WO2015125738A1 - Led lighting module - Google Patents

Led lighting module Download PDF

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Publication number
WO2015125738A1
WO2015125738A1 PCT/JP2015/054154 JP2015054154W WO2015125738A1 WO 2015125738 A1 WO2015125738 A1 WO 2015125738A1 JP 2015054154 W JP2015054154 W JP 2015054154W WO 2015125738 A1 WO2015125738 A1 WO 2015125738A1
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WO
WIPO (PCT)
Prior art keywords
led
module according
lighting module
ribs
illumination module
Prior art date
Application number
PCT/JP2015/054154
Other languages
French (fr)
Japanese (ja)
Inventor
裕貴 米田
祥雄 坂上
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム株式会社 filed Critical ローム株式会社
Publication of WO2015125738A1 publication Critical patent/WO2015125738A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

Definitions

  • the present invention relates to an LED lighting module.
  • Patent Document 1 discloses an LED lighting apparatus used as a downlight.
  • This LED lighting apparatus includes an LED lighting module.
  • the LED illumination module includes a plurality of LED chips, a case for holding these LED chips, a cover that transmits light from the plurality of LED chips, and a base.
  • the cover has a circular shape in a plan view and diffuses light from the plurality of LED chips while transmitting.
  • the front surface of the cover is a circular plane.
  • the base is, for example, an IEC standard GX53 type, and the LED illumination module can be freely attached to and detached from a power feeding portion provided at the back of the ceiling opening.
  • the LED lighting module that functions as a downlight embedded in the ceiling is configured by attaching the LED lighting module to the power feeding unit.
  • the attachment / detachment of the LED illumination module to / from the power supply unit includes an operation of rotating the LED illumination module with respect to the power supply unit.
  • the LED lighting module When the LED lighting module is positioned at the back of the opening portion of the ceiling, the user touches the circular plane on the front surface of the cover to support the LED lighting module. It is not easy to rotate the LED lighting module only by touching the circular plane, and there is a problem that it is difficult to attach and replace the LED lighting module.
  • the present invention has been conceived under the above-described circumstances, and an object thereof is to provide an LED illumination module that can be easily attached to and detached from the power feeding unit.
  • the LED illumination module provided by the present invention is provided on the opposite side of the LED light emitting unit, the LED light emitting unit having one or more LED chips, a case supporting the LED light emitting unit, and the power supply unit.
  • a base that is detachable and a cover that transmits light from the LED light emitting unit are provided, and the attachment and detachment of the base and the power feeding unit is an operation of rotating the base relative to the power feeding unit.
  • the cover includes a high friction part provided along a circumferential direction around the rotation axis of the relative rotation, and bulges in a direction in which light from the LED light emitting part is emitted.
  • the high friction portion is formed on the entire circumference in the circumferential direction.
  • the high friction portion includes a plurality of ribs each extending in the radial direction when viewed in the rotational axis direction.
  • the length of the rib in the radial direction is 5 mm to 20 mm.
  • the width of the rib in the circumferential direction is 0.5 mm to 2.0 mm.
  • the pitch in the circumferential direction of the plurality of ribs is 1.0 mm to 5.0 mm.
  • the height of the rib is 0.5 mm to 5 mm.
  • the plurality of ribs include a lowest rib having a height lower than that of the adjacent ribs.
  • the plurality of ribs include the lowest rib and a plurality of middle ribs that increase in height as they are separated from the lowest rib in the circumferential direction.
  • the base includes a pair of pins, and among the plurality of ribs, the one corresponding to the pair of pins and the circumferential position has a maximum volume.
  • the one corresponding to the pair of pins and the circumferential position has the highest height.
  • the one corresponding to the pair of pins and the circumferential position has the longest length in the radial direction.
  • the high friction part includes a plurality of protrusions.
  • the high friction portion is divided into a plurality of groups separated from each other in the circumferential direction.
  • the entire cover bulges out in a dome shape.
  • the cover transmits the light from the LED light emitting part while diffusing it.
  • the cover is milky white.
  • the LED light emitting section includes an LED substrate, a plurality of LED chips mounted on the LED substrate, and a sealing resin that covers these LED chips.
  • the LED substrate has a base material made of ceramics.
  • the sealing resin is mixed with a fluorescent material that emits light different from the light from the LED chip when excited by the light from the LED chip.
  • the LED light emitting unit emits white light.
  • the plurality of LED chips are of a two-wire type, and the adjacent LED chips are directly connected by wires.
  • all of the plurality of LED chips are connected in series.
  • the case and the cover are circular in plan view.
  • the case has a heat radiating member made of metal.
  • the case has a plurality of fins.
  • the LED illumination module can be rotated more smoothly around the axis, and can be more easily attached to and detached from the power feeding unit.
  • FIG. 4 is a sectional view taken along line IV-IV in FIG. 1.
  • FIG. 6 is an enlarged cross-sectional view of a main part taken along line VI-VI in FIG. 5.
  • FIG. 7 is an enlarged cross-sectional view of a main part taken along line VII-VII in FIG. 5.
  • FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8.
  • the LED illumination module A1 of this embodiment includes a case 1, an LED light emitting unit 2, a cover 3, and a power supply unit 4.
  • the LED illumination module A1 is a module that constitutes, for example, a downlight by being attached to a power supply unit provided on the ceiling.
  • the LED illumination module A1 has a substantially cylindrical shape with a relatively short axial length.
  • FIG. 1 is a plan view showing the LED illumination module A1.
  • FIG. 2 is a side view showing the LED illumination module A1.
  • FIG. 3 is a bottom view showing the LED illumination module A1.
  • 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is an enlarged cross-sectional view showing a main part of the LED illumination module A1.
  • FIG. 6 is an enlarged cross-sectional view of a main part taken along line VI-VI in FIG.
  • FIG. 7 is an enlarged cross-sectional view of a main part taken along line VII-VII in FIG.
  • Case 1 accommodates or holds the LED light emitting section 2, the cover 3, and the power supply section 4.
  • the case 1 includes a heat radiating member 11, an insulating member 12, and an intermediate bracket 15.
  • the case 1 has a circular shape in plan view.
  • the heat dissipating member 11 is a member intended to dissipate heat from the LED light emitting unit 2, and is made of a metal such as aluminum.
  • the heat radiating member 11 has a mounting surface 11a, a plurality of fins 11b, and an engaging portion 11c.
  • the mounting surface 11a faces the emission direction (upward in the drawing in FIG. 4) for emitting the light from the LED light emitting unit 2, and is a substantially circular plane.
  • the plurality of fins 11 b are for promoting heat dissipation from the LED light emitting unit 2, and are provided over the entire outer periphery of the heat radiating member 11.
  • the fins 11b are parallel to the axial direction and the radial direction of the LED illumination module A1.
  • the engaging portion 11c is an annular portion that surrounds the mounting surface 11a. The engaging portion 11 c is used for attaching the cover 3.
  • the insulating member 12 is attached to the side opposite to the emission direction with respect to the heat radiating member 11, and in the present embodiment, has a circular shape in plan view.
  • the insulating member 12 is made of an insulating material.
  • the insulating member 12 is made of, for example, polybutylene terephthalate (PBT) resin.
  • PBT polybutylene terephthalate
  • the insulating member 12 has a convex portion 12a.
  • the convex portion 12a is a cylindrical portion that protrudes on the opposite side to the emission direction.
  • a groove 12b is formed in the convex portion 12a.
  • the groove 12b has a portion extending in the axial direction and a portion extending in the circumferential direction following the portion.
  • the insulating member 12 is provided with two pins 13.
  • the two pins 13 are located on opposite sides in the radial direction with the convex portion 12a interposed therebetween, and protrude on the opposite side to the emission direction.
  • the projection 14 a and the two pins 13 constitute a base 14.
  • the base 14 is for mounting the LED illumination module A1 on, for example, a power supply unit provided on the ceiling, and is, for example, an IEC standard GX53 type.
  • the intermediate bracket 15 is provided between the heat dissipation member 11 and the insulating member 12.
  • the intermediate bracket 15 is made of an insulating material.
  • the intermediate bracket 15 is made of, for example, polybutylene terephthalate (PBT) resin.
  • PBT polybutylene terephthalate
  • the LED light emission part 2 is a unit which makes the light source of LED illumination module A1.
  • the LED light emitting unit 2 includes an LED substrate 21, a plurality of LED chips 22, a sealing resin 24, a dam portion 25, and a holder 26.
  • FIG. 8 is a plan view of the LED light emitting unit 2.
  • FIG. 9 is a cross-sectional view taken along line IX-IX in FIG.
  • FIG. 10 is a plan view in which the sealing resin 24 and the holder 26 are omitted from the LED light emitting unit 2.
  • the LED substrate 21 has, for example, a rectangular shape in plan view, and a plurality of LED chips 22 are mounted thereon.
  • the configuration of the LED substrate 21 is not particularly limited, the substrate 21a and the wiring pattern 21b are provided in the present embodiment.
  • the LED substrate 21 has a plan view dimension of about 12 mm ⁇ 15 mm, for example.
  • the base material 21a is made of an insulating material, and is made of a glass epoxy resin or ceramics with increased thermal conductivity.
  • the wiring pattern 21 b mounts a plurality of LED chips 22 and constitutes a conduction path to these LED chips 22.
  • the wiring pattern 21b is made of a metal plating layer, and is made of, for example, Cu, Ni, Au, Ag, or the like.
  • the wiring pattern 21 b has bonding pads for mounting the plurality of 26 LED chips 22 and two connection pads for conducting with the holder 26.
  • the two connection pads are rectangular portions that are spaced apart in the diagonal direction of the LED substrate 21 with the plurality of LED chips 22 in FIG.
  • the plurality of LED chips 22 are light emitting elements of the LED light emitting unit 2.
  • the LED chip 22 has a semiconductor layer made of, for example, GaN, and emits blue light, for example.
  • 26 LED chips 22 are mounted on the LED substrate 21. These LED chips 22 are arranged in a substantially matrix shape.
  • the LED chip 22 is a so-called 2-wire type LED chip.
  • adjacent LED chips 22 are directly connected by a wire 23.
  • all the LED chips 22 are connected to each other in series. These LED chips 22 are directly connected between the two connection pads of the wiring pattern 21b.
  • the arrangement pitch of the plurality of LED chips 22 is, for example, 1.0 mm to 1.7 mm.
  • the dam portion 25 is formed on the LED substrate 21 and may surround the plurality of LED chips 22.
  • the dam portion 25 has a rectangular ring shape in plan view, and is made of, for example, a white epoxy resin.
  • the height of the dam portion 25 is higher than that of the LED chip 22.
  • the sealing resin 24 covers the plurality of LED chips 22 and fills a region surrounded by the dam portion 25.
