WO2015068971A1 - Procédé de compensation de champ de vision durant une inspection de substrat - Google Patents

Procédé de compensation de champ de vision durant une inspection de substrat Download PDF

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Publication number
WO2015068971A1
WO2015068971A1 PCT/KR2014/009934 KR2014009934W WO2015068971A1 WO 2015068971 A1 WO2015068971 A1 WO 2015068971A1 KR 2014009934 W KR2014009934 W KR 2014009934W WO 2015068971 A1 WO2015068971 A1 WO 2015068971A1
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Prior art keywords
measurement area
area
coordinates
polygon
measurement
Prior art date
Application number
PCT/KR2014/009934
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English (en)
Korean (ko)
Inventor
김자근
최종진
정승원
Original Assignee
주식회사 고영테크놀러지
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Priority to CN201480054313.3A priority Critical patent/CN105593636B/zh
Publication of WO2015068971A1 publication Critical patent/WO2015068971A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/80—Geometric correction
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30168—Image quality inspection

Definitions

  • the present invention relates to a measurement area compensation method when inspecting a substrate. More specifically, when the validity of a compensation matrix generated by the information in the current measurement area is unreliable, information in the measurement area adjacent to the current measurement area is used. To generate a compensation matrix for the current measurement area.
  • the present invention also relates to a method of compensating the pad coordinates according to the bending or distortion of a substrate by subdividing the measurement area of the flexible printed circuit board into a plurality of areas to generate a compensation matrix.
  • At least one printed circuit board is provided in an electronic device, and various circuit elements such as a circuit pattern, a connection pad part, and a driving chip electrically connected to the connection pad part are provided on the printed circuit board. Are mounted.
  • a shape measuring device is used to confirm that the various circuit elements as described above are properly formed or disposed on the printed circuit board.
  • the conventional shape measuring apparatus sets a predetermined measurement area (Field of View, FOV) to check whether a predetermined circuit element is properly formed in the measurement area.
  • FOV Field of View
  • the measurement area must be set correctly at the desired location to measure the circuit elements that require measurement.However, the measurement object such as a printed circuit board may be distorted such as warp or distortion of the base substrate. This must be compensated because it can happen.
  • a compensation matrix may be generated using a feature object such as a curved pattern or a hole pattern on the PCB to compensate for the pad position in the measurement area.
  • a feature object such as a curved pattern or a hole pattern on the PCB
  • a flexible printed circuit is a circuit board formed a complex circuit on a flexible insulating film.
  • Flexible circuit boards are substrates that use heat-resistant plastic films such as polyester (PET) or polyimide (PI), which are flexible materials. And three-dimensional wiring and the like are possible. Therefore, it is used in video cameras, car stereos, head parts of computers and printers, displays, portable devices, and touch input means.
  • PET polyester
  • PI polyimide
  • the flexible printed circuit board is manufactured in a state in which a plurality of panels printed circuits that perform functions according to the intended use are arranged in units of units, and then the panels for each unit are cut to produce each product.
  • the flexible printed circuit board is required to print a complex circuit of a small area panel as a plurality of panels are manufactured as one substrate, thereby increasing the degree of integration and increasing the defective rate.
  • the present invention uses the information in the measurement area adjacent to the current measurement area when the validity of the compensation matrix generated by the information in the current measurement area (FOV) is unreliable.
  • An object of the present invention is to provide a measurement area compensation method for inspecting a substrate to enable generation of a compensation matrix for?.
  • a measuring area compensating method for inspecting a substrate comprising: determining a validity of a first measuring area on a substrate; Determining effective measurement areas among adjacent measurement areas within a preset radius about an area, extracting feature objects within the preset radius around the first measurement area within the effective measurement areas, Generating a compensation matrix for the first measurement area by using the extracted feature objects.
  • the determining of the validity of the first measurement area may include obtaining coordinates of the outermost pads in the first measurement area, obtaining coordinates of the outermost feature objects in the first measurement area, and calculating the outermost pad. Calculating a ratio of an overlapping second area of the second polygon that connects the coordinates of the first polygon and the outermost feature objects to a first area of the first polygon that connects the coordinates of the two polygons, and the ratio
  • the method may include determining whether the predetermined reference value is greater than or equal to.
  • the determining of the effective measurement areas may include obtaining coordinates of the outermost pads in the respective measurement areas for each of the adjacent measurement areas, and obtaining coordinates of the outermost feature objects in each measurement area. Calculating a ratio of an overlapping second area of the first polygon to the coordinates of the outermost pads and the overlapping second area of the second polygon to connect the coordinates of the outermost feature objects; And determining whether the ratio is equal to or greater than a preset reference value.
