WO2015125738A1 - Ｌｅｄ照明モジュール - Google Patents

Ｌｅｄ照明モジュール Download PDF

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Publication number
WO2015125738A1
WO2015125738A1 PCT/JP2015/054154 JP2015054154W WO2015125738A1 WO 2015125738 A1 WO2015125738 A1 WO 2015125738A1 JP 2015054154 W JP2015054154 W JP 2015054154W WO 2015125738 A1 WO2015125738 A1 WO 2015125738A1
Authority
WO
WIPO (PCT)
Prior art keywords
led
module according
lighting module
ribs
illumination module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2015/054154
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English (en)
French (fr)
Japanese (ja)
Inventor
裕貴 米田
祥雄 坂上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of WO2015125738A1 publication Critical patent/WO2015125738A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Definitions

  • the present invention relates to an LED lighting module.
  • Patent Document 1 discloses an LED lighting apparatus used as a downlight.
  • This LED lighting apparatus includes an LED lighting module.
  • the LED illumination module includes a plurality of LED chips, a case for holding these LED chips, a cover that transmits light from the plurality of LED chips, and a base.
  • the cover has a circular shape in a plan view and diffuses light from the plurality of LED chips while transmitting.
  • the front surface of the cover is a circular plane.
  • the base is, for example, an IEC standard GX53 type, and the LED illumination module can be freely attached to and detached from a power feeding portion provided at the back of the ceiling opening.
  • the LED lighting module that functions as a downlight embedded in the ceiling is configured by attaching the LED lighting module to the power feeding unit.
  • the attachment / detachment of the LED illumination module to / from the power supply unit includes an operation of rotating the LED illumination module with respect to the power supply unit.
  • the LED lighting module When the LED lighting module is positioned at the back of the opening portion of the ceiling, the user touches the circular plane on the front surface of the cover to support the LED lighting module. It is not easy to rotate the LED lighting module only by touching the circular plane, and there is a problem that it is difficult to attach and replace the LED lighting module.
  • the present invention has been conceived under the above-described circumstances, and an object thereof is to provide an LED illumination module that can be easily attached to and detached from the power feeding unit.
  • the LED illumination module provided by the present invention is provided on the opposite side of the LED light emitting unit, the LED light emitting unit having one or more LED chips, a case supporting the LED light emitting unit, and the power supply unit.
  • a base that is detachable and a cover that transmits light from the LED light emitting unit are provided, and the attachment and detachment of the base and the power feeding unit is an operation of rotating the base relative to the power feeding unit.
  • the cover includes a high friction part provided along a circumferential direction around the rotation axis of the relative rotation, and bulges in a direction in which light from the LED light emitting part is emitted.
  • the high friction portion is formed on the entire circumference in the circumferential direction.
  • the high friction portion includes a plurality of ribs each extending in the radial direction when viewed in the rotational axis direction.
  • the length of the rib in the radial direction is 5 mm to 20 mm.
  • the width of the rib in the circumferential direction is 0.5 mm to 2.0 mm.
  • the pitch in the circumferential direction of the plurality of ribs is 1.0 mm to 5.0 mm.
  • the height of the rib is 0.5 mm to 5 mm.
  • the plurality of ribs include a lowest rib having a height lower than that of the adjacent ribs.
  • the plurality of ribs include the lowest rib and a plurality of middle ribs that increase in height as they are separated from the lowest rib in the circumferential direction.
  • the base includes a pair of pins, and among the plurality of ribs, the one corresponding to the pair of pins and the circumferential position has a maximum volume.
  • the one corresponding to the pair of pins and the circumferential position has the highest height.
  • the one corresponding to the pair of pins and the circumferential position has the longest length in the radial direction.
  • the high friction part includes a plurality of protrusions.
  • the high friction portion is divided into a plurality of groups separated from each other in the circumferential direction.
  • the entire cover bulges out in a dome shape.
  • the cover transmits the light from the LED light emitting part while diffusing it.
  • the cover is milky white.
  • the LED light emitting section includes an LED substrate, a plurality of LED chips mounted on the LED substrate, and a sealing resin that covers these LED chips.