  • the sealing resin 24 is made of a material in which a fluorescent material is mixed in a transparent resin such as a silicone resin or an epoxy resin. This fluorescent material emits yellow light when excited by blue light from the LED chip 22. Moreover, you may mix and use the fluorescent material which emits red light, and the fluorescent material which emits green light by being excited by the blue light from LED chip 22. FIG. Thereby, white light, such as a light bulb color and a daylight color, is emitted from the LED light emitting unit 2.
  • the holder 26 is for fixing and holding the LED substrate 21 with respect to the mounting surface 11a of the heat dissipation member 11.
  • the holder 26 has a main body 26a and two holding electrodes 26b.
  • the main body 26a is made of, for example, an insulating resin, and has a plan view dimension larger than that of the LED substrate 21 as shown in FIGS. Further, the central portion of the main body 26a is opened so that the sealing resin 24 covering the plurality of LED chips 22 is exposed.
  • the two holding electrodes 26b are in contact with the two connection pads of the wiring pattern 21b of the LED substrate 21, respectively.
  • the 2t holding electrode 26 b is electrically connected to two external connection terminals (not shown) provided on the holder 26. These external connection terminals are electrically connected to the power supply unit 4.
  • the holder 26 is attached to the heat radiating member 11 by screws or fitting.
  • the cover 3 is attached to the case 1 so as to be positioned in the emission direction.
  • the cover 3 transmits light from the LED light emitting unit 2.
  • the material of the cover 3 include a translucent resin or glass mixed with a diffusing material. With such a configuration, the cover 3 exhibits a milky white color, for example.
  • the cover 3 has a circular shape in a plan view, and includes a bulging portion 31, an engaging portion 32, and a high friction portion 33.
  • the bulging portion 31 is a portion that bulges in the emission direction. In the present embodiment, the entire bulging portion 31 bulges on the dome.
  • the bulging portion 31 has an inclined surface 31a.
  • the inclined surface 31a is a surface of the outer peripheral portion of the bulging portion 31, and is a surface inclined with respect to the radial direction and the circumferential direction, that is, the direction in which the mounting surface 11a of the heat radiating member 11 of the case 1 spreads.
  • the engaging portion 32 is provided at the outer peripheral end of the cover 3 and functions to attach the cover 3 to the case 1 by engaging with the engaging portion 11 c of the heat radiating member 11 of the case 1.
  • the high friction part 33 is a part intended to exhibit a higher frictional force than other parts of the cover 3 when a human finger touches it.
  • the frictional force mentioned here is a concept that includes, on the surface of an object, not only a pure frictional force acting in a direction perpendicular to the surface but also a force generated by the shape characteristic of one object (for example, unevenness). is there.
  • the high friction part 33 is provided on the inclined surface 31a of the bulging part 31, and in the present embodiment, is provided over the entire circumference in the circumferential direction.
  • the high friction portion 33 is constituted by a plurality of ribs 34.
  • the rib 34 extends in the radial direction in a plan view, and stands up in the emission direction from the inclined surface 31a.
  • the length L of the rib 34 is, for example, 5 mm to 10 mm.
  • the width W of the rib 34 is, for example, 0.5 mm to 2.0 mm.
  • the height H of the rib 34 is, for example, mm.
  • the pitch P of the plurality of ribs 34 is 2.0 mm to 4.0 mm.
  • the plurality of ribs 34 having such a size and arrangement serve to increase the above-described frictional force when touched by a finger.
  • the length L is 5 mm to 20 mm
  • the width W is 0.5 mm to 2.0 mm
  • the height H is 0.5 mm to 5 mm
  • the pitch P is 1.0 mm to 5.0 mm.
  • the length L is 5 mm to 20 mm
  • the width W is 0.5 mm to 2.0 mm
  • the height H is 0.5 mm to 5 mm
  • the pitch P is 1.0 mm to 5.0 mm.
  • the length L is 5 mm to 20 mm
  • the width W is 0.5 mm to 2.0 mm
  • the height H is 0.5 mm to 5 mm
  • the pitch P is 1.0 mm to 5.0 mm.
  • FIG. 11 shows a process of attaching the LED illumination module A1 to the ceiling 8.
  • the ceiling 8 is provided with a mounting hole 81, and a reflector 82 is provided therein.
  • a power feeding portion 83 is provided in the depth of the attachment hole 81.
  • the power supply unit 83 is configured so that a GX53 type cap of IEC standard can be mounted.
  • the LED illumination module A ⁇ b> 1 is raised from below the attachment hole 81, and is positioned behind the attachment hole 81.
  • the LED illumination module A ⁇ b> 1 is rotated relative to the power supply unit 83.
  • the two pins 13 of the base 14 are engaged with the power supply portion 83.
  • the groove portion 12 b of the convex portion 12 a of the insulating member 12 is engaged with the power feeding portion 83.
  • This relative rotation is to rotate the LED illumination module A1 having a circular shape in plan view around an axis extending in the axial direction.
  • the user rotates the LED illumination module A ⁇ b> 1 in a posture in which the finger is in contact with the high friction portion 33 of the cover 3.
  • the LED illumination module A1 By attaching the LED illumination module A1 to the power supply unit 83, the LED illumination module A1 can be supplied with power from the power supply unit 83 and is surrounded by the reflector 82. Thereby, what is called a downlight is comprised.
  • the LED light emitting unit 2 of the LED illumination module A1 When the power is turned on by a switch not shown, the LED light emitting unit 2 of the LED illumination module A1 is turned on. The light from the LED light emitting unit 2 passes through the cover 3 and partly illuminates the floor surface directly, and the other part is reflected by the reflector 82 to illuminate the floor surface and wall surface.
  • FIG. 13 shows a process of removing the LED illumination module A1 from the ceiling 8.
  • the user rotates the LED illumination module A1 in a direction opposite to that when the LED illumination module A1 is attached in a posture in which the finger is in contact with the high friction portion 33 of the cover 3.
  • die 14 and the electric power feeding part 83 is cancelled
  • the high friction portion 33 is provided on the inclined surface 31 a of the bulging portion 31 of the cover 3.
  • the high friction portion 33 is not provided on a surface that is completely perpendicular to the emission direction, but is inclined with respect to the perpendicular surface.
  • the LED illumination module A1 can be rotated more smoothly around the axis, and can be easily attached to and detached from the power supply unit 83.
  • the user can rotate the LED illumination module A1 by placing a finger on a desired portion in the circumferential position.
  • the high friction part 33 includes a plurality of ribs 34 each extending in the radial direction, the high friction part 33 is configured to more easily exert a frictional force along the circumferential direction. Therefore, it is suitable for rotating the LED illumination module A1.
  • the length L of the rib 34 is set to 5 mm to 20 mm, the width W is set to 0.5 mm to 2.0 mm, the pitch P is set to 1.0 mm to 5.0 mm, and the height H is set to 0.
  • the thickness is 5 mm to 5 mm, there is an advantage that the frictional force along the circumferential direction is suitably exhibited when a human finger touches.
  • the plurality of LED chips 22 are covered with the sealing resin 24, so that the LED light emitting unit 2 has an appearance as if surface emitting. Thereby, it is possible to avoid variations in brightness caused by a plurality of point light sources in the object illuminated by the LED illumination module A1 and the LED illumination module A1 itself.
  • the cover 3 diffuses the light from the LED light emitting unit 2, whereby the brightness variation can be further reduced.
  • FIG. 14 shows an LED illumination module according to the second embodiment of the present invention.
  • FIG. 14 is a plan view showing the LED illumination module A2.
  • the LED illumination module A2 of the present embodiment is different from the above-described embodiment in that the plurality of ribs 34 constituting the high friction portion 33 are described above.
  • the plurality of ribs 34 include two maximum ribs 35.
  • the maximum rib 35 has a larger volume than the other ribs 34.
  • the maximum rib 35 has a length L larger than that of the rib 34 and a height H. Further, the maximum rib 35 has a width W wider than that of the rib 34.
  • all of the length L, height H, and width W may be larger than the rib 34, or any one of these may be selectively used. May be large.
  • the two maximum ribs 35 are provided at positions that coincide with the two pins 13 in the circumferential direction.
  • the two pins 13 are arranged so as to form an angle of 180 ° in the circumferential direction.
  • the two maximum ribs 35 are also arranged at an angle of 180 ° in the circumferential direction.
  • the two maximum ribs 35 allow the user to easily grasp the circumferential position of the two pins 13 that are located behind the mounting hole 81 of the ceiling 8 and cannot be visually recognized. Thereby, when engaging LED lighting module A2 with the electric power feeding part 83, it is possible to perform alignment with two pins 13 and the electric power feeding part 83 reliably, and attachment of LED lighting module A2 is performed smoothly. be able to.
  • FIG. 15 shows an LED illumination module according to the third embodiment of the present invention.
  • FIG. 15 corresponds to an enlarged cross-sectional view of the main part shown in FIG.
  • the LED illumination module A3 of the present embodiment is different from the above-described embodiment in that the plurality of ribs 34 that constitute the high friction portion 33 are different.
  • the plurality of ribs 34 include a plurality of middle ribs 34b and a lowest rib 34a.
  • the lowest rib 34a is lower in height than the adjacent ribs 34 (middle ribs 34b). Further, in the present embodiment, the lowest rib 34 a has the lowest height among the plurality of ribs 34.
  • the plurality of middle ribs 34b become higher as they are separated from the lowest rib 34a in the circumferential direction.
  • the region including the plurality of middle ribs 34b and the lowest ribs 34a is a region in which the envelope surfaces of the upper surfaces of the plurality of middle ribs 34b and the lowest ribs 34a are recessed compared to the other regions. ing.
  • the LED illumination module A3 can be rotated more reliably and easily.
  • FIG. 16 shows an LED illumination module according to the fourth embodiment of the present invention.
  • FIG. 16 is a plan view showing the LED illumination module A4.
  • the high friction part 33 is constituted by a plurality of protrusions 36.
  • the plurality of protrusions 36 are discretely arranged on the entire inclined surface 31 a of the bulging portion 31 of the cover 3 in the entire circumferential direction. In the present embodiment, about four protrusions 36 are arranged along the radial direction.
  • FIG. 17 shows an LED lighting module according to the fifth embodiment of the present invention.
  • FIG. 17 corresponds to the cross-sectional view shown in FIG.
  • the LED illumination module A5 of the present embodiment is different from the above-described embodiment in the shape of the cover 3.
  • the cover 3 includes the bulging portion 31, but the bulging portion 31 has a flat upper surface and does not have a dome shape as a whole.
  • the point which the bulging part 31 has the inclined surface 31a in the circumferential direction perimeter is the same.
  • the high friction part 33 is provided in this inclined surface 31a.
  • the specific configuration of the high friction portion 33 may be any configuration of the LED illumination modules A1 to A4 described above.
  • the LED illumination module A6 of this embodiment is different from the above-described embodiment in that the high friction portion 33 is divided into a plurality of groups separated from each other in the circumferential direction of the cover 3.
