WO2015096334A1 - 扬声器模组及包含该扬声器模组的电子装置 - Google Patents

扬声器模组及包含该扬声器模组的电子装置 Download PDF

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Publication number
WO2015096334A1
WO2015096334A1 PCT/CN2014/076367 CN2014076367W WO2015096334A1 WO 2015096334 A1 WO2015096334 A1 WO 2015096334A1 CN 2014076367 W CN2014076367 W CN 2014076367W WO 2015096334 A1 WO2015096334 A1 WO 2015096334A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
sound
housing
speaker
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2014/076367
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English (en)
French (fr)
Inventor
戴志干
伍迪
李卉昱
杨鑫峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Inc
Original Assignee
Goertek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Inc filed Critical Goertek Inc
Priority to US15/108,255 priority Critical patent/US9883266B2/en
Priority to KR1020167020233A priority patent/KR101840735B1/ko
Publication of WO2015096334A1 publication Critical patent/WO2015096334A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2819—Enclosures comprising vibrating or resonating arrangements of the bass reflex type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/38—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means in which sound waves act upon both sides of a diaphragm and incorporating acoustic phase-shifting means, e.g. pressure-gradient microphone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to the field of electroacoustic products, and more particularly to a speaker module and an electronic device including the speaker module. Background technique
  • the speaker unit is also increasingly thin as an important acoustic element, and the speaker includes a diaphragm for radiating sound, because the phase of the sound radiated from the front side and the back side of the diaphragm is different.
  • the front and rear sound chambers should be spaced apart from each other.
  • the speaker unit is usually disposed in a peripheral frame to form a speaker module to form a closed rear sound cavity. And the front acoustic cavity that is only connected to the sound hole, and then installed in the electronic device.
  • the thickness of the speaker module is strictly limited, and the size of the speaker unit and the size of the sound cavity are also greatly limited. Therefore, the speaker unit of the existing structure affects the speaker to some extent.
  • the acoustic performance and output power of the module In addition, the conventional structure of the speaker module and the electronic device is only a simple positional installation and electrical connection, and the internal space of the electronic device is not fully utilized. Therefore, it is necessary to improve the speaker module and electronic device of this conventional structure to balance the thinning and acoustic performance of the product. Summary of the invention
  • an object of the present invention is to provide a speaker module and an electronic device thereof, which can fully utilize the internal space of the speaker module and the electronic device, increase the size of the sound cavity of the speaker module, and increase the size of the speaker unit, thereby improving The acoustic performance of the product.
  • a speaker module comprising a speaker unit and a module housing for housing the fixed speaker unit, wherein the module housing is provided with a sound hole,
  • the module housing is provided with a receiving portion penetrating the module housing, the receiving portion is for receiving the speaker unit, and the front sound chamber and the rear sound chamber are formed between the module shell and the speaker unit, and the upper end of the front sound chamber and the rear sound chamber are formed.
  • a sealing elastic pad is disposed on the upper end surface and the lower end surface of the module housing, and the upper end surface and the lower end surface of the module housing are sealed and sealed with the components of the terminal electronic device through the sealing elastic pad , the upper end surface and the lower end surface of the front sound chamber and the rear sound chamber are sealed.
  • the sound hole of the speaker module is located on the side wall of the module housing, and the front sound chamber is in communication with the sound hole.
  • the speaker unit includes a vibration system including a diaphragm and a voice coil coupled to one side of the diaphragm;
  • the magnetic circuit system includes a combination of a flame, a magnet, and a basin frame;
  • a single sound hole for radiating sound is disposed between the edge of the basin frame and the module casing; the space of the speaker module corresponding to the front side of the diaphragm forms a rear sound cavity, and the space of the speaker module corresponding to the rear side of the diaphragm forms a front sound cavity.
  • the sealing spring pad comprises two connected closed annular structures; the acoustic cavity formed between the upper surface of the module housing and the electronic device is separated into two parts by a sealing spring pad; The acoustic cavity formed between the electronic devices is divided into two parts by a sealing spring pad.
  • a preferred solution is that the upper side of the module housing is separated by a sealing elastic pad to form a partial structure of the front acoustic cavity and the rear acoustic cavity, and the lower side of the module housing is separated by a sealing elastic pad to form a partial structure of the front acoustic cavity and the rear acoustic cavity.
  • the front acoustic cavity portion on the upper side of the module housing is in communication with the front acoustic cavity portion on the lower side of the module housing; the rear acoustic cavity portion on the upper side of the module housing is connected to the rear acoustic cavity portion on the lower side of the module housing; .
