WO2015034014A1 - プリント配線板及び該配線板を接続するコネクタ - Google Patents
プリント配線板及び該配線板を接続するコネクタ Download PDFInfo
- Publication number
- WO2015034014A1 WO2015034014A1 PCT/JP2014/073374 JP2014073374W WO2015034014A1 WO 2015034014 A1 WO2015034014 A1 WO 2015034014A1 JP 2014073374 W JP2014073374 W JP 2014073374W WO 2015034014 A1 WO2015034014 A1 WO 2015034014A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- printed wiring
- surface side
- flexible printed
- connector
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/73—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
- H01R12/732—Printed circuits being in the same plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/771—Details
- H01R12/772—Strain relieving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/82—Coupling devices connected with low or zero insertion force
- H01R12/85—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
- H01R12/88—Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
Definitions
- the present invention relates to a printed wiring board having a pad for electrical connection at a connection end connected to another electronic component such as a connector, and a connector for connecting the printed wiring board to another wiring board.
- Printed wiring boards are used to connect electronic components in electronic devices such as digital cameras, digital videos, notebook computers, mobile phones, and game machines. Along with the miniaturization, the printed wiring board itself is required to be thinner and smaller. However, if the printed wiring board is made thinner and smaller, the holding force of the connection end by the connector will drop, and the wiring will react with the reaction force and impact such as dropping may cause the connector to come off from the connector or cause poor contact. There is a risk.
- a notch is provided at a position where a pair of sides extending in parallel of the flexible printed wiring board face each other, and an engagement provided on the connector. It is described that the flexible printed wiring board is held in the housing of the connector by fitting the portion into the notch.
- the side where the notch was formed was comprised only with the base film and the coverlay which covers both surfaces of this base film, and these base film and coverlay are either Since the film is made of a thin film made of polyimide, if the thickness of the printed circuit board is reduced as the printed wiring board becomes thinner and smaller, sufficient strength cannot be obtained around the notch, and printed wiring by the connector It is difficult to ensure a sufficient holding force for the plate.
- an object of the present invention is to provide a printed wiring board that provides excellent pull-out resistance.
- the present invention includes a base substrate, a plurality of pads for electrical connection disposed on one surface side of the base substrate at a connection end connected to another electronic component, and a wiring connected to the pad.
- a printed wiring board comprising: an engaged portion that is formed at the connection end portion and is engaged with an engagement portion of the other electronic component in a pulling direction; and a connection direction with the other electronic component
- a reinforcing layer is provided on the front side of the engaged portion and on the other surface side of the base substrate, and is formed separately from the wiring.
- front or “front” refers to the direction of the front end side of the connection end of the printed wiring board
- rear or “rear” refers to the opposite direction
- the reinforcing layer preferably has the same thickness as the wiring.
- the engaged portion and the reinforcing layer are respectively provided on both side edge portions of the connection end portion.
- the other surface side is on the front side of the engaged portion and on the one surface side of the base substrate as viewed in the connection direction with the other electronic component. It is preferable to provide a reinforcing layer different from the reinforcing layer provided on.
- the reinforcing layer on the one surface side is formed integrally with at least one of the pad and the wiring.
- the reinforcing layer on the one surface side is preferably formed separately from the pad and the wiring.
- the printed wiring board of the present invention preferably has an insulating layer covering the surface of the reinforcing layer on the one surface side.
- the engaged portion is preferably a notch formed in a side edge portion of the connection end portion.
- the printed wiring board of the present invention is preferably a flexible printed wiring board.
- the present invention also relates to a connector for connecting the printed wiring board according to any one of the above to another wiring board, the connector including a housing having an insertion port into which a connection end of the printed wiring board is inserted; A plurality of contacts provided in correspondence with a plurality of pads of the printed wiring board inserted into the housing, and a latch that engages with an engaged portion provided on the printed wiring board in the pulling direction of the printed wiring board. And a joint portion.
- the operating member is pivotally supported on the housing with the width direction as a rotation axis, and the contact and the pad of the printed wiring board are connected by rotation in one direction. It is preferable that the rotating member release the connection between the contact and the pad of the printed wiring board by rotating in the other direction.
- the engaging portion is provided on at least one side edge portion of the connection end portion of the printed wiring board as the rotating member rotates in the one direction. It is preferable that the locking member is configured to be locked to the engaged portion in the drawing direction of the printed wiring board and to release the locking by turning in the other direction.
- the printed wiring board of the present invention in addition to providing the engaged end to be engaged with the engaging portion of another electronic component in the pulling direction at the connection end, on the front side of the engaged portion.
- the reinforcing layer on the other surface side of the base substrate, the strength in front of the engaged portion can be increased, and even if the printed wiring board is made thinner and smaller, other electronic components Sufficient locking force (pullout resistance) with the engaging portion can be ensured.
- the reinforcing layer is formed separately from the pad wiring, it is possible to prevent the surrounding high-frequency noise from being transmitted to the wiring through the reinforcing layer.
- the engaging parts of other electronic components are usually connected to the ground, and when the reinforcing layer is formed integrally with the wiring and the reinforcing layer is disposed up to the end face of the engaged part, the signal of the wiring is Although there is a possibility of short-circuiting to the ground through the reinforcing layer and the engaging part of the other electronic component, in the present invention, such a problem arises because the reinforcing layer is formed separately from the wiring of the pad. Can be prevented.
- FIG. 1 It is a top view which shows a part of flexible printed wiring board of one Embodiment according to this invention. It is a bottom view of the flexible printed wiring board shown in FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 schematically shows the front row and rear row pads provided at the connection end of the flexible printed wiring board of FIG. 1, the back side wiring connected to these pads, and the reinforcing layer provided on the back side of the base film. It is a perspective view.
- the modification of the flexible printed wiring board of FIG. 1 is shown, (a) is a top view, (b) is a bottom view. It is a partial bottom view which shows the modification of the to-be-engaged part provided in the connection end part of the flexible printed wiring board according to this invention.
- FIG. 1A is a plan view
- FIG. 2B is a cross-sectional view taken along line BB in FIG.
- FIG. 1A and 2B are diagrams showing a modification of the flexible printed wiring board in FIG. 1, in which FIG. 1A is a plan view and FIG. 2B is a cross-sectional view taken along the line CC in FIG.
- It is sectional drawing which shows a part of manufacturing process of the flexible printed wiring board shown in FIG. (A), (b) is sectional drawing in the position similar to FIG.
- FIG. 3 which shows the modification of the flexible printed wiring board of FIG. 1, respectively.
- (A), (b) is sectional drawing in the position similar to FIG. 3, which shows the modification of the flexible printed wiring board of FIG. 1, respectively.
