WO2015107570A1 - ガスレーザ発振装置、ガスレーザ発振方法およびガスレーザ加工機 - Google Patents
ガスレーザ発振装置、ガスレーザ発振方法およびガスレーザ加工機 Download PDFInfo
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- WO2015107570A1 WO2015107570A1 PCT/JP2014/004202 JP2014004202W WO2015107570A1 WO 2015107570 A1 WO2015107570 A1 WO 2015107570A1 JP 2014004202 W JP2014004202 W JP 2014004202W WO 2015107570 A1 WO2015107570 A1 WO 2015107570A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
- H01S3/036—Means for obtaining or maintaining the desired gas pressure within the tube, e.g. by gettering, replenishing; Means for circulating the gas, e.g. for equalising the pressure within the tube
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/03—Constructional details of gas laser discharge tubes
- H01S3/034—Optical devices within, or forming part of, the tube, e.g. windows, mirrors
- H01S3/0346—Protection of windows or mirrors against deleterious effects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/07—Construction or shape of active medium consisting of a plurality of parts, e.g. segments
- H01S3/073—Gas lasers comprising separate discharge sections in one cavity, e.g. hybrid lasers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
- H01S3/104—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation in gas lasers
Definitions
- the present disclosure relates to a kW (kilowatt) class axial flow type gas laser oscillation device, a gas laser oscillation method, and a gas laser processing machine, which are mainly used for sheet metal cutting.
- the gas laser oscillation apparatus 900 includes a discharge tube 901, electrodes 902 and 903 provided around the discharge tube 901, and a power source 904 connected to the electrodes 902 and 903.
- the discharge space 905 is a space inside the discharge tube 901 and sandwiched between the electrode 902 and the electrode 903.
- a total reflection mirror 906 and a partial reflection mirror 907 are arranged outside the both ends of the discharge tube 901, respectively. As a result, an optical resonator is formed, and the laser beam 908 is output from the partial reflection mirror 907.
- a laser gas flow path 909 is connected to the discharge tube 901, and heat exchangers 910 and 911 and a blower 912 are provided in the laser gas flow path 909.
- the blower 912 circulates the laser gas in the direction of the arrow 913 inside the discharge tube 901 and the laser gas flow path 909.
- the total reflection mirror 906 is held by a total reflection mirror holding portion 914a, and is connected to the left end of the discharge region via a non-discharge tube 915, a copper ring 916, and the like.
- the partial reflection mirror 907 is held by the partial reflection mirror holding portion 914b, and is connected to the right end of the discharge region via the non-discharge tube 915, the copper ring 916, and the like.
- the copper ring 916 has a laser gas introduction portion 917 that is opened in a slit shape, and a connection portion between the non-discharge tube 915 and the copper ring 916 is covered with a connecting tube 918.
- the connecting tube 918 on the total reflection mirror 906 side and the connecting tube 918 on the partial reflection mirror 907 side are connected to a laser gas supply device 919.
- the laser gas supplied from the laser gas supply device 919 is supplied to the discharge tube 901 through the connecting tube 918, the laser gas introduction portion 917 of the copper ring 916, and the non-discharge tube 915. Since the laser gas introduction part 917 is a slit-shaped opening, the turbulent flow of the laser gas does not occur around the total reflection mirror 906 or the partial reflection mirror 907. Therefore, the gas laser oscillation device 900 can stably output the laser beam 908.
- the laser gas introduction part is a slit-shaped opening
- the amount of laser gas introduced is larger than usual, turbulence occurs near the total reflection mirror or the partial reflection mirror. End up. Due to the turbulent flow of the laser gas, the discharge becomes unstable and the output of the laser beam becomes unstable.
- a gas laser oscillation device of the present disclosure includes a laser oscillation unit, a first laser gas supply port, a laser gas discharge port, a first laser gas introduction port, a laser gas circulation path, And a laser gas inlet.
- the laser oscillation unit includes one of a total reflection mirror and a partial reflection mirror provided at the first end, a total reflection mirror provided at the second end opposite to the first end, The other of the partial reflecting mirrors and a first discharge tube for exciting the laser gas.
- the first laser gas supply port is provided between the partial reflection mirror and the first discharge tube, and supplies the laser gas to the laser oscillation unit.
- the laser gas discharge port is provided between the total reflection mirror and the first discharge tube, and discharges the laser gas from the laser oscillation unit.