  • the ratio may be determined as (the overlapping area of the first polygon and the second polygon) / the first area X 100.
  • Coordinates of the outermost pads may be center coordinates of the outermost pads, and coordinates of the outermost feature objects may be central coordinates of the outermost feature objects.
  • the effective measurement areas may be determined based on whether the number of feature objects included in each of the effective measurement areas is greater than or equal to a preset value.
  • the center of the first measurement area may be the center of the polygon generated by connecting the coordinates of the outermost pad in the first measurement area.
  • the feature object may be at least one of a corner portion of a hole pattern, a circle pattern, or a curved pattern in the first measurement area.
  • the method may further comprise predicting the validity of the compensation matrix prior to generating the compensation matrix.
  • the estimating the validity of the compensation matrix may include obtaining coordinates of the outermost pads in the first measurement area, and within the preset radius of the first measurement area within the effective measurement areas (FOV). Obtaining coordinates of the outermost feature objects from among feature objects of the first object and the coordinates of the first polygon and the outermost feature objects with respect to the first area of the first polygon connecting the coordinates of the outermost pads; The method may include calculating a ratio of the overlapping second areas of the second polygon, and determining whether the ratio is equal to or greater than a preset reference value.
  • FOV effective measurement areas
  • a method for compensating a measurement area when inspecting a substrate including: extracting a feature object on a measurement area (FOV) of a substrate, and at least three feature objects adjacent to the extracted feature object; Setting a plurality of effective regions using a polygon formed by selecting coordinates of the generated coordinates, generating a compensation matrix for each of the effective regions using coordinates of feature objects of the polygons corresponding to the plurality of effective regions, and Compensating the coordinates of the pad by selecting a compensation matrix matched for each pad.
  • FOV measurement area
  • the effective area may be set within an effective distance based on the center of gravity coordinates of the polygon corresponding to the effective area.
  • the compensation matrix for which the pad is located and the minimum distance from the pad to the center of gravity of the polygon may be selected as the compensation matrix for the pad.
  • the effective distance may be determined as an average distance of distances between coordinates of a feature object forming the polygon with respect to the center of gravity coordinates.
  • the polygon may be a triangle.
  • the feature object may be at least one of a corner portion of a hole pattern, a circle pattern, or a curved pattern in the first measurement area.
  • the compensation matrix may be one of an affine transformation matrix, a projective transformation matrix, and a scaling and rotation transformation matrix.
  • the measurement area compensation method of inspecting a substrate when the validity of a compensation matrix to be generated using the information on the feature objects in the current measurement area is unreliable, the information on the feature objects in the neighboring measurement areas is determined.
  • the information on the feature objects in the neighboring measurement areas is determined.
  • the reliability of the inspection of the substrate may be improved by minimizing the influence of distortion such as bending or warping of the substrate when compensating for the measurement area in the flexible printed circuit board.
  • FIG. 1 is a block diagram of a substrate inspection apparatus for performing a measurement area compensation method when inspecting a substrate according to an exemplary embodiment of the present invention.
  • FIG. 2 is a flowchart illustrating a measurement area compensation method when inspecting a substrate according to an exemplary embodiment of the present invention.
  • FIG 3 is an exemplary diagram of a substrate to which a measurement area compensation method is applied when inspecting a substrate according to an exemplary embodiment of the present invention.
  • FIG. 4 is a flowchart illustrating a method of determining the validity of a first measurement area in a measurement area compensation method when inspecting a substrate according to an exemplary embodiment of the present invention.
  • FIG 5 is an exemplary view of a first measurement area for explaining a method of determining the validity of the first measurement area.
  • FIG. 6 is a flowchart of a method of determining the validity of a compensation matrix generated by using information of a feature object in an effective measurement area.
  • FIG. 7 is a flowchart illustrating a measuring area compensation method when inspecting a substrate according to another exemplary embodiment of the present invention.
  • FIG. 8 is an exemplary view illustrating a substrate for explaining a method of compensating a measurement area when inspecting a substrate according to another exemplary embodiment of the present disclosure.
  • substrate inspection apparatus 110 control unit
  • pad 220 feature object
  • S1 first area
  • S2 second area
  • FIG. 1 is a block diagram of a substrate inspection apparatus for performing a measurement area compensation method during a substrate inspection according to an exemplary embodiment of the present invention.
