WO2015077012A1

WO2015077012A1 - Peeling methods and apparatus

Info

Publication number: WO2015077012A1
Application number: PCT/US2014/063809
Authority: WO
Inventors: Robert Alan Bellman; Robert George MANLEY; Alan Thomas Ii Stephens
Original assignee: Corning Incorporated
Priority date: 2013-11-19
Filing date: 2014-11-04
Publication date: 2015-05-28
Also published as: JP2016539502A; CN105745168A; TW201522252A; KR20160086392A

Abstract

A peeling apparatus (100) includes a peeling member (103) with an attachment member (115) including an arcuate surface (117) and configured to releasably mount a first substrate (111) with respect to the arcuate surface. The peeling apparatus further includes a translation mechanism (107) configured to translate a support axis (X) relative to a second substrate (113) to move the peeling member away from the second substrate while the peeling member rotates about the support axis. In further examples, methods include releasably mounting a first substrate with respect to an arcuate surface of a peeling member and releasably mounting a second substrate relative to a support location (105). The method further includes translating a support axis of the peeling member relative to the second substrate to move the peeling member away from the second substrate, wherein the first substrate peels from the second substrate as the peeling member rotates about the support axis.

Description

PEELING METHODS AND APPARATUS

PRIORITY

[0001] This application claims the benefit of priority under 35 U.S.C. § 119 of U.S. Provisional Application Serial No. 61/906065 filed on November 19, 2013; the content of which is relied upon and incorporated herein by reference in its entirety.

TECHNICAL FIELD

[0002] The present disclosure relates generally to methods and apparatus for peeling substrates and, more particularly, to a methods and apparatus for peeling a first substrate from a second substrate.

BACKGROUND

[0003] There is interest in using thin, flexible glass in the fabrication of flexible electronics or other devices. Flexible glass can have several beneficial properties related to either the fabrication or performance of electronic devices, for example, liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), touch sensors, photovoltaics, etc. One component in the use of flexible glass is the ability to handle the glass in a sheet format and not in a roll format.

[0004] To enable the handling of flexible glass during processing of the flexible glass, the flexible glass is typically bonded to a rigid carrier substrate using a polymer binding agent. Once bonded to the carrier substrate, the rigid characteristics and size of the carrier substrate allow the bonded structure to be handled in production without bending or causing damage to the flexible glass. For example, thin-film transistor (TFT) components may be attached to the flexible glass in the production of LCDs.

[0005] After processing, the flexible glass is removed from the carrier substrate. However, given the delicate nature of the flexible glass, the force applied to detach the flexible glass from the carrier substrate can damage the flexible glass. Moreover, the separation process can often damage the carrier substrate as well, rendering the carrier substrate unusable for future use. Accordingly, there is a need for practical solutions for detaching thin, flexible glass from a carrier substrate, that reduce the potential for damaging the flexible glass or carrier substrate.

SUMMARY

[0006] The following presents a simplified summary of the disclosure in order to provide a basic understanding of some example aspects described in the detailed description.

[0007] In a first aspect of the disclosure, a peeling apparatus for peeling a first substrate from a second substrate comprises a peeling member configured to rotate about a support axis. The peeling member comprises an attachment member including an arcuate surface and configured to releasably mount the first substrate with respect to the arcuate surface. The peeling apparatus further includes a translation mechanism configured to translate the support axis relative to the second substrate to move the peeling member away from the second substrate while the peeling member rotates about the support axis.

[0008] In one example the first aspect, the translation mechanism is configured to lift a weight of the peeling member to move the peeling member away from the second substrate.

[0009] In another example the first aspect, the peeling member is configured to rotate freely about the support axis while the translation mechanism translates the support axis.

[0010] In still another example the first aspect, the arcuate surface comprises a radius of curvature that varies along an outer radial profile of the arcuate surface.

[0011] In yet another example the first aspect, the attachment member comprises one or more vacuum ports.

[0012] In a further example the first aspect, the attachment member comprises a raised surface portion that extends from the arcuate surface, and the raised surface portion comprises a raised surface including a curvature that substantially matches a curvature of the arcuate surface.

[0013] In still a further example the first aspect, the attachment member further includes a sealing member that circumscribes a surface portion of the attachment member.

[0014] In yet a further example the first aspect, the peeling apparatus further comprises a support platform configured to support the second substrate. In one example, the support platform may comprise an attachment portion configured to releasably mount the second substrate to the support platform. In another example, the peeling apparatus may comprise a locking device configured to releasably lock a movement of the support platform. In still another example, the support platform may be configured to translate while the peeling member rotates about the support axis.