  • the sealing spring pad is a foam; and the sealing spring pad is fixedly coupled to the module housing and the electronic device by bonding.
  • the sealing spring pad is one of TPU, TPE or silicone; and the spring pad is integrally molded with the module housing.
  • the number of sound holes is two, the same electronic device located on the side wall of the module housing, wherein the upper surface and the lower surface of the module housing are respectively connected to the circuit board or the device housing Sealing and bonding; and, the module housing is sealed and sealed by the sealing spring pad and the circuit board and the device housing.
  • an sound hole is disposed on the device housing; and the sound hole disposed on the device housing is located at a side of the device housing, and the sound hole of the device housing is connected to the sound hole of the speaker module.
  • the upper and lower sides of the front sound cavity and the rear sound cavity of the speaker module of the present invention are both open structures, which saves the thickness of the top wall and the bottom wall of the conventional speaker module.
  • the upper and lower end faces of the front and rear sound chambers are sealed by the outer casing and the circuit board in the electronic device of the terminal to replace the functions of the top and bottom walls of the conventional speaker module.
  • FIG. 1 is a perspective exploded structural view of a speaker module of the present invention
  • FIG. 2 is a schematic perspective view of a three-dimensional structure of a speaker module of the present invention.
  • FIG. 3 is a schematic perspective view of the speaker module of the present invention.
  • FIG. 4 is a schematic cross-sectional structural view of a speaker module of the present invention.
  • Figure 5 is a partial schematic structural view of an electronic device of the present invention.
  • Fig. 6 is a schematic cross-sectional view showing the electronic device of the present invention.
  • the present invention proposes a speaker module with optimized structure and an electronic device thereof.
  • the speaker module provided by the present invention comprises a speaker unit 2 and a module housing 1 for housing the fixed speaker unit 2, and an acoustic hole is arranged on the mold housing.
  • the speaker module shown in this embodiment.
  • a housing portion 10 penetrating the module housing 1 is disposed at a central position of the module housing 1.
  • the speaker unit 2 is received and fixed in the housing portion 10.
  • a front acoustic cavity and a rear acoustic cavity are formed between the module housing and the speaker unit, and the upper end and the lower end of the front acoustic cavity and the rear acoustic cavity are both open structures.
  • the sound hole of the speaker module is located on the side of the speaker module, and the speaker module shown in this embodiment has two sound holes: the sound hole 13 and the sound hole 14, and the two sound holes are Located on the same side of the side wall of the module housing 1, the sound emitted by the speaker unit 2 is radiated to the outside through the sound hole 13 and the sound hole 14, and the two sound holes are provided to increase the radiation area of the sound and improve High frequency performance of the speaker module.
  • the outer casing of the speaker module and the speaker unit together form a front sound chamber and a rear sound chamber of the speaker module, wherein the rear sound chamber is closed, and the front sound chamber is connected with the sound hole of the speaker module to make the speaker
  • the sound radiated by the monomer communicates with the outside through the sound hole.
  • the speaker module of the present invention comprises only one module housing 1.
  • the front sound chamber and the rear sound chamber formed by the module housing 1 after receiving the speaker unit 2 are open at the upper end and the lower end.
  • the upper and lower sides of the speaker unit are exposed to the module housing 1.
  • the upper surface and the lower surface of the module housing 1 are sealingly combined with the components of the terminal electronic device, and the upper and lower end faces of the front and rear acoustic chambers are sealed by the combination with the electronic device, on the front and rear acoustic chambers.
  • the rear sound cavity is a closed structure, and the front sound cavity is in communication with the sound hole of the side surface.
  • the speaker unit 2 includes a vibration system and a magnetic circuit system, wherein the vibration system includes a diaphragm 21 and is coupled to The voice coil 22 on the lower side of the diaphragm 21; the magnetic circuit system includes a washer 23, a magnet 24, and a basin holder 25 that are sequentially coupled.
  • the magnetic circuit system is a dual magnetic circuit structure, including a central position. The central magnetic circuit and the edge magnetic circuit at the edge position are formed, and a magnetic gap for accommodating the voice coil 22 is formed between the central magnetic circuit and the side magnetic circuit, as shown in FIG.
  • the magnetic circuit system further includes an electrical connection member 20 electrically connecting the voice coil 22 and the terminal electronic device.
  • the voice coil 22 is electrically connected to the magnetic circuit system after the electrical signal is turned on by the electrical connector 20.
  • the medium is forced to vibrate up and down, and further drives the diaphragm 21 to vibrate to generate sound.
