layers differently, for example, the flow of liquid epoxy having a flow at room temperature to adjust the content contained in the adhesive layer, wherein the content of the liquid epoxy is based on the total of each adhesive layer 5 To 70% by weight.
  • a surface additive suitable for the surface properties inherent to the release film or the protective film may be selectively used in each layer. Through the addition of such surface additives and the difference in content, the wettability of the protective film or the release film and the sealing substrate of each adhesive layer may be improved.
  • the surface additives as described above vinyl-based, amino-based, epoxy-based, methacloroxine silane coupling agents, polyester-modified acrylics, polyurethanes, acrylic copolymers and the like can be used.
  • the peeling force B between the second adhesive layer 2b and the release film layer 3 is applied to the first adhesive layer 2a and the protective film layer ( 1) can be adjusted more than 5 gf / 25mm higher than the peel force (A) between.
  • adjusting the peeling force B between the second adhesive layer 2b and the release film layer 3 to be lower than the peeling force C between the first adhesive layer 2a and the encapsulation substrate 4 is, for example. It can be made as follows. Specifically, the release peeling force (B) between the second adhesive layer (2b) and the release film layer (3) is a room temperature between the first adhesive layer (2a) and the sealing substrate 4 after the thermal bonding step as shown in FIG. It is lower than the peel force (C), the adhesive film is attached to the encapsulation substrate 4 by a thermal bonding process such as hot-roll lamination, the flow of the adhesive layer is generated by heat, Adhesion and adhesion are maximized.
  • the upper limit of the viscosity is not particularly limited.
  • the upper limit of the viscosity is in the range of about 10 9 dyne / cm 2 or less. Can be controlled.
  • the curable resin included in the curable adhesive layer has a water vapor transmission rate (WVTR) in a cured state of 50 g / m 2 ⁇ day or less, 30 g / m 2 ⁇ day or less, 20 g / m 2 ⁇ day or less Or 15 g / m 2 ⁇ day or less.
  • WVTR water vapor transmission rate
  • the term “cured state of the curable resin” refers to a curable resin that is cured or crosslinked through its reaction with other components such as alone or with a curing agent or the like, and when used as an encapsulant, retains components such as moisture adsorbents and fillers, It means the state converted to the state which can exhibit the performance as a structural adhesive.
  • the said water vapor transmission rate is the water vapor transmission rate measured with respect to the thickness direction of the said hardened
  • the moisture permeability is measured according to ASTM F1249.
  • thermosetting resin means a resin that can be cured through an appropriate heat application or aging process
  • photocurable resin means a resin that can be cured by irradiation of electromagnetic waves.
  • electromagnetic waves microwaves, infrared (IR), ultraviolet (UV), X-rays and ⁇ -rays, as well as ⁇ -particle beam (proton beam), proton beam (neutron) Particle beams such as neutron beams and electron beams may be included.
  • the photocurable resin in the present invention includes a cationic photocurable resin.
  • the cationic photocurable resin means a resin that can be cured by cationic polymerization or cation curing reaction induced by irradiation of electromagnetic waves.
  • the curable resin may be a dual curable resin including both thermosetting and photocuring properties.
  • curable resin in this invention will not be restrict
  • it may be cured to exhibit adhesive properties, and may include one or more thermosetting functional groups such as glycidyl group, isocyanate group, hydroxy group, carboxyl group or amide group, or may be an epoxide group or a cyclic ether. and resins containing at least one functional group curable by irradiation of electromagnetic waves such as a (cyclic ether) group, a sulfide group, an acetal group, or a lactone group.
  • specific types of the resin may include an acrylic resin, a polyester resin, an isocyanate resin, an epoxy resin, and the like, but is not limited thereto.
  • a kind or mixture of an epoxy resin, an alkyl modified triphenol methane epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, or a dicyclopentadiene modified phenol type epoxy resin is mentioned.
  • aromatic group-containing epoxy resin examples include biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene modified phenol type epoxy resin, cresol type epoxy resin, Bisphenol-based epoxy resins, xylox-based epoxy resins, polyfunctional epoxy resins, phenol novolac epoxy resins, triphenol methane-type epoxy resins and alkyl-modified triphenol methane epoxy resins, such as one or a mixture of two or more, but is not limited thereto. no.
  • the adhesive film may further comprise a moisture adsorbent and / or a filler.
  • the moisture adsorbent and / or filler may be included in the first adhesive layer or the second adhesive layer, may be included in all, and the content may be the same or different.
  • moisture adsorbent may be used as a generic term for a moisture reactive adsorbent that is a component capable of adsorbing or removing moisture or moisture introduced from the outside through a chemical reaction or the like.
  • the moisture adsorbent chemically reacts with moisture, moisture, or oxygen introduced into the adhesive layer to adsorb moisture or moisture.
  • a water adsorbent such as the metal oxide can be blended into the composition in a state of being properly processed.
  • the thickness of the adhesive layer may be a thin film of 30 ⁇ m or less according to the type of organic electronic device to which the adhesive film is to be applied, and in this case, a grinding process of the moisture absorbent may be required.
  • a process such as a three roll mill, bead mill or ball mill may be used.