  • the high friction part 33 is constituted by a plurality of ribs 34.
  • the high friction part 33 may be comprised by the some protrusion 36 in LED lighting module A4.
  • the plurality of ribs 34 are divided into three groups separated from each other in the circumferential direction of the cover 3. These groups are arranged with an angle of 120 ° in the circumferential direction, for example. Each group is constituted by five ribs 34, for example.
  • the three groups of the high friction part 33 are expected to have an effect of prompting the user to use the LED illumination module A6 to place the thumb, index finger, middle finger, or ring finger along the high friction part 33. it can. By removing using these fingers, the LED illumination module A6 can be rotated more stably and more reliably.
  • the LED illumination module according to the present invention is not limited to the above-described embodiment.
  • the specific configuration of each part of the LED lighting module according to the present invention can be varied in design in various ways.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

An LED lighting module (A1) is provided with: an LED light emitting section having one or more LED chips; a case (1) that supports the LED light emitting section; a ferrule (14), which is provided on the opposite side to the LED light emitting section, and which can be attached to and detached from a power supply section; and a cover (3) that transmits light emitted from the LED light emitting section. Operations of attaching and detaching the ferrule (14) and the power supply section to and from each other include an operation of relatively rotating the ferrule (14) with respect to the power supply section, and the cover (3) is protruding in the direction in which the light emitted from the LED light emitting section is outputted, said cover having a high-friction section (33) that is provided in the circumferential direction about a rotation axis of the relative rotation. With such configuration, the operations of attaching to/detaching from the power supply section can be more easily performed.

Description

ＬＥＤ照明モジュールLED lighting module
　本発明は、ＬＥＤ照明モジュールに関する。 The present invention relates to an LED lighting module.
　室内照明は、室内全体を照らすもの、室内の一部を照らすものなど、様々な種類のものが提案されている。ダウンライトは、天井に埋め込まれる照明器具の一種であり、主に床面の所望の部位を照らすために用いられる。近年においては、ダウンライトの光源としてＬＥＤチップが用いられたＬＥＤ照明器具が開発されている。特許文献１には、ダウンライトとして用いられるＬＥＤ照明器具が開示されている。このＬＥＤ照明器具は、ＬＥＤ照明モジュールを備えている。ＬＥＤ照明モジュールは、複数のＬＥＤチップとこれらのＬＥＤチップを保持するケースと、複数のＬＥＤチップからの光を透過させるカバーと、口金とを備えている。上記カバーは、平面視円形状であり、上記複数のＬＥＤチップからの光を透過させつつ拡散させる。カバーの正面は、円形平面とされている。上記口金は、たとえばＩＥＣ規格のＧＸ５３形であり、天井の開口部分奥方に設けられた給電部に上記ＬＥＤ照明モジュールを着脱自在とするものである。上記ＬＥＤ照明モジュールが上記給電部に取り付けられることによって、天井に埋め込まれたダウンライトとして機能するＬＥＤ照明器具が構成される。 Various types of indoor lighting have been proposed, such as those that illuminate the entire room and those that illuminate a part of the room. A downlight is a type of lighting fixture embedded in a ceiling, and is mainly used to illuminate a desired portion of a floor surface. In recent years, LED lighting fixtures using LED chips as light sources for downlights have been developed. Patent Document 1 discloses an LED lighting apparatus used as a downlight. This LED lighting apparatus includes an LED lighting module. The LED illumination module includes a plurality of LED chips, a case for holding these LED chips, a cover that transmits light from the plurality of LED chips, and a base. The cover has a circular shape in a plan view and diffuses light from the plurality of LED chips while transmitting. The front surface of the cover is a circular plane. The base is, for example, an IEC standard GX53 type, and the LED illumination module can be freely attached to and detached from a power feeding portion provided at the back of the ceiling opening. The LED lighting module that functions as a downlight embedded in the ceiling is configured by attaching the LED lighting module to the power feeding unit.
　上記ＬＥＤ照明モジュールの上記給電部への着脱は、上記ＬＥＤ照明モジュールを上記給電部に対して回転させる動作を含んでいる。上記ＬＥＤ照明モジュールを上記天井の上記開口部分奥方に位置させると、使用者は上記カバーの正面にある上記円形平面に触れることにより上記ＬＥＤ照明モジュールを支える格好となる。上記円形平面に触れることのみで上記ＬＥＤ照明モジュールを回転させることは容易ではなく、上記ＬＥＤ照明モジュールの取り付けおよび取替え作業が困難となるという問題があった。 The attachment / detachment of the LED illumination module to / from the power supply unit includes an operation of rotating the LED illumination module with respect to the power supply unit. When the LED lighting module is positioned at the back of the opening portion of the ceiling, the user touches the circular plane on the front surface of the cover to support the LED lighting module. It is not easy to rotate the LED lighting module only by touching the circular plane, and there is a problem that it is difficult to attach and replace the LED lighting module.
特開２０１２－２２９９４号公報JP 2012-22994 A
　本発明は、上記した事情のもとで考え出されたものであって、給電部への着脱をより容易に行うことが可能なＬＥＤ照明モジュールを提供することをその課題とする。 The present invention has been conceived under the above-described circumstances, and an object thereof is to provide an LED illumination module that can be easily attached to and detached from the power feeding unit.
　本発明によって提供されるＬＥＤ照明モジュールは、１以上のＬＥＤチップを有するＬＥＤ発光部と、上記ＬＥＤ発光部を支持するケースと、上記ＬＥＤ発光部とは反対側に設けられ、給電部に対して着脱可能である口金と、上記ＬＥＤ発光部からの光を透過させるカバーと、を備えており、上記口金と上記給電部との着脱は、上記口金を上記給電部に対して相対回転させる動作を含んでおり、上記カバーは、上記ＬＥＤ発光部の光が出射させる方向に膨出しているとともに、上記相対回転の回転軸周りの周方向に沿って設けられた高摩擦部を有する。 The LED illumination module provided by the present invention is provided on the opposite side of the LED light emitting unit, the LED light emitting unit having one or more LED chips, a case supporting the LED light emitting unit, and the power supply unit. A base that is detachable and a cover that transmits light from the LED light emitting unit are provided, and the attachment and detachment of the base and the power feeding unit is an operation of rotating the base relative to the power feeding unit. The cover includes a high friction part provided along a circumferential direction around the rotation axis of the relative rotation, and bulges in a direction in which light from the LED light emitting part is emitted.
　本発明の好ましい実施の形態においては、上記高摩擦部は、上記周方向の全周に形成されている。 In a preferred embodiment of the present invention, the high friction portion is formed on the entire circumference in the circumferential direction.
　本発明の好ましい実施の形態においては、上記高摩擦部は、各々が上記回転軸方向視において径方向に延びる複数のリブを含んでいる。 In a preferred embodiment of the present invention, the high friction portion includes a plurality of ribs each extending in the radial direction when viewed in the rotational axis direction.
　本発明の好ましい実施の形態においては、上記リブの上記径方向における長さは、５ｍｍ～２０ｍｍである。 In a preferred embodiment of the present invention, the length of the rib in the radial direction is 5 mm to 20 mm.
　本発明の好ましい実施の形態においては、上記リブの上記周方向における幅は、０．５ｍｍ～２．０ｍｍである。 In a preferred embodiment of the present invention, the width of the rib in the circumferential direction is 0.5 mm to 2.0 mm.
　本発明の好ましい実施の形態においては、上記複数のリブの上記周方向におけるピッチは、１．０ｍｍ～５．０ｍｍである。 In a preferred embodiment of the present invention, the pitch in the circumferential direction of the plurality of ribs is 1.0 mm to 5.0 mm.
　本発明の好ましい実施の形態においては、上記リブの高さは、０．５ｍｍ～５ｍｍである。 In a preferred embodiment of the present invention, the height of the rib is 0.5 mm to 5 mm.
　本発明の好ましい実施の形態においては、上記複数のリブは、両隣の上記リブよりも高さが低い最低位リブを含む。 In a preferred embodiment of the present invention, the plurality of ribs include a lowest rib having a height lower than that of the adjacent ribs.
　本発明の好ましい実施の形態においては、上記複数のリブは、上記最低位リブと、この最低位リブから上記周方向に離間するほど高さが高くなる複数の中位リブと、を含む。 In a preferred embodiment of the present invention, the plurality of ribs include the lowest rib and a plurality of middle ribs that increase in height as they are separated from the lowest rib in the circumferential direction.
　本発明の好ましい実施の形態においては、上記口金は、１対のピンを含んでおり、上記複数のリブのうち上記１対のピンと周方向位置が対応するものは、体積が最大である。 In a preferred embodiment of the present invention, the base includes a pair of pins, and among the plurality of ribs, the one corresponding to the pair of pins and the circumferential position has a maximum volume.
　本発明の好ましい実施の形態においては、上記複数のリブのうち上記１対のピンと周方向位置が対応するものは、最も高さが高い。 In a preferred embodiment of the present invention, among the plurality of ribs, the one corresponding to the pair of pins and the circumferential position has the highest height.
　本発明の好ましい実施の形態においては、上記複数のリブのうち上記１対のピンと周方向位置が対応するものは、上記径方向における長さが最も長い。 In a preferred embodiment of the present invention, among the plurality of ribs, the one corresponding to the pair of pins and the circumferential position has the longest length in the radial direction.
　本発明の好ましい実施の形態においては、上記高摩擦部は、複数の突起を含む。 In a preferred embodiment of the present invention, the high friction part includes a plurality of protrusions.
　本発明の好ましい実施の形態においては、上記高摩擦部は、上記周方向において互いに離間する複数のグループに分けられている。 In a preferred embodiment of the present invention, the high friction portion is divided into a plurality of groups separated from each other in the circumferential direction.
　本発明の好ましい実施の形態においては、上記カバーは、全体がドーム状に膨出している。 In a preferred embodiment of the present invention, the entire cover bulges out in a dome shape.
　本発明の好ましい実施の形態においては、上記カバーは、上記ＬＥＤ発光部からの光を拡散させつつ透過させる。 In a preferred embodiment of the present invention, the cover transmits the light from the LED light emitting part while diffusing it.
　本発明の好ましい実施の形態においては、上記カバーは、乳白色である。 In a preferred embodiment of the present invention, the cover is milky white.
　本発明の好ましい実施の形態においては、上記ＬＥＤ発光部は、ＬＥＤ基板と、このＬＥＤ基板に実装された複数のＬＥＤチップと、これらのＬＥＤチップを覆う封止樹脂と、を具備している。 In a preferred embodiment of the present invention, the LED light emitting section includes an LED substrate, a plurality of LED chips mounted on the LED substrate, and a sealing resin that covers these LED chips.
　本発明の好ましい実施の形態においては、上記ＬＥＤ基板は、セラミックスからなる基材を有する。 In a preferred embodiment of the present invention, the LED substrate has a base material made of ceramics.
