WO2015147502A1 - Appareil d'impression de soudure, appareil d'inspection de soudure, et procédé de correction d'informations de plot de système d'appareil d'inspection de soudure - Google Patents

Appareil d'impression de soudure, appareil d'inspection de soudure, et procédé de correction d'informations de plot de système d'appareil d'inspection de soudure Download PDF

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Publication number
WO2015147502A1
WO2015147502A1 PCT/KR2015/002813 KR2015002813W WO2015147502A1 WO 2015147502 A1 WO2015147502 A1 WO 2015147502A1 KR 2015002813 W KR2015002813 W KR 2015002813W WO 2015147502 A1 WO2015147502 A1 WO 2015147502A1
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WO
WIPO (PCT)
Prior art keywords
information
pad
stencil mask
solder
pad information
Prior art date
Application number
PCT/KR2015/002813
Other languages
English (en)
Korean (ko)
Inventor
이창호
김정엽
Original Assignee
주식회사 고영테크놀러지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 고영테크놀러지 filed Critical 주식회사 고영테크놀러지
Priority claimed from KR1020150039802A external-priority patent/KR20150110410A/ko
Publication of WO2015147502A1 publication Critical patent/WO2015147502A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering

Definitions

  • the present invention relates to a method for calibrating pad information of a solder print device, a solder test device and a solder test device system.
  • the pad information correction method of the system is a method for calibrating pad information of a solder print device, a solder test device and a solder test device system.
  • PCB printed circuit board
  • various circuit elements such as a circuit pattern, a connection pad part, and a driving chip electrically connected to the connection pad part are provided on the printed circuit board. Are fitted.
  • the printed circuit board is manufactured by applying solder to a pad region of a bare substrate and then joining terminals of the electronic component to a solder-coated region.
  • a stencil mask is usually used, and the stencil mask is manufactured based on gerber data.
  • the stencil mask may be formed differently from the actual pad due to various factors such as manufacturing error and defective stencil mask, and in this case, caustic defect may be caused in the solder inspection process for checking whether the solder is properly applied after solder application. have.
  • an object of the present invention is to provide a solder print apparatus and a solder inspection apparatus capable of reducing inspection error in a solder inspection process.
  • Another problem to be solved by the present invention is to provide a method for correcting pad information of a solder inspection apparatus system that can reduce inspection errors in a solder inspection process.
  • Another problem to be solved by the present invention is to provide a method for correcting the pad information of the solder inspection apparatus that can reduce the inspection error and improve the convenience in the solder inspection process.
  • the solder print apparatus may include an image processor configured to generate a stencil mask image by capturing a stencil mask corresponding to a pad of a substrate, and output pad information extracted from the stencil mask image. And an image information transmitter.
  • the solder print apparatus may further include a data receiver configured to receive first pad information about the substrate, wherein the first pad information includes each pad for pads existing on the substrate.
  • the pad ID information may be included to be identified separately.
  • the image information transmitter may divide the image information of the stencil mask for each pad according to the pad ID and transmit the divided image information to the solder inspection apparatus.
  • the solder test apparatus includes a comparison determiner and a data changer.
  • the comparison determiner determines whether the first pad information is different from the second pad information by comparing first pad information extracted from gerber data of a substrate and second pad information extracted from a stencil mask image.
  • the data changer changes the first pad information to the second pad information when the comparison determiner determines that the first pad information and the second pad information are different.
  • the first pad information may include pad ID information so that the pads existing on the substrate can be identified for each pad.
  • the first pad information may further include at least one of location information, volume information, area information, and shape information for each pad with respect to the pads existing on the substrate.
  • the solder inspection apparatus may further include a display configured to display the first pad information and the second pad information according to the pad ID information.
  • the solder test apparatus may further include a data transmitter configured to transfer the first pad information to a solder print apparatus.
  • the pad information correcting method of the solder inspection apparatus system includes providing first pad information about a substrate to a solder printing apparatus, and imaging a stencil mask for solder to be printed on the substrate. Generating a stencil mask image, comparing the first pad information with the second pad information extracted from the generated stencil mask image, and comparing the first pad information with the second pad information. If different, changing the first pad information to the second pad information.