  • the front side of the diaphragm 21 is defined as the side of the diaphragm 21 away from the voice coil 22, and the rear side of the diaphragm 21 is defined as the side of the diaphragm 21 close to the voice coil 22.
  • the front side of the diaphragm 21 The space forms the rear acoustic cavity of the speaker module, and the space on the rear side of the diaphragm 21 forms the front acoustic cavity of the speaker module.
  • the edge of the basin frame 25 and the module housing 1 have a gap for radiating sound from the rear side of the diaphragm 21, which is the sound hole 250 of the speaker unit, and the sound is sounded.
  • the hole 250 is radiated and transmitted to the sound hole 13 and the sound hole 14 through the opening 11 and the opening 12 in the module case 1, and is radiated from the sound hole 13 and the sound hole 14 to the outside.
  • the speaker module with a small space on the front side of the diaphragm 21 can adopt the above structure to prevent the diaphragm 21 from colliding with other structures during vibration to affect the sounding effect, and the structure can reduce the resonance of the front sound cavity and improve High frequency sound effects.
  • the module housing 1 and the electronic device are sealed and sealed by a sealing elastic pad.
  • the upper end surface of the module housing 1 is provided with a sealing elastic pad 31, and the module
  • the lower end surface of the casing 1 is provided with a sealing elastic pad 32.
  • One side of the sealing elastic pad 31 and the sealing elastic pad 32 is fixedly coupled with the module housing 1, and the other side is fixedly coupled with the components in the electronic device.
  • the sealing spring pad 31 and the sealing elastic pad 32 are foam materials, and the foam has good elasticity, is convenient for sealing between the two components, and is cost-effective.
  • the sealing elastic pad 31 of the foam material and the sealing elastic pad 32 are sealed and combined with the module housing 1 and the electronic device by bonding.
  • sealing elastic pad 31 and the sealing elastic pad 32 may also be one of TPU, TPE or silicone materials, which have good elasticity and can seal the module housing 1 and the electronic device; It can be fixedly combined with the module housing 1 by injection molding, which can save labor costs and improve accuracy.
  • the front acoustic cavity and the rear acoustic cavity are both open upper structures, and the structure eliminates the thickness of the upper side wall and the lower bottom wall of the upper side of the conventional speaker module, in the periphery of the speaker module.
  • the internal space of the speaker module is increased, which is advantageous for increasing the size of the acoustic cavity and the size of the speaker unit 2, thereby improving the acoustic performance of the product.
  • the front acoustic cavity and the rear acoustic cavity are sealed and combined by the terminal electronic device, so that the front sound cavity and the rear sound cavity of the speaker module are obtained. To the seal, the speaker module can be operated normally.
  • the sound hole 13 and the sound hole 14 are connected to the rear side of the diaphragm 21, and combined with the specific structure inside the speaker module, radiated from the single sound hole 250.
  • the sound waves need to pass through the opening 11 and the opening 12 to communicate with the sound hole 13 and the sound hole 14.
  • the sealing elastic pad 31 and the sealing elastic pad 32 each comprise two connected closed annular structures, and any sealing elastic pad can be separated into two cavities by a sealing elastic pad after being combined with the module housing 1 and the electronic device.
  • the upper cavity is connected to the lower cavity to form a front acoustic cavity and a rear acoustic cavity of the speaker module.
  • FIG. 2 and 3 illustrate a three-dimensional structure of a speaker module according to an embodiment of the present invention
  • the sealing spring pad 31 separates the speaker module into a front acoustic cavity II and a rear acoustic cavity I
  • the spring pad 32 separates the speaker module into a front sound chamber II and a rear sound chamber I.
  • the rear acoustic cavity I separated by the sealed elastic pad 31 and the rear acoustic cavity I formed by the sealed elastic pad 32 are connected to the opening of the module casing 1 through the side of the diaphragm 21, and the module shell is
  • the structure in which the through hole is provided in the body 1 is advantageous for increasing the rear acoustic cavity of the speaker module, thereby improving the low frequency performance of the product.
  • the front acoustic cavity II formed by the sealing elastic pad 32 is separated from the front acoustic cavity II formed by the sealed elastic pad 31 to form a complete front acoustic cavity II, wherein one end of the front acoustic cavity II is communicated through the opening 11 and the opening 12, the front acoustic cavity The other end of II is connected through the sound hole 13 and the sound hole 14.
  • the speaker module is provided with two sound holes: the structure of the sound hole 13 and the sound hole 14 facilitates the sound generated by the diaphragm to radiate to the outside, which is advantageous for improving the high frequency acoustic performance of the product.