- (a) is a top view
- (b) is a bottom view.
- (a) is a top view
- (b) is a bottom view.
- (a) is a top view
- (b) is a bottom view.
- FIG. 1 shows the flexible printed wiring board of other embodiment according to this invention, (a) is a top view, (b) is a bottom view.
- FIG. 1 It is a figure which shows the flexible printed wiring board of other embodiment according to this invention, (a) is a top view, (b) is a bottom view. It is a top view which shows the flexible printed wiring board of other embodiment according to this invention.
- (A), (b) is a partial cross-sectional perspective view which shows the flexible printed wiring board of other embodiment according to this invention, respectively.
- (A), (b) is a partial cross-sectional perspective view which shows the flexible printed wiring board of other embodiment according to this invention, respectively.
- (A), (b) is a perspective view which respectively shows two types of contacts provided in the connector of FIG.
- FIG. 25 is a cross-sectional view of the connector shown in FIG. 24, wherein (a) is a cross-sectional view showing a state before the flexible printed wiring board is inserted into the connector housing, and (b) is a state in which the flexible printed wiring board is inserted into the housing. It is sectional drawing which shows the state which pressed the flexible printed wiring board with the slider. 6 is a plan view showing a part of a flexible printed wiring board of Comparative Example 1.
- a flexible printed wiring board (FPC) will be described as an example of the printed wiring board, but the present invention is also applicable to other printed wiring boards such as a rigid flexible printed wiring board.
- FPC flexible printed wiring board
- ZIF Zero Insertion Force
- the printed wiring board of the present invention uses the thickness of the printed wiring board. It can also be used for non-ZIF connectors and backboard connectors that obtain a fitting force.
- the flexible printed wiring board 1 of the present embodiment includes a base film 3 as a base substrate and an adhesive layer 4 so as to cover one surface (here, the upper surface) of the base film 3.
- the first cover lay (hereinafter referred to as “upper surface side cover lay” for convenience) 5 and the second cover (here, the lower surface) of the base film 3 are attached by the adhesive layer 6 so as to cover the first cover lay.
- the base film 3 is formed of a flexible insulating resin, and examples thereof include polyimide, polyester, and polyethylene naphthalate.
- the upper surface side cover lay 5 and the lower surface side cover lay 7 may be formed by applying and curing a thermosetting ink, an ultraviolet curable ink, or a photosensitive ink in addition to attaching an insulating resin film such as polyimide. it can.
- the flexible printed wiring board 1 has, at least one end in the insertion direction (connection direction) I, a connection end 13 to be inserted into a connector insertion port described later.
- the upper surface side of the connection end 13 is not covered with the cover lay 5, and the exposed portion of the connection end 13 is for electrical connection arranged in a staggered arrangement in front and rear rows 15, 17 as viewed in the insertion direction I.
- a plurality of pads 15a and 17a are formed.
- the pads 15a and 17a do not have to be arranged in a staggered arrangement.
- the positions of the pads 15a in the front row 15 in the width direction (direction crossing the insertion direction I) W and the positions in the width direction W of the pads 17a in the rear row 17 May be the same (see FIG.
- Plating layers for example, gold plating layers
- the uppermost plating layers 18 and 19 may have at least conductivity, and preferably have corrosion resistance, wear resistance, and the like.
- Examples of the plating layers 18 and 19 include a conductive carbon layer and a solder layer in addition to gold plating.
- a reinforcing film 23 bonded to the lower surface of the lower surface side coverlay 7 via the adhesive layer 21 is provided in the lowermost layer of the connection end portion 13.
- the reinforcing film 23 can be formed of polyimide, for example.
- the flexible printed wiring board 1 has a first wiring 9 connected to the pad 15a in the front row 15 and a second wiring 11 connected to the pad 17a in the rear row 17.
- both the first wiring 9 and the second wiring 11 are opposite to the side of the base film 3 where the pads 15a and 17a are provided, that is, the base film 3 and the lower surface side coverlay. 7 is arranged.
- both the 1st wiring 9 and the 2nd wiring 11 are arrange
- the first wiring 9 and the second wiring 11 are adjacent to each other in the width direction (direction crossing the insertion direction I) W and extend in the insertion direction (connection direction) I to the connector.
- the first wiring 9 and the second wiring 11 can be formed of a known conductive metal such as copper or a copper alloy.
- a plating layer (for example, a copper plating layer) 43 may be formed on the outer surfaces of the first wiring 9 and the second wiring 11.
- each pad 15 a in the front row 15 and the first wiring 9 arranged on the lower surface side (the other surface side) of the base film 3 are vias 24 that penetrate the base film 3. Connected through.
- each pad 17 a in the rear row 17 and the second wiring 11 disposed on the lower surface side of the base film 3 are connected via a via 25 penetrating the base film 3.
- one via 24 and 25 is provided for each of the pads 15a and 17a.
- each of the vias 24 and 25 is provided. Two or more pads 15a and 17a can be provided.
- the first wiring 9 and the second wiring 11 have widened portions 9a and 11a at positions corresponding to the upper pads 15a and 17a.
- the widened portions 9a and 11a have a role as a reinforcing material for keeping the thickness of the flexible printed wiring board 1 uniform at the positions of the pads 15a and 17a, that is, improving the creep resistance. Do not make direct contact with contacts.
- the adhesive layer included in the flexible printed wiring board 1 creep-deforms particularly in a high temperature environment.
- these widened portions 9a and 11a have shapes corresponding to the pads 15a and 17a located above, that is, substantially the same shape, but contacts between the pads 15a and 17a and other electronic components. As long as the contact stability with the pad is not impaired, the pad may be formed smaller or larger than the pads 15a and 17a located above. In the present invention, these widened portions 9a and 11a may not be provided.
- the flexible printed wiring board 1 of the present embodiment is connected to at least one of the side edge portions (edges in the width direction) of the connection end portion 13, here, both side edge portions.
- Engaged portions 28 and 29 that are locked in an extraction direction (opposite to the connection direction) to an engagement portion (for example, a tab-shaped lock member provided on a connector described later) of an electronic component that is a target.
- the engaged portions 28 and 29 are configured by notches formed in the side edge portions of the connection end portion 13. You may comprise by such a through-hole 28 or a bottomed hole (illustration omitted).
- the flexible printed wiring board 1 of this embodiment is at least on the front side of the engaged portions 28 and 29 and viewed from the base film 3 in the direction of connection with other electronic components.
- Reinforcing layers 31 and 32 formed separately from the wirings 9 and 11 are provided between the lower surface side coverlay 7.
