WO2015048621A1 - Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof - Google Patents

Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof Download PDF

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Publication number
WO2015048621A1
WO2015048621A1 PCT/US2014/058000 US2014058000W WO2015048621A1 WO 2015048621 A1 WO2015048621 A1 WO 2015048621A1 US 2014058000 W US2014058000 W US 2014058000W WO 2015048621 A1 WO2015048621 A1 WO 2015048621A1
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WIPO (PCT)
Prior art keywords
composition
die attach
conductive
nadimide
maleimide
Prior art date
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Ceased
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PCT/US2014/058000
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English (en)
French (fr)
Inventor
Pukun Zhu
Gina V. HOANG
Shashi K. Gupta
Andrew LAIB
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel IP and Holding GmbH
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Henkel IP and Holding GmbH
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Filing date
Publication date
Application filed by Henkel IP and Holding GmbH filed Critical Henkel IP and Holding GmbH
Priority to CN201480042671.2A priority Critical patent/CN105473657B/zh
Priority to EP14847431.5A priority patent/EP3052566B1/en
Priority to JP2016545261A priority patent/JP6378346B2/ja
Priority to KR1020167007600A priority patent/KR101909353B1/ko
Publication of WO2015048621A1 publication Critical patent/WO2015048621A1/en
Priority to US15/010,531 priority patent/US9449938B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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Definitions

  • the present invention relates to conductive die attach films and formulations useful for the preparation of such films.
  • the invention relates to methods for making such formulations.
  • the invention relates to conductive networks prepared from compositions according to the present invention, and methods for making same.
  • the invention relates to articles comprising invention conductive die attach films adhered to a suitable substrate therefor, and methods for making same.
  • conductive die attach films having advantageous properties for use in large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations.
  • conductive networks prepared from compositions according to the present invention.
  • the invention relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor.
  • compositions comprising:
  • a first maleimide, nadimide or itaconimide wherein said first maleimide, nadimide or itaconimide has an aromatic backbone, and the degree of substitution of imide moieties on the backbone of said first maleimide, nadimide or itaconimide is at least 0.5 imide moieties per repeat unit of said backbone , a second maleimide, nadimide or itaconimide, wherein said second maleimide, nadimide or itaconimide has a flexible aliphatic or aliphatic/aromatic backbone, wherein the backbone of said second maleimide, nadimide or itaconimide includes straight or branched chain hydrocarbyl segments, wherein each hydrocarbyl segment has at least 20 carbons,
  • first epoxy resin wherein said first epoxy resin is rubber or elastomer-modified
  • second epoxy resin wherein said second epoxy resin has a flexible aliphatic or aliphatic/aromatic backbone, wherein the backbone of said second epoxy resin includes straight or branched chain hydrocarbyl segments, wherein each hydrocarbyl segment has at least 20 carbons, backbone,
  • composition when cured, has a modulus less than about lGPa when tested by dynamic mechanical analysis (DMA) at 260°C.
  • DMA dynamic mechanical analysis
  • the degree of substitution of imide moieties on the backbone of the first maleimide, nadimide or itaconimide is at least 0.8 imide moieties per repeat unit of said backbone; in certain embodiments, the degree of substitution on the backbone of the first maleimide, nadimide or itaconamide is at least 1 imide moiety per repeat unit of said backbone.