  • the pad information correction method of the solder inspection apparatus when the stencil mask is inserted into the solder inspection apparatus, imaging the stencil mask to generate a stencil mask image, Gerber data for the substrate Comparing the first pad information extracted from the first pad information and the second pad information extracted from the generated stencil mask image with each other; and when the first pad information and the second pad information are different by the comparison, the first pad information. Changing information to the second pad information.
  • the substrate inspection method of the solder inspection apparatus when the stencil mask is inserted into the solder inspection apparatus, imaging the stencil mask to generate a stencil mask image, the generated stencil mask image Generating a job program based on and inspecting the substrate based on the job program.
  • the generating of the work program based on the stencil mask image may include obtaining position information of an opening corresponding to the solder to be printed from the generated stencil mask image and according to position information of the opening. And generating the work program.
  • the substrate inspection method of the solder inspection apparatus may further include checking whether the stencil mask is defective after the imaging of the stencil mask to generate a stencil mask image.
  • a solder inspection apparatus is configured to generate a work program based on an imaging unit for photographing a stencil mask and the photographed stencil mask image, and to inspect the substrate based on the generated work program. It includes a control unit for controlling.
  • the controller may obtain position information of an opening corresponding to the solder to be printed from the stencil mask image, and generate the work program according to the position information of the opening.
  • the manufacturing error of the stencil mask can be confirmed, and between the stencil mask and the gerber data. Differentiation can reduce inspection errors in the solder inspection process.
  • an error of the stencil mask can be directly checked, and a job program is generated based on the photographed stencil mask, thereby easily creating and modifying a job program without gerber data. Can be. Accordingly, the manufacturing error of the stencil mask can be confirmed, and the inspection error in the solder inspection process due to the difference between the stencil mask and the gerber data can be reduced. In addition, even if the stencil mask is frequently changed to improve productivity, it is possible to reduce the inconvenience of generating a work program through modification of the gerber data.
  • FIG. 1 is a block diagram showing a substrate inspection apparatus system according to an embodiment of the present invention.
  • FIG. 2 is a flowchart illustrating a pad information correction method of a substrate inspection apparatus system according to an exemplary embodiment of the present invention.
  • FIG. 3 is a flowchart illustrating a pad information correction method of the solder test apparatus according to an exemplary embodiment of the present invention.
  • Figure 4 is a flow chart showing a substrate inspection method of the solder inspection apparatus according to an embodiment of the present invention.
  • first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
  • the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
  • FIG. 1 is a block diagram showing a substrate inspection apparatus system according to an embodiment of the present invention.
  • a substrate inspection apparatus system may include a solder print apparatus 100 and a solder paste inspection (SPI) apparatus 200. have.
  • SPI solder paste inspection
  • the solder print apparatus 100 may include a data receiver 110, an image processor 120, and an image information transmitter 130.
  • the data receiver 110 is provided with first pad information about a substrate.
  • the data receiver 110 may receive the first pad information from the solder inspection apparatus 200 that inspects the solder to be printed on the substrate.
  • the first pad information may be extracted from, for example, gerber data of the substrate, and a plurality of pads may be formed on the substrate, so that the pad ID may be identified for each pad. (ID) information may be included.
  • the gerber data may include design information of the substrate.
  • the first pad information may further include, for example, at least one of location information, volume information, area information, and shape information for each pad of pads existing on the substrate. Such information may be utilized for comparison with image information of the stencil mask described later.
  • the image processor 120 generates an stencil mask image by capturing the stencil mask.
  • the stencil mask is a mask for applying a solder paste in a squeegee manner corresponding to the pad formed on the substrate.
  • the image processor 120 may include an imaging unit having a predetermined field of view, and the imaging unit may image the stencil mask in units of a measurement area corresponding to the viewing range.
  • the image processor 120 may extract or infer the area, volume, shape, etc. of the pad from the obtained stencil mask image.
  • the image information transmitter 130 extracts second pad information from the stencil mask image generated by the image processor 120 and transmits the second pad information to the solder inspection apparatus 200 which will be described later.
  • the image information transmitter 130 may divide the image information of the stencil mask into pads according to the pad ID of the first pad information and transmit the divided image information to the solder inspection apparatus 200.
  • the stencil mask image may include a plurality of pads, and a unique pad ID corresponding to the first pad information may be set in the plurality of pads included in the stencil mask image. Accordingly, the second pad information may include pad ID information for the pads. In the solder test apparatus 200 described later, the first pad information and the second pad are based on the pad ID information. Information can be compared with each other.
