WO2015032081A1 - 散热装置组合的制造方法 - Google Patents

散热装置组合的制造方法 Download PDF

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Publication number
WO2015032081A1
WO2015032081A1 PCT/CN2013/083115 CN2013083115W WO2015032081A1 WO 2015032081 A1 WO2015032081 A1 WO 2015032081A1 CN 2013083115 W CN2013083115 W CN 2013083115W WO 2015032081 A1 WO2015032081 A1 WO 2015032081A1
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WIPO (PCT)
Prior art keywords
heat dissipation
main body
dissipation device
circuit board
base
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PCT/CN2013/083115
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English (en)
French (fr)
Inventor
徐睿
Original Assignee
Xu Rui
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Priority to PCT/CN2013/083115 priority Critical patent/WO2015032081A1/zh
Publication of WO2015032081A1 publication Critical patent/WO2015032081A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention provides a method of fabricating a heat sink assembly. More particularly, the present invention provides a method of fabricating a heat sink that simultaneously contacts a plurality of heat generating chips on a circuit board. Background technique
  • the integration of chips is getting higher and higher, and the functions are getting stronger and stronger, but the power consumption of the chips is also increasing.
  • the power consumption of single chips even reaches the level of hundreds of watts, which raises the heat dissipation. Requirements. If the heat dissipation capability of the chip is to be improved, the heat sink is required to provide a large heat dissipation capability, and the interface between the heat sink and the chip is required to have a small thermal resistance. This requires that the heat sink be in good contact with the chip.
  • a plurality of chips are often provided on one circuit board. Since these chips have different external dimensions when the package is manufactured, and the thickness of the solder layer at the bottom of the chip is also inconsistent when soldered to the circuit board, the top surface height of these chips is not easy. Precise control will change up and down within a certain size range. Assuming that the top surface height of one chip is 8 ⁇ 0.3mm and the top surface height of the other chip is 6 ⁇ 0.2mm, the top surface height difference between the two chips It will change in the range of 1.5 ⁇ 2.5mm. It can be seen that if a conventional plate heat sink is used to provide heat dissipation for multiple chips on the circuit board, it is easy to cause the heat sink to only contact some of the chips on the circuit board. If a large pressure is applied to the heat sink to deform it to contact all the chips on the board, it is easy to cause damage to the chip and the board which are partially stressed.
  • the heat dissipating device disclosed in Chinese Patent No. 99214974.6 is provided by arranging a copper material component on a heat sink of an existing aluminum material, and utilizing the high thermal conductivity of copper to improve the heat dissipation device of the existing aluminum material.
  • the heat dissipation effect, and the design of the copper-aluminum component sockets are also cheaper than the copper heat sink.
  • the copper component of this design is fixed to the heat sink by a shoulder portion and a stepped portion on the heat sink of the aluminum material, and then mounted together on the computer chip, so the heat sink does not have With chip height
  • the characteristics of the change, if used on a circuit board with multiple chips, can only be in contact with some of the chips on the board like a conventional flat-plate heat sink. Summary of the invention
  • the present invention provides a manufacturing method of a heat dissipating device assembly, the manufacturing method comprising the steps of: preparing a circuit board and a heat dissipating device, wherein the circuit board is provided with two heat generating chips; the heat dissipating device comprises a main body and An adjusting component, the main body includes a base and a plurality of heat dissipating fins protruding upwardly from the base, the base further pre-fixing a copper post and opening a through hole; the adjusting component is provided with a base The outer peripheral surface of the base and the inner peripheral surface of the through hole of the main body are gap-fitted, so as to be vertically movable into the through hole of the main body base; first, the main body is mounted on the circuit board.
  • the manufacturing method can be flexibly adjusted after the bottom surface of the copper pillar of the main body is attached to a heat-generating chip, and then adjusted by the adjusting component to slide up and down in the through-hole of the main body to be attached to another heat-generating chip. It adapts to the difference in height difference between the top surface of the heat-generating chip on the different circuit boards and the other heat-generating chip, and ensures that the heat-dissipating device is in close contact with a plurality of heat-generating chips on the circuit board at the same time, thereby achieving an ideal heat-dissipating effect.