[0015] The first aspect may be carried out alone or with one or any combination of the examples of the first aspect discussed above.

[0016] In a second aspect of the disclosure, a method for peeling a first substrate from a second substrate comprises the step (I) of releasably mounting the first substrate with respect to an arcuate surface of a peeling member. The method further includes the step (II) of releasably mounting the second substrate relative to a support location. The method further includes the step (III) of translating a support axis of the peeling member relative to the second substrate to move the peeling member away from the second substrate, wherein the first substrate peels from the second substrate as the peeling member rotates about the support axis.

[0017] In one example the second aspect, step (III) comprises lifting a weight of the peeling member to move the peeling member away from the second substrate.

[0018] In another example the second aspect, step (I) further comprises the step of positioning the peeling member to produce a moment about the axis during step (III). In one example, the moment of step (III) drives the rotation of the peeling member about the support axis during step (III). In another example, the moment is produced by a weight of the peeling member.

[0019] In still another example the second aspect, step (II) includes releasably mounting the second substrate relative to a support platform comprising the support location, and step (III) further includes translating the support platform as the peeling member rotates about the support axis.

[0020] In yet another example the second aspect, step (II) includes releasably mounting the second substrate relative to a support platform comprising the support location, and step (III) further includes unlocking the support platform to move while the peeling member rotates about the support axis.

[0021] In a further example the second aspect, step (I) includes applying a vacuum. [0022] In still a further example the second aspect, step (I) includes aligning an edge of a vacuum sealing member with an edge of the first substrate such that an edge portion of the first substrate is releasably vacuum mounted with respect to the arcuate surface of the peeling member.

[0023] The second aspect may be carried out alone or with one or any combination of the examples of the second aspect discussed above.

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] These and other aspects are better understood when the following detailed description is read with reference to the accompanying drawings, in which:

[0025] FIG. 1 is a side view of an example peeling apparatus;

[0026] FIG. 2 is an end view of the example peeling apparatus of FIG. 1;

[0027] FIG. 3 is a side view of a peeling member of the example peeling apparatus;

[0028] FIG. 4 is a bottom view of the peeling member of FIG. 3;

[0029] FIG. 5 is a side view of the example peeling apparatus, wherein a substrate is releasably mounted to the peeling member; and

[0030] FIG. 6 is a side view of the example peeling apparatus of FIG. 5 after a support axis has been translated in a direction Dl.

DETAILED DESCRIPTION

[0031] Examples will now be described more fully hereinafter with reference to the accompanying drawings in which example embodiments are shown. Whenever possible, the same reference numerals are used throughout the drawings to refer to the same or like parts. However, aspects may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0032] Peeling apparatus of the disclosure can be useful in peeling apart two substrates bonded to each other. In particular, peeling apparatus of the disclosure can be useful in peeling apart a thin, flexible glass sheet from a carrier substrate during the production of various electronic devices. Flexible glass sheets are often used to manufacture liquid crystal displays (LCDs), electrophoretic displays (EPD), organic light emitting diode displays (OLEDs), plasma display panels (PDPs), touch sensors, photovoltaics, etc. To enable the handling of flexible glass during processing of the flexible glass, the flexible glass is typically bonded to a rigid carrier substrate using a polymer binding agent. The rigid characteristics and size of the carrier substrate allow the bonded structure to be handled in production without bending or causing damage to the flexible glass. Once it is desired to remove the flexible glass sheet from the carrier substrate, peeling apparatus of the disclosure can be useful in peeling the flexible glass sheet from the carrier substrate without damaging the glass sheet or the carrier substrate.

[0033] Turning to FIGS. 1 & 2, an example peeling apparatus 100 is shown that comprises a peeling member 103, an optional support platform 105, and a translation mechanism 107. A bonded structure 109 is further shown that comprises a first substrate 111 bonded to a second substrate 113 such that a major surface 112 of the first substrate 111 faces a major surface 114 of the second substrate 113. The first substrate 111 may be a thin, flexible glass sheet having a thickness less than about 300 μιη. Moreover, the second substrate may be a more rigid glass sheet having a thickness greater than about 400 μιη. However, the first and second substrates 111, 113 may comprise other materials or have other thicknesses without departing from the scope of the invention.

