WO2015089947A1 - 一种由焊接不良材料制成的电子焊接件的制造工艺 - Google Patents

一种由焊接不良材料制成的电子焊接件的制造工艺 Download PDF

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Publication number
WO2015089947A1
WO2015089947A1 PCT/CN2014/073683 CN2014073683W WO2015089947A1 WO 2015089947 A1 WO2015089947 A1 WO 2015089947A1 CN 2014073683 W CN2014073683 W CN 2014073683W WO 2015089947 A1 WO2015089947 A1 WO 2015089947A1
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hole
soldering
electronic
manufacturing process
thin plate
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PCT/CN2014/073683
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English (en)
French (fr)
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海尔霖⋅鲁道夫
比哲⋅提尔
林亮
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中山名创力电子有限公司
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Publication of WO2015089947A1 publication Critical patent/WO2015089947A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K33/00—Specially-profiled edge portions of workpieces for making soldering or welding connections; Filling the seams formed thereby
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres

Definitions

  • the present invention relates to a manufacturing process of an electronic soldering member made of a poorly welded material.
  • a soldering material such as copper, the aluminum heat sink made by the method is industrially complicated, and the pins are generally fixed by means of a card position, etc., and the stability is not high, and the looseness is easy to loosen, which is easy to cause the circuit. failure.
  • the present invention provides a manufacturing process of an electronic soldering member which is made of a poorly soldered material and can be easily soldered to a circuit board.
  • a manufacturing process of an electronic soldering member made of a poorly welded material comprising the following steps:
  • Step 1 processing the main body of the electronic soldering piece and the soldering pin from the poor soldering material, and forming a through hole at the soldering pin of the electronic soldering piece;
  • Step 2 The electronic soldering member is placed in a fixing device, and the electronic soldering member is fixed by the fixing device, and a solderable material or a plated material corresponding to the through hole of the soldering pin is disposed on the side of the electronic soldering member.
  • Step 3 Pressing a stamping column corresponding to the through hole of the soldering pin to punch the thin plate and the through hole along the axial direction of the through hole, and punching the punching column on the thin plate to cut the filling material corresponding to the through hole, and passing through the stamping column The filler is pressed into the through hole.
  • the electronic soldering member is a thin plate made of an aluminum material, which is manufactured by cutting or die casting.
  • the sheet is made of a copper material.
  • the fixing device includes a base and a first pressing device, and the electronic welding member is disposed between the base and the first pressing device.
  • the thin plate is disposed on an upper end surface of the first pressing device, and a second pressing device is disposed above the thin plate.
  • the first pressing device and the second pressing device respectively have positioning holes aligned with each other, the positioning holes correspond to the through holes, and the electronic welding member is disposed between the base and the first pressing device
  • the hole is aligned with the positioning hole
  • the punching column is disposed in the positioning hole of the second pressing device and can slide back and forth along the positioning hole, and the punching column is connected with the punching device.
  • the manufacturing process of the electronic soldering member of the present invention comprises: forming a through hole in a soldering pin of an electronic soldering member made of a poorly soldered material, and then passing the solderable material or after plating by a punching device A filler made of a solderable material is punched into the through hole, and the welded solder joint of the manufactured electronic soldering piece has good soldering performance.
  • soldering is required, the soldering pin is inserted into the soldering hole of the circuit board. It can be fixed directly by soldering.
  • the solder can be firmly soldered to the soldering pin and soldered.
  • the invention is stable, reliable and convenient, and the manufacturing process of the electronic welding component of the invention is very simple, and the manufacturing cost is low, which is beneficial to a wide range of popularization and application.
