WO2015050344A1 - Stratifié conducteur - Google Patents

Stratifié conducteur Download PDF

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Publication number
WO2015050344A1
WO2015050344A1 PCT/KR2014/009110 KR2014009110W WO2015050344A1 WO 2015050344 A1 WO2015050344 A1 WO 2015050344A1 KR 2014009110 W KR2014009110 W KR 2014009110W WO 2015050344 A1 WO2015050344 A1 WO 2015050344A1
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Prior art keywords
acrylate
meth
conductive laminate
film
conductive
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PCT/KR2014/009110
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English (en)
Korean (ko)
Inventor
권윤경
김현철
박현규
Original Assignee
주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to EP14850358.4A priority Critical patent/EP3054458B1/fr
Priority to CN201480003904.8A priority patent/CN104885162B/zh
Priority to US14/649,474 priority patent/US20160002502A1/en
Priority to JP2015557961A priority patent/JP6272358B2/ja
Priority claimed from KR1020140130118A external-priority patent/KR101698245B1/ko
Publication of WO2015050344A1 publication Critical patent/WO2015050344A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer

Definitions

  • the present application relates to a conductive laminate, a method of manufacturing the same, and an electronic device including the same.
  • the touch panel or touch screen is applied to various information processing terminals such as mobile communication terminals or ATMs, and display devices such as TVs and monitors.
  • various information processing terminals such as mobile communication terminals or ATMs
  • display devices such as TVs and monitors.
  • the application to small portable electronic devices increases, the demand for smaller and lighter touch panels or screens increases.
  • Such a conductive laminate may include an adhesive layer.
  • the pressure-sensitive adhesive layer of the conductive laminate as described above may generate bubbles by heat under heat treatment conditions for ITO crystallization.
  • bubbles may be generated in the pressure-sensitive adhesive layer during heat treatment for crystallization of ITO, and ITO may act as a gas barrier to prevent bubbles from escaping.
  • Patent Document 1 Republic of Korea Patent Publication No. 2002-0036837
  • Patent Document 2 Republic of Korea Patent Publication No. 2001-0042939
  • the present application provides a reliable conductive laminate by suppressing the generation of bubbles generated from the pressure-sensitive adhesive layer during the crystallization heat treatment of the conductive layer.
  • the present application relates to a conductive laminate.
  • 1 is a cross-sectional view of an exemplary conductive laminate, in which a conductive layer 3, a base layer 2, and an adhesive layer 1 may be sequentially formed.
  • the conductive laminate includes a substrate layer 2; An adhesive layer (1) formed under the substrate layer (2) and comprising a crosslinkable polymer containing a monomer having a boiling point of 150 ° C. or less or 200 ° C. or more as a polymerized unit; And a conductive layer 3 formed on the base layer 2.
  • the conductive laminate according to the present application as shown in Figure 2, the conductive layer 3, the base layer 2, the pressure-sensitive adhesive layer (1), the second base layer 2 'and 2 " conductive layer 3 " may be formed in sequence. That is, the conductive laminate is formed under the first base layer 2; the first base layer 2, and has a boiling point of 150 DEG C or less.
  • a pressure-sensitive adhesive layer (1) comprising a crosslinkable polymer containing a monomer having a temperature of 200 ° C.
  • the conductive laminate according to the present application may be a double-sided conductive laminate.
  • the double-sided conductive laminate may include two or more conductive layers on both sides, and may include one or more pressure-sensitive adhesive layers and one or more base layers between the two or more conductive layers.
  • 3 is a diagram illustrating a double-sided conductive laminate according to still another example, wherein the first conductive layer 3, the first base layer 2, the first pressure sensitive adhesive layer 1, and the third base layer 2 are formed.
  • the cross section of the electroconductive laminated body which includes "), the 2nd adhesive layer 1 ', the 2nd base material layer 2', and the 2nd electroconductive layer 3 'sequentially is shown.
  • the conductive laminate of the above-described structure can efficiently suppress bubbles generated from the pressure-sensitive adhesive layer to provide a reliable conductive laminate.