  • the adhesive film of the present invention is used for organic light emitting devices of the top emission type or the like, the permeability of the adhesive layer itself becomes very important, and thus the size of the moisture adsorbent needs to be small. Therefore, the grinding process may be required even in such applications.
  • the filler may inhibit the penetration by lengthening the movement path of moisture or moisture that penetrates into the encapsulation structure, and maximize the barrier to moisture and moisture through interaction with the matrix structure of the curable resin and the moisture absorbent.
  • the specific kind of filler that can be used in the present invention is not particularly limited, and for example, a mixture of one or more kinds selected from the group consisting of clay, talc, silica, zeolite, zirconia, titania and montmorillonite may be used.
  • a product surface-treated with an organic material may be used as the filler, or a coupling agent may be additionally added.
  • the curable adhesive layer of the present invention may include 1 part by weight to 50 parts by weight, and preferably 1 part by weight to 20 parts by weight of filler, based on 100 parts by weight of the curable resin.
  • the filler content By controlling the filler content to 1 part by weight or more, it is possible to provide a cured product having excellent moisture or moisture barrier properties and mechanical properties.
  • the filler content to 50 parts by weight or less in the present invention it is possible to manufacture a film form, it is possible to provide a cured product exhibiting excellent moisture barrier properties even when formed into a thin film.
  • the curable adhesive layer of the present invention may further include a curing agent capable of reacting with the curable resin to form a matrix such as a crosslinked structure.
  • curing agent which can be used by this invention is not specifically limited, It can select suitably according to the kind of curable resin used or the functional group contained in the resin.
  • curing agent for general epoxy resins known in this field can be used as a hardening
  • the curable adhesive layer of the first and second regions of the present invention contains a curing agent in an amount of 1 part by weight to 20 parts by weight, preferably 1 part by weight to 10 parts by weight, for example, based on 100 parts by weight of the thermosetting resin. can do.
  • the content is only one example of the present invention. That is, in the present invention, the content of the curing agent may be changed according to the type and content of the curable resin or functional group, or the matrix structure or crosslinking density to be implemented.
  • the curable adhesive layer of the present invention may further contain a polymer resin.
  • the polymer resin may serve to improve moldability, for example, when molding the composition of the present invention into a film or sheet shape. In addition, it may serve as a high temperature viscosity modifier to control the flow during the heat bonding process.
  • the polymer resin may have a softening point of 40 ° C. or higher, and the polymer resin may have a content of 10 to 70 wt%, 20 to 60 wt%, 25 to 50 wt%, or 30 to 40 wt% based on the entire layer. You can adjust it.
  • the content is not particularly limited to be adjusted according to the desired physical properties.
  • the polymer resin may be included in an amount of about 200 parts by weight or less, preferably 150 parts by weight or less, and more preferably about 100 parts by weight or less based on 100 parts by weight of the curable resin.
  • the content of the polymer resin by controlling the content of the polymer resin to 200 parts by weight or less, it can effectively maintain the compatibility with each component of the resin composition, it can also serve as an adhesive.
  • an appropriate release treatment may be performed on one side or both sides of the protective film layer or the release film layer of the present invention.
  • Alkyd-based, silicone-based, fluorine-based, unsaturated ester-based, polyolefin-based, wax-based, or the like may be used as an example of the release agent used for the release treatment of the protective film layer or the release film layer, and among them, alkyd-based, silicone-based, or fluorine-based It is preferred to use a release agent, but is not limited thereto.
  • the thickness of the protective film layer or the release film layer as described above is not particularly limited, and may be appropriately selected depending on the intended use.
  • the thickness of the first film may be about 10 ⁇ m to 500 ⁇ m, or about 20 ⁇ m to 200 ⁇ m. If the thickness is less than 10 ⁇ m, deformation of the base film may occur easily during the manufacturing process. If the thickness is more than 500 ⁇ m, the economy is inferior.
  • the method of manufacturing such an adhesive film is not specifically limited. For example, a first step of coating a coating liquid containing the composition of the adhesive layer described above on a protective film layer or a release film layer; And a second step of drying the coating solution coated in the first step, thereby preparing each adhesive layer of the adhesive film.
  • Another embodiment of the invention is a substrate; An organic electronic device formed on the substrate; And a first adhesive layer and a second adhesive layer of the aforementioned adhesive film encapsulating the organic electronic device.
  • the organic electronic device may be an organic light emitting diode.
  • Another embodiment of the present invention comprises the steps of peeling the protective film from the above-mentioned adhesive film; Attaching the first adhesive layer to the encapsulation substrate; Peeling off the release film; And laminating the second adhesive layer to be in contact with the organic electronic device.
  • the applying of the adhesive film to the organic electronic device may be performed by hot roll lamination, hot pressing, or vacuum pressing of the adhesive film, and is not particularly limited.