- the reinforcing layers 31 and 32 may be formed of the same material as the wirings 9 and 11, but as long as they have a predetermined strength, a metal such as thermosetting ink, ultraviolet curable ink, photosensitive ink, resin, silver or solder. It can also be formed from other materials.
- the reinforcing layers 31 and 32 may have the same thickness as the wirings 9 and 11, but can be formed thicker or thinner than the wirings 9 and 11 as long as necessary strength is obtained.
- the width of the reinforcing layers 31 and 32 (the length along the width direction W) is preferably 100% or more of the width of the engaged portions 28 and 29 from the viewpoint of securing sufficient pull-out strength. .
- the length of the reinforcing layers 31 and 32 can be appropriately set according to various conditions (strength, material, etc.).
- the shape of the reinforcing layers 31 and 32 is rectangular in the illustrated example, but is not limited to this, and is not limited to this, and is elliptical or circular as shown in FIG. 7A, or as shown in FIGS. 7B and 7C.
- Various shapes such as a shape surrounding the engaged portions 28 and 29 can be adopted.
- 6 and 7 (a) and the like the flexible printed wiring board 1 is manufactured at the time of manufacture by arranging the reinforcing layers 31 and 32 so as not to be exposed at the edges of the engaged portions 28 and 29. When the die is punched into a final shape, the die does not directly shear the copper foil, so that the life of the die is increased and manufacturing defects such as burrs can be prevented.
- the engaged portions 28 and 29 that are locked to the engaging portions of other electronic components at the side edge portion of the connection end portion 13 in the pulling direction.
- the front side of the engaged portions 28 and 29 is provided. The strength of the printed circuit board can be increased, and even when the flexible printed wiring board is made thinner and smaller, it is possible to ensure sufficient locking force (withdrawal resistance) with the engaging parts of other electronic components. it can.
- the reinforcing layers 31 and 32 are formed separately from the wirings 9 and 11 of the pads 15a and 17a, it is possible to prevent the surrounding high-frequency noise from being transmitted to the wirings 9 and 11 through the reinforcing layers 31 and 32.
- the engaging portions of other electronic components are usually connected to the ground, the reinforcing layers 31 and 32 are formed integrally with the wirings 9 and 11, and the reinforcing layers 31 and 32 are formed as shown in FIGS. ), The signals of the wirings 9 and 11 are transmitted to the reinforcing layers 31 and 32 and the end surfaces of the engaged portions 28 and 29 so as to surround the engaged portions 28 and 29 as shown in FIG.
- the reinforcing layers 31 and 32 are separate from the wirings 9 and 11 and are not connected to the wirings 9 and 11. Therefore, it is possible to prevent the signals of the pads 15a and 17a from being short-circuited to the ground via the engaging portions of the reinforcing layers 31 and 32 and other electronic components.
- the first wiring 9 connected to the pad 15a in the front row 15 and the second wiring 11 connected to the pad 17a in the rear row 17 are both formed as a base. If it is arranged on the other surface (back surface) of the film 3, the wiring on the front surface side of the flexible printed wiring board 1 can be eliminated. Therefore, a mounting space for mounting other electronic components such as chips on the front surface side is eliminated. There is also an advantage that it can be taken widely.
- the widened portions 9a and 11a are provided in the positions corresponding to the pads 15a and 17a of the first wiring 9 and the second wiring 11 as in the flexible printed wiring board 1 of the present embodiment, the pad 15a , 17a, even if the contacts of other electronic components that are in contact with the pads are slightly displaced from the normal contact positions due to manufacturing errors or the like, the thickness of the portion of the flexible printed wiring board 1 where the contacts come into contact is determined. Since it can be made uniform, that is, creep resistance can be improved, a stable connection between the pads 15a and 17a and the contacts of other electronic components can be maintained for a long period of time.
- the widened portions 9a and 11a are shaped to correspond to the pads 15a and 17a, so that the effect can be obtained more reliably.
- the reinforcing layers 31 and 32 are formed of the same material as the wirings 9 and 11 located on the same plane as in the flexible printed wiring board 1 of the present embodiment, the engagement with the engaging portions of other electronic components is possible.
- the stopping force can be increased sufficiently and can be easily manufactured.
- the reinforcing layers 31 and 32 have the same thickness as the wirings 9 and 11 located on the same plane as in the flexible printed wiring board 1 of the present embodiment, other electronic components of the flexible printed wiring board 1 can be used. A sufficient thickness can be ensured at the location where the engaging portion abuts, and the pull-out resistance of the flexible printed wiring board 1 can be further enhanced.
- the engaged portions 28 and 29 and the reinforcing layers 31 and 32 are provided on both side edge portions of the connection end portion 13 as in the flexible printed wiring board 1 of the present embodiment, the resistance of the flexible printed wiring board 1 is improved.
- the pull-out property can be further improved and more stable holding can be realized.
- both the first wiring 9 and the second wiring 11 are arranged on the back side of the base film 3
- both the first wiring 9 and the second wiring 11 may be arranged on the surface side of the base film 3, that is, on the side where the pads 15a and 17a are located.
- the reinforcing members 9a ′ and 11a ′ are used instead of the above-described widened portions 9a and 11a at positions corresponding to the upper pads 15a and 17a on the back surface side (the other surface side) of the base film 3. May be provided.
- the reinforcing members 9a ′ and 11a ′ are made of the same material as the wirings 9 and 11 in the example of FIG. 8, but the reinforcing members 9a ′ and 11a ′ are not a part of the wirings 9 and 11, so It can also be formed from other materials such as a resin having a property.
- the second wiring 11 is connected to the surface side of the bail film 3 (
- the first wiring 9 may be disposed on the back surface side (the other surface side) of the base film 3.
- the widened portion 9 b corresponding to the pad 15 a of the front row 15 and the widened portion 9 b corresponding to the pad 17 a of the rear row 17 by the first wiring 9 provided on the back surface side of the base film 3. Is forming.
- the first wiring provided on the back surface side of the base film 3 corresponds to the pad 15a in the front row 15.
- the widened portion and the widened portion corresponding to the pad 17a of the rear row 17 may be formed.
- a double-sided copper-clad laminate 39 in which copper foils 36 and 37 are laminated on both sides of a base film 3 made of polyimide is formed as a starting material.
- the double-sided copper-clad laminate 39 is obtained by bonding the base film 3 and the copper foils 36 and 37 with an adhesive or the like, even if copper is deposited or sputtered on the base film 3 and then copper-plated. It may be.
- a blind via hole 41 penetrating the copper foil 37 and the base film 3 from below (lower surface side) by laser processing, CNC drill processing, or the like at a predetermined position of the double-sided copper clad laminate 39. , 42 are formed.