  • the term "upper” or “lower” means the relative position of each layer constituting the conductive laminate, and when constituting the actual conductive laminate, it is not necessarily located above or below.
  • the conductive layer that is, the first conductive layer and / or the second conductive layer may be crystalline or amorphous.
  • the conductive laminate according to the present application may be a conductive laminate including an amorphous conductive layer before the crystallization step through heat treatment.
  • the conductive laminate may be a conductive laminate including a crystalline conductive layer after the crystallization step.
  • the division of the amorphous conductive layer or the crystalline conductive layer may be performed according to a standard for separating the crystallinity of the conductive layer.
  • the term amorphous conductive layer has an area ratio of 50% or less, or 0, when the surface is observed by FE-TEM (FIELD EMISSION TRANSMISSION ELECTRON MICROSCOPY). It means a conductive layer in the range of 30% to 30%. Therefore, the term crystalline conductive layer in the present application may mean a case where the area ratio occupied by the crystal exceeds 50%.
  • the amorphous conductive layer as described above may be applied to a product through a crystallization treatment after a processing step such as pattern processing.
  • the materials constituting the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer may be the same or different, and the description of the pressure sensitive adhesive layer described below relates to both the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer. Can be.
  • the pressure-sensitive adhesive layer constituting the conductive laminate may include a crosslinkable polymer including a monomer having a boiling point of 150 ° C. or less or 200 ° C. or more as a polymer unit.
  • the boiling point of the monomer may be 145 ° C or less, 200 ° C or more, 140 ° C or less, 205 ° C or more, 135 ° C or less, 210 ° C or more, 130 ° C or less, or 210 ° C or more.
  • the crosslinkable polymer does not include monomers having a boiling point above 150 ° C and below 200 ° C, monomers above 145 ° C and below 200 ° C, monomers above 140 ° C and below 205 ° C, monomers above 135 ° C and below 210 ° C or monomers above 130 ° C and below 210 ° C. You may not.
  • the boiling point of the monomer as the polymerized unit of the polymer constituting the pressure-sensitive adhesive layer, bubbles that may occur in the pressure-sensitive adhesive layer during the heat treatment for crystallizing the conductive layer can be suppressed.
  • the crosslinkable polymer constituting the pressure-sensitive adhesive layer according to the present application may not include a monomer having a boiling point higher than 150 ° C and lower than 200 ° C. Accordingly, the conductive laminate of the present application can solve the bubble problem that may occur from the pressure-sensitive adhesive layer.
  • the boiling point of the monomer may be 60 °C or more. If the boiling point of the monomer is lower than 60 °C may cause a problem that the monomer is volatilized during the polymerization process. In addition, the boiling point of the monomer may be 300 ° C. or less. If the boiling point is higher than 300 ° C., a problem may occur in that the degree of polymerization decreases during the polymerization process.
  • the polymer may comprise a ratio of 10 parts by weight to 60 parts by weight of monomer having a boiling point of 150 ° C. or less and 40 parts by weight to 90 parts by weight of monomer having a boiling point of 200 ° C. or more.
  • the unit "parts by weight” means a weight ratio.
  • the type of monomer is not particularly limited as long as the above-mentioned boiling range is satisfied, but in one example, the monomer having a boiling point of 150 ° C. or lower or 200 ° C. or higher may be ethyl (meth) acrylate or n-propyl (meth) acrylate.
  • the monomer may be a (meth) acrylic acid ester monomer in consideration of physical properties such as cohesion, glass transition temperature and adhesiveness, and specifically, an alkyl (meth) acrylate having an alkyl group having 1 to 14 carbon atoms may be used. It is not limited to this.
  • the monomer having a boiling point of 150 ° C. or less or 200 ° C. or more may include at least one compound including one or more reactive functional groups. That is, the compound including the reactive functional group may be included as the polymerized unit of the polymer.
  • the said compound can provide the polymer with the reactive functional group which can react with the polyfunctional crosslinking agent mentioned later.
