WO2015037916A1 - Procédé de détermination de la validité d'une matrice de compensation au cours de l'inspection de substrats - Google Patents

Procédé de détermination de la validité d'une matrice de compensation au cours de l'inspection de substrats Download PDF

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Publication number
WO2015037916A1
WO2015037916A1 PCT/KR2014/008470 KR2014008470W WO2015037916A1 WO 2015037916 A1 WO2015037916 A1 WO 2015037916A1 KR 2014008470 W KR2014008470 W KR 2014008470W WO 2015037916 A1 WO2015037916 A1 WO 2015037916A1
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WO
WIPO (PCT)
Prior art keywords
validity
compensation matrix
coordinates
substrate
fov
Prior art date
Application number
PCT/KR2014/008470
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English (en)
Korean (ko)
Inventor
유희욱
최종진
정승원
Original Assignee
주식회사 고영테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 고영테크놀러지 filed Critical 주식회사 고영테크놀러지
Priority to CN201480050252.3A priority Critical patent/CN105557081B/zh
Publication of WO2015037916A1 publication Critical patent/WO2015037916A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]

Definitions

  • the present invention relates to a method for determining the validity of a compensation matrix when inspecting a substrate. More specifically, the area of a second polygon including a coordinate of the outermost pads on the FOV and the coordinates of the outermost feature objects on the FOV is described. It relates to a method of determining the validity of the compensation matrix for compensating the position of the pad using.
  • At least one printed circuit board is provided in an electronic device, and various circuit elements such as a circuit pattern, a connection pad part, and a driving chip electrically connected to the connection pad part are provided on the printed circuit board. Are mounted.
  • a shape measuring device is used to confirm that the various circuit elements as described above are properly formed or disposed on the printed circuit board.
  • a conventional shape measuring apparatus sets a predetermined measuring area and checks whether a predetermined circuit element is properly formed in the measuring area.
  • the measurement area must be set correctly at the desired location to measure the circuit elements that require measurement.However, the measurement object such as a printed circuit board may be distorted such as warp or distortion of the base substrate. This must be compensated because it can happen.
  • a compensation matrix may be generated by using a feature object such as a curved pattern or a hole pattern on the PCB to compensate for the pad position. In this case, whether the compensation matrix is valid may be a problem.
  • the present invention provides a method of determining the validity of the compensation matrix during the inspection of the substrate that can determine the validity of the compensation matrix generated by using the coordinates of the feature objects on the FOV to compensate the position of the pad on the FOV
  • the purpose is to provide.
  • a method of determining the validity of a compensation matrix when inspecting a substrate comprising: obtaining coordinates of outermost pads in a measurement area (FOV) on a substrate; Obtaining coordinates of outer feature objects; overlapping of the first polygon with a second polygon that connects coordinates of the outermost feature objects with respect to the first area of the first polygon that connects the coordinates of the outermost pads; Calculating a ratio of a second area, and validity of a compensation matrix generated by using coordinate values of feature objects in the FOV to compensate the coordinates of the pad in the FOV based on whether the ratio is equal to or greater than a preset reference value. Determining the step.
  • Coordinates of the outermost pads may be center coordinates of the outermost pads, and coordinates of the outermost feature objects may be central coordinates of the outermost feature objects.
  • the feature object may be at least one of a corner portion of a hole pattern, a circle pattern, or a curved pattern on the substrate.
  • the ratio may be determined as (the overlapping area of the first polygon and the second polygon) / the first area X 100.
  • the preset reference value may be 50.
  • the method may further comprise determining that the compensation matrix is valid when the ratio is greater than or equal to a preset reference value.
  • the method may further include determining that the compensation matrix is invalid.
  • each step is performed for each of the plurality of partitions, and the determining of the validity is performed by using a coordinate of a feature object in the partition.
  • the validity of can be determined.
  • the plurality of partitions may be one of a plurality of panels or a plurality of components included in the FOV.
  • the substrate may be FPCB (FLEXIBLE PRINTED CIRCUIT BOARD).
  • the reliability of the inspection of the substrate may be improved by determining the effectiveness of the compensation matrix generated by using the coordinates of the feature objects on the FOV.
  • FIG. 1 is a block diagram of a substrate inspection apparatus for determining the validity of a compensation matrix during substrate inspection according to an embodiment of the present invention.
  • FIG. 2 is a flowchart illustrating a method of determining the validity of a compensation matrix when inspecting a substrate according to an exemplary embodiment of the present invention.
  • FIG. 3 is an exemplary view illustrating a measurement area for explaining a method of determining validity of a compensation matrix during a substrate inspection according to an exemplary embodiment of the present invention.
  • FIG. 4 is a diagram illustrating a state where a plurality of panels are arranged on the FOV when the substrate is an FPCB.
  • FIG. 5 is a diagram illustrating a state in which a plurality of components are mounted in the same panel on the FOV when the substrate is an FPCB.
  • FIG. 1 is a configuration diagram of a substrate inspection apparatus for determining the validity of a compensation matrix during a substrate inspection according to an embodiment of the present invention
  • Figure 2 is a method of determining the effectiveness of the compensation matrix during a substrate inspection according to an embodiment of the present invention
  • 3 is an exemplary view illustrating a measurement area for explaining a method for determining validity of a compensation matrix during a substrate inspection according to an exemplary embodiment of the present invention.
  • the substrate inspection apparatus 100 controls the operation of the substrate inspection apparatus 100 and transfers and mounts a control unit 110 for processing an operation for performing various functions, and a substrate to be inspected.
