Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
  • H01L21/28008—Making conductor-insulator-semiconductor electrodes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
  • H01L21/28008—Making conductor-insulator-semiconductor electrodes
  • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
  • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
  • H01L21/28088—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a composite, e.g. TiN
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
  • H01L21/321—After treatment
  • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
  • H01L21/32131—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by physical means only
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
  • H01L21/321—After treatment
  • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
  • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
  • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
  • H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/01—Manufacture or treatment
  • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
  • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
  • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
  • H10D84/0172—Manufacturing their gate conductors
  • H10D84/0177—Manufacturing their gate conductors the gate conductors having different materials or different implants
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/01—Manufacture or treatment
  • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
  • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
  • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
  • H10D84/0172—Manufacturing their gate conductors
  • H10D84/0179—Manufacturing their gate conductors the gate conductors having different shapes or dimensions
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/01—Manufacture or treatment
  • H10D84/02—Manufacture or treatment characterised by using material-based technologies
  • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
  • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
  • H01L21/321—After treatment
  • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
  • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
  • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D64/00—Electrodes of devices having potential barriers
  • H10D64/01—Manufacture or treatment
  • H10D64/017—Manufacture or treatment using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D64/00—Electrodes of devices having potential barriers
  • H10D64/60—Electrodes characterised by their materials
  • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
  • H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D64/00—Electrodes of devices having potential barriers
  • H10D64/60—Electrodes characterised by their materials
  • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
  • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
  • H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
  • H10D84/01—Manufacture or treatment
  • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
  • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
  • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
  • H10D84/0181—Manufacturing their gate insulating layers