  • the first maleimide, nadimide or itaconimide contemplated for use in the practice of the present invention has the structure:
  • n 1-15
  • p 0-15
  • each R 2 is independently selected from hydrogen or lower alkyl
  • J is a monovalent or a polyvalent radical selected from:
  • aromatic hydrocarbyl or substituted aromatic hydrocarbyl species having in the range of about 6 up to about 300 carbon atoms, where the aromatic hydrocarbyl species is selected from aryl, alkylaryl, arylalkyl, aryalkenyl, alkenylaryl, arylalkynyl or alkynylaryl;
  • aromatic hydrocarbylene species are selected from arylene, alkylarylene, arylalkylene, arylalkenylene, alkenylarylene, arylalkynylene or alkynylarylene,
  • heterocyclic or substituted heterocyclic species having in the range of about 6 up to about 300 carbon atoms
  • linker selected from a covalent bond, -O- , -S-, -NR-, -NR-C(O)-, -NR-C(0)-0-, -NR-C(0)-NR-, -S-C(O)-, -S-C(0)-0-, -S-C(O)- NR-, -0-S(0) 2 -, -0-S(0) 2 -O, -0-S(0) 2 -NR-, -O-S(O)-, -0-S(0)-0-, -0-S(0)-NR-, -O-NR-C(O)-, -0-NR-C(0)-0-, -0-NR-C(0)-NR-, -NR-O-C(O)-, -NR-0-C(0)-0-, -NR-C(0)-NR-, -NR-O-C(O)-, -NR-0-C(0)-0-, -NR-0-C(0)-NR-, -NR-O-C(O)-,
  • J of the above-described maleimide, nadimide or itaconimide is heterocyclic, oxyheterocyclic, thioheterocyclic, aminoheterocyclic, carboxyheterocyclic, oxyaryl, thioaryl, aminoaryl, carboxyaryl, heteroaryl, oxyheteroaryl, thioheteroaryl, aminoheteroaryl, carboxyheteroaryl, oxyalkylaryl, thioalkylaryl, aminoalkylaryl, carboxyalkylaryl, oxyarylalkyl, thioarylalkyl, aminoarylalkyl, carboxyarylalkyl, oxyarylalkenyl, thioarylalkenyl, aminoarylalkenyl, carboxyarylalkenyl, oxyalkenylaryl, thioalkenylaryl, aminoalkenylaryl,
  • oxyheteroatom-containing di- or polyvalent cyclic moiety t oheteroatom-containing di- or polyvalent cyclic moiety, ammoheteiOatom-containing di- or polyvalent cyclic moiety, or a carboxyheteroatom-containing di- or polyvalent cyclic moiety.
  • first maleimide nadimide, or itaconamide contemplated for use herein include:
  • the backbone of the second maleimide, nadimide or itaconimide contemplated for use herein contains straight or branched chain hydrocarbyl segments, wherein each hydrocarbyl segment has at least 30 carbons, thereby enhancing the flexibility thereof.
  • the second maleimide, nadimide or itaconimide contemplated for use herein has the structure:
  • n 1-15
  • p 0-15
  • each R 2 is independently selected from hydrogen or lower alkyl
  • J is a monovalent or a polyvalent radical selected from:
  • non-aromatic hydrocarbyl or substituted non-aromatic hydrocarbyl species having in the range of about 20 up to about 500 carbon atoms, where the non- aromatic hydrocarbyl species is selected from alkyl, alkenyl, alkynyl, cycloalkyl, or cycloalkenyl;
  • non-aromatic hydrocarbylene or substituted non-aromatic hydrocarbylene species having in the range of about 20 up to about 500 carbon atoms, where the non-aromatic hydrocarbylene species are selected from alkylene, alkenylene, alkynylene, cycloalkylene, or cycloalkenylene,
  • heterocyclic or substituted heterocyclic species having in the range of about 20 up to about 500 carbon atoms
  • linker selected from a covalent bond, -O- , -S-, -NR-, -NR-C(O)-, -NR-C(0)-0-, -NR-C(0)-NR-, -S-C(O)-, -S-C(0)-0-, -S-C(O)- NR-, -0-S(0) 2 -, -0-S(0) 2 -0-, -0-S(0) 2 -NR-, -O-S(O)-, -0-S(0)-NR-, -O-NR-C(O)-, -0-NR-C(0)-0-, -0-NR-C(0)-NR-, -NR-O-C(O)-, -NR-0-C(0)-0-, -0-NR-C(0)-NR-, -NR-O-C(O)-, -NR-0-C(0)-0-, - R-0-C(0)-NR-, -O-NR-C(S)-, -0-NR-C(
  • J of the above-described maleimide, nadimide or itaconimide is oxyalkyl, thioalkyl, aminoalkyl, carboxylalkyl, oxyalkenyl, thioalkenyl, aminoalkenyl, carboxyalkenyl, oxyalkynyl, thioalkynyl, aminoalkynyl, carboxyalkynyl, pxycycloalkyl, thiocycloalkyl, aminocycloalkyl, carboxycycloalkyl, oxycloalkenyl, thiocycloalkenyl, aminocycloalkenyl, carboxycycloalkenyl, heterocyclic, oxyheterocyclic, thioheterocyclic, aminoheterocyclic, carboxyheterocyclic, oxyalkylene, thioalkylene, aminoalkylene, carboxyalkylene, oxyalkenylene,
  • carboxycycloalkenylene heteroatom-containing di- or polyvalent cyclic moiety, oxyheteroatom-containing di- or polyvalent cyclic moiety, thioheteroatom-containing di- or polyvalent cyclic moiety, aminoheteroatom-containing di- or polyvalent cyclic moiety, or a carboxyheteroatom-containing di- or polyvalent cyclic moiety.