  • a memory unit storing a stage unit 120 to fix the measurement unit 130 for performing inspection on the substrate mounted on the stage unit 120 and a program and data for driving the substrate inspection apparatus 100 ( 140, a display unit 150 for outputting an operation state of the substrate inspection apparatus 100, an inspection result, and the like, and a user interface unit 160 for receiving a user's command.
  • the measurement area FOV is set on the substrate in order to set the inspection area.
  • the measurement area FOV refers to a predetermined area set on the substrate in order to inspect whether the substrate is defective.
  • the measurement area FOV is a photographing range of a camera (not shown) included in the measurement unit 130. Field of view).
  • reference data for the measurement area FOV is obtained.
  • the reference data may for example be a theoretical planar image of the substrate.
  • the reference data may be obtained from CAD information or gerber information that records the shape of the substrate.
  • the CAD information or Gerber information includes design reference information of the substrate, and generally includes layout information regarding pads, circuit patterns, hole patterns, and the like.
  • the reference data may be obtained from learning information obtained by the learning mode.
  • the board 140 is searched for the board information in the memory unit 140, and if there is no board information, the bare board learning is performed. Subsequently, the bare board learning is completed, such as pads and wiring information of the bare board.
  • the substrate information may be implemented in a manner such as storing the substrate information in the database. That is, the design reference information of the printed circuit board is obtained by learning a bare board of the printed circuit board in the learning mode, and the reference data may be obtained by obtaining the learning information through the learning mode.
  • the measurement data may be an image of actually photographing the substrate corresponding to the reference data with the substrate inspection apparatus 100.
  • the measurement data is similar to the reference data, but may be somewhat distorted compared to the reference data due to warpage or distortion of the substrate.
  • a compensation matrix may be generated using the coordinates of the feature objects of the measurement area FOV, and the position of the pad on the measurement area FOV may be compensated using the coordinate matrix.
  • the feature may be at least one of a corner portion of a hole pattern, a circle pattern, or a curved pattern on the substrate.
  • the compensation matrix is a result for the position compensation of the specific pads. Is reliable, but the result is not reliable for position compensation for other pads. Therefore, a judgment on the validity of the compensation matrix is required.
  • the outermost pads and outermost feature objects in the FOV 200 refer to pads and feature objects that are closest to the FOV 200.
  • the first polygon P1 is formed by connecting the coordinates 210 of the outermost pads
  • the second polygon P2 is formed by connecting the coordinates 220 of the outermost feature objects.
  • the ratio of the overlapping second area S2 of the first polygon S1 and the second polygon S2 to the first area S1 of the first polygon P1 is calculated (S120). ).
  • the validity of the compensation matrix is determined by comparing the ratio with a preset reference value (S130). More specifically, the validity of the compensation matrix generated using the coordinate values of the feature objects in the FOV 200 to compensate for the coordinates of the pad in the FOV 200 based on whether the ratio is equal to or greater than a preset reference value. To judge.
  • the ratio may be used as an index of uniformity indicating that the feature objects in the FOV 200 are uniformly distributed in the pad.
  • the larger the ratio the higher the uniformity, which means that the effectiveness of the compensation matrix is higher.
  • Coordinates of the outermost pads may be center coordinates of the outermost pads, and coordinates of the outermost feature objects may be central coordinates of the outermost feature objects.
  • the coordinate of the corner point may be set as the coordinate of the feature object.
  • the ratio may be specifically defined by Equation 1 below.
  • the preset reference value may be set to a reference value capable of guaranteeing the validity of the compensation matrix through a plurality of tests, which may be set in various cases.
  • the preset reference value may be 50, which is merely an example and is not limited thereto.
  • step S130 may include determining that the compensation matrix is valid when the ratio is equal to or greater than a preset reference value, and determining that the compensation matrix is not valid when the ratio is less than the preset reference value. can do.
  • the compensation matrix is determined that the compensation matrix is valid and the compensation matrix is applied. If the ratio is less than the preset reference value, the compensation matrix is determined to be invalid and the current compensation matrix is not applied.
  • the compensation matrix may be generated using the feature objects of the FOV and the neighboring FOV, and the validity of the compensation matrix may be determined by the above-described method.
  • the reliability at the time of board inspection can be improved.
  • the substrate is an FPCB
  • the reliability of the compensation matrix is lowered for each of the divided regions.
  • FIG. 4 is a diagram illustrating a state where a plurality of panels are arranged on the FOV when the substrate is an FPCB.
  • 5 is a diagram illustrating a state in which a plurality of components are mounted in the same panel on the FOV when the substrate is an FPCB.
  • the first panel 410 when different panels, that is, the first panel 410 and the second panel 420, are positioned in the FOV 400, the first panel 410 may be bent due to bending of the FPCB. ) And the second panel 420 may be different from each other. Therefore, in applying the method for determining the validity of the compensation matrix when inspecting the substrate according to the embodiment of the present invention described above, a compensation matrix is generated for each of the first panel 410 and the second panel 420, After determining the validity of the compensation matrix for each of the first panel 410 and the second panel 420, the compensation matrix determined to be valid is applied to the first panel 410 and the second panel 420, respectively. Can be applied individually.
  • a method of determining a compensation matrix validity when inspecting a substrate according to an exemplary embodiment of the present invention may be applied by dividing an area.
  • the compensation matrix determined to be valid may be individually applied to each component region.
  • the partition area As an example of the partition area, the panel and the component are exemplified, but this is only one example, and the partition area may be set in various ways within the FOV.
  • the reliability of the compensation matrix can be further improved when the substrate is an FPCB.