Definitions

• This relates in general to integrated circuits, and in particular to integrated circuits with high dielectric constant gate dielectric and metal gate transistors.
• CMOS Complementary metal-oxide-semiconductor
• hi-k dielectrics provide improved capacitive control of the transistor channel by avoiding an apparent increase in gate dielectric thickness due to depletion of carriers in the polysilicon grains near the gate dielectric interface.
• the workfunction of the gate for p-channel metal-oxide-semiconductor (PMOS) transistors is preferably greater than about 4.8 eV and the workfunction for n-channel metal-oxide-semiconductor (NMOS) transistors is preferably less than about 4.3 eV.
• NMOS transistors may have a different gate metal and or may have a different hi-k gate dielectric than PMOS transistors.
• hi-k last replacement gate There are primarily four different process flows for forming hi-k metal gate transistors: hi-k last replacement gate; hi-k first replacement gate; hi-k last gate first; and hi-k first gate last.
• replacement gate transistor flows conventional polysilicon gate transistors are formed first and then the polysilicon gate is removed and replaced with a metal gate.
• gate first process flows the metal gate transistors are formed similar to conventional polysilicon gate transistors but with a metal gate.
• hi-k last process flows, a silicon dioxide dielectric is first formed and later removed and replaced with a hi-k dielectric before depositing the metal gate.
• hi-k first process flows, the hi-k dielectric is deposited first and gate material is stripped off the hi-k dielectric and replaced with metal gate.
• the hi-k last process flows are more complicated than hi-k first process flows. They require more masking steps but avoid exposing the hi-k dielectric to chemicals that may degrade the hi-k dielectric.
• Replacement gate process flows are more complicated than gate first process flows, but allow more flexibility in setting the work functions of the transistors.
• an integrated circuit is formed with a thick TiN metal gate with a workfunction greater than 4.85 eV and with a thin TiN metal gate with a work function less than 4.25 eV.
• An integrated circuit is formed with a replacement gate PMOS TiN metal gate transistor with a workfunction greater than 4.85 eV and with a replacement gate NMOS TiN metal gate transistor with a workfunction less than 4.25 eV.
• An integrated circuit is formed with a gate first PMOS TiN metal gate transistor with a workfunction greater than 4.85 eV and with a gate first NMOS TiN metal gate transistor with a workfunction less than 4.25 eV.
• FIGS. 1A through 1L are illustrations of steps in the fabrication of integrated circuit with high-k last, replacement metal gate CMOS transistors formed according to example embodiments.
• FIGS. 2 A through 2 J are illustrations of steps in the fabrication of integrated circuits with high-k first, replacement metal gate CMOS transistors formed according to example embodiments.
• FIGS. 3A through 3H are illustrations of steps in the fabrication of integrated circuits with high-k last, metal gate first CMOS transistors formed according to example embodiments.
• FIGS. 4 A through 4F are illustrations of steps in the fabrication of integrated circuits with high-k first, metal gate first CMOS transistors formed according to example embodiments. DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS
• PMOS transistor 170 has high-k dielectric 144 and PMOS TiN gate 146.
• the thickness and oxygen content of the PMOS TiN metal gate 146 are suitable (such as optimized) to give a workfunction greater than about 4.85 eV.
• NMOS transistor 172 has high-k dielectric 154 and NMOS TiN gate 156.
• the thickness and oxygen content of the NMOS TiN metal gate are suitable to give a workfunction less than about 4.25 eV.
• Fill metal 160 and 166 such as tungsten or aluminum, is deposited on the NMOS and PMOS TiN gates within the replacement gate trenches to fill the trenches. The overfill is then removed using chemical mechanical polish (CMP) planarization.
• CMP chemical mechanical polish
• FIG. 1A through 1L The major steps in the formation of an embodiment 3 pattern high-k last, replacement metal gate transistors are illustrated in FIG. 1A through 1L. Three photo resist patterning steps are used in this three pattern high-k last, replacement metal gate process flow.