  • Figure 1 is a schematic cross-sectional view of a manufacturing process apparatus of the present invention
  • Figure 2 is a schematic cross-sectional exploded view of the manufacturing process apparatus of the present invention.
  • Figure 3 is a schematic illustration of the manufacture of an electronic weldment by the present invention.
  • FIG. 1 and FIG. 2 are schematic diagrams showing a manufacturing apparatus involved in a manufacturing process of the present invention.
  • the manufacturing apparatus includes a base 9, a first pressing device 1, and a second pressing.
  • the device 2, the stamping column 3, the stamping column 3 is connected with a punching device such as a punching machine, a cylinder, a cylinder, a hammer, etc., to drive the stamping column 3 to perform a reciprocating punching action, in the first pressing device 1 and the second pressing device
  • the device 2 is respectively provided with positioning holes 11 which are aligned with each other, and the positioning holes 11 are as large or slightly larger than the through holes 42 on the soldering pins 41 of the electronic soldering member 4 to be manufactured, outside the stamping column 3.
  • the diameter corresponds to the inner diameter of the positioning hole 11, and the punch column 3 is inserted into the positioning hole 11 of the second pressing device 2.
  • the manufacturing process of the present invention includes the following steps:
  • Step 1 The main body of the electronic soldering member 4 and the soldering pin 41 are processed by the aluminum material by cutting or die casting, and a through hole 42 is formed in the soldering pin 41 of the electronic soldering member 4;
  • Step 2 includes the following steps: Step 2.1: placing the electronic soldering member 4 between the base 9 and the first pressing device 1, and pressing and fixing the electronic soldering member 4 by pressing the first pressing device 1 and making the through hole 42 is aligned with the positioning hole 11 on the first pressing device 1;
  • Step 2.2 Inserting a thin plate 5 made of a copper material between the first pressing device 1 and the second pressing device 2, pressing the second pressing device 2 to press the thin plate 5, and making the thin plate 5 completely Covering the positioning hole 11;
  • Step 3 The stamping column 3 is driven to be pressed down along the positioning hole 11 by the punching device.
  • the stamping column 3 first punches and cuts the filler corresponding to the through hole 42 on the thin plate 5, and presses the filler through the stamping column 3. Up to the through hole 42.
  • FIG. 3 is a schematic view of the electronic soldering manufactured by the above process, and the soldering pin 41 of the electronic soldering member 4 manufactured by the above process has good soldering performance, and when soldering is required,
  • the soldering pin 41 is inserted into the soldering hole on the circuit board and directly fixed by soldering. Since the through hole of the soldering pin 41 is embedded with a filler made of a copper material, the solder can be firmly fixed. Soldering to the soldering pin 41, the soldering is stable, reliable and convenient, and the manufacturing process of the electronic soldering part of the invention is very simple, and the manufacturing cost is low, which is beneficial to a wide range of popularization and application.
  • the present invention is also applicable to the manufacture of other electronic soldering parts made of poorly soldered materials, such as those made of a PCB substrate.
  • the electronic component bracket, the insulating sheet made of stainless steel material, etc. make the electronic soldering parts made of poorly welded materials have good welding performance in the soldering circuit board, and the manufacturing process is simple, and the manufacturing cost is greatly reduced.
  • the thin plate 5 is made of a copper material.
  • the thin plate 5 can also be made of other weldable materials or electroplated solderable materials, such as stainless steel copper plating, stainless steel tin plating, aluminum plating. Copper, aluminum tin plating, etc., will not be described in detail here.
  • the pressing device and the pressing device are all well-known mechanical devices in the industry, and will not be described in detail herein.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种由焊接不良材料制成的电子焊接件的制造工艺，包括：在由焊接不良材料制成的电子焊接件的焊接接脚上开设通孔，然后通过冲压的装置将由可焊接材料或电镀后可焊接材料制成的填充料冲压进该通孔内，制造而出的电子焊接件的焊接接脚处具有良好的焊接性能，需焊接时，将焊接接脚插入至电路板上的焊接孔内，直接通过锡焊固定即可，由于焊接接脚的通孔内镶嵌入有由可焊接材料制成的填充料，使得焊锡能够牢牢的焊接至焊接接脚上，焊接稳固可靠、方便，且本制造工艺非常的简单，制造成本低，有利于广泛的推广应用。