  • the step of attaching the first adhesive layer to the encapsulation substrate may include a difference between the Big C force between the first adhesive layer and the encapsulation substrate, and the peel force B between the second adhesive layer and the release film, CB of 16 gf / 25 mm or more and 16 gf / 25 mm to 40 gf / 25mm, 16 gf / 25mm to 35gf / 25mm, 16 gf / 25mm to 20 gf / 25mm, or 17 gf / 25mm to 22 gf / 25mm.
  • the applying of the adhesive film to the organic electronic device may be performed at a temperature of 50 ° C. to 90 ° C., and the second adhesive layer may cover the entire surface of the organic electronic device.
  • It may further comprise the step of curing the adhesive layer and the curing step may be carried out by heating to a temperature range of 70 °C to 110 °C or UV irradiation.
  • a transparent electrode is formed on a substrate such as glass or a polymer film by vacuum deposition or sputtering, and an organic material layer is formed on the transparent electrode.
  • the organic material layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer and / or an electron transport layer.
  • a second electrode is further formed on the organic material layer.
  • the above-described adhesive film is applied to cover all of the organic electronic devices on the organic electronic device on the substrate.
  • the method of applying the adhesive film is not particularly limited, and, for example, an encapsulation substrate (ex.
  • Film can be applied by a method such as heating or pressing.
  • a method such as heating or pressing.
  • the adhesive film on the sealing substrate using the adhesive film of the present invention described above, after peeling off the protective film or the release film formed on the film, applying a heat, vacuum press Or transfer to an encapsulation substrate using a vacuum laminator or the like.
  • the adhesive force or the adhesive force of the adhesive film may be reduced. Therefore, it is preferable to control the process temperature to about 100 ° C. or less and the process time within 5 minutes.
  • a vacuum press or a vacuum laminator may be used even when the encapsulation substrate onto which the adhesive film has been transferred is heat-compressed to the organic electronic device.
  • the temperature conditions at this stage can be set as described above, and the process time is preferably within 10 minutes.
  • the adhesive film is applied to the organic electronic device so that the adhesive layer of the first region is in contact with the organic electronic device rather than the second region of the adhesive film (in case the organic electronic device is provided with the protective film).
  • an additional curing process may be performed on the adhesive film obtained by compressing the organic electronic device.
  • the curing process (main curing) may be performed in, for example, a heating chamber or a UV chamber. Conditions in the present curing may be appropriately selected in consideration of the stability of the organic electronic device.
  • the above-described manufacturing process is only one example for encapsulating the organic electronic device of the present invention, and the process sequence or process conditions may be freely modified.
  • the order of the transfer and the pressing process may be changed by first transferring the adhesive film of the present invention to the organic electronic device on the substrate and then compressing the encapsulation substrate.
  • the protective layer may be formed on the organic electronic device, the adhesive film may be applied, and the encapsulation substrate may be omitted and cured.
  • the solution of the second adhesive layer prepared above was applied to the release surface of the release PET using a comma coater and dried at 130 ° C. for 3 minutes in a dryer to form an adhesive layer having a thickness of 15 ⁇ m.
  • the adhesive layer of the first adhesive layer and the second adhesive layer were laminated to prepare a multilayer adhesive film.
  • the sealing substrate After removing a protective film and measuring peeling force A, the sealing substrate is formed using a vacuum press or a vacuum laminator etc., applying heat.
  • Example 1 In the manufacturing process of the adhesive film of Example 1, by varying the weight ratio of the surface additives of the first adhesive layer and the second adhesive layer (increase by 0.2 parts by weight of the additive content for the surface of the first adhesive layer, the additive for the surface of the second adhesive layer An adhesive film having a multilayer structure was prepared in the same manner as in Example 1 except that the content was increased to 0.5 parts by weight.
  • the adhesive film having a multilayer structure was prepared in the same manner as in Example 1 except that the content of the liquid epoxy and the polymer resin in the adhesive layer was adjusted at a ratio of 62:38.
  • Example 1 In the adhesive film manufacturing process of Example 1, a multilayer film adhesive film was prepared in the same manner as in Example 1 except that the content of the liquid epoxy and the polymer resin of the second adhesive layer was adjusted to a ratio of 30:70. .
  • Peeling force A ASTM3330 deformation and measurement value is very small, the width of the measurement sample was 4 inches, divided by 4 was data.
  • the first adhesive layer was attached to the glass by 4inch three by roller, and then 180 degree Peel was measured using a TA device.
  • Peeling force B ASTM3330 After attaching the second adhesive layer to the glass 1 inch by 3 rollers in a constant temperature and humidity conditions 180 degrees Peel was measured using a TA machine.
  • Peeling force C ASTM3330 After attaching the first adhesive layer to the glass through a laminator heated at 60 degrees for 3 units at 1 inch in constant temperature and humidity conditions, the adhesive force between the adhesive layer itself and the glass was measured at 180 degrees using a TA device. It was.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