  • FIG. 5 and 6 respectively show the structure of an electronic device according to an embodiment of the present invention from different angles.
  • the front sound chamber and the rear sound chamber formed by the speaker module are both open structures, and the surface of the module housing 1 is sealed by the electronic device to seal the front sound chamber and the rear sound chamber.
  • the electronic device (such as a mobile phone, a pad, etc.) includes a device housing 4 and a circuit board 5, and the device housing 4 and the upper side of the module housing 1 are sealed and sealed by a sealing spring pad 31, and the circuit board 5 and the module housing The lower side of the seal is sealed by the sealing spring pad 32.
  • the circuit board 5 and the module housing 1 are combined by the sealing spring pad, the rear sound cavity of the speaker module is closed, and the front sound cavity only passes through the sound.
  • the hole 13 and the sound hole 14 communicate with the outside.
  • the sound hole 13 and the sound hole 14 of the speaker module are located on the side of the speaker module. As shown in FIG. 3, the sound hole 13 and the sound hole 14 are both connected to the sound hole 40 on the side of the device casing 4.
  • the sound generated by the speaker unit 2 passes through the sound hole 13 and the sound hole 14 and communicates with the outside through the sound hole 40, as shown in Fig. 6 (only the structure of the sound hole 13 is shown in Fig. 6).
  • the portion of the circuit board 5 combined with the module housing 1 is a planar structure
  • the portion of the device housing 4 combined with the module housing 1 is a non-planar structure corresponding to the module housing 1.
  • the components inside the electronic device are not limited to the outer casing and the circuit board, and may be screens or other internal components, etc., as long as the acoustic cavity capable of sealing the speaker module is within the protection scope of the present invention.