  • Figure 1 is an exploded perspective view of a heat sink assembly of the present invention
  • Figure 2 is a perspective assembled view of the heat sink assembly of the present invention
  • FIG. 3 is a side view of the heat sink assembly of the present invention.
  • Figure 4 is a plan view of the heat sink assembly of the present invention.
  • Fig. 5 is a cross-sectional view taken along line AA of Fig. 4; detailed description
  • the present invention provides a manufacturing method of a heat sink assembly, the manufacturing method comprising the following steps:
  • the heat sink 2 Preparing a circuit board 1 and a heat sink 2, the heat sink 2 includes a main body 3 and an adjusting component 5, the circuit board 1 is provided with two heat generating chips 10, 12 and four locking holes 14; It is made of aluminum, and includes a base 30 and a plurality of heat dissipation fins 32 protruding upwardly from the base 30. Each of the four corners of the base 30 is provided with a fixing component 34.
  • the heat generating chip 12 on the corresponding circuit board 1 in the middle defines a circular through hole 36 having a circular inner peripheral surface 38, and a heat on the circuit board 1 is also provided on one side of the base 30.
  • the chip 10 is pre-fixed with a copper post 40;
  • the adjusting component 5 is made of copper, and includes a circular base 50 and a plurality of heat dissipating fins 52 projecting upwardly from the base 50, the adjusting component 5 base
  • the outer peripheral surface 54 of the base 50 is also slightly smaller than the inner diameter of the through hole 36, so that the outer peripheral surface 54 of the base 50 of the adjusting assembly 5 and the inner peripheral surface of the through hole 36 of the main body 3 38 has a clearance fit, so that the adjustment assembly 5 can move up and down Installed into the through hole 36 of the base 30 of the main body 3;
  • one end of the four fixing members 34 is inserted into the four locking holes 14 of the circuit board 1, so that the main body 3 is mounted on the circuit board 1, and the bottom surface of the copper post 40 on the main body 3 is attached.
  • the top surface of the heat generating chip 10 is coated with a solder material from the back surface of the circuit board 1 at the joint of the four fixing members 34 and the locking holes 14;
  • the adjusting assembly 5 is attached to the through hole of the main body 3.
  • a solder material such as solder paste
  • the advantage of using this manufacturing method is that after the bottom surface of the copper post 40 of the main body 3 is attached to a heat generating chip 10, it is adjusted by the adjusting assembly 5 to slide up and down in the through hole 36 of the main body 3 to be attached to the other heat generating chip 12. After the soldering is completed, the copper pillar 40 and the adjusting component 5 of the main body 3 can be in good contact with the heat generating chips 10 and 12 at the same time to achieve an ideal heat dissipation effect.
  • the above embodiment is only one of the manufacturing methods of the heat sink assembly of the present invention, and may be appropriately modified on the basis of the above.
  • the through hole 36 of the main body 3 can be changed into a square shape, and the base 50 of the adjusting component 5 is also changed to a square shape; the main body 3 can also be fixed with a copper pillar 40 instead of the base 3 of the main body 3.
  • the bottom surface is attached to the top surface of the heat generating chip 10.
  • a through hole (not shown) corresponding to the heat generating chip 10 and an adjusting component (not shown) may be further added to the main body 3, and the two adjusting components are respectively used.