- the first laser gas introduction port is provided between the partial reflection mirror and the first discharge tube, and introduces a laser gas into the laser oscillation unit.
- the laser gas circulation path connects the first laser gas supply port and the laser gas discharge port.
- the second laser gas introduction port is provided in the laser gas circulation path and introduces the laser gas into the laser gas circulation path.
- the laser gas introduction mechanism is connected to the first laser gas introduction port and the second laser gas introduction port.
- the gas laser oscillation method of the present disclosure includes a first laser gas introduction step, a circulation step, a laser oscillation step, and a second laser gas introduction step.
- a laser gas is introduced into the laser oscillation unit.
- the circulation step the laser gas in the laser gas oscillation unit is circulated by the laser gas circulation path connected to the laser oscillation unit.
- a voltage is applied to the laser gas oscillation unit to excite the laser gas.
- the second laser gas introduction step laser gas is introduced into the laser gas circulation path.
- the gas laser processing machine of the present disclosure includes the above-described gas laser oscillation device, a reflection mirror, a torch, and a table.
- the reflection mirror reflects the laser output from the gas laser oscillation device.
- the torch has a condensing lens that condenses the laser beam reflected by the reflecting mirror.
- the table holds a workpiece to be irradiated with the laser beam condensed by the condenser lens.
- the gas laser oscillation device, the gas laser oscillation method, and the gas laser processing machine of the present disclosure increase the amount of laser gas in the laser oscillation unit without increasing the amount of laser gas introduced near the total reflection mirror or the partial reflection mirror of the laser oscillation unit. Can be made. Thereby, even when the operation of the gas laser oscillation apparatus is resumed, a stable laser beam can be output quickly.
- FIG. 1 is a configuration diagram of a gas laser oscillation apparatus according to Embodiment 1.
- FIG. 2 is a flowchart showing an operation procedure of the gas supply device according to the first embodiment.
- FIG. 3 is a configuration diagram of a gas laser processing machine using the gas laser oscillation apparatus according to the first embodiment.
- FIG. 4 is a configuration diagram of the gas laser oscillation apparatus according to the second embodiment.
- FIG. 5 is a configuration diagram of the gas laser oscillation apparatus according to the second embodiment.
- FIG. 6 is a configuration diagram of a conventional gas laser oscillation device.
- Embodiment 1 First, the gas laser oscillation apparatus of Embodiment 1 is demonstrated.
- FIG. 1 is a configuration diagram of an axial flow type gas laser oscillation device 100 according to the present embodiment.
- the axial flow type gas laser oscillation device 100 includes a laser oscillation unit 110, a laser gas circulation mechanism 130, and a laser gas introduction mechanism 140.
- the laser oscillation unit 110 includes a discharge tube 111 formed of a dielectric material such as glass, and the inside of the discharge tube 111 is a discharge unit 112.
- the laser oscillation unit 110 includes a discharge unit 112, a laser gas supply port 113 (first laser gas supply port), a laser gas discharge port 114 (first laser gas discharge port), and a laser gas introduction port 115 (first laser gas introduction port).
- a laser gas supply port 113 first laser gas supply port
- a laser gas discharge port 114 first laser gas discharge port
- laser gas introduction port 115 first laser gas introduction port
- discharge occurs by the electrode 116 (first electrode) and the electrode 117 (second electrode) provided outside the discharge tube 111.
- a high voltage is applied between the electrode 116 and the electrode 117 by the power source 118.
- discharge occurs in the discharge unit 112, the laser gas inside the discharge unit 112 is excited, and the laser is oscillated.
- a total reflection mirror 119 is provided at one end (first end) of the laser oscillation unit 110, and a partial reflection mirror 120 is provided at the other end (second end) of the laser oscillation unit 110.
- the laser gas supply port 113 is positioned between the discharge unit 112 and the partial reflection mirror 120, and the laser gas discharge port 114 is positioned between the discharge unit 112 and the total reflection mirror 119.
- the laser gas introduction port 115 is located closer to the partial reflection mirror 120 than the laser gas supply port 113.
- the laser oscillated by the discharge unit 112 resonates between the total reflection mirror 119 and the partial reflection mirror 120, and is output as laser light 121 from the partial reflection mirror 120 to the outside of the laser oscillation unit 110 when a predetermined energy is exceeded.