Cette invention concerne un film adhésif, un produit encapsulé d'un dispositif électronique organique utilisant le film et un procédé permettant d'encapsuler un dispositif électronique organique utilisant le film. L'invention concerne tout particulièrement un film adhésif permettant d'encapsuler un dispositif électronique, ledit film comprenant : une couche de film protectrice, une première couche adhésive, une seconde couche adhésive et une couche de film anti-adhésive disposées successivement. La force de décollement (A) entre la première couche adhésive et la couche de film protectrice est inférieure à la force de décollement (B) entre la seconde couche adhésive et la couche de film anti-adhésive, et la force de décollement (B) entre la seconde couche adhésive et la couche de film anti-adhésive est inférieure à la force de décollement (C) entre la première couche adhésive et un substrat d'encapsulation, ce qui réduit les défauts pendant le processus de décollement.
PCT/KR2013/007013 2012-08-02 2013-08-02 Film adhésif et procédé d'encapsulation d'un dispositif électronique organique utilisant le film WO2014021687A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380051906.XA CN104685018B (zh) 2012-08-02 2013-08-02 粘合膜和使用该粘合膜封装有机电子器件的方法
US14/609,172 US9343702B2 (en) 2012-08-02 2015-01-29 Adhesive film and method for encapsulating organic electronic device using same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20120084977 2012-08-02
KR10-2012-0084977 2012-08-02
KR10-2013-0092126 2013-08-02
KR1020130092126A KR101408603B1 (ko) 2012-08-02 2013-08-02 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/609,172 Continuation US9343702B2 (en) 2012-08-02 2015-01-29 Adhesive film and method for encapsulating organic electronic device using same