  • the substrate inspection apparatus 100 controls the operation of the substrate inspection apparatus 100 and transfers and mounts a control unit 110 to process operations for performing various functions, and a substrate to be inspected.
  • a memory unit for storing a program unit and a data for driving the stage unit 120 to be fixed to the stage unit 120, the measurement unit 130 for performing inspection on the substrate mounted on the stage unit 120, and the substrate inspection apparatus 100.
  • 140 a display unit 150 for outputting an operation state of the substrate inspection apparatus 100, an inspection result, and the like, and a user interface unit 160 for receiving a user's command.
  • a measurement area is set on a substrate in order to set an inspection area for performing a substrate test.
  • the measurement area refers to a predetermined area set on the substrate in order to inspect whether the substrate is defective, and a plurality of measurement areas may exist on the substrate.
  • the measurement area may be set based on a field of view (FOV) of a camera (not shown) included in the measurement unit 130.
  • FOV field of view
  • reference data for the measurement area is obtained.
  • the reference data may for example be a theoretical planar image of the substrate.
  • the reference data may be obtained from CAD information or gerber information that records the shape of the substrate.
  • the CAD information or Gerber information includes design reference information of the substrate, and generally includes layout information regarding pads, circuit patterns, hole patterns, and the like.
  • the reference data may be obtained from learning information obtained by the learning mode.
  • the board 140 is searched for the board information in the memory unit 140, and if there is no board information, the bare board learning is performed. Subsequently, the bare board learning is completed, such as pads and wiring information of the bare board.
  • the substrate information may be implemented in a manner such as storing the substrate information in the database. That is, the design reference information of the printed circuit board is obtained by learning a bare board of the printed circuit board in the learning mode, and the reference data may be obtained by obtaining the learning information through the learning mode.
  • a compensation matrix may be generated using the coordinates of the feature objects of the measurement area, and the position of the pad on the measurement area may be compensated using the compensation matrix.
  • the feature may be at least one of a corner portion of a hole pattern, a circle pattern, or a curved pattern on the substrate.
  • FIG. 2 is a flowchart of a measurement area compensation method when inspecting a substrate according to an embodiment of the present invention
  • FIG. 3 is an exemplary view of a measurement area to which the measurement area compensation method is applied when inspecting a substrate according to an embodiment of the present invention. to be.
  • FIG. 4 is a flowchart illustrating a method of determining the validity of a first measurement area in a method for compensating for a measurement area when inspecting a substrate according to an exemplary embodiment of the present invention
  • FIG. 5 illustrates a method of determining the effectiveness of a first measurement area. It is an illustration of a first measurement area for.
  • Coordinates of the outermost pads 210 may be center coordinates of each of the outermost pads, and coordinates of the outermost feature objects may be respective center coordinates of the outermost feature objects 210.
  • a first polygon P1 connecting the coordinates of the outermost pads 210 and a second polygon P2 connecting the coordinates of the outermost feature objects 220 may be set.
  • a ratio of the area S2 at which the first polygon P1 and the second polygon P2 overlap with the area S1 of P1 is calculated (S220).
  • the ratio may be used as an index of uniformity indicating that the feature object in the first measurement area is uniformly distributed around the pad.
  • the larger the ratio the higher the uniformity, which means that the effectiveness of the compensation matrix is higher.
  • the ratio may be defined as in Equation 1 below.
  • the preset reference value may be set to a reference value capable of guaranteeing the validity of the compensation matrix through a plurality of tests, which may be set in various cases.
  • the center of the first measurement area may be the center of the polygon generated by connecting the coordinates of the outermost pad in the first measurement area.
  • adjacent measurement areas F8, F9, F13, F15, F18, F19, and F20 within a predetermined radius around the first measurement area F14 are first selected as candidate measurement areas. Can be.
  • the method of determining the effective measurement area among the selected candidate measurement areas may be applied to the same method as the method of determining the validity of the first measurement area described above for each of the candidate measurement areas.
  • the effective measurement area may be selected only when the number of feature objects included in each of the candidate measurement areas is equal to or greater than a preset value.
  • the two methods may be applied separately or both.
  • the validity of the compensation matrix to be generated is predicted using the extracted feature objects (S130).
  • the method of predicting validity is similar to the method of determining validity of the first measurement region described above.
  • FIG. 6 is a flowchart of a method of determining a validity of a compensation matrix generated by using information of a feature object in an effective measurement area in a measurement area compensation method when inspecting a substrate according to an embodiment of the present invention.