- the laser beam 121 is used for laser processing or the like.
- the laser gas circulation mechanism 130 is connected to the laser oscillation unit 110 so as to supply laser gas to the laser oscillation unit 110 via the laser gas supply port 113 and to discharge laser gas from the laser oscillation unit 110 via the laser gas discharge port 114. .
- the laser gas circulation mechanism 130 includes a laser gas circulation path 131, heat exchangers 132 and 133, a blower 134, a laser gas inlet 135 (second laser gas inlet), a laser gas outlet 136, and an exhaust pump 137.
- a laser gas circulation path 131 indicates the entire area from the laser gas supply port 113 to the laser gas discharge port 114.
- the heat exchanger 132, the laser gas outlet 136, the blower 134, the heat exchanger 133, and the laser gas inlet 135 are provided in the laser gas circulation path 131 in this order from the laser gas outlet 114 side.
- the heat exchangers 132 and 133 cool the laser gas that has become high temperature due to the discharge in the laser oscillation unit 110 and the operation of the blower 134.
- the blower 134 circulates the laser gas so as to go from the laser gas discharge port 114 to the laser gas supply port 113. Due to the circulation of the laser gas by the blower 134, the laser gas flows at about 100 m / second in the discharge unit 112.
- the laser gas introduction mechanism 140 includes a laser gas introduction path 141 connected to the laser gas introduction port 115, a laser gas introduction path 142 connected to the laser gas introduction port 135, and a laser gas introduction device 143.
- the laser gas introduction device 143 includes a timer 144, a control unit 145, a laser gas cylinder 146, and on-off valves 147 and 148.
- the laser gas introduction path 141 is provided with an on-off valve 147 (first on-off valve) and is connected to the laser gas cylinder 146.
- the laser gas introduction path 142 is provided with an on-off valve 148 (second on-off valve) and is connected to the laser gas cylinder 146.
- the control unit 145 is connected to the timer 144, the on-off valves 147 and 148, the power source 118, and the exhaust pump 137, and controls each of them.
- the gas laser oscillation apparatus of the present embodiment has the laser gas introduction port 135 for introducing the laser gas into the laser gas circulation path 131 in addition to the laser gas introduction port 115 for introducing the laser gas into the laser oscillation unit 110.
- the amount of laser gas introduced into the laser oscillation unit 110 is the same as during normal operation, and the flow rate of the laser gas inside the laser oscillation unit 110 is greater than during normal operation. You can do more.
- the gas laser oscillation apparatus 100 of this Embodiment can output a stable laser beam at an early stage even when the operation is resumed.
- the laser oscillation unit 110 In the gas laser oscillation device 100 during normal operation, the laser oscillation unit 110, the laser gas circulation mechanism 130, and the laser gas introduction mechanism 140 are driven as follows.
- the power source 118 applies a high voltage to the first electrode 116 and the second electrode 117, whereby the laser gas in the discharge unit 112 is excited and the laser is oscillated.
- the laser oscillated by the discharge unit 112 resonates between the total reflection mirror 119 and the partial reflection mirror 120, and is output as laser light 121 from the partial reflection mirror 120 to the outside of the laser oscillation unit 110 when a predetermined energy is exceeded.
- the on-off valve 147 is opened and the on-off valve 148 is closed.
- new laser gas is supplied to the laser oscillation unit 110 only from the laser gas inlet 115.
- the laser gas outlet 136 is opened, and the same amount of deteriorated laser gas as the laser gas introduced from the laser gas inlet 115 is taken out from the laser gas circulation path 131. Thereby, the internal pressure of the laser oscillation unit 110 is kept constant, and the deteriorated laser gas can be replaced with a new laser gas. Further, by operating the heat exchangers 132 and 133 and the blower 134, the cooled laser gas is supplied to the laser oscillation unit 110 at a constant speed.
- the laser oscillation can be stably performed by the laser oscillation unit 110 by cooling and replacing the laser gas, and the laser beam 121 can be stably output from the gas laser oscillation device 100.
- the flow rate of the laser gas inside the laser oscillation unit 110 needs to be increased from that during normal operation until impurities are removed.
- the flow rate of the laser gas inside the laser oscillation unit 110 when the operation is resumed is set to 5 times or more that during the normal operation, and this laser gas flow rate is maintained for 5 minutes.