Publications (1)

Publication Number Publication Date
WO2014021687A1 true WO2014021687A1 (fr) 2014-02-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2013/007013 WO2014021687A1 (fr) 2012-08-02 2013-08-02 Film adhésif et procédé d'encapsulation d'un dispositif électronique organique utilisant le film

Country Status (1)

Country Link
WO (1) WO2014021687A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111063824A (zh) * 2019-12-09 2020-04-24 昆山国显光电有限公司 一种显示面板以及显示装置
US10907077B1 (en) 2019-09-24 2021-02-02 Beijing Xiaomi Mobile Software Co., Ltd. Method and device of attaching flexible screen to cover plate and terminal

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003177241A (ja) * 2001-12-10 2003-06-27 Fujimori Kogyo Co Ltd 光学用積層体、粘着剤転写テープ、および光学用積層体の製造法
KR20080088606A (ko) * 2006-01-24 2008-10-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착성 캡슐화 조성물 필름 및 유기 전계발광 소자
KR20100116712A (ko) * 2009-02-16 2010-11-01 닛토덴코 가부시키가이샤 롤 원재료 및 롤 원재료 제조 방법
JP4699676B2 (ja) * 2000-07-12 2011-06-15 スリーエム イノベイティブ プロパティズ カンパニー カプセル化された有機電子装置とその製造方法
WO2012060621A2 (fr) * 2010-11-02 2012-05-10 주식회사 엘지화학 Film adhésif et procédé d'encapsulation d'un dispositif électronique organique l'utilisant

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699676B2 (ja) * 2000-07-12 2011-06-15 スリーエム イノベイティブ プロパティズ カンパニー カプセル化された有機電子装置とその製造方法
JP2003177241A (ja) * 2001-12-10 2003-06-27 Fujimori Kogyo Co Ltd 光学用積層体、粘着剤転写テープ、および光学用積層体の製造法
KR20080088606A (ko) * 2006-01-24 2008-10-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착성 캡슐화 조성물 필름 및 유기 전계발광 소자
KR20100116712A (ko) * 2009-02-16 2010-11-01 닛토덴코 가부시키가이샤 롤 원재료 및 롤 원재료 제조 방법
WO2012060621A2 (fr) * 2010-11-02 2012-05-10 주식회사 엘지화학 Film adhésif et procédé d'encapsulation d'un dispositif électronique organique l'utilisant

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10907077B1 (en) 2019-09-24 2021-02-02 Beijing Xiaomi Mobile Software Co., Ltd. Method and device of attaching flexible screen to cover plate and terminal
EP3797993A1 (fr) * 2019-09-24 2021-03-31 Beijing Xiaomi Mobile Software Co., Ltd. Procédé et dispositif de fixation d'un écran flexible sur une plaque de couverture et terminal
CN111063824A (zh) * 2019-12-09 2020-04-24 昆山国显光电有限公司 一种显示面板以及显示装置

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