  • coordinates of the outermost pads in the first measurement area are obtained (S300).
  • the coordinates of the outermost feature objects are obtained from the feature objects within the preset radius with respect to the first measurement area in the effective measurement areas.
  • a first polygon connecting the coordinates of the outermost pads and a second polygon connecting the coordinates of the outermost feature objects are set.
  • a ratio of a second area representing an area where the first polygon and the second polygon overlap with a first area of the area of the first polygon is calculated (S320). .
  • the type of compensation matrix generated according to the ratio may be determined.
  • the type of compensation matrix may be one of an affine transformation matrix, a projective transformation matrix, and a scaling and rotation transformation matrix.
  • an affine transformation matrix is generated as a compensation matrix when the ratio is 80 or more, an affine transformation matrix is generated when the ratio is 60 or more and less than 80, and a size and rotation transformation matrix is generated when the ratio is 40 or more and less than 60.
  • a compensation matrix when the ratio is 80 or more
  • an affine transformation matrix is generated when the ratio is 60 or more and less than 80
  • a size and rotation transformation matrix is generated when the ratio is 40 or more and less than 60.
  • the range of the ratio for determining the type of the compensation matrix is only an example and can be set within various ranges.
  • the distortion of the warp or distortion of the substrate is large due to the characteristics of the flexible material.
  • the degree of warpage or distortion may differ for each region even within the measurement region, the reliability of the substrate inspection cannot be ensured when the substrate inspection is performed by performing the compensation in the measurement region unit.
  • the feature object 310 is extracted from the measurement area FOV of the substrate 300 (S400).
  • the feature object 310 may be at least one of a corner portion of a hole pattern, a circle pattern, or a curved pattern in the measurement area.
  • a plurality of effective areas are set using a polygon formed by selecting at least three or more adjacent feature objects among the extracted feature objects (S410).
  • a plurality of feature objects exist on the measurement area, and when at least three feature objects adjacent to each other are selected, a polygon may be formed.
  • a plurality of triangles 320 may be formed by selecting three adjacent feature objects on the measurement area.
  • the FOV may be divided into a plurality of regions by using the plurality of triangles formed as described above.
  • the effective area 320 may be set within an effective distance centering on the center of gravity coordinates of the polygon corresponding to the effective area 320. As a result, the effective area 320 may be circular. It may be displayed in the shape.
  • the effective distance may be determined as an average distance of distances between coordinates of a feature object forming the polygon with respect to the center of gravity coordinates.
  • the effective distance may be set to various sizes.
  • a compensation matrix is generated for each of the effective areas by using the coordinates of the feature object of the polygon corresponding to each of the plurality of effective areas (S420).
  • the compensation matrix may be one of the affine transformation matrix, the projective transformation matrix, and the scaling and rotation transformation matrix.
  • the compensation matrix matched for each pad 340 is selected to compensate for the coordinates of the pad (S430).
  • the compensation matrix matched for each pad may be selected as the compensation matrix having the minimum pad position and a distance from the pad to the center of gravity of the polygon among the compensation matrices for each effective area.
  • a compensation matrix having a minimum distance to the center of gravity of the polygon is selected as a compensation matrix for the pad 340 to compensate for the coordinates of the pad. It can improve the reliability.
  • a compensation matrix can be generated to compensate the pad coordinates according to the bending or distortion of the substrate for each subdivided area, thereby significantly improving the reliability of the inspection of the flexible printed circuit board.
  • a region is divided by using a feature object on the measurement area, and a compensation matrix is generated for each divided area, and the method is applied to each pad.
  • the area is divided using a pad, and each divided area is used. It is also possible to generate a compensation matrix and apply it to each feature object.
  • the measuring area compensation method when inspecting a substrate according to an exemplary embodiment of the present invention described above may be implemented in a program command form that can be executed by various computer means and recorded in a computer readable medium.
  • the computer-readable medium may include a program command, a data file, a data structure, etc. alone or in combination.
  • Program instructions recorded on the media may be those specially designed and constructed for the purposes of the present invention, or they may be of the kind well-known and available to those having skill in the computer software arts.
  • Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tape, optical media such as CD-ROMs, DVDs, and magnetic disks, such as floppy disks.
  • Magneto-optical media and hardware devices specifically configured to store and execute program instructions, such as ROM, RAM, flash memory, and the like.
  • program instructions include not only machine code generated by a compiler, but also high-level language code that can be executed by a computer using an interpreter or the like.