• the partially processed integrated circuit in FIG. 1A is formed on a p-type substrate 100.
• Shallow trench isolation (STI) dielectric geometries 102 electrically isolate transistors and other devices on the integrated circuit.
• a sacrificial silicon dioxide film 106 with a thickness in the range of approximately 10 nm to 40 nm is grown on the integrated circuit substrate 100.
• An nwell 104 is formed in the region where the PMOS transistor 170 is to be formed.
• An NMOS transistor 172 is formed in the p-type substrate region of the integrated circuit substrate 100.
• polysilicon gate material 110 is deposited on the sacrificial silicon dioxide film 106.
• a transistor gate photo resist pattern 112 is formed on the polysilicon gate material 110.
• PMD Pre-metal dielectric
• the PMD dielectric 134 is planarized to expose the tops of the polysilicon transistor gates 120 and 122.
• the polysilicon replacement gates 120 and 122 are removed by a polysilicon wet etch.
• a first PMOS replacement gate pattern 140 is formed to protect the silicon dioxide dielectric 106 in the bottom of the NMOS 172 replacement gate transistor trench and to expose the silicon dielectric 106 in the bottom of the PMOS 170 replacement gate transistor trench.
• the silicon dioxide dielectric 106 is removed from the PMOS 170 transistor trench, and the first PMOS replacement gate pattern 140 is removed.
• High-k gate dielectric 144 such as HfO x , HfSiO x , or HfSiON is deposited into the PMOS replacement gate transistor trench 170, and a PMOS TiN metal gate film 146 is deposited on the high-k gate dielectric 144.
• the high-k gate dielectric 144 film is deposited using atomic layer deposition (ALD) with a thickness that is typically between about 1 and 4 nm.
• the PMOS TiN metal gate film 146 is deposited with a thickness greater than about 8 nm.
• a TaN film 148 which is used as an etch stop for the high-k dielectric etch, is deposited on the TiN 146 with a thickness of about 2 nm or more.
• the high-k dielectric is 1.2 nm HfO x
• the PMOS TiN film 146 is 10 nm
• the TaN film 148 is 2 nm.
• the PMOS TiN metal gate 146 is then annealed in oxygen as described in United States Patent 8,643,113 (which is hereby incorporated by reference) to provide a workfunction above 4.85 eV.
• An NMOS 172 replacement gate transistor photo resist pattern 150 is formed to protect the PMOS TiN gate over the PMOS transistor 170 and to enable the TaN 148 and TiN 146 to be removed from the NMOS area 172.
• the TaN film 148, the PMOS TiN gate material 146, and the high-k gate dielectric 144 are removed from the NMOS 172 replacement gate transistor trench.
• the silicon dioxide dielectric 106 film is also removed.
• NMOS high-k dielectric 154 such as HfO x , HfSiO x , or HfSiON, is then deposited into the NMOS replacement gate transistor trench as shown in FIG. 1H.
• the high-k dielectric is deposited to a thickness between about 1 nm and 4 nm.
• NMOS TiN metal gate material 156 with a thickness in the range of about 1 nm to 3 nm is deposited on the high-k dielectric 154.
• the high-k dielecric is Hf0 2 about 1.2 nm thick and is deposited using atomic layer deposition (ALD).
• the oxygen content in the NMOS TiN metal gate material 156 is less than about lxlO 13 atoms/cm 3 within one nanometer of the top surface of the high-k gate dielectric 154 to provide a workfunction less than about 4.25 eV.
• 2 nm of the NMOS TiN metal gate material 156 is deposited using ALD.
• a CVD-W (chemical vapor deposition-tungsten) film 160 is deposited on the NMOS TiN gate material 156, and a second PMOS replacement gate transistor pattern 162 is formed on the CVD-W film 160 to protect it over the NMOS replacement gate transistor 172 and to enable the CVD-W film 160, the NMOS TiN gate material 156 and the NMOS high-k dielectric 154 to be etched from the PMOS 170 replacement gate transistor region.
• CVD-W chemical vapor deposition-tungsten
• FIG. 1J shows the integrated circuit after the CVD-W film 160, the thin NMOS TiN gate material 156, and the NMOS high-k gate dielectric 154 are etched from the PMOS 170 replacement gate transistor region.
• the TaN film 148 serves and an etch stop for the high-k dielectric 154 etch.
• the TaN etch stop film 148 may be removed by etching.