  • a hydroxyl group containing compound, a carboxyl group containing compound, or a nitrogen containing compound is mentioned.
  • the compound including the reactive functional group may have a boiling point of 150 ° C. or less, or 200 ° C. or more.
  • the compound containing the reactive functional group is included in 1 to 20 parts by weight, 2 to 19 parts by weight, 3 to 18 parts by weight, 4 to 17 parts by weight or 5 to 16 parts by weight relative to 100 parts by weight of the crosslinkable polymer. Can be.
  • Such polymers in the present application are conventional polymerization methods in the art, for example, solution polymerization, photopolymerization, bulk polymerization, suspension polymerization or emulsion polymerization ( Emulsion polymerization) and the like, and preferably in solution polymerization.
  • the polymer may be present in a crosslinked state in the pressure-sensitive adhesive layer.
  • the crosslinkable polymer in the pressure-sensitive adhesive layer may be crosslinked by at least one multifunctional crosslinker selected from the group consisting of an isocyanate crosslinker, an epoxy crosslinker, an aziridine crosslinker, and a metal chelate crosslinker.
  • a crosslinking agent improves the cohesive force of the cured resin (adhesive layer), gives a crosslinked structure, and controls adhesive properties through reaction with the polar functional group of the acrylic polymer.
  • one or two or more crosslinking agents may be appropriately selected in consideration of the kind of reactive functional groups included in the polymer.
  • isocyanate crosslinking agent examples include tolylene diisocyanate, xylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isoborone diisocyanate, tetramethylxylene diisocyanate or naphthalene diisocyanate, and the above.
  • Addition reactants of the above isocyanate compound and a polyol may be used, and as the polyol, trimethylolpropane may be used.
  • the epoxy crosslinking agent may be ethylene glycol diglycidyl ether, triglycidyl ether, trimethylolpropane triglycidyl ether, N, N, N ', N'-tetraglycidyl ethylenediamine or glycerin diglycidyl.
  • N, N'-toluene-2,4-bis (1-aziridinecarboxamide), N, N'-diphenylmethane-4 , 4'-bis (1-aziridinecarboxamide), triethylene melamine, bisisoprotaloyl-1- (2-methylaziridine) or tri-1-aziridinylphosphine oxide and the like can be exemplified. However, it is not limited thereto.
  • examples of the metal chelate crosslinking agent include compounds in which a polyvalent metal such as aluminum, iron, zinc, tin, titanium, antimony, magnesium, and / or vanadium is coordinated with acetyl acetone or ethyl acetoacetate, and the like. It is not limited.
  • the multifunctional crosslinking agent may be included in an amount of 0.01 to 10 parts by weight, 0.1 to 9 parts by weight, or 0.2 to 8 parts by weight relative to 100 parts by weight of the polymer.
  • the polymer has a weight average molecular weight of at least 500,000, at least 550,000, at least 600,000, at least 650,000, at least 700,000, at least 800,000, at least 900,000, at least 1 million, at least 1.1 million, or at 1.2 million. It can be longer.
  • the upper limit of the weight average molecular weight is not particularly limited, but may be 2 million or less. Within this range, durability and adhesive properties of the pressure-sensitive adhesive layer can be effectively controlled.
  • the pressure-sensitive adhesive layer of the present application includes a silane coupling agent in addition to the above components; Tackifiers; Epoxy resins; Ultraviolet stabilizers; Antioxidants; Colorant; Adjuvant; Fillers; Antifoam; It may further include one or two or more additives such as surfactants or plasticizers.
  • the base layer that is, the first to third base layer is a polyethylene terephthalate (PET) film, polytetrafluoroethylene film, polyethylene film, polypropylene film, polybutene film, polybutadiene film At least one selected from the group consisting of: vinyl chloride copolymer film, polyurethane film, ethylene-vinyl acetate film, ethylene-propylene copolymer film, ethylene-ethyl acrylate copolymer film, ethylene-methyl acrylate copolymer film, and polyimide film It may include.
  • the materials constituting the first to third base layers may be the same or different.
  • the thickness of the said base material layer is not specifically limited, It can set suitably as long as it can function as an electroconductive laminated body.
  • the thickness of the substrate layer may be in the range of about 1 ⁇ m to 500 ⁇ m, about 3 ⁇ m to 300 ⁇ m, about 5 ⁇ m to 250 ⁇ m, or about 10 ⁇ m to 200 ⁇ m.