  • Examples of second maleimide, nadimide, itaconamide contemplated for use herein include:
  • the first epoxy resin contemplated for use herein is an epoxidized carboxyl-terminated butadiene-acrylonitrile (CTBN) oligomer or polymer.
  • CBN carboxyl-terminated butadiene-acrylonitrile
  • the epoxidized CTBN oligomer or polymer is an epoxy- containing derivative of an oligomeric or polymeric precursor having the structure:
  • each Bu is a butylene moiety (e.g., 1 ,2-butadienyl or 1,4-butadienyl), each ACN is an acrylonitrile moiety,
  • epoxidized CTBN oligomers or polymers can be made in a variety of ways, e.g., from (1) a carboxyl teiminated butadiene/acrylonitrile copolymer, (2) an epoxy resin and (3) bisphenol A:
  • Examples of the first epoxy resin include epoxidized CTBN oligomers or polymers made from (1) a carboxyl terminated butadiene/acrylonitrile copolymer, (2) an epoxy resin and (3) bisphenol A as described above; HyproTM Epoxy-Functional Butadiene-Aciylonitrile Polymers (formerly Hycar® ETBN), and the like.
  • Rubber or elastomer-modified epoxies include epoxidized derivatives of:
  • conjugated diene butyl elastomers such as copolymers consisting of from 85 to 99.5% by weight of a C 4 -C 5 olefin combined with about 0.5 to about 15% by weight of a conjugated multi-olefin having 4 to 14 carbon atoms, copolymers of isobutylene and isoprene where a major portion of the isoprene units combined therein have conjugated diene unsaturation (see, for example, U.S. Pat. No.
  • the second epoxy resin is an epoxidized polybutadiene diglycidylether oligomer or polymer.
  • epoxidized polybutadiene diglycidylether oligomers contemplated for use herein have the structure:
  • R 1 and R 2 are each independently H or lower alkyl
  • R 3 is H, saturated or unsaturated hydrocarbyl, or epoxy
  • At least 1 epoxy-containing repeating unit set forth above, and at least one olefinic repeating unit set forth above are present in each oligomer, and, when present, in the range of 1-10 of each repeating unit is present, and
  • n falls in the range of 2 - 150.
  • epoxidized polybutadiene diglycidylether oligomer or polymer contemplated for use in the practice of the present invention has the structure:
  • R is H, OH, lower alkyl, epoxy, oxirane-substituted lower alkyl, aryl, alkaryl, and the like.
  • Examples of the second epoxy resin contemplated for use herein i.e., epoxy having a flexible backbone
  • examples of the second epoxy resin contemplated for use herein include:
  • additional epoxy materials may be included in invention formulations.
  • epoxy- functionalized resins are contemplated for use herein, e.g., epoxy resins based on bisphenol A (e.g., Epon Resin 834), epoxy resins based on bisphenol F (e.g., RSL-1739), multifunctional epoxy resins based on phenol-novolac resin, dicyclopentadiene-type epoxy resins (e.g., Epiclon HP-7200L), naphthalene-type epoxy resins, and the like, as well as mixtures of any two or more thereof.
  • bisphenol A e.g., Epon Resin 834
  • epoxy resins based on bisphenol F e.g., RSL-1739
  • multifunctional epoxy resins based on phenol-novolac resin e.g., dicyclopentadiene-type epoxy resins (e.g., Epiclon HP-7200L), naphthalene-type epoxy resins, and the like, as well as mixtures
  • Exemplary epoxy-functionalized resins contemplated for use herein include the diepoxide of the cycloaliphatic alcohol, hydrogenated bisphenol A (commercially available as Epalloy 5000), a difunctional cycloaliphatic glycidyl ester of
  • Conductive fillers contemplated for use in the practice of the present invention include silver, nickel, cobalt, copper, gold, palladium, platinum, carbon black, carbon fiber, graphite, carbon nanotubes, aluminum, indium tin oxide, silver-coated copper, silver-coated aluminum, silver-coated graphite, nickel-coated graphite, bismuth, tin, bismuth-tin alloy, metal-coated glass spheressilver-coated fiber, silver-coated spheres, antimony doped tin oxide, carbon nanotubes, conductive nanofiUers, alloys of such metals, and the like, as well as mixtures of any two or more thereof.