  • the two heat generating chips 10 and 12 are attached to each other to achieve the same effect.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热装置组合的制造方法，该制造方法包括以下步骤：准备一电路板（1）及一散热装置（2），该电路板（1）上设有两发热芯片（10，12）；该散热装置（2）包括一主体（3）及一调节组件（5），该主体（3）包括一基座（30）及若干散热鳍片（32），该基座（30）上还固设有一铜柱（40）并开设有一通孔（36）；该调节组件（5）可上下活动地装设到该通孔（36）内；先将该主体（3）装设到该电路板（1）上，使该铜柱（40）贴接到一发热芯片（10）上；为该调节组件（5）涂上焊接材料后，再将该调节组件（5）装设到通孔（36）内；使用一加压装置施压在主体（3）和调节组件（5）上，使其与两发热芯片（10，12）紧密贴接；最后将上述散热装置组合一起进行加热，使其焊接成为一整体。这种制造方法能够灵活地适应不同电路板上芯片高度的差异，使散热装置同时与两发热芯片保持良好的接触从而达到理想的散热效果。

Description

说 明 书
散热装置组合的制造方法
技术领域
本发明提供了一种散热装置组合的制造方法， 更具体的说， 本发明提 供一种保证散热装置同时与电路板上的多个发热芯片都紧密接触的制造 方法。 背景技术
随着半导体技术的发展， 芯片的集成度越来越高， 功能愈来愈强， 但 是芯片功耗也随着增大， 单芯片功耗甚至达到上百瓦的水平， 对散热提出 了更高的要求。如果要提高芯片的散热能力， 首先要求散热器能够提供较 大的散热能力， 再者要求散热器与芯片之间的界面热阻小， 这就需要保证 散热装置能够和芯片良好接触。
一块电路板上往往设有多个芯片， 由于这些芯片在封装制造时其外部 尺寸存在一定的差异， 且在焊接到电路板时其底部的焊锡层厚度也不一 致， 因此这些芯片的顶面高度不易精确控制， 会在一定的尺寸范围内发生 上下变动， 假设其中一芯片的顶面高度为 8±0.3mm， 而另一芯片的顶面高 度为 6±0.2mm， 那么两芯片的顶面高度差将在 1.5~2.5mm的范围内发生变 化，可见如果使用一个传统的板式散热装置同时为电路板上的多个芯片提 供散热时， 容易导致散热装置仅能与电路板上的部分芯片接触。如果施加 较大的压力作用在散热装置上，使其发生变形从而与电路板上的所有芯片 接触， 则容易导致部分受力较大的芯片及电路板变形损坏。
如中国专利 99214974.6所揭示的散热装置， 其是通过将一个铜材质的 组件套接装设在现用的铝材质的散热装置上，利用铜的高导热性能来提高 现用的铝材质的散热装置的散热效果，并且这种采用铜铝组件互相套接的 设计也比采用全铜的散热装置较为廉价。但是这种设计的铜材质组件是利 用一肩部与铝材质的散热装置上的台阶形部分相配合固定到散热装置上， 然后再一起装设到电脑芯片上方，因此这种散热装置并不具有与芯片高度 变化相适应的特点， 如果用在设有多个芯片的电路板上， 也会象传统的平 板式散热装置一样仅能与电路板上的部分芯片接触。 发明内容
本发明的目的在于提供一种保证散热装置同时与电路板上的多个发 热芯片都紧密接触的制造方法，其能保证散热装置以适当的压力同时贴接 在多个发热芯片顶部， 提高芯片的散热效果。
为了实现上述目的， 本发明提供一种散热装置组合的制造方法， 该制 造方法包括以下步骤： 准备一电路板及一散热装置， 该电路板上设有两发 热芯片； 该散热装置包括一主体及一调节组件， 该主体包括一基座及由该 基座向上突伸出的若干散热鳍片， 该基座上还预先固设有一铜柱， 并开设 有一通孔； 该调节组件设有一底座， 其中该底座的外周面与该主体的通孔 内周面之间呈间隙配合， 从而可上下活动地装设到该主体基座的通孔内； 先将该主体装设到该电路板上， 使该铜柱的底面贴接到一发热芯片上； 在 该调节组件底座的外周面涂上焊接材料后，再将该调节组件装设到该主体 的通孔内； 使用一加压装置施加适当压力作用在主体和调节组件上， 使其 同时与两发热芯片紧密相贴接； 最后将上述由电路板、主体及调节组件组 成的散热装置组合一起进行加热焊接， 使其焊接成为一不可拆分的整体。