[0034] The support platform 105 is configured to support the second substrate 113 during operation of the peeling apparatus 100. Meanwhile, the peeling member 103 is configured to rotate about a support axis X and comprises an attachment member 115. The attachment member 115 has an arcuate surface 117 and is configured to releasably mount the first substrate 111 with respect to the arcuate surface 117. The translation mechanism 107 is configured to translate the support axis X relative to the second substrate 113 to move the peeling member 103 away from the second substrate 113 while the peeling member 103 rotates about the support axis X. In particular, the translation mechanism 107 may comprise support arms 119 that respectively translate along guide members 121. The translation mechanism 107 further comprises a support member 123 that supports the peeling member 103 and extends along the support axis X. The support member 123 is supported by the support arms 119. As the support arms 119 translate along the guide members 121, the support member 123 and support axis X will also translate. The peeling member 103, support platform, 105, and translation mechanism 107 are configured such that when the first substrate 111 is mounted with respect to the arcuate surface 117, lifting and rotation of the peeling member 103 will peel the first substrate 111 from the second substrate 113.

[0035] The optional support platform 105 provides a support location for mounting the second substrate. The support platform can comprise an attachment portion 127 configured to releasably mount the second substrate 113 to the support platform 105. The attachment portion 127 in the present embodiment comprises a plurality of vacuum ports 129, wherein a vacuum may be selectively supplied to the vacuum ports 129 to selectively mount the second substrate 113 to the support platform 105. However, the attachment portion 127 in other embodiments may only comprise a single vacuum port. Alternatively, the attachment portion 127 may comprise adhesive or other fastening means for releasably mounting the second substrate 113 to the support platform 105.

[0036] The support platform 105 may be configured to translate horizontally along guide members 131 while the peeling member 103 rotates about the support axis X such that the releasably mounted second substrate 113 translates with the support platform 105. Moreover, the support platform 105 can comprise a locking device 132 configured to releasably lock the movement of the support platform 105 along the guide members 131. Although not shown, in further examples, the peeling apparatus may not include a movable support platform. Rather, in some examples the second substrate may be mounted to a table or other support surface, such as the support surface underlying the peeling apparatus. For instance, the peeling apparatus may be mounted for movement relative to the support surface underlying the peeling apparatus. As such, the second substrate may be mounted at a stationary location to a support surface while the peeling apparatus moves relative to the support surface when using the peeling apparatus to peel the first substrate from the second substrate.

[0037] Turning to FIGS. 3 & 4, the arcuate surface 117 of the peeling member 103 may comprise a radius of curvature that varies along an outer peripheral profile 301 of the arcuate surface 117. For example, the radius of curvature may be a distance Rl from the support axis X at one location along the outer peripheral profile 301 while being a different distance R2 from the support axis X at another location along the outer peripheral profile 301. Preferably, the arcuate surface 117 is configured such that the radius of curvature increases from end 303 of the outer peripheral profile 301 to end 305 of the outer peripheral profile 301 such that R2 is greater than Rl. However, there may be other embodiments wherein the radius of curvature remains constant along the outer peripheral profile 301 of the arcuate surface 117.

[0038] Also shown in FIGS. 3 & 4, the attachment member 115 of the peeling member 103 can comprise a plurality of raised surface portions 307, 309, 311. Each raised surface portion 307, 309, 311 extends from the arcuate surface 117 and comprises a raised surface having a curvature that substantially matches a curvature of the arcuate surface 117. The attachment member 115 may also comprise a plurality of vacuum ports 313 that extend through the raised surface portions 307, 309. A vacuum may be selectively supplied to the vacuum ports 313 to releasably mount portions of the first substrate 111 with respect to the raised surface portions 307, 309. Additionally, the peeling member 103 can comprise sealing members 315, 317 that are mounted against the arcuate surface 117 and circumscribe the raised surface portions 307, 309. The sealing members 315, 317 are configured to engage a major surface 133 (shown in FIGS. 1 & 2) of the first substrate 111 to provide a vacuum seal between the arcuate surface 117 and the first substrate 111. Preferably, each sealing member 315, 317 is a flexible and elastic member, such as a gasket or an O-ring. Thus, when mounted against the arcuate surface 117, surfaces 319, 321 of the flexible sealing members 315, 317 will have a curvature that substantially matches a curvature of the arcuate surface 117.