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  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)

Abstract

La présente invention concerne un procédé permettant de déterminer la validité d'une matrice de compensation au cours d'une inspection de substrats. Le procédé comprend les étapes suivantes : calcul des coordonnées des plages de connexion situées les plus à l'extérieur à l'intérieur d'une zone de mesure (FOV) sur un substrat ; calcul des coordonnées des objets de particularité situés les plus à l'extérieur dans le FOV sur le substrat ; calcul du rapport d'une seconde zone, chevauchant un deuxième polygone reliant un premier polygone et les coordonnées des objets de particularité situés les plus à l'extérieur, à une première zone du premier polygone, reliant les coordonnées des plages de connexion situées les plus à l'extérieur ; et détermination de la validité d'une matrice de compensation par comparaison du rapport et d'une valeur de référence prédéfinie. Il est possible d'améliorer la fiabilité des résultats de l'inspection de substrats par détermination de la validité d'une matrice de compensation, en utilisant ledit procédé.
PCT/KR2014/008470 2013-09-12 2014-09-11 Procédé de détermination de la validité d'une matrice de compensation au cours de l'inspection de substrats WO2015037916A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201480050252.3A CN105557081B (zh) 2013-09-12 2014-09-11 判断检查基板时的补偿矩阵的有效性的方法

Applications Claiming Priority (2)

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KR20130109906A KR101444258B1 (ko) 2013-09-12 2013-09-12 기판 검사 시의 보상 매트릭스의 유효성 판단 방법
KR10-2013-0109906 2013-09-12

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WO2015037916A1 true WO2015037916A1 (fr) 2015-03-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109804730A (zh) * 2016-10-04 2019-05-24 株式会社高永科技 基板检查装置及利用其的基板歪曲补偿方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006078206A (ja) * 2004-09-07 2006-03-23 I-Pulse Co Ltd 実装基板の検査方法及び検査装置
KR20100108877A (ko) * 2009-03-30 2010-10-08 주식회사 고영테크놀러지 검사영역의 설정방법
KR20120055322A (ko) * 2010-11-23 2012-05-31 주식회사 고영테크놀러지 검사방법
KR20120069646A (ko) * 2012-06-05 2012-06-28 주식회사 고영테크놀러지 검사방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101231597B1 (ko) * 2010-11-15 2013-02-08 주식회사 고영테크놀러지 검사방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006078206A (ja) * 2004-09-07 2006-03-23 I-Pulse Co Ltd 実装基板の検査方法及び検査装置
KR20100108877A (ko) * 2009-03-30 2010-10-08 주식회사 고영테크놀러지 검사영역의 설정방법
KR20120055322A (ko) * 2010-11-23 2012-05-31 주식회사 고영테크놀러지 검사방법
KR20120069646A (ko) * 2012-06-05 2012-06-28 주식회사 고영테크놀러지 검사방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109804730A (zh) * 2016-10-04 2019-05-24 株式会社高永科技 基板检查装置及利用其的基板歪曲补偿方法
EP3525566A4 (fr) * 2016-10-04 2019-10-23 Koh Young Technology Inc. Dispositif d'inspection de substrat et procédé de compensation de distorsion de substrat l'utilisant
US10791661B2 (en) 2016-10-04 2020-09-29 Koh Young Technology Inc. Board inspecting apparatus and method of compensating board distortion using the same

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CN105557081A (zh) 2016-05-04
KR101444258B1 (ko) 2014-10-30
CN105557081B (zh) 2018-10-09

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