- a conductor layer is formed on the inner peripheral surfaces of the blind via holes 41 and 42 by DPP (Direct Placing Process), and then the inner surfaces of the blind via holes 41 and 42 are included.
- a copper plating layer 43 is formed on the entire surface of the double-sided copper clad laminate 39.
- a method of partial plating having a structure called button plating may be employed.
- vias 24 and 25 that electrically connect the upper surface copper foil 36 and the lower surface copper foil 37 of the double-sided copper clad laminate 39 are formed.
- the vias 24 and 25 may be hollow ones formed by plating only the inner peripheral surfaces of the blind via holes 41 and 42, or may be so-called filled vias in which the blind via holes 41 and 42 are filled by plating or filled with a conductive material. .
- the copper foil 36 on the upper surface side and the copper foil 37 on the lower surface side are patterned so that the pads 48 and 49 on the surface of the base film 3 and the lower surface side of the base film 3 are obtained.
- the wiring patterns 46 and 47 and the reinforcing layer (not shown) on the back side are formed.
- a mask pattern is formed on the surfaces of the upper surface copper foil 36 and the lower surface copper foil 37 by photolithography, and then the upper surface side copper foil 36 is formed. This is done by edging the foil 36 and the copper foil 37 on the lower surface side.
- the upper surface side coverlay 5 and the lower surface side coverlay 7 are bonded to both surfaces of the double-sided copper clad laminate 39 on which the wiring pattern is formed, with an adhesive.
- the gold plating layers 18 and 19 are formed on the surfaces of the pads 15a and 17a formed on the upper surface side, and then the both side edge portions of the connection end portion are partially removed by a mold or the like to thereby form both side edge portions.
- the engaged portions 28 and 29 are formed in the upper part.
- the blind via holes 41 and 42 may be formed from the upper side (upper surface side) as shown in FIG. 11 (a), or may be formed as through holes as shown in FIG. 11 (b). it can.
- the copper plating layer 43 may not be formed on the entire surface of the double-sided copper-clad laminate 39. For example, as shown in FIG. Alternatively, it may be formed on the copper foil 36 on the upper surface side (single-sided partial plating) as shown in FIG.
- the flexible printed wiring board 1 of the previous embodiment has the reinforcing layers 31 and 32 only on the back surface side (the other surface side) of the base film 3, as shown in FIGS. 13 (a) and 13 (b).
- the flexible printed wiring board 1 includes a reinforcing layer (hereinafter, referred to as a first reinforcing layer) 31, 32 as well as a reinforcing layer (hereinafter, referred to as a first reinforcing layer) on the surface side (one surface side) of the base film 3. This is also referred to as a second reinforcing layer.) It differs from that of the previous embodiment in that it has 34 and 35.
- the second reinforcing layers 34 and 35 are provided with pads 15 a and 17 a on at least the front side of the engaged portions 28 and 29 formed on the side edge portion of the connection end portion 13 and on the base film 3.
- the pad 15 is formed integrally with the pad 15 a located on the outermost side in the width direction of the pads 15 a of the front row 15.
- the pull-out resistance of the flexible printed wiring board 1 can be further enhanced by the second reinforcing layers 34 and 35 together with the first reinforcing layers 31 and 32.
- the first wiring 9 and the second wiring 11 are both arranged on the back side of the base film 3.
- Both the wiring 9 and the second wiring 11 may be arranged on the front surface side of the base film 3, or the first wiring 9 is arranged on the back surface side of the base film 3 as in FIGS. 5 and 9.
- the second wiring 11 may be disposed on the surface side of the base film 3 (not shown).
- the flexible printed wiring board 1 shown in FIGS. 14 (a) and 14 (b) has a second reinforcement. It differs from the flexible printed wiring board 1 of FIG. 13 in having insulating layers 5a and 5b on the surfaces of the layers 34 and 35.
- the insulating layers 5a and 5b extend forward in the width direction outside portion of the upper surface side coverlay 5 so as not to cover the pads 15a and 17a. , 35 is covered.
- the second reinforcing layers 34 and 35 can further enhance the pull-out resistance of the flexible printed wiring board 1 in combination with the first reinforcing layers 31 and 32, and Even when the engaging part of the electronic component is connected to the ground, since the engaging part is insulated from the second reinforcing layers 34 and 35 by the insulating layers 5a and 5b, the signal of the pad 15a is the second signal. It is possible to prevent a short circuit to the ground via the reinforcing layers 34 and 35 and the engaging portion. Further, such insulating layers 5a and 5b are useful as a reinforcing layer for increasing the strength around the engaged portions 28 and 29, and can further enhance the pull-out resistance of the flexible printed wiring board 1. .
- the first wiring 9 and the second wiring 11 are both arranged on the back side of the base film 3.
- Both the wiring 9 and the second wiring 11 may be arranged on the front surface side of the base film 3, or the first wiring 9 is arranged on the back surface side of the base film 3 as in FIGS. 5 and 9.
- the second wiring 11 may be disposed on the surface side of the base film 3 (not shown).
- the insulating layers 5 a and 5 b are formed by the upper surface side coverlay 5, but not limited thereto, an insulating layer that is not the upper surface side coverlay 5 is separately provided for the second reinforcing layers 34 and 35. You may affix on the upper surface.
- FIGS. 15A and 15B show still another modified example of the flexible printed wiring board.
- This flexible printed wiring board 1 has second reinforcing layers 34 ′ and 35 ′ on the front surface side of the base film 3 in addition to the first reinforcing layers 31 and 32 disposed on the back surface side of the base film 3.
- the second reinforcing layers 34 ′ and 35 ′ are different from the example of FIG. 13 in that the second reinforcing layers 34 ′ and 35 ′ are formed separately from the pads 15 a and 17 a. That is, the second reinforcing layers 34 'and 35' are separated from the pads 15a and 17a and are not electrically connected.
- the second reinforcing layers 34 ′ and 35 ′ can further enhance the pull-out resistance of the flexible printed wiring board 1 in combination with the first reinforcing layers 31 and 32. Even when the engaging portions of other electronic components are connected to the ground, the second reinforcing layers 34 'and 35' are not electrically connected to the pads 15a and 17a. It is possible to prevent the signal from being short-circuited to the ground via the second reinforcing layers 34 ′ and 35 ′ and the engaging portion.
- the first wiring 9 and the second wiring 11 are both disposed on the back side of the base film 3, but the first wiring 9 is the same as in FIG. Both the wiring 9 and the second wiring 11 may be arranged on the front surface side of the base film 3, or the first wiring 9 is arranged on the back surface side of the base film 3 as in FIGS. 5 and 9. In addition, the second wiring 11 may be disposed on the surface side of the base film 3 (not shown).