  • the LED substrate has a base material made of ceramics.
  • the sealing resin is mixed with a fluorescent material that emits light different from the light from the LED chip when excited by the light from the LED chip.
  • the LED light emitting unit emits white light.
  • the plurality of LED chips are of a two-wire type, and the adjacent LED chips are directly connected by wires.
  • all of the plurality of LED chips are connected in series.
  • the case and the cover are circular in plan view.
  • the case has a heat radiating member made of metal.
  • the case has a plurality of fins.
  • the LED illumination module can be rotated more smoothly around the axis, and can be more easily attached to and detached from the power feeding unit.
  • FIG. 4 is a sectional view taken along line IV-IV in FIG. 1.
  • FIG. 6 is an enlarged cross-sectional view of a main part taken along line VI-VI in FIG. 5.
  • FIG. 7 is an enlarged cross-sectional view of a main part taken along line VII-VII in FIG. 5.
  • FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8.
  • the LED illumination module A1 of this embodiment includes a case 1, an LED light emitting unit 2, a cover 3, and a power supply unit 4.
  • the LED illumination module A1 is a module that constitutes, for example, a downlight by being attached to a power supply unit provided on the ceiling.
  • the LED illumination module A1 has a substantially cylindrical shape with a relatively short axial length.
  • FIG. 1 is a plan view showing the LED illumination module A1.
  • FIG. 2 is a side view showing the LED illumination module A1.
  • FIG. 3 is a bottom view showing the LED illumination module A1.
  • 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is an enlarged cross-sectional view showing a main part of the LED illumination module A1.
  • FIG. 6 is an enlarged cross-sectional view of a main part taken along line VI-VI in FIG.
  • FIG. 7 is an enlarged cross-sectional view of a main part taken along line VII-VII in FIG.
  • Case 1 accommodates or holds the LED light emitting section 2, the cover 3, and the power supply section 4.
  • the case 1 includes a heat radiating member 11, an insulating member 12, and an intermediate bracket 15.
  • the case 1 has a circular shape in plan view.
  • the heat dissipating member 11 is a member intended to dissipate heat from the LED light emitting unit 2, and is made of a metal such as aluminum.
  • the heat radiating member 11 has a mounting surface 11a, a plurality of fins 11b, and an engaging portion 11c.
  • the mounting surface 11a faces the emission direction (upward in the drawing in FIG. 4) for emitting the light from the LED light emitting unit 2, and is a substantially circular plane.
  • the plurality of fins 11 b are for promoting heat dissipation from the LED light emitting unit 2, and are provided over the entire outer periphery of the heat radiating member 11.
  • the fins 11b are parallel to the axial direction and the radial direction of the LED illumination module A1.
  • the engaging portion 11c is an annular portion that surrounds the mounting surface 11a. The engaging portion 11 c is used for attaching the cover 3.
  • the insulating member 12 is attached to the side opposite to the emission direction with respect to the heat radiating member 11, and in the present embodiment, has a circular shape in plan view.
  • the insulating member 12 is made of an insulating material.
  • the insulating member 12 is made of, for example, polybutylene terephthalate (PBT) resin.
  • PBT polybutylene terephthalate
  • the insulating member 12 has a convex portion 12a.
  • the convex portion 12a is a cylindrical portion that protrudes on the opposite side to the emission direction.
  • a groove 12b is formed in the convex portion 12a.
  • the groove 12b has a portion extending in the axial direction and a portion extending in the circumferential direction following the portion.
  • the insulating member 12 is provided with two pins 13.
  • the two pins 13 are located on opposite sides in the radial direction with the convex portion 12a interposed therebetween, and protrude on the opposite side to the emission direction.
  • the projection 14 a and the two pins 13 constitute a base 14.
  • the base 14 is for mounting the LED illumination module A1 on, for example, a power supply unit provided on the ceiling, and is, for example, an IEC standard GX53 type.
  • the intermediate bracket 15 is provided between the heat dissipation member 11 and the insulating member 12.
  • the intermediate bracket 15 is made of an insulating material.
