WO2015102108A1 - Plaque de verre trempé et son procédé de fabrication - Google Patents

Plaque de verre trempé et son procédé de fabrication Download PDF

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Publication number
WO2015102108A1
WO2015102108A1 PCT/JP2015/050015 JP2015050015W WO2015102108A1 WO 2015102108 A1 WO2015102108 A1 WO 2015102108A1 JP 2015050015 W JP2015050015 W JP 2015050015W WO 2015102108 A1 WO2015102108 A1 WO 2015102108A1
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WO
WIPO (PCT)
Prior art keywords
stress layer
compressive stress
tempered glass
glass plate
main surface
Prior art date
Application number
PCT/JP2015/050015
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English (en)
Japanese (ja)
Inventor
睦 深田
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to JP2015555890A priority Critical patent/JPWO2015102108A1/ja
Publication of WO2015102108A1 publication Critical patent/WO2015102108A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium

Definitions

  • the present invention relates to a tempered glass plate and a manufacturing method thereof, and more specifically, to a tempered glass plate chemically strengthened by an ion exchange method and a manufacturing method thereof.
  • a chemically strengthened tempered glass plate has been used for a touch panel display mounted on an electronic device such as a smartphone or a tablet PC.
  • Such a tempered glass plate is generally produced by treating a glass substrate containing an alkali metal oxide as a composition with a tempering liquid to form a compressive stress layer on the surface. Since such a tempered glass plate has high strength, it is difficult to stably perform mechanical cutting.
  • Patent Document 1 a technique of cutting (melting) a glass substrate used for a cover glass by etching has been developed (for example, Patent Document 1).
  • the method for manufacturing a glass substrate disclosed in Patent Document 1 cuts the tempered glass by partially forming a resist film on both sides of the tempered glass to be cut and etching portions not protected by the resist film. it can.
  • the tempered glass plate 31 generally chemically strengthened includes compressive stress layers 32A and 32B and an incompressible stress layer 33 in which the compressive stress layers 32A and 32B are not formed.
  • a protrusion 35 is formed on the melted surface 34.
  • the protrusion part 35 is easily chipped when subjected to an impact.
  • the protrusion part 35 is missing, a crack will generate
  • the present invention has been made in consideration of such circumstances, and it is an object of the present invention to provide a tempered glass sheet having a high end face impact resistance and easily manufactured, and a method for manufacturing the same.
  • the tempered glass plate of the present invention is a tempered glass plate having a compressive stress layer on at least one of opposing main surfaces, and the end surface of the tempered glass plate has a compressive stress layer portion and a compressive stress layer on which the compressive stress layer is formed. And a non-compressive stress layer portion that is not formed, and further includes a protrusion when viewed in cross-section in the thickness direction, and the top of the protrusion is formed in the compressive stress layer portion.
  • the tempered glass plate of the present invention it is possible to obtain a higher end face impact resistance than the conventional product. Specifically, since the protruding portion is formed in the compressive stress layer portion, the protruding portion is hardly chipped and cracks due to the chipping of the protruding portion are difficult to occur. Therefore, breakage of the tempered glass plate due to such cracks can be suppressed.
  • the top portion of the protruding portion is located on the center side in the plate thickness direction from the main surface.
  • the protruding portion is less likely to be chipped, and higher impact resistance can be obtained.
  • the depth from the main surface of the compressive stress layer with respect to the thickness of the tempered glass sheet is preferably 1/100 to 1/10.
  • the top portion of the protruding portion has a convex curved shape in a sectional view.
  • the protruding portion is less likely to be chipped, and higher impact resistance can be obtained.
  • a compressive stress layer having a tensile stress layer on the center side in the plate thickness direction from the compressive stress layer is 300 MPa or more, the depth from the main surface of the compressive stress layer is 5 to 100 ⁇ m,
  • the tensile stress is preferably 10 MPa or more.
  • the method for producing a tempered glass plate of the present invention is a method for producing a tempered glass plate by fusing a chemically strengthened mother glass plate, and a compressive stress layer is formed in the melted cross section at the time of fusing. Protruding portions are formed at the formed locations.
  • the method for producing a tempered glass sheet of the present invention it is possible to easily produce a tempered glass sheet having a higher end face impact resistance than that of a conventional product without requiring a step of removing the protruding portion.
  • the cutting planned portion of the chemically strengthened mother glass plate after etching the planned cutting portion of the chemically strengthened mother glass plate from the one main surface side to the compressive stress layer on the other main surface side, the cutting planned portion from the other main surface side. It is preferable to form the protrusion by etching.
  • the protruding portion can be easily formed in the compressive stress layer portion. Moreover, the self-breakage of the mother glass plate at the time of fusing can be suppressed.