- the flexible printed wiring board 1 shown in FIG. 16 includes second reinforcing layers 34 ′ and 35. 15 is different from the flexible printed wiring board 1 of FIG. 15 in that the insulating layers 5a and 5b are provided on the surface of '.
- the insulating layers 5a and 5b extend forward in the width direction outside portion of the upper surface side coverlay 5 so as not to cover the pads 15a and 17a. It is comprised by covering the upper surface of ', 35'.
- the second reinforcing layers 34 ′ and 35 ′ can further enhance the pull-out resistance of the flexible printed wiring board 1 in combination with the first reinforcing layers 31 and 32.
- the short circuit of the signal of the pad 15a to the ground as described above can be prevented more reliably.
- such insulating layers 5a and 5b are useful as a reinforcing layer for increasing the strength around the engaged portions 28 and 29, and can further enhance the pull-out resistance of the flexible printed wiring board 1. .
- the first wiring 9 and the second wiring 11 are both arranged on the back side of the base film 3.
- Both the wiring 9 and the second wiring 11 may be arranged on the front surface side of the base film 3, or the first wiring 9 is arranged on the back surface side of the base film 3 as in FIGS. 5 and 9.
- the second wiring 11 may be disposed on the surface side of the base film 3 (not shown).
- the insulating layers 5 a and 5 b are formed by the upper surface side coverlay 5, but the present invention is not limited thereto, and an insulating layer that is not the upper surface side coverlay 5 is separately provided as the second reinforcing layers 34 ′ and 35. You may stick it on the top of '.
- FIG. 17 shows a further modification of the flexible printed wiring board.
- the flexible printed wiring board 1 shown in FIG. 17 extends the width direction outer side portion of the upper surface side coverlay 5 forward so as not to cover the pads 15a and 17a, and the extension layers 5a ′ and 5b 'Is composed. Even with such a configuration, it is possible to increase the strength of the front side of the engaged portions 28 and 29.
- the present invention can also be applied to a flexible printed wiring board having electromagnetic wave shielding characteristics.
- a flexible printed wiring board in which the first wiring 9 and the second wiring 11 as shown in FIGS. 1 to 4, 13, 14, 15, and 16 are both disposed on the back side of the base film 3. 1 as shown in FIGS. 18A and 18B, a ground connection is made to the surface (upper surface) of the base film 3 opposite to the side where the first wiring 9 and the second wiring 11 are arranged.
- the electromagnetic wave shielding layers 40 and 40 'to be formed may be formed.
- the pattern of the electromagnetic wave shielding layers 40 and 40 ' is not particularly limited, and may be a solid pattern as shown in FIG. 18 (a) or a more flexible mesh pattern as shown in FIG. 18 (b). Further, in the flexible printed wiring board 1 in which both the first wiring 9 and the second wiring 11 are arranged on the surface side of the base film 3 as shown in FIG. What is necessary is just to provide 40 and 40 'on the back surface side of the base film 3. FIG. Further, in the flexible printed wiring board 1 in which the first wiring 9 and the second wiring 11 are arranged on different surfaces of the base film 3 as shown in FIGS. 9 and 17, FIG. As shown in (b), narrow electromagnetic shielding layers 40 and 40 ′ can be provided between the adjacent first wirings 9 and between the adjacent second wirings 11, respectively.
- the electromagnetic shielding layers 40 and 40 ' are formed by patterning the copper foils 36 and 37 of the double-sided copper clad laminate 39 as shown in FIG. 10 together with the patterning of the wirings 9 and 11 and the pads 15 and 17.
- the copper plating layer 43 on the copper foils 36 and 37 and the gold plating layers 18 and 19 thereon may or may not be provided.
- the cover lay 5 on the electromagnetic wave shielding layers 40 and 40 ' can be omitted.
- an electromagnetic wave shield layer can also be formed by affixing to the base film 3 separately what woven copper wire, the conductive fiber, etc. in mesh shape, or copper foil of a predetermined shape. *
- the connector 50 includes a housing 52 into which the flexible printed wiring board 1 is inserted, a plurality of contacts 54 electrically connected to the pads 15 a and 17 a of the flexible printed wiring board 1, and a housing 52.
- a rotating member 56 as an actuating member that presses the inserted flexible printed wiring board 1 through the contact 54, and an engaged portion 28 provided at both side edge portions of the connection end 13 of the flexible printed wiring board 1.
- 29 and a tab-like lock member 58 as an engaging portion.
- the housing 52 is made of an electrically insulating plastic and can be manufactured by a known injection molding method.
- the material is appropriately selected in consideration of dimensional stability, workability, cost, etc.
- PBT polybutylene terephthalate
- 66PA, 46PA polyamide
- LCP liquid crystal polymer
- PC polycarbonate
- PTFE Polytetrafluoroethylene
- the housing 52 is provided with a required number of insertion grooves into which the contacts 54 are inserted, and an insertion port 60 into which the flexible printed wiring board 1 is inserted on the rear side.
- Each contact 54 can be manufactured by a known processing method such as pressing or cutting.
- the contact 54 is required to have springiness or conductivity, and can be formed of brass, beryllium copper, phosphor bronze, or the like.
- two types of contacts 54 are used corresponding to the pads 15a in the front row 15 and the pads 17a in the rear row 17 of the flexible printed wiring board 1, and the insertion direction. Instead of staggering, they are staggered.
- Both of the two types of contacts 54a and 54b are rear openings 62 and 63 into which the connection end 13 of the flexible printed circuit board 1 is inserted, and front openings into which a cam 65 (to be described later) of the rotating member 56 is inserted.
- the lock member 58 is also inserted with a rear opening 58 a into which the connection end portion 13 of the flexible printed wiring board 1 is inserted and a cam 65 described later of the rotating member 56. It has a substantially H shape in which a front opening 58b is formed, and is disposed on both sides of the contact 54, respectively.
- the rotating member 56 is pivotally supported by the housing 52 at both ends thereof with the width direction W as the rotation axis.
- the rotating member 56 has a cam 65 inserted into the openings 67 and 68 on the front side of the contact 54 and the opening 58b on the front side of the lock member 58 on the rotation axis.
- the rotating member 56 is rotated in the tilting direction, so that the cam 65 resists the spring force of the contact 54 and the locking member 58 by the cam 65 and the front of the contact 54.
- the side openings 67, 68 and the front opening 58b of the lock member 58 are expanded. Accordingly, as shown in FIG.