  • the intermediate bracket 15 is made of, for example, polybutylene terephthalate (PBT) resin.
  • PBT polybutylene terephthalate
  • the LED light emission part 2 is a unit which makes the light source of LED illumination module A1.
  • the LED light emitting unit 2 includes an LED substrate 21, a plurality of LED chips 22, a sealing resin 24, a dam portion 25, and a holder 26.
  • FIG. 8 is a plan view of the LED light emitting unit 2.
  • FIG. 9 is a cross-sectional view taken along line IX-IX in FIG.
  • FIG. 10 is a plan view in which the sealing resin 24 and the holder 26 are omitted from the LED light emitting unit 2.
  • the LED substrate 21 has, for example, a rectangular shape in plan view, and a plurality of LED chips 22 are mounted thereon.
  • the configuration of the LED substrate 21 is not particularly limited, the substrate 21a and the wiring pattern 21b are provided in the present embodiment.
  • the LED substrate 21 has a plan view dimension of about 12 mm ⁇ 15 mm, for example.
  • the base material 21a is made of an insulating material, and is made of a glass epoxy resin or ceramics with increased thermal conductivity.
  • the wiring pattern 21 b mounts a plurality of LED chips 22 and constitutes a conduction path to these LED chips 22.
  • the wiring pattern 21b is made of a metal plating layer, and is made of, for example, Cu, Ni, Au, Ag, or the like.
  • the wiring pattern 21 b has bonding pads for mounting the plurality of 26 LED chips 22 and two connection pads for conducting with the holder 26.
  • the two connection pads are rectangular portions that are spaced apart in the diagonal direction of the LED substrate 21 with the plurality of LED chips 22 in FIG.
  • the plurality of LED chips 22 are light emitting elements of the LED light emitting unit 2.
  • the LED chip 22 has a semiconductor layer made of, for example, GaN, and emits blue light, for example.
  • 26 LED chips 22 are mounted on the LED substrate 21. These LED chips 22 are arranged in a substantially matrix shape.
  • the LED chip 22 is a so-called 2-wire type LED chip.
  • adjacent LED chips 22 are directly connected by a wire 23.
  • all the LED chips 22 are connected to each other in series. These LED chips 22 are directly connected between the two connection pads of the wiring pattern 21b.
  • the arrangement pitch of the plurality of LED chips 22 is, for example, 1.0 mm to 1.7 mm.
  • the dam portion 25 is formed on the LED substrate 21 and may surround the plurality of LED chips 22.
  • the dam portion 25 has a rectangular ring shape in plan view, and is made of, for example, a white epoxy resin.
  • the height of the dam portion 25 is higher than that of the LED chip 22.
  • the sealing resin 24 covers the plurality of LED chips 22 and fills a region surrounded by the dam portion 25.
  • the sealing resin 24 is made of a material in which a fluorescent material is mixed in a transparent resin such as a silicone resin or an epoxy resin. This fluorescent material emits yellow light when excited by blue light from the LED chip 22. Moreover, you may mix and use the fluorescent material which emits red light, and the fluorescent material which emits green light by being excited by the blue light from LED chip 22. FIG. Thereby, white light, such as a light bulb color and a daylight color, is emitted from the LED light emitting unit 2.
  • the holder 26 is for fixing and holding the LED substrate 21 with respect to the mounting surface 11a of the heat dissipation member 11.
  • the holder 26 has a main body 26a and two holding electrodes 26b.
  • the main body 26a is made of, for example, an insulating resin, and has a plan view dimension larger than that of the LED substrate 21 as shown in FIGS. Further, the central portion of the main body 26a is opened so that the sealing resin 24 covering the plurality of LED chips 22 is exposed.
  • the two holding electrodes 26b are in contact with the two connection pads of the wiring pattern 21b of the LED substrate 21, respectively.
  • the 2t holding electrode 26 b is electrically connected to two external connection terminals (not shown) provided on the holder 26. These external connection terminals are electrically connected to the power supply unit 4.
  • the holder 26 is attached to the heat radiating member 11 by screws or fitting.