  • the solder test apparatus 200 may include a data transmitter 210, a comparison determiner 220, a data changer 230, and the like.
  • the data transmitter 210 provides the first pad information to the data receiver 110 of the solder print apparatus 100.
  • the first pad information may be extracted from gerber data of the substrate.
  • the comparison determining unit 220 receives the second pad information extracted from the stencil mask image and transmits the first pad information and the second pad information by comparing the first pad information with the received second pad information. 2 Determine whether the pad information is different.
  • the comparison between the first pad information and the second pad information may be performed automatically or manually by a user.
  • the comparison between the first pad information and the second pad information may be performed for each pad, and identification of the pads may be performed based on the pad ID information.
  • the comparison between the first pad information and the second pad information may be performed based on at least one of location information, volume information, area information, and shape information for each pad.
  • the data changer 230 changes the first pad information to the second pad information.
  • the first pad information includes rectangular shape information with respect to a pad ID corresponding to the specific pad.
  • the second pad information includes circular shape information about a pad ID corresponding to the specific pad.
  • the data changing unit 230 may change the first pad information on the specific pad or the gerber data of the substrate from a rectangle to a circle.
  • the solder inspection apparatus system may further include an information sharing unit (not shown).
  • the information sharing unit receives the first pad information from the solder inspection apparatus 200, receives the second pad information from the solder print apparatus 100, and receives the first pad information and the second pad information. You can share.
  • the first pad information extracted from the Gerber data provided by the solder inspection apparatus 200 may be provided to the information sharing unit, and the image processing unit 120 of the solder print apparatus 100 may be provided.
  • the generated stencil mask image may be provided to the information sharing unit through the image information transmitter 130.
  • the information sharing unit may be provided to the user in the form of a shared folder of a computer.
  • the solder tester system may further include a display unit (not shown).
  • the display unit may display the first pad information and the second pad information, and display the first pad information and the second pad information according to the pad ID information. Accordingly, when the comparison between the first pad information and the second pad information is performed manually, the user may more easily compare the pad information.
  • the display unit may display a situation in which the first pad information and the second pad information are automatically compared.
  • the display unit may separately list up the pads (hereinafter referred to as “bad pads”) which are determined to be different as a result of the comparison between the first pad information and the second pad information, and display them to the user. Images of the bad pads may be displayed separately.
  • FIG. 2 is a flowchart illustrating a pad information correction method of a substrate inspection apparatus system according to an exemplary embodiment of the present invention.
  • first pad information on a substrate is provided to the solder print apparatus 100 (S110).
  • the first pad information extracted from gerber data and the second pad information extracted from the stencil mask image are compared with each other (S130).
  • the first pad information is changed to the second pad information (S140).
  • the solder inspection apparatus is configured to correct the pad information with the second pad information.
  • a job program may be generated using gerber data, and based on this, the defect formed on the substrate may be more accurately inspected.
  • the pad information extracted from the gerber data and the pad information of the stencil mask image are compared to change the pad information of the gerber data when the stencil is different. Manufacturing errors in the mask can be identified and inspection errors in the solder inspection process due to the difference between the stencil mask and the gerber data can be reduced.
  • the image processing unit 120 of the solder print apparatus 100 includes an imaging unit, and the imaging unit generates the stencil mask image after imaging the stencil mask.
  • the stencil mask image may be generated.
  • FIG. 3 is a flowchart illustrating a pad information correction method of the solder test apparatus according to an exemplary embodiment of the present invention.
  • a stencil mask for solder to be printed on a substrate is inserted into a solder inspection apparatus (S210).
  • the stencil mask image is generated by imaging the stencil mask (S220).
  • the stencil mask inserted into the solder inspection apparatus 200 is taken directly from the solder inspection apparatus 200.
  • Imaging of the stencil mask may be performed by an imaging unit (not shown) of the solder inspection apparatus 200.
  • the solder inspection apparatus 200 may include an imaging unit for imaging of the stencil mask. Although it may be sufficient, the imaging part for inspecting a solder defect may be utilized.
  • the imaging unit may transfer the captured stencil mask image to the comparison determining unit 220.