  • the substrate layer may be appropriately coated with a corona discharge treatment, an ultraviolet irradiation treatment, a plasma treatment, or a sputter etching treatment.
  • a conductive layer may be formed on one surface of the substrate layer of the conductive laminate of the present application.
  • the method of forming the conductive layer is not particularly limited, but may be formed by, for example, a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a conventional thin film forming method combining two or more of the above methods. It may be formed by a vacuum deposition method or a sputtering method.
  • the material constituting the conductive layer examples include metals such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, or alloys of two or more of the above, indium oxide, tin oxide, Titanium oxide, cadmium oxide or a metal oxide composed of a mixture of two or more thereof, copper iodide, and the like may be used, and as described above, the conductive layer may be a crystal layer or an amorphous layer.
  • indium tin oxide (ITO) may be used among the materials constituting the conductive layer, but is not limited thereto.
  • the materials constituting the first conductive layer and the second conductive layer described above may be the same or different.
  • the thickness of the conductive layer as described above may be adjusted to about 10 nm to 300 nm, about 10 nm to 200 nm, or about 10 nm to 100 nm in consideration of the possibility of forming a continuous film, conductivity, transparency, and the like.
  • the conductive laminate according to the present application may further include a known functional layer such as an undercoat layer or a hard coat layer, which may be appropriately disposed when required by a person skilled in the art.
  • a known functional layer such as an undercoat layer or a hard coat layer, which may be appropriately disposed when required by a person skilled in the art.
  • an undercoat layer may further exist between the substrate layer and the conductive layer.
  • the undercoat layer can be advantageously used for improving adhesion between the conductive layer and the base layer, for example, and improving the scratch resistance, the bending resistance and the spot property.
  • the undercoat layer may include an inorganic material, an organic material, or an organic / inorganic composite material.
  • the inorganic material for example, SiO 2 , MgF 2 or Al 2 O 3 and the like can be exemplified, and as the organic material, acrylic polymer, urethane polymer, melamine polymer, alkyd polymer or siloxane polymer can be exemplified.
  • the undercoating layer may be formed using a sol gel reactant of an admixture containing an organic silane or a thermosetting resin including an admixture of melamine resin, alkyd polymer, and an organosilane condensate as an organic material.
  • the undercoat layer may be formed by, for example, vacuum deposition, sputtering, ion plating or coating.
  • the undercoat layer may be formed to a thickness of usually 100 nm or less, 15 nm to 100 nm or 20 nm to 60 nm.
  • the conductive laminate may further include a hard coat layer existing between the pressure-sensitive adhesive layer and the base layer.
  • the hard coat layer can be formed of a conventional material, and can be formed, for example, by a hard coat treatment method for applying and curing a hard resin such as an acrylic urethane resin or a siloxane resin. In the hard coating process, non-glare which can roughen the surface by mix
  • the hard coat layer may be formed to a thickness of about 0.1 ⁇ m to about 30 ⁇ m in consideration of hardness, crack resistance, and curl prevention properties.
  • the present application also relates to a method for producing a conductive laminate.
  • the manufacturing method may include heat treating the aforementioned conductive laminate. Crystallization of the amorphous conductive layer may proceed through the heat treatment. Therefore, the said manufacturing method relates to the manufacturing method of the electroconductive laminated body containing a crystalline conductive layer.
  • the condition of the heat treatment is not particularly limited as long as the crystallization of the conductive layer can proceed.
  • the heat treatment may be performed at a temperature in the range of 100 °C to 200 °C, 120 °C to 200 °C, 145 °C to 200 °C or 150 °C to 190 °C.
  • the heat treatment may be performed for 30 minutes to 12 hours 50 minutes to 6 hours or 1 hour to 6 hours.
  • the conductive film is crystallized, and generation of carriers in the film can be promoted.