Description

一种由焊接不良材料制成的电子焊接件的制造工艺
技术领域
本发明涉及一种由焊接不良材料制成的电子焊接件的制造工艺。
背景技术
在电路板焊接的过程中，通常会存在一些由焊接不良材料制成的电子焊接件，如：铝质散热片、PCB基板制成的支架、由不锈钢材料制成的绝缘片等，而铝、PCB基板、不锈钢均是很难上锡的，故该类材料制成的电子焊接件通常是难以焊接至电路板之上，为解决该难题，行业内存在着各种的解决方法，如铝质散热片通常有两种解决方法：第一种方法是对铝散热片进行镀锡处理，通过该方法制成铝散热片，工艺复杂且成本高；第二种方法是在铝散热片下端加装一有可焊接材料如铜制成的接脚，通过该方法制成的铝散热片其工业复杂，且接脚一般是通过卡位等方式固定，其稳定性不高容易松动脱离，易造成电路的故障。
发明内容
为了克服现有技术的不足，本发明提供一种由焊接不良材料制成并能够方便的焊接至电路板上的电子焊接件的制造工艺。
本发明解决其技术问题所采用的技术方案是：
一种由焊接不良材料制成的电子焊接件的制造工艺,包括以下步骤：
步骤1：由焊接不良材料加工出电子焊接件的主体及其焊接接脚，并在电子焊接件的焊接接脚处开设通孔；
步骤2：将电子焊接件置入一固定装置中，并通过该固定装置固定好电子焊接件，在电子焊接件侧面设置一能够与焊接接脚的通孔对应的由可焊接材料或电镀后可焊接材料制成的薄板；
步骤3：通过一与焊接接脚的通孔对应的冲压柱沿通孔的轴向向薄板及通孔冲压，冲压柱在薄板上冲压裁切出与通孔对应的填充料，并通过冲压柱将该填充料压入至通孔内。
所述电子焊接件为由铝质材料制成的薄板，其通过裁切或压铸的方式制造。
所述薄板由铜质材料制成。
所述固定装置包括底座及第一压紧装置，所述电子焊接件设置在底座和第一压紧装置之间。
所述薄板设置在第一压紧装置的上端面，并在薄板上方配置第二压紧装置。
所述第一压紧装置和第二压紧装置上分别开设有相互对齐的定位孔，所述定位孔与通孔对应，并且电子焊接件设置在底座和第一压紧装置之间时，通孔与定位孔对齐，所述冲压柱设置在第二压紧装置的定位孔内并能沿定位孔往复的滑动，所述冲压柱与冲压装置连接。
本发明的有益效果是：本发明的电子焊接件的制造工艺包括：在由焊接不良材料制成的电子焊接件的焊接接脚上开设通孔，然后通过冲压的装置将由可焊接材料或电镀后可焊接材料制成的填充料冲压进该通孔内，制造而出的电子焊接件的焊接接脚处具有良好的焊接性能，需焊接时，将焊接接脚插入至电路板上的焊接孔内，直接通过锡焊固定即可，由于焊接接脚的通孔内镶嵌入有由可焊接材料或电镀后可焊接材料制成的填充料，使得焊锡能够牢牢的焊接至焊接接脚上，焊接稳固可靠、方便，且本发明的电子焊接件制造工艺均非常的简单，制造成本低，有利于广泛的推广应用。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明的制造工艺设备的截面示意图；
图2是本发明的制造工艺设备的截面分解示意图；
图3是通过本发明的制造电子焊接件的示意图。
具体实施方式
参照图1、图2，图1、图2是本发明的制造工艺所涉及的制造设备的简要示意图，如图所示，该制造设备包括底座9、第一压紧装置1、第二压紧装置2、冲压柱3，所述冲压柱3与冲压设备如冲床、气缸、油缸、冲锤等连接，以带动冲压柱3作往复的冲压动作，在第一压紧装置1和第二压紧装置2上分别开设有相互对齐的定位孔11，所述定位孔11与所需制造的电子焊接件4的焊接接脚41上的通孔42一样大或稍大，所述冲压柱3的外径与定位孔11的内径对应，并将冲压柱3插入至第二压紧装置2的定位孔11内。
本发明的制造工艺包括以下步骤：
步骤1：由铝质材料通过裁切或压铸的方式制造加工出薄片状的电子焊接件4的主体及其焊接接脚41，并在电子焊接件4的焊接接脚41处开设通孔42；
步骤2包括以下步骤：步骤2.1：将电子焊接件4置入底座9和第一压紧装置1之间，并通过下压第一压紧装置1压紧固定电子焊接件4，并使得通孔42与第一压紧装置1上的定位孔11对齐；
步骤2.2：将由铜质材料制成的薄板5置入至第一压紧装置1和第二压紧装置2之间，下压第二压紧装置2以压紧薄板5，并使得薄板5完全遮盖定位孔11；
步骤3：通过冲压设备带动冲压柱3沿定位孔11向下冲压，冲压柱3先在薄板5上冲压裁切出与通孔42对应的填充料，并通过冲压柱3将该填充料压入至通孔42内。
如图3所示，图3即为通过上述工艺制造的电子焊接的的示意图，通过上述的工艺制造而出的电子焊接件4的焊接接脚41处具有良好的焊接性能，需焊接时，将焊接接脚41插入至电路板上的焊接孔内，直接通过锡焊固定即可，由于焊接接脚41的通孔内镶嵌入有由铜质材料制成的填充料，使得焊锡能够牢牢的焊接至焊接接脚41上，焊接稳固可靠、方便，且本发明的电子焊接件制造工艺均非常的简单，制造成本低，有利于广泛的推广应用。
在上述的步骤中所制造的是一种用于焊接电路板上的铝质散热片，当然本发明还可应用于制造其他由焊接不良材料制成的电子焊接件，如由PCB基板制成的电子元件支架、由不锈钢材料制成的绝缘片等，使得该类的由焊接不良材料制成的电子焊接件再焊接电路板中具有良好的焊接性能，且制造工艺简单，大大降低制造的成本。
在上述实施例中，薄板5由铜质材料制成，在具体实施过程中，薄板5还可采用其他可焊接材料或电镀后可焊接材料制成，如不锈钢镀铜、不锈钢镀锡、铝镀铜、铝镀锡等，在此不作详述。
在上述步骤中，涉及的压紧装置、冲压装置均为行业内所熟知的机械装置，在此不作详述。
以上对本发明的较佳实施进行了具体说明，当然，本发明还可以采用与上述实施方式不同的形式，熟悉本领域的技术人员在不违背本发明精神的前提下所作的等同的变换或相应的改动，都应该属于本发明的保护范围内。