  • the comparison determination unit 200 of the solder inspection apparatus 200 compares the first pad information on the substrate and the second pad information extracted from the stencil mask image (S230).
  • the first pad information for the substrate may be extracted from the gerber data of the substrate, as described in FIGS. 1 and 2, and a plurality of pads may be formed on the substrate, so that each pad for the pads may be formed.
  • the pad ID information may be included to be identified separately. Accordingly, in the solder test apparatus, the first pad information and the second pad information may be compared with each other based on the pad ID information.
  • the first pad information is changed to the second pad information (S240).
  • the stencil mask when the first pad information and the second pad information is different by the comparison, it may be checked whether the stencil mask is defective. That is, when the openings corresponding to each pad are blocked by defects of the stencil mask itself, or the shape of the pad is other than circular, oval, and polygonal shapes (for example, the openings corresponding to the pads are not completely blocked). Etc.), it may be determined that the stencil mask is bad, and the solder inspection apparatus 200 may perform a bad notification.
  • the first pad information is generated when a work program for performing the inspection process of the solder inspection apparatus 200 is performed. It may not be referenced.
  • the solder inspection apparatus 200 uses the second pad information captured instead of changing the first pad information extracted from the gerber data of the substrate into the second pad information extracted from the stencil image. It is possible to generate a work program immediately and check whether or not the solder formed on the substrate is defective.
  • Figure 4 is a flow chart showing a substrate inspection method of the solder inspection apparatus according to an embodiment of the present invention.
  • a stencil mask is inserted into the solder inspection apparatus 200 (S310).
  • the inserting step may be clamped by being transferred to the solder inspection apparatus 200 from another device or inserted by a user.
  • the stencil mask image is generated by imaging the clamped stencil mask (S320).
  • the position information of the opening corresponding to the solder to be printed may be obtained from the generated stencil mask image, and then a work program may be generated according to the position information of the opening. That is, since solder is printed corresponding to the opening of the stencil mask, position information of the opening may be regarded as pad information. Therefore, a work program for inspecting whether the solder is defective may be generated based on the positional information of the opening.
  • the work program is generated based on gerber data. However, when directly photographing the stencil mask inserted into the solder inspection apparatus 200 as described above, the work program is generated from the position information of the opening of the stencil mask without the gerber data. Can be formed.
  • the substrate is inspected based on the work program (S340).
  • the defect formed on the substrate may be inspected using the work program generated as described above.
  • the process of generating the work program as described above (S330) and the process of inspecting the substrate based on the work program (S340) may be performed by a controller (not shown) of the solder inspection apparatus 200.
  • the stencil mask is imaged directly by the solder inspection device, the error of the stencil mask can be checked immediately, and the work program is based on the captured stencil mask.
  • the work program can be easily created and modified without Gerber data.
  • the manufacturing error of the stencil mask can be confirmed, and the inspection error in the solder inspection process due to the difference between the stencil mask and the gerber data can be reduced.
  • the stencil mask is frequently changed to improve productivity, it is possible to reduce the inconvenience of generating a work program through modification of the gerber data.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un système d'appareil d'inspection de substrat, qui comprend un appareil d'impression de soudure et un appareil d'inspection de soudure. L'appareil d'impression de soudure comprend : une unité de réception de données pour recevoir des premières informations de plot ; une unité de traitement d'image pour photographier un masque pochoir et générer une image ; et une unité de transmission d'informations d'image pour transmettre des secondes informations de plot extraites de l'image de masque pochoir. L'appareil d'inspection de soudure comprend : une unité de transmission de données pour fournir des premières informations de plot ; une unité de comparaison et de détermination pour comparer les premières informations de plot et des secondes informations de plot fournies, et déterminer alors si les premières informations de plot et les secondes informations de plot sont différentes ; et une unité de changement pour remplacer les premières informations de plot par les secondes informations de plot. En conséquence, il est possible de réduire des erreurs d'inspection au cours de procédures d'inspection de soudure.
PCT/KR2015/002813 2014-03-22 2015-03-23 Appareil d'impression de soudure, appareil d'inspection de soudure, et procédé de correction d'informations de plot de système d'appareil d'inspection de soudure WO2015147502A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2014-0033731 2014-03-22
KR20140033731 2014-03-22
KR1020150039802A KR20150110410A (ko) 2014-03-22 2015-03-23 솔더 프린트 장치, 솔더 검사장치 및 솔더 검사장치 시스템의 패드 정보 보정방법
KR10-2015-0039802 2015-03-23