  • the upper and lower sides of the front and rear acoustic chambers of the speaker module of the present invention are both open structures, eliminating the thickness of the top and bottom walls of the conventional speaker module, and are sealed by the outer casing and the circuit board in the electronic device of the terminal.
  • the upper and lower end faces of the front and rear sound chambers replace the functions of the top and bottom walls of the conventional speaker module.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

一种扬声器模组，包括扬声器单体（2）和模组壳体（1），模组壳体（1）与扬声器单体（2）之间形成前声腔和后声腔，前声腔、后声腔的上端和下端均为开放的结构；模组壳体（1）的上端面和下端面均通过密封弹垫（31，32）与终端电子装置的元件密封结合，使前声腔和后声腔的上端面和下端面均被密封。还公开了一种电子装置，模组壳体（1）的上表面和下表面分别与电子装置的线路板（5）或装置壳体（4）密封结合，模组壳体（1）与线路板（5）、所述装置壳体（4）均通过密封弹垫（31，32）密封结合。这种结构充分的利用了扬声器模组和电子装置的空间，提高了扬声器模组的内部空间，增大扬声器单体的尺寸和声腔的尺寸，从而提高了产品的声学性能。

Description

扬声器模组及包含该扬声器模组的电子装置
技术领域
本发明涉及电声产品技术领域， 更为具体地， 涉及一种扬声器模组及包 含该扬声器模组的电子装置。 背景技术
当今， 消费者对便携式电子装置的要求日渐薄型化， 电子装置内部的电 子元件也日趋薄型化。 其中， 扬声器单体作为重要的声学元件也日趋薄型化， 扬声器包括用于辐射声音的振膜， 由于振膜前侧和后侧辐射的声音相位相差
180度， 因此， 前声腔和后声腔应为相互间隔的结构。 为了避免扬声器单体直 接安装于电子装置中产生的诸如前声腔和后声腔无法完全间隔之类的缺陷， 通常预先将扬声器单体设置于一外围框架中形成一扬声器模组， 形成封闭的 后声腔和仅与出声孔连通的前声腔， 然后再安装于电子装置中。
然而由于电子装置的日趋薄型化， 扬声器模组的厚度受到严格的限制， 扬声器单体的尺寸、 声腔尺寸也受到极大的限制， 因此， 现有结构的扬声器 单体在一定程度上影响了扬声器模组的声学性能和输出功率。 另外传统结构 的扬声器模组与电子装置之间只是简单的位置上的安装和电连接的实现， 没 有充分的利用电子装置内部的空间。 因此， 有必要对这种传统结构的扬声器 模组和电子装置进行改进， 以兼顾产品的薄型化和声学性能。 发明内容
鉴于上述问题， 本发明的目的是提供一种扬声器模组及其电子装置， 可 以充分利用扬声器模组和电子装置的内部空间， 增大扬声器模组的声腔尺寸 和扬声器单体的尺寸， 从而提高产品的声学性能。 为解决上述技术问题， 本发明的技术方案是： 一种扬声器模组， 包括扬 声器单体和收容固定扬声器单体的模组壳体， 在模组壳体上设置有出声孔， 其中， 模组壳体设置有贯穿模组壳体的收容部， 收容部用于收容扬声器单体， 模组壳体与扬声器单体之间形成前声腔和后声腔， 前声腔、 后声腔的上端和 下端均为开放的结构； 在模组壳体的上端面和下端面上均设置有密封弹垫， 模组壳体的上端面和下端面均通过密封弹垫与终端电子装置的元件密封结 合， 使前声腔和后声腔的上端面和下端面均被密封。
此外， 优选的方案是， 扬声器模组的出声孔位于模组壳体的侧壁上， 前 声腔与出声孔连通。
此外， 优选的方案是， 扬声器单体包括振动系统和磁路系统， 振动系统 包括振膜和结合于振膜一侧的音圈； 磁路系统包括依次结合的华斯、 磁铁和 盆架； 其中， 在盆架边缘与模组壳体之间设置有辐射声音的单体声孔； 扬声 器模组对应振膜前侧的空间形成后声腔， 扬声器模组对应振膜后侧的空间形 成前声腔。
此外， 优选的方案是， 密封弹垫包括两个相连的闭合的环形结构； 模组 壳体上表面与电子装置之间形成的声腔被密封弹垫分隔为两部分； 模组壳体 下表面与电子装置之间形成的声腔被密封弹垫分隔为两部分。