  • Curing agents contemplated for use in the practice of the present invention include ureas, aliphatic and aromatic amines, polyamides, imidazoles, dicyandiamides,
  • Exemplary free radical initiators include peroxy esters, peroxy carbonates, hydroperoxides, alkylperoxides, arylperoxides, azo compounds, and the like.
  • Non-reactive diluents when present, include aromatic hydrocarbons (e.g., benzene, toluene, xylene, and the like), saturated hydrocarbons (e.g., hexane, cyclohexane, heptane, tetradecane), chlorinated hydrocarbons (e.g., methylene chloride, chloroform, carbon tetrachloride, dichloroethane, trichloroethylene, and the like), ethers (e.g., diethyl ether, tetrahydrofuran, dioxane, glycol ethers, monoalkyl or dialkyl ethers of ethylene glycol, and the like), esters (e.g., ethyl acetate, butyl acetate, methoxy propyl acetate, and the like); dibasic esters, alpha-terpineol, beta-terpineol,
  • the amount of non-reactive diluent contemplated for use in accordance with the present invention can vary widely, so long as a sufficient quantity is employed to dissolve and/or disperse the components of invention compositions.
  • the amount of non-reactive diluent employed typically falls in the range of about 2 up to about 25 weight percent of the composition. In certain embodiments, the amount of non-reactive diluent falls in the range of about 5 up to 20 weight percent of the total composition. In some embodiments, the amount of non-reactive diluent falls in the range of about 10 up to about 18 weight percent of the total composition.
  • invention compositions contain substantially no diluent therein. Even if diluent is, at one time, present, it is typically removed once manipulation of invention compositions (e.g., by coating as a film on a suitable substrate) has been completed.
  • compositions according to the present invention further comprise up to about 4 wt % acrylic polymer.
  • Acrylates contemplated for use in the practice of the present invention are well known in the art. See, for example, US Pat. No. 5,717,034, the entire contents of which are hereby incorporated by reference herein.
  • acrylic polymers have a molecular weight in the range of about 100,000 up to about 1,000,000 and a Tg in the range of about -40°C up to about 20°C.
  • acrylic polymers contemplated for optional use herein have a molecular weight in the range of about 200,000 up to about 900,000 and a Tg in the range of about -40°C up to about 20°C.
  • compositions according to the present invention further comprise up to about 4 wt % polyurethane, polysiloxane, or the like.
  • polyurethane refers to polymers composed of a chain of organic units joined by carbamate (also known as “urethane") linkers.
  • Polyurethane polymers can be formed by reacting an isocyanate with a polyol. Both the isocyanates and polyols used to make polyurethanes typically contain on average two or more functional groups per molecule.
  • compositions according to the present invention optionally further comprise one or more flow additives, adhesion promoters, conductivity additives, rheology modifiers, or the like, as well as mixtures of any two or more thereof.
  • flow additives refers to silicon polymers, ethyl acrylate/2- ethylhexyl acrylate copolymers, alkylol ammonium salt of phosphoric acid esters of ketoxime, and the like, as well as combinations of any two or more thereof.
  • compositions comprise: at least 1 wt % of said first maleimide, nadimide or itaconimide, at least 1 wt % of said second maleimide, nadimide or itaconimide, at least 2 wt % of said first epoxy resin (i.e., said rubber or elastomer- modified epoxy),
  • said second epoxy resin i.e., said epoxy resin having a flexible aliphatic or aliphatic/aromatic backbone
  • the amount of each component of invention compositions falls in the range of about:
  • said first epoxy resin i.e., said rubber or elastomer-modified epoxy
  • said second epoxy resin i.e., said epoxy resin having a
  • the amount of each component of invention compositions falls in the range of about:
  • said first epoxy resin i.e., said rubber or elastomer-modified epoxy
  • said second epoxy resin i.e., said epoxy resin having a flexible aliphatic or aliphatic/aromatic backbone
  • invention compositions provide a number of useful performance properties. For example, when applied at a thickness of 0.2mm on a suitable 10x10mm copper substrate pad and cured at 200°C for 60 minutes, invention compositions undergo less than 58 micron warpage.
  • inventions described herein comprise subjecting the contemplated combination of components to high shear mixing for a time sufficient to obtain a substantially homogeneous blend.
  • compositions as described herein are applied to a suitable substrate (e.g., a release liner), then b-staged at elevated temperature to remove substantially all of the solvent therefrom.