　本発明の好ましい実施の形態においては、上記封止樹脂には、上記ＬＥＤチップからの光によって励起されることにより上記ＬＥＤチップからの光とは異なる光を発する蛍光材料が混入されており、上記ＬＥＤ発光部は、白色光を発する。 In a preferred embodiment of the present invention, the sealing resin is mixed with a fluorescent material that emits light different from the light from the LED chip when excited by the light from the LED chip. The LED light emitting unit emits white light.
　本発明の好ましい実施の形態においては、上記複数のＬＥＤチップは２ワイヤタイプであり、隣り合う上記ＬＥＤチップどうしが、ワイヤによって直接接続されている。 In a preferred embodiment of the present invention, the plurality of LED chips are of a two-wire type, and the adjacent LED chips are directly connected by wires.
　本発明の好ましい実施の形態においては、上記複数のＬＥＤチップのすべてが直列に接続されている。 In a preferred embodiment of the present invention, all of the plurality of LED chips are connected in series.
　本発明の好ましい実施の形態においては、上記ケースおよび上記カバーは、平面視円形状である。 In a preferred embodiment of the present invention, the case and the cover are circular in plan view.
　本発明の好ましい実施の形態においては、上記ケースは、金属からなる放熱部材を有する。 In a preferred embodiment of the present invention, the case has a heat radiating member made of metal.
　本発明の好ましい実施の形態においては、上記ケースには、複数のフィンが形成されている。 In a preferred embodiment of the present invention, the case has a plurality of fins.
　このような構成によれば、膨出した上記カバーに上記高摩擦部が設けられていることにより、使用者が上記高摩擦部に指を触れた際に、まっすぐに押し当てる格好とはならず、傾斜の分だけ上記高摩擦部を介して上記カバーを挟むような触れ方を取ることができる。したがって、上記ＬＥＤ照明モジュールを上記軸周りによりスムーズに回転させることが可能であり、給電部への着脱をより容易に行うことができる。 According to such a configuration, since the high-friction portion is provided on the bulged cover, when the user touches the high-friction portion with a finger, it does not look straight. It is possible to take a touch such that the cover is sandwiched through the high friction portion by an amount corresponding to the inclination. Therefore, the LED illumination module can be rotated more smoothly around the axis, and can be more easily attached to and detached from the power feeding unit.
　本発明のその他の特徴および利点は、添付図面を参照して以下に行う詳細な説明によって、より明らかとなろう。 Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.
本発明の第一実施形態に基づくＬＥＤ照明モジュールを示す平面図である。It is a top view which shows the LED lighting module based on 1st embodiment of this invention. 図１のＬＥＤ照明モジュールを示す側面図である。It is a side view which shows the LED lighting module of FIG. 図１のＬＥＤ照明モジュールを示す底面図である。It is a bottom view which shows the LED lighting module of FIG. 図１のＩＶ－ＩＶ線に沿う断面図である。FIG. 4 is a sectional view taken along line IV-IV in FIG. 1. 図１のＬＥＤ照明モジュールを示す要部拡大断面図である。It is a principal part expanded sectional view which shows the LED illumination module of FIG. 図５のＶＩ－ＶＩ線に沿う要部拡大断面図である。FIG. 6 is an enlarged cross-sectional view of a main part taken along line VI-VI in FIG. 5. 図５のＶＩＩ－ＶＩＩ線に沿う要部拡大断面図である。FIG. 7 is an enlarged cross-sectional view of a main part taken along line VII-VII in FIG. 5. 図１のＬＥＤ照明モジュールのＬＥＤ発光部を示す平面図である。It is a top view which shows the LED light emission part of the LED illumination module of FIG. 図８のＩＸ－ＩＸ線に沿う断面図である。FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 8. 図１のＬＥＤ照明モジュールのＬＥＤ発光部を示す要部拡大平面図である。It is a principal part enlarged plan view which shows the LED light emission part of the LED illumination module of FIG. 図１のＬＥＤ照明モジュールを天井に取り付ける工程を示す斜視図である。It is a perspective view which shows the process of attaching the LED lighting module of FIG. 1 to a ceiling. 図１のＬＥＤ照明モジュールを天井に取り付ける工程を示す斜視図である。It is a perspective view which shows the process of attaching the LED lighting module of FIG. 1 to a ceiling. 図１のＬＥＤ照明モジュールを天井から取り外す工程を示す斜視図である。It is a perspective view which shows the process of removing the LED lighting module of FIG. 1 from a ceiling. 本発明の第二実施形態に基づくＬＥＤ照明モジュールを示す平面図である。It is a top view which shows the LED lighting module based on 2nd embodiment of this invention. 本発明の第三実施形態に基づくＬＥＤ照明モジュールを示す要部拡大断面図である。It is a principal part expanded sectional view which shows the LED lighting module based on 3rd embodiment of this invention. 本発明の第四実施形態に基づくＬＥＤ照明モジュールを示す平面図である。It is a top view which shows the LED lighting module based on 4th embodiment of this invention. 本発明の第五実施形態に基づくＬＥＤ照明モジュールを示す断面図である。It is sectional drawing which shows the LED lighting module based on 5th embodiment of this invention. 本発明の第六実施形態に基づくＬＥＤ照明モジュールを示す断面図である。It is sectional drawing which shows the LED lighting module based on 6th embodiment of this invention. 本発明の第五実施形態に基づくＬＥＤ照明モジュールを示す平面図である。It is a top view which shows the LED lighting module based on 5th embodiment of this invention.
　以下、本発明の好ましい実施の形態につき、図面を参照して具体的に説明する。 Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.
　図１～図７は、本発明の第一実施形態に基づくＬＥＤ照明モジュールを示している。本実施形態のＬＥＤ照明モジュールＡ１は、ケース１、ＬＥＤ発光部２、カバー３および電源部４を備えている。ＬＥＤ照明モジュールＡ１は、後述するように、天井に設けられた給電部に取り付けられることにより、たとえばダウンライトを構成するモジュールである。本実施形態においては、ＬＥＤ照明モジュールＡ１は、軸方向長さが相対的に短い略円柱形状である。 1 to 7 show an LED illumination module according to the first embodiment of the present invention. The LED illumination module A1 of this embodiment includes a case 1, an LED light emitting unit 2, a cover 3, and a power supply unit 4. As will be described later, the LED illumination module A1 is a module that constitutes, for example, a downlight by being attached to a power supply unit provided on the ceiling. In the present embodiment, the LED illumination module A1 has a substantially cylindrical shape with a relatively short axial length.
　図１は、ＬＥＤ照明モジュールＡ１を示す平面図である。図２は、ＬＥＤ照明モジュールＡ１を示す側面図である。図３は、ＬＥＤ照明モジュールＡ１を示す底面図である。図４は、図１のＩＶ－ＩＶ線に沿う断面図である。図５は、ＬＥＤ照明モジュールＡ１を示す要部拡大断面図である。図６は、図５のＶＩ－ＶＩ線に沿う要部拡大断面図である。図７は、図５のＶＩＩ－ＶＩＩ線に沿う要部拡大断面図である。 FIG. 1 is a plan view showing the LED illumination module A1. FIG. 2 is a side view showing the LED illumination module A1. FIG. 3 is a bottom view showing the LED illumination module A1. 4 is a cross-sectional view taken along line IV-IV in FIG. FIG. 5 is an enlarged cross-sectional view showing a main part of the LED illumination module A1. FIG. 6 is an enlarged cross-sectional view of a main part taken along line VI-VI in FIG. FIG. 7 is an enlarged cross-sectional view of a main part taken along line VII-VII in FIG.
　ケース１は、ＬＥＤ発光部２、カバー３および電源部４を収容もしくは保持するものである。本実施形態においては、ケース１は、放熱部材１１、絶縁部材１２および中間ブラケット１５からなる。本実施形態においては、ケース１は、平面視円形状である。 Case 1 accommodates or holds the LED light emitting section 2, the cover 3, and the power supply section 4. In the present embodiment, the case 1 includes a heat radiating member 11, an insulating member 12, and an intermediate bracket 15. In the present embodiment, the case 1 has a circular shape in plan view.
　放熱部材１１は、ＬＥＤ発光部２からの熱を放散することが意図された部材であり、たとえばアルミなどの金属からなる。放熱部材１１は、搭載面１１ａ、複数のフィン１１ｂおよび係合部１１ｃを有する。搭載面１１ａは、ＬＥＤ発光部２からの光を出射させる出射方向（図４における図中上方）を向いており、円形の略平面である。複数のフィン１１ｂは、ＬＥＤ発光部２からの熱の放散を促進するためのものであり、放熱部材１１の外周部分全周にわたって設けられている。フィン１１ｂは、ＬＥＤ照明モジュールＡ１の軸方向および径方向に対して平行である。係合部１１ｃは、搭載面１１ａを取り囲む円環状の部分である。係合部１１ｃは、カバー３の取り付けに用いられる。 The heat dissipating member 11 is a member intended to dissipate heat from the LED light emitting unit 2, and is made of a metal such as aluminum. The heat radiating member 11 has a mounting surface 11a, a plurality of fins 11b, and an engaging portion 11c. The mounting surface 11a faces the emission direction (upward in the drawing in FIG. 4) for emitting the light from the LED light emitting unit 2, and is a substantially circular plane. The plurality of fins 11 b are for promoting heat dissipation from the LED light emitting unit 2, and are provided over the entire outer periphery of the heat radiating member 11. The fins 11b are parallel to the axial direction and the radial direction of the LED illumination module A1. The engaging portion 11c is an annular portion that surrounds the mounting surface 11a. The engaging portion 11 c is used for attaching the cover 3.
　絶縁部材１２は、放熱部材１１に対して上記出射方向とは反対側に取り付けられており、本実施形態においては、平面視円形状である。絶縁部材１２は、絶縁性材料からなり、本実施形態においては、たとえばポリブチレンテレフタレート（ＰＢＴ）樹脂からなる。絶縁部材１２は、凸部１２ａを有している。凸部１２ａは、上記出射方向とは反対側に突出する円柱形状部分である。図２に示すように、凸部１２ａには、溝部１２ｂが形成されている。溝部１２ｂは、上記軸方向に延びる部分と、これに続いて上記周方向に延びる部分とを有している。また、絶縁部材１２には、２つのピン１３が設けられている。２つのピン１３は、凸部１２ａを挟んで上記径方向において互いに反対側に位置しており、上記出射方向とは反対側に突出している。この凸部１２ａと２つのピン１３とによって口金１４が構成されている。口金１４は、後述するように、ＬＥＤ照明モジュールＡ１をたとえば天井に設けられた給電部に装着するためのものであり、たとえばＩＥＣ規格のＧＸ５３型である。 The insulating member 12 is attached to the side opposite to the emission direction with respect to the heat radiating member 11, and in the present embodiment, has a circular shape in plan view. The insulating member 12 is made of an insulating material. In the present embodiment, the insulating member 12 is made of, for example, polybutylene terephthalate (PBT) resin. The insulating member 12 has a convex portion 12a. The convex portion 12a is a cylindrical portion that protrudes on the opposite side to the emission direction. As shown in FIG. 2, a groove 12b is formed in the convex portion 12a. The groove 12b has a portion extending in the axial direction and a portion extending in the circumferential direction following the portion. The insulating member 12 is provided with two pins 13. The two pins 13 are located on opposite sides in the radial direction with the convex portion 12a interposed therebetween, and protrude on the opposite side to the emission direction. The projection 14 a and the two pins 13 constitute a base 14. As will be described later, the base 14 is for mounting the LED illumination module A1 on, for example, a power supply unit provided on the ceiling, and is, for example, an IEC standard GX53 type.