[0039] FIGS. 5 & 6 illustrate one method of peeling the first substrate 111 from the second substrate 113 using the peeling apparatus 100 described above. The method includes the step of releasably mounting the second substrate 113 to a support location. For example, as shown, the method can include the step of releasably mounting the second substrate to the support platform 105 at the support location. The second substrate 113 may be releasably mounted to the support platform 105 using the vacuum ports 129 as described above or the second substrate 113 may be releasably mounted using adhesive or other fastening means. Alternatively, as discussed previously, the apparatus may be provided without a support platform. For example, the method can include the step of releasably mounting the second substrate to at a support location of a support surface underlying the peeling apparatus 100. [0040] The method further includes the step of releasably mounting the first substrate 111 with respect to the arcuate surface 117 of the peeling member 103. Referring to FIG. 5, the peeling member 103 may be positioned such that an edge 501 of the sealing member 315 is aligned with an edge 503 of the first substrate 111 and the surface 319 of the sealing member 315 engages an edge portion 505 of the first substrate 111. A vacuum may then be applied to the vacuum ports 313 in the raised surface portion 307 to releasably vacuum mount the edge portion 505 with respect to the arcuate surface 117 of the peeling member 103. When pressed against the first substrate 111, the sealing member 315 will provide a flush seal between the arcuate surface 117 and the first substrate 111.

[0041] Preferably, the peeling member 103 is positioned such that when the edge portion 505 is initially mounted with respect to the arcuate surface 117, the peeling member's center of gravity Cg is offset from a vertical plane P in which the support axis X lies. Thus, the weight F of the peeling member 103 will produce a moment M about the support axis X. Since the peeling member 103 is configured to rotate freely about the support axis X, the moment M (absent other forces and moments) would normally cause the peeling member 103 to rotate about the support axis X in the direction of the moment M. However, the vacuum applied to mount the edge portion 505 of the first substrate 111 with respect to the peeling member 103 will produce a vacuum force that will help hold the peeling member 103 stationary and prevent the peeling member 103 from rotating. As mentioned above, the support platform 105 can comprise a locking device 132 configured to releasably lock the movement of the support platform 105 along the guide members 131. When locked, the substrate assembly 109, which is fixed to the support platform 105 via the vacuum applied through the vacuum ports 129, will thus be prevented from moving. As such, the peeling member 103, which is attached to the substrate assembly 109 via the vacuum applied through the vacuum ports 313, will similarly be prevented from moving. Moreover, because the radius of curvature of the arcuate surface 117 increases from end 303 to end 305 of the outer peripheral profile 301, the peeling member 103 will further be prevented from rotating in the direction of the moment M as a greater clearance will be needed between the support axis X and the substrate assembly 109 for the larger radius portions of the peeling member 103 to pass through. Thus, unless the support axis X is translated relative to the second substrate 113 to move the peeling member 103 away from the second substrate 113 and increase the clearance between the support axis X and the substrate assembly 109, the peeling member 103 will remain stationary.

[0042] The method further includes the step of translating the support axis X of the peeling member 103 relative to the second substrate 113 to move the peeling member 103 away from the second substrate 113. As shown in FIG. 5, the translation mechanism 107 may be operated to translate the support axis X away from the second substrate 113 in a direction Dl, thus lifting the peeling member 103 away from the second substrate 113. The direction Dl is preferably vertical. However, the direction Dl may be any direction that is transverse to the surface 114 of the second substrate 113. In further examples, although not shown, the support axis X of the peeling member 103 may be translated relative to the second substrate by moving the second substrate 113 away from the peeling member, for example, while the peeling member does not translate. For instance, the illustrated second substrate 113 may move downward in a direction opposite direction Dl to provide relative translation of the support axis X.

[0043] The support arms 119 of the translation mechanism 107 may either be raised manually along the guide members 121 or the translation mechanism 107 may comprise a motor that can automatically be operated to adjust the position of the support arms 119. Since the edge portion 505 of the first substrate 111 is releasably vacuum mounted with respect to the arcuate surface 117 of the peeling member 103, the peeling member 103 will impart a lifting force at the edge portion 505 as the peeling member 103 is lifted relative to the second substrate, thus causing the edge portion 505 to peel away from the second substrate 113.