- the openings 62 and 63 on the rear side of the contact 54 and the opening 58a on the rear side of the lock member 58 are narrowed, and the electrical connection between the contact 54 and the flexible printed wiring board 1 and the lock member are narrowed.
- 54 is engaged with the engaged portions 28 and 29.
- FIG. 23 by rotating the rotating member 56 in the upright direction, the electrical connection and the locking of the lock member 58 are released.
- the operating member may be a slider that is inserted after the flexible printed wiring board is inserted into the housing and presses the flexible printed wiring board against the contact.
- a connector 70 as shown in FIGS. 24 and 25, which mainly includes a housing 72, a contact 74, and a slider 76.
- the contact 74 has a substantially U shape as shown in FIG. 25, and is mainly fixed to the housing 72, a contact portion 74 a that comes into contact with the flexible printed wiring board 1, a connection portion 74 b that is connected to a substrate or the like. Part 74c.
- the contact 74 is fixed to the housing 72 by press fitting or the like.
- the slider 76 has a substantially wedge shape as shown in FIG. 25.
- the slider 76 After the flexible printed wiring board 1 is inserted into the housing 72 in which the required number of contacts 74 are arranged, the slider 76 is inserted.
- the slider 76 includes a mounting portion 76 a that is mainly mounted on the housing 72 and a pressing portion 76 b that presses the flexible printed wiring board 1 against the contact portion 74 a of the contact 74.
- the slider 76 is temporarily attached to the housing 72.
- the slider 76 shown in FIG.
- the pressing portion 76 b of the slider 76 is inserted in parallel with the flexible printed wiring board 1, and the flexible printed wiring board 1 is pressed against the contact portion 74 a of the contact 74.
- the connector 70 also has engaging portions that engage with the engaged portions 28 and 29 provided on the flexible printed wiring board 1 when the slider 76 is inserted, as with the connector 50 described above. Have.
- the rotation member 56 is disposed at the front position in the insertion direction of the housing 52. However, the rotation member 56 is located at the rear position in the insertion direction of the housing 52. May be arranged (not shown).
- Example 1 As Example 1, a flexible printed wiring board having the structure shown in FIGS. Specifically, the flexible printed wiring board has a staggered pad of 15 front rows and 14 back rows at the connection end, and the pad pitch is 0.175 mm (0.35 mm in each row).
- the front row pad wiring and the rear row pad wiring are both provided on the surface of the base film opposite to the surface on which the pad is provided (back surface), and further on the front side of the notch (engaged portion).
- a reinforcing layer separate from the wiring is disposed on the back side.
- the pad, wiring, and reinforcing layer were made of copper, and a gold plating layer was formed on the upper surface of the pad.
- a polyimide film having a thickness of 20 ⁇ m was used as the base film.
- a polyimide film having a thickness of 12.5 ⁇ m was used for the upper surface side coverlay and the lower surface side coverlay.
- a polyimide film having a thickness of 12.5 ⁇ m was used as the reinforcing film.
- the reinforcing layer had a width of 0.5 mm, a length of 0.5 mm, and a thickness of 22.5 ⁇ m (copper: 12.5 ⁇ m, copper plating: 10 ⁇ m, which is the same as the wiring).
- the dimension of the notch was 0.5 mm in width and 0.5 mm in length.
- Example 2 As Example 2, a flexible printed wiring board that differs from Example 1 only in that a reinforcing layer as shown in FIG. 17 is provided on the upper surface side (side on which the pad is formed) of the base film was manufactured. Specifically, in the flexible printed wiring board of Example 2, the upper surface side reinforcing layer is constituted by an extending portion extending forward from the width direction outer side portion of the upper surface side coverlay.
- Comparative Example 1 As Comparative Example 1, as shown in FIG. 26, a flexible material having the same structure as that of Example 1 except that neither the reinforcing layer on the lower surface side of the base film nor the reinforcing layer on the lower surface side of the base film is provided. A printed wiring board was prototyped.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structure Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
