WO2015106676A1 - 一种柔性发光器件及其制造的方法和系统 - Google Patents
一种柔性发光器件及其制造的方法和系统 Download PDFInfo
- Publication number
- WO2015106676A1 WO2015106676A1 PCT/CN2015/070624 CN2015070624W WO2015106676A1 WO 2015106676 A1 WO2015106676 A1 WO 2015106676A1 CN 2015070624 W CN2015070624 W CN 2015070624W WO 2015106676 A1 WO2015106676 A1 WO 2015106676A1
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- WIPO (PCT)
- Prior art keywords
- led
- reel
- adhesive layer
- flexible substrate
- film
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
Description
Claims (13)
- 一种柔性发光器件,其特征在于包括LED和柔性基板,所述柔性基板包括热塑膜、导热层和底板;所述LED设置在所述热塑膜上,所述导热层夹在所述热塑膜与底板之间;所述LED通过导热层将热传递给底板;所述导热层由覆铜板制成,所述底板由铝合金、铜或塑料树脂材料制成;所述热塑膜为柔性扁平电缆,其包括第一膜层、第一黏胶层、电线、第二黏胶层和第二膜层,所述第一黏胶层夹在所述第一膜层与电线之间,所述第二黏胶层夹在所述电线和第二膜层之间;所述第一膜层和第二膜层分别由热塑性聚酯或聚氯乙烯制成,所述电线由镀锡铜或金或铜制成,所述第一黏胶层和第二黏胶层由热塑性聚酯制成;所述第一膜层和第二膜层的厚度为20-30微米,所述电线的厚度为33-52微米,所述第一黏胶层和第二黏胶层的厚度为40-50微米。
- 一种制造如权利要求1所述的柔性发光器件的方法,其特征在于包括:第一步:分配焊料到在卷轮器上旋转的柔性基板的焊盘上;第二步:将LED安放在已放置焊料的焊盘上;第三步:使用激光局部加热使LED焊接到所述焊盘上;所述第一步还包括检测分配是否精确到位;如果是,则进行第二步;如果否,则报警;所述第二步还包括检测LED是否准确放到焊盘上;如果是,则进行第三步;如果否,则报警;所述第三步还包括检测LED是否能正常照明;如果否,则报警。
- 一种制造如权利要求1所述的柔性发光器件的系统,其特征在于包括卷轮器、分配器、放置器和激光器,所述卷轮器供柔性基板在其上进行旋转,所述分配器将焊料分配到柔性基板上,所述放置器将LED安放在已放置焊料的焊盘上,所述激光器进行局部加热使LED焊接到所述焊盘上;所述卷轮器包括第一卷轮、第二卷轮和支架,所述支架支撑柔性基板,所述柔性基板绕过第一卷轮和第二卷轮,并在其上进行旋转。
- 一种柔性发光器件,其特征在于包括LED和柔性基板,所述柔性基板包括热塑膜、导热层和底板;所述LED设置在所述热塑膜上,所述导热层夹在所述热塑膜与底板之间。
- 如权利要求4所述的柔性发光器件,其特征在于所述热塑膜为柔性扁平电缆,其包括第一膜层、第一黏胶层、电线、第二黏胶层和第二膜层,所述第一黏胶层夹在所述第一膜层与电线之间,所述第二黏胶层夹在所述电线和第二膜层之间。
- 如权利要求5所述的柔性发光器件,其特征在于所述第一膜层和第二膜层分别由热塑性聚酯或聚氯乙烯制成,所述电线由镀锡铜制成,所述第一黏胶层和第二黏胶层由热塑性聚酯制成。
- 如权利要求6所述的柔性发光器件,其特征在于所述第一膜层和第二膜层的厚度为20-30微米,所述电线的厚度为33-52微米,所述第一黏胶层和第二黏胶层的厚度为40-50微米。
- 一种制造如权利要求4所述的柔性发光器件的方法,其特征在于包括:第一步:分配焊料到在卷轮器上旋转的柔性基板的焊盘上;第二步:将LED安放在已放置焊料的焊盘上;第三步:使用激光局部加热使LED焊接到所述焊盘上。
- 如权利要求8所述的方法,其特征在于所述第一步还包括检测分配是否精确到位;如果是,则进行第二步;如果否,则报警。
- 如权利要求8所述的方法,其特征在于所述第二步还包括检测LED是否准确放到焊盘上;如果是,则进行第三步;如果否,则报警。
- 如权利要求8所述的方法,其特征在于所述第三步还包括检测LED是否能正常照明;如果否,则报警。
- 一种制造如权利要求4所述的柔性发光器件的系统,其特征在于包括卷轮器、分配器、放置器和激光器,所述卷轮器供柔性基板在其上进行旋转,所述分配器将焊料分配到柔性基板上,所述放置器将LED安放在已放置焊料的焊盘上,所述激光器进行局部加热使LED焊接到所述焊盘上。
- 如权利要求12所述的柔性发光器件的系统,其特征在于所述卷轮器包括第一卷轮、第二卷轮和支架,所述支架支撑柔性基板,所述柔性基板绕过第一卷轮和第二卷轮,并在其上进行旋转。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580000274.3A CN105102880A (zh) | 2014-01-14 | 2015-01-13 | 一种柔性发光器件及其制造的方法和系统 |
HK16105963.4A HK1217986A1 (zh) | 2014-01-14 | 2016-05-25 | 種柔性發光器件及其製造的方法和系統 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461926968P | 2014-01-14 | 2014-01-14 | |
US61/926,968 | 2014-01-14 |