• the NMOS 172 transistor high-k gate dielectric 154 is removed to prevent a capacitor from forming between the NMOS transistor 172 TiN metal gate material 156 and the PMOS transistor 170 TiN metal gate material 146.
• additional CVD-W 166 is deposited to completely fill the PMOS 170 and NMOS 172 replacement gate transistor trenches.
• Aluminum metal alternatively may be used.
• the CVD-W overfill and the metal gate material is then removed from the surface of the PMD dielectric 134 between the replacement gate transistor trenches 170 and 172 using CMP shown in FIG. 1L.
• the replacement gate PMOS 170 transistor has a thick oxygenated TiN metal gate with a workfunction above about 4.85 eV.
• the replacement gate NMOS 172 transistor has a thin deoxygenated NMOS TiN metal gate with a workfunction less than about 4.25 eV.
• Additional PMD dielectric may be deposited on the integrated circuit, and contacts may be formed to the transistor gates and to deep source and drain diffusions to electrically connect them to a first layer of interconnect. Additional layers of dielectric and more levels of interconnect may be formed to complete the integrated circuit.
• One advantage of the embodiment 3 pattern high-k last replacement metal gate process is that the PMOS and NMOS high-k dielectrics are deposited immediately before the PMOS and NMOS TiN metal gates are deposited. There is no degradation of the high-k dielectric due to layers being chemically stripped off before the TiN metal gate deposition. Also, the high-k dielectric for NMOS is deposited using a different process step than the high-k dielectric for the PMOS so, if desired, different high-k dielectrics may be used on the NMOS and PMOS transistors.
• PMOS transistor 174 has high-k dielectric 144 and PMOS TiN gate 146.
• the thickness and oxygen content of the PMOS TiN metal gate 146 are suitable to give a workfunction greater than about 4.85 eV.
• NMOS transistor 176 has high-k dielectric 108 and NMOS TiN gate 156.
• the thickness and oxygen content of the NMOS TiN metal gate are suitable to give a workfunction less than about 4.25 eV.
• Metal 166 such as tungsten or aluminum, is deposited on the NMOS and PMOS TiN gates within the replacement gate trenches and planarized.
• FIG. 2 A through 2J The major steps in an embodiment 1 pattern high-k first, replacement metal gate CMOS process flow using an embodiment one photo resist pattern process are illustrated in FIG. 2 A through 2J.
• This embodiment process has the advantage of being less expensive to implement than the previously described three photo resist pattern embodiment process.
• the partially processed integrated circuit in FIG. 2A is formed on a p-type substrate 100.
• Shallow trench isolation (STI) dielectric geometries 102 electrically isolate transistors and other devices on the integrated circuit.
• An nwell 104 is formed in the region where the PMOS transistor 174 is to be formed.
• An NMOS transistor 176 is formed in the p-type region of the integrated circuit substrate 100.
• a high-k dielectric film 108 is deposited on the integrated circuit substrate.
• the high-k dielectric is typically a material such as HfO x , HfSiO x , or HfSiON between about 1 and 4 nm thick.
• the high-k dielectric is HfO x deposited with a thickness of approximately 1.2 nm using ALD.
• polysilicon gate material 110 is deposited on the high-k dielectric film 108.
• a transistor gate pattern 112 is formed on the polysilicon gate material 110.
• PMD Pre metal dielectric
• the PMD dielectric is planarized to expose the tops of the polysilicon replacement gates 120 and 122 over the transistors.
• the polysilicon replacement gates 120 and 122 are then removed exposing the high-k dielectric 108 in the bottom of the replacement gate transistor trenches 174 and 176.
• a PMOS TiN metal gate film 146 is deposited on the high-k gate dielectric 108.
• the PMOS TiN metal gate film 146 is deposited with a thickness greater than about 8 nm. In an example integrated circuit, the PMOS TiN metal gate film is about 10 nm.
• the PMOS TiN metal gate is then annealed in oxygen as described in United States Patent 8,643,113 to provide a workfunction above 4.85 eV.
• An NMOS replacement gate 174 photo resist pattern 150 is formed to protect the PMOS TiN gate 146 over the PMOS transistor 174 and to enable removal of the PMOS TiN gate 146 from the NMOS replacement gate transistor area 176.