図1~4に示すように、本実施の形態のフレキシブルプリント配線板1は、ベース基板としてのベースフィルム3と、このベースフィルム3の一方の面(ここでは上面)を覆うように接着層4により貼り合わされた第1のカバーレイ(以下、便宜上「上面側カバーレイ」という。)5と、上記ベースフィルム3の他方の面(ここでは下面)を覆うように接着層6により貼り合わされた第2のカバーレイ(以下、便宜上「下面側カバーレイ」という。)7とを備えている。ベースフィルム3は、可撓性を有する絶縁性樹脂により形成されており、例えば、ポリイミド、ポリエステル、ポリエチレンナフタレートを例に挙げることができる。また、上面側カバーレイ5及び下面側カバーレイ7は、ポリイミド等の絶縁性樹脂フィルムを貼着する他、熱硬化インクや紫外線硬化インク、感光性インクを塗布、硬化することにより形成することもできる。
次に、図1~4で示したフレキシブルプリント配線板1の製造方法の一例について、図10~図12及び図3を参照しながら説明する。
次いで、本発明に係る他の実施形態のフレキシブルプリント配線板について、図13~図17を参照して説明する。なお、先の実施形態のフレキシブルプリント配線板1における要素と同様の要素には同一の符号を付し、その詳細は省略する。
次に、上述したフレキシブルプリント配線板1を他の配線板に接続する、本発明に従う一実施形態のコネクタについて説明する。
実施例1として、図1~4に示す構造を有するフレキシブルプリント配線板を試作した。具体的には、フレキシブルプリント配線板は、接続端部に、前列15枚、後列14枚の千鳥配列されたパッドを有し、パッドのピッチは0.175mm(各列では0.35mm)であり、前列のパッドの配線及び後列のパッドの配線を共にベースフィルムの、パッドが設けられた面とは反対側の面(裏面)に有し、さらに切欠き部(被係合部)の前方側でかつ裏面側に、配線と別体の補強層を配設したものである。パッド、配線及び補強層は銅製とし、パッドの上面には金めっき層を形成した。ベースフィルムには、厚さ20μmのポリイミド製のフィルムを用いた。上面側カバーレイ及び下面側カバーレイには、厚さ12.5μmのポリイミド製のフィルムを用いた。補強フィルムには、厚さ12.5μmのポリイミド製のフィルムを用いた。補強層は、幅0.5mm、長さ0.5mm、厚さ22.5μm(銅:12.5μm,銅めっき:10μmであり、配線と同じである。)とした。また、切欠き部の寸法は、幅を0.5mm、長さを0.5mmとした。
実施例2として、ベースフィルムの上面側(パッドが形成された側)に図17に示すような補強層を有する点のみが実施例1とは異なるフレキシブルプリント配線板を試作した。詳細には、実施例2のフレキシブルプリント配線板は、上面側の補強層を、上面側カバーレイの幅方向外側部分から前方に延びる延出部で構成したものである。
比較例1として、図26に示すように、ベースフィルムの下面側の補強層及びベースフィルムの下面側の補強層のいずれも有していない点を除いて、実施例1と同じ構造を有するフレキシブルプリント配線板を試作した。
耐引抜け性試験は、実施例1,2及び比較例1のフレキシブルプリント配線板をそれぞれ、図20に示した構造を有するコネクタ(但し、コンタクトは設けていない。)に接続し、タブ状のロック部材のみでフレキシブルプリント配線板を嵌合、保持した状態において、引張試験機で、各フレキシブルプリント配線板をコネクタに対して、引き抜き方向(接続方向とは逆方向)に引っ張り、フレキシブルプリント配線板がコネクタから外れたときの引張試験機に加わる荷重を測定することにより行った。
試験の結果、比較例1のフレキシブルプリント配線板における、フレキシブルプリント配線板がコネクタから外れたときの荷重を100%として、実施例1のフレキシブルプリント配線板における、フレキシブルプリント配線板がコネクタから外れたときの荷重は146%であり、実施例2のフレキシブルプリント配線板における、フレキシブルプリント配線板がコネクタから外れたときの荷重は168%であり、本発明の適用により、フレキシブルプリント配線板の耐引き抜け性が向上することが確認された。
3 ベースフィルム
4 接着層
5 上面側カバーレイ
5a,5b 絶縁層(延出部)
6 接着層
7 下面側カバーレイ
9,11 配線
13 接続端部
15a 前列のパッド
17a 後列のパッド
18,19 めっき層
21 接着層
23 補強フィルム
24,25 ビア
28,29 被係合部
31,32 補強層(第1の補強層)
34,35,34’,35’,5a’,5b’ 補強層(第2の補強層)
36,37 銅箔
39 両面銅張積層体
40,40’ 電磁波シールド層
41,42 ブラインドビアホール
50 コネクタ
52 ハウジング
54 コンタクト
56 回動部材(作動部材)
58 ロック部材(係合部)
65 カム
70 コネクタ
72 ハウジング
74 コンタクト
76 スライダ
Claims (8)
- ベース基板と、他のコネクタに接続される接続端部の、前記ベース基板の一方の面側に配置された電気接続用の複数のパッドと、前記ベース基板の他方の面側に配置され、前記複数のパッドのうちの少なくとも一部のパッドに、前記ベース基板を貫通するビアを介して接続された他方の面側配線と、前記接続端部に形成され、前記他のコネクタの係合部に引き抜き方向で係止される被係合部と、を備え、
前記他のコネクタとの接続方向で見て、前記被係合部の前方側でかつ前記ベース基板の他方の面側に配置され、前記他方の面側配線とは別体として形成された第1補強層を備えることを特徴とするプリント配線板。 - 前記他のコネクタとの接続方向で見て、前記被係合部の前方側でかつ前記ベース基板の前記一方の面側に、前記他方の面側に設けられた前記第1補強層とは別の第2補強層を備える、請求項1に記載のプリント配線板。
- 前記第2補強層は、前記パッドと一体として形成されている、請求項2に記載のプリント配線板。
- 前記ベース基板の前記一方の面側に配置され、前記複数のパッドのうちの一部のパッドに接続された一方の面側配線をさらに備え、前記第2補強層は、前記一方の面側配線のいずれか一の配線と一体として形成されている、請求項2または3に記載のプリント配線板。
- 前記第2補強層は、前記パッドと別体として形成されている、請求項2に記載のプリント配線板。
- 前記ベース基板の前記一方の面側に配置され、前記複数のパッドのうちの一部のパッドに接続された一方の面側配線をさらに備え、前記第2補強層は、前記パッド及び前記一方の面側配線とは別体として形成されている、請求項2に記載のプリント配線板。
- 前記第2補強層の表面を覆う絶縁層を有する、請求項2~6のいずれか一項に記載のプリント配線板。
- 請求項1~7のいずれか一項に記載のプリント配線板を他の配線板に接続するコネクタであって、
前記プリント配線板の前記接続端部が挿入される挿入口を有するハウジングと、
前記ハウジング内に挿入された前記プリント配線板の前記複数のパッドに対応して設けられた複数のコンタクトと、
前記プリント配線板に設けられた前記被係合部に、前記プリント配線板の引き抜き方向で係止する係合部と、を備えることを特徴とするコネクタ。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480048252.XA CN105493638B (zh) | 2013-09-05 | 2014-09-04 | 印刷布线板以及连接该布线板的连接器 |
KR1020167007964A KR101868969B1 (ko) | 2013-09-05 | 2014-09-04 | 프린트 배선판 및 그 배선판을 접속하는 커넥터 |
US14/916,663 US9673545B2 (en) | 2013-09-05 | 2014-09-04 | Printed wiring board and connector connecting the wiring board |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013184069 | 2013-09-05 | ||
JP2013-184069 | 2013-09-05 | ||
JP2013-235823 | 2013-11-14 | ||
JP2013235823A JP5559924B1 (ja) | 2013-09-05 | 2013-11-14 | プリント配線板及び該配線板を接続するコネクタ |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015034014A1 true WO2015034014A1 (ja) | 2015-03-12 |
Family
ID=51416987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/073374 WO2015034014A1 (ja) | 2013-09-05 | 2014-09-04 | プリント配線板及び該配線板を接続するコネクタ |
Country Status (6)
Country | Link |
---|---|
US (1) | US9673545B2 (ja) |
JP (1) | JP5559924B1 (ja) |
KR (1) | KR101868969B1 (ja) |
CN (1) | CN105493638B (ja) |
TW (1) | TWI551202B (ja) |
WO (1) | WO2015034014A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5779624B2 (ja) * | 2013-09-05 | 2015-09-16 | 株式会社フジクラ | プリント配線板及び該配線板を接続するコネクタ |
JP7090622B2 (ja) * | 2017-08-14 | 2022-06-24 | 住友電工プリントサーキット株式会社 | フレキシブルプリント配線板 |
JP7224921B2 (ja) * | 2019-01-09 | 2023-02-20 | 日本ルメンタム株式会社 | 光モジュール及び光モジュールの製造方法 |
TWM595899U (zh) * | 2019-12-06 | 2020-05-21 | 貿聯國際股份有限公司 | 電路板結構及具有該電路板結構的連接器 |
CN211789643U (zh) * | 2020-02-20 | 2020-10-27 | 东莞富强电子有限公司 | 电连接器 |