Claims (6)

  1. 一种由焊接不良材料制成的电子焊接件的制造工艺,其特征在于:包括以下步骤：
    步骤1：由焊接不良材料加工出电子焊接件的主体及其焊接接脚，并在电子焊接件的焊接接脚处开设通孔；
    步骤2：将电子焊接件置入一固定装置中，并通过该固定装置固定好电子焊接件，在电子焊接件侧面设置一能够与焊接接脚的通孔对应的由可焊接材料或电镀后可焊接材料制成的薄板；
    步骤3：通过一与焊接接脚的通孔对应的冲压柱沿通孔的轴向向薄板及通孔冲压，冲压柱在薄板上冲压裁切出与通孔对应的填充料，并通过冲压柱将该填充料压入至通孔内。
  2. 根据权利要求1所述的一种由焊接不良材料制成的电子焊接件的制造工艺，其特征在于：所述电子焊接件为由铝质材料制成的薄板，其通过裁切或压铸的方式制造。
  3. 根据权利要求1所述的一种由焊接不良材料制成的电子焊接件的制造工艺，其特征在于：所述薄板由铜质材料制成。
  4. 根据权利要求2所述的一种由焊接不良材料制成的电子焊接件的制造工艺，其特征在于：所述固定装置包括底座及第一压紧装置，所述电子焊接件设置在底座和第一压紧装置之间。
  5. 根据权利要求4所述的一种由焊接不良材料制成的电子焊接件的制造工艺，其特征在于：所述薄板设置在第一压紧装置的上端面，并在薄板上方配置第二压紧装置。
  6. 根据权利要求5所述的一种由焊接不良材料制成的电子焊接件的制造工艺，其特征在于：所述第一压紧装置和第二压紧装置上分别开设有相互对齐的定位孔，所述定位孔与通孔对应，并且电子焊接件设置在底座和第一压紧装置之间时，通孔与定位孔对齐，所述冲压柱设置在第二压紧装置的定位孔内并能沿定位孔往复的滑动，所述冲压柱与冲压装置连接。
PCT/CN2014/073683 2013-12-17 2014-03-19 一种由焊接不良材料制成的电子焊接件的制造工艺 WO2015089947A1 (zh)

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