WO2015113407A1 - Image sensor and data tranmission method thereof - Google Patents

Image sensor and data tranmission method thereof Download PDF

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Publication number
WO2015113407A1
WO2015113407A1 PCT/CN2014/087889 CN2014087889W WO2015113407A1 WO 2015113407 A1 WO2015113407 A1 WO 2015113407A1 CN 2014087889 W CN2014087889 W CN 2014087889W WO 2015113407 A1 WO2015113407 A1 WO 2015113407A1
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WO
WIPO (PCT)
Prior art keywords
data
pixel
reading
module
transmission
Prior art date
Application number
PCT/CN2014/087889
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English (en)
French (fr)
Inventor
Chen Li
Jianxin WEN
Yuhang Zhao
Original Assignee
Shanghai Integrated Circuit Research And Development Center Co., Ltd.
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Filing date
Publication date
Application filed by Shanghai Integrated Circuit Research And Development Center Co., Ltd. filed Critical Shanghai Integrated Circuit Research And Development Center Co., Ltd.
Priority to US15/104,236 priority Critical patent/US9979918B2/en
Publication of WO2015113407A1 publication Critical patent/WO2015113407A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
PCT/CN2014/087889 2014-01-30 2014-09-30 Image sensor and data tranmission method thereof WO2015113407A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US15/104,236 US9979918B2 (en) 2014-01-30 2014-09-30 Image sensor and data tranmission method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410045272.3 2014-01-30
CN201410045272.3A CN103780850B (zh) 2014-01-30 2014-01-30 像素分裂与合并图像传感器及其信号传输方法

Publications (1)

Publication Number Publication Date
WO2015113407A1 true WO2015113407A1 (en) 2015-08-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2014/087889 WO2015113407A1 (en) 2014-01-30 2014-09-30 Image sensor and data tranmission method thereof

Country Status (2)

Country Link
CN (1) CN103780850B (zh)
WO (1) WO2015113407A1 (zh)

Cited By (1)

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CN111491118A (zh) * 2020-05-08 2020-08-04 合肥海图微电子有限公司 一种用于图像传感器的可编程增益放大器电路

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CN103780850B (zh) * 2014-01-30 2017-12-15 上海集成电路研发中心有限公司 像素分裂与合并图像传感器及其信号传输方法
CN104301639A (zh) * 2014-07-18 2015-01-21 上海集成电路研发中心有限公司 超高帧率cmos图像传感器
CN104486602B (zh) * 2014-12-29 2018-04-06 上海集成电路研发中心有限公司 一种实现像素物理合并的结构和方法
WO2017101864A1 (zh) 2015-12-18 2017-06-22 广东欧珀移动通信有限公司 图像传感器、控制方法和电子装置
CN105578066B (zh) * 2015-12-18 2018-01-19 广东欧珀移动通信有限公司 成像方法、成像装置及电子装置
CN105516696A (zh) * 2015-12-18 2016-04-20 广东欧珀移动通信有限公司 图像传感器、成像方法、成像装置和电子装置
CN105611198B (zh) * 2015-12-18 2017-06-27 广东欧珀移动通信有限公司 图像传感器及具有其的终端
CN105516699B (zh) * 2015-12-18 2017-11-24 广东欧珀移动通信有限公司 图像传感器及其成像方法、成像装置和电子装置
CN105554419B (zh) * 2015-12-18 2018-04-10 广东欧珀移动通信有限公司 图像传感器及具有其的终端
CN105516695B (zh) * 2015-12-18 2018-06-15 广东欧珀移动通信有限公司 图像传感器和具有其的终端
CN105611258A (zh) * 2015-12-18 2016-05-25 广东欧珀移动通信有限公司 图像传感器的成像方法、成像装置和电子装置
CN107040733B (zh) * 2017-04-18 2020-10-20 中国科学院半导体研究所 Cmos图像传感器
CN108184081B (zh) * 2018-01-15 2021-01-08 北京时代民芯科技有限公司 一种用于cmos图像传感器中的中高速数据传输读出电路及读出通道
CN112906444B (zh) * 2019-12-04 2023-11-14 北京小米移动软件有限公司 有源像素传感器阵列、显示面板、电子设备
CN111131714A (zh) * 2019-12-31 2020-05-08 联想(北京)有限公司 图像采集控制方法、装置及电子设备
CN111246130B (zh) * 2020-01-16 2022-04-01 锐芯微电子股份有限公司 存储单元阵列、量化电路阵列及其读取控制方法
US11363226B2 (en) * 2020-04-27 2022-06-14 Shenzhen GOODIX Technology Co., Ltd. Ping pong readout structure in image sensor with dual pixel supply
CN111741240B (zh) * 2020-08-21 2020-12-22 深圳市汇顶科技股份有限公司 图像传感器、指纹检测装置和电子设备
WO2022036713A1 (zh) 2020-08-21 2022-02-24 深圳市汇顶科技股份有限公司 图像传感器、指纹检测装置和电子设备
CN113709391B (zh) * 2021-08-26 2023-12-05 锐芯微电子股份有限公司 Cmos图像传感器及其读取方法

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US20060221221A1 (en) * 2003-06-11 2006-10-05 Makoto Furukawa Scanning circuit of image sensor
CN101521755A (zh) * 2008-12-15 2009-09-02 昆山锐芯微电子有限公司 Cmos图像传感器读出电路及读出方法
US20100283881A1 (en) * 2009-05-11 2010-11-11 Sony Corporation Solid-state imaging apparatus, driving method of the solid-state imaging apparatus, and electronic equipment
CN103780850A (zh) * 2014-01-30 2014-05-07 上海集成电路研发中心有限公司 像素分裂与合并图像传感器及其信号传输方法

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CN101459758B (zh) * 2008-12-31 2011-06-08 昆山锐芯微电子有限公司 图像传感器
JP5272860B2 (ja) * 2009-04-08 2013-08-28 ソニー株式会社 固体撮像素子およびカメラシステム
US8350940B2 (en) * 2009-06-08 2013-01-08 Aptina Imaging Corporation Image sensors and color filter arrays for charge summing and interlaced readout modes
US8730364B2 (en) * 2010-11-09 2014-05-20 Omnivision Technologies, Inc. Image sensor with pipelined column analog-to-digital converters

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US20060221221A1 (en) * 2003-06-11 2006-10-05 Makoto Furukawa Scanning circuit of image sensor
CN101521755A (zh) * 2008-12-15 2009-09-02 昆山锐芯微电子有限公司 Cmos图像传感器读出电路及读出方法
US20100283881A1 (en) * 2009-05-11 2010-11-11 Sony Corporation Solid-state imaging apparatus, driving method of the solid-state imaging apparatus, and electronic equipment
CN103780850A (zh) * 2014-01-30 2014-05-07 上海集成电路研发中心有限公司 像素分裂与合并图像传感器及其信号传输方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111491118A (zh) * 2020-05-08 2020-08-04 合肥海图微电子有限公司 一种用于图像传感器的可编程增益放大器电路
CN111491118B (zh) * 2020-05-08 2022-07-08 合肥海图微电子有限公司 一种用于图像传感器的可编程增益放大器电路

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CN103780850B (zh) 2017-12-15

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