  • the mother glass plate has a tensile stress layer on the center side in the thickness direction from the compressive stress layer, the compressive stress of the compressive stress layer is 300 MPa or more, and the main surface of the compressive stress layer Is preferably 5 to 100 ⁇ m, and the tensile stress of the tensile stress layer is preferably 10 MPa or more.
  • FIGS. 2A to 2D are diagrams showing an example of a manufacturing process of a tempered glass sheet according to an embodiment of the present invention. It is sectional drawing which shows an example of the end surface shape of the tempered glass board which concerns on embodiment of this invention. It is a figure which shows an example of the test method which evaluates the impact resistance of the tempered glass board of this invention. It is sectional drawing which shows an example of the end surface shape of the conventional tempered glass board fuse
  • the tempered glass plate 1 of the present invention is a chemically tempered glass having a main surface 2A and a main surface 2B facing each other.
  • a compressive stress layer 3A is formed near the main surface 2A, and a compressive stress layer 3B is formed near the main surface 2B.
  • region in which the compressive-stress layer is not formed in the tempered glass board 1 is called the non-compressive-stress layer 4.
  • the end surface 5 of the tempered glass plate 1 is composed of compressive stress layer portions 6A and 6B on which a compressive stress layer is formed, and an uncompressed stress layer portion 7 on which no compressive stress layer is formed.
  • the compressive stress layer 6A corresponds to the end of the compressive stress layer 3A
  • the compressive stress layer 6B corresponds to the end of the compressive stress layer 3B.
  • a protruding portion 8 protruding partially is formed.
  • the top part 9 of the protrusion part 8 is located in the compressive-stress layer part 6B.
  • the composition of the tempered glass plate 1 may be arbitrary.
  • the glass composition may be 50% by mass of SiO 2 50-80%, Al 2 O 3 5-25%, B 2 O 3 0-15%, Na It is preferable to contain 2 O 1 to 20% and K 2 O 0 to 10%. If the glass composition range is regulated as described above, it becomes easy to achieve both ion exchange performance and devitrification resistance at a high level.
  • the depth from the main surface of each of the compressive stress layers 3A and 3B with respect to the thickness of the tempered glass plate 1 is preferably 1/100 to 1/10.
  • the thickness of the tempered glass plate 1 is, for example, 0.3 to 1.3 mm, and preferably 0.4 to 0.7 mm.
  • the depth from the main surface of each of the compressive stress layers 3A and 3B is, for example, 5 to 100 ⁇ m, preferably 10 to 80 ⁇ m, more preferably 15 to 50 ⁇ m.
  • the compressive stress of each of the compressive stress layers 3A and 3B is 300 MPa or more, preferably 500 to 1200 MPa, more preferably 600 to 1000 MPa, and still more preferably 700 to 1000 MPa.
  • a tensile stress layer (not shown) is formed on the center side in the plate thickness direction of each of the compressive stress layers 3A and 3B.
  • the tensile stress of the tensile stress layer is 10 MPa or more, preferably 10 to 200 MPa, more preferably 15 MPa to 150 MPa, and further preferably 25 to 90 MPa.
  • the tempered glass plate 1 of the present invention since the top portion 9 is formed on the compressive stress layer portion 6B having high strength, the protruding portion 8 is hardly chipped. That is, the tempered glass plate 1 has high impact resistance at the end face.
  • the top part 9 of the protrusion part 8 is located in the plate
  • the tempered glass plate 1 of the present invention can be manufactured, for example, by fusing a mother glass plate (hereinafter, also simply referred to as “mother glass”) G as shown in FIGS. 2A to 2D.
  • the mother glass G is a glass plate having the same composition as the tempered glass plate 1 and chemically strengthened in advance.
  • the mother glass G includes a main surface 2A and a main surface 2B facing each other, and a compressive stress layer 3A is formed in the vicinity of the main surface 2A, and a compressive stress layer 3B is formed in the vicinity of the main surface 2B.
  • a tensile stress layer is formed between the compressive stress layer 3A and the compressive stress layer 3B of the base glass G.
  • the tensile stress of the tensile stress layer of the mother glass G is preferably 200 MPa or less, more preferably 10 to 200 MPa, still more preferably 15 MPa to 150 MPa, and most preferably 25 to 90 MPa. If the tensile stress of the tensile stress layer of the mother glass G is too large, the mother glass G is likely to be damaged due to the tensile stress in the manufacturing process of the tempered glass sheet 1 described later (the dividing process of the mother glass G). On the other hand, if the tensile stress of the tensile stress layer of the mother glass G is too small, the compressive stress layers 3A and 3B of the mother glass G need to be reduced in magnitude, and the strength of the resulting tempered glass plate 1 is high. It will decline.
  • a resist film 10A is formed on the main surfaces 2A and 2B except for the planned cutting region 11A set on the main surface 2A of the mother glass G and the planned cutting region 11B set on the main surface 2B. 10B is formed.
  • the scheduled cutting regions 11A and 11B are, for example, strip-shaped regions along the planned cutting line set in the mother glass G.
  • any known material may be used as long as it is a material that is not affected by the etching solution 12 described later.
  • known resist materials including organic, inorganic, and metal can be used.
  • a method for forming the resist films 10A and 10B for example, a known method such as a photoresist method, a screen method, or a mechanical mask method may be used.