- step S1 of FIG. 2 the on-off valve 147 is opened, and laser gas is introduced into the laser oscillation unit 110 from the laser gas inlet 115.
- the laser gas circulation mechanism 130 starts operation of the heat exchangers 132 and 133, the blower 134, and the exhaust pump 137, and the laser gas outlet 136 is also opened.
- the control unit 145 controls the power supply 118 of the laser oscillation unit 110 to apply a high voltage between the first electrode 116 and the second electrode 117.
- the power supply 118 transmits a discharge start signal indicating whether or not the discharge in the discharge unit 112 has occurred to the control unit 145.
- the laser gas is introduced into the laser oscillation unit 110 from the laser gas inlet 115 and the laser gas circulation mechanism 130 circulates the laser gas.
- step S3 of FIG. 2 when discharge is started in the discharge unit 112, the control unit 145 opens the on-off valve 148 and introduces the laser gas from the laser gas inlet 135 to the laser gas circulation path 131.
- the rotational speed of the exhaust pump 137 is increased, and the amount of laser gas discharged from the laser gas outlet 136 is increased.
- a laser gas four times the amount of laser gas introduced from the laser gas inlet 115 is introduced from the laser gas inlet 135.
- the amount of laser gas discharged from the laser gas outlet 136 is increased five times.
- a laser gas having a flow rate five times that during normal operation can be supplied to the discharge unit 112 and the laser gas circulation path 131.
- the pressure of the laser gas such as the discharge unit 112 hardly increases.
- step S ⁇ b> 5 of FIG. 2 the timer 144 newly starts counting time from the time when it is reset, and transmits the count time to the control unit 145.
- step S6 of FIG. 2 if the count time of the timer 144 is less than 5 minutes, the control unit 145 maintains the open / close valve 148 in an open state.
- step S7 of FIG. 2 when the count time of the timer 144 reaches 5 minutes, the control unit 145 closes the on-off valve 148 and the gas laser oscillation device 100 performs normal operation. Control during normal operation is as described above.
- the amount of laser gas introduced into the laser oscillation unit 110 is the same as that during normal operation.
- the flow rate of the laser gas inside 110 can be increased to about five times that during normal operation.
- the gas laser processing machine 300 of the present embodiment includes a gas laser oscillation device 100, a reflection mirror 301, a torch 302, a condensing lens 303 in the torch 302, a table 304, and an X-axis motor. 305 and a Y-axis motor 306.
- the gas laser processing machine 300 performs processing such as welding and cutting on the workpiece 307 mounted on the table 304.
- the laser beam output from the gas laser oscillation device 100 is reflected by the reflection mirror 301 toward the condenser lens 303 in the torch 302.
- the condensing lens 303 condenses the incident laser beam and irradiates the workpiece 307.
- the torch 302 is moved by the X-axis motor 305 and the Y-axis motor 306 in accordance with the machining shape of the workpiece 307.
- the table 304 can be moved in accordance with the machining shape of the workpiece 307.
- Embodiment 2 Next, the gas laser oscillation apparatus of Embodiment 2 is demonstrated.
- FIG. 4 is a configuration diagram of an axial-flow type gas laser oscillation device 400 according to the present embodiment
- FIG. 5 is a configuration diagram of another axial-flow type gas laser oscillation device 500 according to the present embodiment.
- the same components as those of the gas laser oscillation device 100 of the first embodiment are denoted by the same reference numerals and description thereof is omitted.
- the gas laser oscillation device 400 is different from the gas laser oscillation device 100 in the following points.
- the laser oscillation unit 410 of the gas laser oscillation device 400 includes a discharge tube 411 (second discharge tube) and a discharge unit 412 (second discharge) in addition to the laser oscillation unit 110 of the gas laser oscillation device 100. Part), a laser gas supply port 413 (second laser gas supply port), a laser gas introduction port 415 (third laser gas introduction port), an electrode 416 (third electrode), and an electrode 417 (fourth electrode) And a power source 418 (second power source).
- the control unit 145 controls the two power supplies 118 and 418.
- a laser gas discharge port 114 is positioned between the two discharge tubes 111 and 411, and the respective components are positioned symmetrically.
- the laser gas circulation path 431 is divided into two downstream from the heat exchanger 133, and is connected to the two laser gas supply ports 113 and 413.
- the laser gas introduction mechanism 440 has two laser gas introduction paths 441 downstream of the on-off valve 147 and is connected to two laser gas introduction ports 115 and 415.