　中間ブラケット１５は、放熱部材１１と絶縁部材１２との間に設けられている。中間ブラケット１５は、絶縁性材料からなり、本実施形態においては、たとえばポリブチレンテレフタレート（ＰＢＴ）樹脂からなる。中間ブラケット１５は、２つのピン１３および電源部４の固定保持や、２つのピン１３、ＬＥＤ発光部２および電源部４を接続する配線などを保持する機能を果たす。 The intermediate bracket 15 is provided between the heat dissipation member 11 and the insulating member 12. The intermediate bracket 15 is made of an insulating material. In the present embodiment, the intermediate bracket 15 is made of, for example, polybutylene terephthalate (PBT) resin. The intermediate bracket 15 functions to fix and hold the two pins 13 and the power supply unit 4 and to hold the wiring connecting the two pins 13, the LED light emitting unit 2, and the power supply unit 4.
　ＬＥＤ発光部２は、ＬＥＤ照明モジュールＡ１の光源をなすユニットである。図８～図１０に示すように、ＬＥＤ発光部２は、ＬＥＤ基板２１、複数のＬＥＤチップ２２、封止樹脂２４、堰部２５およびホルダ２６を備えている。図８は、ＬＥＤ発光部２の平面図である。図９は、図８のＩＸ－ＩＸ線に沿う断面図である。図１０は、ＬＥＤ発光部２から封止樹脂２４およびホルダ２６を省略した平面図である。 The LED light emission part 2 is a unit which makes the light source of LED illumination module A1. As shown in FIGS. 8 to 10, the LED light emitting unit 2 includes an LED substrate 21, a plurality of LED chips 22, a sealing resin 24, a dam portion 25, and a holder 26. FIG. 8 is a plan view of the LED light emitting unit 2. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. FIG. 10 is a plan view in which the sealing resin 24 and the holder 26 are omitted from the LED light emitting unit 2.
　図１０に示すように、ＬＥＤ基板２１は、たとえば平面視矩形状であり、複数のＬＥＤチップ２２が搭載されている。ＬＥＤ基板２１の構成は特に限定されないが、本実施形態においては、基材２１ａおよび配線パターン２１ｂを有している。ＬＥＤ基板２１は、平面視寸法がたとえば１２ｍｍＸ１５ｍｍ程度である。 As shown in FIG. 10, the LED substrate 21 has, for example, a rectangular shape in plan view, and a plurality of LED chips 22 are mounted thereon. Although the configuration of the LED substrate 21 is not particularly limited, the substrate 21a and the wiring pattern 21b are provided in the present embodiment. The LED substrate 21 has a plan view dimension of about 12 mm × 15 mm, for example.
　基材２１ａは、絶縁性材料からなり、熱伝導率が高められたガラスエポキシ樹脂やセラミックスからなる。配線パターン２１ｂは、複数のＬＥＤチップ２２を実装し、かつこれらのＬＥＤチップ２２への導通経路を構成する。配線パターン２１ｂは、金属のメッキ層からなり、たとえばＣｕ，Ｎｉ，Ａｕ，Ａｇなどからなる。本実施形態においては、配線パターン２１ｂは、２６個の複数のＬＥＤチップ２２を搭載するためのボンディングパッドと、ホルダ２６との導通をとるための２つの接続パッドとを有する。上記２つの接続パッドは、図１０において複数のＬＥＤチップ２２を挟んでＬＥＤ基板２１の対角線方向に離間配置された矩形状部分である。 The base material 21a is made of an insulating material, and is made of a glass epoxy resin or ceramics with increased thermal conductivity. The wiring pattern 21 b mounts a plurality of LED chips 22 and constitutes a conduction path to these LED chips 22. The wiring pattern 21b is made of a metal plating layer, and is made of, for example, Cu, Ni, Au, Ag, or the like. In the present embodiment, the wiring pattern 21 b has bonding pads for mounting the plurality of 26 LED chips 22 and two connection pads for conducting with the holder 26. The two connection pads are rectangular portions that are spaced apart in the diagonal direction of the LED substrate 21 with the plurality of LED chips 22 in FIG.
　複数のＬＥＤチップ２２は、ＬＥＤ発光部２の発光要素である。ＬＥＤチップ２２は、たとえばＧａＮからなる半導体層を有しており、たとえば青色光を発する。本実施形態においては、２６個のＬＥＤチップ２２がＬＥＤ基板２１に搭載されている。これらのＬＥＤチップ２２は、略マトリクス状に配置されている。ＬＥＤチップ２２は、いわゆる２ワイヤタイプのＬＥＤチップである。本実施形態においては、隣り合うＬＥＤチップ２２どうしが、ワイヤ２３によって直接接続されている。さらに、本実施形態においては、すべてのＬＥＤチップ２２が互いに直列に接続されている。これらのＬＥＤチップ２２は、配線パターン２１ｂの上記２つの接続パッドの間において直接に接続されている。複数のＬＥＤチップ２２の配列ピッチは、たとえば１．０ｍｍ～１．７ｍｍである。 The plurality of LED chips 22 are light emitting elements of the LED light emitting unit 2. The LED chip 22 has a semiconductor layer made of, for example, GaN, and emits blue light, for example. In the present embodiment, 26 LED chips 22 are mounted on the LED substrate 21. These LED chips 22 are arranged in a substantially matrix shape. The LED chip 22 is a so-called 2-wire type LED chip. In the present embodiment, adjacent LED chips 22 are directly connected by a wire 23. Furthermore, in this embodiment, all the LED chips 22 are connected to each other in series. These LED chips 22 are directly connected between the two connection pads of the wiring pattern 21b. The arrangement pitch of the plurality of LED chips 22 is, for example, 1.0 mm to 1.7 mm.
　堰部２５は、ＬＥＤ基板２１上に形成されており、複数のＬＥＤチップ２２を囲んでいうる。本実施形態においては、堰部２５は、平面視において矩形環状とされており、たとえば白色のエポキシ樹脂からなる。堰部２５の高さは、ＬＥＤチップ２２よりも高い。 The dam portion 25 is formed on the LED substrate 21 and may surround the plurality of LED chips 22. In the present embodiment, the dam portion 25 has a rectangular ring shape in plan view, and is made of, for example, a white epoxy resin. The height of the dam portion 25 is higher than that of the LED chip 22.
　封止樹脂２４は、複数のＬＥＤチップ２２を覆っており、堰部２５によって囲まれた領域に充填されている。封止樹脂２４は、たとえばシリコーン樹脂あるいはエポキシ樹脂などの透明な樹脂に、蛍光材料が混入された材質からなる。この蛍光材料は、ＬＥＤチップ２２からの青色光によって励起されることにより黄色光を発する。また、ＬＥＤチップ２２からの青色光によって励起されることにより、赤色光を発する蛍光材料と緑色光を発する蛍光材料とを混ぜて用いてもよい。これにより、ＬＥＤ発光部２からは、電球色、昼光色などの白色光が発せられる。 The sealing resin 24 covers the plurality of LED chips 22 and fills a region surrounded by the dam portion 25. The sealing resin 24 is made of a material in which a fluorescent material is mixed in a transparent resin such as a silicone resin or an epoxy resin. This fluorescent material emits yellow light when excited by blue light from the LED chip 22. Moreover, you may mix and use the fluorescent material which emits red light, and the fluorescent material which emits green light by being excited by the blue light from LED chip 22. FIG. Thereby, white light, such as a light bulb color and a daylight color, is emitted from the LED light emitting unit 2.
　ホルダ２６は、ＬＥＤ基板２１を放熱部材１１の搭載面１１ａに対して固定保持するためのものである。ホルダ２６は、本体２６ａおよび２つの保持電極２６ｂを有している。本体２６ａは、たとえば絶縁性の樹脂からなり、図８および図９に示すように、平面視寸法がＬＥＤ基板２１よりも大とされている。また、複数のＬＥＤチップ２２を覆う封止樹脂２４を露出させるように、本体２６ａは、その中央部分が開口している。２つの保持電極２６ｂは、ＬＥＤ基板２１の配線パターン２１ｂの上記２つの接続パッドに各々が接触している。２ｔの保持電極２６ｂは、ホルダ２６に設けられた図示しない２つの外部接続端子と導通している。これらの外部接続端子は、電源部４に導通している。ホルダ２６の放熱部材１１への取り付けは、ねじや嵌合などによってなされる。 The holder 26 is for fixing and holding the LED substrate 21 with respect to the mounting surface 11a of the heat dissipation member 11. The holder 26 has a main body 26a and two holding electrodes 26b. The main body 26a is made of, for example, an insulating resin, and has a plan view dimension larger than that of the LED substrate 21 as shown in FIGS. Further, the central portion of the main body 26a is opened so that the sealing resin 24 covering the plurality of LED chips 22 is exposed. The two holding electrodes 26b are in contact with the two connection pads of the wiring pattern 21b of the LED substrate 21, respectively. The 2t holding electrode 26 b is electrically connected to two external connection terminals (not shown) provided on the holder 26. These external connection terminals are electrically connected to the power supply unit 4. The holder 26 is attached to the heat radiating member 11 by screws or fitting.
　カバー３は、ケース１に対して上記出射方向に位置するように取り付けられている。カバー３は、ＬＥＤ発光部２からの光を透過させる。また、本実施形態においては、カバー３は、ＬＥＤ発光部２からの光を拡散させつつ透過させる。カバー３の材質としては、透光性を有する樹脂またはガラスに拡散材を混入した材質が挙げられる。このような構成により、カバー３は、たとえば乳白色を呈する。 The cover 3 is attached to the case 1 so as to be positioned in the emission direction. The cover 3 transmits light from the LED light emitting unit 2. Moreover, in this embodiment, the cover 3 permeate | transmits the light from the LED light emission part 2, diffusing. Examples of the material of the cover 3 include a translucent resin or glass mixed with a diffusing material. With such a configuration, the cover 3 exhibits a milky white color, for example.