  • the cover 3 is attached to the case 1 so as to be positioned in the emission direction.
  • the cover 3 transmits light from the LED light emitting unit 2.
  • the material of the cover 3 include a translucent resin or glass mixed with a diffusing material. With such a configuration, the cover 3 exhibits a milky white color, for example.
  • the cover 3 has a circular shape in a plan view, and includes a bulging portion 31, an engaging portion 32, and a high friction portion 33.
  • the bulging portion 31 is a portion that bulges in the emission direction. In the present embodiment, the entire bulging portion 31 bulges on the dome.
  • the bulging portion 31 has an inclined surface 31a.
  • the inclined surface 31a is a surface of the outer peripheral portion of the bulging portion 31, and is a surface inclined with respect to the radial direction and the circumferential direction, that is, the direction in which the mounting surface 11a of the heat radiating member 11 of the case 1 spreads.
  • the engaging portion 32 is provided at the outer peripheral end of the cover 3 and functions to attach the cover 3 to the case 1 by engaging with the engaging portion 11 c of the heat radiating member 11 of the case 1.
  • the high friction part 33 is a part intended to exhibit a higher frictional force than other parts of the cover 3 when a human finger touches it.
  • the frictional force mentioned here is a concept that includes, on the surface of an object, not only a pure frictional force acting in a direction perpendicular to the surface but also a force generated by the shape characteristic of one object (for example, unevenness). is there.
  • the high friction part 33 is provided on the inclined surface 31a of the bulging part 31, and in the present embodiment, is provided over the entire circumference in the circumferential direction.
  • the high friction portion 33 is constituted by a plurality of ribs 34.
  • the rib 34 extends in the radial direction in a plan view, and stands up in the emission direction from the inclined surface 31a.
  • the length L of the rib 34 is, for example, 5 mm to 10 mm.
  • the width W of the rib 34 is, for example, 0.5 mm to 2.0 mm.
  • the height H of the rib 34 is, for example, mm.
  • the pitch P of the plurality of ribs 34 is 2.0 mm to 4.0 mm.
  • the plurality of ribs 34 having such a size and arrangement serve to increase the above-described frictional force when touched by a finger.
  • the length L is 5 mm to 20 mm
  • the width W is 0.5 mm to 2.0 mm
  • the height H is 0.5 mm to 5 mm
  • the pitch P is 1.0 mm to 5.0 mm.
  • the length L is 5 mm to 20 mm
  • the width W is 0.5 mm to 2.0 mm
  • the height H is 0.5 mm to 5 mm
  • the pitch P is 1.0 mm to 5.0 mm.
  • the length L is 5 mm to 20 mm
  • the width W is 0.5 mm to 2.0 mm
  • the height H is 0.5 mm to 5 mm
  • the pitch P is 1.0 mm to 5.0 mm.
  • FIG. 11 shows a process of attaching the LED illumination module A1 to the ceiling 8.
  • the ceiling 8 is provided with a mounting hole 81, and a reflector 82 is provided therein.
  • a power feeding portion 83 is provided in the depth of the attachment hole 81.
  • the power supply unit 83 is configured so that a GX53 type cap of IEC standard can be mounted.
  • the LED illumination module A ⁇ b> 1 is raised from below the attachment hole 81, and is positioned behind the attachment hole 81.
  • the LED illumination module A ⁇ b> 1 is rotated relative to the power supply unit 83.
  • the two pins 13 of the base 14 are engaged with the power supply portion 83.
  • the groove portion 12 b of the convex portion 12 a of the insulating member 12 is engaged with the power feeding portion 83.
  • This relative rotation is to rotate the LED illumination module A1 having a circular shape in plan view around an axis extending in the axial direction.
  • the user rotates the LED illumination module A ⁇ b> 1 in a posture in which the finger is in contact with the high friction portion 33 of the cover 3.
  • the LED illumination module A1 By attaching the LED illumination module A1 to the power supply unit 83, the LED illumination module A1 can be supplied with power from the power supply unit 83 and is surrounded by the reflector 82. Thereby, what is called a downlight is comprised.