本发明具有以下有益效果：这种制造方法在主体的铜柱底面与一发热 芯片贴接后，再通过调节组件在主体通孔内上下滑动进行调节从而与另一 发热芯片贴接，可以灵活地适应不同电路板上发热芯片与另一发热芯片之 间顶面高度差的差异，保证散热装置同时与电路板上的多个发热芯片都紧 密接触， 从而达到理想的散热效果。 附图说明
图 1是本发明的散热装置组合的立体分解图；
图 2是本发明的散热装置组合的立体组合图；
图 3是本发明的散热装置组合的侧视图；
图 4是本发明的散热装置组合的俯视图；
图 5是图 4的 A-A剖视图。 具体实施方式
请参阅图 1至图 5， 本发明提供一种散热装置组合的制造方法， 该制造 方法包括以下步骤：
准备一电路板 1及一散热装置 2，该散热装置 2包括一主体 3及一调节组 件 5， 该电路板 1上设有两个发热芯片 10、 12及四个锁固孔 14; 该主体 3是 由铝材制成的，其包括一基座 30及由该基座 30向上突伸出的若干散热鳍片 32， 该基座 30的四角各装设有一固定元件 34， 该基座 30的中部对应电路板 1上的发热芯片 12开设有一圆形通孔 36， 该通孔 36具有一圆环形的内周面 38， 而在该基座 30的一侧还对应电路板 1上的发热芯片 10预先固设有一铜 柱 40; 该调节组件 5是由铜材制成的， 其包括一圆形底座 50及由该底座 50 向上突伸出的若干散热鳍片 52， 该调节组件 5底座 50也具有一圆环形的外 周面 54， 其中该底座 50的外径是略小于通孔 36的内径， 因而该调节组件 5 底座 50的外周面 54与该主体 3通孔 36的内周面 38之间呈间隙配合， 从而使 该调节组件 5可上下活动地装设到该主体 3基座 30的通孔 36内；
先将四固定元件 34的一端对应穿插到该电路板 1的四锁固孔 14内， 从 而将该主体 3装设到该电路板 1上， 使主体 3上的铜柱 40的底面贴接到发热 芯片 10的顶面， 再从电路板 1的背面为四固定元件 34与锁固孔 14的接合处 涂上焊接材料；
在该调节组件 5底座 50的外周面 54或该主体 3的通孔 36的内周面 38涂 上焊接材料 （如锡膏） 后， 再将该调节组件 5装设到该主体 3的通孔 36内， 使该调节组件 5底座 50的底面初步贴接到发热芯片 12的顶面；
使用一夹持在电路板 1上下两侧的加压装置 （图未示） 分别施加适当 压力作用在主体 3和调节组件 5上， 使主体 3的铜柱 40和调节组件 5底座 50 的底面分别与两发热芯片 10、 12紧密相贴接；
将上述由电路板 1、 主体 3及调节组件 5组成的散热装置组合与加压装 置一起放入到焊接炉 （图未示） 中进行加热焊接， 等到焊接材料冷却凝固 后再拆除加压装置， 即可将主体 3与电路板 1， 调节组件 5与主体 3焊接成为 一不可拆分的整体，从而使主体 3的铜柱 40及调节组件 5能同时与两发热芯 片 10、 12保持良好接触。 采用这种制造方法的优越性在于当主体 3的铜柱 40底面与一发热芯片 10贴接后，再通过调节组件 5在主体 3通孔 36内上下滑动进行调节从而与另 一发热芯片 12贴接，保证焊接完成后该主体 3的铜柱 40及调节组件 5能同时 与发热芯片 10、 12保持良好的接触， 达到理想的散热效果。
上述实施方式仅是本发明散热装置组合的制造方法中的一种，还可以 在其基础上作出适当的变更。 例如说主体 3的通孔 36可以改变为方形， 而 调节组件 5的底座 50也对应改变为方形；该主体 3也可以不预先固设一铜柱 40， 而改为用主体 3基座 30的底面与发热芯片 10顶面相贴接， 另外还可以 在主体 3上再加入一个与发热芯片 10相对应的通孔 （图未示） 及一调节组 件（图未示） ， 使用两调节组件分别与两发热芯片 10、 12相贴接来达到同 样的效果。

Claims

1、 一种散热装置组合的制造方法， 其特征在于： 该制造方法包括以 下步骤：
准备一电路板及一散热装置， 该电路板上设有至少两发热元件； 该散 热装置包括一主体及至少一调节组件，该主体包括一基座及由该基座向上 突伸出的若干散热鳍片， 该基座上设有至少一通孔； 该调节组件设有一底 座， 其中该底座的外周面与该主体的通孔内周面之间呈间隙配合， 从而可 上下活动地装设到该主体基座的通孔内；
先将该主体装设到该电路板上；