　カバー３は、本実施形態においては、平面視円形状であり、膨出部３１、係合部３２および高摩擦部３３を有している。膨出部３１は、出射方向に膨出する部分である。本実施形態においては、膨出部３１は、全体がドーム上に膨出している。膨出部３１は、傾斜面３１ａを有している。傾斜面３１ａは、膨出部３１の外周部分の表面であり、上記径方向および上記周方向、すなわちケース１の放熱部材１１の搭載面１１ａが広がる方向に対して傾斜した面である。係合部３２は、カバー３の外周端に設けられており、ケース１の放熱部材１１の係合部１１ｃと係合することにより、カバー３をケース１に取り付ける機能を果たす。 In this embodiment, the cover 3 has a circular shape in a plan view, and includes a bulging portion 31, an engaging portion 32, and a high friction portion 33. The bulging portion 31 is a portion that bulges in the emission direction. In the present embodiment, the entire bulging portion 31 bulges on the dome. The bulging portion 31 has an inclined surface 31a. The inclined surface 31a is a surface of the outer peripheral portion of the bulging portion 31, and is a surface inclined with respect to the radial direction and the circumferential direction, that is, the direction in which the mounting surface 11a of the heat radiating member 11 of the case 1 spreads. The engaging portion 32 is provided at the outer peripheral end of the cover 3 and functions to attach the cover 3 to the case 1 by engaging with the engaging portion 11 c of the heat radiating member 11 of the case 1.
　高摩擦部３３は、人間の指が触れた場合に、カバー３のその他の部分よりも高い摩擦力を発揮することが意図された部分である。ただし、ここで言う摩擦力は、物体の表面において、この表面に垂直な方向に作用する純粋な摩擦力に加えて、一方の物体の形状的な特徴（たとえば凹凸など）によって生じる力も含む概念である。高摩擦部３３は、膨出部３１の傾斜面３１ａに設けられており、本実施形態においては、上記周方向全周にわたって設けられている。 The high friction part 33 is a part intended to exhibit a higher frictional force than other parts of the cover 3 when a human finger touches it. However, the frictional force mentioned here is a concept that includes, on the surface of an object, not only a pure frictional force acting in a direction perpendicular to the surface but also a force generated by the shape characteristic of one object (for example, unevenness). is there. The high friction part 33 is provided on the inclined surface 31a of the bulging part 31, and in the present embodiment, is provided over the entire circumference in the circumferential direction.
　図１および図２に示すように、本実施形態においては、高摩擦部３３は、複数のリブ３４によって構成されている。図５～図７に示すように、リブ３４は、平面視において上記径方向に延びており、傾斜面３１ａから出射方向に起立している。リブ３４の長さＬは、たとえば５ｍｍ～１０ｍｍである。リブ３４の幅Ｗは、たとえば０．５ｍｍ～２．０ｍｍである。リブ３４の高さＨは、たとえば　　ｍｍである。複数のリブ３４のピッチＰは、２．０ｍｍ～４．０ｍｍである。このようなサイズおよび配置とされた複数のリブ３４は、指が触れた場合に上述した摩擦力を高める機能を果たす。このような機能を果たすためには、長さＬは５ｍｍ～２０ｍｍ、幅Ｗは０．５ｍｍ～２．０ｍｍ、高さＨは０．５ｍｍ～５ｍｍ、ピッチＰは１．０ｍｍ～５．０ｍｍであることが好ましい。 As shown in FIGS. 1 and 2, in the present embodiment, the high friction portion 33 is constituted by a plurality of ribs 34. As shown in FIGS. 5 to 7, the rib 34 extends in the radial direction in a plan view, and stands up in the emission direction from the inclined surface 31a. The length L of the rib 34 is, for example, 5 mm to 10 mm. The width W of the rib 34 is, for example, 0.5 mm to 2.0 mm. The height H of the rib 34 is, for example, mm. The pitch P of the plurality of ribs 34 is 2.0 mm to 4.0 mm. The plurality of ribs 34 having such a size and arrangement serve to increase the above-described frictional force when touched by a finger. In order to fulfill these functions, the length L is 5 mm to 20 mm, the width W is 0.5 mm to 2.0 mm, the height H is 0.5 mm to 5 mm, and the pitch P is 1.0 mm to 5.0 mm. Preferably there is.
　図１１は、ＬＥＤ照明モジュールＡ１を天井８に取り付ける工程を示している。天井８には、取り付け穴８１が設けられており、その内部にリフレクタ８２が備え付けられている。また、取り付け穴８１の奥方には、給電部８３が設けられている。給電部８３は、ＩＥＣ規格のＧＸ５３型の口金が装着可能に構成されている。取り付け穴８１の下方からＬＥＤ照明モジュールＡ１を上昇させ、取り付け穴８１の奥方に位置させる。 FIG. 11 shows a process of attaching the LED illumination module A1 to the ceiling 8. The ceiling 8 is provided with a mounting hole 81, and a reflector 82 is provided therein. In addition, a power feeding portion 83 is provided in the depth of the attachment hole 81. The power supply unit 83 is configured so that a GX53 type cap of IEC standard can be mounted. The LED illumination module A <b> 1 is raised from below the attachment hole 81, and is positioned behind the attachment hole 81.
　次いで、図１２に示すように、ＬＥＤ照明モジュールＡ１を給電部８３に対して相対回転させる。これにより、口金１４の２つのピン１３が給電部８３に係合する。また、絶縁部材１２の凸部１２ａの溝部１２ｂが給電部８３に係合する。この相対回転は、平面視円形状であるＬＥＤ照明モジュールＡ１を軸方向に延びる軸周りに回転させるものである。この際、使用者は、指をカバー３の高摩擦部３３に触れさせた姿勢で、ＬＥＤ照明モジュールＡ１を回転させる。ＬＥＤ照明モジュールＡ１を給電部８３に取り付けることにより、ＬＥＤ照明モジュールＡ１は、給電部８３からの給電が可能であり、かつリフレクタ８２に囲まれた状態となる。これにより、いわゆるダウンライトが構成される。図外のスイッチによって電源投入されると、ＬＥＤ照明モジュールＡ１のＬＥＤ発光部２が点灯する。ＬＥＤ発光部２からの光は、カバー３を透過して一部が直接床面を照らし、他の一部がリフレクタ８２によって反射されることにより、床面や壁面を照らす。 Next, as shown in FIG. 12, the LED illumination module A <b> 1 is rotated relative to the power supply unit 83. Thereby, the two pins 13 of the base 14 are engaged with the power supply portion 83. Further, the groove portion 12 b of the convex portion 12 a of the insulating member 12 is engaged with the power feeding portion 83. This relative rotation is to rotate the LED illumination module A1 having a circular shape in plan view around an axis extending in the axial direction. At this time, the user rotates the LED illumination module A <b> 1 in a posture in which the finger is in contact with the high friction portion 33 of the cover 3. By attaching the LED illumination module A1 to the power supply unit 83, the LED illumination module A1 can be supplied with power from the power supply unit 83 and is surrounded by the reflector 82. Thereby, what is called a downlight is comprised. When the power is turned on by a switch not shown, the LED light emitting unit 2 of the LED illumination module A1 is turned on. The light from the LED light emitting unit 2 passes through the cover 3 and partly illuminates the floor surface directly, and the other part is reflected by the reflector 82 to illuminate the floor surface and wall surface.
　図１３は、ＬＥＤ照明モジュールＡ１を天井８から取り外す工程を示している。この際、使用者は、指をカバー３の高摩擦部３３に触れさせた姿勢で、ＬＥＤ照明モジュールＡ１を取り付けた際とは反対方向にＬＥＤ照明モジュールＡ１を回転させる。これにより、口金１４と給電部８３との係合が解かれ、ＬＥＤ照明モジュールＡ１が取り外される。 FIG. 13 shows a process of removing the LED illumination module A1 from the ceiling 8. At this time, the user rotates the LED illumination module A1 in a direction opposite to that when the LED illumination module A1 is attached in a posture in which the finger is in contact with the high friction portion 33 of the cover 3. Thereby, engagement with the nozzle | cap | die 14 and the electric power feeding part 83 is cancelled | released, and LED lighting module A1 is removed.
　次に、ＬＥＤ照明モジュールＡ１の作用について説明する。 Next, the operation of the LED lighting module A1 will be described.
　本実施形態によれば、カバー３の膨出部３１の傾斜面３１ａに高摩擦部３３が設けられている。これにより、高摩擦部３３は、上記出射方向に対して完全に垂直な面に設けられているものではなく、この垂直な面に対して傾斜した構成となっている。このため、使用者が高摩擦部３３に指を触れた際に、まっすぐに押し当てる格好とはならず、傾斜の分だけ高摩擦部３３を介してカバー３を挟むような触れ方を取ることができる。したがって、ＬＥＤ照明モジュールＡ１を上記軸周りによりスムーズに回転させることが可能であり、給電部８３への着脱をより容易に行うことができる。 According to the present embodiment, the high friction portion 33 is provided on the inclined surface 31 a of the bulging portion 31 of the cover 3. As a result, the high friction portion 33 is not provided on a surface that is completely perpendicular to the emission direction, but is inclined with respect to the perpendicular surface. For this reason, when the user touches the high friction portion 33 with his / her finger, the user does not feel that the user presses the finger directly, and the user touches the cover 3 through the high friction portion 33 by an amount corresponding to the inclination. Can do. Therefore, the LED illumination module A1 can be rotated more smoothly around the axis, and can be easily attached to and detached from the power supply unit 83.
　高摩擦部３３が、上記周方向の全周に形成されていることにより、使用者は、上記周方向位置の所望の部位に指を当てて、ＬＥＤ照明モジュールＡ１を回転させることができる。 Since the high friction portion 33 is formed on the entire circumference in the circumferential direction, the user can rotate the LED illumination module A1 by placing a finger on a desired portion in the circumferential position.
　高摩擦部３３が、各々が上記径方向に延びる複数のリブ３４を含んでいることにより、高摩擦部３３は上記周方向に沿う摩擦力をより発揮しやすい構成となっている。したがって、ＬＥＤ照明モジュールＡ１を回転させるのに適している。 Since the high friction part 33 includes a plurality of ribs 34 each extending in the radial direction, the high friction part 33 is configured to more easily exert a frictional force along the circumferential direction. Therefore, it is suitable for rotating the LED illumination module A1.
　リブ３４の長さＬを５ｍｍ～２０ｍｍｍｍとすること、幅Ｗを、０．５ｍｍ～２．０ｍｍとすること、ピッチＰを１．０ｍｍ～５．０ｍｍｍｍとすること、高さＨを、０．５ｍｍ～５ｍｍとすることは、人間の指が触れた際に、上記周方向に沿った摩擦力を好適に発揮させるという利点がある。 The length L of the rib 34 is set to 5 mm to 20 mm, the width W is set to 0.5 mm to 2.0 mm, the pitch P is set to 1.0 mm to 5.0 mm, and the height H is set to 0. When the thickness is 5 mm to 5 mm, there is an advantage that the frictional force along the circumferential direction is suitably exhibited when a human finger touches.