  • the LED light emitting unit 2 of the LED illumination module A1 When the power is turned on by a switch not shown, the LED light emitting unit 2 of the LED illumination module A1 is turned on. The light from the LED light emitting unit 2 passes through the cover 3 and partly illuminates the floor surface directly, and the other part is reflected by the reflector 82 to illuminate the floor surface and wall surface.
  • FIG. 13 shows a process of removing the LED illumination module A1 from the ceiling 8.
  • the user rotates the LED illumination module A1 in a direction opposite to that when the LED illumination module A1 is attached in a posture in which the finger is in contact with the high friction portion 33 of the cover 3.
  • die 14 and the electric power feeding part 83 is cancelled
  • the high friction portion 33 is provided on the inclined surface 31 a of the bulging portion 31 of the cover 3.
  • the high friction portion 33 is not provided on a surface that is completely perpendicular to the emission direction, but is inclined with respect to the perpendicular surface.
  • the LED illumination module A1 can be rotated more smoothly around the axis, and can be easily attached to and detached from the power supply unit 83.
  • the user can rotate the LED illumination module A1 by placing a finger on a desired portion in the circumferential position.
  • the high friction part 33 includes a plurality of ribs 34 each extending in the radial direction, the high friction part 33 is configured to more easily exert a frictional force along the circumferential direction. Therefore, it is suitable for rotating the LED illumination module A1.
  • the length L of the rib 34 is set to 5 mm to 20 mm, the width W is set to 0.5 mm to 2.0 mm, the pitch P is set to 1.0 mm to 5.0 mm, and the height H is set to 0.
  • the thickness is 5 mm to 5 mm, there is an advantage that the frictional force along the circumferential direction is suitably exhibited when a human finger touches.
  • the plurality of LED chips 22 are covered with the sealing resin 24, so that the LED light emitting unit 2 has an appearance as if surface emitting. Thereby, it is possible to avoid variations in brightness caused by a plurality of point light sources in the object illuminated by the LED illumination module A1 and the LED illumination module A1 itself.
  • the cover 3 diffuses the light from the LED light emitting unit 2, whereby the brightness variation can be further reduced.
  • FIG. 14 shows an LED illumination module according to the second embodiment of the present invention.
  • FIG. 14 is a plan view showing the LED illumination module A2.
  • the LED illumination module A2 of the present embodiment is different from the above-described embodiment in that the plurality of ribs 34 constituting the high friction portion 33 are described above.
  • the plurality of ribs 34 include two maximum ribs 35.
  • the maximum rib 35 has a larger volume than the other ribs 34.
  • the maximum rib 35 has a length L larger than that of the rib 34 and a height H. Further, the maximum rib 35 has a width W wider than that of the rib 34.
  • all of the length L, height H, and width W may be larger than the rib 34, or any one of these may be selectively used. May be large.
  • the two maximum ribs 35 are provided at positions that coincide with the two pins 13 in the circumferential direction.
  • the two pins 13 are arranged so as to form an angle of 180 ° in the circumferential direction.
  • the two maximum ribs 35 are also arranged at an angle of 180 ° in the circumferential direction.
  • the two maximum ribs 35 allow the user to easily grasp the circumferential position of the two pins 13 that are located behind the mounting hole 81 of the ceiling 8 and cannot be visually recognized. Thereby, when engaging LED lighting module A2 with the electric power feeding part 83, it is possible to perform alignment with two pins 13 and the electric power feeding part 83 reliably, and attachment of LED lighting module A2 is performed smoothly. be able to.
  • FIG. 15 shows an LED illumination module according to the third embodiment of the present invention.
  • FIG. 15 corresponds to an enlarged cross-sectional view of the main part shown in FIG.
  • the LED illumination module A3 of the present embodiment is different from the above-described embodiment in that the plurality of ribs 34 that constitute the high friction portion 33 are different.
  • the plurality of ribs 34 include a plurality of middle ribs 34b and a lowest rib 34a.
  • the lowest rib 34a is lower in height than the adjacent ribs 34 (middle ribs 34b). Further, in the present embodiment, the lowest rib 34 a has the lowest height among the plurality of ribs 34.