在该调节组件底座的外周面或该通孔的内周面涂上焊接材料后，再将 该调节组件装设到该主体的通孔内；
使用一加压装置施加适当压力作用在散热装置上，使散热装置的底面 同时与至少两发热元件紧密贴接；
将上述由电路板、主体及调节组件组成的散热装置组合一起进行加热 焊接， 使其焊接成为一不可拆分的整体。
2、 根据权利要求 1所述的散热装置组合的制造方法， 其特征在于： 当 该电路板上设有 n个发热元件时， 该主体上对应这些发热元件设有 n-1个通 孔及 n-1个调节组件。
3、 根据权利要求 2所述的散热装置组合的制造方法， 其特征在于： 该 主体的基座上还预先固设有一铜柱，并使该铜柱底面与其中一个发热元件 相贴接从而为其提供散热。
4、 根据权利要求 2所述的散热装置组合的制造方法， 其特征在于： 该 主体的基座底面与其中一个发热元件相贴接从而为其提供散热。
5、 根据权利要求 1所述的散热装置组合的制造方法， 其特征在于： 该 主体对应电路板上的每一发热元件都设有一通孔及一调节组件。
6、 根据权利要求 1所述的散热装置组合的制造方法， 其特征在于： 该 电路板上设有若干锁固孔， 该主体上对应这些锁固孔设有若干固定元件。
7、 根据权利要求 6所述的散热装置组合的制造方法， 其特征在于： 将 这些固定元件的一端对应穿插到该电路板的锁固孔后，再在固定元件与锁 固孔的接合处涂上焊接材料，在焊接完成后这些固定元件的一端就焊固在 该电路板的锁固孔内， 从而将该主体焊固到电路板上。
8、 根据权利要求 1所述的散热装置组合的制造方法， 其特征在于： 该 基座的通孔是圆形的， 该调节组件的底座对应也呈圆形。
9、 根据权利要求 1所述的散热装置组合的制造方法， 其特征在于： 该 调节组件的底座也向上突伸出若干散热鳍片。
10、 根据权利要求 1所述的散热装置组合的制造方法， 其特征在于： 该调节组件是用铜材制成， 而该主体是用铝材制成的。
11、 根据权利要求 1所述的散热装置组合的制造方法， 其特征在于： 该加压装置是夹持在电路板的两侧，其与该散热装置组合一起进行加热焊 接， 在焊接完成后再拆除。
PCT/CN2013/083115 2013-09-09 2013-09-09 散热装置组合的制造方法 WO2015032081A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2807480Y (zh) * 2005-04-27 2006-08-16 凌华科技股份有限公司 散热模块
CN2833890Y (zh) * 2005-06-18 2006-11-01 中兴通讯股份有限公司 一种散热装置
CN101179918A (zh) * 2006-11-09 2008-05-14 东莞莫仕连接器有限公司 散热装置组合的制造方法
US20090034199A1 (en) * 2007-07-31 2009-02-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip
JP2010080587A (ja) * 2008-09-25 2010-04-08 Fujitsu General Ltd ヒートシンクの取付構造

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2807480Y (zh) * 2005-04-27 2006-08-16 凌华科技股份有限公司 散热模块
CN2833890Y (zh) * 2005-06-18 2006-11-01 中兴通讯股份有限公司 一种散热装置
CN101179918A (zh) * 2006-11-09 2008-05-14 东莞莫仕连接器有限公司 散热装置组合的制造方法
US20090034199A1 (en) * 2007-07-31 2009-02-05 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly having a clip
JP2010080587A (ja) * 2008-09-25 2010-04-08 Fujitsu General Ltd ヒートシンクの取付構造

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