[0044] The method can further comprise the step of unlocking the locking device 132, which will allow the peeling member 103 to rotate about the support axis X as the support axis X is translated relative to the second substrate 103. When the locking device 132 is unlocked, the support platform 132 (and the substrate assembly 109 mounted thereto) can freely translate along the guide members 131. Thus, the peeling member 103 will no longer be prevented from rotating due to its attachment to the previously rigid substrate assembly 109. Rather, as the support axis X is translated relative to and away from the second substrate 103, the clearance between the support axis X and the substrate assembly 109 will increase, allowing the peeling member 103 to rotate in the direction of the moment M. As the peeling member 103 rotates, the peeling member 103 will pull the first substrate 111 to the right, which in turn will cause the second substrate 113 and the support platform 105 to translate along the guide members 131 in the direction D2.

[0045] Although the support platform 105 in the present embodiment is configured to freely translate along the guide members 131, it should be understood that the support platform 105 in other embodiments may be translated by a motor that can automatically be operated to translate the support platform 105 along the guide members 131 in response to rotation of the peeling member 103. Furthermore, there may be embodiments wherein the support platform 105 remains stationary but the second substrate 113 is not fixed relative to the support platform 105. In such embodiments, the second substrate 113 can freely slide across the support platform 105, if provided, with the first substrate 113 as the first substrate 113 is pulled to the right by the peeling member 103, thus allowing the peeling member 103 to rotate while the support platform 105 remains stationary.

[0046] As the support axis X is translated in direction Dl, the peeling member 103 will to continue to naturally rotate in response to the moment M. As the peeling member 103 rotates and is lifted relative to the second substrate 113, the edge portion 505 will continue to lift with the peeling member 103 and away from the second substrate 103, causing the first substrate 111 to further peel away from the second substrate 113. Additionally, the curvature of the arcuate surface 117 is configured such that as the peeling member 103 is lifted and rotates, the sealing member 317 of the peeling member 103 will eventually engage with the first substrate 111. A vacuum may then be applied to the vacuum ports 313 in the raised surface portion 309 to provide additional lifting force to the first substrate 111 at the portion of the first substrate 111 which engages the sealing member 317. Thus, the overall lifting force required to peel the first substrate 111 from the second substrate 113 can be spread out over portions of the first substrate 111 such that the necessary lifting force is not completely provided at the edge portion 505. Such spreading of the lifting force over portions of the first substrate 111 can prevent any one portion of the first substrate from experiencing undesired compressive stresses from high vacuum forces. [0047] Eventually, continued translation of the support axis X in the direction Dl will allow the peeling member 103 to naturally rotate in response to the moment M until its center of gravity Cg is directly below the support axis X on the plane P, as shown in FIG. 6. At this point, the peeling member 103 will cease rotating absent additional force as the moment M produced by the peeling member's weight F will be zero. The first substrate 111 may be completely peeled from the second substrate 113 at this time or the first substrate 111 may be partially peeled from the second substrate 113. If any portions of the first and second substrates 111, 113 remain attached, further translation of the support axis X in the direction Dl will lift the peeling member 103 and the releasably mounted first substrate 111 relative to the second substrate 113 and cause the first and second substrates 111, 113 to completely separate.

[0048] As can be seen in FIG. 6, peeling the first substrate 111 from the second substrate 113 using the peeling apparatus 100 and method described above produces a curvature in the first substrate 111 that substantially matches a curvature of the arcuate surface 117 of the peeling member 103. As the peeling member 103 rotates about the support axis X and is lifted relative to the second substrate 113, the surface 133 of the first substrate 111 engages with the sealing members 315, 317 and is releasably vacuum mounted at the portions of the first substrate 111 engaging the sealing members 315, 317. Additionally, further rotation and lifting of the peeling member will result in the surface 133 of the first substrate 111 engaging the raised surface portion 311. Since the surfaces of the sealing members 315, 317 and the raised surface portion 311 have a curvature that substantially matches a curvature of the arcuate surface 117 of the peeling member 103, the surface 133 of the first substrate 111 will similarly have a curvature that substantially matches a curvature of the arcuate surface 117. In order to prevent damage to the first substrate 111, the curvature produced will preferably result in the first substrate 111 being placed under a bending stress that does not exceed the yield strength of the first substrate 111.

[0049] The apparatus 100 and method of using the apparatus 100 described above can permit the first substrate 111 to be peeled from the second substrate 113 by applying a single linear force to translate the support axis X away from the second substrate 113. The peeling member 103 will naturally rotate as the support axis X is translated away from the second substrate 113. Moreover, the optional support platform 105 and the second substrate 113 will translate (e.g., horizontally) in response to the pulling motion that the peeling member 103 exerts on the first substrate 111 as the peeling member 103 naturally rotates. Thus, a smooth peeling motion may be applied to the first substrate 111 with a single linear force.