　ＬＥＤ発光部２において、複数のＬＥＤチップ２２が封止樹脂２４によって覆われている構成であることにより、ＬＥＤ発光部２は、あたかも面発光しているような外観を呈する。これにより、ＬＥＤ照明モジュールＡ１によって照らされた物体やＬＥＤ照明モジュールＡ１そのものが、複数の点光源に起因する明るさのばらつきが生じることを回避することができる。カバー３がＬＥＤ発光部２からの光を拡散させることにより、明るさおばらつきをさらに低減することができる。 In the LED light emitting unit 2, the plurality of LED chips 22 are covered with the sealing resin 24, so that the LED light emitting unit 2 has an appearance as if surface emitting. Thereby, it is possible to avoid variations in brightness caused by a plurality of point light sources in the object illuminated by the LED illumination module A1 and the LED illumination module A1 itself. The cover 3 diffuses the light from the LED light emitting unit 2, whereby the brightness variation can be further reduced.
　図１４～図１７は、本発明の他の実施形態を示している。なお、これらの図において、上記実施形態と同一または類似の要素には、上記実施形態と同一の符号を付している。 14 to 17 show other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.
　図１４は、本発明の第二実施形態に基づくＬＥＤ照明モジュールを示している。図１４は、ＬＥＤ照明モジュールＡ２を示す平面図である。本実施形態のＬＥＤ照明モジュールＡ２は、高摩擦部３３を構成する複数のリブ３４が上述した実施形態と異なっている。本実施形態においては、複数のリブ３４が２つの極大リブ３５を含んでいる。 FIG. 14 shows an LED illumination module according to the second embodiment of the present invention. FIG. 14 is a plan view showing the LED illumination module A2. The LED illumination module A2 of the present embodiment is different from the above-described embodiment in that the plurality of ribs 34 constituting the high friction portion 33 are described above. In the present embodiment, the plurality of ribs 34 include two maximum ribs 35.
　極大リブ３５は、これ以外のリブ３４よりも体積が大とされている。本実施形態においては、極大リブ３５は、リブ３４よりも長さＬが大であり、高さＨが高い。さらに、極大リブ３５は、リブ３４よりも幅Ｗが広い。なお、極大リブ３５の体積をリブ３４よりも大とする手法としては、長さＬ、高さＨおよび幅Ｗのすべてをリブ３４よりも大としてもよいし、これらのいずれかを選択的に大としてもよい。 The maximum rib 35 has a larger volume than the other ribs 34. In the present embodiment, the maximum rib 35 has a length L larger than that of the rib 34 and a height H. Further, the maximum rib 35 has a width W wider than that of the rib 34. As a method for making the volume of the maximal rib 35 larger than that of the rib 34, all of the length L, height H, and width W may be larger than the rib 34, or any one of these may be selectively used. May be large.
　２つの極大リブ３５は、周方向において２つのピン１３と一致する位置に設けられている。本実施形態においては、２つのピン１３が周方向において１８０°の角度をなすように配置されている。このため、２つの極大リブ３５も、周方向において１８０°の角度をなすように配置されている。 The two maximum ribs 35 are provided at positions that coincide with the two pins 13 in the circumferential direction. In the present embodiment, the two pins 13 are arranged so as to form an angle of 180 ° in the circumferential direction. For this reason, the two maximum ribs 35 are also arranged at an angle of 180 ° in the circumferential direction.
　このような実施形態によっても、給電部８３への着脱をより容易に行うことが可能である。また、２つの極大リブ３５によって、使用者は天井８の取り付け穴８１の奥方に位置し、視認できない２つのピン１３の周方向位置を容易に把握することができる。これにより、ＬＥＤ照明モジュールＡ２を給電部８３に係合させる際に、２つのピン１３と給電部８３との位置合わせを確実に行うことが可能であり、ＬＥＤ照明モジュールＡ２の取り付けをスムーズに行うことができる。 Also according to such an embodiment, it is possible to more easily attach and detach the power supply unit 83. Further, the two maximum ribs 35 allow the user to easily grasp the circumferential position of the two pins 13 that are located behind the mounting hole 81 of the ceiling 8 and cannot be visually recognized. Thereby, when engaging LED lighting module A2 with the electric power feeding part 83, it is possible to perform alignment with two pins 13 and the electric power feeding part 83 reliably, and attachment of LED lighting module A2 is performed smoothly. be able to.
　図１５は、本発明の第三実施形態に基づくＬＥＤ照明モジュールを示している。図１５は、図６に示す要部拡大断面図に相当するものである。本実施形態のＬＥＤ照明モジュールＡ３は、高摩擦部３３を構成する複数のリブ３４が上述した実施形態と異なっている。本実施形態においては、複数のリブ３４が複数の中位リブ３４ｂおよび最低位リブ３４ａを含んでいる。 FIG. 15 shows an LED illumination module according to the third embodiment of the present invention. FIG. 15 corresponds to an enlarged cross-sectional view of the main part shown in FIG. The LED illumination module A3 of the present embodiment is different from the above-described embodiment in that the plurality of ribs 34 that constitute the high friction portion 33 are different. In the present embodiment, the plurality of ribs 34 include a plurality of middle ribs 34b and a lowest rib 34a.
　最低位リブ３４ａは、両隣のリブ３４（中位リブ３４ｂ）よりも高さが低い。さらに、本実施形態においては、最低位リブ３４ａは、複数のリブ３４の中で最も高さが低い。複数の中位リブ３４ｂは、最低位リブ３４ａから上記周方向に離間するほど高さが高くなっている。このような構成により、複数の中位リブ３４ｂおよび最低位リブ３４ａを含む領域は、これ以外の領域よりも複数の中位リブ３４ｂおよび最低位リブ３４ａの上面の包絡面が凹んだ領域となっている。 The lowest rib 34a is lower in height than the adjacent ribs 34 (middle ribs 34b). Further, in the present embodiment, the lowest rib 34 a has the lowest height among the plurality of ribs 34. The plurality of middle ribs 34b become higher as they are separated from the lowest rib 34a in the circumferential direction. With such a configuration, the region including the plurality of middle ribs 34b and the lowest ribs 34a is a region in which the envelope surfaces of the upper surfaces of the plurality of middle ribs 34b and the lowest ribs 34a are recessed compared to the other regions. ing.
　このような実施形態によっても、給電部８３への着脱をより容易に行うことが可能である。また、複数の中位リブ３４ｂおよび最低位リブ３４ａによって包絡面が凹んだ領域は、使用者の指により沿いやすい形態となっている。したがって、より確実かつ容易にＬＥＤ照明モジュールＡ３を回転させることができる。 Also according to such an embodiment, it is possible to more easily attach and detach the power supply unit 83. Moreover, the area | region where the envelope surface was dented by the some middle rib 34b and the lowest rib 34a becomes a form which is easy to follow with a user's finger | toe. Therefore, the LED illumination module A3 can be rotated more reliably and easily.
　図１６は、本発明の第四実施形態に基づくＬＥＤ照明モジュールを示している。図１６は、ＬＥＤ照明モジュールＡ４を示す平面図である。本実施形態のＬＥＤ照明モジュールＡ４は、高摩擦部３３が複数の突起３６によって構成されている。 FIG. 16 shows an LED illumination module according to the fourth embodiment of the present invention. FIG. 16 is a plan view showing the LED illumination module A4. In the LED illumination module A4 of the present embodiment, the high friction part 33 is constituted by a plurality of protrusions 36.
　複数の突起３６は、カバー３の膨出部３１の傾斜面３１ａにおいて、周方向全周において離散的に配置されている。また、本実施形態においては、４個程度の突起３６が上記径方向に沿って配列されている。 The plurality of protrusions 36 are discretely arranged on the entire inclined surface 31 a of the bulging portion 31 of the cover 3 in the entire circumferential direction. In the present embodiment, about four protrusions 36 are arranged along the radial direction.
　このような実施形態によっても、給電部８３への着脱をより容易に行うことが可能である。 Also according to such an embodiment, it is possible to more easily attach and detach the power supply unit 83.
　図１７は、本発明の第五実施形態に基づくＬＥＤ照明モジュールを示している。図１７は、図４に示す断面図に相当する。本実施形態のＬＥＤ照明モジュールＡ５は、カバー３の形状が上述した実施形態と異なっている。本実施形態においては、カバー３は、膨出部３１を有するものの、膨出部３１は、上面が平坦となっており、全体がドーム形状とはなっていない。ただし、膨出部３１が周方向全周に傾斜面３１ａを有する点は同様である。また、この傾斜面３１ａに高摩擦部３３が設けられている。高摩擦部３３の具体的な構成は、上述したＬＥＤ照明モジュールＡ１～Ａ４のいずれの構成であってもよい。 FIG. 17 shows an LED lighting module according to the fifth embodiment of the present invention. FIG. 17 corresponds to the cross-sectional view shown in FIG. The LED illumination module A5 of the present embodiment is different from the above-described embodiment in the shape of the cover 3. In the present embodiment, the cover 3 includes the bulging portion 31, but the bulging portion 31 has a flat upper surface and does not have a dome shape as a whole. However, the point which the bulging part 31 has the inclined surface 31a in the circumferential direction perimeter is the same. Moreover, the high friction part 33 is provided in this inclined surface 31a. The specific configuration of the high friction portion 33 may be any configuration of the LED illumination modules A1 to A4 described above.
　このような実施形態によっても、給電部８３への着脱をより容易に行うことが可能である。 Also according to such an embodiment, it is possible to more easily attach and detach the power supply unit 83.
　図１８および図１９は、本発明の第六実施形態に基づくＬＥＤ照明モジュールを示している。本実施形態のＬＥＤ照明モジュールＡ６は、高摩擦部３３が、カバー３の周方向において互いに離間した複数のグループに分けられている点が、上述した実施形態と異なっている。 18 and 19 show an LED illumination module according to the sixth embodiment of the present invention. The LED illumination module A6 of this embodiment is different from the above-described embodiment in that the high friction portion 33 is divided into a plurality of groups separated from each other in the circumferential direction of the cover 3.
　本実施形態においては、高摩擦部３３は、複数のリブ３４によって構成されている。なお、高摩擦部３３は、ＬＥＤ照明モジュールＡ４における複数の突起３６によって構成されていてもよい。複数のリブ３４は、カバー３の周方向において互いに離間した３つのグループに分けられている。これらのグループは、たとえば周方向において１２０°の角度を隔てて配置されている。各グループは、たとえば５つのリブ３４によって構成されている。 In the present embodiment, the high friction part 33 is constituted by a plurality of ribs 34. In addition, the high friction part 33 may be comprised by the some protrusion 36 in LED lighting module A4. The plurality of ribs 34 are divided into three groups separated from each other in the circumferential direction of the cover 3. These groups are arranged with an angle of 120 ° in the circumferential direction, for example. Each group is constituted by five ribs 34, for example.