此外， 优选的方案是， 模组壳体的上侧由密封弹垫分隔形成前声腔和后 声腔的部分结构， 模组壳体的下侧由密封弹垫分隔形成前声腔和后声腔的部 分结构； 以及， 模组壳体上侧的前声腔部分和模组壳体下侧的前声腔部分相 连通； 模组壳体上侧的后声腔部分和模组壳体下侧的后声腔部分相连通。
此外， 优选的方案是， 密封弹垫为泡棉； 并且， 密封弹垫与模组壳体、 电子装置之间通过粘结的方式固定结合。
此外， 优选的方案是， 密封弹垫为 TPU、 TPE或硅胶中的一种； 并且， 弹垫与模组壳体注塑结合为一体。
此外， 优选的方案是， 出声孔的数量为两个， 位于模组壳体的侧壁的同 一种电子装置， 其中， 模组壳体的上表面和下表面分别与线路板或装置 壳体密封结合； 并且， 模组壳体与线路板、 装置壳体均通过密封弹垫密封结 合。
优选的， 在装置壳体上设置有出声孔； 并且， 设置在装置壳体上的出声 孔位于装置壳体的侧面， 装置壳体的出声孔与扬声器模组的出声孔相连通。 采用上述技术方案后， 与传统结构相比， 本发明扬声器模组的前声腔和 后声腔的上侧和下侧均为开放的结构， 省掉了传统扬声器模组顶壁和底壁的 厚度， 用终端的电子装置中的外壳和线路板密封前声腔和后声腔的上端面和 下端面， 以代替传统扬声器模组顶壁和底壁的作用。 这种结构充分的利用了 扬声器模组和电子装置的空间， 提高了扬声器模组的内部空间， 增大扬声器 单体的尺寸和声腔的尺寸， 从而提高了产品的声学性能。 为了实现上述以及相关目的， 本发明的一个或多个方面包括后面将详细 说明并在权利要求中特别指出的特征。 下面的说明以及附图详细说明了本发 明的某些示例性方面。 然而， 这些方面指示的仅仅是可使用本发明的原理的 各种方式中的一些方式。 此外， 本发明旨在包括所有这些方面以及它们的等 同物。 附图说明
通过参考以下结合附图的说明及权利要求书的内容， 并且随着对本发明 的更全面理解， 本发明的其它目的及结果将更加明白及易于理解。 在附图中： 图 1是本发明扬声器模组的立体分解结构示意图；
图 2是本发明扬声器模组的立体结构示意图一；
图 3是本发明扬声器模组的立体结构示意图二；
图 4是本发明扬声器模组的剖面结构示意图；
图 5是本发明电子装置的部分结构示意图；
图 6是本发明电子装置的剖面结构示意图。
在所有附图中相同的标号指示相似或相应的特征或功能。 具体实施方式
为了解决现有技术中不能充分的利用电子装置内部空间的问题， 本发明 提出了一种优化结构的扬声器模组及其电子装置。
下面将结合本发明实施例中的附图， 对本发明的技术方案进行清楚、 完 整的描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是全部 的实施例。 并且， 在下面的实施例描述中， 出于说明的目的， 为了提供对一 个或多个实施例的全面理解， 阐述了许多具体细节， 很明显， 也可以在没有 这些具体细节的情况下实现这些实施例。 基于本发明中的实施例， 本领域普 通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例， 都属于 本发明保护的范围。
图 1至图 4从多个角度示出了根据本发明实施例的扬声器模组的结构。 如图 1至图 4所示， 本发明提供的扬声器模组包括扬声器单体 2和收容 固定扬声器单体 2的模组壳体 1， 在模具壳体上设置有出声孔。本实施例中所 示的扬声器模组的外壳仅有一个， 在该模组壳体 1 的中心位置设置有贯穿模 组壳体 1的收容部 10， 扬声器单体 2被收容固定于收容部 10中， 此外， 模组 壳体与扬声器单体之间形成前声腔和后声腔， 前声腔、 后声腔的上端和下端 均为开放的结构。
具体地， 扬声器模组的出声孔位于扬声器模组的侧面， 本实施例中所示 的扬声器模组具有两个出声孔： 出声孔 13和出声孔 14， 两个出声孔均位于模 组壳体 1的侧壁的同一侧上， 扬声器单体 2发出的声音通过出声孔 13和出声 孔 14辐射到外界， 设置两个出声孔有利于增加声音的辐射面积， 提高扬声器 模组的高频性能。
在扬声器的传统结构中， 扬声器模组的外壳和扬声器单体共同形成扬声 器模组的前声腔和后声腔， 其中后声腔是封闭的， 前声腔与扬声器模组的出 声孔相连通， 使扬声器单体辐射的声音通过出声孔与外界连通。 本发明的扬 声器模组仅包含一个模组壳体 1，模组壳体 1收容扬声器单体 2后形成的前声 腔、 后声腔均为上端和下端开放的结构。
在本实施例中， 扬声器单体的上下两侧均是露出模组壳体 1 的。 模组壳 体 1 的上表面和下表面与终端电子装置的元件密封结合， 通过与电子装置的 结合实现对前声腔和后声腔的上端面和下端面的密封， 在前声腔和后声腔的 上端面和下端面密封之后， 后声腔为封闭的结构， 前声腔与侧面的出声孔相 连通。