- the gas laser oscillation device 400 is provided with discharge parts 112 and 412 on the left and right sides, and has two laser gas supply ports 113 and 413 and two laser gas introduction ports 115 and 415, respectively. As a result, the amount of laser gas at each laser gas supply port and laser gas inlet can be reduced, and turbulent laser gas flow can be suppressed.
- the gas laser oscillation device 500 is different from the gas laser oscillation device 400 in the following points.
- the laser gas introduction mechanism 540 of the gas laser oscillation apparatus 500 has a laser gas introduction path 542 divided into two.
- the two divided laser gas introduction paths 542 are connected by a laser gas introduction port 135 and a laser gas introduction port 535 (fourth laser gas introduction port) of the two divided laser gas circulation paths 431.
- new laser gas can be introduced equally to the left and right without being affected by the flow of laser gas from the heat exchanger 133.
- gas laser processing machine shown in FIG. 3 it is possible to use the gas laser oscillation device 400 or the gas laser oscillation device 500 instead of the gas laser oscillation device 100.
- the laser gas inlets 115 and 415 may have a slit shape along the side surface of the laser oscillation unit 110. Thereby, the laser gas is introduced from the entire side surface of the laser oscillation unit 110, and the turbulent flow of the laser gas introduced from the laser gas inlets 115 and 415 can be suppressed.
- the gas laser oscillation device, gas laser oscillation method, and gas laser processing machine of the present disclosure can output a stable laser beam quickly even when the operation of the gas laser oscillation device is resumed, and are useful in cutting and welding processing.
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Abstract
Description
まず、実施の形態1のガスレーザ発振装置について説明する。
次に、実施の形態2のガスレーザ発振装置について説明する。
110,410 レーザ発振部
111,411,901 放電管
112,412 放電部
113,413 レーザガス供給口
114,414 レーザガス排出口
115,135,415,535 レーザガス導入口
116,117,416,417,902,903 電極
118,418,904 電源
119,906 全反射鏡
120,907 部分反射鏡
121 レーザ光
130,430 レーザガス循環機構
131,431 レーザガス循環経路
132,133,910,911 熱交換器
134,912 送風機
136 レーザガス取り出し口
137 排気ポンプ
140,440,540 レーザガス導入機構
141,142,441,542 レーザガス導入経路
143 レーザガス導入装置
144 タイマ
145 制御部
146 レーザガスボンベ
147,148 開閉弁
300 ガスレーザ加工機
301 反射ミラー
302 トーチ
303 集光レンズ
304 テーブル
305 X軸モータ
306 Y軸モータ
307 加工ワーク
905 放電空間
908 レーザビーム
909 レーザガス流路
913 矢印
914a 全反射鏡保持部
914b 部分反射鏡保持部
915 無放電管
916 銅リング
917 レーザガス導入部
918 つなぎ管
919 レーザガス供給装置
Claims (9)
- 第1の端部に設けられた全反射鏡および部分反射鏡のうちの一方と、前記第1の端部とは反対側の第2の端部に設けられた全反射鏡および部分反射鏡のうちの他方と、レーザガスを励起する第1の放電管と、を有するレーザ発振部と、
前記第1の端部と前記第1の放電管との間に設けられ、前記レーザ発振部にレーザガスを供給する第1のレーザガス供給口と、
前記第2の端部と前記第1の放電管との間に設けられ、前記レーザ発振部からレーザガスを排出するレーザガス排出口と、
前記第1の端部と前記第1の放電管との間に設けられ、前記レーザ発振部にレーザガスを導入する第1のレーザガス導入口と、