　このような実施形態によっても、給電部８３への着脱をより容易に行うことが可能である。また、高摩擦部３３の３つのグループは、ＬＥＤ照明モジュールＡ６の使用者が取り外しを行う際に、親指および人差し指と中指および薬指のいずれかとを高摩擦部３３に沿わせることを促す効果が期待できる。これらお指を用いて取り外しを行うことにより、ＬＥＤ照明モジュールＡ６をより安定してより確実に回転させることができる。 Also according to such an embodiment, it is possible to more easily attach and detach the power supply unit 83. In addition, the three groups of the high friction part 33 are expected to have an effect of prompting the user to use the LED illumination module A6 to place the thumb, index finger, middle finger, or ring finger along the high friction part 33. it can. By removing using these fingers, the LED illumination module A6 can be rotated more stably and more reliably.
　本発明に係るＬＥＤ照明モジュールは、上述した実施形態に限定されるものではない。本発明に係るＬＥＤ照明モジュールの各部の具体的な構成は、種々に設計変更自在である。 The LED illumination module according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the LED lighting module according to the present invention can be varied in design in various ways.

Claims (25)

  1. 　１以上のＬＥＤチップを有するＬＥＤ発光部と、
    　上記ＬＥＤ発光部を支持するケースと、
    　上記ＬＥＤ発光部とは反対側に設けられ、給電部に対して着脱可能である口金と、
    　上記ＬＥＤ発光部からの光を透過させるカバーと、を備えており、
    　上記口金と上記給電部との着脱は、上記口金を上記給電部に対して相対回転させる動作を含んでおり、
    　上記カバーは、上記ＬＥＤ発光部の光が出射させる方向に膨出しているとともに、上記相対回転の回転軸周りの周方向に沿って設けられた高摩擦部を有する、ＬＥＤ照明モジュール。     An LED light emitting unit having one or more LED chips;
    A case for supporting the LED light emitting unit;
    A base that is provided on the side opposite to the LED light emitting unit and is detachable from the power feeding unit;
    A cover that transmits light from the LED light emitting unit, and
    The attachment and detachment of the base and the power supply unit includes an operation of rotating the base relative to the power supply unit,
    The cover is an LED lighting module having a high friction portion provided along a circumferential direction around a rotation axis of the relative rotation, while bulging in a direction in which light of the LED light emitting portion is emitted.
  2. 　上記高摩擦部は、上記周方向の全周に形成されている、請求項１に記載のＬＥＤ照明モジュール。 The LED illumination module according to claim 1, wherein the high friction part is formed on the entire circumference in the circumferential direction.
  3. 　上記高摩擦部は、各々が上記回転軸方向視において径方向に延びる複数のリブを含んでいる、請求項１または２に記載のＬＥＤ照明モジュール。 The LED illumination module according to claim 1 or 2, wherein the high friction portion includes a plurality of ribs each extending in a radial direction when viewed in the rotational axis direction.
  4. 　上記リブの上記径方向における長さは、５ｍｍ～２０ｍｍである、請求項１ないし３のいずれかに記載のＬＥＤ照明モジュール。 4. The LED illumination module according to claim 1, wherein a length of the rib in the radial direction is 5 mm to 20 mm.
  5. 　上記リブの上記周方向における幅は、０．５ｍｍ～２．０ｍｍである、請求項１ないし４のいずれかに記載のＬＥＤ照明モジュール。 The LED illumination module according to any one of claims 1 to 4, wherein a width of the rib in the circumferential direction is 0.5 mm to 2.0 mm.
  6. 　上記複数のリブの上記周方向におけるピッチは、１．０ｍｍ～５．０ｍｍである、請求項１ないし５のいずれかに記載のＬＥＤ照明モジュール。 6. The LED illumination module according to claim 1, wherein a pitch of the plurality of ribs in the circumferential direction is 1.0 mm to 5.0 mm.
  7. 　上記リブの高さは、０．５ｍｍ～５ｍｍである、請求項１ないし６のいずれかに記載のＬＥＤ照明モジュール。 The LED lighting module according to any one of claims 1 to 6, wherein a height of the rib is 0.5 mm to 5 mm.
  8. 　上記複数のリブは、両隣の上記リブよりも高さが低い最低位リブを含む、請求項１ないし７のいずれかに記載のＬＥＤ照明モジュール。 The LED lighting module according to any one of claims 1 to 7, wherein the plurality of ribs include a lowest-order rib having a lower height than the adjacent ribs.
  9. 　上記複数のリブは、上記最低位リブと、この最低位リブから上記周方向に離間するほど高さが高くなる複数の中位リブと、を含む、請求項８に記載のＬＥＤ照明モジュール。 The LED lighting module according to claim 8, wherein the plurality of ribs include the lowest rib and a plurality of middle ribs that increase in height as the rib is separated from the lowest rib in the circumferential direction.
  10. 　上記口金は、１対のピンを含んでおり、
    　上記複数のリブのうち上記１対のピンと周方向位置が対応するものは、体積が最大である、請求項１ないし９のいずれかに記載のＬＥＤ照明モジュール。     The base includes a pair of pins,
    The LED lighting module according to any one of claims 1 to 9, wherein a volume of the plurality of ribs corresponding to the pair of pins in the circumferential direction has a maximum volume.
  11. 　上記複数のリブのうち上記１対のピンと周方向位置が対応するものは、最も高さが高い、請求項１０に記載のＬＥＤ照明モジュール。 The LED illumination module according to claim 10, wherein among the plurality of ribs, the one corresponding to the pair of pins and the circumferential position has the highest height.
  12. 　上記複数のリブのうち上記１対のピンと周方向位置が対応するものは、上記径方向における長さが最も長い、請求項１０または１１に記載のＬＥＤ照明モジュール。 The LED illumination module according to claim 10 or 11, wherein among the plurality of ribs, the pair of pins corresponding to the circumferential position has the longest length in the radial direction.
  13. 　上記高摩擦部は、複数の突起を含む、請求項１または２に記載のＬＥＤ照明モジュール。 The LED illumination module according to claim 1 or 2, wherein the high friction part includes a plurality of protrusions.
  14. 　上記高摩擦部は、上記周方向において互いに離間する複数のグループに分けられている、請求項１ないし１３のいずれかに記載のＬＥＤ照明モジュール。 The LED illumination module according to any one of claims 1 to 13, wherein the high friction portion is divided into a plurality of groups separated from each other in the circumferential direction.
  15. 　上記カバーは、全体がドーム状に膨出している、請求項１ないし１４のいずれかに記載のＬＥＤ照明モジュール。 The LED cover module according to any one of claims 1 to 14, wherein the cover bulges as a whole in a dome shape.
  16. 　上記カバーは、上記ＬＥＤ発光部からの光を拡散させつつ透過させる、請求項１５に記載のＬＥＤ照明モジュール。 The LED illumination module according to claim 15, wherein the cover transmits light from the LED light emitting unit while diffusing.
  17. 　上記カバーは、乳白色である、請求項１６に記載のＬＥＤ照明モジュール。 The LED illumination module according to claim 16, wherein the cover is milky white.
  18. 　上記ＬＥＤ発光部は、ＬＥＤ基板と、このＬＥＤ基板に実装された複数のＬＥＤチップと、これらのＬＥＤチップを覆う封止樹脂と、を具備している、請求項１ないし１７のいずれかに記載のＬＥＤ照明モジュール。 The said LED light emission part is equipped with the LED board, the some LED chip mounted in this LED board, and the sealing resin which covers these LED chips, The any one of Claim 1 thru | or 17 LED lighting module.
  19. 　上記ＬＥＤ基板は、セラミックスからなる基材を有する、請求項１８に記載のＬＥＤ照明モジュール。 The LED lighting module according to claim 18, wherein the LED substrate has a base material made of ceramics.
  20. 　上記封止樹脂には、上記ＬＥＤチップからの光によって励起されることにより上記ＬＥＤチップからの光とは異なる光を発する蛍光材料が混入されており、
    　上記ＬＥＤ発光部は、白色光を発する、請求項１８または１９に記載のＬＥＤ照明モジュール。     The sealing resin is mixed with a fluorescent material that emits light different from the light from the LED chip by being excited by the light from the LED chip,
    The LED lighting module according to claim 18 or 19, wherein the LED light emitting unit emits white light.
  21. 　上記複数のＬＥＤチップは２ワイヤタイプであり、
    　隣り合う上記ＬＥＤチップどうしが、ワイヤによって直接接続されている、請求項１８ないし２０のいずれかに記載のＬＥＤ照明モジュール。     The plurality of LED chips is a two-wire type,
    The LED lighting module according to claim 18, wherein the adjacent LED chips are directly connected by a wire.
  22. 　上記複数のＬＥＤチップのすべてが直列に接続されている、請求項２１に記載のＬＥＤ照明モジュール。 The LED lighting module according to claim 21, wherein all of the plurality of LED chips are connected in series.
  23. 　上記ケースおよび上記カバーは、平面視円形状である、請求項１ないし２２のいずれかに記載のＬＥＤ照明モジュール。 The LED lighting module according to any one of claims 1 to 22, wherein the case and the cover are circular in a plan view.
  24. 　上記ケースは、金属からなる放熱部材を有する、請求項２３に記載のＬＥＤ照明モジュール。 The LED lighting module according to claim 23, wherein the case has a heat dissipating member made of metal.
  25. 　上記ケースには、複数のフィンが形成されている、請求項２４に記載のＬＥＤ照明モジュール。 25. The LED lighting module according to claim 24, wherein the case is formed with a plurality of fins.
PCT/JP2015/054154 2014-02-20 2015-02-16 Led lighting module WO2015125738A1 (en)

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JP2011044412A (en) * 2009-08-24 2011-03-03 Toshiba Lighting & Technology Corp Lighting fixture
JP2011171160A (en) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp Led lamp device and led lighting system
JP2011171190A (en) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp Lighting system
JP2012204210A (en) * 2011-03-25 2012-10-22 Toshiba Lighting & Technology Corp Lamp device and lighting fixture

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Publication number Priority date Publication date Assignee Title
JP6145860B2 (en) * 2013-01-22 2017-06-14 パナソニックＩｐマネジメント株式会社 Illumination light source and illumination device

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JP2011044412A (en) * 2009-08-24 2011-03-03 Toshiba Lighting & Technology Corp Lighting fixture
JP2011171160A (en) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp Led lamp device and led lighting system
JP2011171190A (en) * 2010-02-19 2011-09-01 Toshiba Lighting & Technology Corp Lighting system
JP2012204210A (en) * 2011-03-25 2012-10-22 Toshiba Lighting & Technology Corp Lamp device and lighting fixture

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