• the PMOS TiN metal gate material 146 is removed from the NMOS 176 replacement gate transistor area.
• a highly selective etch is used for removing the PMOS TiN metal gate material 146 from the high-k gate dielectric 108 in the NMOS transistor 176 region, so as not to damage the high-k gate dielectric 108.
• a wet etch including dilute SCI plus NH 4 OH and H 2 0 2 is used for removing the TiN 146 from the high-k dielectric 108.
• thin NMOS TiN metal gate material 156 is deposited on the high-k dielectric 108 in the NMOS 176 replacement gate transistor trench.
• the oxygen content in the NMOS TiN metal gate material 156 is less than about lxlO 13 atoms/cm 3 within one nanometer of the top surface of the high-k gate dielectric 108 to provide a workfunction less than about 4.25 eV.
• 2 nm of the NMOS TiN metal gate material 156 is deposited using ALD.
• CVD-W 166 is deposited to completely fill the PMOS 174 and NMOS 176 replacement gate transistor trenches.
• Aluminum metal alternatively may be used.
• the surface of the integrated circuit is then planarized using CMP as shown in FIG. 2J to remove CVD-W 166 overfill and metal gate material 146 and 156 from the surface of the PMD 134 between the NMOS 176 and PMOS 174 replacement gates.
• the high-k first replacement gate PMOS 174 transistor has a thick oxygenated TiN metal gate 146 with a workfunction greater than about 4.85 eV.
• the high-k first replacement gate NMOS 176 transistor has a thin deoxygenated NMOS TiN metal gate 156 with a workfunction less than about 4.25 eV.
• Additional PMD dielectric may be deposited on the integrated circuit, and contacts may be formed to the deep source and drain diffusions and to the transistor gates to electrically connect them to a first layer of interconnect. Additional layers of dielectric and more levels of interconnect may be formed to complete the integrated circuit.
• PMOS transistor 180 has high-k dielectric 144 and TiN gate 146.
• the thickness and oxygen content of the PMOS TiN metal gate 146 are suitable to give a workfunction greater than about 4.85 eV.
• NMOS transistor 182 has high-k dielectric 154 and TiN gate 156.
• the thickness and oxygen content of the TiN NMOS metal gate 156 are suitable to give a workfunction less than about 4.25 eV.
• Doped polysilicon is deposited on the PMOS and NMOS TiN metal gates 146 and 156 and then patterned and etched to form the gates, 120 and 122 of the embodiment high-k last, gate first NMOS and PMOS metal gate transistors 180 and 182.
• FIG. 3A through 3H The major steps in the embodiment three pattern process that forms the, high-k last, metal gate first transistors are illustrated in FIG. 3A through 3H.
• the partially processed integrated circuit in FIG. 3A is formed on a p-type substrate 100.
• Shallow trench isolation (STI) dielectric geometries 102 electrically isolate transistors and other devices on the integrated circuit.
• a sacrificial silicon dioxide film 106 in the range of approximately 10 nm to 40 nm is grown on the integrated circuit substrate 100.
• An nwell 104 is formed in the region where the PMOS transistor 180 is to be formed by counter doping the p-type substrate 100 in the usual manner.
• An NMOS transistor 182 will be formed in the p-type substrate 100.
• a first PMOS transistor photo resist pattern 140 is formed on the sacrificial silicon dioxide layer 106 to protect it in the NMOS transistor area 182 and to allow it to be removed from the PMOS transistor area 180.
• the sacrificial silicon dioxide dielectric 106 is removed from the PMOS 180 transistor area, and the first PMOS transistor photo resist pattern 140 is removed.
• PMOS high-k gate dielectric 144 is then deposited, and a PMOS TiN metal gate film 146 is deposited on the PMOS high-k gate dielectric 144.
• the high-k gate dielectric 144 film is Hf0 2 deposited using atomic layer deposition (ALD) with a thickness of about 1.2 nm.
• ALD atomic layer deposition
• the TiN metal gate film 146 is deposited with a thickness greater than about 8 nm.
• a TaN film 148 which is used as an etch stop for a high-k dielectric etch, is deposited on the TiN 146 to a thickness of about 2 nm or more.
• the PMOS TiN film is 10 nm and the TaN film is 2 nm.
• the PMOS TiN metal gate material 146 is then annealed in oxygen as described in United States Patent 8,643,113 to provide a workfunction above 4.85 eV.