图 1和图 4从不同角度示出了扬声器单体的结构， 在本发明的一个具体 实施例中， 扬声器单体 2包括振动系统和磁路系统， 其中， 振动系统包括振 膜 21和结合于振膜 21下侧的音圈 22; 磁路系统包括依次结合的华司 23、 磁 铁 24和盆架 25。 在本实施例中个， 磁路系统为双磁路结构， 包括位于中心位 置的中心磁路和位于边缘位置的边磁路， 中心磁路和边磁路之间形成收容音 圈 22的磁间隙， 如图 4所示。 此外， 磁路系统还包括电连接音圈 22和终端 电子装置的电连接件 20， 如图 1所示， 音圈 22通过电连接件 20接通电信号 后， 在磁路系统形成的磁间隙中受力而上下振动， 进一步带动振膜 21振动产 生声音。
其中， 定义振膜 21前侧为振膜 21远离音圈 22的一侧， 定义振膜 21后 侧为振膜 21靠近音圈 22的一侧， 在本实施例中， 振膜 21前侧的空间形成扬 声器模组的后声腔， 振膜 21后侧的空间形成扬声器模组的前声腔。 如图 2和 图 3所示， 盆架 25的边缘与模组壳体 1之间具有使振膜 21后侧的声音辐射 出来的间隙， 该间隙即扬声器单体的声孔 250， 声音从声孔 250辐射出来后经 过模组壳体 1上的开孔 11和开孔 12传输到出声孔 13和出声孔 14，并从出声 孔 13和出声孔 14处辐射到外界。 对于振膜 21前侧空间较小的扬声器模组可 以采用上述结构， 以防止振膜 21在振动过程中碰撞到其他结构而影响发声效 果， 并且采用这种结构可以减小前声腔的谐振， 提高高频声效。
在本发明的一个具体实施方式中， 模组壳体 1 与电子装置之间是通过密 封弹垫实现密封结合的， 其中， 在模组壳体 1的上端面设置有密封弹垫 31， 模组壳体 1的下端面设置有密封弹垫 32， 密封弹垫 31和密封弹垫 32的一侧 与模组壳体 1 固定结合， 另一侧与电子装置中的元件固定结合。 优选的， 密 封弹垫 31和密封弹垫 32为泡棉材料， 泡棉具有良好的弹性， 便于两个部件 之间的密封， 而且性价比较高。 泡棉材料的密封弹垫 31、 密封弹垫 32与模组 壳体 1、 电子装置之间通过粘结的方式密封结合。
此外， 密封弹垫 31和密封弹垫 32也可以采用 TPU、 TPE或硅胶材料中 的一种， 这些材料具有良好的弹性， 可以使模组壳体 1和电子装置密封结合; 此外， 上述材料也可以通过注塑的方式与模组壳体 1 固定结合， 可以节省人 工成本， 提高精确度。
在本发明的扬声器模组中， 前声腔和后声腔均为上端开放的结构， 这种 结构省掉了传统扬声器模组的上侧的顶壁和下侧底壁的厚度， 在扬声器模组 外围尺寸一定的情况下， 增大了扬声器模组的内部空间， 有利于增大声腔的 尺寸和扬声器单体 2 的尺寸， 从而有利于提高产品的声学性能。 前声腔和后 声腔通过终端电子装置密封结合的结构， 使扬声器模组的前声腔和后声腔得 到密封， 可以保证扬声器模组的正常工作。
需要说明的是， 在本实施例中的扬声器模组的出声孔 13和出声孔 14是 与振膜 21后侧连通的， 结合扬声器模组内部的具体结构， 从单体声孔 250辐 射出的声波需要经过开孔 11和开孔 12才能与出声孔 13、 出声孔 14连通。结 合这种结构， 密封弹垫 31和密封弹垫 32均包含两个相连的闭合环形结构， 任一密封弹垫与模组壳体 1、电子装置结合后可以通过密封弹垫分隔为两个腔 体， 上侧的腔体与下侧的腔体对应连通， 形成扬声器模组的前声腔和后声腔。
图 2和图 3示出了根据本发明实施例的扬声器模组的立体结构； 如图 2和图 3共同所示，密封弹垫 31将扬声器模组分隔为前声腔 II和后 声腔 I； 密封弹垫 32将扬声器模组分隔为前声腔 II和后声腔 I。
具体地，被密封弹垫 31分隔而成的后声腔 I与被密封弹垫 32分隔形成的 后声腔 I通过振膜 21侧面贯穿模组壳体 1的开孔相连通， 这种在模组壳体 1 上设置贯通孔的结构有利于增大扬声器模组的后声腔， 从而提高产品的低频 性能。 被密封弹垫 32分隔形成的前声腔 II与被密封弹垫 31分隔形成的前声 腔 II连通形成完整的前声腔 II， 其中， 前声腔 II的一端通过开孔 11和开孔 12连通， 前声腔 II的另一端通过出声孔 13和出声孔 14连通。 扬声器模组设 置两个出声孔： 出声孔 13和出声孔 14的结构便于振膜产生的声音辐射到外 界， 有利于提高产品高频的声学性能。
图 5和图 6从不同角度分别示出了根据本发明实施例的电子装置的结构。 如图 5和图 6所示， 扬声器模组形成的前声腔和后声腔均是开放的结构， 模组壳体 1 的表面通过与电子装置密封结合实现前声腔和后声腔的密封。 其 中， 电子装置 （如手机、 pad等） 包括装置壳体 4和线路板 5， 装置壳体 4与 模组壳体 1的上侧通过密封弹垫 31密封结合， 线路板 5与模组壳体 1的下侧 通过密封弹垫 32密封结合， 装置壳体 4、 线路板 5与模组壳体 1通过密封弹 垫结合后， 扬声器模组的后声腔为封闭的结构， 前声腔仅通过出声孔 13、 出 声孔 14与外界连通。