Publications (1)
Publication Number | Publication Date |
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WO2015106676A1 true WO2015106676A1 (zh) | 2015-07-23 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2015/070624 WO2015106676A1 (zh) | 2014-01-14 | 2015-01-13 | 一种柔性发光器件及其制造的方法和系统 |
Country Status (3)
Country | Link |
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CN (1) | CN105102880A (zh) |
HK (2) | HK1199366A2 (zh) |
WO (1) | WO2015106676A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113225864A (zh) * | 2021-05-24 | 2021-08-06 | 上海大学 | 一种紫外线发光二极管灯具及其制造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111556666A (zh) * | 2020-03-31 | 2020-08-18 | 苏州优诺电子材料科技有限公司 | 一种led发光体及led灯 |
Citations (6)
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CN1729553A (zh) * | 2002-12-20 | 2006-02-01 | 克里公司 | 用于在基片上组装部件的系统和为此的方法 |
CN101088140A (zh) * | 2004-03-29 | 2007-12-12 | 连接技术公司 | 从卷筒到卷筒制造的发光纸和密封的半导体电路装置 |
CN101826593A (zh) * | 2009-03-06 | 2010-09-08 | 日本航空电子工业株式会社 | 有助于减小发光设备的厚度并且具有高通用性的布线板 |
CN101858526A (zh) * | 2009-04-07 | 2010-10-13 | 徐志华 | 具有塑料包覆的挠性电连接线与发光二极管的发光装置 |
CN102201277A (zh) * | 2010-03-26 | 2011-09-28 | 日立电线精密技术株式会社 | 柔性扁平线缆 |
CN102280224A (zh) * | 2010-06-10 | 2011-12-14 | 住友电气工业株式会社 | 屏蔽扁平电缆的制造方法以及在该制造方法中使用的屏蔽带 |
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2015
- 2015-01-07 HK HK15100170.5A patent/HK1199366A2/zh not_active IP Right Cessation
- 2015-01-13 CN CN201580000274.3A patent/CN105102880A/zh active Pending
- 2015-01-13 WO PCT/CN2015/070624 patent/WO2015106676A1/zh active Application Filing
-
2016
- 2016-05-25 HK HK16105963.4A patent/HK1217986A1/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1729553A (zh) * | 2002-12-20 | 2006-02-01 | 克里公司 | 用于在基片上组装部件的系统和为此的方法 |
CN101088140A (zh) * | 2004-03-29 | 2007-12-12 | 连接技术公司 | 从卷筒到卷筒制造的发光纸和密封的半导体电路装置 |
CN101826593A (zh) * | 2009-03-06 | 2010-09-08 | 日本航空电子工业株式会社 | 有助于减小发光设备的厚度并且具有高通用性的布线板 |
CN101858526A (zh) * | 2009-04-07 | 2010-10-13 | 徐志华 | 具有塑料包覆的挠性电连接线与发光二极管的发光装置 |
CN102201277A (zh) * | 2010-03-26 | 2011-09-28 | 日立电线精密技术株式会社 | 柔性扁平线缆 |
CN102280224A (zh) * | 2010-06-10 | 2011-12-14 | 住友电气工业株式会社 | 屏蔽扁平电缆的制造方法以及在该制造方法中使用的屏蔽带 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113225864A (zh) * | 2021-05-24 | 2021-08-06 | 上海大学 | 一种紫外线发光二极管灯具及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
HK1217986A1 (zh) | 2017-01-27 |
HK1199366A2 (zh) | 2015-06-26 |
CN105102880A (zh) | 2015-11-25 |
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