  • the etching solution 12 is caused to flow from the main surface 2A side to the mother glass G, and the mother glass G is etched in the planned cutting region 11A. At this time, etching is performed until the molten cross section reaches the compressive stress layer 3B from the main surface 2A. At this time, the etching is performed to such an extent that the molten section does not reach the main surface 2B, that is, does not penetrate the mother glass G.
  • Any known liquid may be used as the etching liquid 12 as long as it is a liquid capable of etching the mother glass G.
  • hydrofluoric acid and a solution containing hydrofluoric acid can be used for the etchant 12.
  • the etching solution 12 is caused to flow down from the main surface 2B side to the mother glass G, and the mother glass G is etched in the planned cutting region 11B.
  • the mother glass G is divided.
  • etching is preferably performed after the front and back posture of the mother glass G is reversed from the state of FIG.
  • the width of the planned cutting area 11B is preferably smaller than the width of the planned cutting area 11A.
  • the width of the planned cutting region 11B is set in this manner, the mother glass G is hardly etched from the main surface 2B side, and the top portion 9 of the protruding portion 8 can be more reliably formed on the compressive stress layer portion 6B. Become.
  • the tempered glass 1 is obtained by removing the resist films 10A and 10B.
  • the protruding portion 8 can be easily formed on the compressive stress layer portion 6B. Moreover, the protrusion part 8 can be formed so that the top part 9 of the protrusion part 8 may be located in the plate
  • the damage of the mother glass G at the time of fusing can be suppressed.
  • the tensile stress of the tensile stress layer in the mother glass G is relatively large, if the compressive stress layers 3A and 3B on both main surfaces are etched simultaneously as in the conventional method, the compressive stress and tensile stress in the mother glass G There was a risk of self-destruction.
  • the above self-destruction can be suppressed.
  • the step of FIG. 2C may be omitted, and the mother glass G may be fused by performing etching up to the main surface 2B in FIG. 2B.
  • top part 9 of the protrusion part 8 has a sharp shape
  • the top part of the protrusion part 8 is formed in the compressive stress layer part 6 ⁇ / b> B, as shown in FIG. 3. It may be rounded. That is, the top of the protrusion 8 may be a curved top 15 by a process such as mechanical polishing or etching.
  • Tables 1 and 2 show examples and comparative examples of the present invention.
  • test no. Nos. 1 and 2 are examples of the present invention.
  • 3 shows a comparative example.
  • the mother glasses ⁇ , ⁇ , and ⁇ serving as test samples were prepared.
  • the mother glasses ⁇ , ⁇ , and ⁇ are in mass% as a glass composition, SiO 2 62.0%, Al 2 O 3 19.7%, B 2 O 3 3.6%, Na 2 O 13.2%, MgO
  • a glass plate containing 1.5% is chemically strengthened by an ion exchange method under different temperature and time conditions.
  • the mother glasses ⁇ , ⁇ , and ⁇ have different characteristics such as compressive stress.
  • the main glass ⁇ , ⁇ , and ⁇ are respectively cut from the one side shown in FIGS. 2A to 2D, and the main glass is immersed in an etching solution in place of the steps shown in FIGS.
  • FIG. 4 is a diagram showing a method for evaluating the impact resistance of the end face of the sample S.
  • the sample S of each test differs in the position of the top part of a protrusion part as described in Table 2. Specifically, Test No. Samples 1 and 2 were melted by etching from one side as shown in FIGS. 2A to 2D so that the protruding portion was positioned in the compressive stress layer. In addition, Test No. In the sample No. 3, the mother glass ⁇ was etched from both main surfaces at the same time and melted so that the protruding portion was located in the incompressible stress layer portion.
  • the sample S has a length of 130 mm, a width of 65 mm, and a thickness of 0.7 mm. Thereafter, test no. For sample 2 of No. 2, the top of the protrusion was polished with a polishing tape, and the shape of the top of the protrusion was curved. In addition, Test No. For Samples 1 and 3, the tops of the protrusions were not processed as they were after cutting, but were sharpened.
  • the impact resistance of the end face was evaluated for each sample obtained as described above. Details of the evaluation method will be described below. First, the sample S was held on the jig 20 so that the molten cross section was exposed. Next, the jig 20 was fixed below the inclined surface of the inclined table 21 having an inclined surface with an inclination angle of 32 °. Then, the collision member 22 was slid down from above the inclined surface of the inclined table 21 to be collided with the molten surface of the sample S.
  • the collision member 22 is, for example, a 190 g stainless steel block.
  • the above collision test was repeated by changing the sliding distance L of the collision member 22. Specifically, the sliding distance L was gradually increased from 5 mm to 5 mm until the sample S was damaged, and the sliding distance L at which the sample S was damaged was measured.
  • the sliding distance L at which the sample S is damaged is preferably 30 mm or more, more preferably 50 mm or more. If the sliding distance L at which the sample S is damaged is 50 mm or more, it can be said that the sample has sufficient impact resistance as a cover glass for a smartphone, a tablet-type terminal or the like.
  • the tempered glass plate and the method for producing the same of the present invention are useful as a glass substrate used for a touch panel display and the like, and a method for producing the same.