[0050] It will be apparent to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the claimed invention. For example, as discussed previously, although the translation mechanism 107 in the apparatus 100 described above is configured to lift the peeling member 103 away from the second substrate 113, the translation mechanism 107 in other embodiments may lower the second substrate 113 away from the peeling member 103 to achieve the same peeling motion. Moreover, although the peeling member 103 rotates naturally as the support axis X is translated, the rotation of the peeling member 103 in other embodiments may be controlled either manually or automatically. Furthermore, although the attachment member 115 of the peeling member 103 in the apparatus 100 described above comprises a plurality of raised portions 307, 309, 311 and sealing members 315, 317 that are configured to engage the surface 133 of the first substrate 111, the attachment member 115 may not comprise any raised portions or sealing members in other embodiments. Rather, the surface 133 of the first substrate 111 may engage directly with the arcuate surface 117 of the attachment member 115 during operation of the peeling apparatus 100. Indeed, the attachment member 115 may comprise any number of raised portions and sealing members, or none at all, without departing from the scope of the invention. These are just a few examples of variations that can be made to the apparatus and method described above. Other various modifications and variations can be made without departing from the spirit and scope of the claimed invention.

Claims

CLAIMS What is claimed is:

1. A peeling apparatus for peeling a first substrate from a second substrate comprising:

a peeling member configured to rotate about a support axis, wherein the peeling member comprises an attachment member including an arcuate surface and configured to releasably mount the first substrate with respect to the arcuate surface; and

a translation mechanism configured to translate the support axis relative to the second substrate to move the peeling member away from the second substrate while the peeling member rotates about the support axis.

2. The peeling apparatus of claim 1, wherein the translation mechanism is configured to lift a weight of the peeling member to move the peeling member away from the second substrate.

3. The peeling apparatus of claim 1, wherein the peeling member is configured to rotate freely about the support axis while the translation mechanism translates the support axis.

4. The peeling apparatus of claim 1, wherein the arcuate surface comprises a radius of curvature that varies along an outer radial profile of the arcuate surface.

5. The peeling apparatus of claim 1, wherein the attachment member comprises one or more vacuum ports.

6. The peeling apparatus of claim 1, wherein the attachment member comprises a raised surface portion that extends from the arcuate surface, and the raised surface portion comprises a raised surface including a curvature that substantially matches a curvature of the arcuate surface.

7. The peeling apparatus of claim 1, wherein the attachment member further includes a sealing member that circumscribes a surface portion of the attachment member.

8. The peeling apparatus of claim 1, further comprising a support platform configured to support the second substrate.

9. The peeling apparatus of claim 8, wherein the support platform comprises an attachment portion configured to releasably mount the second substrate to the support platform.

10. The peeling apparatus of claim 8, further comprising a locking device configured to releasably lock a movement of the support platform.

11. The peeling apparatus of claim 8, wherein the support platform is configured to translate while the peeling member rotates about the support axis.

12. A method for peeling a first substrate from a second substrate comprising the steps of:

(I) releasably mounting the first substrate with respect to an arcuate surface of a peeling member;

(II) releasably mounting the second substrate relative to a support location; and

(III) translating a support axis of the peeling member relative to the second substrate to move the peeling member away from the second substrate, wherein the first substrate peels from the second substrate as the peeling member rotates about the support axis.

13. The method of claim 12, wherein step (III) comprises lifting a weight of the peeling member to move the peeling member away from the second substrate.

14. The method of claim 12, wherein step (I) further comprises the step of positioning the peeling member to produce a moment about the axis during step (III).

15. The method of claim 14, wherein the moment of step (III) drives the rotation of the peeling member about the support axis during step (III).

16. The method of claim 14, wherein the moment is produced by a weight of the peeling member.

17. The method of claim 12, wherein step (II) includes releasably mounting the second substrate relative to a support platform comprising the support location, and step (III) further includes translating the support platform as the peeling member rotates about the support axis.

18. The method of claim 12, wherein step (II) includes releasably mounting the second substrate relative to a support platform comprising the support location, and step (III) further includes unlocking the support platform to move while the peeling member rotates about the support axis.

19. The method of claim 12, wherein step (I) includes applying a vacuum.

20. The method of claim 12, wherein step (I) includes aligning an edge of a vacuum sealing member with an edge of the first substrate such that an edge portion of the first substrate is releasably vacuum mounted with respect to the arcuate surface of the peeling member.