• NMOS transistor photo resist pattern 150 is formed on the PMOS TiN metal gate 146 to enable the PMOS TiN metal gate material 146 to be removed from the NMOS metal gate transistor 182 area and to protect it from being removed from the PMOS metal gate transistor area 180.
• FIG. 3D shows the integrated circuit after the TaN etch stop material 148 is etched, the PMOS TiN metal gate material 146 is etched, the PMOS high-k gate dielectric 144 is etched, and the sacrificial silicon dioxide film 106 is etched from the NMOS metal gate transistor 182 area.
• NMOS high-k dielectric 154 is then deposited onto the integrated circuit as shown in FIG. 3E.
• Thin NMOS TiN metal gate material 156 is deposited on the NMOS high-k dielectric 154.
• the NMOS high-k dielectric 154 is Hf0 2 about 1.2 nm thick and is deposited using atomic layer deposition (ALD).
• the thin NMOS TiN metal gate material 156 is also deposited using ALD to a thickness of about 2 nm.
• the thin NMOS TiN metal gate material 156 is deposited with an oxygen content of less than about lxl 0 13 atoms/cm 3 within one nanometer of the top surface of the high-k gate dielectric 154 to provide a workfunction less than about 4.25 eV.
• a second PMOS transistor photoresist pattern 162 is formed on the thin NMOS TiN metal gate 156 to enable the thin NMOS TiN metal gate 156 material and the NMOS high-k gate dielectric material 154 to be etched off the PMOS TiN metal gate 146 in the PMOS transistor 180 region.
• Photo resist 162 protects the NMOS TiN metal gate 156 from being removed from the NMOS transistor 182 region.
• FIG. 3F shows the integrated circuit after the thin TiN gate film 156 and the NMOS transistor 182 high-k gate dielectric 154 are etched from the PMOS transistor area 180.
• the TaN film 148 serves and an etch stop for the high-k dielectric 154 etch.
• the TaN etch stop film 148 may be removed by etching.
• the NMOS 182 transistor high-k gate dielectric 154 is removed to prevent capacitor formation between the NMOS 182 transistor TiN metal gate film 156 and the PMOS 180 transistor TiN metal gate film 146.
• polysilicon gate material 110 is deposited on the PMOS 180 and NMOS 182 TiN metal gates.
• a transistor gate photo resist pattern 112 is formed on the polysilicon gate material 110.
• FIG. 3H The cross section in FIG. 3H is shown after the gates 120 and 122 are etched.
• Polysilicon 110 plus thick PMOS TiN gate material 146 is etched to form the gate 120 of the PMOS transistor 180.
• Polysilicon 110 plus thin NMOS TiN gate material 156 is etched to form the gate 122 of the NMOS transistor 182.
• PMD Pre metal dielectric
• the PMD dielectric 134 may be planarized using CMP, and contacts may be formed to the deep source and drain diffusions 128 and 132 and to the transistor gates 120 and 122 to electrically connect them to a first layer of interconnect. Additional layers of dielectric and additional levels of interconnect may be formed to complete the integrated circuit.
• One advantage of the embodiment 3 pattern high-k last, metal gate first process is that the PMOS and NMOS high-k dielectrics are deposited immediately before the PMOS and NMOS TiN metal gates are deposited. There is no degradation of the high-k dielectric due to layers being chemically stripped off the surface before the TiN metal gate deposition. Also, the high-k dielectric for NMOS is deposited using a different process step than the high-k dielectric for the PMOS so, if desired, different high-k dielectrics may be used on the NMOS and PMOS transistors.
• PMOS transistor 184 has high-k dielectric 108 and PMOS TiN metal gate 146.
• the thickness and oxygen content of the PMOS TiN metal gate material 146 are suitable to give a workfunction greater than about 4.85 eV.
• NMOS transistor 186 has high-k dielectric 108 and NMOS TiN metal gate 156.
• the thickness and oxygen content of the TiN NMOS metal gate material 156 are suitable to give a workfunction less than about 4.25 eV.
• Doped polysilicon is deposited on the TiN metal gates and then patterned and etched to form the gates 120 and 122 of the embodiment high-k first, metal gate first PMOS and NMOS transistors, 184 and 186.
• FIG. 4A through 4H The major steps for an embodiment one pattern high-k first, metal gate first process are illustrated in FIG. 4A through 4H.
• This embodiment high-k first, metal gate first one pattern process is more cost effective than the embodiment high-k last, metal gate first three pattern process.