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WO2015147502A1 true WO2015147502A1 (fr) 2015-10-01

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112385328A (zh) * 2018-07-12 2021-02-19 株式会社富士 模板生成装置及元件安装机
WO2023096653A1 (fr) * 2021-11-29 2023-06-01 Siemens Industry Software Inc. Conception de pochoir à brasure avec rétroaction basée sur l'inspection

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KR100526035B1 (ko) * 2003-05-07 2005-11-08 홍성국 메탈 마스크 검사 장치 및 그의 검사 방법
KR101008585B1 (ko) * 2008-05-06 2011-01-17 충북대학교 산학협력단 인쇄 회로 기판 검사를 위한 티칭 데이터 생성 장치 및 그방법
KR20110056920A (ko) * 2009-11-23 2011-05-31 삼성테크윈 주식회사 스크린 프린터 및 이를 사용한 스크린 프린팅 방법
KR101059825B1 (ko) * 2002-07-25 2011-08-29 파나소닉 주식회사 기판에 인쇄되는 크림 솔더 검사용 장치 및 방법
KR20130121747A (ko) * 2012-04-27 2013-11-06 주식회사 고영테크놀러지 스크린 프린터 장비의 보정방법 및 이를 이용한 기판 검사시스템

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
KR101059825B1 (ko) * 2002-07-25 2011-08-29 파나소닉 주식회사 기판에 인쇄되는 크림 솔더 검사용 장치 및 방법
KR100526035B1 (ko) * 2003-05-07 2005-11-08 홍성국 메탈 마스크 검사 장치 및 그의 검사 방법
KR101008585B1 (ko) * 2008-05-06 2011-01-17 충북대학교 산학협력단 인쇄 회로 기판 검사를 위한 티칭 데이터 생성 장치 및 그방법
KR20110056920A (ko) * 2009-11-23 2011-05-31 삼성테크윈 주식회사 스크린 프린터 및 이를 사용한 스크린 프린팅 방법
KR20130121747A (ko) * 2012-04-27 2013-11-06 주식회사 고영테크놀러지 스크린 프린터 장비의 보정방법 및 이를 이용한 기판 검사시스템

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112385328A (zh) * 2018-07-12 2021-02-19 株式会社富士 模板生成装置及元件安装机
WO2023096653A1 (fr) * 2021-11-29 2023-06-01 Siemens Industry Software Inc. Conception de pochoir à brasure avec rétroaction basée sur l'inspection

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