  • the scattering factors of carriers which are transitions and defects of crystal grains in the crystal film, can be reduced, and the formation of carriers can be smoothed.
  • the heat treatment temperature may mean the temperature of the object to be processed.
  • the heat treatment may proceed in an oxygen containing atmosphere.
  • the amount of oxygen in the heat treatment atmosphere may be a trace amount, or may be carried out under an oxygen atmosphere that is present after the substitution of a conventional nitrogen or argon gas.
  • the method of forming the conductive layer is not particularly limited, but for example, a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination of two or more of the above methods, It can be formed by a thin film formation method, and can be normally formed by a vacuum vapor deposition method or sputtering method.
  • the method of forming an adhesive layer can form an adhesive layer by the method of apply
  • An example electronic device may be a touch panel.
  • the touch panel may include the conductive laminate as, for example, an electrode plate for a touch panel.
  • the touch panel may be formed in a known structure including a capacitive type or a resistive film type.
  • the said electroconductive laminated body can be used for formation of various apparatuses, such as a touchscreen or a liquid crystal display.
  • the present application relates to a display device including the touch panel.
  • the structure of the display device and the like can be applied as it is.
  • the conductive laminate according to the present application can suppress generation of bubbles generated from the pressure-sensitive adhesive layer during the crystallization heat treatment of the conductive layer.
  • 1 to 3 are cross-sectional views of conductive laminates according to one example of the present application.
  • the pressure-sensitive adhesive composition was prepared by uniformly mixing 0.25 parts by weight of xylene diisocyanate (Takenate D110N, Mitsui Chemical Co., Ltd.) as a crosslinking agent with respect to 100 parts by weight of the polymer.
  • the weight average molecular weight of the polymer was 1.4 million.
  • the other surface of the PET film (thickness: about 25 ⁇ m) formed with an ITO layer on one side It adhered to an adhesive layer and formed the double-sided conductive laminated body.
  • 2-ethylhexyl acrylate (2-EHA), methyl acrylate (MA) and 2-hydroxyethyl acrylate (2-HEA) were weight ratios of 60:30:10 (2-EHA: MA: 2-HEA).
  • An electrically conductive laminate was prepared in the same manner as in Example 1, except that was added thereto. The weight average molecular weight of the polymer was 1.6 million.
  • 2-ethylhexyl instead of adding 2-ethylhexyl acrylate (2-EHA), methyl acrylate (MA) and 2-hydroxyethyl acrylate (2-HEA) in a weight ratio of 50:40:10.
  • Acrylate (2-EHA), methyl acrylate (MA), isobornyl acrylate (IBOA) and 2-hydroxyethyl acrylate (2-HEA) were added at a weight ratio of 35: 35: 20: 10.
  • the weight average molecular weight of the polymer was 1.3 million.
  • methyl acrylate (MA) and 2-hydroxyethyl acrylate (2-HEA) in a weight ratio of 50:40:10, butyl acrylate ( A conductive laminate was prepared in the same manner as in Example 1, except that BA), methyl acrylate (MA) and acrylic acid (AA) were added at a weight ratio of 72.5: 20: 7.25, and 0.02 part by weight of a crosslinking agent was added. Prepared. The weight average molecular weight of the polymer was 1.84 million.
  • methyl acrylate (MA) and 2-hydroxyethyl acrylate (2-HEA) instead of 2-ethylhexyl acrylate (2-EHA), methyl acrylate (MA) and 2-hydroxyethyl acrylate (2-HEA) in a weight ratio of 50:40:10, butyl acrylate ( Except that BA), methyl acrylate (MA), methoxy ethyl acrylate (MEA) and 2-hydroxyethyl acrylate (2-HEA) were added in a weight ratio of 35: 15: 40: 10, A conductive laminate was prepared in the same manner as in Example 1. The weight average molecular weight of the polymer was 1.2 million.
  • the weight average molecular weight (Mw) was measured under the following conditions using GPC, and the measurement results were converted using standard polystyrene of Agilent system for the production of calibration curves.
  • the conductive laminates prepared according to Examples and Comparative Examples were heat-treated at 150 ° C. for 1 hour in an oxygen-containing atmosphere, and then visually confirmed whether bubbles were generated.
  • Example 1 Example 2
  • Example 3 Example 4 Comparative Example 1 Whether or not heat treated late cloth occurs (150 °C, 60 minutes) Not Occurred Not Occurred Not Occurred Small amount Large quantities