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Abstract

La présente invention concerne un procédé de compensation de champ d'observation durant une inspection de substrat. Le procédé comprend : une étape de détermination de validité d'un premier champ de vision sur un substrat ; une étape de décision de champs de vision (FOV) valides parmi des champs de vision adjacents dans un rayon prédéterminé autour du premier champ de vision (FOV) si le premier champ de vision (FOV) n'est pas valide ; une étape d'extraction d'objets caractéristiques dans le rayon prédéterminé autour du premier champ de vision dans les champs de vision (FOV) valides ; et une étape de génération d'une matrice de compensation pour le premier champ de vision à l'aide d'informations des objets caractéristiques extraits. Selon le procédé, il est possible d'améliorer la fiabilité d'un résultat d'inspection durant une inspection de substrat même si la matrice de compensation générée à l'aide d'informations d'objets caractéristiques dans un premier champ de vision n'est pas valide.
PCT/KR2014/009934 2013-11-06 2014-10-22 Procédé de compensation de champ de vision durant une inspection de substrat WO2015068971A1 (fr)

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KR101893831B1 (ko) * 2016-10-20 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판 검사방법
CN108007410B (zh) * 2017-11-20 2019-12-10 京东方科技集团股份有限公司 显示基板检测设备的机差补偿方法及装置、检测设备
JP2019168315A (ja) * 2018-03-23 2019-10-03 三菱電機株式会社 測定装置、回路基板、表示装置、および測定方法

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KR101510143B1 (ko) 2015-04-08
CN108805821B (zh) 2022-02-01
CN105593636B (zh) 2019-10-01
CN108805821A (zh) 2018-11-13
CN105593636A (zh) 2016-05-18

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