前記第1のレーザガス供給口と前記レーザガス排出口とを接続するレーザガス循環経路と、
前記レーザガス循環経路に設けられ、前記レーザガス循環経路にレーザガスを導入する第2のレーザガス導入口と、
前記第1のレーザガス導入口および前記第2のレーザガス導入口に接続されたレーザガス導入機構と、を備えたガスレーザ発振装置。 - 前記レーザガス循環経路に設けられ、前記レーザガス排出口から前記第1のレーザガス供給口に向けてレーザガスを循環させる送風機をさらに備え、
前記第2のレーザガス導入口は、前記送風機と前記第1のレーザガス供給口との間に設けられている請求項1に記載のガスレーザ発振装置。 - 前記レーザガス循環経路に設けられ、前記レーザガス循環経路からレーザガスを取り出すレーザガス取り出し口をさらに備え、
前記レーザガス取り出し口は、前記送風機と前記レーザガス排出口との間に設けられている請求項2に記載のガスレーザ発振装置。 - 前記レーザガス循環経路における、前記レーザガス排出口と前記送風機の間に設けられた第1の熱交換器と、
前記レーザガス循環経路における、前記第1のレーザガス供給口と前記送風機の間に設けられた第2の熱交換器と、をさらに備えた請求項2または3に記載のガスレーザ発振装置。 - 前記第1のレーザガス導入口は、前記第1のレーザガス供給口と前記第1の端部との間に設けられた請求項1~4のいずれかに記載のガスレーザ発振装置。
- 前記レーザガス排出口と前記第2の端部との間に設けられた、レーザガスを励起する第2の放電管と、
前記第2の端部と前記第2の放電管との間に設けられ、前記レーザ発振部にレーザガスを供給する第2のレーザガス供給口と、
前記第2の端部と前記第2の放電管との間に設けられ、前記レーザ発振部にレーザガスを導入する第3のレーザガス導入口と、をさらに備え、
前記レーザガス循環経路は、前記第2のレーザガス供給口と接続されている請求項1~5のいずれかに記載のガスレーザ発振装置。 - 前記レーザガス循環経路に設けられ、前記レーザガス循環経路にレーザガスを導入する第4のレーザガス導入口をさらに備え、
前記第4のレーザガス導入口は、前記レーザガス排出口と前記第2のレーザガス導入口との間に設けられている請求項6に記載のガスレーザ発振装置。 - レーザ発振部にレーザガスを導入する第1のレーザガス導入工程と、
前記レーザ発振部に接続されたレーザガス循環経路によって、レーザガス発振部のレーザガスを循環させる循環工程と、
前記レーザガス発振部に電圧を印加し、レーザガスを励起するレーザ発振工程と、
前記レーザガス循環経路にレーザガスを導入する第2のレーザガス導入工程と、を備え、
前記レーザ発振工程においてレーザが発振したことを検出すると、前記第2のレーザガス導入工程を開始し、所定時間が経過すると前記第2のレーザガス導入工程を終了するガスレーザ発振方法。 - 請求項1~7に記載のガスレーザ発振装置と、
前記ガスレーザ発振装置から出力されたレーザを反射する反射ミラーと、
前記反射ミラーによって反射されたレーザを集光する集光レンズを有するトーチと、
前記集光レンズによって集光されたレーザを照射する加工ワークを保持するテーブルとを備えたガスレーザ加工機。
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EP14878908.4A EP3021431A4 (en) | 2014-01-15 | 2014-08-18 | GAS LASER OSCILLATION APPARATUS, GAS LASER OSCILLATION METHOD, AND GAS LASER PROCESSING MACHINE |
US14/890,155 US20160111846A1 (en) | 2014-01-15 | 2014-08-18 | Gas laser oscillation apparatus, gas laser oscillation method and gas laser processing machine |
JP2015557581A JPWO2015107570A1 (ja) | 2014-01-15 | 2014-08-18 | ガスレーザ発振装置、ガスレーザ発振方法およびガスレーザ加工機 |
CN201480037321.7A CN105359355A (zh) | 2014-01-15 | 2014-08-18 | 气体激光振荡装置、气体激光振荡方法以及气体激光加工机 |
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WO2021186656A1 (ja) * | 2020-03-19 | 2021-09-23 | ギガフォトン株式会社 | レーザ装置及び電子デバイスの製造方法 |
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- 2014-08-18 US US14/890,155 patent/US20160111846A1/en not_active Abandoned
- 2014-08-18 CN CN201480037321.7A patent/CN105359355A/zh active Pending
- 2014-08-18 WO PCT/JP2014/004202 patent/WO2015107570A1/ja active Application Filing
- 2014-08-18 EP EP14878908.4A patent/EP3021431A4/en not_active Withdrawn
- 2014-08-18 JP JP2015557581A patent/JPWO2015107570A1/ja active Pending
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US20160111846A1 (en) | 2016-04-21 |
CN105359355A (zh) | 2016-02-24 |
JPWO2015107570A1 (ja) | 2017-03-23 |
EP3021431A1 (en) | 2016-05-18 |
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