KR20230111491A (ko) | 2022-01-18 | 2023-07-25 | 부경대학교 산학협력단 | 프로젝션 기반 용접비드 검출 방법 및 장치 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58152786U (ja) * | 1982-04-06 | 1983-10-13 | 松下電器産業株式会社 | 可撓性印刷配線基板 |
JPS6226882U (ja) * | 1985-07-31 | 1987-02-18 | ||
JPS62109475U (ja) * | 1985-12-27 | 1987-07-13 | ||
JPS6416083U (ja) * | 1987-07-20 | 1989-01-26 | ||
JPH0361366U (ja) * | 1989-10-20 | 1991-06-17 | ||
JP2000030784A (ja) * | 1998-05-08 | 2000-01-28 | Japan Aviation Electronics Ind Ltd | 電気コネクタ |
JP2001177206A (ja) * | 1999-12-16 | 2001-06-29 | Smk Corp | フレキシブル配線基板及びそれを用いたコネクタ相互接続構造 |
JP2006196423A (ja) * | 2005-01-17 | 2006-07-27 | Jst Mfg Co Ltd | コネクタ接続用端末構造を有するfpc |
JP2007227036A (ja) * | 2006-02-22 | 2007-09-06 | Hirose Electric Co Ltd | 平型回路基板用電気コネクタ |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0361366A (ja) * | 1989-07-28 | 1991-03-18 | Matsushita Electric Ind Co Ltd | レーザースパッタリング装置 |
JP2000106236A (ja) * | 1998-09-30 | 2000-04-11 | Sony Corp | 印刷配線テープ用コネクタ |
JP2001135896A (ja) * | 1999-11-02 | 2001-05-18 | Sanyo Electric Co Ltd | Cof基板 |
JP2002056931A (ja) * | 2000-06-01 | 2002-02-22 | Olympus Optical Co Ltd | 電気接続装置 |
JP2002134860A (ja) * | 2000-10-23 | 2002-05-10 | Matsushita Electric Ind Co Ltd | フレキシブルプリント配線板 |
US6835071B2 (en) * | 2001-07-18 | 2004-12-28 | Tyco Electronics Corporation | Elastomeric connector interconnecting flexible circuits and circuit board and method of manufacturing the same |
US6994563B2 (en) * | 2003-12-19 | 2006-02-07 | Lenovo (Singapore) Pte. Ltd. | Signal channel configuration providing increased capacitance at a card edge connection |
JP2006228988A (ja) * | 2005-02-17 | 2006-08-31 | Sony Corp | フレキシブル基板 |
JP2006236657A (ja) * | 2005-02-23 | 2006-09-07 | Nec Corp | コネクタ装置 |
JP2008091363A (ja) | 2006-09-29 | 2008-04-17 | Cmk Corp | プリント配線板 |
JP2009080972A (ja) | 2007-09-25 | 2009-04-16 | Sumitomo Electric Ind Ltd | 接続構造体,配線板接続体,配線板モジュールおよび電子機器 |
KR101585183B1 (ko) * | 2009-08-14 | 2016-01-13 | 샌디스크 아이엘 엘티디 | 백워드 및 포워드 호환성을 구비한 이중 인터페이스 카드 |
JP4933603B2 (ja) * | 2009-09-11 | 2012-05-16 | 京セラエルコ株式会社 | コネクタ |
TWM385816U (en) | 2010-03-31 | 2010-08-01 | Chief Land Electronic Co Ltd | Structure of electrical connector |
JP2013109995A (ja) * | 2011-11-22 | 2013-06-06 | D D K Ltd | コネクタ及び該コネクタに用いるコンタクトの挿入方法 |
-
2013
- 2013-11-14 JP JP2013235823A patent/JP5559924B1/ja not_active Expired - Fee Related
-
2014
- 2014-09-04 US US14/916,663 patent/US9673545B2/en active Active
- 2014-09-04 KR KR1020167007964A patent/KR101868969B1/ko active IP Right Grant
- 2014-09-04 CN CN201480048252.XA patent/CN105493638B/zh not_active Expired - Fee Related
- 2014-09-04 WO PCT/JP2014/073374 patent/WO2015034014A1/ja active Application Filing
- 2014-09-05 TW TW103130709A patent/TWI551202B/zh not_active IP Right Cessation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58152786U (ja) * | 1982-04-06 | 1983-10-13 | 松下電器産業株式会社 | 可撓性印刷配線基板 |
JPS6226882U (ja) * | 1985-07-31 | 1987-02-18 | ||
JPS62109475U (ja) * | 1985-12-27 | 1987-07-13 | ||
JPS6416083U (ja) * | 1987-07-20 | 1989-01-26 | ||
JPH0361366U (ja) * | 1989-10-20 | 1991-06-17 | ||
JP2000030784A (ja) * | 1998-05-08 | 2000-01-28 | Japan Aviation Electronics Ind Ltd | 電気コネクタ |
JP2001177206A (ja) * | 1999-12-16 | 2001-06-29 | Smk Corp | フレキシブル配線基板及びそれを用いたコネクタ相互接続構造 |
JP2006196423A (ja) * | 2005-01-17 | 2006-07-27 | Jst Mfg Co Ltd | コネクタ接続用端末構造を有するfpc |
JP2007227036A (ja) * | 2006-02-22 | 2007-09-06 | Hirose Electric Co Ltd | 平型回路基板用電気コネクタ |
Also Published As
Publication number | Publication date |
---|---|
US9673545B2 (en) | 2017-06-06 |
JP2015073063A (ja) | 2015-04-16 |
TW201526729A (zh) | 2015-07-01 |
KR20160048159A (ko) | 2016-05-03 |
US20160211599A1 (en) | 2016-07-21 |
TWI551202B (zh) | 2016-09-21 |
JP5559924B1 (ja) | 2014-07-23 |
CN105493638A (zh) | 2016-04-13 |
KR101868969B1 (ko) | 2018-06-19 |
CN105493638B (zh) | 2018-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2015034013A1 (ja) | プリント配線板及び該配線板を接続するコネクタ | |
JP5559925B1 (ja) | プリント配線板及び該配線板を接続するコネクタ | |
JP5941446B2 (ja) | プリント配線板及び該配線板を接続するコネクタ | |
JP5779624B2 (ja) | プリント配線板及び該配線板を接続するコネクタ | |
JP5797309B1 (ja) | プリント配線板 | |
JP5559924B1 (ja) | プリント配線板及び該配線板を接続するコネクタ | |
JP2015216385A (ja) | プリント配線板及び該配線板を接続するコネクタ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201480048252.X Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14841714 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 14916663 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20167007964 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14841714 Country of ref document: EP Kind code of ref document: A1 |