  • a suitable substrate e.g., a release liner
  • conductive die attach films comprising the reaction product obtained upon removing substantially all of the solvent/diluent from the above-described b-staged compositions.
  • Exemplary conductive die attach films contemplated herein include films produced when said composition is cured at a temperature in the range of about 160 - 230°C for a time in the range of about 30 minutes - 2 hours.
  • conductive die attach films include those produced when compositions according to the present invention are cured at a temperature in the range of about 175-200°C for about 1 hour.
  • Conductive die attach films according to the present invention after cure, typically absorb less than about 1.2 % by weight moisture when exposed to 85°C at 85% relative humidity in a Dynamic Vapor Sorption Analyzer. In some embodiments, conductive die attach films according to the present invention, upon cure, absorb less than about 0.7% by weight moisture when exposed to 85°C at 85% relative humidity in a Dynamic Vapor Sorption Analyzer.
  • Conductive die attach films according to the present invention upon cure, typically have a Tg (as determined by thermomechanical analysis; TMA) of less than about 40°C; in some embodiments, the Tg as determined by TMA is less than about 20°C.
  • TMA thermomechanical analysis
  • TMA Thermomechanical analysis
  • conductive die attach films according to the present invention upon cure, typically have a Tan Delta Tg (as determined by dynamic mechanical analysis; DMA) of less than about 100°C; in some embodiments, the Tan Delta Tg is less than about 80°C.
  • Dynamic mechanical analysis is a technique used to determine the viscoelasticity of polymers. See an exemplary protocol therefor in Example 1 herein.
  • Conductive die attach films according to the present invention can also be characterized, upon cure, with reference to the tensile modulus thereof; in some embodiments, the tensile modulus of invention films (at 260°C) is less than IGPa; in some embodiments, the tensile modulus (at 260°C) is less than 500 Mpa.
  • Conductive die attach films according to the present invention, upon cure, can also be characterized with reference to the hot die shear thereof; in some embodiments, the hot die shear of said cured film at 260°C is at least 0.5 kg/mm 2 ; in some embodiments, the hot die shear of said film is at least 0.8 kg/mm 2 .
  • Conductive die attach films according to the present invention upon cure, can also be characterized with reference to the hot, wet die shear thereof at 260°C after exposure to 85°C at 85% relative humidity for about 3 days; in some embodiments, the hot, wet die shear of said film after exposure to such conditions is at least 0.5 kg/mm 2 ; in some embodiments, the hot, wet die shear of said film after exposure to such conditions is at least 0.65 kg/mm 2 .
  • methods for preparing conductive die attach films comprising curing the above-described compositions after application thereof to a suitable substrate, after optional b-staging thereof.
  • b-staging is carried out prior to curing of the above-described compositions.
  • Suitable substrates contemplated for use herein include lead-frame(s), laminate substrate(s) designed for semiconductor packages (e.g., BT substrate, FR4 substrate, and the like), polyethylene terephthalate, polymethyl methacrylate, polyethylene,
  • polypropylene polycarbonate, an epoxy resin, polyimide, polyamide, polyester, glass, and the like.
  • lead-frame(s) comprise a base plate consisting of copper or copper alloys, and a protective coating formed on the upper (or both) surface(s) of the base plate.
  • the protective coating is composed of at least one metal selected from the group consisting of gold, gold alloy, silver, silver alloy, palladium or palladium alloy, and has a thickness of about 10-500 angstrom.
  • the protective coating is formed by suitable means, e.g., by vapor deposition. It is possible to form an intermediate coating of nickel or nickel alloys between the surface of the base plate and the protective coating, by means of vapor deposition or wet plating. A suitable thickness for the intermediate coating is within the range of about 50-20,000 angstrom. See, for example, U.S. Pat. No. 5,510,197, the entire contents of which are hereby incorporated by reference herein.
  • articles comprising conductive die attach films as described herein adhered to a suitable substrate therefor.
  • Articles according to the present invention can be characterized in terms of the adhesion of the cured conductive die attach film to the substrate; typically the adhesion is at least about 0.5 kg/mm 2 at 260°C; in some embodiments, the adhesion is at least about 0.8 kg/mm 2 at 260°C.
  • Articles according to the present invention can also be characterized in terms of the Tg of the cured conductive die attach film, with a Tg (as determined by thermomechanical analysis; TMA) typically being less than about 40°C; in some embodiments, the Tg is less than about 20°C.