• the partially processed integrated circuit in FIG. 4A is formed on a p-type substrate 100.
• Shallow trench isolation (STI) dielectric geometries 102 electrically isolate transistors and other devices on the integrated circuit.
• An nwell 104 is formed in the region where the PMOS transistor 184 is to be formed by counter doping the p-type substrate 100 in the usual manner.
• An NMOS transistor 186 will be formed in the p-type substrate 100.
• a high-k dielectric film 108 with a thickness typically in the range of approximately 1 nm to 4 nm is deposited on the integrated circuit substrate 100.
• the high-k dielectric is a Hf0 2 dielectric film deposited with a thickness of approximately 1.2 nm using ALD.
• thick PMOS TiN metal gate material 146 is deposited on the high-k dielectric film 108.
• the PMOS TiN metal gate material 146 is deposited with a thickness greater than about 8 nm.
• the PMOS TiN metal gate material is deposited using ALD to a thickness of about 10 nm.
• the PMOS TiN metal gate is then annealed in oxygen as described in United States Patent 8,643,113 to provide a workfunction above 4.85 eV.
• An NMOS transistor 186 photo resist pattern 150 is formed to protect the PMOS TiN metal gate material 146 over the PMOS transistor area 184 and to enable it to be removed from the NMOS area 186.
• the PMOS TiN metal gate material 146 is removed from the NMOS 184 transistor area.
• a highly selective etch is used for removing the PMOS TiN metal gate material 146 from the high-k gate dielectric 108 in the NMOS transistor 186 region, so as not to damage the high-k gate dielectric 108.
• a wet etchant including diluted SCI, NH 4 OH, and H 2 0 2 is used for etching the PMOS TiN metal gate material 146.
• Thin NMOS TiN metal gate material 156 is deposited on the high-k dielectric 108 in the NMOS 186 transistor area.
• the thin NMOS TiN metal gate material 156 may be deposited with a thickness in the range of about 1 nm to 3 nm. In an example embodiment, about 2 nm of the NMOS TiN metal gate material 156 is deposited using ALD. As described in United States Patent 8,643,113, the thin NMOS TiN metal gate material 156 is deposited with an oxygen content of less than about lxl 0 13 atoms/cm 3 within one nanometer of the top surface of the high-k gate dielectric 108 to provide a workfunction less than about 4.25 eV.
• polysilicon gate material 110 is deposited on the PMOS 184 and NMOS 186 TiN metal gate material 146 and 156.
• a transistor gate photo resist pattern 112 is formed on the polysilicon gate material 110.
• FIG. 4F shows the integrated circuit after the gates 120 and 122 are etched.
• Polysilicon 110 plus NMOS TiN metal gate material 156 and PMOS TiN metal gate material 146 are etched to form the gate 120 of the PMOS high-k metal gate transistor 184.
• Polysilicon 110 plus NMOS TiN metal gate material 156 are etched to form the gate 122 of the NMOS high-k metal gate transistor 186.
• PMD Pre metal dielectric
• the PMD dielectric 134 may be planarized using CMP, and contacts may be formed to the deep source and drain diffusions 128 and 132 and to the transistor gates 120 and 122 to electrically connect them to a first layer of interconnect. Additional layers of dielectric and more levels of interconnect may be formed to complete the integrated circuit.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Chemical & Material Sciences (AREA)
• Composite Materials (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
• Insulated Gate Type Field-Effect Transistor (AREA)
• Electrodes Of Semiconductors (AREA)

Priority Applications (3)

Applications Claiming Priority (4)

Publications (1)

Family

ID=53441843

Family Applications (1)

Country Status (5)

Families Citing this family (10)

Citations (3)

Family Cites Families (15)

• 2014
  • 2014-12-11 US US14/567,507 patent/US9070785B1/en active Active
  • 2014-12-31 JP JP2016544064A patent/JP6709732B2/ja active Active
  • 2014-12-31 EP EP14876620.7A patent/EP3090445A4/en active Pending
  • 2014-12-31 WO PCT/US2014/073032 patent/WO2015103412A1/en not_active Ceased
  • 2014-12-31 CN CN201480071998.2A patent/CN105874588B/zh active Active
• 2015
  • 2015-05-28 US US14/724,185 patent/US9721847B2/en active Active

Patent Citations (3)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events