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

　La présente invention a pour objet une plaque de verre trempé qui a une haute résistance au choc aux surfaces d'extrémité et qui est facilement fabriquée et sur son procédé de fabrication. Cette plaque de verre trempé a une couche de contrainte de compression sur au moins l'une des surfaces principales opposées. Les surfaces d'extrémité de la plaque de verre trempé ont des parties de contrainte de compression dans lesquelles les couches de contrainte de compression sont formées et une partie exempte de couche de contrainte de compression dans laquelle aucune couche de contrainte de compression n'est formée ; et elles sont en outre pourvues d'une partie faisant saillie visible dans la section transversale dans la direction de l'épaisseur, la partie apicale de la partie faisant saillie étant formée dans la couche de contrainte de compression.
PCT/JP2015/050015 2014-01-06 2015-01-05 Plaque de verre trempé et son procédé de fabrication WO2015102108A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015555890A JPWO2015102108A1 (ja) 2014-01-06 2015-01-05 強化ガラス板およびその製造方法

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JP2014-000197 2014-01-06
JP2014000197 2014-01-06

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WO2015102108A1 true WO2015102108A1 (fr) 2015-07-09

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TW (1) TW201540685A (fr)
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227523A (ja) * 2008-03-24 2009-10-08 Hoya Corp ガラス基材及びその製造方法
WO2012153798A1 (fr) * 2011-05-11 2012-11-15 Hoya株式会社 Lamelle couvre-objet pour dispositif mobile, son procédé de fabrication, et substrat en verre pour lamelle couvre-objet de dispositif mobile
WO2013002368A1 (fr) * 2011-06-30 2013-01-03 株式会社Ｎｓｃ Procédé pour la fabrication de substrats de verre
WO2013118867A1 (fr) * 2012-02-08 2013-08-15 Hoya株式会社 Procédé et dispositif de fabrication de verre de couverture d'appareil électronique

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009227523A (ja) * 2008-03-24 2009-10-08 Hoya Corp ガラス基材及びその製造方法
WO2012153798A1 (fr) * 2011-05-11 2012-11-15 Hoya株式会社 Lamelle couvre-objet pour dispositif mobile, son procédé de fabrication, et substrat en verre pour lamelle couvre-objet de dispositif mobile
WO2013002368A1 (fr) * 2011-06-30 2013-01-03 株式会社Ｎｓｃ Procédé pour la fabrication de substrats de verre
WO2013118867A1 (fr) * 2012-02-08 2013-08-15 Hoya株式会社 Procédé et dispositif de fabrication de verre de couverture d'appareil électronique

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JPWO2015102108A1 (ja) 2017-03-23
TW201540685A (zh) 2015-11-01

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