此外， 扬声器模组的出声孔 13、 出声孔 14位于扬声器模组的侧面， 如图 3所示， 出声孔 13和出声孔 14均与装置壳体 4侧面的出声孔 40连通， 扬声 器单体 2产生的声音通过出声孔 13和出声孔 14后通过出声孔 40与外界连通， 如图 6所示 （图 6仅示出出声孔 13的结构）。 本实施例中， 线路板 5与模组壳体 1结合的部分为平面结构， 装置壳体 4 与模组壳体 1结合的部分为对应模组壳体 1设置的非平面结构。
此外， 电子装置内部的元件不限于外壳和线路板， 也可以为屏幕或内部 其他元件等， 只要能够密封扬声器模组的声腔均在本发明保护范围内即可。 本发明扬声器模组的前声腔和后声腔的上侧和下侧均为开放的结构， 省 掉了传统扬声器模组顶壁和底壁的厚度， 用终端的电子装置中的外壳和线路 板密封前声腔和后声腔的上端面和下端面， 以代替传统扬声器模组顶壁和底 壁的作用。 这种结构充分的利用了扬声器模组和电子装置的空间， 提高了扬 声器模组的内部空间， 增大扬声器单体的尺寸和声腔的尺寸， 从而提高了产 品的声学性能。 如上参照附图以示例的方式描述根据本发明的扬声器模组及其电子装 置。 在本发明的上述教导下， 本领域技术人员可以在上述实施例的基础上进 行其他的改进和变形， 而这些改进和变形， 都落在本发明的保护范围内。 因 此， 本领域技术人员应该明白， 上述的具体描述只是更好的解释本发明的目 的， 而并非对本发明的限定， 本发明的保护范围由权利要求及其等同物限定。

Claims

权 利 要 求 书
1、 一种扬声器模组， 包括扬声器单体和收容固定所述扬声器单体的模组 壳体， 在所述模组壳体上设置有出声孔， 其特征在于，
在所述模组壳体上设置有贯穿所述模组壳体的收容部， 所述收容部用于 收容所述扬声器单体， 所述模组壳体与所述扬声器单体之间形成前声腔和后 声腔， 所述前声腔、 所述后声腔的上端和下端均为开放的结构；
在所述模组壳体的上端面和下端面上均设置有密封弹垫， 所述模组壳体 的上端面和下端面均通过所述密封弹垫与终端电子装置的元件密封结合， 使 所述前声腔和后声腔的上端面和下端面均被密封。
2、 根据权利要求 1所述的扬声器模组， 其特征在于，
所述扬声器模组的出声孔位于模组壳体的侧壁上， 所述前声腔与所述出 声孔连通。
3、 根据权利要求 1所述的扬声器模组， 其特征在于，
所述扬声器单体包括振动系统和磁路系统， 所述振动系统包括振膜和结 合于所述振膜一侧的音圈； 所述磁路系统包括依次结合的华司、 磁铁和盆架； 其中，
在所述盆架边缘与所述模组壳体之间设置有辐射声音的单体声孔； 扬声器模组对应所述振膜前侧的空间形成所述后声腔， 扬声器模组对应 所述振膜后侧的空间形成所述前声腔。
4、 根据权利要求 3所述的扬声器模组， 其特征在于，
所述密封弹垫包括两个相连的闭合的环形结构；
所述模组壳体上表面与所述电子装置之间形成的声腔被所述密封弹垫分 隔为两部分；
所述模组壳体下表面与所述电子装置之间形成的声腔被所述密封弹垫分 隔为两部分。
5、 根据权利要求 4所述的扬声器模组， 其特征在于，
所述模组壳体的上侧由所述密封弹垫分隔形成前声腔和后声腔的部分结 构， 所述模组壳体的下侧由所述密封弹垫分隔形成前声腔和后声腔的部分结 构； 以及，
所述模组壳体上侧的前声腔部分和所述模组壳体下侧的前声腔部分相连 通； 所述模组壳体上侧的后声腔部分和所述模组壳体下侧的后声腔部分相连 通。
6、 根据权利要求 1至 5中任一项所述的扬声器模组， 其特征在于， 所述密封弹垫为泡棉； 并且，
所述密封弹垫与所述模组壳体、 所述电子装置之间通过粘结的方式固定 士 A
7、 根据权利要求 1至 5中任一项所述的扬声器模组， 其特征在于， 所述密封弹垫为 TPU、 TPE或硅胶中的一种； 并且，
所述弹垫与所述模组壳体注塑结合为一体。
8、 根据权利要求 1或 2所述的扬声器模组， 其特征在于，
所述出声孔的数量为两个， 位于所述模组壳体的侧壁的同一侧。
9、 一种电子装置， 其特征在于， 所述电子装置包括线路板、 装置壳体， 以及根据权利要求 1至 8中任一项所述的扬声器模组， 其中，
所述模组壳体的上表面和下表面分别与所述线路板或装置壳体密封结 合； 并且，
所述模组壳体与所述线路板、 所述装置壳体均通过密封弹垫密封结合。
10、 根据权利要求 9所述的电子装置， 其特征在于，
在所述装置壳体上设置有出声孔； 并且，
设置在所述装置壳体上的出声孔位于所述装置壳体的侧面， 所述装置壳 体的出声孔与所述扬声器模组的出声孔相连通。
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