  • the plurality of middle ribs 34b become higher as they are separated from the lowest rib 34a in the circumferential direction.
  • the region including the plurality of middle ribs 34b and the lowest ribs 34a is a region in which the envelope surfaces of the upper surfaces of the plurality of middle ribs 34b and the lowest ribs 34a are recessed compared to the other regions. ing.
  • the LED illumination module A3 can be rotated more reliably and easily.
  • FIG. 16 shows an LED illumination module according to the fourth embodiment of the present invention.
  • FIG. 16 is a plan view showing the LED illumination module A4.
  • the high friction part 33 is constituted by a plurality of protrusions 36.
  • the plurality of protrusions 36 are discretely arranged on the entire inclined surface 31 a of the bulging portion 31 of the cover 3 in the entire circumferential direction. In the present embodiment, about four protrusions 36 are arranged along the radial direction.
  • FIG. 17 shows an LED lighting module according to the fifth embodiment of the present invention.
  • FIG. 17 corresponds to the cross-sectional view shown in FIG.
  • the LED illumination module A5 of the present embodiment is different from the above-described embodiment in the shape of the cover 3.
  • the cover 3 includes the bulging portion 31, but the bulging portion 31 has a flat upper surface and does not have a dome shape as a whole.
  • the point which the bulging part 31 has the inclined surface 31a in the circumferential direction perimeter is the same.
  • the high friction part 33 is provided in this inclined surface 31a.
  • the specific configuration of the high friction portion 33 may be any configuration of the LED illumination modules A1 to A4 described above.
  • the LED illumination module A6 of this embodiment is different from the above-described embodiment in that the high friction portion 33 is divided into a plurality of groups separated from each other in the circumferential direction of the cover 3.
  • the high friction part 33 is constituted by a plurality of ribs 34.
  • the high friction part 33 may be comprised by the some protrusion 36 in LED lighting module A4.
  • the plurality of ribs 34 are divided into three groups separated from each other in the circumferential direction of the cover 3. These groups are arranged with an angle of 120 ° in the circumferential direction, for example. Each group is constituted by five ribs 34, for example.
  • the three groups of the high friction part 33 are expected to have an effect of prompting the user to use the LED illumination module A6 to place the thumb, index finger, middle finger, or ring finger along the high friction part 33. it can. By removing using these fingers, the LED illumination module A6 can be rotated more stably and more reliably.
  • the LED illumination module according to the present invention is not limited to the above-described embodiment.
  • the specific configuration of each part of the LED lighting module according to the present invention can be varied in design in various ways.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
PCT/JP2015/054154 2014-02-20 2015-02-16 Ｌｅｄ照明モジュール Ceased WO2015125738A1 (ja)

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Application Number Priority Date Filing Date Title
JP2014030403A JP2015156283A (ja) 2014-02-20 2014-02-20 Ｌｅｄ照明モジュール
JP2014-030403 2014-02-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023158839A (ja) * 2022-04-19 2023-10-31 コイズミ照明株式会社 照明装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011044412A (ja) * 2009-08-24 2011-03-03 Toshiba Lighting & Technology Corp 照明器具
JP2011171160A (ja) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp Ｌｅｄランプ装置およびｌｅｄ照明装置
JP2011171190A (ja) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp 照明装置
JP2012204210A (ja) * 2011-03-25 2012-10-22 Toshiba Lighting & Technology Corp ランプ装置および照明器具

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6145860B2 (ja) * 2013-01-22 2017-06-14 パナソニックＩｐマネジメント株式会社 照明用光源及び照明装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011044412A (ja) * 2009-08-24 2011-03-03 Toshiba Lighting & Technology Corp 照明器具
JP2011171160A (ja) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp Ｌｅｄランプ装置およびｌｅｄ照明装置
JP2011171190A (ja) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp 照明装置
JP2012204210A (ja) * 2011-03-25 2012-10-22 Toshiba Lighting & Technology Corp ランプ装置および照明器具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023158839A (ja) * 2022-04-19 2023-10-31 コイズミ照明株式会社 照明装置

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