  • Tg as determined by thermomechanical analysis
  • Articles according to the present invention can alternatively be characterized with reference to the Tan Delta Tg of the cured conductive die attach film; typically, the conductive die attach film of invention articles has a Tan Delta Tg (as determined by dynamic mechanical analysis; DMA) of less than about 100°C; in some embodiments, the Tg is less than about 80°C.
  • DMA dynamic mechanical analysis
  • Articles according to the present invention can be further characterized with reference to the tensile modulus of said cured conductive die attach film at 260°C;
  • the tensile modulus is less than about lGPa; in some embodiments, the tensile modulus is less than about 500 MPa.
  • invention articles can vary over a wide range.
  • a particular advantage of invention formulations is their suitability for preparation of large dies.
  • Exemplary articles typically have a surface area of at least 6 mm 2 , and can be 2.5x2.5 mm, or 3x3 mm, or 4x4 mm, or 5x5 mm, or 6x6 mm, or 7x7mm, or 8x8 mm, or 9x9 mm, or 10x10 mm, or the like.
  • methods for preparing a conductive network comprising: applying a composition as described herein to a suitable substrate in a
  • Comparison formulations and formulations according to the invention were prepared by combining the components set forth in Table 1, as follows.
  • Solid resins were pre-dissolved in suitable solvent as follows. The required amounts of the organic components were weighed into a container, hand mixed for about 5 minutes, then sufficient solvent was added to fill 5-25 % of the container. Pre-mixing continued for about 5-10 minutes with a high speed mixer. The required amount of fillier was then added to the container, and the contents thereof subjected to high speed mixing (about 1000-3000 rpm) for about one hour. The resulting slurry was de-gassed by subjecting same to reduced pressure for about 1-10 minutes.
  • Conductive films were prepared by pouring the slurry onto a clean, prepared surface using a coating machine. The slurry was subsequently heated in a retort oven to produce a stable coating film that is well bonded to the substrate (the release liner). A cover liner is than applied onto the film to protect the surface thereof. In some circumstances, it may be desirable to laminate the film under heat and pressure to promote the formation of substantially even film coatings.
  • thermomechanical analysis (TMA) on a Perkin-Elmer Instrument with an expansion fixture with an applied force of 20mN.
  • TMA thermomechanical analysis
  • Tg glass transition temperature
  • CTE1 coefficient of thermal expansion 1
  • CTE2 coeffecient of thermal expansion 2
  • DMA analysis of tensile modulus was performed on film samples employing a TA Instruments, TA-Q800 using a flat edge tension film fixture on the TA -Q800. Sample dimensions were approximately (24 x 8 x 0.2 mm). Samples were cured by subjecting them to a 30-45min ramp from room temperature to 200°C, then soaked for about lhr at 200°C.
  • DMA was carried out at a ramp rate of 5.0°C/min starting at -70°C up to 300°C.
  • the frequency was 10 Hz and 5 microns was applied for strain amplitude. Results are presented in Table 2. Table 2
  • MSL moisture sensitivity levels
  • MSL1 85°C and 85% relative humidity for 168 hours;
  • MSL2 85°C and 60% relative humidity for 168 hours
  • MSL3 30°C and 60% relative humidity for 192 hours. The results are summarized below:
  • invention formulations e.g., Formulation C
  • e.g., Formulation C perform very well when subjected to multiple temperature cycles, providing far better adhesion than comparative formulations lacking one or more of the components required by invention formulations.
  • Patents and publications mentioned in the specification are indicative of the levels of those skilled in the art to which the invention pertains. These patents and publications are incorporated herein by reference to the same extent as if each individual application or publication was specifically and individually incorporated herein by reference.

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CN201480042671.2A CN105473657B (zh) 2013-09-30 2014-09-29 用于大型晶片半导体包装的导电晶片粘接膜和用于制备导电晶片粘接膜的组合物
EP14847431.5A EP3052566B1 (en) 2013-09-30 2014-09-29 Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof
JP2016545261A JP6378346B2 (ja) 2013-09-30 2014-09-29 大型ダイ半導体パッケージのための導電性ダイアタッチフィルムおよびその調製に有用な組成物
KR1020167007600A KR101909353B1 (ko) 2013-09-30 2014-09-29 대형 다이 반도체 패키지를 위한 전도성 다이 부착 필름 및 그의 제조를 위해 유용한 조성물
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CN105473657A (zh) 2016-04-06
US9449938B2 (en) 2016-09-20

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