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne un stratifié conducteur et son procédé de fabrication, et un dispositif électronique comprenant le stratifié conducteur. L'invention concerne un stratifié conducteur qui permet de supprimer la génération de bulles à générer à partir d'une couche adhésive pendant le traitement thermique de cristallisation d'une couche conductrice.
PCT/KR2014/009110 2013-10-01 2014-09-29 Stratifié conducteur WO2015050344A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP14850358.4A EP3054458B1 (fr) 2013-10-01 2014-09-29 Stratifié conducteur
CN201480003904.8A CN104885162B (zh) 2013-10-01 2014-09-29 导电层压板
US14/649,474 US20160002502A1 (en) 2013-10-01 2014-09-29 Conductive laminate
JP2015557961A JP6272358B2 (ja) 2013-10-01 2014-09-29 導電性積層体

Applications Claiming Priority (4)

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KR20130117079 2013-10-01
KR10-2013-0117079 2013-10-01
KR10-2014-0130118 2014-09-29
KR1020140130118A KR101698245B1 (ko) 2013-10-01 2014-09-29 도전성 적층체

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WO2015050344A1 true WO2015050344A1 (fr) 2015-04-09

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021142026A1 (fr) 2020-01-07 2021-07-15 Revolution Medicines, Inc. Dosage d'inhibiteurs de shp2 et méthodes de traitement du cancer

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KR20020036837A (ko) 2000-05-21 2002-05-16 사토 히로시 투명 도전 적층체 및 그 제조 방법
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WO2013094542A1 (fr) * 2011-12-19 2013-06-27 日東電工株式会社 Film support pour films conducteurs transparents et stratifié
JP2013129201A (ja) * 2013-01-25 2013-07-04 Nitto Denko Corp 導電性積層フィルム、タッチパネル用電極板、タッチパネルおよび導電性積層フィルム用粘着剤

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KR20020036837A (ko) 2000-05-21 2002-05-16 사토 히로시 투명 도전 적층체 및 그 제조 방법
KR20070084424A (ko) * 2005-10-31 2007-08-24 닛토덴코 가부시키가이샤 도전성 적층 필름, 터치패널용 전극판, 터치패널 및 도전성적층 필름용 점착제
JP2012079257A (ja) * 2010-10-06 2012-04-19 Dic Corp 両面粘着シートを用いた透明導電膜積層体およびタッチパネル装置
KR20130062880A (ko) * 2011-12-05 2013-06-13 닛토덴코 가부시키가이샤 투명 도전성 필름용 점착제층, 점착제층 부착 투명 도전성 필름, 투명 도전성 적층체, 및 터치 패널
WO2013094542A1 (fr) * 2011-12-19 2013-06-27 日東電工株式会社 Film support pour films conducteurs transparents et stratifié
JP2013129201A (ja) * 2013-01-25 2013-07-04 Nitto Denko Corp 導電性積層フィルム、タッチパネル用電極板、タッチパネルおよび導電性積層フィルム用粘着剤

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See also references of EP3054458A4

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021142026A1 (fr) 2020-01-07 2021-07-15 Revolution Medicines, Inc. Dosage d'inhibiteurs de shp2 et méthodes de traitement du cancer

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